WO2022014599A1 - 組成物及び硬化体 - Google Patents

組成物及び硬化体 Download PDF

Info

Publication number
WO2022014599A1
WO2022014599A1 PCT/JP2021/026324 JP2021026324W WO2022014599A1 WO 2022014599 A1 WO2022014599 A1 WO 2022014599A1 JP 2021026324 W JP2021026324 W JP 2021026324W WO 2022014599 A1 WO2022014599 A1 WO 2022014599A1
Authority
WO
WIPO (PCT)
Prior art keywords
mass
aromatic
less
aromatic vinyl
vinyl compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/026324
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
亨 荒井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=79555553&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2022014599(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority to EP26160201.5A priority Critical patent/EP4723139A2/en
Application filed by Denka Co Ltd filed Critical Denka Co Ltd
Priority to KR1020267001070A priority patent/KR20260016004A/ko
Priority to EP21841529.7A priority patent/EP4183843B1/en
Priority to US18/015,484 priority patent/US20230287222A1/en
Priority to CN202180039735.3A priority patent/CN115698200B/zh
Priority to JP2022536396A priority patent/JP7284875B2/ja
Priority to MYPI2023000196A priority patent/MY209867A/en
Priority to CN202410631078.7A priority patent/CN118599040A/zh
Priority to CN202410631367.7A priority patent/CN118599041A/zh
Priority to KR1020227040875A priority patent/KR102913373B1/ko
Publication of WO2022014599A1 publication Critical patent/WO2022014599A1/ja
Anticipated expiration legal-status Critical
Priority to JP2023005482A priority patent/JP7569392B2/ja
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F210/00—Copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond
    • C08F210/02—Ethene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F210/00—Copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond
    • C08F210/04—Monomers containing three or four carbon atoms
    • C08F210/08—Butenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F210/00—Copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond
    • C08F210/14—Monomers containing five or more carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02—Monomers containing only one unsaturated aliphatic radical
    • C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/06—Hydrocarbons
    • C08F212/08—Styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/34—Monomers containing two or more unsaturated aliphatic radicals
    • C08F212/36—Divinylbenzene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/36—Amides or imides
    • C08F222/40—Imides, e.g. cyclic imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F4/00—Polymerisation catalysts
    • C08F4/42—Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors
    • C08F4/44—Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors selected from light metals, zinc, cadmium, mercury, copper, silver, gold, boron, gallium, indium, thallium, rare earths or actinides
    • C08F4/60—Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors selected from light metals, zinc, cadmium, mercury, copper, silver, gold, boron, gallium, indium, thallium, rare earths or actinides together with refractory metals, iron group metals, platinum group metals, manganese, rhenium technetium or compounds thereof
    • C08F4/62—Refractory metals or compounds thereof
    • C08F4/64—Titanium, zirconium, hafnium or compounds thereof
    • C08F4/642—Component covered by group C08F4/64 with an organo-aluminium compound
    • C08F4/6428—Component covered by group C08F4/64 with an organo-aluminium compound with an aluminoxane, i.e. a compound containing an Al-O-Al- group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F4/00—Polymerisation catalysts
    • C08F4/42—Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors
    • C08F4/44—Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors selected from light metals, zinc, cadmium, mercury, copper, silver, gold, boron, gallium, indium, thallium, rare earths or actinides
    • C08F4/60—Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors selected from light metals, zinc, cadmium, mercury, copper, silver, gold, boron, gallium, indium, thallium, rare earths or actinides together with refractory metals, iron group metals, platinum group metals, manganese, rhenium technetium or compounds thereof
    • C08F4/62—Refractory metals or compounds thereof
    • C08F4/64—Titanium, zirconium, hafnium or compounds thereof
    • C08F4/659—Component covered by group C08F4/64 containing a transition metal-carbon bond
    • C08F4/6592—Component covered by group C08F4/64 containing a transition metal-carbon bond containing at least one cyclopentadienyl ring, condensed or not, e.g. an indenyl or a fluorenyl ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F4/00—Polymerisation catalysts
    • C08F4/42—Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors
    • C08F4/44—Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors selected from light metals, zinc, cadmium, mercury, copper, silver, gold, boron, gallium, indium, thallium, rare earths or actinides
    • C08F4/60—Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors selected from light metals, zinc, cadmium, mercury, copper, silver, gold, boron, gallium, indium, thallium, rare earths or actinides together with refractory metals, iron group metals, platinum group metals, manganese, rhenium technetium or compounds thereof
    • C08F4/62—Refractory metals or compounds thereof
    • C08F4/64—Titanium, zirconium, hafnium or compounds thereof
    • C08F4/659—Component covered by group C08F4/64 containing a transition metal-carbon bond
    • C08F4/6592—Component covered by group C08F4/64 containing a transition metal-carbon bond containing at least one cyclopentadienyl ring, condensed or not, e.g. an indenyl or a fluorenyl ring
    • C08F4/65922—Component covered by group C08F4/64 containing a transition metal-carbon bond containing at least one cyclopentadienyl ring, condensed or not, e.g. an indenyl or a fluorenyl ring containing at least two cyclopentadienyl rings, fused or not
    • C08F4/65927—Component covered by group C08F4/64 containing a transition metal-carbon bond containing at least one cyclopentadienyl ring, condensed or not, e.g. an indenyl or a fluorenyl ring containing at least two cyclopentadienyl rings, fused or not two cyclopentadienyl rings being mutually bridged
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0807—Copolymers of ethene with unsaturated hydrocarbons only containing four or more carbon atoms
    • C08L23/0838—Copolymers of ethene with unsaturated hydrocarbons only containing four or more carbon atoms with monomers including an aromatic carbocyclic ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D109/00—Coating compositions based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D123/00—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers
    • C09D123/02—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
    • C09D123/04—Homopolymers or copolymers of ethene
    • C09D123/08—Copolymers of ethene
    • C09D123/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
    • C09D123/0815—Copolymers of ethene with aliphatic 1-olefins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D123/00—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers
    • C09D123/02—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
    • C09D123/04—Homopolymers or copolymers of ethene
    • C09D123/08—Copolymers of ethene
    • C09D123/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
    • C09D123/0838—Copolymers of ethene with aromatic monomers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D123/00—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers
    • C09D123/02—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
    • C09D123/04—Homopolymers or copolymers of ethene
    • C09D123/08—Copolymers of ethene
    • C09D123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D125/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Coating compositions based on derivatives of such polymers
    • C09D125/02—Homopolymers or copolymers of hydrocarbons
    • C09D125/04—Homopolymers or copolymers of styrene
    • C09D125/08—Copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D171/00—Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain; Coating compositions based on derivatives of such polymers
    • C09D171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09D171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09D171/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/02—Emulsion paints including aerosols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/63—Additives non-macromolecular organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/65—Additives macromolecular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/442—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from aromatic vinyl compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2314/00—Polymer mixtures characterised by way of preparation
    • C08L2314/06—Metallocene or single site catalysts

Definitions

  • Patent Document 5 shows a cured product obtained from a specific polymerization catalyst and having a specific composition and composition of an ethylene-olefin (aromatic vinyl compound) -polyene copolymer and a non-polar vinyl compound copolymer. There is.
  • the cured product specifically described in the examples of Patent Document 5 has the characteristics of low dielectric constant and low dielectric loss tangent, but is extremely soft, and therefore improves mechanical strength such as elastic modulus at normal temperature and high temperature. It is necessary to. Dimensions such as thin film insulation materials, such as FPC (Flexible Print Circuit Board), FCCL (Flexible Copper Clad Laminate, Flexible Copper Clad Laminate) interlayer insulation material, and in coverlay applications, thickness during or after mounting.
  • FPC Flexible Print Circuit Board
  • FCCL Flexible Copper Clad Laminate
  • the present invention can provide the following.
  • the number average molecular weight of the copolymerized oligomer is 500 or more and less than 12,000, preferably less than 10,000, and particularly preferably less than 5,000.
  • the aromatic vinyl compound monomer is an aromatic vinyl compound having 8 or more and 20 or less carbon atoms, and the content of the aromatic vinyl compound monomer unit is 0% by mass or more and 90% by mass or less, preferably 70% by mass.
  • oligomer The olefin-aromatic vinyl compound-aromatic polyene copolymer oligomer (hereinafter, may be simply referred to as "oligomer") copolymerizes each monomer of an olefin, an aromatic vinyl compound, and an aromatic polyene. Can be obtained by As a concept distinguished from this "oligomer", the present specification defines an olefin-aromatic vinyl compound-aromatic polyene copolymer, or simply a "copolymer" when the number average molecular weight is 12000 or more.
  • BVPE 1,2-bis (vinylphenyl) ethane
  • various divinylbenzenes of ortho, meta and para, or mixtures thereof are preferably used, and most preferably a mixture of meta and paradivinylbenzene is used. In this specification, these divinylbenzenes are referred to as divinylbenzenes.
  • divinylbenzenes When divinylbenzenes are used as the aromatic polyene, it is preferable because the curing efficiency is high and the curing is easy when the curing treatment is performed.
  • the molecular weight of the vinyl group derived from the aromatic polyene unit in the number average molecular weight is 67.5, which is the product of these, and this is calculated by the formula weight 27 of the vinyl group. By dividing, it becomes 2.5. That is, the vinyl group content derived from the aromatic polyene unit per number average molecular weight in the present copolymerized oligomer is required to be 2.5.
  • the attribution of the peak obtained by 1 H-NMR measurement of the copolymerized oligomer is known from the literature.
  • the cured product can exhibit a lower coefficient of linear expansion (CTE) than when a higher molecular weight copolymer is used. Even a cured product of a composition containing another resin or monomer in addition to the copolymerized oligomer can exhibit a lower coefficient of linear expansion (CTE) when compared with similar formulations.
  • the CTE value preferable for a single-layer or multi-layer CCL, FCCL, an interlayer insulating layer, or an interlayer adhesive layer is in the range of 25 to 150 ° C., and is 200 ppm or less, preferably 100 ppm or less, most preferably. It is 75 ppm or less.
  • olefin-aromatic polyene copolymerization oligomers containing no aromatic vinyl compound monomer unit specifically, ethylene-divinylbenzene copolymerization oligomers, ethylene-propylene-divinylbenzene copolymerization oligomers
  • Preferable examples include ethylene-1-butene-divinylbenzene copolymerization oligomer, ethylene-1-hexene-divinylbenzene copolymerization oligomer, and ethylene-1-octene-divinylbenzene copolymerization oligomer.
  • a known curing agent that can be conventionally used for polymerization or curing of aromatic polyenes and aromatic vinyl compounds can be used.
  • examples of such a curing agent include a radical polymerization initiator, a cationic polymerization initiator, and an anionic polymerization initiator, and a radical polymerization initiator can be preferably used.
  • Preferred are organic peroxide-based (peroxide), azo-based polymerization initiators, and the like, which can be freely selected depending on the intended use and conditions. Catalogs containing organic peroxides can be found on the NOF website, for example.
  • a varnish having a composition having good compatibility can be provided, and the cured product obtained from this varnish has good mechanical properties and good adhesion to members. It is possible to show the property (for example, the adhesiveness with a copper foil).
  • the use of an olefin-aromatic vinyl compound-aromatic polyene copolymer in an amount exceeding these ranges is not preferable because the viscosity of the toluene solution (varnish) increases.
  • Meta) acrylate can be exemplified.
  • the amount of the polar monomer used in the resin composition of the present invention is preferably 0.1 to 20 parts by mass, more preferably 0.1 to 10 parts by mass with respect to 100 parts by mass of the copolymerized oligomer.
  • the dielectric constant is 4.0 or less, preferably 3.0 or less, and the dielectric loss tangent is 0. It can be suppressed to 005 or less, preferably 0.002 or less.
  • the varnish of the present invention further contains (d) a solvent.
  • (a) to (c) have the same meanings as described above. It is preferable that the solvent (d) is volatilized and removed in the cured product, but a part of the solvent may remain as long as there is no problem in practical use.
  • the cured product of the present invention is particularly preferably one or more selected from (a) a curing agent, (b) a hydrocarbon-based elastomer, a polyphenylene ether-based resin, and an aromatic polyene-based resin, in addition to the present copolymerization oligomer. It can be obtained by curing a composition containing one or more selected from the resin of (c) polar monomer.
  • the composition containing the varnish of the present invention can be cured by a known method with reference to the curing conditions (temperature, time, pressure) of the contained curing agent.
  • the curing conditions can be determined with reference to the half-life temperature and the like disclosed for each peroxide.
  • the uncured or semi-cured thermoplastic resin composition of the present invention can be adhered to a copper foil for wiring by a heat-pressurizing treatment without particularly applying an adhesive or an adhesive treatment.
  • copper foil is a concept including copper wiring.
  • olefin-aromatic vinyl compound-aromatic polyene copolymerization oligomer which is a raw material, preferably, when a copolymerization oligomer having an aromatic vinyl compound content of 10% by mass or more is used, and / or the olefin is ethylene alone.
  • a known co-catalyst used in combination with a transition metal compound can be used as the co-catalyst.
  • an alumoxane such as methylaluminoxane (or referred to as methylalmoxane or MAO) or a boron compound is preferably used.
  • alkylaluminum such as triisobutylaluminum and triethylaluminum may be used together with these alumoxane and boron compounds. Examples of such co-catalysts include European Patent Application Publication No.
  • each raw material monomer of an olefin, an aromatic vinyl compound, and an aromatic polyene is brought into contact with a single site-coordinated polymerization catalyst composed of the transition metal compound and a co-catalyst.
  • a single site-coordinated polymerization catalyst composed of the transition metal compound and a co-catalyst.
  • the copolymer oligomer can be produced by applying the method for producing a copolymer described in International Publication No. 00/37517, JP-A-2009-161743, and JP-A-2010-280771 mutatis mutandis.
  • the production method is a method of polymerizing in a liquid monomer without using a solvent, or a method of pettan, hexane, heptane, cyclohexane, methylcyclohexane, benzene, toluene, ethylbenzene, xylene, mesitylene, limonene, chloro-substituted benzene, chloro-substituted toluene, chloride.
  • a saturated aliphatic such as methylene and chloroform, an aromatic hydrocarbon, or a halogenated hydrocarbon alone or in a mixed solvent.
  • a mixed alkane solvent, cyclohexane, toluene, ethylbenzene or the like is used.
  • the polymerization form may be either solution polymerization or slurry polymerization. Further, if necessary, known methods such as batch polymerization, continuous polymerization, prepolymerization, and multistage polymerization can be used.
  • the pipe-shaped polymerized cans include various known mixers such as dynamic or static mixers and static mixers that also serve as heat remover, and known various types such as coolers equipped with thin tubes for heat removal. It may have a cooler. Further, it may have a batch type prepolymerized can. Further, a method such as gas phase polymerization can be used.
  • the present invention is an olefin-aromatic vinyl compound-fragrance obtained by using a single site-coordinated polymerization catalyst composed of the transition metal compound represented by the general formula (1) and a co-catalyst.
  • a cured product containing a group polyene copolymerized oligomer can be provided.
  • the olefin-aromatic vinyl compound-aromatic polyene copolymer oligomer contained in the cured product preferably satisfies the conditions (1) to (4) above. Further, it is preferable that the cured product further contains a singular or a plurality selected from the following (a) to (c).
  • the content of vinyl group units derived from ethylene, hexene, styrene, and divinylbenzene in the copolymer was determined by 1 H-NMR from the peak area intensity assigned to each.
  • the sample was dissolved in heavy 1,1,2,2-tetrachloroethane, and the measurement was performed at 80 to 130 ° C.
  • the raw materials were as follows. For 1,2-PBd, Nippon Soda Co., Ltd. product B3000 (number average molecular weight 3200) was used. A bifunctional polyphenylene ether oligomer (OPE-2St, number average molecular weight 1200) was used. A toluene solution product manufactured by Mitsubishi Gas Chemical Company was further diluted with toluene, a large amount of methanol was added to precipitate methanol, and the mixture was air-dried and then dried under reduced pressure to obtain a powdered polyphenylene ether oligomer and used. As SEBS, H-1041 manufactured by Asahi Kasei Chemicals Co., Ltd. was used. As the curing agent, Park Mill D (Dicumyl Peroxide) manufactured by NOF CORPORATION was used.
  • the obtained composition was applied to a Teflon (registered trademark) mold (frame portion length 7 cm, width 7 cm, thickness 0.2 mm, 0.5 mm, or 1.0 mm) on a PET sheet placed on a glass plate. It was poured, air-dried at 50 ° C. on a hot plate, and further dried at 70 ° C. for 1 hour in a vacuum dryer to obtain an uncured sheet. Further, a PET sheet was placed on it, sandwiched between glass plates, and heat-treated in a dryer at 120 ° C. for 30 minutes, 150 ° C. for 30 minutes, and then at 200 ° C. for 120 minutes. After completion, the glass plate and the mold were removed to obtain a cured product as a supple semi-hard resin-like film.
  • Teflon registered trademark
  • the dielectric loss tangent of the sheet obtained in Comparative Example 3 did not meet the scope of the present invention. Therefore, the measurement of the storage elastic modulus of the cured product sheet of Comparative Example 3 was omitted.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Laminated Bodies (AREA)
  • Paints Or Removers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
  • Polymerization Catalysts (AREA)
PCT/JP2021/026324 2020-07-15 2021-07-13 組成物及び硬化体 Ceased WO2022014599A1 (ja)

Priority Applications (11)

Application Number Priority Date Filing Date Title
MYPI2023000196A MY209867A (en) 2020-07-15 2021-07-13 Composition and cured product thereof
JP2022536396A JP7284875B2 (ja) 2020-07-15 2021-07-13 組成物及び硬化体
KR1020267001070A KR20260016004A (ko) 2020-07-15 2021-07-13 조성물 및 경화체
EP21841529.7A EP4183843B1 (en) 2020-07-15 2021-07-13 Composition and cured body
US18/015,484 US20230287222A1 (en) 2020-07-15 2021-07-13 Composition and cured product thereof
CN202180039735.3A CN115698200B (zh) 2020-07-15 2021-07-13 组合物及固化体
CN202410631078.7A CN118599040A (zh) 2020-07-15 2021-07-13 组合物及固化体
EP26160201.5A EP4723139A2 (en) 2020-07-15 2021-07-13 Composition and cured body
KR1020227040875A KR102913373B1 (ko) 2020-07-15 2021-07-13 조성물 및 경화체
CN202410631367.7A CN118599041A (zh) 2020-07-15 2021-07-13 组合物及固化体
JP2023005482A JP7569392B2 (ja) 2020-07-15 2023-01-17 組成物及び硬化体

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020121683 2020-07-15
JP2020-121683 2020-07-15
JP2021-085708 2021-05-20
JP2021085708 2021-05-20

Publications (1)

Publication Number Publication Date
WO2022014599A1 true WO2022014599A1 (ja) 2022-01-20

Family

ID=79555553

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/026324 Ceased WO2022014599A1 (ja) 2020-07-15 2021-07-13 組成物及び硬化体

Country Status (8)

Country Link
US (1) US20230287222A1 (https=)
EP (2) EP4183843B1 (https=)
JP (2) JP7284875B2 (https=)
KR (2) KR20260016004A (https=)
CN (3) CN118599040A (https=)
MY (1) MY209867A (https=)
TW (1) TWI897995B (https=)
WO (1) WO2022014599A1 (https=)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4141065A1 (en) * 2019-12-03 2023-03-01 Denka Company Limited Olefin-aromatic vinyl compound-aromatic polyene, curable composition comprising the same, and cured product thereof
WO2023063357A1 (ja) * 2021-10-14 2023-04-20 デンカ株式会社 絶縁層を含む多層構造体
WO2023140262A1 (ja) 2022-01-19 2023-07-27 デンカ株式会社 共重合体、組成物、ワニス、及びそれらの硬化体
WO2023223909A1 (ja) * 2022-05-19 2023-11-23 住友化学株式会社 ポリオレフィン系共重合体、樹脂ペレット、エンジニアリングプラスチック用改質剤、エンジニアリングプラスチック組成物及び樹脂成形体
JPWO2024014436A1 (https=) * 2022-07-11 2024-01-18
JP2024064932A (ja) * 2022-10-27 2024-05-14 南亞塑膠工業股▲分▼有限公司 樹脂組成物
WO2024106433A1 (ja) * 2022-11-15 2024-05-23 デンカ株式会社 絶縁接着層を含む多層構造体及びその硬化物
WO2024143509A1 (ja) 2022-12-27 2024-07-04 デンカ株式会社 共重合体、その製造方法及び共重合体を含む硬化体
WO2024190862A1 (ja) * 2023-03-16 2024-09-19 デンカ株式会社 硬化性組成物、及びその硬化体
WO2024190872A1 (ja) * 2023-03-15 2024-09-19 デンカ株式会社 化合物、共重合体、組成物、ワニス、及びそれらの硬化体
WO2024190869A1 (ja) * 2023-03-16 2024-09-19 デンカ株式会社 硬化性組成物、及びその硬化体
WO2024190873A1 (ja) * 2023-03-15 2024-09-19 デンカ株式会社 組成物、及びその硬化体
WO2025028516A1 (ja) 2023-08-02 2025-02-06 デンカ株式会社 未硬化シート及びその硬化体
WO2025258655A1 (ja) * 2024-06-13 2025-12-18 デンカ株式会社 オレフィン－芳香族ビニル化合物－芳香族ポリエン共重合体及びその製造方法、当該共重合体を含有する組成物、並びにこれらの硬化体
WO2026009943A1 (ja) * 2024-07-03 2026-01-08 デンカ株式会社 有機架橋粒子
WO2026009901A1 (ja) * 2024-07-03 2026-01-08 デンカ株式会社 低誘電放熱材料
WO2026009902A1 (ja) * 2024-07-03 2026-01-08 デンカ株式会社 低誘電放熱材

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI855765B (zh) * 2023-07-07 2024-09-11 台光電子材料股份有限公司 樹脂組合物及其製品
TWI884749B (zh) * 2024-03-28 2025-05-21 台光電子材料股份有限公司 樹脂組合物及使用其製成之物品
WO2025205188A1 (ja) * 2024-03-28 2025-10-02 日鉄ケミカル＆マテリアル株式会社 シンジオタクチック構造を有する多官能ビニル芳香族共重合体、硬化性樹脂組成物、硬化物

Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5231272A (en) 1975-09-02 1977-03-09 Kanda Tekko Kk Method to form drop-out preventive angle for speed-change gear fitted to automobiles
JPS6320426B2 (https=) 1980-07-02 1988-04-27 Kuraray Co
WO1994010216A1 (fr) * 1992-10-28 1994-05-11 Idemitsu Kosan Co., Ltd. Copolymeres d'olefines et procede pour leur production
JPH06184179A (ja) 1991-11-30 1994-07-05 Hoechst Ag 配位子としてベンゼン融合したインデニル誘導体を持つメタロセン、その製造方法および触媒としてのその用途
JPH06192392A (ja) 1992-12-24 1994-07-12 Sumitomo Bakelite Co Ltd 低誘電率熱硬化性樹脂組成物
JPH0940709A (ja) 1995-07-31 1997-02-10 Denki Kagaku Kogyo Kk エチレン−芳香族ビニル化合物共重合体の製造方法
JPH09309925A (ja) 1996-03-19 1997-12-02 Denki Kagaku Kogyo Kk エチレン−芳香族ビニル化合物共重合体及びその製造方法
EP0872492A2 (en) 1997-04-17 1998-10-21 Denki Kagaku Kogyo Kabushiki Kaisha Transition metal compound as catalyst component for polymerization, aromatic vinyl compound-olefin copolymer having stereoregularity and method for its preparation by means of the transition metal compound as catalyst component
JPH1160645A (ja) 1997-08-27 1999-03-02 Tdk Corp 耐熱性低誘電性高分子材料ならびにそれを用いたフィルム、基板、電子部品および耐熱性樹脂成形品
JPH11130808A (ja) 1997-04-17 1999-05-18 Denki Kagaku Kogyo Kk 重合用遷移金属触媒成分、それを用いた立体規則性を有する芳香族ビニル化合物系重合体及びその製造方法
EP0985689A1 (en) 1998-09-07 2000-03-15 Denki Kagaku Kogyo Kabushiki Kaisha Aromatic vinyl compound-ethylene copolymer and method for producing the same
WO2000037517A1 (en) 1998-12-22 2000-06-29 Denki Kagaku Kogyo Kabushiki Kaisha Cross-copolymerized olefin/styrene/diene copolymer, process for the production of the same and uses thereof
JP2003026730A (ja) * 2001-07-18 2003-01-29 Denki Kagaku Kogyo Kk メタジビニルベンゼン含有共重合体およびその製造方法
JP2004087639A (ja) 2002-08-26 2004-03-18 Hitachi Ltd 低誘電正接絶縁材料を用いた高周波用電子部品
JP2008291227A (ja) 2007-04-26 2008-12-04 Hitachi Chem Co Ltd セミｉｐｎ型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにこれを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板
JP2009161743A (ja) 2007-12-10 2009-07-23 Denki Kagaku Kogyo Kk 後硬化性樹脂組成物及びそれを用いた高周波用電気絶縁材料
JP2010280771A (ja) 2009-06-03 2010-12-16 Denki Kagaku Kogyo Kk 後硬化性樹脂組成物及びそれを用いた電気絶縁材料
JP2010280860A (ja) 2009-06-08 2010-12-16 Denki Kagaku Kogyo Kk 高充填樹脂組成物
WO2016114287A1 (ja) 2015-01-13 2016-07-21 日立化成株式会社 フレキシブルプリント配線板用樹脂フィルム、樹脂付き金属箔、カバーレイフィルム、ボンディングシート及びフレキシブルプリント配線板
WO2021112088A1 (ja) * 2019-12-03 2021-06-10 デンカ株式会社 硬化性組成物及びその硬化体

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51124187A (en) 1975-04-23 1976-10-29 Nippon Telegr & Teleph Corp <Ntt> Preparation of polyethylene having low dielectric loss
GB2039789B (en) 1978-11-13 1983-04-13 Fellows A Electrostatic imaging sheet
CN1192033C (zh) 1998-10-08 2005-03-09 陶氏化学公司 桥连的金属配合物
KR100925361B1 (ko) * 1999-10-22 2009-11-09 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 저온 경화형 이방성 도전 접속재료
JP4731011B2 (ja) 2000-12-18 2011-07-20 株式会社Ａｄｅｋａ 電線被覆用塩化ビニル系樹脂組成物
JP2004175834A (ja) * 2002-11-25 2004-06-24 Asahi Kasei Chemicals Corp 芳香族系ビニル化合物の共重合触媒及び芳香族系ビニル共重合体の製造方法
JP4696109B2 (ja) * 2005-03-07 2011-06-08 三井化学株式会社 環状オレフィン系樹脂組成物および該樹脂組成物から得られる基板
BRPI0911051A2 (pt) * 2008-04-15 2015-12-29 Denki Kagaku Kogyo Kk composição de resina termoplástica.
CN103797067B (zh) * 2011-09-15 2016-06-01 旭化成株式会社 交联组合物、交联组合物的制造方法和成型体
CN107207932B (zh) * 2015-01-19 2019-10-25 株式会社巴川制纸所 热固化性粘合剂组合物、热固化性粘合膜以及复合膜
WO2017122295A1 (ja) * 2016-01-13 2017-07-20 デンカ株式会社 オレフィン－芳香族ビニル化合物系共重合体の製造方法及びクロス共重合体の製造方法
US10662321B2 (en) * 2016-02-29 2020-05-26 Mitsui Chemicals, Inc. Cyclic olefin copolymer composition and cross-linked product thereof
JP6995534B2 (ja) * 2016-08-31 2022-01-14 日鉄ケミカル＆マテリアル株式会社 可溶性多官能ビニル芳香族共重合体、その製造方法、硬化性樹脂組成物及びその硬化物
KR102537249B1 (ko) * 2017-03-30 2023-05-26 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 가용성 다관능 비닐 방향족 공중합체, 그 제조 방법, 경화성 수지 조성물 및 그 경화물
JP2019178233A (ja) * 2018-03-30 2019-10-17 日鉄ケミカル＆マテリアル株式会社 リン含有ビニル樹脂を含む低誘電難燃性組成物
KR102818943B1 (ko) 2018-09-28 2025-06-11 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 다관능 비닐 방향족 공중합체 및 그 제조 방법, 그것으로부터 얻어지는 공중합체 고무, 고무 조성물, 고무 가교물, 및 타이어 부재
CN115667393A (zh) * 2020-09-11 2023-01-31 电化株式会社 组合物及其固化体

Patent Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5231272A (en) 1975-09-02 1977-03-09 Kanda Tekko Kk Method to form drop-out preventive angle for speed-change gear fitted to automobiles
JPS6320426B2 (https=) 1980-07-02 1988-04-27 Kuraray Co
JPH06184179A (ja) 1991-11-30 1994-07-05 Hoechst Ag 配位子としてベンゼン融合したインデニル誘導体を持つメタロセン、その製造方法および触媒としてのその用途
WO1994010216A1 (fr) * 1992-10-28 1994-05-11 Idemitsu Kosan Co., Ltd. Copolymeres d'olefines et procede pour leur production
JPH06192392A (ja) 1992-12-24 1994-07-12 Sumitomo Bakelite Co Ltd 低誘電率熱硬化性樹脂組成物
JPH0940709A (ja) 1995-07-31 1997-02-10 Denki Kagaku Kogyo Kk エチレン−芳香族ビニル化合物共重合体の製造方法
JPH09309925A (ja) 1996-03-19 1997-12-02 Denki Kagaku Kogyo Kk エチレン−芳香族ビニル化合物共重合体及びその製造方法
EP0872492A2 (en) 1997-04-17 1998-10-21 Denki Kagaku Kogyo Kabushiki Kaisha Transition metal compound as catalyst component for polymerization, aromatic vinyl compound-olefin copolymer having stereoregularity and method for its preparation by means of the transition metal compound as catalyst component
JPH11130808A (ja) 1997-04-17 1999-05-18 Denki Kagaku Kogyo Kk 重合用遷移金属触媒成分、それを用いた立体規則性を有する芳香族ビニル化合物系重合体及びその製造方法
JPH1160645A (ja) 1997-08-27 1999-03-02 Tdk Corp 耐熱性低誘電性高分子材料ならびにそれを用いたフィルム、基板、電子部品および耐熱性樹脂成形品
EP0985689A1 (en) 1998-09-07 2000-03-15 Denki Kagaku Kogyo Kabushiki Kaisha Aromatic vinyl compound-ethylene copolymer and method for producing the same
WO2000037517A1 (en) 1998-12-22 2000-06-29 Denki Kagaku Kogyo Kabushiki Kaisha Cross-copolymerized olefin/styrene/diene copolymer, process for the production of the same and uses thereof
JP2003026730A (ja) * 2001-07-18 2003-01-29 Denki Kagaku Kogyo Kk メタジビニルベンゼン含有共重合体およびその製造方法
JP2004087639A (ja) 2002-08-26 2004-03-18 Hitachi Ltd 低誘電正接絶縁材料を用いた高周波用電子部品
JP2008291227A (ja) 2007-04-26 2008-12-04 Hitachi Chem Co Ltd セミｉｐｎ型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにこれを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板
JP2009161743A (ja) 2007-12-10 2009-07-23 Denki Kagaku Kogyo Kk 後硬化性樹脂組成物及びそれを用いた高周波用電気絶縁材料
JP2010280771A (ja) 2009-06-03 2010-12-16 Denki Kagaku Kogyo Kk 後硬化性樹脂組成物及びそれを用いた電気絶縁材料
JP2010280860A (ja) 2009-06-08 2010-12-16 Denki Kagaku Kogyo Kk 高充填樹脂組成物
WO2016114287A1 (ja) 2015-01-13 2016-07-21 日立化成株式会社 フレキシブルプリント配線板用樹脂フィルム、樹脂付き金属箔、カバーレイフィルム、ボンディングシート及びフレキシブルプリント配線板
WO2021112088A1 (ja) * 2019-12-03 2021-06-10 デンカ株式会社 硬化性組成物及びその硬化体

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
M. KAWABE ET AL., JOURNAL OF THE JAPAN INSTITUTE OF ELECTRONICS PACKAGING, vol. 12, no. 2, 2009, pages 125

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12091531B2 (en) 2019-12-03 2024-09-17 Denka Company Limited Copolymer and laminate containing same
EP4141065A1 (en) * 2019-12-03 2023-03-01 Denka Company Limited Olefin-aromatic vinyl compound-aromatic polyene, curable composition comprising the same, and cured product thereof
EP4141065B1 (en) * 2019-12-03 2025-07-09 Denka Company Limited Olefin-aromatic vinyl compound-aromatic polyene, curable composition comprising the same, and cured product thereof
US12104047B2 (en) 2019-12-03 2024-10-01 Denka Company Limited Curable composition and cured product thereof
WO2023063357A1 (ja) * 2021-10-14 2023-04-20 デンカ株式会社 絶縁層を含む多層構造体
WO2023140262A1 (ja) 2022-01-19 2023-07-27 デンカ株式会社 共重合体、組成物、ワニス、及びそれらの硬化体
JPWO2023140262A1 (https=) * 2022-01-19 2023-07-27
WO2023223909A1 (ja) * 2022-05-19 2023-11-23 住友化学株式会社 ポリオレフィン系共重合体、樹脂ペレット、エンジニアリングプラスチック用改質剤、エンジニアリングプラスチック組成物及び樹脂成形体
JP2023170477A (ja) * 2022-05-19 2023-12-01 住友化学株式会社 ポリオレフィン系共重合体、樹脂ペレット、エンジニアリングプラスチック用改質剤、エンジニアリングプラスチック組成物及び樹脂成形体
JPWO2024014436A1 (https=) * 2022-07-11 2024-01-18
JP2024064932A (ja) * 2022-10-27 2024-05-14 南亞塑膠工業股▲分▼有限公司 樹脂組成物
WO2024106433A1 (ja) * 2022-11-15 2024-05-23 デンカ株式会社 絶縁接着層を含む多層構造体及びその硬化物
EP4644439A4 (en) * 2022-12-27 2026-04-22 Denka Company Ltd COPOLYMER, ITS PRODUCTION PROCESS AND HARDENED BODY CONTAINING A COPOLYMER
WO2024143509A1 (ja) 2022-12-27 2024-07-04 デンカ株式会社 共重合体、その製造方法及び共重合体を含む硬化体
EP4644439A1 (en) 2022-12-27 2025-11-05 Denka Company Limited Copolymer, producing method for same, and cured body containing copolymer
WO2024190872A1 (ja) * 2023-03-15 2024-09-19 デンカ株式会社 化合物、共重合体、組成物、ワニス、及びそれらの硬化体
WO2024190873A1 (ja) * 2023-03-15 2024-09-19 デンカ株式会社 組成物、及びその硬化体
WO2024190869A1 (ja) * 2023-03-16 2024-09-19 デンカ株式会社 硬化性組成物、及びその硬化体
WO2024190862A1 (ja) * 2023-03-16 2024-09-19 デンカ株式会社 硬化性組成物、及びその硬化体
JP7664498B1 (ja) * 2023-08-02 2025-04-17 デンカ株式会社 未硬化シート及びその硬化体
WO2025028516A1 (ja) 2023-08-02 2025-02-06 デンカ株式会社 未硬化シート及びその硬化体
WO2025258655A1 (ja) * 2024-06-13 2025-12-18 デンカ株式会社 オレフィン－芳香族ビニル化合物－芳香族ポリエン共重合体及びその製造方法、当該共重合体を含有する組成物、並びにこれらの硬化体
WO2026009943A1 (ja) * 2024-07-03 2026-01-08 デンカ株式会社 有機架橋粒子
WO2026009901A1 (ja) * 2024-07-03 2026-01-08 デンカ株式会社 低誘電放熱材料
WO2026009902A1 (ja) * 2024-07-03 2026-01-08 デンカ株式会社 低誘電放熱材

Also Published As

Publication number Publication date
KR20230038413A (ko) 2023-03-20
EP4723139A2 (en) 2026-04-08
JP7569392B2 (ja) 2024-10-17
CN118599041A (zh) 2024-09-06
EP4183843A4 (en) 2023-11-22
JPWO2022014599A1 (https=) 2022-01-20
US20230287222A1 (en) 2023-09-14
CN115698200A (zh) 2023-02-03
CN115698200B (zh) 2024-06-11
CN118599040A (zh) 2024-09-06
KR102913373B1 (ko) 2026-01-14
EP4183843B1 (en) 2026-03-11
JP7284875B2 (ja) 2023-05-31
JP2023058506A (ja) 2023-04-25
TW202216802A (zh) 2022-05-01
KR20260016004A (ko) 2026-02-03
MY209867A (en) 2025-08-08
EP4183843A1 (en) 2023-05-24
TWI897995B (zh) 2025-09-21

Similar Documents

Publication Publication Date Title
KR102913373B1 (ko) 조성물 및 경화체
JP7676503B2 (ja) 共重合体及びこれを含む積層体
KR102890823B1 (ko) 조성물 및 그 경화체
JP7445092B2 (ja) 絶縁層を含む多層構造体
KR20240152385A (ko) 조성물
TW202605080A (zh) 清漆、硬化體、電氣絕緣材料、ccl基板、fccl基板、層間絕緣層及層間接著層

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21841529

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2022536396

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 2021841529

Country of ref document: EP

Effective date: 20230215

WWG Wipo information: grant in national office

Ref document number: 2021841529

Country of ref document: EP