TW202406952A - 清漆及其硬化體 - Google Patents

清漆及其硬化體 Download PDF

Info

Publication number
TW202406952A
TW202406952A TW112125852A TW112125852A TW202406952A TW 202406952 A TW202406952 A TW 202406952A TW 112125852 A TW112125852 A TW 112125852A TW 112125852 A TW112125852 A TW 112125852A TW 202406952 A TW202406952 A TW 202406952A
Authority
TW
Taiwan
Prior art keywords
varnish
mass
monomer
aromatic
less
Prior art date
Application number
TW112125852A
Other languages
English (en)
Chinese (zh)
Inventor
荒井亨
Original Assignee
日商電化股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商電化股份有限公司 filed Critical 日商電化股份有限公司
Publication of TW202406952A publication Critical patent/TW202406952A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/12—Polymers provided for in subclasses C08C or C08F
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F210/00—Copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond
    • C08F210/02—Ethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02—Monomers containing only one unsaturated aliphatic radical
    • C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/06—Hydrocarbons
    • C08F212/08—Styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/34—Monomers containing two or more unsaturated aliphatic radicals
    • C08F212/36—Divinylbenzene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F255/00—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Paints Or Removers (AREA)
TW112125852A 2022-07-11 2023-07-11 清漆及其硬化體 TW202406952A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2022-111290 2022-07-11
JP2022111290 2022-07-11
JP2022-194995 2022-12-06
JP2022194995 2022-12-06

Publications (1)

Publication Number Publication Date
TW202406952A true TW202406952A (zh) 2024-02-16

Family

ID=89536719

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112125852A TW202406952A (zh) 2022-07-11 2023-07-11 清漆及其硬化體

Country Status (5)

Country Link
JP (1) JPWO2024014436A1 (https=)
KR (1) KR20250029951A (https=)
CN (1) CN119343387A (https=)
TW (1) TW202406952A (https=)
WO (1) WO2024014436A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026009775A1 (ja) * 2024-07-03 2026-01-08 デンカ株式会社 共重合体、共重合体を含む組成物およびその硬化体
WO2026009942A1 (ja) * 2024-07-03 2026-01-08 デンカ株式会社 共重合体組成物及び硬化体
JP2026009070A (ja) * 2024-07-03 2026-01-19 デンカ株式会社 有機架橋粒子

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2716639B2 (ja) * 1992-12-24 1998-02-18 住友ベークライト株式会社 低誘電率熱硬化性樹脂組成物
US6559234B1 (en) * 1998-12-22 2003-05-06 Denki Kagaku Kogyo Kabushiki Kaisha Cross-copolymerized olefin/styrene/diene copolymer, process for the production of the same and uses thereof
JP3985633B2 (ja) 2002-08-26 2007-10-03 株式会社日立製作所 低誘電正接絶縁材料を用いた高周波用電子部品
JP2009161743A (ja) * 2007-12-10 2009-07-23 Denki Kagaku Kogyo Kk 後硬化性樹脂組成物及びそれを用いた高周波用電気絶縁材料
JP5336935B2 (ja) * 2009-06-08 2013-11-06 電気化学工業株式会社 高充填樹脂組成物
WO2018159080A1 (ja) * 2017-03-02 2018-09-07 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
JP7465894B2 (ja) * 2019-12-03 2024-04-11 デンカ株式会社 硬化性組成物及びその硬化体
JP7294155B2 (ja) 2020-01-15 2023-06-20 株式会社デンソー 制御装置
JP7347224B2 (ja) 2020-01-15 2023-09-20 株式会社デンソー 通信システム
JP7616631B2 (ja) 2020-07-07 2025-01-17 国立大学法人 東京大学 延性に優れた高強度鋼
CN118599040A (zh) * 2020-07-15 2024-09-06 电化株式会社 组合物及固化体
CN115667393A (zh) * 2020-09-11 2023-01-31 电化株式会社 组合物及其固化体

Also Published As

Publication number Publication date
CN119343387A (zh) 2025-01-21
KR20250029951A (ko) 2025-03-05
JPWO2024014436A1 (https=) 2024-01-18
WO2024014436A1 (ja) 2024-01-18

Similar Documents

Publication Publication Date Title
JP7569392B2 (ja) 組成物及び硬化体
TW202406952A (zh) 清漆及其硬化體
JP7652996B2 (ja) 共重合体、その製造方法及び共重合体を含む硬化体
JP7627379B2 (ja) 共重合体、組成物、ワニス、及びそれらの硬化体
JP7664498B1 (ja) 未硬化シート及びその硬化体
TWI864457B (zh) 包含絕緣層之多層構造體
TW202502847A (zh) 化合物、共聚物、組合物、清漆、及其等之硬化體
TW202442711A (zh) 硬化性組合物及其硬化體
TW202442712A (zh) 硬化性組合物及其硬化體
TW202517695A (zh) 組合物及其硬化體
TW202605080A (zh) 清漆、硬化體、電氣絕緣材料、ccl基板、fccl基板、層間絕緣層及層間接著層
WO2025258655A1 (ja) オレフィン－芳香族ビニル化合物－芳香族ポリエン共重合体及びその製造方法、当該共重合体を含有する組成物、並びにこれらの硬化体
TW202604989A (zh) 樹脂組成物、硬化體以及其製造方法
TW202348707A (zh) 組合物
JP2026008903A (ja) 共重合体、共重合体を含む組成物およびその硬化体