WO2022041874A1 - 焊接结构和显示模组 - Google Patents

焊接结构和显示模组 Download PDF

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Publication number
WO2022041874A1
WO2022041874A1 PCT/CN2021/095396 CN2021095396W WO2022041874A1 WO 2022041874 A1 WO2022041874 A1 WO 2022041874A1 CN 2021095396 W CN2021095396 W CN 2021095396W WO 2022041874 A1 WO2022041874 A1 WO 2022041874A1
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WO
WIPO (PCT)
Prior art keywords
support member
support
sub
welded structure
welding
Prior art date
Application number
PCT/CN2021/095396
Other languages
English (en)
French (fr)
Inventor
林杨春
Original Assignee
广州国显科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 广州国显科技有限公司 filed Critical 广州国显科技有限公司
Publication of WO2022041874A1 publication Critical patent/WO2022041874A1/zh
Priority to US17/968,204 priority Critical patent/US20230035388A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Definitions

  • the application belongs to the field of display technology, and in particular relates to a welding structure and a display module.
  • a display module generally includes a screen body, a flexible printed circuit board, etc., and the screen body and the flexible printed circuit board are usually electrically connected through a chip on film (COF).
  • COF chip on film
  • an indenter is used for pressing.
  • the screen body and/or the chip on film at the edge of the welding area is prone to cracks during the pressing process.
  • the cracks may extend to the lines in the display module, resulting in poor display of the display module.
  • the present application provides a welding structure and a display module to reduce the pressure on the output carrier and/or the input carrier during the welding and pressing process.
  • a technical solution adopted in the present application is to provide a welding structure, comprising: an output carrier, one edge of which is provided with a first welding area; an input carrier, whose first end has a second welding area, the second bonding pad is electrically connected to the first bonding pad; and the orthographic projection of the first end of the input carrier on the output carrier extends beyond the first bonding pad; at least one set of first supports and a second support, the first support is located on the input carrier and is located at a position where the first end exceeds the first welding zone; the second support is located on the output carrier and is connected to the
  • the first support members are arranged opposite to each other.
  • Another technical solution adopted in the present application is to provide a display module including the welding structure described in any one of the above embodiments.
  • the beneficial effects of the present application are: in the welding structure provided by the present application, the orthographic projection of the first end of the input carrier on the output carrier exceeds the first welding area on the output carrier; A first support is provided at a position where one end exceeds the first welding area, and a second support is provided at a position of the output carrier corresponding to the first support.
  • the size of the first support member and the second support member in the present application is relatively large, and the pressure of the indenter is distributed to the first support member and the second support member, thereby reducing the output
  • the probability of cracks in the carrier and the input carrier during the pressing process when the display module adopts the above welding structure, the probability of poor screen display can be reduced and the display effect can be improved.
  • FIG. 1 is a schematic structural diagram of an embodiment of the welding structure of the application
  • Fig. 2 is the sectional schematic diagram at the position of A-A section line in Fig. 1;
  • FIG. 3 is a schematic top view of the welding of the second welding area of the input carrier and the first welding area of the output carrier in FIG. 1;
  • FIG. 4 is a schematic structural diagram of another embodiment of the first support member or the second support member in FIG. 3;
  • FIG. 5 is a schematic cross-sectional view of another embodiment at the position of the section line A-A in FIG. 1 .
  • FIG. 6 is a schematic structural diagram of an embodiment of the display module of the present application.
  • the present application discloses a welding structure, which can be applied to flexible OLED display modules, Micro-OLED display modules, etc., and can also be applied to the welding of flexible printed circuit boards and adapter boards. It includes an output carrier 10 , an input carrier 12 , at least one set of first supports 14 and second supports 16 .
  • the output carrier 10 can be any one of a display screen, an adapter board, and a flexible printed circuit board. Layers of layers, for example, the output carrier 10 includes an array layer, a light-emitting layer, an encapsulation layer, a touch layer, etc. that are stacked in sequence, and a first welding area 100 is provided on one side edge of the output carrier 10 .
  • the first welding area 100 It can be located on the array layer, and the signal lines (eg, data lines, scan lines, etc.) in the array layer can be electrically connected to the first bonding area 100; or, the first bonding area 100 can be located on the touch layer, and the touch layer
  • the touch electrodes (eg, transmitting electrodes, receiving electrodes) inside can be electrically connected to the first bonding pad 100 .
  • the input carrier 12 may be any one of a chip-on-film, a flexible printed circuit board, and an adapter board.
  • the first end 120 of the input carrier 12 has a second bonding area 1200, the second bonding area 1200 is electrically connected to the first bonding area 100, for example, electrically connected through conductive particles (eg, anisotropic conductive adhesive film ACF, etc.); and
  • the orthographic projection of the first end 120 of the input carrier 12 on the output carrier 10 extends beyond the first bond pad 100 .
  • the size of the second welding area 1200 is approximately the same as the size of the first welding area 100 at the corresponding position.
  • the first support 14 and the second support 16 are located between the output carrier 10 and the first end 120 of the input carrier 12, and the first support 14 is located on the input carrier 12, and the first support 14 is located beyond the first end 120 At the position of the first welding area 100 , the second support member 16 is located on the output carrier 10 and is opposite to the first support member 14 .
  • first connection lines A are provided on the surface of the first bonding area 100
  • second connection lines B are provided on the surface of the second bonding area 1200 ;
  • the first connection lines A are in one-to-one correspondence and are electrically connected, for example, electrically connected by conductive particles, so that the output carrier 10 is electrically connected to the input carrier 12 through the first connection line A and the second connection line B.
  • a plurality of first connection lines A are arranged at intervals on the surface of the first bonding area 100
  • a plurality of second connection lines B are arranged at intervals on the surface of the second bonding area 1200
  • the corresponding first connection lines A and second connection lines B are along the Conduction in the vertical direction and insulation from the adjacent first connection line A or second connection line B in the horizontal direction.
  • the material of the first support member 14 is the same as that of the second connection line B
  • the material of the second support member 16 is the same as the material of the first connection line A.
  • the above design method can make the first support member 14 and the second The connection circuit B can be prepared and formed at the same time, and the second support member 16 and the first connection circuit A can be prepared and formed at the same time, so as to reduce the complexity of the preparation process and improve the efficiency.
  • the thickness of the first support member 14 may be the same as the thickness of the second connection line B, and the thickness of the second support member 16 may be the same as the thickness of the first connection line A to further reduce the complexity of the manufacturing process.
  • the material of the second connection line B and the first connection line A is metal
  • the first support member 14 and the second support member 16 are electrically suspended metal wires, wherein the above-mentioned electrical suspension refers to the second support
  • the first support member 16 is not electrically connected to the first connection line A on the output carrier 10
  • the first support member 14 is not electrically connected to the second connection line B on the input carrier 12
  • the space between the first support member 14 and the second support member 16 is not electrically connected. No electrical circuit can be created.
  • the hardness of the first supporting member 14 and the second supporting member 16 made of the above-mentioned metal materials is relatively high, and the probability of cracks occurring during the pressing process of the indenter is relatively low.
  • the first connection line A and the second support member 16 may be simultaneously formed on the base material of the output carrier 10 by patterning the metal layer, and the formed first connection line A and the second support member 16
  • the thickness can be the same; and the second connection line B and the first support member 14 can be simultaneously formed on the base material of the input carrier 12 by means of a patterned metal layer, and the formed second connection line B and the first support member 14 14
  • the thickness can be the same.
  • a non-simultaneous formation method can also be adopted. In this case, the thicknesses of the first connecting line A and the second supporting member 16 can be different, and the thicknesses of the second connecting line B and the first supporting member 14 can also be different. can be different.
  • the first end 120 of the input carrier 12 has a first portion 1202 and a second portion 1204 whose orthographic projection on the output carrier 10 extends beyond the first bonding area 100 .
  • a welding area 100 is disposed opposite to each other, and the first part 1202 and the second part 1204 are symmetrically disposed relative to the second welding area 1200 , wherein a plurality of first support members 14 are disposed in the first part 1202 and the second part 1204 , corresponding to , the output carrier 10 is provided with a plurality of second support members 16 in the region corresponding to the first part 1202 and the second part 1204 .
  • This design method can enable the input carrier 12 to protect the two distal ends of the first welding area 100 to a certain extent, and can reduce the probability of cracks occurring between the output carrier 10 and the input carrier 12 during the pressing process.
  • the plurality of first support members 14 located in the first portion 1202 are arranged parallel to each other and at equal intervals, and the plurality of first support members 14 located in the second portion 1204 are parallel to each other and Arranged at equal intervals, this design method can make the pressing pressures of the plurality of first supports 14 and the corresponding plurality of second supports 16 at the positions of the first part 1202 and the second part 1204 more balanced, reducing the first support This reduces the probability of fracture of the member 14 and the second support member 16, thereby reducing the probability of cracks in the output carrier 10 and the input carrier 12.
  • only the plurality of first supports 14 located in the first part 1202 may be arranged parallel to each other and at equal intervals; or, only the plurality of first supports 14 located in the second part 1204 The pieces 14 are arranged parallel to each other and at equal intervals.
  • the first support member 14 is linear, and the extension direction of the first support member 14 is the same as the extension direction of the adjacent second connecting line B, and the corresponding second support member 16 is also It is linear, and the extending direction of the second support member 16 is the same as the extending direction of the adjacent first connecting lines A.
  • This design method can reduce the requirements on the alignment accuracy of the input carrier 12 and the output carrier 10. For example, if the second connection line B in the input carrier 12 is slightly left or right relative to the first connection line A in the output carrier 10 , the above-mentioned design manner can still enable the first support member 14 to correspond to the position of the second support member 16 at the corresponding position.
  • the first end 120 of the input carrier 12 has an axis of symmetry L perpendicular to the direction from the first part 1202 to the second part 1204 , and the extension direction of the first support 14 in the first part 1202 is the same as that of the first part 1202 .
  • the extension directions of the first support members 14 in the two parts 1204 are different.
  • the first support members 14 in the first part 1202 extend downward to the left, while the first support members 14 in the corresponding second part 1204 extend downward to the right.
  • the above design method can improve the welding pull-out force between the input carrier 12 and the output carrier 10 .
  • the above-mentioned arrangement of the symmetry axis L also indicates that the second connection lines B in the second bonding area 1200 of the input carrier 12 are also arranged symmetrically with respect to the symmetry axis L.
  • an identification area 1206 may also be disposed, and identification lines arranged in a specific pattern may be disposed in the identification area 1206 to enable to the function of positioning identification.
  • identification lines arranged in a specific pattern may be disposed in the identification area 1206 to enable to the function of positioning identification.
  • the cross-shaped identification line in FIG. 3 and the like.
  • the first support 14 is formed by at least two first sub-supports 140 located on the same line at intervals
  • the second support 16 is formed by at least two second sub-supports 160 located on the same line
  • the interval setting is formed.
  • One first sub-support 140 may correspond to at least one second sub-support 160
  • one second sub-support 160 may correspond to at least one first sub-support 140 .
  • the first support member 14 may also be a straight-line extending whole, and the second support member 16 is formed by at least two second sub-support members 160 located on the same straight line at intervals; alternatively, the second support member 16 The member 16 is a straight-line extending whole, and the first support member 14 is formed by at least two first sub-support members 140 located on the same straight line at intervals.
  • the first support member 14 a includes a plurality of first sub-support members 140 a connected to each other and adjacent to each other.
  • the extension directions of the first sub-supports 140a are different, for example, the included angles between the extension directions of the adjacent first sub-supports 140a are 30°, 60°, etc.
  • the second supports 16a may include mutual A plurality of second sub-supports 160a are connected, and the first sub-supports 140a and the second sub-supports 160a are in one-to-one correspondence.
  • the above-mentioned design method can make the stress generating cracks decompose between the adjacent first sub-supports 140a or the adjacent second sub-supports 160a, thereby preventing the stress from propagating and reducing the crack propagation distance.
  • first sub-support 140a and the second sub-support 160a in FIG. 4 are linear, and in other embodiments, the first and second sub-supports 140a and 160a may also be arc-shaped.
  • adjacent first sub-support members 140a are connected to each other, and adjacent second sub-support members 160a are connected to each other. In other embodiments, adjacent first sub-support members 160a are connected to each other.
  • a space may be provided between the adjacent second sub-supports 160a, and/or a space may also be provided between the adjacent second sub-supports 160a.
  • the first support 14a includes a plurality of first sub-supports 140a arranged at a distance from each other. , the extension directions between adjacent first sub-supports 140a are different, the second support 16a includes a plurality of second sub-supports 160a arranged at intervals from each other, and the extension directions between adjacent second sub-supports 160a are different, And the first sub-support members 140a correspond to the second sub-support members 160a one-to-one.
  • FIG. 5 which is a schematic cross-sectional view of another embodiment at the position of section line AA in FIG. 1
  • the first support 14a or the second support 16a is provided with a non-penetrating a groove
  • at least part of the second support 16a or the first support 14a disposed opposite to it is located in the groove
  • the second support 16a in FIG. 5 is provided with a groove
  • the corresponding first support At least part of the piece 14a is located in the groove
  • the sum of the heights of the first support piece 14a and the second support piece 16a is greater than the sum of the heights of the second connection line B1 and the first connection line A1.
  • the cross section of the first support member 14a on the AA section line in FIG. 5 is a regular rectangle.
  • the cross section of the first support member 14a on the AA section line may be T-shaped, and T The end of the font is located in the groove.
  • a groove may also be provided on the first support member 14a, and at least part of the second support member 16a is located in the groove.
  • the positions of the first support member 14a and the second support member 16a can be defined by grooves, so as to further reduce the probability of displacement of the input carrier 12a and the output carrier 10a.
  • FIG. 6 is a schematic structural diagram of an embodiment of the display module of the present application.
  • the display module 20 can include the welding structure in any of the above-mentioned embodiments; for example, the above-mentioned welding structure can be used between the array layer of the display module 20 and the chip on film or the flexible printed circuit board; for another example, the display module 20 The above-mentioned welding structure can be used between the touch layer and the flexible printed circuit board.
  • the input carrier 12 when the input carrier 12 is a display screen, the position where the first end 120 of the input carrier 12 exceeds the second welding area 1200 is in the clearance area of the welding structure, and the input carrier 12 in the clearance area and the corresponding output carrier 10
  • No circuit design that is, after the first support member 14 and the second support member 16 are introduced into the clearance area, the first support member 14 and the second support member 16 can be lowered by using the surface contact method of the first support member 14 and the second support member 16
  • the pressure exerted by the member 16 on the output carrier 10 and the input carrier 12 on both sides thereof is equivalent to dispersing the pressure on the first support member 14 and the second support member 16, thereby reducing the pressure on the output carrier 10 and the input carrier 12 in the pressing
  • the probability of cracks in the process when the display module adopts the above welding structure, the probability of poor screen display can be reduced, and the display effect can be improved.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

本申请公开了一种焊接结构和显示模组，所述焊接结构包括：输出载体，其一侧边缘设置有第一焊接区；输入载体，其第一端具有第二焊接区，所述第二焊接区与所述第一焊接区电连接；且所述输入载体的第一端在所述输出载体上的正投影超出所述第一焊接区；至少一组第一支撑件和第二支撑件，所述第一支撑件位于所述输入载体上，且位于所述第一端超出所述第一焊接区的位置；所述第二支撑件位于所述输出载体上且与所述第一支撑件相对设置。通过上述方式，本申请能够降低焊接压合过程中输出载体和/或输入载体所受到的压力。

Description

焊接结构和显示模组 技术领域
本申请属于显示技术领域，具体涉及一种焊接结构和显示模组。
背景技术
显示模组中一般包含屏体、柔性印刷电路板等，而屏体和柔性印刷电路板之间通常通过覆晶薄膜(chip on film，即COF)电连接。
一般而言，覆晶薄膜和屏体焊接过程中会利用压头进行压合，在压合过程中，焊接区边缘位置处的屏体和/或覆晶薄膜在压合过程中容易出现裂缝，严重时裂缝可能会延伸至显示模组中的线路，进而造成显示模组显示不良。
发明内容
本申请提供一种焊接结构和显示模组，以降低焊接压合过程中输出载体和/或输入载体所受到的压力。
为解决上述技术问题，本申请采用的一个技术方案是：提供一种焊接结构，包括：输出载体，其一侧边缘设置有第一焊接区；输入载体，其第一端具有第二焊接区，所述第二焊接区与所述第一焊接区电连接；且所述输入载体的第一端在所述输出载体上的正投影超出所述第一焊接区；至少一组第一支撑件和第二支撑件，所述第一支撑件位于所述输入载体上，且位于所述第一端超出所述第一焊接区的位置；所述第二支撑件位于所述输出载体上且与所述第一支撑件相对设置。
为解决上述技术问题，本申请采用的另一个技术方案是：提供一种显示模组，包括上述任一实施例中所述的焊接结构。
区别于现有技术情况，本申请的有益效果是：本申请所提供的焊接结构中输入载体的第一端在输出载体上的正投影超出输出载体上的第一焊接区；且输入载体的第一端超出第一焊接区的位置设置有第一支撑件，输出载体对应第一支撑件的位置设置有第二支撑件。当第一焊接区和第二焊接区焊接时，本申请中第一支撑件和第二支撑件的尺寸较大，将压头压力分散至第一支撑件和第二支撑件上，从而降低输出载体以及输入载体在压合过程中出现裂缝的概率；当显示模组采用上述焊接结构时，可以降低屏体显示不良的概率，提高显示效果。
【附图说明】
图1为本申请焊接结构一实施方式的结构示意图；
图2为图1中A-A剖线位置处的剖视示意图；
图3为图1中输入载体的第二焊接区与输出载体的第一焊接区焊接的俯视示意图；
图4为图3中第一支撑件或第二支撑件另一实施方式的结构示意图；
图5为图1中A-A剖线位置处另一实施方式的剖视示意图。
图6为本申请显示模组一实施方式的结构示意图。
【具体实施方式】
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，均属于本申请保护的范围。
请参阅图1与图2，本申请揭示了一种焊接结构，该焊接结构可以应用于柔性OLED显示模组、Micro-OLED显示模组等，也可应用于柔性印刷电路板与转接板焊接的测试过程；其包括输出载体10、输入载体12、至少一组第一支撑件14和第二支撑件16。
具体地，当该焊接结构应用于显示模组时，该输出载体10可以为显示屏、转接板、柔性印刷电路板中任意一种，以显示屏为例，其可包括依次层叠设置的多层膜层，例如，输出载体10包括依次层叠设置的阵列层、发光层、封装层、触控层等，该输出载体10的一侧边缘设置有第一焊接区100，该第一焊接区100可以位于阵列层上，阵列层内的信号线(例如，数据线、扫描线等)可以电连接至第一焊接区100；或者，该第一焊接区100可以位于触控层上，触控层内的触控电极(例如，发射电极、接收电极)可以电连接至第一焊接区100。
输入载体12可以是覆晶薄膜、柔性印刷电路板、转接板中任意一种。输入载体12的第一端120具有第二焊接区1200，该第二焊接区1200与第一焊接区100电连接，例如通过导电粒子(例如，各向异性导电胶膜ACF等)电连接；且输入载体12的第一端120在输出载体10上的正投影超出第一焊接区100。在本实施例中，可以认为第二焊接区1200的大小与对应位置处的第一焊接区100的大小大致相同。
第一支撑件14和第二支撑件16位于输出载体10与输入载体12的第一端120之间，且第一支撑件14位于输入载体12上，第一支撑件14处于第一端120超出第一焊接区100的位置，第二支撑件16位于输出载体10上且与第一支撑件14相对设置。
在本实施例中，结合图2所示，第一焊接区100表面设置有多个第一连接线路A，第二焊接区1200表面设置有多个第二连接线路B；第二连接线路B与第一连接线路A一一对应且电连接，例如，通过导电粒子电连接，以使得输出载体10通过第一连接线路A、第二连接线路B与输入载体12电连接。多个第一连接线路A在第一焊接区100表面间隔设置，多个第二连接线路B在第二焊接区1200表面间隔设置，一一对应的第一连接线路A与第二连接线路B沿竖直方向导通，沿水平方向与相邻的第一连接线路A或第二连接线路B绝缘。优选地，第一支撑件14的材质与第二连接线路B的材质相同，第二支撑件16的材质与第一连接线路A的材质相同，上述设计方式可以使得第一支撑件14和第二连接线路B能够同时制备形成，第二支撑件16与第一连接线路A能够同时制备形成，以降低制备工艺复杂程度，提高效率。
优选地，上述第一支撑件14的厚度可以与第二连接线路B的厚度相同，第二支撑件16的厚度可以与第一连接线路A的厚度相同，以进一步降低制备工艺复杂程度。
优选地，上述第二连接线路B和第一连接线路A的材质为金属，第一支撑件14和第二支撑件16为电性悬空的金属线，其中，上述电性悬空是指第二支撑件16与输出载体10上的第一连接线路A非电连接，第一支撑件14与输入载体12上的第二连接线路B非电连接，第一支撑件14和第二支撑件16之间并不能产生电性回路。上述金属材质的第一支撑件14和第二支撑件16的硬度较高，在压头压合过程中产生裂纹的概率较低。
在实际制备过程中，可以通过图案化金属层的方式在输出载体10的基材上同时形成第一连接线路A和第二支撑件16，且所形成的第一连接线路A和第二支撑件16厚度可以相同；以及可以通过图案化金属层的方式在输入载体12的基材上同时形成第二连接线路B和第一支撑件14，且所形成的第二连接线路B和第一支撑件14厚度可以相同。当然，在其他实施例中，也可采用非同时形成的方式，此时所形成的第一连接线路A和第二支撑件16厚度可以不同，第二连接线路B和第一支撑件14厚度也可以不同。
请一并参阅图1和图3，输入载体12的第一端120具有在输出载体10上的正投影超出第一焊接区100的第一部分1202和第二部分1204，第二焊接区1200与第一焊接区100相对设置，且第一部分1202和第二部分1204相对于第二焊接区1200对称设置，其中，第一部分1202和第二部分1204内均设置有多个第一支撑件14，对应地，输出载体10对应第一部分1202和第二部分1204的区域内设置有多个第二支撑件16。该设计方式可以使得输入载体12能够对第一焊接区100的两远端起到一定的保护作用，且可以降低压合过程中输出载体10和输入载体12产生裂缝的概率。
优选地，如图3所示，位于第一部分1202内的多个第一支撑件14之间相互平行且等间隔排列，位于第二部分1204内的多个第一支撑件14之间相互平行且等间隔排列，该设计方式可以使得第一部分1202和第二部分1204位置处的多个第一支撑件14和对应的多个第二支撑件16所受到的压合压力较为均衡，降低第一支撑件14和第二支撑件16断裂的概率，进而降低输出载体10和输入载体12产生裂缝的概率。当然，在其他实施例中，也可仅位于第一部分1202内的多个第一支撑件14之间相互平行且等间隔排列；或者，也可仅位于第二部分1204内的多个第一支撑件14之间相互平行且等间隔排列。
优选地，如图3所示，第一支撑件14为直线型，且第一支撑件14的延伸方向与邻近的第二连接线路B的延伸方向相同，与之对应的第二支撑件16也为直线型，且第二支撑件16的延伸方向与邻近的第一连接线路A的延伸方向相同。该设计方式可以降低输入载体12与输出载体10对对位精度的要求，例如，若输入载体12中的第二连接线路B相对输出载体10中的第一连接线路A稍微左偏或右偏一些，上述设计方式仍然可以使得第一支撑件14能够与对应位置处的第二支撑件16位置对应。
优选地，如图3所示，输入载体12的第一端120具有与第一部分1202至第二部分1204方向垂直的对称轴L，且第一部分1202内的第一支撑件14的延伸方向与第二部分1204内的第一支撑件14的延伸方向不同，例如，第一部分1202内的第一支撑件14朝左下延伸，而对应的第二部分1204内的第一支撑件14朝右下延伸，上述设计方式可以提高输入载体12与输出载体10之间的焊接拉拔力。另外，上述对称轴L的设置方式还表明输入载体12的第二焊接区1200内的第二连接线路B也是关于该对称轴L对称设置的。
另外，输入载体12的第二焊接区1200与其两侧的第一部分1202和第二部 分1204之间还可设置有标识区1206，标识区1206内可以设置有排列成特定图案的标识线路，以起到定位标识作用。例如，图3中的十字形标识线路等。
如图3所示，第一支撑件14由位于同一直线上的至少两个第一子支撑件140间隔设置形成，第二支撑件16由位于同一直线上的至少两个第二子支撑件160间隔设置形成。一个第一子支撑件140可以与至少一个第二子支撑件160对应，或者，一个第二子支撑件160可以与至少一个第一子支撑件140对应。在压力压合过程中，若第一支撑件14或第二支撑件16上产生裂纹，上述间隔设计方式可以阻断裂纹传播。当然，在其他实施例中，第一支撑件14也可为直线延伸的整体，第二支撑件16由位于同一直线上的至少两个第二子支撑件160间隔设置形成；或者，第二支撑件16为直线延伸的整体，第一支撑件14由位于同一直线上的至少两个第一子支撑件140间隔设置形成。
当然，在其他实施方式中，也可采用其他方式来阻止裂纹传播。如图4所示，图4为图3中第一支撑件或第二支撑件另一实施方式的结构示意图，第一支撑件14a包括相互连接的多个第一子支撑件140a，且相邻第一子支撑件140a之间的延伸方向不同，例如，相邻第一子支撑件140a的延伸方向之间的夹角为30°、60°等；同样地，第二支撑件16a可以包括相互连接的多个第二子支撑件160a，且第一子支撑件140a与第二子支撑件160a一一对应。上述设计方式可以使得产生裂纹的应力在相邻第一子支撑件140a或相邻第二子支撑件160a之间分解，继而阻止应力传播，降低裂纹传播的距离。需要说明的是，图4中第一子支撑件140a和第二子支撑件160a为直线型，在其他实施例中，第一子支撑件140a和第二子支撑件160a也可为弧形。图4中，相邻的第一子支撑件140a之间是相互连接的，相邻的第二子支撑件160a之间是相互连接的，在其他实施例中，相邻的第一子支撑件140a之间可设置有间隔，和/或，相邻的第二子支撑件160a之间也可设置有间隔，具体地，第一支撑件14a包括相互间隔排列的多个第一子支撑件140a，相邻第一子支撑件140a之间的延伸方向不同，第二支撑件16a包括相互间隔排列的多个第二子支撑件160a，相邻第二子支撑件160a之间的延伸方向不同，且第一子支撑件140a与第二子支撑件160a一一对应。
在又一个实施方式中，如图5所示，图5为图1中A-A剖线位置处另一实施方式的剖视示意图，第一支撑件14a或第二支撑件16a上设置有非贯通的凹槽，与其相对设置的第二支撑件16a或第一支撑件14a的至少部分位于凹槽内，例如，图5中的第二支撑件16a上设置有凹槽，与其对应设置的第一支撑件14a的至少 部分位于凹槽内，此时第一支撑件14a和第二支撑件16a的高度之和大于第二连接线路B1和第一连接线路A1的高度之和。优选地，图5中的第一支撑件14a在A-A剖线上的截面为一个规则的矩形，在其他实施例中，第一支撑件14a在A-A剖线上的截面可以为T字型，T字型的端部位于凹槽内。当然，在其他实施例中，也可在第一支撑件14a上设置凹槽，第二支撑件16a的至少部分位于凹槽内。上述设计方式可以通过凹槽限定第一支撑件14a和第二支撑件16a的位置，以进一步降低输入载体12a与输出载体10a发生位移的概率。
请参阅图6，图6为本申请显示模组一实施方式的结构示意图。该显示模组20可以包含上述任一实施例中的焊接结构；例如，显示模组20的阵列层与覆晶薄膜或柔性印刷电路板之间可以采用上述焊接结构；又例如，显示模组20的触控层与柔性印刷电路板之间可以采用上述焊接结构。
本申请中，当输入载体12为显示屏时，输入载体12的第一端120超出第二焊接区1200的位置处于焊接结构的净空区，净空区内的输入载体12以及对应的输出载体10上无线路设计，即在净空区引入第一支撑件14和第二支撑件16后，利用第一支撑件14和第二支撑件16面接触的方式，可以降低第一支撑件14和第二支撑件16对其两侧的输出载体10以及输入载体12施加的压强，即相当于将压力分散至第一支撑件14和第二支撑件16上，从而降低输出载体10以及输入载体12在压合过程中出现裂缝的概率；当显示模组采用上述焊接结构时，可以降低屏体显示不良的概率，提高显示效果。
以上所述仅为本申请的实施例，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其它相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (20)

  1. 一种焊接结构，包括：
    输出载体，其一侧边缘设置有第一焊接区；
    输入载体，其第一端具有第二焊接区，所述第二焊接区与所述第一焊接区电连接；且所述输入载体的所述第一端在所述输出载体上的正投影超出所述第一焊接区；
    至少一组第一支撑件和第二支撑件，所述第一支撑件位于所述输入载体上，且位于所述第一端超出所述第一焊接区的位置；所述第二支撑件位于所述输出载体上且与所述第一支撑件相对设置。
  2. 根据权利要求1所述的焊接结构，其中，
    所述第一焊接区表面设置有多个第一连接线路，所述第二焊接区表面设置有多个第二连接线路，所述第一连接线路与所述第二连接线路一一对应且电连接；所述第一支撑件的材质与所述第二连接线路的材质相同。
  3. 根据权利要求1所述的焊接结构，其中，
    所述第一焊接区表面设置有多个第一连接线路，所述第二焊接区表面设置有多个第二连接线路，所述第一连接线路与所述第二连接线路一一对应且电连接；所述第二支撑件的材质与所述第一连接线路的材质相同。
  4. 根据权利要求2所述的焊接结构，其中，
    所述第一支撑件的厚度与所述第二连接线路的厚度相同，
  5. 根据权利要求3所述的焊接结构，其中，
    所述第二支撑件的厚度与所述第一连接线路的厚度相同。
  6. 根据权利要求1-5中任一项所述的焊接结构，其中，
    所述第二焊接区与所述第一焊接区通过导电粒子电连接，所述第一支撑件和所述第二支撑件为电性悬空的金属线。
  7. 根据权利要求1所述的焊接结构，其中，
    所述输入载体的所述第一端具有在所述输出载体上的正投影超出所述第一焊接区的第一部分和第二部分，所述第二焊接区与所述第一焊接区相对设置，且所述第一部分和所述第二部分相对于所述第二焊接区对称设置；其中，所述第一部分和所述第二部分内均设置有多个所述第一支撑件，所述输出载体对应所述第一部分和所述第二部分的区域内分别设置有多个所述第二支撑件。
  8. 根据权利要求7所述的焊接结构，其中，
    位于所述第一部分内的多个所述第一支撑件之间相互平行且等间隔排列。
  9. 根据权利要求7所述的焊接结构，其中，
    位于所述第二部分内的多个所述第一支撑件之间相互平行且等间隔排列。
  10. 根据权利要求2所述的焊接结构，其中，
    所述第一支撑件为直线型，且所述第一支撑件的延伸方向与邻近的所述第二连接线路的延伸方向相同。
  11. 根据权利要求3所述的焊接结构，其中，
    所述第二支撑件为直线型，且所述第二支撑件的延伸方向与邻近的所述第一连接线路的延伸方向相同。
  12. 根据权利要求10所述的焊接结构，其中，
    所述第一支撑件由位于同一直线上的至少两个第一子支撑件间隔设置形成。
  13. 根据权利要求11所述的焊接结构，其中，
    所述第二支撑件由位于同一直线上的至少两个第二子支撑件间隔设置形成。
  14. 根据权利要求7所述的焊接结构，其中，
    所述输入载体的所述第一端具有与从所述第一部分至所述第二部分的方向垂直的对称轴，且所述第一部分内的所述第一支撑件的延伸方向与所述第二部分内的所述第一支撑件的延伸方向不同。
  15. 根据权利要求1所述的焊接结构，其中，
    所述第一支撑件包括相互连接的多个第一子支撑件，且相邻所述第一子支撑件之间的延伸方向不同；
    所述第二支撑件包括相互连接的多个第二子支撑件，且相邻所述第二子支撑件之间的延伸方向不同，所述第一子支撑件与所述第二子支撑件一一对应。
  16. 根据权利要求1所述的焊接结构，其中，
    所述第一支撑件包括相互间隔排列的多个第一子支撑件，且相邻所述第一子支撑件之间的延伸方向不同，
    所述第二支撑件包括相互间隔排列的多个第二子支撑件，且相邻所述第二子支撑件之间的延伸方向不同，所述第一子支撑件与所述第二子支撑件一一对应。
  17. 根据权利要求1所述的焊接结构，其中，
    所述第一支撑件或所述第二支撑件上设置有非贯通的凹槽，与其相对设置的所述第二支撑件或所述第一支撑件的至少部分位于所述凹槽内。
  18. 根据权利要求1所述的焊接结构，其中，所述输出载体包括显示屏、转接板、柔性印刷电路板中的任一种；所述输入载体包括覆晶薄膜、柔性印刷电路板、转接板中的任一种。
  19. 根据权利要求1所述的焊接结构，其中，
    所述输入载体的所述第二焊接区与其两侧的所述第一部分和所述第二部分之间还分别设置有标识区，所述标识区内设置有标识线路。
  20. 一种显示模组，包括：权利要求1-19任一项所述的焊接结构。
PCT/CN2021/095396 2020-08-27 2021-05-24 焊接结构和显示模组 WO2022041874A1 (zh)

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