KR20250029951A - 바니시 및 그 경화체 - Google Patents

바니시 및 그 경화체 Download PDF

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Publication number
KR20250029951A
KR20250029951A KR1020257003481A KR20257003481A KR20250029951A KR 20250029951 A KR20250029951 A KR 20250029951A KR 1020257003481 A KR1020257003481 A KR 1020257003481A KR 20257003481 A KR20257003481 A KR 20257003481A KR 20250029951 A KR20250029951 A KR 20250029951A
Authority
KR
South Korea
Prior art keywords
varnish
mass
monomer
aromatic
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257003481A
Other languages
English (en)
Korean (ko)
Inventor
토루 아라이
Original Assignee
덴카 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 덴카 주식회사 filed Critical 덴카 주식회사
Publication of KR20250029951A publication Critical patent/KR20250029951A/ko
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/12—Polymers provided for in subclasses C08C or C08F
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F210/00—Copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond
    • C08F210/02—Ethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02—Monomers containing only one unsaturated aliphatic radical
    • C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/06—Hydrocarbons
    • C08F212/08—Styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/34—Monomers containing two or more unsaturated aliphatic radicals
    • C08F212/36—Divinylbenzene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F255/00—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Paints Or Removers (AREA)
KR1020257003481A 2022-07-11 2023-07-10 바니시 및 그 경화체 Pending KR20250029951A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2022-111290 2022-07-11
JP2022111290 2022-07-11
JP2022194995 2022-12-06
JPJP-P-2022-194995 2022-12-06
PCT/JP2023/025492 WO2024014436A1 (ja) 2022-07-11 2023-07-10 ワニス及びその硬化体

Publications (1)

Publication Number Publication Date
KR20250029951A true KR20250029951A (ko) 2025-03-05

Family

ID=89536719

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257003481A Pending KR20250029951A (ko) 2022-07-11 2023-07-10 바니시 및 그 경화체

Country Status (5)

Country Link
JP (1) JPWO2024014436A1 (https=)
KR (1) KR20250029951A (https=)
CN (1) CN119343387A (https=)
TW (1) TW202406952A (https=)
WO (1) WO2024014436A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026009775A1 (ja) * 2024-07-03 2026-01-08 デンカ株式会社 共重合体、共重合体を含む組成物およびその硬化体
WO2026009942A1 (ja) * 2024-07-03 2026-01-08 デンカ株式会社 共重合体組成物及び硬化体
JP2026009070A (ja) * 2024-07-03 2026-01-19 デンカ株式会社 有機架橋粒子

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06192392A (ja) 1992-12-24 1994-07-12 Sumitomo Bakelite Co Ltd 低誘電率熱硬化性樹脂組成物
JP2004087639A (ja) 2002-08-26 2004-03-18 Hitachi Ltd 低誘電正接絶縁材料を用いた高周波用電子部品
JP2007217706A (ja) 1998-12-22 2007-08-30 Denki Kagaku Kogyo Kk クロス共重合化オレフィン−スチレン−ジエン共重合体、その製造方法及びその用途
JP2009161743A (ja) 2007-12-10 2009-07-23 Denki Kagaku Kogyo Kk 後硬化性樹脂組成物及びそれを用いた高周波用電気絶縁材料
JP2021112088A (ja) 2020-01-15 2021-08-02 株式会社デンソー 制御装置
JP2021112087A (ja) 2020-01-15 2021-08-02 株式会社デンソー 通信システム
JP2022014599A (ja) 2020-07-07 2022-01-20 国立大学法人 東京大学 延性に優れた高強度鋼

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5336935B2 (ja) * 2009-06-08 2013-11-06 電気化学工業株式会社 高充填樹脂組成物
WO2018159080A1 (ja) * 2017-03-02 2018-09-07 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
JP7465894B2 (ja) * 2019-12-03 2024-04-11 デンカ株式会社 硬化性組成物及びその硬化体
CN118599040A (zh) * 2020-07-15 2024-09-06 电化株式会社 组合物及固化体
CN115667393A (zh) * 2020-09-11 2023-01-31 电化株式会社 组合物及其固化体

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06192392A (ja) 1992-12-24 1994-07-12 Sumitomo Bakelite Co Ltd 低誘電率熱硬化性樹脂組成物
JP2007217706A (ja) 1998-12-22 2007-08-30 Denki Kagaku Kogyo Kk クロス共重合化オレフィン−スチレン−ジエン共重合体、その製造方法及びその用途
JP2004087639A (ja) 2002-08-26 2004-03-18 Hitachi Ltd 低誘電正接絶縁材料を用いた高周波用電子部品
JP2009161743A (ja) 2007-12-10 2009-07-23 Denki Kagaku Kogyo Kk 後硬化性樹脂組成物及びそれを用いた高周波用電気絶縁材料
JP2021112088A (ja) 2020-01-15 2021-08-02 株式会社デンソー 制御装置
JP2021112087A (ja) 2020-01-15 2021-08-02 株式会社デンソー 通信システム
JP2022014599A (ja) 2020-07-07 2022-01-20 国立大学法人 東京大学 延性に優れた高強度鋼

Also Published As

Publication number Publication date
TW202406952A (zh) 2024-02-16
CN119343387A (zh) 2025-01-21
JPWO2024014436A1 (https=) 2024-01-18
WO2024014436A1 (ja) 2024-01-18

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