WO2022124100A1 - ポリアミド樹脂組成物 - Google Patents
ポリアミド樹脂組成物 Download PDFInfo
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- WO2022124100A1 WO2022124100A1 PCT/JP2021/043426 JP2021043426W WO2022124100A1 WO 2022124100 A1 WO2022124100 A1 WO 2022124100A1 JP 2021043426 W JP2021043426 W JP 2021043426W WO 2022124100 A1 WO2022124100 A1 WO 2022124100A1
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- polyamide resin
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- polyamide
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/20—Compounding polymers with additives, e.g. colouring
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
- C08J5/043—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with glass fibres
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/08—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from amino-carboxylic acids
- C08G69/14—Lactams
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
- C08J2377/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
- C08J2377/06—Polyamides derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Definitions
- the present invention relates to a polyamide resin composition, in particular, a polyamide resin composition containing reinforcing fibers in a high filling amount and capable of providing a molded product having high strength, high rigidity and excellent appearance.
- aliphatic polyamide resins typified by polyamide 6 and polyamide 66 have excellent mechanical strength, heat resistance, impact resistance, and chemical resistance, and are widely used in automobile parts, electric parts, electronic parts, household goods, and the like. in use.
- the fiber-reinforced polyamide resin composition to which an inorganic reinforcing material typified by glass fiber is added is known to have significantly improved rigidity, strength, heat resistance, etc., and a large amount of reinforcing material such as glass fiber is added. (Patent Documents 1, 2, etc.).
- Patent Documents 1, 2, etc. the appearance of the molded product is extremely deteriorated and the commercial value is often significantly impaired.
- Patent Documents 1 and 2 a low-viscosity polyamide resin is used.
- Patent Document 3 proposes a method in which an amorphous semi-aromatic polyamide resin and a specific elastomer are used in combination in addition to the aliphatic polyamide resin in order to improve the appearance of the molded product (Patent Document 3).
- this method does improve the appearance, it has the disadvantage of reducing the rigidity and heat resistance of the molded product, and is susceptible to fluctuations in manufacturing conditions, and has difficulty in manufacturing stability. There was a problem that it was difficult to obtain the characteristics.
- Japanese Unexamined Patent Publication No. 6-313045 Japanese Unexamined Patent Publication No. 2007-12915 Japanese Unexamined Patent Publication No. 2009-215534
- the present invention is intended to solve the above problems, is not easily affected by fluctuations in manufacturing conditions, has a high filling amount of reinforcing fibers, and has high strength, high rigidity, good appearance, and high temperature. It is an object of the present invention to provide a polyamide resin composition capable of stably providing a molded product having excellent rigidity.
- the present invention is as follows. (1) Hypochlorite with respect to a total of 100 parts by mass of 20 to 60 parts by mass of the aliphatic polyamide resin (A), 5 to 20 parts by mass of the polyamide MXD6 resin (B), and 30 to 59 parts by mass of the inorganic reinforcing material (C). A polyamide resin composition containing 0 to 3 parts by mass of the metal phosphate salt (D). A polyamide resin composition characterized in that the MFR measured under the condition of a load of 2.16 kg and 275 ° C. of the polyamide resin composition is 3 to 60 g / 10 minutes. (2) The polyamide resin composition according to (1), wherein the temperature lowering crystallization temperature of the polyamide resin composition is 160 to 190 ° C.
- the hypophosphite metal salt (D) is contained in an amount of 0.001 to 3 parts by mass with respect to a total of 100 parts by mass of the above (A), (B) and (C) (1) or (2).
- the inorganic reinforcing material (C) in the polyamide resin composition is contained in an amount of 40 to 59 parts by mass with respect to 100 parts by mass in total of (A), (B) and (C).
- the polyamide according to any one of (1) to (5), wherein the MFR measured under the condition of a load of 2.16 kg and 275 ° C. of the polyamide resin composition is 4 to 25 g / 10 minutes. Resin composition.
- the polyamide resin composition of the present invention is not easily affected by fluctuations in manufacturing conditions, and can stably provide a molded product having high strength, high rigidity, good appearance, and excellent high temperature rigidity.
- an aliphatic polyamide resin having an acid amide bond (-CONH-) in the molecule and having a crystal melting point is preferable.
- polycaproamide polyamide 6
- polyhexamethylene adipamide polyamide 66
- polytetramethylene adipamide polyamide 46
- polyhexamethylene sebacamide polyamide 610
- polyhexamethylene dodeca polyamide dodeca.
- polymers such as amide (polyamide 612), poly-lauryl lactam (polyamide 12), poly-11-aminoundecanoic acid (polyamide 11), and copolymers and blends thereof can be mentioned, but are limited thereto. It's not something.
- examples of the preferred aliphatic polyamide resin (A) include polyamide 6, polyamide 66, and a mixture of polyamide 6 and polyamide 66, with polyamide 6 being particularly preferred.
- the relative viscosity of the aliphatic polyamide resin (A) is preferably in the range of 1.8 to 3.5, more preferably 2.0 to 3.2. Is the range of.
- the blending ratio of the aliphatic polyamide resin (A) to 100 parts by mass of the total of the aliphatic polyamide resin (A), the polyamide MXD6 resin (B) and the inorganic reinforcing material (C) is 20 to 60 parts by mass, preferably 25. It is up to 50 parts by mass, more preferably 28 to 42 parts by mass. In the range of less than 20 parts by mass and more than 60 parts by mass, the effect of the present invention is difficult to be exhibited. In the present invention, the blending ratio becomes the content ratio in the polyamide resin composition as it is.
- the polyamide MXD6 resin (B) in the present invention is a polyamide resin mainly composed of polymethoxylylen adipamide, and has a diamine component in which at least 80 mol% of the diamine component is metaxylylene diamine and at least a dicarboxylic acid component. It is a polycondensate with a dicarboxylic acid component in which 80 mol% is adipic acid.
- the diamine component other than methylylenediamine paraxylylenediamine, tetramethylenediamine, hexamethylenediamine and the like can be used as long as it is 20 mol% or less.
- the dicarboxylic acid component other than adipic acid an aliphatic dicarboxylic acid such as sebacic acid can be used as long as it is 20 mol% or less.
- the relative viscosity of the polyamide MXD6 resin (B) is preferably in the range of 1.5 to 4.0, more preferably 1.8 to 3.0. It is a range.
- the blending ratio of the polyamide MXD6 resin (B) to a total of 100 parts by mass of the aliphatic polyamide resin (A), the polyamide MXD6 resin (B) and the inorganic reinforcing material (C) is 5 to 20 parts by mass, preferably 10 to 10 parts by mass. It is 20 parts by mass, more preferably 10 to 17 parts by mass.
- the content is within this range, the moldability is excellent, the appearance of the molded product is excellent, and the molded product is excellent in heat resistance. In the range of less than 5 parts by mass and more than 20 parts by mass, the effect of the present invention is difficult to be exhibited.
- the blending ratio of the aliphatic polyamide resin (A) and the polyamide MXD6 resin (B) is preferably 10 to 90 parts by mass with respect to 100 parts by mass of the aliphatic polyamide resin (A). It is more preferably up to 70 parts by mass, further preferably 10 to 55 parts by mass, and even more preferably 15 to 45 parts by mass. If it is less than 10 parts by mass, it becomes difficult to control the crystallization temperature, and if it exceeds 90 parts by mass, the glass transition temperature becomes high, so that it is difficult to obtain a good appearance unless the mold temperature is raised.
- the inorganic reinforcing material (C) in the present invention most effectively improves physical properties such as strength, rigidity and heat resistance, and specifically, glass fiber, carbon fiber, alumina fiber, silicon carbide fiber, and zirconia.
- glass fiber carbon fiber
- alumina fiber silicon carbide fiber
- zirconia zirconia
- fibrous materials such as fibers, whiskers such as aluminum borate and potassium titanate, needle-shaped wallastonite, and milled fibers.
- glass fiber, carbon fiber and the like are particularly preferably used.
- These inorganic reinforcing materials (C) may be used alone or in combination of two or more.
- a fibrous reinforcing material is used as the inorganic reinforcing material (C), it is preferably treated in advance with a coupling agent such as an organic silane compound, an organic titanium compound, an organic borane compound and an epoxy compound, and a carboxylic acid. Those that easily react with acid groups and / and carboxylic acid anhydride groups are particularly preferable.
- a polyamide resin composition containing glass fibers treated with a coupling agent is preferable because a molded product having excellent mechanical properties and appearance characteristics can be obtained. Further, in the case of other fibrous reinforcing materials, if the coupling agent is not treated, it can be added afterwards and used.
- the inorganic reinforcing material (C) is glass fiber
- a chopped strand-shaped material cut to a fiber length of about 1 to 20 mm can be preferably used.
- a glass fiber having a circular cross section and a non-circular cross section can be used.
- a glass fiber having a non-circular cross section is preferable from the physical characteristics. Glass fibers having a non-circular cross section include those having a substantially elliptical system, a substantially elliptical system, and a substantially cocoon-shaped cross section in a cross section perpendicular to the length direction of the fiber length, and have a flatness of 1.5 to 8. Is preferable.
- the flatness is assumed to be a rectangle having the smallest area circumscribing a cross section perpendicular to the longitudinal direction of the glass fiber, the length of the long side of this rectangle is the major axis, and the length of the short side is the minor axis. It is the ratio of the major axis / the minor axis at the time of.
- the thickness of the glass fiber is not particularly limited, but the minor axis is about 1 to 20 ⁇ m and the major axis is about 2 to 100 ⁇ m.
- the glass fiber is preferably treated with a silane-based or titanate-based coupling agent, and particularly preferably treated with a silane-based coupling agent.
- Preferred silane coupling agents include ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropylmethyldiethoxysilane, ⁇ - (3,4-epoxycyclohexyl) ethyltrimethoxysilane, and ⁇ -anilinopropyl.
- trimethoxysilane examples thereof include trimethoxysilane, ⁇ - (2-aminoethyl) aminopropyltrimethoxysilane, ⁇ -methacryloxypropyltrimethoxysilane, vinyltrimethoxysilane, ⁇ -mercaptopropyltrimethoxysilane, and particularly ⁇ -.
- Glycydoxypropyltrimethoxysilane, ⁇ -anilinopropyltrimethoxysilane, ⁇ - (2-aminoethyl) aminopropyltrimethoxysilane, and ⁇ -methacryloxypropyltrimethoxysilane are preferred.
- the blending ratio of the inorganic reinforcing material (C) to a total of 100 parts by mass of the aliphatic polyamide resin (A), the polyamide MXD6 resin (B) and the inorganic reinforcing material (C) is 30 to 59 parts by mass. Further, it is preferably 40 to 59 parts by mass, more preferably 45 to 59 parts by mass, and further preferably 50 to 59 parts by mass. If it is less than 30 parts by mass, the rigidity may be insufficient, and if it exceeds 59 parts by mass, the appearance of the molded product may be deteriorated.
- the blending ratio of the inorganic reinforcing material (C) is preferably 40 to 59 parts by mass because the balance between the rigidity and the molded appearance is particularly excellent.
- the polyamide resin composition of the present invention preferably contains a hypophosphite metal salt (D).
- the hypophosphite metal salt (D) includes hypophosphite, group 1, 2, 3, 4, 5, 6, 7, 8, 11, 12, 13 elements, tin, lead, etc. in the Periodic Table of the Elements. It is a salt with a metal, and may be used alone or in combination of two or more. Among these, sodium hydride (NaH 2 PO 2 ) and calcium hypophosphite (Ca (H 2 PO 2 ) 2 ) are preferable from the viewpoint of achieving the effect of the present invention more remarkably.
- the hypophosphite metal salt may be a hydrate, and examples thereof include sodium hypophosphite monohydrate (NaH 2 PO 2 and H 2 O).
- the blending amount of the hypophosphite metal salt (D) is 0.001 to 3 parts by mass with respect to 100 parts by mass in total of the aliphatic polyamide resin (A), the polyamide MXD6 resin (B) and the inorganic reinforcing material (C). Is preferable, and more preferably 0.05 to 1.5 parts by mass, still more preferably 0.08 to 0.8 parts by mass.
- a molded product having high strength, high rigidity, and excellent high-temperature rigidity can be obtained without blending the hypopolyamide metal salt (D), but the hypopolyamide metal salt (D) is present within a specific range. Then, the amide exchange reaction between the crystalline aliphatic polyamide resin and the polyamide MXD6 is promoted, which is preferable for stabilizing the properties of the resin composition.
- the polyamide resin composition of the present invention has an MFR (melt flow rate) of 3 to 60 g / 10 minutes, preferably 3 to 45 g / 10 minutes, more preferably 4 minutes, as measured under the condition of a load of 2.16 kg and 275 ° C. It is ⁇ 25 g / 10 minutes, more preferably 5 to 20 g / 10 minutes, and even more preferably 5 to 15 g / 10 minutes. If the MFR is less than 3 g / 10 minutes, the fluidity may be insufficient in the case of a thin-walled molded product, and if the MFR exceeds 60 g / 10 minutes, burrs tend to appear in the molded product. This MFR can be achieved by using the polyamide resin composition as described above.
- the polyamide resin composition of the present invention has excellent fluidity when the MFR measured under the condition of a load of 2.16 kg and 275 ° C. is 4 to 25 g / 10 minutes, and in order to obtain a molded product having the effect of the present invention. preferable.
- This MFR can be achieved by adjusting the composition of the polyamide resin composition.
- the polyamide resin composition of the present invention preferably has a temperature-decreasing crystallization temperature of 160 to 190 ° C., more preferably 170 to 185 ° C., which is obtained by DSC measurement at a heating rate of 20 ° C./min according to JIS K7121. Is. If the temperature lowering crystallization temperature is less than 160 ° C., the solidification rate may be slow and the molding cycle may be too long, and if it exceeds 190 ° C., the effect of improving the appearance of the molded product may be inferior.
- the polyamide resin composition of the present invention may contain, if necessary, a heat stabilizer, an antioxidant, an ultraviolet absorber, a light stabilizer, a plasticizer, a lubricant, a crystal nucleating agent, and the like.
- a mold release agent, an antistatic agent, a combination of a halogen-based flame retardant and an antioxidant, various phosphoric acid-based flame retardants, a melamine-based flame retardant, an inorganic pigment, an organic pigment, a dye, or another kind of polymer can also be added.
- the polyamide resin composition of the present invention may occupy 70% by mass or more in total of the aliphatic polyamide resin (A), the polyamide MXD6 resin (B), the inorganic reinforcing material (C) and the hypophosphite metal salt (D). It is preferable to occupy 80% by mass or more, and even more preferably 90% by mass or more.
- the method for producing the polyamide resin composition of the present invention is not particularly limited as long as it can be melt-kneaded, but a single-screw extruder, a twin-screw extruder, a kneader, a Banbury mixer, a roll, or the like can be used. Above all, it is preferable to use a twin-screw extruder.
- a twin-screw extruder In the case of a twin-screw extruder, the above-mentioned (A), (B) and various additives, and if necessary, the component (D) dissolved in water are premixed with a tumbler or a Henschel mixer, and the premix is prepared from the main feeder.
- the component (C) is supplied from the side feeder and melt-kneaded in a temperature range of 220 to 330 ° C.
- the polyamide resin composition that has been melt-kneaded and discharged into a strand shape in the cooling water is pelletized to a length of about 1 to 10 mm by a pelletizer.
- the polyamide resin composition of the present invention can be made into a molded product by a known molding method.
- the molding method is not specified, and can be suitably used in injection molding, blow molding, extrusion molding, foam molding, malformed molding, calendar molding, and various other molding methods. Of these, injection molding is preferable.
- the molded product made of the polyamide resin composition of the present invention has high rigidity and excellent appearance, and is therefore suitable for metal substitute parts in fields such as automobiles, electric / electronic parts, and household goods. For example, it is suitable for door mirror parts and breaker parts.
- Relative viscosity (RV) of polyamide resin The measurement was carried out using a Ubbelohde viscous tube at 25 ° C. with a 96% by mass sulfuric acid solution at a polyamide resin concentration of 1 g / dl.
- Tc2 Temperature lowering Crystallization temperature
- a DSC measuring device EXSTAR6000 manufactured by Seiko Instruments was used. Crystallization peak observed when the temperature is raised to 300 ° C. at a heating rate of 20 ° C./min under a nitrogen stream, held at that temperature for 5 minutes, and then lowered to 50 ° C. at a rate of 10 ° C./min. The peak temperature of was measured.
- Melt flow rate It was measured according to ISO1133. The pellets of the obtained polyamide resin composition were dried until the water content was less than 0.1% by mass, and the measurement was carried out under the conditions of a measurement temperature of 275 ° C. and a load of 2.16 kg.
- Evaluation method of appearance of molded product As the appearance of the molded product, the mirror glossiness was measured and evaluated by the following method. Using a mirror-finished mold of 100 mm x 100 mm x 3 mm (thickness), a molded product is manufactured at a resin temperature of 280 ° C and a mold temperature of 80 ° C, and the glossiness of an incident angle of 60 degrees is obtained according to JIS Z-8714. It was measured. The higher the value, the better the glossiness. The measurement result of glossiness was evaluated based on the following criteria. ⁇ : 97 or more ⁇ : 95 or more, less than 97 ⁇ : 90 or more, less than 95 ⁇ : less than 90
- Comparative Examples 1 and 2 containing no polyamide MXD6 resin the appearance of the molded product was significantly inferior.
- Comparative Examples 3 and 4 which contained polyamide 6T6I, which is an amorphous polyamide resin, instead of the polyamide MXD6 resin, the molded product had an excellent appearance, but the rigidity, heat resistance, mechanical properties, etc. of the molded product were deteriorated. .. Further, in Comparative Examples 3 and 4, the change in the physical properties of the resin composition when the discharge amount of the extruder was greatly changed was slightly larger than that in the cases of Examples 1 and 2.
- the polyamide resin composition of the present invention is not easily affected by fluctuations in manufacturing conditions, and can stably provide a molded product having high rigidity and good appearance. It is suitable as a molding material for parts in fields such as electronic parts and household goods, and molded products.
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Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202180081167.3A CN116507672B (zh) | 2020-12-07 | 2021-11-26 | 聚酰胺树脂组合物 |
| US18/265,077 US20230407088A1 (en) | 2020-12-07 | 2021-11-26 | Polyamide resin composition |
| JP2022568179A JPWO2022124100A1 (https=) | 2020-12-07 | 2021-11-26 |
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| Application Number | Priority Date | Filing Date | Title |
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| JP2020-202926 | 2020-12-07 | ||
| JP2020202926 | 2020-12-07 |
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| WO2022124100A1 true WO2022124100A1 (ja) | 2022-06-16 |
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| PCT/JP2021/043426 Ceased WO2022124100A1 (ja) | 2020-12-07 | 2021-11-26 | ポリアミド樹脂組成物 |
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| US (1) | US20230407088A1 (https=) |
| JP (1) | JPWO2022124100A1 (https=) |
| CN (1) | CN116507672B (https=) |
| TW (1) | TWI890897B (https=) |
| WO (1) | WO2022124100A1 (https=) |
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| JP2004168849A (ja) * | 2002-11-19 | 2004-06-17 | Fujitsu Ltd | 電子機器筐体 |
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| WO2013088932A1 (ja) * | 2011-12-16 | 2013-06-20 | 三菱瓦斯化学株式会社 | 成形品 |
| WO2017018346A1 (ja) * | 2015-07-29 | 2017-02-02 | 東洋紡株式会社 | 耐熱老化性ポリアミド樹脂組成物、及びポリアミド樹脂の耐熱老化性向上方法 |
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| JP2004331919A (ja) * | 2003-05-12 | 2004-11-25 | Mitsubishi Gas Chem Co Inc | 酸素吸収性樹脂組成物および包装容器 |
| JP2004352833A (ja) * | 2003-05-28 | 2004-12-16 | Mitsubishi Gas Chem Co Inc | ポリアミド樹脂組成物 |
| JP5200335B2 (ja) * | 2006-05-31 | 2013-06-05 | 三菱瓦斯化学株式会社 | ポリアミド樹脂組成物 |
| US7981518B2 (en) * | 2006-10-26 | 2011-07-19 | Mitsubishi Gas Chemical Company, Inc. | Thermoplastic resin composition excellent in barrier property |
| JP5194573B2 (ja) * | 2007-06-12 | 2013-05-08 | 三菱瓦斯化学株式会社 | ポリアミド樹脂組成物 |
| EP3006507B1 (de) * | 2014-10-10 | 2018-12-19 | Ems-Patent Ag | Verstärkte polyamidformmassen sowie daraus hergestellte spritzgussteile |
| KR101693635B1 (ko) * | 2015-06-15 | 2017-01-06 | 현대자동차주식회사 | 연료주입관용 폴리아마이드 복합 수지 조성물 |
| JP6129464B1 (ja) * | 2015-11-12 | 2017-05-17 | ユニチカ株式会社 | ポリアミド樹脂組成物およびそれを成形してなる成形体 |
| EP3398995B1 (en) * | 2015-12-28 | 2021-04-21 | Mitsubishi Gas Chemical Company, Inc. | Dry-blended mixture |
| JP2018012761A (ja) * | 2016-07-20 | 2018-01-25 | 旭化成株式会社 | ポリアミド成形品 |
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- 2021-11-26 US US18/265,077 patent/US20230407088A1/en active Pending
- 2021-11-26 WO PCT/JP2021/043426 patent/WO2022124100A1/ja not_active Ceased
- 2021-11-29 TW TW110144296A patent/TWI890897B/zh active
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| JP2000204240A (ja) * | 1999-01-08 | 2000-07-25 | Ube Ind Ltd | ウエルド強度に優れたポリアミド樹脂組成物 |
| JP2003105095A (ja) * | 2001-09-27 | 2003-04-09 | Mitsubishi Engineering Plastics Corp | ポリアミド樹脂組成物の製造方法 |
| JP2004168849A (ja) * | 2002-11-19 | 2004-06-17 | Fujitsu Ltd | 電子機器筐体 |
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| Publication number | Publication date |
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| CN116507672A (zh) | 2023-07-28 |
| CN116507672B (zh) | 2025-01-07 |
| TWI890897B (zh) | 2025-07-21 |
| JPWO2022124100A1 (https=) | 2022-06-16 |
| US20230407088A1 (en) | 2023-12-21 |
| TW202231782A (zh) | 2022-08-16 |
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