WO2021218629A1 - 显示基板以及显示装置 - Google Patents

显示基板以及显示装置 Download PDF

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Publication number
WO2021218629A1
WO2021218629A1 PCT/CN2021/086959 CN2021086959W WO2021218629A1 WO 2021218629 A1 WO2021218629 A1 WO 2021218629A1 CN 2021086959 W CN2021086959 W CN 2021086959W WO 2021218629 A1 WO2021218629 A1 WO 2021218629A1
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Prior art keywords
layer
light
filter
display substrate
filter layer
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PCT/CN2021/086959
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English (en)
French (fr)
Inventor
王云浩
李�杰
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京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Priority to US17/630,334 priority Critical patent/US20230059728A1/en
Publication of WO2021218629A1 publication Critical patent/WO2021218629A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens

Definitions

  • the present disclosure generally relates to the field of display technology, and in particular, to a display substrate and a display device.
  • the OLED display has the characteristics of lightness, thinness, and long life, and has become a commonly used display type.
  • the display substrate mainly includes a driving backplane, a light-emitting device arranged on the driving backplane, and an encapsulation layer for packaging the light-emitting device.
  • a filter structure can be provided on the encapsulation layer to convert the light emitted by the light-emitting device into red and red light. Monochromatic light such as green and blue can realize its color display.
  • the filter structure can also play a role in preventing the surface of the display substrate from reflecting ambient light. Therefore, the quality of the filter structure will directly affect the display effect, such as the color shift caused by the filter structure. Therefore, improving the design of the filter structure is a technical problem to be solved urgently.
  • a display substrate including:
  • a light-emitting structure located on the driving backplane, including a plurality of light-emitting devices
  • the filter structure is located on the side of the light emitting structure away from the drive backplane, the filter structure includes a plurality of filter layers corresponding to at least part of the light emitting device, and the filter layer has a hollow spherical structure And the filter layer has a hollow fan shape in a cross section perpendicular to the driving back plate, and the filter layer has a uniform thickness along the divergence direction of the spherical center of the hollow spherical structure.
  • the orthographic projection of the filter layer on the driving backplane completely covers the corresponding light-emitting device, and the light-emitting device is located at the center of the hollow spherical structure of the filter layer.
  • the filter structure further includes: an insulating layer on a side of the filter layer facing the light emitting structure;
  • the surface of the insulating layer in contact with the filter layer includes a plurality of first recesses and a plurality of first protrusions located in each of the first recesses;
  • the filter layer is located in the first recess.
  • the height of the first protrusion is smaller than the depth of the first recess.
  • the top of the filter layer on the side away from the driving backplane protrudes from the surface of the insulating layer on the side away from the driving backplane.
  • the filter structure further includes: a flat layer on a side of the filter layer away from the insulating layer, and a surface of the flat layer in contact with the filter layer has a surface that is in contact with the filter layer.
  • the layer corresponds to the depression set.
  • the filter structure further includes a light shielding layer, and the orthographic projection of the light shielding layer on the drive backplane covers the area between the filter layers.
  • the display substrate further includes:
  • a touch structure located on a side of the light emitting structure away from the drive backplane includes touch electrodes and bridge electrodes, and the touch electrodes are located between the insulating layer and the flat layer,
  • the bridge electrode is located between the insulating layer and the light emitting structure, and the bridge electrode is electrically connected to the touch electrode through a via hole penetrating the insulating layer.
  • the orthographic projections of the touch electrodes and the bridge electrodes on the drive backplane do not overlap with the filter layer, and fall into the light shielding layer on the drive backplane. Within the range of orthographic projection.
  • the surface of the flat layer facing away from the filter layer includes a plurality of second recesses; the light shielding layer is located in the second recesses, and the light shielding layer is away from the filter layer The surface of one side is flush with the surface of the flat layer facing away from the filter layer.
  • an embodiment of the present disclosure provides a display device, including the above-mentioned display substrate provided by the embodiment of the present disclosure.
  • FIG. 1 shows an exemplary structure diagram of a display substrate in the related art
  • FIG. 2 shows an exemplary structural schematic diagram of a display substrate provided by an embodiment of the present disclosure
  • FIG. 3 shows an exemplary flow chart of a manufacturing method of a display substrate provided by an embodiment of the present disclosure
  • FIG. 1 shows a schematic diagram of the structure of a display substrate in the related art.
  • the display substrate includes a substrate 101, a driving circuit 102, a light emitting device 103, an encapsulation layer 104, a buffer layer 105, a passivation layer 106, and a filter structure.
  • the filter structure includes an insulating layer 107, a filter layer 121, and a flat layer 108.
  • the filter layer 121 adopts a flat structure. At this time, the optical path length of the light emitted by the light emitting device 103 in the filter layer 121 is different, that is, the optical path gradually becomes longer from the center of the filter layer 121 to both sides, and this structure is likely to cause color shift.
  • a touch structure is added between the encapsulation layer 104 and the filter structure, which specifically includes a bridge electrode 131 and a touch electrode 132, which are electrically connected through a via 133 in the passivation layer 106.
  • the structure shown in FIG. 1 not only increases the thickness of the display substrate, but also increases the complexity of the process.
  • the present disclosure provides the following technical solutions.
  • a display substrate provided by an embodiment of the present disclosure includes: a substrate 101, a driving circuit 102, a light emitting device 103, an encapsulation layer 104, a buffer layer 105, and a filter structure.
  • the filter structure includes an insulating layer 107, The filter layer 121 and the flat layer 108.
  • the substrate 101 and the driving circuit 102 can be considered to constitute a driving backplane, and the light emitting device 103 and the encapsulation layer 104 can be considered to constitute a light emitting structure.
  • the filter layer 121 is provided corresponding to at least part of the light-emitting device 103. In specific implementation, a filter layer 121 may be provided for each light-emitting device 103.
  • the filter layer 121 has a hollow spherical structure, and the filter layer 121 is perpendicular to The cross section of the driving backplane is in the shape of a hollow sector. As shown in FIG. 2, the thickness of the filter layer 121 along the divergence direction of the spherical center of the hollow spherical structure is uniform, so that the light emitted by the light emitting device 103 is formed in the filter layer. The length of the light path is the same, which eliminates the color cast problem and improves the display quality.
  • the driving circuit 102 includes a plurality of thin film transistors for driving the pixel unit.
  • the filter layer 121 is arranged above the corresponding light emitting device 103, that is, the red filter layer 121 is arranged above the red light emitting device 103.
  • the green filter layer 121 is disposed above the green light-emitting device 103, and the blue filter layer 121 is disposed above the blue light-emitting device 103.
  • different hatch patterns are used to represent different colors.
  • the orthographic projection of the filter layer 121 on the driving backplane completely covers the corresponding light-emitting device 103, and the light-emitting device 103 is located at the center of the hollow spherical structure of the filter layer 121.
  • the display substrate in FIG. 2 has been magnified for each film layer.
  • the thickness of each film layer is in the micron level or even in the nanometer level. Therefore, the light-emitting device 103 to the filter layer 121 The thickness is very thin, and by adjusting the corresponding size of the hollow spherical structure, each light-emitting device 103 can be located at the center of the corresponding hollow spherical structure.
  • the hollow spherical structure of the filter layer 121 is generally not larger than a hemisphere.
  • the insulating layer 107 is away from the substrate.
  • the surface on the side 101 includes a plurality of first recesses 107-1 and a plurality of first protrusions 107-2 located in each of the first recesses 107-1, and the filter layer 121 is located in the first recess 107-1 of the insulating layer .
  • the first protrusion 107-2 may be disposed at the center of the first recess 107-1, the hollow 121-2 in the hollow spherical structure of the filter layer 121 and the first insulating layer
  • the protrusions 107-2 are correspondingly arranged, that is, the first protrusions 107-2 of the insulating layer 107 are filled in the hollow 121-2 in the hollow spherical structure of the filter layer 121, and are in direct contact with the hollow spherical structure.
  • the bottom 121-1 in the hollow spherical structure of the filter layer 121 is arranged in the first recess 107-1 around the first protrusion 107-2.
  • the height of the first protrusion 107-2 is generally smaller than the depth of the first recess 107-1, that is, the top of the first protrusion 107-2 does not protrude from the surface of the insulating layer 107.
  • the structure of providing the first recess 107-1 and the first protrusion 107-2 on the insulating layer 107 can simplify the manufacturing process of the hollow spherical structure.
  • FIG. 6 after the patterns of the first recesses 107-1 and the first protrusions 107-2 are formed on the insulating layer 107, as shown in FIG. 8, the required hollow balls are formed by a mask exposure process.
  • the filter layer 121 lacks a structure.
  • the hollow 121-2 of the filter layer 121 is filled with the first protrusion 107-2, and the bottom of the filter layer 121 is respectively located at the first protrusion 107-2 around the first protrusion 107-2.
  • the depression 107-1 It should be noted that the depth of the first recess 107-1 can be set according to actual applications, and can be deep or shallow, and is not limited here.
  • the filter layer 121 further includes a top part 121-3.
  • the position of the upper top 121-3 is higher than the upper surface of the insulating layer 107 and is exposed on the upper surface of the insulating layer 107, that is, the top 121-3 of the filter layer 121 on the side away from the driving backplane protrudes from the insulating layer 107 away from the driving backplane
  • the thickness of the filter layer 121 is not limited by the thickness of the insulating layer 107.
  • a flat layer 108 needs to be provided.
  • the surface of the flat layer 108 in contact with the filter layer 107 has recesses corresponding to the filter layer, that is, the flat layer 108 is close to the filter layer.
  • the surface of the layer 121 is uneven, and is provided with a plurality of depressions and protrusions (not shown in the figure). The depressions are arranged corresponding to the filter layer 121, and the protrusions are arranged between the filter layers 121.
  • the filter structure may further include a light shielding layer 122, and the orthographic projection of the light shielding layer 122 on the driving backplane covers the area between the filter layers 121.
  • the display substrate further includes a touch structure including a touch electrode 132, a bridge electrode 131, and a via 133 located in the insulating layer 107, and the via 133 is used to electrically connect the touch electrode 132 and a bridge electrode 131.
  • the touch electrode 132 is located between the insulating layer 107 and the flat layer 108, and the bridge electrode 131 is located between the buffer layer 105 and the insulating layer 107.
  • the orthographic projection of the touch electrode 132 and the bridge electrode 131 on the driving backplane and the filter layer 121 do not overlap each other, and fall within the orthographic projection range of the light shielding layer 122 on the driving backplane.
  • the capacitive sensing type touch structure is widely used due to its advantages such as low cost, multi-touch capability and fast response speed.
  • the capacitance change at the position of the touch electrode is measured to determine the specific touch position on the display substrate.
  • the touch structure provided by the embodiment of the present disclosure is compared with the touch structure in FIG. 1. The difference is that the position of the touch structure provided by the embodiment of the present disclosure shown in FIG. 2 has changed.
  • the touch electrode 132 in FIG. 1 is disposed on the passivation layer 106, and the touch electrode 132 in FIG. 2 is disposed on the insulating layer 107; the bridge electrode 131 in FIG. 1 and the bridge electrode 131 in FIG. 2 are both disposed on On the buffer layer 105.
  • Such an arrangement allows the display substrate structure shown in FIG. 2 to remove the passivation layer 106 added to provide the touch structure, thereby saving the cost of the film and also playing a role in thinning.
  • the distribution of the touch electrodes 132 and the bridge electrodes 131 is not limited, and they can be arranged according to application requirements.
  • the surface of the flat layer 108 on the side facing away from the filter layer 107 may include a plurality of second recesses 108-1 and a plurality of second recesses 108-1 located between the second recesses 108-1.
  • the two protrusions 108-2 and the second recess 108-1 are located between the filter layers 121, so that the light shielding layer 122 is placed, that is, the light shielding layer 122 is located in the second recess 108-1.
  • the surface of the light shielding layer 122 facing away from the filter layer 121 is flush with the surface of the flat layer 108 facing away from the filter layer 121.
  • the above arrangement of the light shielding layer 122 enables the light shielding layer 122 to better absorb external light for shielding.
  • the light-shielding layer 122 in FIG. 1 is disposed inside the flat layer. Compared with the light-shielding layer method in FIG. 2, the flat layer 108 on the top of the light-shielding layer 122 in FIG. 1 will reflect part of external light. Therefore, the display substrate of the present disclosure reduces the reflected light of the flat layer 108 and improves the display quality.
  • the present disclosure also provides a display device, including the display substrate provided by each embodiment of the present disclosure.
  • the present disclosure also provides a method for manufacturing a display substrate. Please refer to FIG. 3.
  • the method includes the following steps:
  • Step S101 sequentially forming a driving circuit, a light emitting device, an encapsulation layer and a buffer layer on a substrate;
  • Step S102 forming a patterned bridge electrode on the buffer layer
  • Step S103 forming an insulating layer, and forming patterns of patterned via holes and first recesses and first protrusions;
  • Step S104 forming patterned touch electrodes
  • Step S105 forming a patterned filter layer
  • Step S106 forming a patterned flat layer.
  • step S101 as shown in FIG. 4, a driver circuit 102, a light emitting device 103, an encapsulation layer 104, and a buffer layer 105 are sequentially formed on the substrate 101, which are stacked.
  • a patterned bridge electrode 131 is formed on the buffer layer 105.
  • the bridge electrode 131 can be made of a metal material, and the thickness is usually between 1500 angstroms and 3000 angstroms.
  • step S103 as shown in FIG. 6, an insulating layer 107 is formed on the buffer layer 105, and a pattern of via holes 133, first recesses 107-1 and first protrusions 107-2 are formed through a mask process.
  • the via 133 is used to connect the bridge electrode 131 and the touch electrode 132.
  • the thickness of the insulating layer 105 is between 1.2-2.5 microns.
  • a patterned touch electrode 132 is formed on the insulating layer 107.
  • the touch electrode 132 may be made of a metal material, and the thickness is usually between 3000 angstroms and 5000 angstroms.
  • step S105 as shown in FIG. 8, for the display substrate of the three primary colors, the filter layer 12 of the corresponding color can be formed through three masking processes, and the thickness of the filter layer 12 is between 1.2-2.5 micrometers.
  • step S106 as shown in FIG. 9, on the filter layer 122, a flat layer 108 covering the entire display substrate is formed.
  • the thickness of the flat layer 108 is between 1.2-2.5 microns.
  • the manufacturing method of the display substrate further includes forming a patterned second recess 108-1 as shown in FIG. 10 on the flat layer 108, and forming a second recess 108-1 in the second recess 108-
  • the light shielding layer 122 shown in FIG. 2 is formed at one place.
  • the upper surface of the light shielding layer 122 and the upper surface of the flat layer 108 are arranged on the same plane.

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Abstract

本公开提供了一种显示基板以及显示装置。该显示基板包括：驱动背板，位于驱动背板之上的发光结构，包括多个发光器件，位于发光结构背离驱动背板一侧的滤光结构，滤光结构包括与至少部分发光器件对应的多个滤光层，滤光层具有空心球缺结构，且滤光层在垂直于驱动背板的截面为空心扇形形状，滤光层在沿着空心球缺结构的球心发散方向上的厚度均匀，通过将滤光层设计成空心球缺结构，能够解决某些滤光层引起的色偏问题。

Description

显示基板以及显示装置
相关申请的交叉引用
本公开要求在2020年04月27日提交中国专利局、申请号为202010344719.2、申请名称为“显示基板以及显示装置”的中国专利申请的优先权，其全部内容通过引用结合在本公开中。
技术领域
本公开一般涉及显示技术领域，尤其涉及一种显示基板以及显示装置。
背景技术
OLED显示具有轻薄化、寿命长等特点，已经成为人们常用的显示类型。显示基板主要包括驱动背板，设置在驱动背板上的发光器件，以及封装发光器件的封装层等，在封装层上可以设置滤光结构，用以将发光器件发出的光分别转化为红、绿、蓝等单色光，从而实现其彩色显示，另一方面滤光结构还可以起到防止显示基板的表面反射环境光的作用。因此，滤光结构的优良将直接影响显示效果，例如滤光结构引起的色偏问题等。因此改善滤光结构的设计是亟待解决的技术问题。
发明内容
第一方面，本公开实施例提供了一种显示基板，包括：
驱动背板；
发光结构，位于所述驱动背板之上，包括多个发光器件；
滤光结构，位于所述发光结构背离所述驱动背板的一侧，所述滤光结构包括与至少部分所述发光器件对应的多个滤光层，所述滤光层具有空心球缺结构，且所述滤光层在垂直于所述驱动背板的截面为空心扇形形状，所述滤光层在沿着所述空心球缺结构的球心发散方向上的厚度均匀。
在一些实施例中，所述滤光层在所述驱动背板上的正投影完全覆盖对应的所述发光器件，所述发光器件位于所述滤光层的空心球缺结构的球心位置。在一些实施例中，所述滤光结构还包括：位于所述滤光层面向所述发光结构一侧的绝缘层；
所述绝缘层与所述滤光层接触的表面包括复数个第一凹陷和位于各所述第一凹陷内的复数个第一凸起；
所述滤光层位于所述第一凹陷内。
在一些实施例中，所述第一凸起的高度小于所述第一凹陷的深度。
在一些实施例中，所述滤光层远离所述驱动背板一侧的顶部凸出于所述绝缘层背离所述驱动背板一侧的表面。
在一些实施例中，所述滤光结构还包括：位于所述滤光层背离所述绝缘层一侧的平坦层，所述平坦层与所述滤光层接触的表面具有与所述滤光层对应设置的凹陷。
在一些实施例中，所述滤光结构还包括：遮光层，所述遮光层在所述驱动背板上的正投影覆盖所述滤光层之间的区域。
在一些实施例中，该显示基板还包括：
触控结构，位于所述发光结构背离所述驱动背板的一侧，所述触控结构包括触控电极和桥电极，所述触控电极位于所述绝缘层与所述平坦层之间，所述桥电极位于所述绝缘层与所述发光结构之间，所述桥电极通过贯穿所述绝缘层的过孔与所述触控电极电连接。
在一些实施例中，所述触控电极和桥电极在所述驱动背板上的正投影与所述滤光层互不交叠，且落入所述遮光层在所述驱动背板上的正投影范围内。
在一些实施例中，所述平坦层背离所述滤光层一侧的表面包括复数个第二凹陷；所述遮光层位于所述第二凹陷内，且所述遮光层背离所述滤光层一侧的表面与所述平坦层背离所述滤光层一侧的表面齐平。
第二方面，本公开实施例提供了一种显示装置，包括本公开实施例提供的上述显示基板。
附图说明
图1示出了相关技术中的一种显示基板的示例性结构示意图；
图2示出了本公开实施例提供的显示基板的示例性结构示意图；
图3示出了本公开实施例提供的显示基板的制造方法的示例性流程图；
图4至图10分别示出了图3中显示基板的制造方法的各步骤执行后的具体示例性结构示意图。
具体实施方式
下面结合附图和实施例对本公开作进一步的详细说明。可以理解的是，此处所描述的具体实施例仅仅用于解释相关发明，而非对该发明的限定。另外还需要说明的是，为了便于描述，附图中仅示出了与发明相关的部分。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
需要说明的是，在不冲突的情况下，本公开中的实施例及实施例中的特征可以相互组合。下面将参考附图并结合实施例来详细说明本公开。
请参考图1，给出一种相关技术中的显示基板的结构示意图。显示基板包括衬底101、驱动电路102、发光器件103、封装层104、缓冲层105、钝化层106和滤光结构，其中滤光结构包括绝缘层107、滤光层121和平坦层108，滤光层121采用平板结构。此时，发光器件103发射的光在滤光层121中的光路长短不同，即光路从滤光层121的中心到两边逐渐变长，此结构容易造 成色偏。另外，为了实现触控功能，在封装层104和滤光结构之间增加触控结构，具体包括桥电极131和触控电极132，两者通过钝化层106中的过孔133电连接。图1示出的结构不仅增加了显示基板的厚度，还增加了工艺的复杂度。
为了获得具有良好的显示质量的薄型显示基板，本公开提供如下技术方案。
请参考图2，本公开实施例提供的一种显示基板包括：衬底101、驱动电路102、发光器件103、封装层104、缓冲层105和滤光结构，其中滤光结构包括绝缘层107、滤光层121和平坦层108。衬底101和驱动电路102可以认为组成驱动背板，发光器件103和封装层104可以认为组成发光结构。滤光层121与至少部分发光器件103对应设置，在具体实施时，可以对每个发光器件103均设置滤光层121，滤光层121具有空心球缺结构，且滤光层121在垂直于驱动背板的截面为空心扇形形状，如图2所示，滤光层121在沿着空心球缺结构的球心发散方向上的厚度均匀，使得发光器件103发射的光在滤光层内形成的光路长短相同，消除了色偏问题，提高了显示质量。需要说明的是，驱动电路102包括用于驱动像素单元的多个薄膜晶体管。
具体地，对于如图2所示示例的具有RGB三基色的显示基板而言，将滤光层121设置在对应的发光器件103的上方，即红色滤光层121设置在红色发光器件103的上方，绿色滤光层121设置在绿色发光器件103的上方，蓝色滤光层121设置在蓝色发光器件103的上方。图2中采用不同的图案填充图案表示不同的颜色。滤光层121和发光器件103的填充图案相同时，表示颜色相同。
在一些实施例中，滤光层121在驱动背板上的正投影完全覆盖对应的发光器件103，发光器件103位于滤光层121的空心球缺结构的球心位置。需要说明的是，图2中的显示基板为了表示清楚，将各膜层进行了放大，实际上各膜层的厚度在微米级，甚至在纳米级的厚度，因此发光器件103到滤光层121的厚度非常薄，通过调整空心球缺结构的相应尺寸就可以实现各发光器件 103位于对应的空心球缺结构的球心处。值得注意的是，为了对发光器件103发出的光线进行有效滤光，滤光层121的空心球缺结构一般不大于半球。
在一些实施例中，如图2和图7所示，为了制作滤光层121的空心球缺结构，需要绝缘层107与滤光层121接触的表面制作相应结构，例如绝缘层107远离衬底101一侧的表面包括复数个第一凹陷107-1和位于各第一凹陷107-1内的复数个第一凸起107-2，滤光层121位于绝缘层的第一凹陷107-1内。通过对绝缘层107表面的构图，以便于在其上制作相应形状的滤光层121。
具体地，如图2所示，第一凸起107-2可以设置在第一凹陷107-1的中心位置，滤光层121的空心球缺结构中的空心121-2与绝缘层的第一凸起107-2对应设置，即绝缘层107的第一凸起107-2填充在滤光层121的空心球缺结构中的空心121-2中，且与空心球缺结构直接接触。滤光层121的空心球缺结构中的底部121-1设置在第一凸起107-2周围的第一凹陷107-1内。如图2所示，第一凸起107-2的高度一般小于第一凹陷107-1的深度，即第一凸起107-2的顶部不会凸出于绝缘层107的表面。
在绝缘层107上设置第一凹陷107-1和第一凸起107-2的结构可以简化空心球缺结构的制作工艺。如图6所示，在绝缘层107上，形成第一凹陷107-1和第一凸起107-2的图案后，如图8所示，之后通过掩模曝光工艺形成所需的具有空心球缺结构的滤光层121，此时，滤光层121的空心121-2被第一凸起107-2填充，滤光层121的底部分别位于该第一凸起107-2周围的第一凹陷107-1内。需要说明的是，第一凹陷107-1的深度，可根据实际应用设定，可深可浅，这里不做限定。
在一些实施例中，如图2所示，滤光层121还包括顶部121-3，滤光层121的远离衬底101一侧的顶部121-3露出在绝缘层107的上表面外，纵向上顶部121-3的位置高出绝缘层107上表面，露出在绝缘层107的上表面，即滤光层121远离驱动背板一侧的顶部121-3凸出于绝缘层107背离驱动背板一侧的表面，使滤光层121的厚度不受绝缘层107的厚度限制。
在一些实施例中，由于滤光层121的顶部不平整，需要设置平坦层108， 平坦层108与滤光层107接触的表面具有与滤光层对应设置的凹陷，即平坦层108靠近滤光层121的表面不平，设置有多个凹陷和凸起(图中未标出)，凹陷与滤光层121对应设置，凸起设置在各滤光层121之间。
在一些实施例中，滤光结构还可以包括：遮光层122，遮光层122在驱动背板上的正投影覆盖滤光层121之间的区域。
在一些实施例中，该显示基板还包括触控结构，该触控结构包括触控电极132、桥电极131和位于绝缘层107内的过孔133，该过孔133用于电连接触控电极132和桥电极131，触控电极132位于绝缘层107与平坦层108之间，桥电极131位于缓冲层105与绝缘层107之间。触控电极132和桥电极131在驱动背板上的正投影与滤光层121互不交叠，且落入遮光层122在驱动背板上的正投影范围内。
电容感应式的触控结构由于成本低、能够实现多点触控且反应速度快等优点，而得到广泛的应用。通过搭桥设计，测量触控电极位置上的电容变化量，确定显示基板上的具体触摸位置。本公开实施例提供的触控结构与图1中的触控结构相比较，区别在于，图2所示的本公开实施例提供的触控结构的位置发生了变化。图1中的触控电极132设置在钝化层106上，而图2中的触控电极132设置在绝缘层107上；图1中的桥电极131和图2中的桥电极131均设置在缓冲层105上。这样的设置，使得图2示出的显示基板结构可以去掉为了设置触控结构而增设的钝化层106，从而节省了膜层成本，也起到了薄型化的作用。其中，触控电极132以及桥电极131的分布不做限定，可以根据应用需要进行相应排布。
请参考图2和图10，在一些实施例中，平坦层108背离滤光层107一侧的表面可以包括复数个第二凹陷108-1和复数个位于第二凹陷108-1之间的第二凸起108-2，第二凹陷108-1位于滤光层121之间，以便放置遮光层122，即遮光层122位于第二凹陷108-1内。遮光层122背离滤光层121一侧的表面与平坦层108背离滤光层121一侧的表面齐平。遮光层122的上述设置方式，使得遮光层122能够更好地吸收外部光线进行遮挡。而图1的遮光层122设 置在平坦层内部，相对图2的遮光层方式，图1的遮光层122上部的平坦层108将反射部分外部光线。因此，本公开的显示基板减少了平坦层108的反射光线，改善了显示质量。
本公开还提供了一种显示装置，包括本公开各实施例所提供的显示基板。
本公开还提供了一种显示基板的制造方法，请参考图3，该方法包括如下步骤：
步骤S101：依次在衬底上形成驱动电路、发光器件、封装层和缓冲层；
步骤S102：在缓冲层上形成图案化的桥电极；
步骤S103：形成绝缘层，并形成图案化的过孔和第一凹陷和第一凸起的图案；
步骤S104：形成图案化的触控电极；
步骤S105：形成图案化的滤光层；
步骤S106：形成图案化的平坦层。
下面结合图4至图9进行说明上述制造方法中的各步骤。
在步骤S101，如图4所示，依次在衬底101上形成层叠设置的驱动电路102、发光器件103、封装层104和缓冲层105。
在步骤S102，如图5所示，在缓冲层105上形成图案化的桥电极131，桥电极131可采用金属材料制造，厚度通常在1500埃米-3000埃米之间。
在步骤S103：如图6所示，在缓冲层105上形成绝缘层107，并通过掩模工艺形成过孔133和第一凹陷107-1和第一凸起107-2的图案。过孔133用于连接桥电极131和触摸电极132。其中，绝缘层105的厚度在1.2-2.5微米之间。
在步骤S104：如图7所示，在绝缘层107上形成图案化的触控电极132，该触控电极132可采用金属材料，厚度通常在3000埃米-5000埃米之间。
在步骤S105：如图8所示，对于三基色的显示基板而言，可通过三道掩模工艺形成对应颜色的滤光层12，滤光层12的厚度在1.2-2.5微米之间。
在步骤S106：如图9所示，在滤光层122之上，形成覆盖整个显示基板 的平坦层108。平坦层108的厚度在1.2-2.5微米之间。
请参考图10和图2，在一些实施例中，显示基板的制造方法还包括在平坦层108上形成图案化的如图10所示的第二凹陷108-1，并在第二凹陷108-1处形成如图2所示的遮光层122。该遮光层122的上表面与平坦层108的上表面设置在同一平面上。
以上描述仅为本公开的较佳实施例以及对所运用技术原理的说明。本领域技术人员应当理解，本公开中所涉及的发明范围，并不限于上述技术特征的特定组合而成的技术方案，同时也应涵盖在不脱离所述发明构思的情况下，由上述技术特征或其等同特征进行任意组合而形成的其它技术方案。例如上述特征与本公开中公开的(但不限于)具有类似功能的技术特征进行互相替换而形成的技术方案。

Claims (11)

  1. 一种显示基板，其中，包括：
    驱动背板；
    发光结构，位于所述驱动背板之上，包括多个发光器件；
    滤光结构，位于所述发光结构背离所述驱动背板的一侧，所述滤光结构包括与至少部分所述发光器件对应的多个滤光层，所述滤光层具有空心球缺结构，且所述滤光层在垂直于所述驱动背板的截面为空心扇形形状，所述滤光层在沿着所述空心球缺结构的球心发散方向上的厚度均匀。
  2. 根据权利要求1所述的显示基板，其中，所述滤光层在所述驱动背板上的正投影完全覆盖对应的所述发光器件，所述发光器件位于所述滤光层的空心球缺结构的球心位置。
  3. 根据权利要求1所述的显示基板，其中，所述滤光结构还包括：位于所述滤光层面向所述发光结构一侧的绝缘层；
    所述绝缘层与所述滤光层接触的表面包括复数个第一凹陷和位于各所述第一凹陷内的复数个第一凸起；
    所述滤光层位于所述第一凹陷内。
  4. 根据权利要求3所述的显示基板，其中，所述第一凸起的高度小于所述第一凹陷的深度。
  5. 根据权利要求4所述的显示基板，其中，所述滤光层远离所述驱动背板一侧的顶部凸出于所述绝缘层背离所述驱动背板一侧的表面。
  6. 根据权利要求5所述的显示基板，其中，所述滤光结构还包括：位于所述滤光层背离所述绝缘层一侧的平坦层，所述平坦层与所述滤光层接触的表面具有与所述滤光层对应设置的凹陷。
  7. 根据权利要求6所述的显示基板，其中，所述滤光结构还包括：遮光层，所述遮光层在所述驱动背板上的正投影覆盖所述滤光层之间的区域。
  8. 根据权利要求7所述的显示基板，其中，该显示基板还包括：
    触控结构，位于所述发光结构背离所述驱动背板的一侧，所述触控结构包括触控电极和桥电极，所述触控电极位于所述绝缘层与所述平坦层之间，所述桥电极位于所述绝缘层与所述发光结构之间，所述桥电极通过贯穿所述绝缘层的过孔与所述触控电极电连接。
  9. 根据权利要求8所述的显示基板，其中，所述触控电极和桥电极在所述驱动背板上的正投影与所述滤光层互不交叠，且落入所述遮光层在所述驱动背板上的正投影范围内。
  10. 根据权利要求9所述的显示基板，其中，所述平坦层背离所述滤光层一侧的表面包括复数个第二凹陷；所述遮光层位于所述第二凹陷内，且所述遮光层背离所述滤光层一侧的表面与所述平坦层背离所述滤光层一侧的表面齐平。
  11. 一种显示装置，其中，包括如权利要求1至10任一项所述的显示基板。
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