JPWO2024014436A1 - - Google Patents

Info

Publication number
JPWO2024014436A1
JPWO2024014436A1 JP2024533709A JP2024533709A JPWO2024014436A1 JP WO2024014436 A1 JPWO2024014436 A1 JP WO2024014436A1 JP 2024533709 A JP2024533709 A JP 2024533709A JP 2024533709 A JP2024533709 A JP 2024533709A JP WO2024014436 A1 JPWO2024014436 A1 JP WO2024014436A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024533709A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024014436A1 publication Critical patent/JPWO2024014436A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/12—Polymers provided for in subclasses C08C or C08F
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F210/00—Copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond
    • C08F210/02—Ethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02—Monomers containing only one unsaturated aliphatic radical
    • C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/06—Hydrocarbons
    • C08F212/08—Styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/34—Monomers containing two or more unsaturated aliphatic radicals
    • C08F212/36—Divinylbenzene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F255/00—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Paints Or Removers (AREA)
JP2024533709A 2022-07-11 2023-07-10 Pending JPWO2024014436A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022111290 2022-07-11
JP2022194995 2022-12-06
PCT/JP2023/025492 WO2024014436A1 (ja) 2022-07-11 2023-07-10 ワニス及びその硬化体

Publications (1)

Publication Number Publication Date
JPWO2024014436A1 true JPWO2024014436A1 (https=) 2024-01-18

Family

ID=89536719

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024533709A Pending JPWO2024014436A1 (https=) 2022-07-11 2023-07-10

Country Status (5)

Country Link
JP (1) JPWO2024014436A1 (https=)
KR (1) KR20250029951A (https=)
CN (1) CN119343387A (https=)
TW (1) TW202406952A (https=)
WO (1) WO2024014436A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026009775A1 (ja) * 2024-07-03 2026-01-08 デンカ株式会社 共重合体、共重合体を含む組成物およびその硬化体
WO2026009942A1 (ja) * 2024-07-03 2026-01-08 デンカ株式会社 共重合体組成物及び硬化体
JP2026009070A (ja) * 2024-07-03 2026-01-19 デンカ株式会社 有機架橋粒子

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06192392A (ja) * 1992-12-24 1994-07-12 Sumitomo Bakelite Co Ltd 低誘電率熱硬化性樹脂組成物
JP2004087639A (ja) * 2002-08-26 2004-03-18 Hitachi Ltd 低誘電正接絶縁材料を用いた高周波用電子部品
JP2007217706A (ja) * 1998-12-22 2007-08-30 Denki Kagaku Kogyo Kk クロス共重合化オレフィン−スチレン−ジエン共重合体、その製造方法及びその用途
JP2009161743A (ja) * 2007-12-10 2009-07-23 Denki Kagaku Kogyo Kk 後硬化性樹脂組成物及びそれを用いた高周波用電気絶縁材料
JP2010280860A (ja) * 2009-06-08 2010-12-16 Denki Kagaku Kogyo Kk 高充填樹脂組成物
WO2018159080A1 (ja) * 2017-03-02 2018-09-07 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
WO2021112087A1 (ja) * 2019-12-03 2021-06-10 デンカ株式会社 共重合体及びこれを含む積層体
WO2022014599A1 (ja) * 2020-07-15 2022-01-20 デンカ株式会社 組成物及び硬化体
WO2022054885A1 (ja) * 2020-09-11 2022-03-17 デンカ株式会社 組成物及びその硬化体

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7294155B2 (ja) 2020-01-15 2023-06-20 株式会社デンソー 制御装置
JP7347224B2 (ja) 2020-01-15 2023-09-20 株式会社デンソー 通信システム
JP7616631B2 (ja) 2020-07-07 2025-01-17 国立大学法人 東京大学 延性に優れた高強度鋼

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06192392A (ja) * 1992-12-24 1994-07-12 Sumitomo Bakelite Co Ltd 低誘電率熱硬化性樹脂組成物
JP2007217706A (ja) * 1998-12-22 2007-08-30 Denki Kagaku Kogyo Kk クロス共重合化オレフィン−スチレン−ジエン共重合体、その製造方法及びその用途
JP2004087639A (ja) * 2002-08-26 2004-03-18 Hitachi Ltd 低誘電正接絶縁材料を用いた高周波用電子部品
JP2009161743A (ja) * 2007-12-10 2009-07-23 Denki Kagaku Kogyo Kk 後硬化性樹脂組成物及びそれを用いた高周波用電気絶縁材料
JP2010280860A (ja) * 2009-06-08 2010-12-16 Denki Kagaku Kogyo Kk 高充填樹脂組成物
WO2018159080A1 (ja) * 2017-03-02 2018-09-07 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
WO2021112087A1 (ja) * 2019-12-03 2021-06-10 デンカ株式会社 共重合体及びこれを含む積層体
WO2022014599A1 (ja) * 2020-07-15 2022-01-20 デンカ株式会社 組成物及び硬化体
WO2022054885A1 (ja) * 2020-09-11 2022-03-17 デンカ株式会社 組成物及びその硬化体

Also Published As

Publication number Publication date
TW202406952A (zh) 2024-02-16
CN119343387A (zh) 2025-01-21
KR20250029951A (ko) 2025-03-05
WO2024014436A1 (ja) 2024-01-18

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