CN119343387A - 清漆及其固化体 - Google Patents

清漆及其固化体 Download PDF

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Publication number
CN119343387A
CN119343387A CN202380046249.3A CN202380046249A CN119343387A CN 119343387 A CN119343387 A CN 119343387A CN 202380046249 A CN202380046249 A CN 202380046249A CN 119343387 A CN119343387 A CN 119343387A
Authority
CN
China
Prior art keywords
varnish
mass
monomer
aromatic
vinyl compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380046249.3A
Other languages
English (en)
Chinese (zh)
Inventor
荒井亨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Co Ltd filed Critical Denka Co Ltd
Publication of CN119343387A publication Critical patent/CN119343387A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/12—Polymers provided for in subclasses C08C or C08F
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F210/00—Copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond
    • C08F210/02—Ethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02—Monomers containing only one unsaturated aliphatic radical
    • C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/06—Hydrocarbons
    • C08F212/08—Styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/34—Monomers containing two or more unsaturated aliphatic radicals
    • C08F212/36—Divinylbenzene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F255/00—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Paints Or Removers (AREA)
CN202380046249.3A 2022-07-11 2023-07-10 清漆及其固化体 Pending CN119343387A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2022-111290 2022-07-11
JP2022111290 2022-07-11
JP2022-194995 2022-12-06
JP2022194995 2022-12-06
PCT/JP2023/025492 WO2024014436A1 (ja) 2022-07-11 2023-07-10 ワニス及びその硬化体

Publications (1)

Publication Number Publication Date
CN119343387A true CN119343387A (zh) 2025-01-21

Family

ID=89536719

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380046249.3A Pending CN119343387A (zh) 2022-07-11 2023-07-10 清漆及其固化体

Country Status (5)

Country Link
JP (1) JPWO2024014436A1 (https=)
KR (1) KR20250029951A (https=)
CN (1) CN119343387A (https=)
TW (1) TW202406952A (https=)
WO (1) WO2024014436A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026009775A1 (ja) * 2024-07-03 2026-01-08 デンカ株式会社 共重合体、共重合体を含む組成物およびその硬化体
WO2026009942A1 (ja) * 2024-07-03 2026-01-08 デンカ株式会社 共重合体組成物及び硬化体
JP2026009070A (ja) * 2024-07-03 2026-01-19 デンカ株式会社 有機架橋粒子

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2716639B2 (ja) * 1992-12-24 1998-02-18 住友ベークライト株式会社 低誘電率熱硬化性樹脂組成物
US6559234B1 (en) * 1998-12-22 2003-05-06 Denki Kagaku Kogyo Kabushiki Kaisha Cross-copolymerized olefin/styrene/diene copolymer, process for the production of the same and uses thereof
JP3985633B2 (ja) 2002-08-26 2007-10-03 株式会社日立製作所 低誘電正接絶縁材料を用いた高周波用電子部品
JP2009161743A (ja) * 2007-12-10 2009-07-23 Denki Kagaku Kogyo Kk 後硬化性樹脂組成物及びそれを用いた高周波用電気絶縁材料
JP5336935B2 (ja) * 2009-06-08 2013-11-06 電気化学工業株式会社 高充填樹脂組成物
WO2018159080A1 (ja) * 2017-03-02 2018-09-07 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
JP7465894B2 (ja) * 2019-12-03 2024-04-11 デンカ株式会社 硬化性組成物及びその硬化体
JP7294155B2 (ja) 2020-01-15 2023-06-20 株式会社デンソー 制御装置
JP7347224B2 (ja) 2020-01-15 2023-09-20 株式会社デンソー 通信システム
JP7616631B2 (ja) 2020-07-07 2025-01-17 国立大学法人 東京大学 延性に優れた高強度鋼
CN118599040A (zh) * 2020-07-15 2024-09-06 电化株式会社 组合物及固化体
CN115667393A (zh) * 2020-09-11 2023-01-31 电化株式会社 组合物及其固化体

Also Published As

Publication number Publication date
TW202406952A (zh) 2024-02-16
KR20250029951A (ko) 2025-03-05
JPWO2024014436A1 (https=) 2024-01-18
WO2024014436A1 (ja) 2024-01-18

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