WO2020232690A1 - 引脚结构及柔性面板 - Google Patents

引脚结构及柔性面板 Download PDF

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Publication number
WO2020232690A1
WO2020232690A1 PCT/CN2019/088055 CN2019088055W WO2020232690A1 WO 2020232690 A1 WO2020232690 A1 WO 2020232690A1 CN 2019088055 W CN2019088055 W CN 2019088055W WO 2020232690 A1 WO2020232690 A1 WO 2020232690A1
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WO
WIPO (PCT)
Prior art keywords
pin
pins
bonding
lead
extension
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Application number
PCT/CN2019/088055
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English (en)
French (fr)
Inventor
罗永辉
杜利剑
叶桂卿
Original Assignee
深圳市柔宇科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市柔宇科技有限公司 filed Critical 深圳市柔宇科技有限公司
Priority to PCT/CN2019/088055 priority Critical patent/WO2020232690A1/zh
Priority to CN201980079833.2A priority patent/CN113330561A/zh
Publication of WO2020232690A1 publication Critical patent/WO2020232690A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads

Definitions

  • This application relates to the field of electronic technology, in particular to a pin structure and a flexible panel.
  • the pins in the bonding area on the display panel are electrically connected to the pins on the chip on flex (COF) by hot pressing, so that the circuit of the display panel is connected to the chip on the COF to drive Display of the display panel.
  • COF chip on flex
  • the present application provides a lead that can solve the problem of cracks easily generated when the pins in the hot-press bonding area and the COF pins are easily formed, so as to improve the electrical connection quality between the pins in the bonding area and the COF pins. Foot structure and flexible panel.
  • the present application provides a pin structure, including: a substrate; a plurality of first pins are provided on the substrate, and a gap is formed between two adjacent first pins; and a plurality of second pins A pin is provided on the substrate, at least one of the second pins is located between two adjacent first pins, and the second pin includes a first insertion portion and a first extension that are connected Part, the first insertion part is located in the gap, and the first extension part extends out of the gap.
  • the present application provides a flexible panel, including: a substrate; a plurality of first pins arranged on the substrate, and a gap is formed between two adjacent first pins; a plurality of second leads
  • the foot is provided on the substrate, at least one of the second leads is located between two adjacent first leads, and the second lead includes a first insertion portion and a first extension portion that are connected , The first insertion portion is located in the gap, and the first extension portion extends out of the gap; a circuit carrier at least partially opposite to the substrate; a plurality of first bonding pins are provided on the circuit carrier , Each of the first bonding feet is superimposed on one of the first pins and electrically connected; and a plurality of second bonding feet are provided on the circuit carrier, and each of the second bonding feet is connected to one The second pins are superimposed and electrically connected, and the second bonding feet and the first bonding feet are spaced apart.
  • FIG. 1 is a schematic structural diagram of a first pin structure provided by an embodiment of the present application.
  • Fig. 2 is a schematic structural diagram of a second pin structure provided by an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a third pin structure provided by an embodiment of the present application.
  • Fig. 4 is a schematic structural diagram of a first flexible panel provided by an embodiment of the present application.
  • Fig. 5 is a cross-sectional view of the flexible panel provided in Fig. 4 along the line A-A.
  • Fig. 6 is a schematic structural diagram of a second flexible panel provided by an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of a third type of flexible panel provided by an embodiment of the present application.
  • the present application provides a pin structure 10, which can be applied to a flexible display panel.
  • the pin structure 10 includes a substrate 1, a plurality of first pins 2 and a plurality of second pins 3.
  • a plurality of first pins 2 are provided on the supporting surface 11 of the substrate 1.
  • a gap 12 is formed between two adjacent first pins 2.
  • a plurality of second pins 3 are provided on the supporting surface 11 of the substrate 1.
  • At least one of the second pins 3 is located between two adjacent first pins 2.
  • the second pin 3 includes a first insertion portion 31 and a first extension portion 32 connected to each other.
  • the first insertion portion 31 is located in the gap 12.
  • the first protrusion 32 is located outside the gap 12. In other words, the plurality of first pins 2 and the plurality of second pins 3 intersect each other.
  • the area where the multiple first pins 2 are located and the area where the multiple second pins 3 are located will not form a straight line Therefore, when the pin structure 10 is connected to other pin structures by pressing, it is not easy for pressure to occur between the area where the first pins 2 are located and the area where the second pins 3 are located.
  • the bottom collapse causes the substrate 1 to crack, so the yield of the pin structure 10 can be improved, which is beneficial to be applied to a high-resolution display panel.
  • the substrate 1 is a flexible substrate, and the material of the substrate 1 is a flexible material such as polyimide (PI).
  • PI polyimide
  • the substrate 1 is a flexible substrate, the plurality of first pins 2 and the plurality of second pins 3 are interspersed with each other, which prevents the substrate 1 from being caused by multiple first pins 2 and multiple second pins during the bending process. The separation gap between 3 is broken to improve the bending strength of the lead structure 10.
  • the substrate 1 may be a rigid substrate 1.
  • the material of the substrate 1 is glass or the like.
  • the supporting surface 11 of the substrate 1 is used for disposing scan lines, data lines, thin film transistors and other devices for display.
  • the first pins 2 are elongated, each of the first pins 2 has the same structure, and a plurality of the first pins 2 are arranged in parallel and equidistant from each other.
  • the direction in which the first pins 2 extend is defined as the Y direction
  • the direction in which the multiple first pins 2 are arranged is the X direction.
  • the first pin 2 and the second pin 3 are electrically connected to signal transmission lines, which include but are not limited to data lines, scan lines or other driving signal lines.
  • the gap 12 is an area between two adjacent and opposite first pins 2.
  • the shape of the second pin 3 is the same as the shape of the first pin 2, so that the impedance of the first pin 2 and the second pin 3 are the same and the influence on the signal is the same.
  • the arrangement of the second pins 3 is the same as the arrangement of the first pins 2.
  • the plurality of second pins 3 are arranged in parallel and equidistant from each other. A part of the second pin 3 is located in the gap 12 between two adjacent first pins 2 and is spaced apart from the first pin 2, and another part of the second pin 3 extends out of the gap along the Y direction 12, so that the first pin 2 and the second pin 3 are interspersed and arranged.
  • the application does not limit the length of the second pin 3 extending into the gap 12. Specifically, the length of the first insertion portion 31 of the second pin 3 is greater than the length of the first extension portion 32.
  • a second pin 3 is provided between two adjacent first pins 2, so that the first pin 2 and the second pin 3 are alternately inserted into each other, so that the pin structure
  • the pins on the pin 10 are evenly distributed, and each area of the pin structure 10 can evenly bear the pressure during the hot pressing, which reduces the occurrence of cracks and improves the yield of the pin structure 10.
  • a plurality of second pins 3 may also be provided between two adjacent first pins 2 to suit specific usage scenarios and increase the degree of freedom of structural design of the pin structure 10.
  • both the first pin 2 and the second pin 3 are made of copper material to reduce the impedance of the first pin 2 and the second pin 3, thereby reducing the first pin 2 and the second pin 3 Heat loss of pin 3.
  • the first pin 2 and the second pin 3 may also be made of aluminum and other materials with good electrical conductivity.
  • a first empty area 33 is formed between the end of the first pin 2 and the adjacent first protrusion 32.
  • the pin structure 10 also includes a plurality of third pins 4.
  • the third pin 4 includes a second insertion portion 41 and a second extension portion 42 connected to each other.
  • the second insertion portion 41 is located in the first empty area 33 and is spaced apart from the first pin 2 and the second pin 3.
  • the second protrusion 42 extends from the first empty area 33 in a direction away from the first pin 2.
  • the density of the pins on the pin structure 10 is increased, so that the first lead
  • the area where the leg 2 is located, the area where the second pin 3 is located, and the area where the third pin 4 is located are sequentially tightly occluded to improve the bending resistance of the pin structure 10 during the hot pressing process, and the third pin 4 is located at the third pin 4
  • the first vacant area 33 formed by a pin 2 and a second pin 3 reduces the occupation of the first pin 2, the second pin 3, and the third pin 4 in the Y-axis direction of the substrate 1. Space, reduce the width of the pins arranged along the X axis, and facilitate the miniaturization of the pin structure 10.
  • the first pin 2 and the second pin 3 have the same length, and the first pin 2 and the second pin 3 are interspersed with each other, so the first pin 2 is close to the second pin.
  • a first empty area 33 is formed between the end of the pin 3 and the adjacent second pin 3.
  • the first empty area 33 when the first pin 2 is the outermost pin, the area between the end of the first pin 2 and the adjacent second pin 3 is the first empty area 33;
  • the pin 2 is an inner pin, the area enclosed between the end of the first pin 2 and the two adjacent second pins 3 is the first empty area 33.
  • the gap 12 and the first empty area 33 are arranged along the Y-axis direction.
  • the third pin 4 is arranged in the first vacant area 33 and is spaced apart from the first pin 2 and the second pin 3.
  • the orthographic projection of the third pin 4 in the X-axis direction does not coincide with the orthographic projection of the first pin 2 in the X-axis direction.
  • the pin structure 10 further includes a plurality of first leads 23.
  • One end of the first lead 23 is electrically connected to the first pin 2.
  • the other end of the first pin 2 protrudes from the end of the first pin 2 close to the second pin 3 and passes through the first empty area 33 to be connected to a signal transmission line.
  • the third pin 4 is located on the left side of the first lead 23 (refer to FIG. 2).
  • the structure of the third pin 4 is the same as that of the first pin 2, so that the impedance of the third pin 4 and the first pin 2 are the same, and the third lead Pin 4 and the first pin 2 have the same influence on the signal.
  • the second insertion portion 41 of the third pin 4 is located in the first vacant area 33.
  • the second insertion portion 41 is located between the first extension portion 32 and Between the first leads 23.
  • the second insertion portion 41 is spaced apart from the first extension portion 32 and the first lead 23. This embodiment does not limit the length of the second insertion portion 41, as long as the second insertion portion 41 is close to the end of the first pin 2 but insulated from the end of the first pin 2.
  • the plurality of third pins 4 are arranged in parallel and equidistantly, so that the first pin 2, the second pin 3, and the third pin 4 are evenly arranged, so that each of the pin structure 10 The partial pressure is evenly distributed, which reduces the risk of the pin structure 10 breaking during the hot pressing process.
  • a second empty area 43 is formed between the end of the second pin 3 and the adjacent second extension 42.
  • the pin structure 10 also includes a plurality of fourth pins 5.
  • the fourth pin 5 includes a third insertion portion 51 and a third extension portion 52 connected to each other.
  • the third insertion portion 51 is located in the second vacant area 43 and is spaced apart from the second pin 3 and the third pin 4.
  • the third protruding portion 52 protrudes from the second empty area 43 in a direction away from the second pin 3.
  • the third pin 4 since the length of the first insertion portion 31 of the second pin 3 is greater than the length of the first extension portion 32, when the third pin 4 is arranged close to the first pin 2, the third pin 4 The length of the second insertion portion 41 is less than the length of the second extension 42, that is, most of the third pin 4 is located outside the first empty area 33, and the second pin 3 and the second extension 42 The area of the second vacant area 43 is relatively large. It is understandable that the area of the second vacant area 43 is larger than the area of the first vacant area 33. The vacancy of the second vacant area 43 makes the space utilization rate on the pin structure 10 small, resulting in a large amount of area waste on the pin structure 10 .
  • the second vacant area can be effectively used In the space of area 43, with a certain number of pins, the pins are arranged in four rows in the Y-axis direction, which can reduce the width of the pin structure 10 in the X-axis direction, which is conducive to the miniaturization of the pin structure 10
  • This embodiment increases the density of the pins on the pin structure 10, so that the first pin 2 is located, the second pin 3 is located, the third pin 4 is located, and the fourth pin 5 is located The regions are tightly occluded to improve the bending resistance of the lead structure 10.
  • a second empty area 43 is formed between the end of the first extension portion 32 of the second pin 3 away from the first insertion portion 31 and the adjacent third pin 4.
  • the second pin 3 is the outermost pin
  • the area enclosed by the end of the second pin 3 and the adjacent third pin 4 is the second empty area 43;
  • the first extension 32 of the second pin 3 is away from the area enclosed by the end of the first insertion portion 31 and the adjacent two third pins 4 It is the second vacant area 43.
  • the gap 12, the first empty area 33 and the second empty area 43 are arranged along the Y-axis direction.
  • the fourth pin 5 and the second pin 3 are arranged along the Y-axis direction, and are spaced apart from the second pin 3 and the third pin 4.
  • the orthographic projection of the fourth pin 5 in the X-axis direction does not coincide with the orthographic projection of the second pin 3 in the X-axis direction.
  • the pin structure 10 further includes a plurality of second leads 34, one end of the second lead 34 is electrically connected to the second pin 3.
  • the other end of the second lead 34 extends from the end of the second pin 3 close to the third pin 4 (the end of the first extension 32 away from the first insertion portion 31) and penetrates Pass through the second vacant area 43 to connect to the signal transmission line.
  • the fourth pin 5 is located on the left of the second lead 34 and on the right of the first lead 23 (refer to FIG. 3).
  • the second extension 42 is located between a pair of adjacent first leads 23 and second leads 34.
  • the fourth pin 5 is located between another pair of adjacent first lead 23 and second lead 34, and the second extension 42 and the fourth pin 5 are alternately arranged.
  • the structure of the fourth pin 5 is the same as the structure of the first pin 2, so that the impedance of the fourth pin 5 and the first pin 2 are the same, and the fourth pin 5 is the same as the first pin 2.
  • Pin 2 has the same effect on the signal.
  • the third insertion portion 51 of the fourth pin 5 is located in the second empty area 43. This embodiment does not limit the length of the third insertion portion 51, as long as the third insertion portion 51 is close to the end of the second pin 3 but insulated from the end of the second pin 3.
  • the plurality of fourth pins 5 are arranged in parallel and equidistantly, so that the first pin 2, the second pin 3, the third pin 4, and the fourth pin 5 are evenly arranged, thereby Each part of the lead structure 10 bears a uniform pressure distribution, which reduces the risk of the lead structure 10 breaking during the hot pressing process.
  • the pin structure 10 further includes a plurality of third leads 44.
  • One end of the third lead 44 is connected to the third pin 4.
  • the other end of the third lead 44 protrudes from the end of the second extension 42 away from the second insertion part 41 and passes through the gap between the adjacent first lead 23 and the second lead 34 12.
  • the pin structure 10 further includes a plurality of fourth leads 54.
  • One end of the fourth lead 54 is connected to the fourth pin 5.
  • the other end of the fourth lead 54 extends from the end of the third extension 52 away from the third insertion part 51, and passes through another pair of adjacent first leads 23 and second leads 34 Between the gap 12.
  • first pin 2 and the second pin 3 Describing from another angle, take the first pin 2 and the second pin 3 as the first row of pins with a distance in the Y-axis direction, so that one end of the first row of pins is toothed;
  • the three pins 4 and the fourth pin 5 are used as the pins of the second row with a distance in the Y-axis direction, so that one end of the second row is also toothed.
  • the teeth of the first row and the teeth of the second row are engaged with each other, so that there is no gap 12 between the pins of the first row and the pins of the second row, thereby improving the pins on the pin structure 10
  • the density of the lead structure 10 improves the bending resistance of the lead structure 10 during the hot pressing process, and the yield rate of the lead structure 10 is improved.
  • the present application also provides a flexible panel 100.
  • the flexible panel 100 may be a flexible display panel.
  • the flexible panel 100 includes a pin structure 10 and a bonding structure 20.
  • the pin structure 10 includes a substrate 1, a plurality of first pins 2 and a plurality of second pins 3.
  • a plurality of first pins 2 are provided on the substrate 1, and a gap 12 is formed between two adjacent first pins 2.
  • a plurality of second pins 3 are provided on the substrate 1, and at least one of the second pins 3 is located between two adjacent first pins 2.
  • the second pin 3 includes a first insertion portion 31 and a first extension portion 32 connected to each other.
  • the first insertion portion 31 is located in the gap 12.
  • the first protrusion 32 extends from the gap 12.
  • the bonding structure 20 includes a circuit carrier 21, a plurality of first bonding feet 6 and a plurality of second bonding feet 7. At least part of the circuit carrier 21 is opposite to the substrate 1.
  • a plurality of first bonding pins 6 are provided on the circuit carrier 21. Each of the first bonding pins 6 is overlapped with one of the first pins 2 and is electrically connected.
  • a plurality of second bonding pins 7 are provided on the circuit carrier 21. Each of the second bonding feet 7 is superimposed and electrically connected to one of the second pins 3, and the second bonding feet 7 and the first bonding feet 6 are spaced apart.
  • an anisotropic conductive film (ACF) is used to carry out between the first pin 2 and the first bonding pin 6, and the second pin 2 and the interconnection between the second bonding foot 7.
  • ACF anisotropic conductive film
  • an anisotropic conductive adhesive film is arranged between the first pin 2 and the first bonding leg 6, and then the first pin 2 and the first bonding leg 6 are bonded and bonded by hot pressing, thereby achieving The signal between the first pin 2 and the first bonding pin 6 is conducted.
  • the pin structure 10 on the flexible panel 100 By setting the pin structure 10 on the flexible panel 100 such that the first pin 2 and the second pin 3 are inserted into each other, and the first bonding leg 6 and the second bonding pin 7 are inserted into each other, and the first pin 2 and the first pin 2 are inserted into each other.
  • the bonding pins 6 correspond one-to-one
  • the second pins 3 correspond to the second bonding pins 7 one-to-one, so that the pin structure 10 and the bonding structure 20 are pressed together, and there is no difference between the pins or the bonding feet. Cracks are generated due to the gap 12, and the success rate of the electrical connection between the lead structure 10 and the bonding structure 20 is improved.
  • the lead and the lead are less likely to break due to the gap 12, which improves This improves the bending resistance of the flexible panel 100.
  • pin structure 10 is the pin structure 10 described in any one of the foregoing implementation manners, and will not be repeated here.
  • the circuit carrier 21 of the bonding structure 20 may be a flexible circuit board or a chip on film.
  • the layout of the bonding feet on the bonding structure 20 is the same as the layout of the pins on the pin structure 10, so that one bonding leg corresponds to one pin, so the layout of the bonding feet on the bonding structure 20 is different here. Repeat it again.
  • the flexible panel 100 further includes a plurality of third pins 4 provided on the substrate 1 and a plurality of third bonding pins 8 provided on the circuit carrier 21.
  • the third pin 4 includes a second insertion portion 41 and a second extension portion 42 connected to each other.
  • the second insertion portion 41 is located in the first empty area 33 and is spaced apart from the first pin 2 and the second pin 3.
  • the second protrusion 42 extends from the first empty area 33 in a direction away from the first pin 2.
  • Each of the third bonding feet 8 overlaps and is electrically connected with one of the third pins 4, and the third bonding feet 8 are spaced apart from the second bonding feet 7 and the first bonding feet 6 Set up.
  • the density of the pins on the pin structure 10 is increased.
  • the area where the first pin 2 is located, the area where the second pin 3 is located, and the area where the third pin 4 is located are tightly engaged.
  • the density of the bonding feet on the bonding structure 20 is also greater, so that the first key The area where the bonding foot 6 is located, the area where the second bonding foot 7 is located, and the area where the third bonding foot 8 is located are tightly engaged.
  • the gap between the substrate 1 and the circuit carrier 21 The density of the pins and the bonding feet is relatively large, which can withstand relatively large thermal pressure and is not prone to cracks, and can also improve the bending resistance of the flexible panel 100.
  • part of the third pin 4 is located in the first empty area 33 formed by the first pin 2 and the second pin 3, reducing the first pin 2, the second pin 3, and the third pin 4.
  • the space occupied in the Y-axis direction of the substrate 1 correspondingly reduces the space occupied by the bonding feet on the bonding structure 20 in the Y-axis direction of the substrate 1, which is beneficial to the pin structure 10 and the bonding Miniaturized design of structure 20.
  • the flexible panel 100 further includes a plurality of fourth pins 5 provided on the substrate 1 and a plurality of fourth bonding pins 9 provided on the circuit carrier 21.
  • the fourth pin 5 includes a third insertion portion 51 and a third extension portion 52 connected to each other.
  • the third insertion portion 51 is located in the second vacant area 43 and is spaced apart from the second pin 3 and the third pin 4.
  • the third protruding portion 52 protrudes from the second empty area 43 in a direction away from the second pin 3.
  • Each of the fourth bonding feet 9 is superimposed and electrically connected to one of the fourth pins 5, and the fourth bonding feet 9 are connected to the second bonding feet 7, the first bonding feet 6, and the fourth bonding feet.
  • the third bonding feet 8 are arranged at intervals.
  • the second vacant area 43 can be effectively used Under a certain number of pins, the pins are arranged in four rows in the Y-axis direction, which can reduce the width of the pin structure 10 in the X-axis direction, which is conducive to the miniaturization of the pin structure 10
  • this embodiment also increases the density of the bonding feet on the bonding structure 20, which is conducive to the miniaturization of the bonding structure 20, prevents the pin structure 10 and the bonding structure 20 from cracking during the hot pressing process, and improves the lead The bending resistance of the foot structure 10 and the bonding structure 20.
  • the bonding pin is only electrically connected to its corresponding pin, and is insulated from other pins.
  • the bonding leg By setting the length and width of the bonding leg to be slightly larger than the length and width of the pin, so that the bonding leg can still cover the pin with a certain deviation in alignment, so as to be well connected to the pin .
  • the part of the first bonding leg 6 that exceeds the first pin 2 is located at the first pin 2 away from the first pin 2
  • One end of the second pin 3 the part of the second bonding leg 7 that extends beyond the second pin 3 is located at the end of the insertion portion of the second pin 3 away from the extension
  • the third bonding leg 8 extends beyond the
  • the part of the third pin 4 is located at the end of the third pin 4 away from the second pin 3
  • the part of the fourth bonding pin 9 beyond the fourth pin 5 is located at the fourth pin 5 away from the third pin 5
  • One end of the pin 4 so that the distance between the first pin 2 and the third pin 4 is small, the distance between the second pin 3 and the fourth pin 5 is small, and the first bonding pin 6 It is not electrically connected to the third pin 4 and the third bonding foot 8, and the second bonding leg 7 is not electrically connected to the fourth pin 5 and the fourth bonding foot 9.
  • the flexible panel 100 further includes a plurality of first leads 23.
  • One end of the first lead 23 is connected to the first pin 2.
  • the other end of the first pin 2 protrudes from one end of the first pin 2 and passes through the first empty area 33.
  • the first lead 23 is used to electrically connect the electronic components on the substrate 1 so that the electronic components are electrically connected to the first bonding pins 6 through the first pins 2 to realize signal transmission.
  • the first lead 23 extends from one end of the first bonding leg 6 and passes through the second bonding leg 7 and the third bonding leg 8 and the gap between the third bonding foot 8 and the fourth bonding foot 9 to make rational use of the gap between the third bonding foot 8 and the fourth bonding foot 9 to make the first
  • the lead wire 23 is insulated from the third bonding leg 8 and the fourth bonding leg 9.
  • the flexible panel 100 further includes a plurality of second leads 34.
  • One end of the second lead 34 is connected to the second pin 3.
  • the other end of the second lead 34 protrudes from an end of the first extension portion 32 away from the first insertion portion 31 and passes through the second empty area 43.
  • the second lead 34 is used to electrically connect the electronic component on the substrate 1 so that the electronic component is electrically connected to the second bonding pin 7 through the second pin 3 to realize signal transmission.
  • the second lead 34 extends from the second bonding leg 7 and passes through the third bonding leg 8 and the fourth bonding leg 9
  • the gap between the third bonding leg 8 and the fourth bonding leg 9 can be reasonably used to insulate the second lead 34 from the third bonding leg 8 and the fourth bonding leg 9.
  • the flexible panel 100 further includes a plurality of third leads 44.
  • One end of the third lead 44 is connected to the third pin 4.
  • the third lead 44 is used to electrically connect the electronic component on the substrate 1 so that the electronic component is electrically connected to the third bonding pin 8 through the third pin 4 to realize signal transmission.
  • the pin structure 10 and the bonding structure 20 are pressed together, the other end of the third lead 44 is away from the end of the second insertion portion 41 from the second extension 42 and the third bonding leg One end of 8 extends and passes through the gap between a pair of adjacent first leads 23 and second leads 34.
  • the flexible panel 100 further includes a plurality of fourth leads 54.
  • One end of the fourth lead 54 is connected to the fourth pin 5.
  • the fourth lead 54 is used to electrically connect the electronic component on the substrate 1 so that the electronic component is electrically connected to the fourth bonding pin 9 through the fourth pin 5 to realize signal transmission.
  • the other end of the fourth lead 54 is away from the third extension portion 52 from the end of the third insertion portion 51 and the fourth bonding leg
  • One end of 9 protrudes and passes through the gap between another pair of adjacent first leads 23 and second leads 34.
  • the flexible panel 100 provided by the present application is provided with the pin structure 10 on the flexible panel 100 such that the first pin 2 and the second pin 3 are inserted into each other, and the third pin 4 is inserted between the second pin 3.
  • the fourth pin 5 is inserted into the gap 12 between the third pin 4, which increases the density of the pins of the pin structure 10 and improves the space utilization on the substrate 1.
  • the bonding feet on the bonding structure 20 correspond to the pins on the pin structure 10 and are electrically connected, which realizes the signal transmission between the pin structure 10 and the bonding structure 20, and due to the bonding feet of the bonding structure 20
  • the density is larger, and the density of the pins on the pin structure 10 is larger, so that the pin structure 10 and the bonding structure 20 are not prone to cracks during the hot pressing process, and the resistance of the pin structure 10 and the bonding structure 20 can be improved. Bending performance.

Abstract

本申请提供一种引脚结构(10)，包括：基板(1)；多个第一引脚(2)，设于基板(1)上，且相邻的两个第一引脚(2)之间形成间隙(12)；及多个第二引脚(3)，设于基板(1)上，至少一个第二引脚(3)位于相邻的两个第一引脚(2)之间，第二引脚(3)包括相连接的第一插入部(31)和第一伸出部(32)，第一插入部(31)位于间隙(12)，第一伸出部(32)伸出间隙(12)。通过将多个第一引脚(2)与多个第二引脚(3)相互穿插，以使多个第一引脚(2)所在的区域与多个第二引脚(3)所在的区域之间不会形成呈直线延伸的分隔间隙，故而该引脚结构(10)在与其他引脚结构通过压合连接时不易产生裂纹。

Description

引脚结构及柔性面板 技术领域
本申请涉及电子技术领域，尤其涉及一种引脚结构及柔性面板。
背景技术
显示面板上的绑定区域内的引脚通过热压方式与覆晶薄膜(Chip On Flex，COF)上的引脚电连接，以使显示面板的电路与COF上的芯片相导通，以驱动显示面板的显示。然而，在热压绑定区域内的引脚与COF的引脚时容易因为受力不均匀而产生裂纹。因此，如何解决在热压绑定区域内的引脚与COF的引脚时容易因为受力不均匀而产生裂纹，以提高绑定区域内的引脚与COF的引脚的电连接质量，成为需要解决的技术问题。
发明内容
本申请提供了一种能够解决在热压绑定区域内的引脚与COF的引脚时容易产生裂纹的问题，以提高绑定区域内的引脚与COF的引脚的电连接质量的引脚结构和柔性面板。
一方面，本申请提供一种引脚结构，包括：基板；多个第一引脚，设于所述基板上，且相邻的两个第一引脚之间形成间隙；及多个第二引脚，设于所述基板上，至少一个所述第二引脚位于相邻的两个第一引脚之间，所述第二引脚包括相连接的第一插入部和第一伸出部，所述第一插入部位于所述间隙，所述第一伸出部伸出所述间隙。
另一方面，本申请提供一种柔性面板，包括：基板；多个第一引脚，设于所述基板上，且相邻的两个第一引脚之间形成间隙；多个第二引脚，设于所述基板上，至少一个所述第二引脚位于相邻的两个第一引脚之间，所述第二引脚包括相连接的第一插入部和第一伸出部，所述第一插入部位于所述间隙，所述第一伸出部伸出所述间隙；电路载体，至少部分与所述基板相对；多个第一键合脚，设于所述电路载体上，每个所述第一键合脚与一个所述第一引脚相叠加且电连接；及多个第二键合脚，设于所述电路载体上，每个所述第 二键合脚与一个所述第二引脚相叠加且电连接，且所述第二键合脚与所述第一键合脚相间隔设置。
通过将多个第一引脚与多个第二引脚相互穿插，以使多个第一引脚所在的区域与多个第二引脚所在的区域之间不会形成呈直线延伸的分隔间隙，故而，在该引脚结构与其他引脚结构通过压合连接时，多个第一引脚所在的区域与多个第二引脚所在的区域之间不易在压力下坍塌而导致基板产生裂纹，故而能够提高引脚结构的良率，利于应用于高解析度的显示面板。
附图说明
为了更清楚地说明本申请的技术方案，下面将对实施方式中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施方式，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以如这些附图获得其他的附图。
图1是本申请实施例提供的第一种引脚结构的结构示意图。
图2是本申请实施例提供的第二种引脚结构的结构示意图。
图3是本申请实施例提供的第三种引脚结构的结构示意图。
图4是本申请实施例提供的第一种柔性面板的结构示意图。
图5是图4提供的柔性面板沿A-A线的截面图。
图6是本申请实施例提供的第二种柔性面板的结构示意图。
图7是本申请实施例提供的第三种柔性面板的结构示意图。
具体实施方式
下面将结合本申请实施方式中的附图，对本申请实施方式中的技术方案进行清楚、完整地描述，显然，所描述的实施方式仅仅是本申请一部分实施方式，而不是全部的实施方式。基于本申请中的实施方式，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施方式，都属于本申请保护的范围。
请参阅图1，本申请提供了一种引脚结构10，可应用于柔性显示面板。引脚结构10包括基板1、多个第一引脚2及多个第二引脚3。多个第一引脚2 设于所述基板1的支撑面11上。相邻的两个第一引脚2之间形成间隙12。多个第二引脚3设于所述基板1的支撑面11上。至少一个所述第二引脚3位于相邻的两个第一引脚2之间。所述第二引脚3包括相连接的第一插入部31和第一伸出部32。所述第一插入部31位于所述间隙12。所述第一伸出部32位于所述间隙12之外。换而言之，多个第一引脚2与多个第二引脚3相互穿插。
通过将多个第一引脚2与多个第二引脚3相互穿插，以使多个第一引脚2所在的区域与多个第二引脚3所在的区域之间不会形成呈直线延伸的分隔间隙，故而，在该引脚结构10与其他引脚结构通过压合连接时，多个第一引脚2所在的区域与多个第二引脚3所在的区域之间不易在压力下坍塌而导致基板1产生裂纹，故而能够提高引脚结构10的良率，利于应用于高解析度的显示面板。
本实施例中，所述基板1为柔性基板，所述基板1的材质为聚酰亚胺(PI)等柔性材质。当基板1为柔性基板时，多个第一引脚2与多个第二引脚3相互穿插，避免了基板1在弯折过程中由多个第一引脚2与多个第二引脚3之间的分隔间隙处折断，以提高引脚结构10的抗弯折强度。当然，在其他实施方式中，所述基板1可以为硬性基板1，具体的，所述基板1的材质为玻璃等。
可以理解的，所述基板1的支撑面11用于设置扫描线、数据线、薄膜晶体管等用于显示的器件。在一实施方式中，所述第一引脚2呈长条状，每个所述第一引脚2的结构相同，多个所述第一引脚2相互平行且等距排布。为了便于描述，定义第一引脚2延伸的方向为Y方向，多个第一引脚2排列的方向为X方向。本实施例中，第一引脚2和第二引脚3电连接信号传输线，信号传输线包括但不限于数据线、扫描线或其他驱动信号线等。
可以理解的，请参阅图1，所述间隙12为两个相邻且相对的第一引脚2之间的区域。在一实施方式中，第二引脚3的形状与所述第一引脚2的形状相同，以使第一引脚2和第二引脚3的阻抗相同及对于信号的影响相同。第二引脚3的排布方式与所述第一引脚2的排布方式相同。多个所述第二引脚3相互平行且等距排布。第二引脚3的一部分位于相邻的两个第一引脚2之间的间隙12中且与第一引脚2相间隔，第二引脚3的另一部分沿Y方向延伸出所述间隙12，以使第一引脚2与第二引脚3相互穿插设置。本申请对于所述第二引 脚3伸入间隙12的长度不做限定。具体的，所述第二引脚3的第一插入部31的长度大于第一伸出部32的长度。
本实施例中，相邻的两个第一引脚2之间设有一个第二引脚3，以使第一引脚2和第二引脚3相交替地相互穿插，以使引脚结构10上的引脚均匀分布，在进行热压时引脚结构10的各个区域能够均匀地承受压力，减少产生裂纹，提高引脚结构10的良率。在其他实施方式中，相邻的两个第一引脚2之间还可以设有多个第二引脚3，以配合具体的使用场景，提高引脚结构10的结构设计的自由度。
本实施例中，第一引脚2和第二引脚3均为铜材料制成，以减少第一引脚2和第二引脚3的阻抗，进而减少第一引脚2和第二引脚3的热损耗。在其他实施例中，第一引脚2和第二引脚3还可以为铝等导电性能较好的材料制成。
请参阅图2，所述第一引脚2的端部与相邻的第一伸出部32之间形成第一空置区33。所述引脚结构10还包括多个第三引脚4。所述第三引脚4包括相连接的第二插入部41和第二伸出部42。所述第二插入部41位于所述第一空置区33，且与所述第一引脚2和所述第二引脚3相间隔。所述第二伸出部42沿背离所述第一引脚2的方向伸出所述第一空置区33。
通过将第一引脚2与第二引脚3相互穿插设置，及第二引脚3与第三引脚4相互穿插设置，增加了引脚结构10上的引脚的密度，使第一引脚2所在区域、第二引脚3所在区域及第三引脚4所在区域依次紧密咬合，提高引脚结构10在热压过程中的抗弯折性能，而且第三引脚4的部分位于第一引脚2和第二引脚3形成的第一空置区33，减小了第一引脚2、第二引脚3及第三引脚4在所述基板1的Y轴方向上占据的空间，减小引脚沿X轴排布的宽度，利于引脚结构10的小型化设计。
具体的，请参阅图2，第一引脚2与第二引脚3的长度相同，且第一引脚2和第二引脚3相互穿插设置，所以第一引脚2靠近所述第二引脚3的端部与相邻的第二引脚3之间形成第一空置区33。其中，当第一引脚2为最外侧的引脚时，所述第一引脚2的端部与相邻的一个第二引脚3之间的区域为第一空置区33；当第一引脚2为内侧的引脚时，所述第一引脚2的端部与相邻的两个第二引脚3之间包围的区域为第一空置区33。其中，所述间隙12与所述第 一空置区33沿Y轴方向排列。所述第三引脚4设于所述第一空置区33，且与第一引脚2、第二引脚3相间隔。所述第三引脚4在X轴方向的正投影与所述第一引脚2在X轴方向的正投影不重合。
请参阅图2，所述引脚结构10还包括多条第一引线23。所述第一引线23的一端电连接所述第一引脚2。所述第一引脚2的另一端从所述第一引脚2靠近所述第二引脚3的一端伸出并穿过所述第一空置区33，以连接至信号传输线。本实施例中，相邻的两个第二引脚3之间具有一个第三引脚4。其中，该第三引脚4位于第一引线23左边(以图2为参考)。
具体的，请参阅图2，所述第三引脚4的结构与所述第一引脚2的结构相同，以使第三引脚4与第一引脚2的阻抗相同，进而第三引脚4与第一引脚2对信号的影响相同。
请参阅图2，所述第三引脚4的第二插入部41位于所述第一空置区33内，换而言之，所述第二插入部41位于所述第一伸出部32与所述第一引线23之间。第二插入部41与第一伸出部32和第一引线23相间隔设置。本实施例对于第二插入部41的长度不做限定，只需第二插入部41靠近所述第一引脚2的端部但与第一引脚2的端部相绝缘即可。
可以理解的，多个第三引脚4相平行且等距排布，以使第一引脚2、第二引脚3及第三引脚4的均匀排布，进而引脚结构10的各个部分承受的压力分配均匀，减少了引脚结构10在热压过程中断裂的风险。
请参阅图3，所述第二引脚3的端部与相邻的第二伸出部42之间形成第二空置区43。所述引脚结构10还包括多个第四引脚5。所述第四引脚5包括相连接的第三插入部51和第三伸出部52。所述第三插入部51位于所述第二空置区43，且与所述第二引脚3和所述第三引脚4相间隔。所述第三伸出部52沿背离所述第二引脚3的方向伸出所述第二空置区43。
请参阅图3，由于第二引脚3的第一插入部31的长度大于第一伸出部32的长度，所以当第三引脚4靠近第一引脚2设置时，第三引脚4的第二插入部41的长度小于第二伸出部42的长度，即第三引脚4的大部分位于第一空置区33之外，而第二引脚3与第二伸出部42之间的第二空置区43的面积较大。可以理解的，第二空置区43的面积大于第一空置区33的面积，第二空置区 43空置使得引脚结构10上的空间利用率小，造成了引脚结构10上的大量的面积浪费。
通过在第三引脚4背离第一引脚2的一侧设置多个第四引脚5，其中，第四引脚5的部分设于第二空置区43内，可以有效地利用第二空置区43的空间，在一定的引脚数量下，将引脚在Y轴方向上分为四排排布，可以减小引脚结构10在X轴方向上的宽度，利于引脚结构10的小型化设计；本实施例提高了引脚结构10上的引脚的密度，使第一引脚2所在区域、第二引脚3所在区域、第三引脚4所在区域及第四引脚5所在区域之间紧密咬合，提高引脚结构10的抗弯折性能。
具体的，请参阅图3，第二引脚3的第一伸出部32远离第一插入部31的端部与相邻的第三引脚4之间形成第二空置区43。其中，当第二引脚3为最外侧的引脚时，所述第二引脚3的端部与相邻的一个第三引脚4之间包围的区域为第二空置区43；当第二引脚3为内侧的引脚时，所述第二引脚3的第一伸出部32远离第一插入部31的端部与相邻的两个第三引脚4之间包围的区域为第二空置区43。其中，所述间隙12、所述第一空置区33与所述第二空置区43沿Y轴方向排列。所述第四引脚5与所述第二引脚3沿Y轴方向排列，且与第二引脚3、第三引脚4相间隔。所述第四引脚5在X轴方向的正投影与所述第二引脚3在X轴方向的正投影不重合。
请参阅图3，所述引脚结构10还包括多条第二引线34，第二引线34的一端电连接所述第二引脚3。所述第二引线34的另一端从所述第二引脚3靠近所述第三引脚4的端部(第一伸出部32远离所述第一插入部31的一端)伸出并穿过所述第二空置区43，以连接至信号传输线。本实施例中，相邻的两个第三引脚4之间具有一个第四引脚5。其中，该第四引脚5位于第二引线34的左边且位于第一引线23的右边(以图3为参考)。
具体的，请参阅图3，所述第二伸出部42位于一对相邻的第一引线23与第二引线34之间。所述第四引脚5位于另一对相邻的第一引线23与第二引线34之间，且所述第二伸出部42与所述第四引脚5相交错设置。
具体的，所述第四引脚5的结构与所述第一引脚2的结构相同，以使第四引脚5与第一引脚2的阻抗相同，进而第四引脚5与第一引脚2对信号的影响 相同。所述第四引脚5的第三插入部51位于所述第二空置区43内。本实施例对于第三插入部51的长度不做限定，只需第三插入部51靠近所述第二引脚3的端部但与第二引脚3的端部相绝缘即可。
可以理解的，多个第四引脚5相平行且等距排布，以使第一引脚2、第二引脚3、第三引脚4及第四引脚5的均匀排布，进而引脚结构10的各个部分承受的压力分配均匀，减少了引脚结构10在热压过程中断裂的风险。
请参阅图3，所述引脚结构10还包括多条第三引线44。所述第三引线44的一端连接所述第三引脚4。所述第三引线44的另一端从所述第二伸出部42远离所述第二插入部41的一端伸出，并穿过相邻的第一引线23与第二引线34之间的间隙12。
请参阅图3，所述引脚结构10还包括多条第四引线54。所述第四引线54的一端连接所述第四引脚5。所述第四引线54的另一端从所述第三伸出部52远离所述第三插入部51的一端伸出，并穿过另一对相邻的第一引线23与第二引线34之间的间隙12。
从另一角度上描述，将第一引脚2和第二引脚3作为第一排在Y轴方向上拉开距离的引脚，以使第一排引脚的一端呈齿状；将第三引脚4和第四引脚5作为第二排在Y轴方向上拉开距离的引脚，以使第二排的一端也呈齿状。其中，第一排的齿状和第二排的齿状相互咬合，以使第一排的引脚和第二排的引脚之间没有间隙12，进而提高了引脚结构10上的引脚的密度，提高引脚结构10在热压过程中的抗弯折性能，提高了引脚结构10的良率。
请参阅图4及图5，本申请还提供了一种柔性面板100。所述柔性面板100可以为柔性显示面板。柔性面板100包括引脚结构10和键合结构20。引脚结构10包括基板1、多个第一引脚2、多个第二引脚3。多个第一引脚2设于所述基板1上，且相邻的两个第一引脚2之间形成间隙12。多个第二引脚3设于所述基板1上，至少一个所述第二引脚3位于相邻的两个第一引脚2之间。所述第二引脚3包括相连接的第一插入部31和第一伸出部32。所述第一插入部31位于所述间隙12。所述第一伸出部32伸出所述间隙12。所述键合结构20包括电路载体21、多个第一键合脚6及多个第二键合脚7。所述电路载体21的至少部分与所述基板1相对。多个第一键合脚6设于所述电路载体21上。 每个所述第一键合脚6与一个所述第一引脚2相叠加且电连接。多个第二键合脚7设于所述电路载体21上。每个所述第二键合脚7与一个所述第二引脚3相叠加且电连接，且所述第二键合脚7与第一键合脚6相间隔设置。
在电连接引脚结构10与键合结构20的过程中，采用异方性导电胶薄膜(Anisotropic Conductive Film，ACF)来进行第一引脚2和第一键合脚6之间、第二引脚2和第二键合脚7之间的互连。具体地，将第一引脚2和第一键合脚6之间设置异方性导电胶薄膜，然后通过热压方式实现第一引脚2和第一键合脚6的绑定贴合，进而实现第一引脚2与第一键合脚6之间的信号导通。
通过设置柔性面板100上的引脚结构10为第一引脚2与第二引脚3相互穿插，及第一键合脚6与第二键合脚7相互穿插，且第一引脚2与第一键合脚6一一对应，第二引脚3与第二键合脚7一一对应，以使引脚结构10与键合结构20在压合的过程中，引脚之间或键合脚之间不会因间隙12而产生裂纹，提高引脚结构10与键合结构20电连接的成功率，在柔性面板100在弯折的过程中，引脚与引脚之间不易因为间隙12而发生断裂，提高了柔性面板100的抗弯折能力。
可以理解的，所述引脚结构10为上述任意一种实施方式所述的引脚结构10，在此不再赘述。
可以理解的，键合结构20的电路载体21可以是柔性电路板或覆晶薄膜。所述键合结构20上的键合脚的布局与引脚结构10上的引脚的布局相同，以使一个键合脚与一个引脚对应，所以键合结构20上的键合脚的布局在此不再赘述。
请参阅图6，所述第一引脚2的端部与相邻的第一伸出部32之间形成第一空置区33。所述柔性面板100还包括设于所述基板1上的多个第三引脚4及设于所述电路载体21上的多个第三键合脚8。所述第三引脚4包括相连接的第二插入部41和第二伸出部42。所述第二插入部41位于所述第一空置区33，且与所述第一引脚2和所述第二引脚3相间隔。所述第二伸出部42沿背离所述第一引脚2的方向伸出所述第一空置区33。每个所述第三键合脚8与一个所述第三引脚4相叠加且电连接，且所述第三键合脚8与所述第二键合脚7、所述第一键合脚6相间隔设置。
可以理解的，通过将第一引脚2与第二引脚3相互穿插设置，及第二引脚3与第三引脚4相互穿插设置，增加了引脚结构10上的引脚的密度，使第一引脚2所在区域、第二引脚3所在区域及第三引脚4所在区域之间紧密咬合，相应地，键合结构20上的键合脚的密度也较大，使第一键合脚6所在区域、第二键合脚7所在区域及第三键合脚8所在区域之间紧密咬合，在引脚结构10与键合结构20在热压过程中，基板1与电路载体21之间的引脚和键合脚的密度较大，能够承受较大的热压力而不易产生裂纹，还可以提高柔性面板100的抗弯曲性能。
此外，第三引脚4的部分位于第一引脚2和第二引脚3形成的第一空置区33内，减小了第一引脚2、第二引脚3及第三引脚4在所述基板1的Y轴方向上占据的空间，相应地，减小了键合结构20上的键合脚在所述基板1的Y轴方向上占据的空间，利于引脚结构10和键合结构20的小型化设计。
请参阅图7，所述第二引脚3的端部与相邻的第二伸出部42之间形成第二空置区43。所述柔性面板100还包括设于所述基板1上的多个第四引脚5及设于所述电路载体21上的多个第四键合脚9。所述第四引脚5包括相连接的第三插入部51和第三伸出部52。所述第三插入部51位于所述第二空置区43，且与所述第二引脚3和所述第三引脚4相间隔。所述第三伸出部52沿背离所述第二引脚3的方向伸出所述第二空置区43。每个所述第四键合脚9与一个所述第四引脚5相叠加且电连接，且所述第四键合脚9与所述第二键合脚7、所述第一键合脚6、所述第三键合脚8相间隔设置。
通过在第三引脚4背离第一引脚2的一侧设置多个第四引脚5，其中，第四引脚5设于第二空置区43内，可以有效地利用第二空置区43的空间，在一定的引脚数量下，将引脚在Y轴方向上分为四排排布，可以减小引脚结构10在X轴方向上的宽度，利于引脚结构10的小型化设计；相应地，本实施例还提高了键合结构20上键合脚的密度，利于键合结构20的小型化，避免引脚结构10和键合结构20在热压过程中出现裂纹，及提高引脚结构10和键合结构20的抗弯折性能。
可以理解的，键合脚仅仅与其对应的引脚电连接，而与其他的引脚相绝缘。
通过设置所述键合脚的长度和宽度分别稍大于所述引脚的长度和宽度，以 使键合脚能够在对准有一定的偏差的情况下仍然能够覆盖引脚，以与引脚良好导通。
请参阅图7，由于第一键合脚6和第二键合脚7沿Y方向排列，所以所述第一键合脚6超出所述第一引脚2的部分位于第一引脚2远离所述第二引脚3的一端，所述第二键合脚7超出所述第二引脚3的部分位于第二引脚3的插入部远离伸出部的一端，所述第三键合脚8超出所述第三引脚4的部分位于第三引脚4远离所述第二引脚3的一端，所述第四键合脚9超出所述第四引脚5的部分位于第四引脚5远离第三引脚4的一端，以使第一引脚2和第三引脚4之间的间距较小，第二引脚3和第四引脚5之间的间距较小，且第一键合脚6不会电连接于第三引脚4和第三键合脚8，及第二键合脚7不会电连接于第四引脚5和第四键合脚9。
请参阅图7，所述柔性面板100还包括多条第一引线23。所述第一引线23的一端连接所述第一引脚2。所述第一引脚2的另一端从所述第一引脚2的一端伸出并穿过所述第一空置区33。第一引线23用于电连接基板1上的电子元件，以使电子元件通过第一引脚2与第一键合脚6电连接来实现信号传输。当引脚结构10与键合结构20相压合时，所述第一引线23从所述第一键合脚6的一端伸出并穿过所述第二键合脚7与所述第三键合脚8之间的间隙及所述第三键合脚8与所述第四键合脚9之间的间隙，以合理利用第三键合脚8与所述第四键合脚9之间的间隙，使第一引线23与所述第三键合脚8与所述第四键合脚9绝缘。
请参阅图7，所述柔性面板100还包括多条第二引线34。所述第二引线34的一端连接所述第二引脚3。所述第二引线34的另一端从所述第一伸出部32远离所述第一插入部31的一端伸出并穿过所述第二空置区43。第二引线34用于电连接基板1上的电子元件，以使电子元件通过第二引脚3与第二键合脚7电连接来实现信号传输。当引脚结构10与键合结构20相压合时，所述第二引线34从所述第二键合脚7伸出并穿过所述第三键合脚8与所述第四键合脚9之间的间隙，以合理利用第三键合脚8与所述第四键合脚9之间的间隙，使第二引线34与所述第三键合脚8与所述第四键合脚9绝缘。
请参阅图7，所述柔性面板100还包括多条第三引线44。所述第三引线 44的一端连接所述第三引脚4。第三引线44用于电连接基板1上的电子元件，以使电子元件通过第三引脚4与第三键合脚8电连接来实现信号传输。当引脚结构10与键合结构20相压合时，所述第三引线44的另一端从所述第二伸出部42远离所述第二插入部41的一端和所述第三键合脚8的一端伸出，并穿过一对相邻的第一引线23与第二引线34之间的间隙。
请参阅图7，所述柔性面板100还包括多条第四引线54。第四引线54的一端连接所述第四引脚5。第四引线54用于电连接基板1上的电子元件，以使电子元件通过第四引脚5与第四键合脚9电连接来实现信号传输。当引脚结构10与键合结构20相压合时，所述第四引线54的另一端从所述第三伸出部52远离所述第三插入部51的一端和所述第四键合脚9的一端伸出，并穿过另一对相邻的第一引线23与第二引线34之间的间隙。
本申请提供的一种柔性面板100，通过设置柔性面板100上的引脚结构10为第一引脚2与第二引脚3相互穿插，第三引脚4穿插与第二引脚3之间的间隙12中，第四引脚5穿插于第三引脚4之间的间隙12中，提高了引脚结构10的引脚的密度，提高了基板1上的空间利用率，相应地，键合结构20上的键合脚与引脚结构10上的引脚一一对应且电连接，实现了引脚结构10与键合结构20之间的信号传输，且由于键合结构20的键合脚的密度较大，引脚结构10上的引脚密度较大，以使引脚结构10与键合结构20在热压过程中不易产生裂纹，还可以提高引脚结构10与键合结构20的抗弯折性能。
以上对本申请实施方式进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施方式的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的一般技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (17)

  1. 一种引脚结构，其特征在于，包括：
    基板；
    多个第一引脚，设于所述基板上，且相邻的两个第一引脚之间形成间隙；及
    多个第二引脚，设于所述基板上，至少一个所述第二引脚位于相邻的两个第一引脚之间，所述第二引脚包括相连接的第一插入部和第一伸出部，所述第一插入部位于所述间隙，所述第一伸出部伸出所述间隙。
  2. 如权利要求1所述的引脚结构，其特征在于，所述第一引脚的端部与相邻的第一伸出部之间形成第一空置区，所述引脚结构还包括多个第三引脚，所述第三引脚包括相连接的第二插入部和第二伸出部，所述第二插入部位于所述第一空置区，且与所述第一引脚和所述第二引脚相间隔，所述第二伸出部沿背离所述第一引脚的方向伸出所述第一空置区。
  3. 如权利要求2所述的引脚结构，其特征在于，所述第二引脚的端部与相邻的第二伸出部之间形成第二空置区，所述引脚结构还包括多个第四引脚，所述第四引脚包括相连接的第三插入部和第三伸出部，所述第三插入部位于所述第二空置区，且与所述第二引脚和所述第三引脚相间隔，所述第三伸出部沿背离所述第二引脚的方向伸出所述第二空置区。
  4. 如权利要求3所述的引脚结构，其特征在于，所述引脚结构还包括多条第一引线，所述第一引线的一端连接所述第一引脚，所述第一引脚的另一端从所述第一引脚的一端伸出并穿过所述第一空置区。
  5. 如权利要求4所述的引脚结构，其特征在于，所述第二插入部位于所述第一伸出部与所述第一引线之间。
  6. 如权利要求4所述的引脚结构，其特征在于，所述引脚结构还包括多条 第二引线，所述第二引线的一端连接所述第二引脚，所述第二引线的另一端从所述第一伸出部远离所述第一插入部的一端伸出并穿过所述第二空置区。
  7. 如权利要求6所述的引脚结构，其特征在于，所述第二伸出部位于一对相邻的第一引线与第二引线之间，所述第四引脚位于另一对相邻的第一引线与第二引线之间，且所述第二伸出部与所述第四引脚相交错设置。
  8. 如权利要求6所述的引脚结构，其特征在于，所述引脚结构还包括多条第三引线，所述第三引线的一端连接所述第三引脚，所述第三引线的另一端从所述第二伸出部远离所述第二插入部的一端伸出，并穿过一对相邻的第一引线与第二引线之间的间隙。
  9. 如权利要求8所述的引脚结构，其特征在于，所述引脚结构还包括多条第四引线，所述第四引线的一端连接所述第四引脚，所述第四引线的另一端从所述第三伸出部远离所述第三插入部的一端伸出，并穿过另一对相邻的第一引线与第二引线之间的间隙。
  10. 一种柔性面板，其特征在于，包括：
    基板；
    多个第一引脚，设于所述基板上，且相邻的两个第一引脚之间形成间隙；
    多个第二引脚，设于所述基板上，至少一个所述第二引脚位于相邻的两个第一引脚之间，所述第二引脚包括相连接的第一插入部和第一伸出部，所述第一插入部位于所述间隙，所述第一伸出部伸出所述间隙；
    电路载体，至少部分与所述基板相对；
    多个第一键合脚，设于所述电路载体上，每个所述第一键合脚与一个所述第一引脚相叠加且电连接；及
    多个第二键合脚，设于所述电路载体上，每个所述第二键合脚与一个所述第二引脚相叠加且电连接，且所述第二键合脚与所述第一键合脚相间隔设置。
  11. 如权利要求10所述的柔性面板，其特征在于，所述第一引脚的端部与相邻的第一伸出部之间形成第一空置区，所述柔性面板还包括设于所述基板上的多个第三引脚及设于所述电路载体上的多个第三键合脚，所述第三引脚包括相连接的第二插入部和第二伸出部，所述第二插入部位于所述第一空置区，且与所述第一引脚和所述第二引脚相间隔，所述第二伸出部沿背离所述第一引脚的方向伸出所述第一空置区；每个所述第三键合脚与一个所述第三引脚相叠加且电连接，且所述第三键合脚与所述第二键合脚、所述第一键合脚相间隔设置。
  12. 如权利要求11所述的柔性面板，其特征在于，所述第二引脚的端部与相邻的第二伸出部之间形成第二空置区，所述柔性面板还包括设于所述基板上的多个第四引脚及设于所述电路载体上的多个第四键合脚，所述第四引脚包括相连接的第三插入部和第三伸出部，所述第三插入部位于所述第二空置区，且与所述第二引脚和所述第三引脚相间隔，所述第三伸出部沿背离所述第二引脚的方向伸出所述第二空置区；每个所述第四键合脚与一个所述第四引脚相叠加且电连接，且所述第四键合脚与所述第二键合脚、所述第一键合脚、所述第三键合脚相间隔设置。
  13. 如权利要求12所述的柔性面板，其特征在于，所述第一键合脚在所述基板上的正投影覆盖所述第一引脚，及所述第二键合脚在所述基板上的正投影覆盖所述第二引脚，所述第三键合脚在所述基板上的正投影覆盖所述第三引脚，所述第四键合脚在所述基板上的正投影覆盖所述第四引脚。
  14. 如权利要求13所述的柔性面板，其特征在于，所述柔性面板还包括多条第一引线，所述第一引线的一端连接所述第一引脚，所述第一引脚的另一端从所述第一引脚的一端伸出并穿过所述第一空置区；所述第一引线从所述第一键合脚的一端伸出并穿过所述第二键合脚与所述第三键合脚之间的间隙及所述第三键合脚与所述第四键合脚之间的间隙。
  15. 如权利要求14所述的柔性面板，其特征在于，所述柔性面板还包括多条第二引线，所述第二引线的一端连接所述第二引脚，所述第二引线的另一 端从所述第一伸出部远离所述第一插入部的一端伸出并穿过所述第二空置区；所述第二引线从所述第二键合脚伸出并穿过所述第三键合脚与所述第四键合脚之间的间隙。
  16. 如权利要求15所述的柔性面板，其特征在于，所述柔性面板还包括多条第三引线，所述第三引线的一端连接所述第三引脚，所述第三引线的另一端从所述第二伸出部远离所述第二插入部的一端和所述第三键合脚的一端伸出，并穿过一对相邻的第一引线与第二引线之间的间隙。
  17. 如权利要求15所述的柔性面板，其特征在于，所述柔性面板还包括多条第四引线，所述第四引线的一端连接所述第四引脚，所述第四引线的另一端从所述第三伸出部远离所述第三插入部的一端和所述第四键合脚的一端伸出，并穿过另一对相邻的第一引线与第二引线之间的间隙。
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