WO2022030447A1 - 含フッ素ジアミンまたはその塩、含フッ素ジアミンまたはその塩の製造方法、ポリアミド、ポリアミドの製造方法、ポリアミド溶液、ポリアミド環化体、ポリアミド環化体の製造方法、高周波電子部品用絶縁材、高周波電子部品用絶縁材の製造方法、高周波電子部品、高周波機器および高周波電子部品製造用絶縁材料 - Google Patents
含フッ素ジアミンまたはその塩、含フッ素ジアミンまたはその塩の製造方法、ポリアミド、ポリアミドの製造方法、ポリアミド溶液、ポリアミド環化体、ポリアミド環化体の製造方法、高周波電子部品用絶縁材、高周波電子部品用絶縁材の製造方法、高周波電子部品、高周波機器および高周波電子部品製造用絶縁材料 Download PDFInfo
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- 0 CC(*C(Nc1ccc(C(C(F)(F)F)c(cc2)cc(C(C(F)(F)F)(C(F)(F)F)O)c2NC)cc1C(C(F)(F)F)(C(F)(F)F)O)=O)=O Chemical compound CC(*C(Nc1ccc(C(C(F)(F)F)c(cc2)cc(C(C(F)(F)F)(C(F)(F)F)O)c2NC)cc1C(C(F)(F)F)(C(F)(F)F)O)=O)=O 0.000 description 3
- RNVCVTLRINQCPJ-UHFFFAOYSA-N Cc(cccc1)c1N Chemical compound Cc(cccc1)c1N RNVCVTLRINQCPJ-UHFFFAOYSA-N 0.000 description 1
- VVAKEQGKZNKUSU-UHFFFAOYSA-N Cc1c(C)c(N)ccc1 Chemical compound Cc1c(C)c(N)ccc1 VVAKEQGKZNKUSU-UHFFFAOYSA-N 0.000 description 1
- JJYPMNFTHPTTDI-UHFFFAOYSA-N Cc1cc(N)ccc1 Chemical compound Cc1cc(N)ccc1 JJYPMNFTHPTTDI-UHFFFAOYSA-N 0.000 description 1
- KQYOLADFSOLEKG-UHFFFAOYSA-N Nc1ccc(C(C(F)(F)F)c(cc2)cc(C(C(F)(F)F)(C(F)(F)F)O)c2N)cc1C(C(F)(F)F)(C(F)(F)F)O Chemical compound Nc1ccc(C(C(F)(F)F)c(cc2)cc(C(C(F)(F)F)(C(F)(F)F)O)c2N)cc1C(C(F)(F)F)(C(F)(F)F)O KQYOLADFSOLEKG-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
- C08G69/32—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from aromatic diamines and aromatic dicarboxylic acids with both amino and carboxylic groups aromatically bound
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C215/00—Compounds containing amino and hydroxy groups bound to the same carbon skeleton
- C07C215/68—Compounds containing amino and hydroxy groups bound to the same carbon skeleton having amino groups bound to carbon atoms of six-membered aromatic rings and hydroxy groups bound to acyclic carbon atoms or to carbon atoms of rings other than six-membered aromatic rings of the same carbon skeleton
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C213/00—Preparation of compounds containing amino and hydroxy, amino and etherified hydroxy or amino and esterified hydroxy groups bound to the same carbon skeleton
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/42—Polyamides containing atoms other than carbon, hydrogen, oxygen, and nitrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D177/00—Coating compositions based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Coating compositions based on derivatives of such polymers
- C09D177/06—Polyamides derived from polyamines and polycarboxylic acids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/305—Polyamides or polyesteramides
Definitions
- the present invention relates to a fluorine-containing diamine or a salt thereof, a method for producing a fluorine-containing diamine or a salt thereof, a polyamide, a method for producing a polyamide, a polyamide solution, a polyamide cyclized body, a method for producing a polyamide cyclized body, and an insulating material for high-frequency electronic components.
- the present invention relates to a method for manufacturing an insulating material for high-frequency electronic components, a high-frequency electronic component, a high-frequency device, and an insulating material for manufacturing high-frequency electronic components.
- Fluorine-containing polymers may exhibit better dielectric properties than fluorine-free polymers due to the electronic specificity of fluorine atoms. Therefore, for example, the use of a fluorine-containing polymer as a material for manufacturing high-frequency electronic components may be attempted.
- Patent Document 1 describes a fluorine-containing polyimide film having a dielectric loss tangent of 0.007 or less, a water absorption of 0.8% or less, and a linear expansion coefficient of 30 ppm / ° C. or less at 50 to 200 ° C. According to the description of Patent Document 1, this fluorine-containing polyimide film has characteristics such as low dielectric constant and low water absorption (and thus low permeability of water vapor and gas), and is particularly suitable for a high-frequency compatible substrate. Applies.
- fluorine-containing polymer various polymers such as the polyamide described in Patent Document 1 are known.
- a new fluorine-containing polymer is potentially required from the viewpoint of improving the degree of freedom in material selection and good performance (for example, good heat resistance and dielectric properties).
- the present invention was made in view of such circumstances.
- One of the objects of the present invention is to provide a novel fluorine-containing polymer that is preferably applicable to the production of high-frequency electronic components, for example.
- a fluorine-containing diamine represented by the following general formula [1A] or a salt thereof is provided.
- R 1 is at least one selected from the group consisting of an alkyl group, an alkoxy group, a halogen atom, a haloalkyl group and a haloalkoxy group independently when there are a plurality of them.
- the two ns are independently integers of 0 to 3.
- a polyamide having a structural unit represented by the following general formula [1B] is provided.
- R 1 is at least one selected from the group consisting of an alkyl group, an alkoxy group, a halogen atom, a haloalkyl group and a haloalkoxy group independently when there are a plurality of them.
- R 2 is a divalent organic group and The two ns are independently integers of 0 to 3.
- a polyamide solution containing the above-mentioned polyamide and an organic solvent is provided.
- a polyamide cyclized body having a structural unit represented by the following general formula [1C].
- R 1 is at least one selected from the group consisting of an alkyl group, an alkoxy group, a halogen atom, a haloalkyl group and a haloalkoxy group independently when there are a plurality of them.
- R 2 is a divalent organic group and The two ns are independently integers of 0 to 3.
- an insulating material for high-frequency electronic components including the above-mentioned polyamide cyclized material is provided.
- a high frequency electronic component provided with the above-mentioned insulating material for a high frequency electronic component is provided.
- a high frequency device including the above high frequency electronic component is provided.
- an insulating material for manufacturing high-frequency electronic components containing the above-mentioned polyamide is provided.
- the above-mentioned manufacturing method for producing a polyamide comprises a fluorine-containing diamine represented by the following general formula [1A] or a salt thereof, and the following general formula [DC1] or Provided is a production method including a step of polycondensing a dicarboxylic acid or a dicarboxylic acid derivative represented by [DC2].
- R 1 is at least one selected from the group consisting of an alkyl group, an alkoxy group, a halogen atom, a haloalkyl group and a haloalkoxy group independently when there are a plurality of them.
- the two ns are independently integers of 0 to 3.
- R2 is synonymous with R2 in the general formula [1B], and the two As are independently hydrogen atoms, alkyl groups having 1 to 10 carbon atoms, or 6 to 6 carbon atoms. Represents 10 aromatic hydrocarbon groups.
- R2 is synonymous with R2 in the general formula [1B], and the two Xs independently represent a fluorine atom, a chlorine atom, a bromine atom, an iodine atom or an active ester group.
- a manufacturing method for manufacturing the above-mentioned polyamide cyclized product The first step of producing a polyamide by the above-mentioned manufacturing method for producing a polyamide, and The second step of dehydrating and ring-closing the polyamide obtained in the first step, and A manufacturing method including the above is provided.
- the coating step of applying the above-mentioned polyamide solution to the supporting substrate and the coating step A drying step of obtaining a resin film containing polyamide by drying the solvent contained in the applied polyamide solution, and A heating step of heat-treating the resin film to form a cured film, A method for manufacturing an insulating material for high frequency electronic components including the above is provided.
- a novel fluorine-containing polymer that can be preferably applied to, for example, the production of high-frequency electronic components is provided.
- the notation "XY” in the description of the numerical range indicates X or more and Y or less unless otherwise specified.
- “1 to 5% by mass” means “1% by mass or more and 5% by mass or less”.
- the notation that does not indicate whether it is substituted or unsubstituted includes both those having no substituent and those having a substituent.
- the "alkyl group” includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
- organic group as used herein means an atomic group obtained by removing one or more hydrogen atoms from an organic compound.
- the "monovalent organic group” represents an atomic group obtained by removing one hydrogen atom from an arbitrary organic compound.
- the notation “Me” represents a methyl group (CH 3 ).
- fluoral means trifluoroacetaldehyde.
- high frequency means, for example, a region having a frequency of 1 GHz or higher, preferably a frequency of 10 to 200 GHz, and more preferably a frequency of 28 to 100 GHz.
- the fluorine-containing diamine of the present embodiment is represented by the following general formula [1A].
- the salt of the fluorine-containing diamine of the present embodiment is a salt obtained by neutralizing the amino group portion of the fluorine-containing diamine represented by the following general formula [1A] and the acid to form a salt.
- -C (CF 3 ) 2 The OH moiety and the base are neutralized to form a salt.
- the former is preferable as the salt, and examples of such a salt include hydrochloride, sulfate, nitrate and the like.
- R 1 is at least one selected from the group consisting of an alkyl group, an alkoxy group, a halogen atom, a haloalkyl group and a haloalkoxy group independently when there are a plurality of them.
- the two ns are independently integers of 0 to 3.
- a fluorine-containing polyamide resin can be produced by polycondensing a fluorine-containing diamine or a salt thereof of the present embodiment with, for example, a dicarboxylic acid or a derivative thereof.
- a polyamide cyclized product can be derived from the fluorine-containing polyamide resin. This polyamide cyclized body tends to have good dielectric properties and heat resistance. Details of the polyamide resin and the polyamide cyclized body will be described later.
- the alkyl group of R 1 may be linear or branched. Specific examples of the alkyl group include a linear or branched alkyl group having 1 to 6 carbon atoms. Of these, n-butyl group, s-butyl group, isobutyl group, t-butyl group, n-propyl group, i-propyl group, ethyl group and methyl group are preferable, and ethyl group and methyl group are more preferable.
- the alkoxy group of R 1 may be linear or branched. Specific examples of the alkoxy group include a linear or branched alkoxy group having 1 to 6 carbon atoms.
- n-butoxy group, s-butoxy group, isobutoxy group, t-butoxy group, n-propoxy group, i-propoxy group, ethoxy group and methoxy group are preferable, and ethoxy group and methoxy group are particularly preferable.
- the halogen atom of R 1 include a fluorine atom, a chlorine atom, a bromine atom, an iodine atom and the like, and a fluorine atom is preferable.
- haloalkyl group and the haloalkoxy group of R 1 include those in which a part or all of the hydrogen atom of the above-mentioned alkyl group or alkoxy group is replaced with a halogen atom (preferably a fluorine atom).
- n is preferably an integer of 0 to 2, and more preferably an integer of 0 to 1.
- fluorine-containing diamines represented by the general formula [1A] or salts thereof the following general formulas [1A-1], [1A-2] or [1A-3] are expressed because of the cost of raw materials and the ease of synthesis. Fluorine-containing diamines or salts thereof are preferably used.
- the two Rs are independently alkyl groups having 1 to 6 carbon atoms.
- the two Rs are independently alkyl groups having 1 to 6 carbon atoms.
- each of the four Rs is an alkyl group having 1 to 6 carbon atoms independently.
- the fluorine-containing diamines represented by the following formulas [1A-4] to [1A-7] or salts thereof are particularly high in purity and high by the above-mentioned method. Can be produced in yield.
- the compound name of the diamine represented by the formula [1A-4] is 1,1,1-trifluoro-2,2-bis (3- (1-hydroxy-1-trifluoromethyl-2,2,2-). Trifluoroethyl) -4-aminophenyl) ethane.
- the compound name of the diamine represented by the formula [1A-5] is 1,1,1-trifluoro-2,2-bis (3- (1-hydroxy-1-trifluoromethyl-2,2,2-).
- Trifluoroethyl) -5-methyl-4-aminophenyl) ethane The compound name of the diamine represented by the formula [1A-6] is 1,1,1-trifluoro-2,2-bis (3- (1-hydroxy-1-trifluoromethyl-2,2,2-). Trifluoroethyl) -6-methyl-4-aminophenyl) ethane.
- the compound name of the diamine represented by the formula [1A-7] is 1,1,1-trifluoro-2,2-bis (3- (1-hydroxy-1-trifluoromethyl-2,2,2-). Trifluoroethyl) -5,6-dimethyl-4-aminophenyl) ethane.
- the fluorine-containing diamine represented by the general formula [1A] or a salt thereof is hexafluoroacetone (hereinafter referred to as “HFA”) with respect to the aromatic diamine compound represented by the general formula [2] as shown in the following reaction formula. ”) Or its equivalent can be added.
- HFA hexafluoroacetone
- R1 and n are the same as those in the general formula [1A].
- the aromatic diamine compound represented by the general formula [2] is obtained by reacting a mixture of fluoral / hydrogen fluoride with an amine compound represented by the general formula [3] as shown in the following reaction formula. be able to.
- the definitions of R1 and n are the same as those of the general formula [1A].
- fluoral, hydrates of commercial products (manufactured by Tokyo Chemical Industry Co., Ltd.) and hemiacetals of fluoral can be used as equivalents thereof.
- a fluoral hydrate or a fluoral hemiacetal can be prepared and used by the method described in JP-A-5-97757.
- anhydrous fluoral can be prepared by dehydrating the hydrate or hemiacetal form of fluoral.
- 1,2,2,2-tetrafluoroethanol forms an equilibrium state between fluoral and hydrogen fluoride, and further, the excessive presence of hydrogen fluoride in the system causes the equilibrium state. It is presumed that it is maintained, and as a result, the decomposition of fluoride is suppressed. It has been confirmed that fluoral in hydrogen fluoride not only improves the stability of the compound but also increases the boiling point, and fluoral, which is a low boiling point compound, can be easily handled even near room temperature as an adduct of hydrogen fluoride.
- the amount of hydrogen fluoride added is usually 0.1 to 100 mol, preferably 1 to 75 mol, more preferably 1 to 75 mol, relative to 1 mol of the prepared fluoral. It is preferably 2 to 50 mol.
- the amount of hydrogen fluoride added is 0.1 mol or more, it is easy to obtain a sufficient stabilizing effect. Further, from the viewpoint of productivity and economy, the amount of hydrogen fluoride added is preferably 100 mol or less.
- the fluoral / hydrogen fluoride mixture may contain an excess of hydrogen fluoride. Although the presence of excess hydrogen fluoride may seem unfavorable, hydrogen fluoride itself may act as an acid catalyst or dehydrating agent to promote the desired reaction. In other words, it can be said that there is an advantage in treating Fluoral as a mixture of hydrogen fluoride.
- the amount of the amine compound represented by the general formula [3] may be 1 mol or more with respect to 1 mol of fluoral, and it is usually preferable to use 2 to 10 mol because the reaction proceeds smoothly. Considering the treatment operation, 2 to 5 mol is particularly preferable.
- the step of obtaining the aromatic diamine compound represented by the general formula [2] can be performed in the presence of a reaction solvent.
- the reaction solvent include aliphatic hydrocarbons, aromatic hydrocarbons, halogenated hydrocarbons, ethers, esters, amides, nitriles, sulfoxides and the like.
- n-hexane cyclohexane, n-heptane, benzene, toluene, ethylbenzene, xylene, mesitylene, methylene chloride, chloroform, 1,2-dichloroethane, diethyl ether, tetrahydrofuran, diisopropyl ether, tert-butylmethyl ether, Ethyl acetate, n-butyl acetate, N, N-dimethylformamide, N, N-dimethylacetamide, N-methylpyrrolidone, 1,3-dimethyl-2-imidazolidinone, acetonitrile, propionitrile, dimethyl sulfoxide and the like.
- reaction solvents can be used alone or in combination.
- the reaction may be carried out without using a solvent. It is preferable to carry out the reaction without a solvent from the viewpoint that the purification operation after the reaction becomes simple and the high-purity target product can be obtained only by a simple purification operation.
- Lewis acids include boron (III: oxidation number; hereinafter the same herein), tin (II), tin (IV), titanium (IV), zinc (II), aluminum (III), and antimony (II). It is a metal halide containing at least one metal selected from the group consisting of III) and antimony (V). As the metal halide used, a metal halide having the maximum possible valence is usually preferable.
- boron trifluoride (III), aluminum trichloride (III), zinc dichloride (II), titanium tetrachloride (IV), tin tetrachloride (IV), and antimony trichloride (V) are particularly important. preferable.
- the amount of Lewis acid used is, for example, 0.001 mol or more, specifically 0.01 to 2.0 mol, with respect to 1 mol of Fluoral.
- Bronsted acids are inorganic or organic acids. Specific examples of the inorganic acid include phosphoric acid, hydrogen chloride, hydrogen bromide, concentrated nitric acid, concentrated sulfuric acid, fuming nitric acid, fuming sulfuric acid, and phosphoric acid.
- organic acid examples include formic acid, acetic acid, oxalic acid, benzoic acid, methanesulfonic acid, benzenesulfonic acid, paratoluenesulfonic acid, trifluoromethanesulfonic acid and the like.
- the amount of Bronsted acid used is, for example, 0.001 mol or more, specifically 0.01 to 2.0 mol, with respect to 1 mol of Fluoral.
- the temperature conditions are, for example, ⁇ 20 to + 200 ° C., preferably ⁇ 10 to + 180 ° C., and more preferably 0 to + 160 ° C.
- the pressure conditions are, for example, from atmospheric pressure to 4.0 MPa (absolute pressure, hereinafter the same), preferably from atmospheric pressure to 2.0 MPa, and more preferably from atmospheric pressure to 1.5 MPa.
- the reaction vessels used in this step include metal containers such as stainless steel, Monel (trademark), Hastelloy (trademark), and nickel, tetrafluoroethylene resin, chlorotrifluoroethylene resin, vinylidene fluoride resin, and PFA resin.
- a reactor capable of sufficiently reacting under normal pressure or pressure such as a propylene resin or a polyethylene resin lined inside, can be used.
- the reaction time will vary depending on the combination of the fluoral / hydrogen fluoride mixture and the aryl compound, and the difference in reaction conditions due to the amount of the additives Lewis acid and Bronsted acid used.
- the reaction time is usually within 24 hours. It is preferable to track the progress of the reaction by analytical means such as gas chromatography, thin layer chromatography, liquid chromatography, nuclear magnetic resonance, etc., and set the end point of the reaction at the time when the starting substrate has almost disappeared.
- the post-reaction post-treatment is a normal purification operation on the reaction termination solution, eg, the reaction termination solution is water or an alkali metal inorganic base (eg, sodium hydroxide, potassium hydroxide, sodium hydrogencarbonate, potassium hydrogencarbonate, carbonate).
- an alkali metal inorganic base eg, sodium hydroxide, potassium hydroxide, sodium hydrogencarbonate, potassium hydrogencarbonate, carbonate.
- an organic solvent for example, ethyl acetate, toluene, mesitylene, methylene chloride, etc.
- the target product can be purified to a higher chemical purity product by activated carbon treatment, distillation, recrystallization, column chromatography and the like, if necessary.
- the fluorine-containing diamine represented by the general formula [1A] or a salt thereof can be obtained by allowing HFA or an equivalent thereof to act on the aromatic diamine compound represented by the general formula [2].
- HFA or its equivalent various equivalents such as HFA trihydrate can be used in addition to the HFA gas which is a gas at normal temperature and pressure. From the viewpoint of reactivity, it is desirable to use gaseous HFA gas.
- the amount of HFA or an equivalent thereof used is typically 0.1 to 10 mol, preferably 1 to 3 mol, based on 1 mol of the aromatic diamine compound as a raw material represented by the general formula [2].
- the yield of the desired fluorine-containing diamine represented by the general formula [1A] or a salt thereof can be increased.
- HFA or its equivalent in excess it is possible to suppress the formation of by-products in which -C (CF 3 ) 2 OH groups are introduced in excess.
- Possible reaction solvents include aliphatic hydrocarbons, aromatic hydrocarbons, alcohols, halogenated alcohols, halogenated hydrocarbons, ethers, esters, amides, nitriles, sulfoxides and the like. Can be mentioned.
- fluoroalcohols such as trifluoroethanol and hexafluoroisopropanol are particularly preferable.
- These reaction solvents can be used alone or in combination.
- the amount used is 10 to 2000 parts by mass, more preferably 100 to 1000 parts by mass with respect to 100 parts by mass of the aromatic diamine compound of the raw material represented by the general formula [2].
- Lewis acids include boron (III: oxidation number; hereinafter the same herein), tin (II), tin (IV), titanium (IV), zinc (II), aluminum (III), and antimony (II). It is a metal halide containing at least one metal selected from the group consisting of III) and antimony (V). As the metal halide used, a metal halide having the maximum possible valence is usually preferable.
- boron trifluoride (III), aluminum trichloride (III), zinc dichloride (II), titanium tetrachloride (IV), tin tetrachloride (IV), and antimony trichloride (V) are Especially preferable.
- the amount of Lewis acid used is, for example, 0.001 mol or more, preferably 0.01 to 3.0 mol, based on 1 mol of the aromatic diamine compound as a raw material represented by the general formula [2].
- Bronsted acids are inorganic or organic acids.
- the inorganic acid include phosphoric acid, hydrogen chloride, hydrogen bromide, concentrated nitric acid, concentrated sulfuric acid, fuming nitric acid, fuming sulfuric acid and the like.
- the organic acid include formic acid, acetic acid, oxalic acid, benzoic acid, methanesulfonic acid, benzenesulfonic acid, paratoluenesulfonic acid, trifluoromethanesulfonic acid and the like.
- the amount of Bronsted acid used is, for example, 0.001 mol or more, preferably 0.01 to 3.0 mol, based on 1 mol of the aromatic diamine compound as a raw material represented by the general formula [2].
- the temperature conditions are usually ⁇ 20 to + 200 ° C., preferably 0 to + 180 ° C., and more preferably + 20 to + 160 ° C.
- the reaction pressure is usually from atmospheric pressure to 4.0 MPa (absolute pressure, hereinafter the same), preferably from atmospheric pressure to 3.0 MPa, and more preferably from atmospheric pressure to 1.5 MPa.
- Reaction vessels include metal containers such as stainless steel, Monel TM, Hastelloy TM, nickel, tetrafluoroethylene resin, chlorotrifluoroethylene resin, vinylidene fluoride resin, PFA resin, propylene resin, and A reactor capable of sufficiently reacting under normal pressure or pressure, such as a polyethylene resin lined inside, can be used.
- the reaction time varies depending on the difference in the reaction conditions due to the aromatic diamine compound, the amount of the reaction solvent and the acid catalyst used, and the HFA equivalent.
- the reaction time is usually within 24 hours. It is preferable to follow the progress of the reaction by analytical means such as thin layer chromatography, gas chromatography, liquid chromatography, nuclear magnetic resonance, etc., and set the time point at which the starting substrate has almost disappeared as the end point of the reaction.
- a simple substance of the fluorine-containing diamine compound represented by the general formula [1A] can be easily obtained by simply distilling off the solvent.
- the target product can be purified to a higher chemical purity product by activated carbon treatment, distillation, recrystallization, column chromatography and the like, if necessary.
- After the reaction if it is in a uniform state, it can be purified by adding a poor solvent to the solution as it is and recrystallizing it.
- the polyamide of the present embodiment has a structural unit represented by the following general formula [1B].
- R 1 is at least one selected from the group consisting of an alkyl group, an alkoxy group, a halogen atom, a haloalkyl group and a haloalkoxy group independently when there are a plurality of them.
- R 2 is a divalent organic group and The two ns are independently integers of 0 to 3.
- the polyamide of the present embodiment tends to show good film forming property. It is presumed that this is related to the structure "-CH (CF 3 )-" in the general formula [1B]. Introducing a fluorine atom into a polymer increases its solubility in the organic solvent used to form the film.
- the polyamide of the present embodiment is inferior in symmetry to the "-C (CF 3 ) 2- " structure which is generally used by those skilled in the art in terms of price and availability. It is presumed that this structure having poor symmetry loosens the packing of the polymer chain, thereby increasing the solubility in an organic solvent and improving the film forming property.
- the divalent organic group of R 2 in the general formula [1B] can include one or more of an aliphatic group, an alicyclic group, an aromatic ring group, a condensed ring group and the like. Further, the divalent organic group of R 2 may contain an atom that is neither a carbon atom nor a hydrogen atom, such as an oxygen atom, a nitrogen atom, a sulfur atom, and a halogen atom.
- the divalent organic group of R 2 may be a divalent organic group containing an aromatic ring such as a benzene ring from the viewpoint of heat resistance required for an insulating material and better dielectric properties. preferable. More specifically, the divalent organic group of R 2 can be -Ph-, -Ph-X-Ph- or the like.
- Ph is a substituted or unsubstituted phenylene group
- X is a divalent linking group other than a single-bonded or phenylene group (for example, a linear or branched alkylene group having 1 to 3 carbon atoms, an ether group, a thioether group, etc. Carbonyl group, sulfon group, carbonyloxy group, oxycarbonyl group, etc.).
- the weight average molecular weight of the polyamide of the present embodiment is not particularly limited. However, when used as, for example, an insulating material for manufacturing high-frequency electronic components or an insulating material for high-frequency electronic components, the weight average molecular weight of the polyamide is preferably 1,000 or more and 1,000,000 or less, more preferably 30,000 or more. It is less than 500,000. When the weight average molecular weight is appropriate, for example, the ease of forming a film on a substrate can be improved.
- the weight average molecular weight and the number average molecular weight can be measured by gel permeation chromatography (GPC) using polystyrene as a standard substance.
- the polyamide of the present embodiment may have a structural unit different from the structural unit represented by the general formula [1B].
- the general formula [1B] is preferably 50 to 100 mol%, more preferably 75 to 100 mol%, still more preferably 90 to 100 mol% in the total structural unit of the polyamide. It is a structural unit represented by. Virtually all structural units (100%) of the polyamide of the present embodiment may be structural units represented by the general formula [1B]. Preferred examples of the polyamide of this embodiment are shown below.
- the polyamide of this embodiment is preferably used as an insulating material for manufacturing high-frequency electronic components. The specific application will be described in detail later.
- the polyamide of the present embodiment (having a structural unit represented by the general formula [1B]) is usually applied to various uses in the form of being dissolved in an organic solvent.
- One of the applications preferably applied is for manufacturing high frequency electronic components. That is, the polyamide solution containing the polyamide and the organic solvent of this embodiment is preferably used as an insulating material for manufacturing high-frequency electronic components.
- the organic solvent is preferably at least one selected from the group consisting of an amide solvent, an ether solvent, an aromatic solvent, a halogen solvent and a lactone solvent. These solvents dissolve the polyamide of the present embodiment well. Specific examples of these solvents include the same organic solvents used for the reaction (condensation polymerization) described in the following ⁇ Method for producing polyamide>. Incidentally, when preparing the polyamide solution, it is preferable to use the same organic solvent as the organic solvent used for the reaction (condensation polymerization) from the viewpoint of simplification of the manufacturing process and the like.
- the concentration of the polyamide solution may be appropriately set according to the application and purpose. From the viewpoint of good film forming property, the concentration of the polyamide is preferably 0.1% by mass or more and 50% by mass or less, and more preferably 1% by mass or more and 30% by mass or less.
- the polyamide solution of the present embodiment may contain one or more additives in addition to the polyamide and the organic solvent.
- an additive such as a surfactant can be used for the purpose of improving coatability, leveling property, film forming property, storage stability, defoaming property and the like.
- Commercially available surfactants include Megafuck, product number F142D, F172, F173 or F183 manufactured by DIC Co., Ltd., and Florard, product number, FC-135, FC-170C, FC- manufactured by Sumitomo 3M Co., Ltd.
- FC-431 product name Surfron manufactured by AGC Seimi Chemical Co., Ltd., product number S-112, S-113, S-131, S-141 or S-145, or manufactured by Toray Dow Corning Silicone Co., Ltd., product name. , SH-28PA, SH-190, SH-193, SZ-6032 or SF-8428 (Megafuck is the trade name of fluorine-based additives (surfactants / surface modifiers) of DIC Co., Ltd., Florard. Is the trade name of the fluorine-based surfactant manufactured by Sumitomo 3M Co., Ltd.
- the polyamide solution of the present embodiment usually does not contain a photosensitive agent such as a quinonediazide compound, or even if it contains a small amount.
- the amount of the photosensitive agent in the polyamide solution of the present embodiment is, for example, 1 part by mass or less, specifically 0.1 part by mass or less, with respect to 100 parts by mass of the polyamide. If the polyamide solution of the present embodiment is used for applications that do not require patterning with light, no photosensitive agent is required. In other words, the polyamide solution of this embodiment can be non-photosensitive.
- the polyamide cyclized product of the present embodiment has a structural unit represented by the following general formula [1C].
- R 1 is at least one selected from the group consisting of an alkyl group, an alkoxy group, a halogen atom, a haloalkyl group and a haloalkoxy group independently when there are a plurality of them.
- R 2 is a divalent organic group and The two ns are independently integers of 0 to 3.
- R1 and n in the general formula [1C] are the same as those in the general formula [1A]. Therefore, a new description will be omitted.
- R 2 in the general formula [1C] is the same as that in the general formula [1B]. Therefore, a new description will be omitted.
- the relative permittivity and dielectric loss tangent of the polyamide cyclized body of this embodiment are small.
- the polyamide cyclized material of the present embodiment has a bulky non-planar cyclic skeleton containing fluorine and also contains an asymmetric "-CH (CF 3 )-" structure to form a polymer chain. It is presumed that the packing of the polymer is sparse and that the existence of the fluorine atom itself is related. Further, the polyamide cyclized product of the present embodiment tends to have high heat resistance. This is presumed to be due to the rigid annular skeleton.
- the polyamide cyclized product of the present embodiment may have a structural unit different from the structural unit represented by the general formula [1C].
- % Is a structural unit represented by the general formula [1C].
- Virtually all structural units (100%) of the polyamide cyclized product of the present embodiment may be structural units represented by the general formula [1C].
- the polyamide of the present embodiment (having a structural unit represented by the general formula [1B]) is at least a fluorine-containing diamine represented by the above-mentioned general formula [1A] or a salt (monomer) thereof, and other compounds ( It can be produced by reacting (condensation) with (monomer).
- a fluorine-containing diamine represented by the general formula [1A] or a salt thereof (monomer) is usually reacted with another compound (monomer) in an organic solvent.
- a fluorine-containing diamine represented by the general formula [1A] or a salt thereof may be used in combination with other diamine compounds.
- the diamine compound that can be used in combination include 5- (trifluoromethyl) -1,3-phenylenediamine, 2- (trifluoromethyl) -1,3-phenylenediamine, and 4- (trifluoromethyl) -1,3-.
- diamines examples include a diamine that has a -C (CF 3 ) 2 -OH group (hexafluoroisopropanol group) but does not fall under the general formula [1A]. Specifically, it is described in JP-A-2007-119503, JP-A-2007-119504, JP-A-2008-150534, JP-A-2014-125455, JP-A-2014-129340, and the like. Diamines having a C (CF 3 ) 2 -OH group can be mentioned. Of these, diamines as shown below are preferable.
- the diamine compounds used in the production of polyamide is a fluorine-containing diamine represented by the general formula [1A] or a salt thereof.
- a fluorine-containing diamine represented by the general formula [1A] or a salt thereof may be used alone, or (ii) a fluorine-containing diamine represented by the general formula [1A] or Two or more kinds of the salt may be used in combination, or (iii) one kind or two or more kinds of fluorine-containing diamine represented by the general formula [1A] or a salt thereof, and one kind or two or more kinds of general formula [ It may be used in combination with a diamine compound that does not fall under 1A].
- Preferred examples of the "other compound (monomer)" to react with the fluorine-containing diamine or a salt (monomer) thereof include a dicarboxylic acid or a derivative thereof (diester, dicarboxylic acid halide, active ester compound, etc.).
- a dicarboxylic acid or a derivative thereof preferably, a compound represented by the following general formula [DC-1] or [DC-2] can be mentioned.
- R2 is synonymous with R2 in the general formula [1B], and the two As are independently hydrogen atoms, alkyl groups having 1 to 10 carbon atoms, or 6 to 10 carbon atoms. Represents the aromatic hydrocarbon group of.
- R2 is synonymous with R2 in the general formula [1B], and the two Xs independently represent a fluorine atom, a chlorine atom, a bromine atom, an iodine atom or an active ester group.
- the compound in which X is an "active ester group” can be obtained, for example, by reacting a dicarboxylic acid with an active esterifying agent in the presence of a dehydration condensing agent.
- a dehydration condensing agent include, for example, dicyclohexylcarbodiimide, 1-ethoxycarbonyl-2-ethoxy-1,2-dihydroquinoline, 1,1′-carbonyldioxy-di-1,2,3-benzotriazole, N, Examples thereof include N'-discusin imidazole carbonate.
- Preferred active esterifying agents include N-hydroxysuccinimide, 1-hydroxybenzotriazole, N-hydroxy-5-norbornen-2,3-dicarboxylic acidimide, 2-hydroxyimino-2-cyanoacetate ethyl, 2-hydroxyimino. -2-Cyanoacetic acid amide and the like can be mentioned.
- dicarboxylic acid itself or the dicarboxylic acid that is the source of the dicarboxylic acid derivative
- dicarboxylic acid derivative include oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, and azelaic acid as aliphatic dicarboxylic acids.
- phthalic acid as aromatic dicarboxylic acid, isophthalic acid, terephthalic acid, 3,3'-dicarboxydiphenyl ether, 3,4-dicarboxydiphenyl ether, 4,4'-dicarboxydiphenyl ether, 3,3'- Dicarboxydiphenylmethane, 3,4-dicarboxydiphenylmethane, 4,4'-dicarboxydiphenylmethane, 3,3'-dicarboxydiphenyldifluoromethane, 3,4-dicarboxydiphenyldifluoromethane, 4,4'-dicarboxydiphenyl Difluoromethane, 3,3'-dicarboxydiphenylsulfone, 3,4-dicarboxydiphenylsulfone, 4,4'-dicarboxydiphenylsulfone, 3,3'-dicarboxydiphenylsulfide, 3,4-dicarboxy
- dicarboxylic acid or the dicarboxylic acid derivative include an aromatic dicarboxylic acid or a derivative thereof.
- particularly preferred dicarboxylic acids or dicarboxylic acid derivatives include: In the following, the definition and specific embodiment of A are the same as those of the general formula [DC-1], and the definition and specific embodiment of X are the same as those of the general formula [DC-2].
- a solvent in which the raw material compound is dissolved can be used without particular limitation. Specific examples thereof include amide solvents, ether solvents, aromatic solvents, halogen solvents, lactone solvents and the like.
- amide-based solvent N, N-dimethylformamide, N, N-dimethylacetamide, N-methylformamide, hexamethylphosphate triamide or N-methyl-2-pyrrolidone
- ether-based solvent Diethyl ether, dipropyl ether, diisopropyl ether, dibutyl ether, cyclopentylmethyl ether, diphenyl ether, dimethoxyethane, diethoxyethane, tetrahydrofuran, dioxane or trioxane, as aromatic solvents, benzene, anisole, nitrobenzene or benzonitrile, halogen
- the system solvent is chloroform, dichloromethane, 1,2-dichloroethane or 1,1,2,2-tetrachloroethane
- lactone-based solvent is ⁇ -butyrolactone, ⁇ -valerolactone, ⁇ -valerolactone, ⁇ -valerolactone, ⁇
- the temperature at the time of reaction may be appropriately set between, for example, -100 to 100 ° C. Further, the reaction may be carried out in an environment of an inert gas such as nitrogen or argon.
- the addition-reactive group is not particularly limited as long as it is a group that undergoes an addition polymerization reaction (curing reaction) by heating. It is preferably any reaction group selected from the group consisting of a group containing an acetylene bond such as a phenylethynyl group, a nadic acid group, and a maleimide group, and more preferably a group containing an acetylene bond such as a phenylethynyl group. Yes, more preferably a phenylethynyl group.
- the addition-reactive group is introduced into the polymer terminal by reacting a compound having an acid anhydride group or an amino group together with the addition-reactive group in one molecule with the amino group or the acid anhydride group at the polymer terminal.
- This reaction is preferably a reaction that forms an imide ring.
- the compound having an acid anhydride group or an amino group together with an addition reactive group in the molecule include 4- (2-phenylethynyl) anhydrous phthalic acid, phenylethynyl trimellitic anhydride, and 4- (2-phenylethynyl).
- dicarboxylic acid anhydride such as maleic anhydride, phthalic anhydride, nadic acid anhydride, ethynyl phthalic anhydride, hydroxy phthalic anhydride, hydroxyaniline, aminobenzoic acid, dihydroxyaniline.
- dicarboxylic acid anhydride such as maleic anhydride, phthalic anhydride, nadic acid anhydride, ethynyl phthalic anhydride, hydroxy phthalic anhydride, hydroxyaniline, aminobenzoic acid, dihydroxyaniline.
- carbboxyhydroxyaniline dicarboxyaniline and the like.
- a reaction solution to a poor solvent (for example, water, alcohol, etc.) to precipitate, isolate and purify the polyamide for the purpose of removing residual monomers and low molecular weight substances.
- a poor solvent for example, water, alcohol, etc.
- the polyamide with reduced impurities may be dissolved again in an organic solvent. By doing so, it is possible to obtain a polyamide solution having a small amount of impurities.
- a polyamide cyclized product can be produced using the polyamide produced as described above.
- -The first step of manufacturing polyamide by the above ⁇ polyamide manufacturing method> and -The second step of dehydrating and ring-closing the polyamide obtained in the first step and thereby, the polyamide cyclized product of the present embodiment (polymer having a structural unit represented by the above-mentioned general formula [1C]) can be produced.
- the dehydration ring closure reaction in the second step is usually carried out by a heating method. Specifically, the polyamide obtained in the first step is heated to 100 ° C. or higher and 400 ° C. or lower. As a result, dehydration cyclization in the polyamide proceeds. Then, the polyamide cyclized product of the present embodiment can be obtained.
- the polyamide may be heated by heating the polyamide solution or by heating the solid (for example, film-like) polyamide, but the latter is preferable. This will be described in detail later as a method for manufacturing an insulating material for high-frequency electronic components.
- the insulating material for high-frequency electronic components including the polyamide cyclized body can be typically obtained by heating the above-mentioned polyamide or a solution thereof. Specifically, by going through each of the following steps, an insulating material for high-frequency electronic components including a polyamide cyclized body having a structural unit represented by the general formula [1C] can be manufactured. Incidentally, the following drying step and heating step may be continuously carried out.
- the coating method in the coating step is not particularly limited, and a known method can be adopted.
- a known coating device such as a spin coater, a bar coater, a doctor blade coater, an air knife coater, a roll coater, a rotary coater, a flow coater, a die coater, and a lip coater can be appropriately used depending on the coating film thickness, the viscosity of the solution, and the like.
- the supporting base material is not particularly limited, but an inorganic base material or an organic base material is suitable. Specifically, glass, silicon wafer, stainless steel, alumina, copper, nickel, etc., polyethylene terephthalate, polyethylene glycol terephthalate, polyethylene glycol naphthalate, polycarbonate, polyimide, polyamideimide, polyetherimide, polyetheretherketone, polypropylene, poly Examples thereof include ether sulfone, polyethylene terephthalate, polyphenylene sulfone, polyphenylene sulfide and the like. Of these, from the viewpoint of heat resistance, it is preferable to use an inorganic base material, and it is more preferable to use an inorganic base material such as glass, silicon wafer, or stainless steel.
- the thickness of the finally obtained film can be adjusted.
- the thickness of the finally obtained film is usually 1 ⁇ m or more and 1000 ⁇ m or less, preferably 5 ⁇ m or more and 500 ⁇ m or less.
- the thickness is 1 ⁇ m or more, the strength of the film itself can be made sufficient.
- the thickness is 1000 ⁇ m or less, it is easy to suppress defects such as cissing, dents, and cracks.
- the solvent in the applied polyamide solution is usually volatilized by heating with a hot plate.
- the heating temperature in the drying step is preferably 50 ° C. or higher and 250 ° C. or lower, and more preferably 80 ° C. or higher and 200 ° C. or lower, although it depends on the type of the solvent in which the polyamide is dissolved.
- the heating temperature in the drying step is usually lower than the temperature in the subsequent heating step. When the heating temperature in the drying step is 50 ° C. or higher, drying is more easily performed. Further, when the heating temperature in the drying step is 250 ° C. or lower, defects such as cissing, dents, and cracks due to rapid solvent evaporation are suppressed, and a uniform film can be easily formed.
- the resin film obtained in the drying step is cured by heat treatment at a high temperature.
- the ring closure reaction of the polyamide in the resin film proceeds, and an insulating material (cured film) for high-frequency electronic components containing a polyamide cyclized body can be obtained.
- the temperature of the heating step is preferably 100 ° C. or higher and 400 ° C. or lower, and more preferably 150 ° C. or higher and 350 ° C. or lower.
- the temperature of the heating step is 100 ° C. or higher, the cyclization reaction can easily proceed sufficiently. Further, when the temperature of the heating step is 400 ° C. or lower, it is easy to suppress the occurrence of defects such as cracks.
- the heating step is preferably performed using an inert gas oven, a hot plate, a box-type dryer, or a conveyor-type dryer, but is not limited to the use of these devices.
- the heating step is preferably performed under an inert gas stream from the viewpoint of suppressing oxidation of the resin film and removing the residual solvent.
- the inert gas include nitrogen and argon.
- the flow rate of the inert gas is preferably 1 L / min or more and 5 L / min or less. When the flow rate of the inert gas is 1 L / min or more, it is easy to sufficiently remove the solvent and cure the resin film. Further, when the flow rate of the inert gas is 5 L / min or less, the entire resin film is uniformly dried / cured, and defects such as cracks are less likely to occur.
- a peeling step may be performed in which the cured film (containing the polyamide cyclized material) is peeled off from the supporting substrate after the heating step, and the cured film is used as the polyamide cyclized body substrate.
- the peeling step can be carried out after cooling from room temperature (20 ° C.) to about 400 ° C. after the heating step.
- a peeling agent may be applied to the supporting base material in advance.
- the release agent at that time is not particularly limited, and examples thereof include a silicon-based or fluorine-based release agent.
- the insulating material for high-frequency electronic components of the present embodiment includes a polyamide cyclized body having a structural unit represented by the above-mentioned general formula [1C].
- the insulating material of the present embodiment may contain a polyamide having a structure represented by the above-mentioned general formula [1B].
- the insulating material of this embodiment is typically in the form of a film.
- the film-shaped insulating material can be obtained, for example, by using a polyamide solution and undergoing a coating step, a drying step, and a heating step, as described above.
- the insulating material of the present embodiment preferably has good heat resistance for the convenience of application to the manufacturing process of electronic devices.
- the 5% weight loss temperature (Td 5 ) can be used as an index.
- Td 5 can be quantified by reading the data when the temperature of the insulating material is raised at a constant rate by using a differential scanning calorimeter as described in Examples described later.
- Td 5 is preferably 350 ° C. or higher, more preferably 380 ° C. or higher, and even more preferably 400 ° C. or higher.
- There is no particular upper limit for Td 5 but from the viewpoint of realistic polymer design, the upper limit for Td 5 is, for example, 600 ° C.
- the insulating material of the present embodiment contains a polyamide cyclized body having a structural unit represented by the general formula [1C], so that a high frequency device (communication device or the like) used for 5G (fifth generation mobile communication system) can be used. It is preferably used as an insulating material to be provided.
- the dielectric loss tangent of the insulating material of the present embodiment at a frequency of 28 GHz is preferably 0.012 or less, more preferably 0.007 or less.
- the lower limit of the dielectric loss tangent is ideally 0, but in reality it is about 0.0002.
- the relative permittivity of the insulating material of the present embodiment at a frequency of 28 GHz is preferably 3.1 or less, more preferably 2.8 or less.
- the lower limit of the relative permittivity is practically 2.0.
- the transmission speed at 5 G can be increased. It is possible to fully reduce the transmission loss.
- the high frequency electronic component of this embodiment includes the above-mentioned insulating material. Further, by using this high frequency electronic component, a high frequency device (communication terminal or the like) can be manufactured.
- the high-frequency electronic component of the present embodiment can be obtained by providing wiring portions on one side or both sides of a film-shaped insulating material. By doing so, the transmission speed can be increased and / or the transmission loss can be reduced.
- the above-mentioned insulating material may have good heat resistance. Therefore, even if a process (for example, drying, vapor deposition, plasma treatment, etc.) in which the temperature of the insulating material tends to rise is performed in the process of manufacturing the high-frequency electronic component, the performance of the insulating material does not change easily. This is preferable in the manufacture of electronic components.
- Examples of the method for forming the wiring portion on the film-shaped insulating material include copper, indium tin oxide (ITO), polythiophene, and the like by a laminating method, a metallizing method, a sputtering method, a vapor deposition method, a coating method, a printing method, and the like.
- a wiring portion can be formed by forming a conductive layer made of a conductive material such as polyaniline and polypyrrole and patterning the conductive layer.
- the surface of the film-shaped insulating material may be modified by plasma treatment or the like in order to improve the adhesive force between the insulating material and the conductive layer. Further, an adhesive may be used to improve the adhesive strength.
- % of the composition analysis value refers to the raw material or product as gas chromatography (hereinafter referred to as GC; unless otherwise specified, the detector is FID) or liquid chromatography (hereinafter referred to as LC, particularly described). If not, the detector represents the "% of area" of the composition obtained as measured by UV).
- Weight average molecular weight (Mw) and number average molecular weight (Mn) The weight average molecular weight and the number average molecular weight were measured by gel permeation chromatography (GPC, HLC-8320 manufactured by Tosoh Corporation) using polystyrene as a standard substance. Tetrahydrofuran (THF) was used as the mobile phase, and TSKgel SuperHZM-H was used as the column.
- measuring temperature Measured under the conditions of a starting temperature of 30 ° C, a measuring temperature range of -40 ° C to 350 ° C, and a heating rate of 10 ° C / min using a differential scanning calorimetry device (manufactured by SII Nanotechnology Co., Ltd., model name X-DSC7000). did. Specifically, the temperature indicating the maximum value of the endothermic peak generated when the polyamide is ring-closed and converted into a polyamide cyclized body was defined as the curing temperature.
- a gas phase reaction device manufactured by SUS316L, diameter 2.5 cm, length 40 cm including a cylindrical reaction tube equipped with an electric furnace was filled with 125 mL of the catalyst prepared in the above catalyst preparation example.
- the reactor was charged in a 2000 mL SUS304 reactor equipped with a thermometer and a stirrer, and the reactor was heated to 25 ° C. While refluxing hydrogen fluoride in the cooling tube under normal pressure, hydrogen chloride passing through the top tower of the cooling tube was absorbed by water and removed. After 10 hours of reflux, sampling was performed from the reactor, and the hydrogen fluoride content, hydrogen chloride content, and organic matter content were calculated by titration with respect to the mixture.
- Hydrogen fluoride 44% by weight, hydrogen chloride: 1% by weight, Organic matter: 55% by weight.
- a part of the mixture was collected in a resin NMR tube, and from the integral ratio of 19 F-NMR, fluoral in anhydrous hydrogen fluoride was 1, 2, 2, 2 which is a composition of fluoral / hydrogen fluoride. -It was confirmed that it was converted to tetrafluoroethanol.
- the water used for absorbing hydrogen chloride was subjected to titration, the content of hydrogen fluoride due to the accompanying droplets was partially observed, but almost no organic matter was contained.
- the fluoral-containing mixture obtained in Preparation Example 1 (hydrogen fluoride: 44% by weight, hydrogen chloride:) was placed in a 1 L stainless steel autoclave reactor equipped with a pressure gauge, a thermometer protection tube, an insertion tube, and a stirring motor. Weigh 205 g (fluoral: 1.15 mol, hydrogen fluoride: 4.51 mol), 186 g (9.29 mol) of hydrogen fluoride, and 321 g (3.45 mmol) of aniline (1% by weight, organic matter: 55% by weight). The mixture was heated in an oil bath at 90 ° C. and reacted at an absolute pressure of 0.05 MPa for 7 hours.
- the reaction solution was poured into a mixture of 600 g of ice water and 1080 g of toluene, and 1250 g of a 48% potassium hydroxide aqueous solution was added dropwise to neutralize the mixture.
- the organic layer recovered by the liquid separation operation was further washed with 750 g of an 18% potassium hydroxide aqueous solution and then with 600 g of clean water, and then the organic layer was heated to 80 ° C. and 410 g of n-heptane was added dropwise to perform recrystallization. ..
- the fluoral-containing mixture obtained in Preparation Example 1 (hydrogen fluoride: 44% by weight, hydrogen chloride:) was placed in a 1 L stainless steel autoclave reactor equipped with a pressure gauge, a thermometer protection tube, an insertion tube, and a stirring motor. Weigh 1% by weight, organic matter: 55% by weight) in 196 g (fluoral: 1.10 mol, hydrogen fluoride: 4.31 mol), 178 g (8.89 mol) of hydrogen fluoride, and 353 g (3.30 mmol) of o-toluidine. The mixture was heated in an oil bath at 90 ° C. and reacted at an absolute pressure of 0.05 MPa for 7 hours.
- the reaction solution was poured into a mixture of 600 g of ice water and 1080 g of toluene, and 1250 g of a 48% potassium hydroxide aqueous solution was added dropwise to neutralize the mixture.
- the organic layer recovered by the liquid separation operation was further washed with 750 g of an 18% potassium hydroxide aqueous solution and then with 600 g of clean water, and then the organic layer was heated to 80 ° C. and 410 g of n-heptane was added dropwise to perform recrystallization. ..
- the fluoral-containing mixture obtained in Preparation Example 1 (hydrogen fluoride: 44% by weight, hydrogen chloride:) was placed in a 1 L stainless steel autoclave reactor equipped with a pressure gauge, a thermometer protection tube, an insertion tube, and a stirring motor. Weigh 209 g (fluoral: 1.17 mol, hydrogen fluoride: 4.60 mol), 189 g (9.44 mol) of hydrogen fluoride, and 300 g (2.80 mmol) of m-toluidine (1% by weight, organic matter: 55% by weight). The mixture was heated in an oil bath at 150 ° C. and reacted at an absolute pressure of 0.45 MPa for 8 hours.
- the reaction solution was poured into a mixture of 1030 g of ice water, 690 g of toluene, and 500 g of ethyl acetate, and 1720 g of a 48% potassium hydroxide aqueous solution was added dropwise to neutralize the mixture.
- the organic layer recovered by the liquid separation operation was washed with 1000 g of clean water and then concentrated to about 400 g by an evaporator.
- 207 g of the target product 1,1,1-trifluoro-2,2-bis (2-methyl-4-aminophenyl) ethane, was obtained. , Yield 60%, Purity 98.4% (GC).
- the fluoral-containing mixture obtained in Preparation Example 1 (hydrogen fluoride: 44% by weight, hydrogen chloride:) was placed in a 1 L stainless steel autoclave reactor equipped with a pressure gauge, a thermometer protection tube, an insertion tube, and a stirring motor. 1% by weight, organic matter: 55% by weight) 196 g (fluoral: 1.10 mol, hydrogen fluoride: 4.31 mol), 178 g (8.89 mol) hydrogen fluoride, 267 g (2.20 mmol) of 2,3-dimethylaniline. ) was weighed, heated in an oil bath at 150 ° C., and reacted at an absolute pressure of 1.2 MPa for 19 hours.
- the reaction solution was poured into a mixture of 700 g of ice water and 1400 g of ethyl acetate, and 1570 g of a 48% potassium hydroxide aqueous solution was added dropwise to neutralize the mixture.
- the organic layer recovered by the liquid separation operation was further washed with 600 g of clean water, and then the organic layer was concentrated to about 800 g by an evaporator.
- the concentrate was heated to 60 ° C., and 710 g of n-heptane was added dropwise to recrystallize.
- the 1,1,1-trifluoro-2,2-bis (1,1,1-trifluoro-2,2-bis (1,1,1-trifluoro-2,2-bis" obtained in Preparation Example 2 were placed in a 200 mL stainless steel autoclave reactor equipped with a pressure gauge, a thermometer protection tube, a gas introduction tube, and a stirring motor. Weighed 20.1 g (75.4 mmol) of 4-aminophenyl) ethane, 100 g of hexafluoroisopropanol, and 0.11 g (0.75 mmol) of trifluoromethanesulfonic acid.
- the 1,1,1-trifluoro-2,2-bis (1,1,1-trifluoro-2,2-bis (1,1,1-trifluoro-2,2-bis" obtained in Preparation Example 4 were placed in a 200 mL stainless steel autoclave reactor equipped with a pressure gauge, a thermometer protection tube, a gas introduction tube, and a stirring motor. Weighed 20.0 g (67.8 mmol) of 2-methyl-4-aminophenyl) ethane, 120 g of hexafluoroisopropanol, and 0.51 g (3.1 mmol) of trifluoromethanesulfonic acid.
- the 1,1,1-trifluoro-2,2-bis (1,1,1-trifluoro-2,2-bis (1,1,1-trifluoro-2,2-bis" obtained in Preparation Example 5 were placed in a 200 mL stainless steel autoclave reactor equipped with a pressure gauge, a thermometer protection tube, a gas introduction tube, and a stirring motor. Weighed 20.1 g (62.3 mmol) of 2,3-dimethyl-4-aminophenyl) ethane, 100 g of hexafluoroisopropanol, and 0.47 g (3.1 mmol) of trifluoromethanesulfonic acid.
- the reaction solution was obtained by stirring at room temperature (25 ° C.) for 5 hours under a nitrogen atmosphere. Then, the reaction solution was pressure-filtered to prepare a polyamide solution.
- the prepared polyamide solution was applied onto a glass substrate using a spin coater. Then, under a nitrogen atmosphere, a film (cured film) is obtained on a glass substrate by heating at a temperature of 110 ° C. for 10 minutes as a drying step, then heating at 200 ° C. for 30 minutes as a curing step, and then heating at 300 ° C. for 2 hours. rice field. Then, the film was cooled to room temperature, and the film was peeled off from the glass substrate to obtain a film-like cured film (insulating material). The film thickness of the cured film was measured and found to be 15 ⁇ m. Moreover, according to the measurement result of FT-IR of the cured film, there was absorption peculiar to the polyamide cyclized body at 1645 cm -1 . That is, it was confirmed that the cured film contained a polyamide cyclized product.
- the curing temperature was measured and found to be 227 ° C.
- the Td 5 of the cured film was 550 ° C.
- the relative permittivity was 2.6
- the dielectric loss tangent was 0.0034.
- Example 2 Polyamide synthesis / Polyamide cyclization and evaluation
- a polyamide solution was prepared by the same method as in Example 1 except that the fluorine-containing diamine (HFA-BIS-3AT-EF) obtained in Synthesis Example 2 was used instead of HFA-BIS-A-EF. did.
- the film thickness of the cured film obtained in the same manner as in Example 1 was 33 ⁇ m, and the Td 5 of the cured film (polyamide cyclized product) was 520 ° C.
- Example 3 Polyamide synthesis / polyamide cyclization and evaluation
- HFA-BIS-A-EF a mixture of the fluorine-containing diamine (HFA-BIS-3AT-EF) obtained in Synthesis Example 2 and HFA-MDA having the following chemical structure (the molar ratio of the mixture is HFA-BIS).
- the film thickness of the cured film obtained in the same manner as in Example 1 was 23 ⁇ m, and the Td 5 of the cured film (polyamide cyclized product) was 520 ° C.
- Example 4 Polyamide synthesis / Polyamide cyclization and evaluation
- a polyamide solution was prepared by the same method as in Example 3 except that the fluorine-containing diamine (HFA-BIS-2AT-EF) obtained in Synthesis Example 3 was used instead of HFA-BIS-3AT-EF.
- HFA-BIS-2AT-EF fluorine-containing diamine
- HFA-BIS-3AT-EF HFA-BIS-3AT-EF.
- the film thickness of the cured film obtained in the same manner as in Example 1 was 27 ⁇ m, and the Td 5 of the cured film (polyamide cyclized product) was 405 ° C.
- Example 5 Polyamide synthesis / polyamide cyclization and evaluation
- OBBC a mixture of OBBC
- IPC and TPC 9: 0.5: 0.5, see below for the chemical structure of IPC and TPC
- a polyamide solution was prepared in the same manner as in Example 3.
- the film thickness of the cured film obtained in the same manner as in Example 1 was 20 ⁇ m, and the Td 5 of the cured film (polyamide cyclized product) was 510 ° C.
- Example 6 Polyamide synthesis / Polyamide cyclization and evaluation
- a polyamide solution was prepared in the same manner as in Example 5 except that the fluorine-containing diamine (HFA-BIS-2AT-EF) obtained in Synthesis Example 3 was used instead of HFA-BIS-3AT-EF.
- the film thickness of the cured film obtained in the same manner as in Example 1 was 26 ⁇ m, and the Td 5 of the cured film (polyamide cyclized product) was 435 ° C.
- Example 1 From the comparison between Example 1 and Comparative Example 1, the polyamide cyclized product having a -CH (CF 3 ) -structure was obtained under curing conditions at a lower temperature than that of polybenzoxazole having a -C (CF 3 ) 2 -structure. It is understood that it will be done. It is also understood that the polyamide cyclized body having the -CH (CF 3 ) -structure exhibits better low dielectric properties than the polybenzoxazole having the "-C (CF 3 ) 2- " structure. Further, the heat resistance of the polyamide cyclized body having the -CH (CF 3 ) -structure of Examples 1 to 6 was good.
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Abstract
Description
R1は、複数存在する場合はそれぞれ独立に、アルキル基、アルコキシ基、ハロゲン原子、ハロアルキル基およびハロアルコキシ基からなる群より選ばれる少なくともいずれかであり、
2つのnは、それぞれ独立して0~3の整数である。
R1は、複数存在する場合はそれぞれ独立に、アルキル基、アルコキシ基、ハロゲン原子、ハロアルキル基およびハロアルコキシ基からなる群より選ばれる少なくともいずれかであり、
R2は、2価の有機基であり、
2つのnは、それぞれ独立して0~3の整数である。
R1は、複数存在する場合はそれぞれ独立に、アルキル基、アルコキシ基、ハロゲン原子、ハロアルキル基およびハロアルコキシ基からなる群より選ばれる少なくともいずれかであり、
R2は、2価の有機基であり、
2つのnは、それぞれ独立して0~3の整数である。
R1は、複数存在する場合はそれぞれ独立に、アルキル基、アルコキシ基、ハロゲン原子、ハロアルキル基およびハロアルコキシ基からなる群より選ばれる少なくともいずれかであり、
2つのnは、それぞれ独立して0~3の整数である。
上記のポリアミド環化体を製造する製造方法であって、
上記のポリアミドを製造する製造方法によりポリアミドを製造する第一工程と、
前記第一工程で得られた前記ポリアミドを脱水閉環する第二工程と、
を含む製造方法が提供される。
塗布されたポリアミド溶液中に含まれる溶媒を乾燥させることにより、ポリアミドを含む樹脂膜を得る乾燥工程と、
前記樹脂膜を加熱処理して硬化膜とする加熱工程と、
を含む、高周波電子部品用絶縁材の製造方法が提供される。
本明細書における基(原子団)の表記において、置換か無置換かを記していない表記は、置換基を有しないものと置換基を有するものの両方を包含するものである。例えば「アルキル基」とは、置換基を有しないアルキル基(無置換アルキル基)のみならず、置換基を有するアルキル基(置換アルキル基)をも包含するものである。
本明細書における「有機基」の語は、特に断りが無い限り、有機化合物から1つ以上の水素原子を除いた原子団のことを意味する。例えば、「1価の有機基」とは、任意の有機化合物から1つの水素原子を除いた原子団のことを表す。
本明細書中の化学式において、「Me」の表記は、メチル基(CH3)を表す。
本明細書中、「フルオラール」の語は、トリフルオロアセトアルデヒドを意味する。
本明細書における「高周波」とは、例えば周波数1GHz以上、好ましくは周波数10~200GHz、さらに好ましくは周波数28~100GHzの領域を意味する。
本実施形態の含フッ素ジアミンは、以下一般式[1A]で表されるものである。また、本実施形態の含フッ素ジアミンの塩は、以下一般式[1A]で表される含フッ素ジアミンのアミノ基の部分と酸とが中和して塩となったものであるか、または、-C(CF3)2OH部分と塩基とが中和して塩となったものである。塩としては前者が好ましく、そのような塩としては例えば塩酸塩、硫酸塩、硝酸塩などが挙げられる。
R1は、複数存在する場合はそれぞれ独立に、アルキル基、アルコキシ基、ハロゲン原子、ハロアルキル基およびハロアルコキシ基からなる群より選ばれる少なくともいずれかであり、
2つのnは、それぞれ独立して0~3の整数である。
ポリアミド樹脂やポリアミド環化体についての詳細は追って説明する。
R1のアルコキシ基は、直鎖状でも分岐状でもよい。アルコキシ基としては、炭素数1~6の直鎖または分岐のアルコキシ基が具体的に挙げられる。中でも、n-ブトキシ基、s-ブトキシ基、イソブトキシ基、t-ブトキシ基、n-プロポキシ基、i-プロポキシ基、エトキシ基およびメトキシ基が好ましく、エトキシ基とメトキシ基が特に好ましい。
R1のハロゲン原子としては、フッ素原子、塩素原子、臭素原子、ヨウ素原子などを挙げることができ、フッ素原子が好ましい。
R1のハロアルキル基およびハロアルコキシ基としては、上述のアルキル基またはアルコキシ基が有する水素原子の一部または全部がハロゲン原子(好ましくはフッ素原子)に置換されたものを挙げることができる。
一般式[1A]において、nは好ましくは0~2の整数であり、より好ましくは0~1の整数である。
式[1A-4]で表されるジアミンの化合物名は、1,1,1-トリフルオロ-2,2-ビス(3-(1-ヒドロキシ-1-トリフルオロメチル-2,2,2-トリフルオロエチル)-4-アミノフェニル)エタンである。
式[1A-5]で表されるジアミンの化合物名は、1,1,1-トリフルオロ-2,2-ビス(3-(1-ヒドロキシ-1-トリフルオロメチル-2,2,2-トリフルオロエチル)-5-メチル-4-アミノフェニル)エタンである。
式[1A-6]で表されるジアミンの化合物名は、1,1,1-トリフルオロ-2,2-ビス(3-(1-ヒドロキシ-1-トリフルオロメチル-2,2,2-トリフルオロエチル)-6-メチル-4-アミノフェニル)エタンである。
式[1A-7]で表されるジアミンの化合物名は、1,1,1-トリフルオロ-2,2-ビス(3-(1-ヒドロキシ-1-トリフルオロメチル-2,2,2-トリフルオロエチル)-5,6-ジメチル-4-アミノフェニル)エタンである。
一般式[1A]で表される含フッ素ジアミンまたはその塩は、下記反応式に示されるように、一般式[2]で表される芳香族ジアミン化合物に対して、ヘキサフルオロアセトン(以下「HFA」と表すことがある)またはその等価体を付加させることで得ることができる。
一般式[2]中、R1およびnの定義は、一般式[1A]と同様である。
下記反応式において、R1およびnの定義は、一般式[1A]と同様である。
一般的に、フルオラールは水和物やヘミアセタール体として用いることが多い為、フルオラールを無水条件下で用いる場合、フルオラールの水和体やヘミアセタール体を脱水させることで無水フルオラールを調製できる。
特開2019-026628号公報に記載の通り、フルオラールは低沸点化合物であり、一般的に自己反応性が高く、取り扱いが困難な化合物であるが、フルオラールはフッ化水素溶液中で非常に安定に取り扱うことが可能である。フルオラールをフッ化水素中で取り扱った場合、下記スキームで表す通り、フルオラールとフッ化水素からなる付加体である、1,2,2,2-テトラフルオロエタノールが生成する(これについても後掲の調製例1を参照されたい)。
調製したフルオラールをフッ化水素との混合物として取り扱う場合、用いるフッ化水素の添加量は、調製されたフルオラール1モルに対し、通常0.1~100モルであり、好ましくは1~75モル、更に好ましくは2~50モルである。フッ化水素の添加量が0.1モル以上であることにより、十分な安定化効果を得やすい。また、生産性や経済性の面から、フッ化水素の添加量は100モル以下が好ましい。
フルオラール/フッ化水素の混合物には、過剰量のフッ化水素が含まれる場合もある。過剰なフッ化水素の存在は一見好ましくないとも思われるが、フッ化水素はそれ自身が酸触媒や脱水剤として作用し、所望の反応を促進させる場合がある。つまり、フルオラールをフッ化水素の混合物として取り扱う利点はあると言える。
ルイス酸としては、ホウ素(III:酸化数をいう。以下、本明細書で同じ)、スズ(II)、スズ(IV)、チタン(IV)、亜鉛(II)、アルミニウム(III)、アンチモン(III)及びアンチモン(V)からなる群より選ばれる少なくとも1種の金属を含む金属ハロゲン化物である。なお、用いる金属ハロゲン化物としては、通常取りうる最大の原子価を有する金属のハロゲン化物が好ましい。金属ハロゲン化物のうち、三フッ化ホウ素(III)、三塩化アルミニウム(III)、二塩化亜鉛(II)、四塩化チタン(IV)、四塩化スズ(IV)、五塩化アンチモン(V)が特に好ましい。ルイス酸の使用量は、フルオラール1モルに対し、例えば0.001モル以上、具体的には0.01~2.0モルである。
ブレンステッド酸は無機酸または有機酸である。無機酸の具体例としては、リン酸、塩化水素、臭化水素、濃硝酸、濃硫酸、発煙硝酸、発煙硫酸、フッ酸等が挙げられる。有機酸の具体例としては、ギ酸、酢酸、シュウ酸、安息香酸、メタンスルホン酸、ベンゼンスルホン酸、パラトルエンスルホン酸、トリフルオロメタンスルホン酸等が挙げられる。ブレンステッド酸の使用量は、フルオラール1モルに対し、例えば0.001モル以上、具体的には0.01~2.0モルである。
圧力条件は、例えば大気圧から4.0MPa(絶対圧、以下、同じ)、好ましくは大気圧から2.0MPa、より好ましくは大気圧から1.5MPaである。
本工程で用いる反応容器としては、ステンレス鋼、モネル(商標)、ハステロイ(商標)、ニッケルなどの金属製容器や、四フッ化エチレン樹脂、クロロトリフルオロエチレン樹脂、フッ化ビニリデン樹脂、PFA樹脂、プロピレン樹脂、そしてポリエチレン樹脂などを内部にライニングしたもの等、常圧又は加圧下で十分反応を行うことができる反応器を使用することができる。
反応時間は、フルオラール/フッ化水素の混合物とアリール化合物の組み合わせ、および添加剤であるルイス酸やブレンステッド酸の使用量に起因した反応条件の違いにより異なってくる。反応時間は、通常は24時間以内である。ガスクロマトグラフィー、薄層クロマトグラフィー、液体クロマトグラフィー、核磁気共鳴等の分析手段により反応の進行状況を追跡し、出発基質が殆ど消失した時点を反応の終点とすることが好ましい。
HFAまたはその等価体としては、常温常圧で気体であるHFAガスの他に、HFA3水和物を初めとする種々等価体を用いることができる。反応性の観点からは、気体のHFAガスを用いることが望ましい。
HFAまたはその等価体の使用量は、一般式[2]で表される原料の芳香族ジアミン化合物1モルに対し、典型的には0.1~10モル、好ましくは1~3モルである。十分に多い量のHFAまたはその等価体を用いることで、目的の一般式[1A]で表される含フッ素ジアミンまたはその塩の収率を高めることができる。また、HFAまたはその等価体を過剰に用いないことで、過剰に-C(CF3)2OH基が導入された副生成物の生成を抑えることができる。
ルイス酸としては、ホウ素(III:酸化数をいう。以下、本明細書で同じ)、スズ(II)、スズ(IV)、チタン(IV)、亜鉛(II)、アルミニウム(III)、アンチモン(III)及びアンチモン(V)からなる群より選ばれる少なくとも1種の金属を含む金属ハロゲン化物である。なお、用いる金属ハロゲン化物としては、通常取りうる最大の原子価を有する金属のハロゲン化物が好ましい。これら金属ハロゲン化物のうち、三フッ化ホウ素(III)、三塩化アルミニウム(III)、二塩化亜鉛(II)、四塩化チタン(IV)、四塩化スズ(IV)、五塩化アンチモン(V)が特に好ましい。ルイス酸の使用量は、一般式[2]で表される原料の芳香族ジアミン化合物1モルに対し、例えば0.001モル以上、好ましくは0.01~3.0モルである。
ブレンステッド酸は無機酸または有機酸である。無機酸の具体例としては、リン酸、塩化水素、臭化水素、濃硝酸、濃硫酸、発煙硝酸、発煙硫酸等が挙げられる。有機酸の具体例としては、ギ酸、酢酸、シュウ酸、安息香酸、メタンスルホン酸、ベンゼンスルホン酸、パラトルエンスルホン酸、トリフルオロメタンスルホン酸等が挙げられる。ブレンステッド酸の使用量は一般式[2]で表される原料の芳香族ジアミン化合物1モルに対し、例えば0.001モル以上、好ましくは0.01~3.0モルである。
反応圧は、通常は大気圧から4.0MPa(絶対圧、以下、同じ)、好ましくは大気圧から3.0MPa、より好ましくは大気圧から1.5MPaである。
反応容器としては、ステンレス鋼、モネル(商標)、ハステロイ(商標)、ニッケルなどの金属製容器や、四フッ化エチレン樹脂、クロロトリフルオロエチレン樹脂、フッ化ビニリデン樹脂、PFA樹脂、プロピレン樹脂、そしてポリエチレン樹脂などを内部にライニングしたもの等、常圧又は加圧下で十分反応を行うことができる反応器を使用することができる。
反応時間は、芳香族ジアミン化合物、反応溶媒や酸触媒の使用量、およびHFA当量に起因した反応条件の違いになどより異なってくる。反応時間は、通常は24時間以内である。薄層クロマトグラフィー、ガスクロマトグラフィー、液体クロマトグラフィー、核磁気共鳴等の分析手段により反応の進行状況を追跡し、出発基質が殆ど消失した時点を反応の終点とすることが好ましい。
本実施形態のポリアミドは、以下一般式[1B]で表される構造単位を有する。
R1は、複数存在する場合はそれぞれ独立に、アルキル基、アルコキシ基、ハロゲン原子、ハロアルキル基およびハロアルコキシ基からなる群より選ばれる少なくともいずれかであり、
R2は、2価の有機基であり、
2つのnは、それぞれ独立して0~3の整数である。
ポリマーにフッ素原子を導入すると、膜形成に用いる有機溶剤への溶解性が高くなる。それに加え、本実施形態のポリアミドは、価格面や入手容易性で当業者にとって一般的な「-C(CF3)2-」構造と比較すると、対称性に劣る。この対称性に劣る構造がポリマー鎖のパッキングを疎とすることで、有機溶剤への溶解性が高まり、膜形成性が良好となっていると推測される。
重量平均分子量や数平均分子量は、ゲル浸透クロマトグラフィー(GPC)により、ポリスチレンを標準物質として測定することができる。
本実施形態のポリアミドは、一般式[1B]で表される構造単位とは異なる構造単位を有していてもよい。ただし、一態様として、性能の一層の向上の観点では、ポリアミドの全構造単位中、好ましくは50~100mol%、より好ましくは75~100mol%、さらに好ましくは90~100mol%が一般式[1B]で表される構造単位である。本実施形態のポリアミドの実質上全ての構造単位(100%)が一般式[1B]で表される構造単位であってもよい。
本実施形態のポリアミドの好ましい例を以下に示す。
本実施形態のポリアミド(一般式[1B]で表される構造単位を有する)は、通常、有機溶媒に溶解させた形で、種々の用途に適用される。好ましく適用される用途の1つは、高周波電子部品製造用途である。つまり、本実施形態のポリアミドと有機溶媒とを含むポリアミド溶液は、高周波電子部品製造用絶縁材料として好ましく用いられる。
界面活性剤の市販品としては、DIC株式会社製の商品名メガファック、品番F142D、F172、F173もしくはF183、住友スリーエム株式会社製の商品名フロラード、品番、FC-135、FC-170C、FC-430もしくはFC-431、AGCセイミケミカル株式会社製の商品名サーフロン、品番S-112、S-113、S-131、S-141もしくはS-145、または東レ・ダウコーニングシリコーン株式会社製、商品名、SH-28PA、SH-190、SH-193、SZ-6032もしくはSF-8428が挙げられる(メガファックはDIC株式会社のフッ素系添加剤(界面活性剤・表面改質剤)の商品名、フロラードは住友スリーエム株式会社製のフッ素系界面活性剤の商品名およびサーフロンはAGCセイミケミカル株式会社のフッ素系界面活性剤の商品名であり、各々商標登録されている)。
界面活性剤を用いる場合、その量は、ポリアミド100質量部に対して、通常、0.001~10質量部である。
ちなみに、本実施形態のポリアミド溶液は、通常、キノンジアジド化合物などの感光剤を含まないか、含むとしても少量である。具体的には、本実施形態のポリアミド溶液中の感光剤の量は、ポリアミド100質量部に対して例えば1質量部以下、具体的には0.1質量部以下である。本実施形態のポリアミド溶液を、光によるパターニングが不要な用途に用いるならば、感光剤は不要である。換言すると、本実施形態のポリアミド溶液は、非感光性であることができる。
本実施形態のポリアミド環化体は、以下一般式[1C]で表される構造単位を有する。
R1は、複数存在する場合はそれぞれ独立に、アルキル基、アルコキシ基、ハロゲン原子、ハロアルキル基およびハロアルコキシ基からなる群より選ばれる少なくともいずれかであり、
R2は、2価の有機基であり、
2つのnは、それぞれ独立して0~3の整数である。
また、一般式[1C]におけるR2の具体的態様は、一般式[1B]と同様である。よって、改めての説明は省略する。
また、本実施形態のポリアミド環化体は、高い耐熱性を有する傾向がある。これは、剛直な環状骨格に起因するものと推測される。
本実施形態のポリアミド環化体は、一般式[1C]で表される構造単位とは異なる構造単位を有していてもよい。ただし、一態様として、耐熱性などの性能の一層の向上の観点では、ポリアミド環化体の全構造単位中、好ましくは50~100mol%、より好ましくは75~100mol%、さらに好ましくは90~100mol%が一般式[1C]で表される構造単位である。本実施形態のポリアミド環化体の実質上全ての構造単位(100%)が一般式[1C]で表される構造単位であってもよい。
本実施形態のポリアミド(一般式[1B]で表される構造単位を有する)は、少なくとも、前述の一般式[1A]で表される含フッ素ジアミンまたはその塩(モノマー)と、その他の化合物(モノマー)と、を反応(縮重合)させることで製造することができる。反応は、通常、一般式[1A]で表される含フッ素ジアミンまたはその塩(モノマー)と、その他の化合物(モノマー)とを、有機溶媒中で反応させる。
具体的には、特開2007-119503号公報、特開2007-119504号公報、特開2008-150534号公報、特開2014-125455号公報、特開2014-129340号公報などに記載の、-C(CF3)2-OH基を有するジアミンを挙げることができる。中でも、以下に示されるようなジアミンが好ましい。
ジカルボン酸またはその誘導体は、単独で用いられてもよく、2種以上が併用されてもよい。
付加反応性基は、加熱によって付加重合反応(硬化反応)を行う基であれば特に限定されない。好ましくは、フェニルエチニル基等のアセチレン結合を含む基、ナジック酸基、および、マレイミド基からなる群から選ばれるいずれかの反応基であり、より好ましくはフェニルエチニル基等のアセチレン結合を含む基であり、更に好ましくはフェニルエチニル基である。
付加反応性基は、1分子中に付加反応性基と共に酸無水物基又はアミノ基を有する化合物が、ポリマー末端のアミノ基又は酸無水物基と反応することによって、ポリマー末端に導入される。この反応は、好ましくはイミド環を形成する反応である。分子内に付加反応性基と共に酸無水物基又はアミノ基を有する化合物としては、例えば、4-(2-フェニルエチニル)無水フタル酸、フェニルエチニルトリメリット酸無水物、4-(2-フェニルエチニル)アニリン、4-エチニル-無水フタル酸、4-エチニルアニリン、ナジック酸無水物、マレイン酸無水物が挙げられる。
不純物が低減されたポリアミドを、再度、有機溶媒に溶解させてもよい。こうすることで、不純物量が少ないポリアミド溶液を得ることができる。
上記のようにして製造されたポリアミドを用いて、ポリアミド環化体を製造することができる。
具体的には、
・上記<ポリアミドの製造方法>によりポリアミドを製造する第一工程と、
・その第一工程で得られたポリアミドを脱水閉環する第二工程と、
により、本実施形態のポリアミド環化体(前掲の一般式[1C]で表される構造単位を有するポリマー)を製造することができる。
ポリアミドの加熱は、ポリアミド溶液を加熱してもよいし、固形状(例えば膜状)としたポリアミドを加熱してもよいが、好ましくは後者である。これについては、高周波電子部品用絶縁材の製造方法として追って詳述する。
本実施形態において、ポリアミド環化体を含む高周波電子部品用絶縁材は、典型的には上述のポリアミドまたはその溶液を加熱することで得ることができる。
具体的には、以下の各工程を経ることで、一般式[1C]で表される構造単位を有するポリアミド環化体を含む高周波電子部品用絶縁材を製造することができる。ちなみに、以下の乾燥工程と加熱工程は、連続的に実施されてもよい。
・上述のポリアミド溶液を支持基材に塗布する工程(塗布工程)
・塗布されたポリアミド溶液中に含まれる溶媒を乾燥させることにより、ポリアミドを含む樹脂膜を得る工程(乾燥工程)
・得られた樹脂膜を加熱処理して硬化膜とする工程(加熱工程)
塗布工程における塗布方法は、特に制限されず、公知の方法を採用することができる。塗布膜厚や溶液の粘度等に応じて、スピンコーター、バーコーター、ドクターブレードコーター、エアナイフコーター、ロールコーター、ロータリーコーター、フローコーター、ダイコーター、リップコーター等の公知塗布装置を適宜使用できる。
これらのうち、耐熱性の観点から、無機基材を用いることが好ましく、ガラス、シリコンウェハ、ステンレス等の無機基材を用いることがより好ましい。
最終的に得られる膜(硬化膜、高周波電子部品用絶縁材)の厚みは、通常1μm以上1000μm以下、好ましくは5μm以上500μm以下である。厚みが1μm以上であることで、膜自体の強度を十分なものとすることができる。厚みが1000μm以下であることで、ハジキ、ヘコミ、ワレ等の欠陥を抑えやすい。
乾燥工程においては、通常、ホットプレートを用いた加熱により、塗布されたポリアミド溶液中の溶媒を揮発させる。乾燥工程における加熱温度は、ポリアミドを溶解させた溶媒の種類にもよるが、50℃以上250℃以下が好ましく、80℃以上200℃以下がより好ましい。乾燥工程における加熱温度は、通常は後の加熱工程の温度よりも低い温度である。
乾燥工程における加熱温度が50℃以上であることで乾燥が十二分に行われやすくなる。また、乾燥工程における加熱温度が250℃以下であることで、急激な溶媒蒸発によるハジキ、ヘコミ、ワレ等の欠陥が抑えられ、均一な膜を形成しやすい。
加熱工程では、乾燥工程で得られた樹脂膜を高温で熱処理することで硬化させる。加熱により、樹脂膜中のポリアミドの閉環反応が進行し、ポリアミド環化体を含む高周波電子部品用絶縁材(硬化膜)を得ることができる。加熱工程では、乾燥工程で取り除くことができなかった残存溶媒の除去、環化率の向上、物理特性の改善も期待される。加熱工程の温度は、100℃以上400℃以下が好ましく、150℃以上350℃以下がより好ましい。加熱工程の温度が100℃以上であることにより、環化反応を十二分に進行させやすい。また、加熱工程の温度が400℃以下であることにより、ひび割れ等の欠陥発生を抑えやすい。
Td5は350℃以上が好ましく、380℃以上がより好ましく、400℃以上がさらに好ましい。Td5の上限は特に無いが、現実的なポリマー設計の観点から、Td5の上限は例えば600℃である。
具体的には、本実施形態の絶縁材の、周波数28GHzにおける誘電正接は、好ましくは0.012以下、より好ましくは0.007以下である。誘電正接の下限値は理想的には0であるが、現実的には0.0002程度である。
また、本実施形態の絶縁材の、周波数28GHzにおける比誘電率は、好ましくは3.1以下、より好ましくは2.8以下である。比誘電率の下限値は、現実的には2.0である。
周波数28GHzにおける誘電正接が3.1以下となるように、かつ/または、周波数28GHzにおける比誘電率が0.012以下となるように絶縁材を設計することで、5Gにおける伝送速度の高速化や伝送損失の低減を十二分に図りうる。
本実施形態の高周波電子部品は、上述の絶縁材を備える。また、この高周波電子部品を用いることで、高周波機器(通信端末など)を製造することができる。
また、上述の絶縁材は、良好な耐熱性を有し得る。そのため、高周波電子部品を製造するプロセスの中で、絶縁材の温度が上昇し易い処理(例えば、乾燥、蒸着、プラズマ処理等)が行われても、絶縁材の性能が変わりにくい。このことは電子部品の製造上好ましい。
以下において、組成分析値の「%」は、原料または生成物をガスクロマトグラフィー(以下GCと記す。特に記述のない場合、検出器はFID)もしくは液体クロマトグラフィー(以下LCと示す。特に記述のない場合検出器はUV)によって測定して得られた組成の「面積%」を表す。
まず、各種測定・評価法について説明する。
重量平均分子量および数平均分子量は、ゲルパーミエーションクロマトグラフィー(GPC、東ソー株式会社製HLC-8320)を用いて、ポリスチレンを標準物質として用いて測定した。移動相はテトラヒドロフラン(THF)、カラムはTSKgel SuperHZM-Hを用いた。
化合物または膜の赤外線吸収スペクトルは、NicoletNEXUS470FT-IR(サーモフィッシャーサイエンティフィック社製)を用いて測定した。
5%重量減少温度(Td5)は、示差熱熱重量同時測定装置(株式会社日立ハイテクサイエンス社製、機種名STA7200)を用い、開始温度の30℃から昇温速度10℃/分の条件で測定した。
後掲の実施例で得られた硬化膜または比較例のフィルムの、周波数条件28GHz、温度23℃および相対湿度50%RHにおける比誘電率(εr)および誘電正接(tanδ)を、スプリットシリンダ共振器法により測定した。測定装置としては、キーサイト・テクノロジー社製ネットワークアナライザ装置名「N5290A」および関東電子応用開発社製スプリットシリンダ共振器(28GHzCR-728)を用いた。
示差走査熱量測定装置(エスアイアイ・ナノテクノロジー株式会社製、機種名X-DSC7000)を用い、開始温度30℃、測定温度範囲-40℃~350℃、昇温速度10℃/分の条件で測定した。具体的には、ポリアミドが閉環してポリアミド環化体に転化する際に生じる吸熱ピークの極大値を示す温度を硬化温度とした。
[触媒調製例]
896gの特級試薬CrCl3・6H2Oを純水に溶かして3.0Lとした。この溶液に粒状アルミナ400gを浸漬し、一昼夜放置した。次に濾過してアルミナを取り出し、熱風循環式乾燥器中で100℃に保ち、さらに一昼夜乾燥した。
得られたクロム担持アルミナを、電気炉を備えた直径4.2cm長さ60cmの円筒形SUS316L製反応管に充填した。この反応管に窒素ガスを約20mL/分の流量で流しながら300℃まで昇温した。水の流出が見られなくなった時点で、窒素ガスにフッ化水素を同伴させ、その濃度を徐々に高めた。充填されたクロム担持アルミナのフッ素化によるホットスポットが反応管出口端に達したところで反応器温度を350℃に上げ、その状態を5時間保った。このようにして触媒を調製した。
1,2,2,2-テトラフルオロエタノール:
19F-NMR(400MHz,CFCl3)δ(ppm):-85.8(3F,s),-137.8(1F,d,J=54.9Hz)
フッ化水素:
19F-NMR(400MHz,CFCl3)δ(ppm):-193.4(1F,s)
1,1,1-トリフルオロ-2,2-ビス(4-アミノフェニル)エタン:
1H-NMR(400MHz,CDCl3)δ(ppm):3.42(4H,s),4.45(1H,q,J=10.1Hz),6.62(4H,d,J=8.3Hz),7.12(4H,d,J=8.3Hz)
19F-NMR(400MHz,CDCl3,CFCl3)δ(ppm):-66.9(3F,d,J=11.5Hz)
1,1,1-トリフルオロ-2,2-ビス(3-メチル-4-アミノフェニル)エタン:1H-NMR(400MHz,CDCl3)δ(ppm):2.13(6H,s),3.14(4H,s),4.41(1H,q,J=10.4Hz),6.62(2H,d,J=10.4Hz),7.01(2H,s),7.02(2H,d, J=8.3Hz)
19F-NMR(400MHz,CDCl3)δ(ppm):-66.7(3F,d,J=11.5Hz)
1,1,1-トリフルオロ-2,2-ビス(2,3-ジメチル-4-アミノフェニル)エタン:
1H-NMR(400MHz,CDCl3)δ(ppm):2.10(6H,s),2.18(6H,s),4.19(4H,bs),5.01(1H,q,J=9.6Hz),6.59(2H,d,J=8.4Hz),7.07(2H,d,J=8.4Hz)
19F-NMR(400MHz,CDCl3,CFCl3)δ(ppm):-64.6(3F,d,J=9.2Hz)
1,1,1-トリフルオロ-2,2-ビス(3-(1-ヒドロキシ-1-トリフルオロメチル-2,2,2-トリフルオロエチル)-4-アミノフェニル)エタン:
1H-NMR(400MHz,CD3CN)δ(ppm):4.78(1H,q,J=10.3Hz),4.85(2H,br-s),6.86(2H,d,J=6.9Hz),7.22(2H,dd,J=8.5,1.1Hz),7.32(2H,d,J=1.1Hz)
19F-NMR(400MHz,CD3CN)δ(ppm):-67.2(3F,d,J=8.7Hz),-75.3(12F,s)
1,1,1-トリフルオロ-2,2-ビス(3-(1-ヒドロキシ-1-トリフルオロメチル-2,2,2-トリフルオロエチル)-5-メチル-4-アミノフェニル)エタン:
1H-NMR(400MHz,CD3CN)δ(ppm):2.17(6H,s),4.45(2H,br-s)4.77(1H,q,J=10.3Hz),7.25(2H,s),7.32(2H,s)
19F-NMR(400MHz,CD3CN)δ(ppm):-67.0(3F,d,J=8.7Hz),-75.4(12F,s)
1,1,1-トリフルオロ-2,2-ビス(3-(1-ヒドロキシ-1-トリフルオロメチル-2,2,2-トリフルオロエチル)-6-メチル-4-アミノフェニル)エタン:
1H-NMR(400MHz,CD3CN)δ(ppm):2.15(6H,s),4.74(2H,br-s)5.00(1H,q,J=9.6Hz),6.71(2H,s),7.26(2H,s)
19F-NMR(400MHz,CD3CN)δ(ppm):-66.2(3F,d,J=8.7Hz),-75.5(6F,s),-75.8(6F,s)
1,1,1-トリフルオロ-2,2-ビス(3-(1-ヒドロキシ-1-トリフルオロメチル-2,2,2-トリフルオロエチル)-5,6-ジメチル-4-アミノフェニル)エタン:
1H-NMR(400MHz,CD3CN)δ(ppm):2.15(6H,s),2.18(6H,s),4.51(2H,br-s)5.35(1H,q,J=9.4Hz),7.29(2H,s)
19F-NMR(400MHz,CD3CN)δ(ppm):-65.6(3F,d,J=8.7Hz),-75.8(6F,s),-76.0(6F,s)
(実施例1:以下スキームで表されるポリアミドの合成/ポリアミドの環化、および評価)
また、硬化膜(ポリアミド環化体を含む)のTd5は550℃、比誘電率は2.6、誘電正接は0.0034であった。
HFA―BIS-A-EFの代わりに合成例2で得られた含フッ素ジアミン(HFA―BIS-3AT-EF)を用いたこと以外は、実施例1と同様の手法で、ポリアミドの溶液を調製した。溶液のGPC測定の結果、Mw=16000、Mw/Mn=1.8であった。
また、実施例1と同様にして得られた硬化膜の膜厚は33μmであり、硬化膜(ポリアミド環化体)のTd5は520℃であった。
HFA―BIS-A-EFの代わりに、合成例2で得られた含フッ素ジアミン(HFA―BIS-3AT-EF)と以下化学構造のHFA-MDAの混合物(混合のモル比は、HFA―BIS-3AT-EF:HFA-MDA=4:1)を用いたこと以外は、実施例1と同様の手法で、ポリアミドの溶液を調製した。溶液のGPC測定の結果、Mw=33700、Mw/Mn=1.9であった。
また、実施例1と同様にして得られた硬化膜の膜厚は23μmであり、硬化膜(ポリアミド環化体)のTd5は520℃であった。
HFA―BIS-3AT-EFの代わりに合成例3で得られた含フッ素ジアミン(HFA―BIS-2AT-EF)を用いたこと以外は、実施例3と同様の手法で、ポリアミドの溶液を調製した(念のため補足しておくと、実施例3におけるHFA―BIS-3AT-EFとHFA-MDAの2種のジアミンのうち、HFA―BIS-3AT-EFのみをHFA―BIS-2AT-EFに替えた)。溶液のGPC測定の結果、Mw=68100、Mw/Mn=2.2であった。
また、実施例1と同様にして得られた硬化膜の膜厚は27μmであり、硬化膜(ポリアミド環化体)のTd5は405℃であった。
OBBCの代わりに、OBBC、IPCおよびTPCの混合物(モル比は、OBBC:IPC:TPC=9:0.5:0.5、IPCおよびTPCの化学構造は以下参照)を用いたこと以外は、実施例3と同様の手法で、ポリアミドの溶液を調製した。溶液のGPC測定の結果、Mw=37100、Mw/Mn=1.8であった。
また、実施例1と同様にして得られた硬化膜の膜厚は20μmであり、硬化膜(ポリアミド環化体)のTd5は510℃であった。
HFA―BIS-3AT-EFの代わりに、合成例3で得られた含フッ素ジアミン(HFA―BIS-2AT-EF)を用いたこと以外は、実施例5と同様の手法で、ポリアミドの溶液を調製した。溶液のGPC測定の結果、Mw=73700、Mw/Mn=2.0であった。
また、実施例1と同様にして得られた硬化膜の膜厚は26μmであり、硬化膜(ポリアミド環化体)のTd5は435℃であった。
HFA―BIS-A-EFの代わりに、2,2-ビス(3-アミノ-4-ヒドロキシフェニル)-1,1,1,3,3,3-ヘキサフルオロプロパン(BIS-AP-AF)を用いたこと以外は、実施例1と同様の手法にて、ポリヒドロキシアミドを得、さらにそれを加熱して硬化膜(ポリベンゾオキサゾール含有)を得た。
ポリヒドロキシアミドの硬化温度は289℃であった。また、ポリベンゾオキサゾール硬化膜の誘電率は2.9、誘電正接は0.0055であった。
さらに、実施例1~6の、-CH(CF3)-構造を有するポリアミド環化体の耐熱性は良好であった。
Claims (34)
- 請求項10に記載のポリアミドであって、
R2は、芳香環を含有する2価の有機基であるポリアミド。 - 請求項10~12のいずれか1項に記載のポリアミドであって、
重量平均分子量が、1,000以上1,000,000以下であるポリアミド。 - 請求項10~13のいずれかに記載のポリアミドと、有機溶媒とを含む、ポリアミド溶液。
- 請求項14に記載のポリアミド溶液であって、
前記有機溶媒が、アミド系溶媒、エーテル系溶媒、芳香族系溶媒、ハロゲン系溶媒及びラクトン系溶媒からなる群より選ばれる少なくとも1種を含むポリアミド溶液。 - 請求項14または15に記載のポリアミド溶液であって、
前記ポリアミドの濃度は、0.1質量%以上50質量%以下であるポリアミド溶液。 - 請求項17に記載のポリアミド環化体であって、
R2は、芳香環を含有する2価の有機基であるポリアミド環化体。 - 請求項17~19のいずれか1項に記載のポリアミド環化体を含む高周波電子部品用絶縁材。
- 請求項20に記載の高周波電子部品用絶縁材であって、
5%重量減少温度Td5が350℃以上である絶縁材。 - 請求項20または21に記載の高周波電子部品用絶縁材であって、
周波数28GHzにおける誘電正接が0.012以下である絶縁材。 - 請求項20~22のいずれか1項に記載の高周波電子部品用絶縁材であって、
周波数28GHzにおける比誘電率が3.1以下である絶縁材。 - 請求項20~23のいずれか1項に記載の高周波電子部品用絶縁材を備える高周波電子部品。
- 請求項24に記載の高周波電子部品を備える高周波機器。
- 請求項10~13のいずれか1項に記載のポリアミドを含む高周波電子部品製造用絶縁材料。
- 請求項26に記載の高周波電子部品製造用絶縁材料であって、
前記ポリアミドの重量平均分子量が500,000以下である絶縁材料。 - 請求項10~13のいずれか1項に記載のポリアミドを製造する製造方法であって、
当該製造方法は、以下一般式[1A]で表される含フッ素ジアミンまたはその塩と、以下一般式[DC1]または[DC2]で表されるジカルボン酸またはジカルボン酸誘導体と、を縮重合する工程を含む製造方法。
R1は、複数存在する場合はそれぞれ独立に、アルキル基、アルコキシ基、ハロゲン原子、ハロアルキル基およびハロアルコキシ基からなる群より選ばれる少なくともいずれかであり、
2つのnは、それぞれ独立して0~3の整数である。
- 請求項17~19のいずれか1項に記載のポリアミド環化体を製造する製造方法であって、
請求項28に記載の製造方法によりポリアミドを製造する第一工程と、
前記第一工程で得られた前記ポリアミドを脱水閉環する第二工程と、
を含む製造方法。 - 請求項14~16のいずれか1項に記載のポリアミド溶液を支持基材に塗布する塗布工程と、
塗布されたポリアミド溶液中に含まれる溶媒を乾燥させることにより、ポリアミドを含む樹脂膜を得る乾燥工程と、
前記樹脂膜を加熱処理して硬化膜とする加熱工程と、
を含む、高周波電子部品用絶縁材の製造方法。 - 請求項30に記載の高周波電子部品用絶縁材の製造方法であって、
前記支持基材が、ガラス、シリコンウェハ、ステンレス、アルミナ、銅、ニッケル、ポリエチレンテレフタレート、ポリエチレングリコールテレフタレート、ポリエチレングリコールナフタレート、ポリカーボネート、ポリイミド、ポリアミドイミド、ポリエーテルイミド、ポリエーテルエーテルケトン、ポリプロピレン、ポリエーテルスルホン、ポリエチレンテレフタレート、ポリフェニレンスルホンおよびポリフェニレンスルフィドからなる群より選ばれる少なくとも1種である、高周波電子部品用絶縁材の製造方法。 - 請求項30または31に記載の高周波電子部品用絶縁材の製造方法であって、
前記硬化膜の膜厚が1μm以上1000μm以下である、高周波電子部品用絶縁材の製造方法。 - 請求項30~32のいずれか1項に記載の高周波電子部品用絶縁材の製造方法であって、
前記乾燥工程は、50℃以上250℃以下の温度で実施される、高周波電子部品用絶縁材の製造方法。 - 請求項30~33のいずれか1項に記載の高周波電子部品用絶縁材の製造方法であって、
前記加熱工程は、100℃以上400℃以下の温度で実施される、高周波電子部品用絶縁材の製造方法。
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