WO2021082485A1 - Procédé de conception de pastilles de carte de circuit imprimé, dispositif et milieu - Google Patents

Procédé de conception de pastilles de carte de circuit imprimé, dispositif et milieu Download PDF

Info

Publication number
WO2021082485A1
WO2021082485A1 PCT/CN2020/098405 CN2020098405W WO2021082485A1 WO 2021082485 A1 WO2021082485 A1 WO 2021082485A1 CN 2020098405 W CN2020098405 W CN 2020098405W WO 2021082485 A1 WO2021082485 A1 WO 2021082485A1
Authority
WO
WIPO (PCT)
Prior art keywords
size
pcb board
layer
pyramid
shaped
Prior art date
Application number
PCT/CN2020/098405
Other languages
English (en)
Chinese (zh)
Inventor
杨才坤
Original Assignee
苏州浪潮智能科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 苏州浪潮智能科技有限公司 filed Critical 苏州浪潮智能科技有限公司
Priority to US17/772,946 priority Critical patent/US20220377905A1/en
Publication of WO2021082485A1 publication Critical patent/WO2021082485A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/182—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by the machine tool function, e.g. thread cutting, cam making, tool direction control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45035—Printed circuit boards, also holes to be drilled in a plate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09481—Via in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to the field of PCBs, and more specifically, to a method, equipment and readable medium for designing PCB pads.
  • PCB pad design In the process of wave soldering device PCB pad design, it is usually designed according to the device pin size.
  • the diameter of the through hole of the pad is the device pin size diameter + 0.2 ⁇ 0.4mm, as shown in Figure 1.
  • the size of the surface pad is the diameter of the through hole +0.4 ⁇ 0.6mm, as shown in Figure 2.
  • the purpose of the embodiments of the present invention is to provide a method, equipment and medium for designing PCB pads.
  • the amount of tin creep in the hole can be maximized, and the top surface solder can be prevented.
  • Excessive overflow causes continuous soldering on the top surface, which can avoid problems such as insufficient tin on the wave soldering device, false soldering, and false soldering, and can also increase the current carrying capacity of the inner power supply.
  • one aspect of the embodiments of the present invention provides a method for designing PCB pads, including the following steps: using a first size drill bit to drill through the PCB board from the first side; The second side of the PCB board is back drilled to form a pyramid-shaped through hole; the connection mode of the second layer and the third layer of the inner layer of the PCB board including the pyramid-shaped through hole is set to be fully connected; and A pad of a third size is provided on the first layer of the inner layer, and a pad of a fourth size is provided on the last layer of the inner layer, wherein the fourth size is greater than the third size, and the The fourth size is larger than the second size, the second size is larger than the first size, and the third size is larger than the first size.
  • using a drill bit of the first size to drill through the PCB board from the first side includes: using a drill bit of the first size to drill through the PCB board perpendicular to the first side of the PCB board, and The first size is larger than the size of the pin of the device to be soldered.
  • using a drill of the second size to back drill on the second side of the PCB board to form a pyramid-shaped through hole includes: using a drill of the second size to back drill on the second side of the PCB board. Drill to half the thickness of the PCB board to form a pyramid-shaped through hole.
  • back-drilling the second side of the PCB board with a drill bit of the second size to form a pyramid-shaped through hole further includes: electroplating copper in the pyramid-shaped through hole.
  • the arranging a pad of a third size on the first layer of the inner layer further includes: judging whether the first layer of the inner layer of the PCB board including the pyramid-shaped through holes can be used Fully connected; and in response to the first layer of the inner layer of the PCB board including the pyramid-shaped through holes being unable to be fully connected, the first layer is set as a flower pad connection.
  • a computer device including: at least one processor; and a memory.
  • the memory stores computer instructions that can run on the processor, and the instructions are executed by the processor to implement the following steps: Use a drill bit of the first size to drill through the PCB board from the first side; use a drill bit of the second size to back drill on the second side of the PCB board to form a pyramid-shaped through hole;
  • the connection mode of the second layer and the third layer of the inner layer of the board is set to be fully connected; and a third-size pad is arranged on the first layer of the inner layer, and the last layer of the inner layer is arranged
  • a pad of a fourth size wherein the fourth size is greater than the third size, the fourth size is greater than the second size, the second size is greater than the first size, and the third The size is larger than the first size.
  • using a drill bit of the first size to drill through the PCB board from the first side includes: using a drill bit of the first size to drill through the PCB board perpendicular to the first side of the PCB board, and The first size is larger than the size of the pin of the device to be soldered.
  • using a drill of the second size to back drill on the second side of the PCB board to form a pyramid-shaped through hole includes: using a drill of the second size to back drill on the second side of the PCB board. Drill to half the thickness of the PCB board to form a pyramid-shaped through hole.
  • back-drilling the second side of the PCB board with a drill bit of the second size to form a pyramid-shaped through hole further includes: electroplating copper in the pyramid-shaped through hole.
  • a computer-readable storage medium stores a computer program that implements the steps of the above method when executed by a processor.
  • the invention has the following beneficial technical effects: by providing the pyramid-shaped through holes, the amount of creeping tin in the hole can be increased to the greatest extent, and it can prevent excessive overflow of the top surface solder from causing continuous soldering on the top surface, thereby avoiding tin on the wave soldering device Insufficient, false welding, false welding and other problems can also increase the current carrying capacity of the inner power supply.
  • Fig. 1 is a cross-sectional view of a PCB board with through-holes in the prior art
  • Fig. 2 is a top view of a PCB board with a through-hole through a pad in the prior art
  • FIG. 3 is a schematic diagram of an embodiment of a method for designing PCB pads provided by the present invention.
  • Figure 5 is a cross-sectional view of the PCB board with pads provided by the present invention.
  • FIG. 6 is a flowchart of an embodiment of a method for designing PCB pads provided by the present invention.
  • FIG. 7 is a schematic diagram of the hardware structure of an embodiment of the method for designing PCB pads provided by the present invention.
  • FIG. 3 shows a schematic diagram of an embodiment of the method for designing PCB pads provided by the present invention.
  • the embodiment of the present invention includes the following steps:
  • a pad of a third size is arranged on the first layer of the inner layer, and a pad of a fourth size is arranged on the last layer of the inner layer.
  • the fourth size is larger than the third size
  • the fourth size is larger than the second size
  • the second size is larger than the first size
  • the third size is larger than the first size
  • a drill bit of the first size is used to drill through the PCB board from the first side, and a drill bit of the second size is used to perform back drilling on the second side of the PCB board to form a pyramid-shaped through hole.
  • the first size represents the size of the top surface of the through hole
  • the second size represents the size of the bottom surface of the through hole.
  • the shape of the through hole of the pad of the PCB package of the wave soldering device is designed as a pyramid shape.
  • the first surface is the top surface of the PCB board
  • the second surface is the bottom surface of the PCB board.
  • the diameter of the bottom through hole increases, which can increase the solder climbing area for the solder to enter the through hole, thereby increasing the amount of tin in the hole; the diameter of the top through hole is reduced, It can reduce the risk of excessive tin creeping in the through hole and overflowing to the device surface.
  • using a drill bit of the first size to drill through the PCB board from the first side includes: using a drill bit of the first size to drill through the PCB board perpendicular to the first side of the PCB board, and
  • the first size is larger than the size of the pin of the device to be soldered.
  • the diameter of the top surface of the through hole can be set to the diameter of the device pin size + 0.15 to 0.2 mm.
  • using a drill of the second size to back drill on the second side of the PCB board to form a pyramid-shaped through hole includes: using a drill of the second size to back drill on the second side of the PCB board. Drilling to a position of half the thickness of the PCB board to form a pyramid-shaped through hole, and the second size is larger than the size of the pin of the device to be soldered. The size and diameter of the bottom surface of the through hole can be set to the device pin size + 0.3 ⁇ 0.5mm.
  • back-drilling the second side of the PCB board with a drill bit of the second size to form a pyramid-shaped through hole further includes: electroplating copper in the pyramid-shaped through hole.
  • Fig. 4 shows a cross-sectional view of the PCB board with through-holes provided by the present invention.
  • the size of the pin of the device to be soldered is d
  • connection mode of the second layer and the third layer of the inner layer of the PCB board including the pyramid-shaped through holes is set to be fully connected.
  • the plane layer connection method of the inner layer pad is improved.
  • the connection of the inner layer of the through hole is a flower pad connection.
  • the heat dissipation of the solder will be slower.
  • the solder will climb to the top surface As a result, the top surface solder overflows. Therefore, the inner layer connection method needs to be changed, and the second and third layers of the inner layer are changed to full connection, and the other layers are still designed with flower pads.
  • the design of the inner pad connection method can make the top surface heat dissipation as soon as possible under the condition of sufficient solder climbing, so that the solder can cool and lock the solder, and avoid excessive overflow of the solder on the top surface. At the same time, the heat dissipation on the bottom layers is slower, ensuring sufficient time to climb the tin.
  • this design method of fully connected layers on the top surface of the inner layer can increase the current-carrying capacity and avoid insufficient current-carrying.
  • a pad of a third size is arranged on the first layer of the inner layer, and a pad of a fourth size is arranged on the last layer of the inner layer.
  • the arranging a pad of a third size on the first layer of the inner layer further includes: judging whether the first layer of the inner layer of the PCB board including the pyramid-shaped through holes can be used Fully connected; and in response to the first layer of the inner layer of the PCB board including the pyramid-shaped through holes being unable to be fully connected, the first layer is set as a flower pad connection.
  • top and bottom pads are designed, and the top pad size is designed to increase the diameter of the top surface of the through hole by 0.1-0.3mm, preferably 0.2mm, and the size of the bottom pad is increased by 0.38-0.42mm according to the diameter of the bottom of the through hole, preferably Increase 0.4mm.
  • Figure 5 shows a cross-sectional view of the PCB board with pads provided by the present invention.
  • the top surface pad is reduced, which can reduce excessive tin creep in the hole, which leads to excessive tin absorption on the top surface and overflow of tin on the top surface; the increase of the bottom surface pad can increase the tin suction area, which can make Climb the tin faster in the hole.
  • FIG. 6 shows a flowchart of an embodiment of a method for designing PCB pads provided by the present invention.
  • box 102 use the first size drill bit to drill through the PCB board from the first side; then proceed to box 103, use the second size drill bit in the PCB
  • the second side of the board is back-drilled to form a pyramid-shaped through hole; then proceed to the frame 104, the connection mode of the second layer and the third layer of the inner layer of the PCB board including the pyramid-shaped through hole is set to full connection; then Proceed to block 105, set a third-size pad on the first layer of the inner layer, set a fourth-size pad on the last layer of the inner layer, and then proceed to block 106 to end.
  • the second aspect of the embodiments of the present invention provides a computer device, including: at least one processor; and a memory, where computer instructions that can run on the processor are stored in the memory, and the instructions are executed by the processor.
  • the following steps are implemented: S1, a drill bit of the first size is used to drill through the PCB board from the first side; S2, a drill bit of the second size is used to back-drill the second side of the PCB board to form a pyramidal through hole; S3. Set the connection mode of the second layer and the third layer of the inner layer of the PCB board including the pyramid-shaped through-holes to full connection; and S4. Set a third-size solder on the first layer of the inner layer Disk, a pad of a fourth size is arranged on the last layer of the inner layer.
  • using a drill bit of the first size to drill through the PCB board from the first side includes: using a drill bit of the first size to drill through the PCB board perpendicular to the first side of the PCB board, and The first size is larger than the size of the pin of the device to be soldered.
  • using a drill of the second size to back drill on the second side of the PCB board to form a pyramid-shaped through hole includes: using a drill of the second size to back drill on the second side of the PCB board. Drilling to a position of half the thickness of the PCB board to form a pyramid-shaped through hole, and the second size is larger than the size of the pin of the device to be soldered.
  • back-drilling the second side of the PCB board with a drill bit of the second size to form a pyramid-shaped through hole further includes: electroplating copper in the pyramid-shaped through hole.
  • the arranging a pad of a third size on the first layer of the inner layer further includes: judging whether the first layer of the inner layer of the PCB board including the pyramid-shaped through holes can be used Fully connected; and in response to the first layer of the inner layer of the PCB board including the pyramid-shaped through holes being unable to be fully connected, the first layer is set as a flower pad connection.
  • FIG. 7 it is a schematic diagram of the hardware structure of an embodiment of the above method for designing PCB pads provided by the present invention.
  • the device includes a processor 701 and a memory 702, and may also include: an input device 703 and an output device 704.
  • the processor 701, the memory 702, the input device 703, and the output device 704 may be connected by a bus or in other ways. In FIG. 7, the connection by a bus is taken as an example.
  • the memory 702 as a non-volatile computer-readable storage medium, can be used to store non-volatile software programs, non-volatile computer-executable programs, and modules, such as the method for designing PCB pads in the embodiments of the present application.
  • the processor 701 executes various functional applications and data processing of the server by running non-volatile software programs, instructions, and modules stored in the memory 702, that is, realizing the method for designing PCB pads in the foregoing method embodiment.
  • the memory 702 may include a storage program area and a storage data area.
  • the storage program area may store an operating system and an application program required by at least one function; the storage data area may store data created according to the method of designing PCB pads, etc. .
  • the memory 702 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one magnetic disk storage device, a flash memory device, or other non-volatile solid-state storage devices.
  • the memory 702 may optionally include memories remotely provided with respect to the processor 701, and these remote memories may be connected to a local module through a network. Examples of the aforementioned networks include, but are not limited to, the Internet, corporate intranets, local area networks, mobile communication networks, and combinations thereof.
  • the input device 703 can receive the input user name and password and other information.
  • the output device 704 may include a display device such as a display screen.
  • the program instructions/modules corresponding to one or more methods for designing PCB pads are stored in the memory 702, and when executed by the processor 701, the method for designing PCB pads in any of the foregoing method embodiments is executed.
  • Any embodiment of the computer device that executes the foregoing method for designing PCB pads can achieve the same or similar effects as any of the foregoing corresponding method embodiments.
  • the present invention also provides a computer-readable storage medium, and the computer-readable storage medium stores a computer program that executes the above method when executed by a processor.
  • the program of the method for designing PCB pads can be stored in a computer.
  • the program may include the procedures of the above-mentioned method embodiments.
  • the storage medium of the program can be a magnetic disk, an optical disk, a read-only memory (ROM) or a random access memory (RAM), etc.
  • the foregoing computer program embodiment can achieve the same or similar effects as any of the foregoing corresponding method embodiments.
  • the method disclosed according to the embodiment of the present invention may also be implemented as a computer program executed by a processor, and the computer program may be stored in a computer-readable storage medium.
  • the computer program executes the above-mentioned functions defined in the method disclosed in the embodiment of the present invention.
  • the above method steps and system units can also be implemented using a controller and a computer-readable storage medium for storing a computer program that enables the controller to implement the above steps or unit functions.
  • non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory Memory.
  • Volatile memory can include random access memory (RAM), which can act as external cache memory.
  • RAM can be obtained in various forms, such as synchronous RAM (DRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), Synchronous link DRAM (SLDRAM) and direct Rambus RAM (DRRAM).
  • DRAM synchronous RAM
  • DRAM dynamic RAM
  • SDRAM synchronous DRAM
  • DDR SDRAM double data rate SDRAM
  • ESDRAM enhanced SDRAM
  • SLDRAM Synchronous link DRAM
  • DRRAM direct Rambus RAM
  • the storage devices of the disclosed aspects are intended to include, but are not limited to, these and other suitable types of memory.
  • DSP digital signal processors
  • ASIC application-specific integrated circuits
  • FPGA Field Programmable Gate Array
  • a general-purpose processor may be a microprocessor, but in the alternative, the processor may be any conventional processor, controller, microcontroller, or state machine.
  • the processor may also be implemented as a combination of computing devices, for example, a combination of a DSP and a microprocessor, multiple microprocessors, one or more microprocessors in combination with a DSP, and/or any other such configuration.
  • the steps of the method or algorithm described in combination with the disclosure herein may be directly included in hardware, a software module executed by a processor, or a combination of the two.
  • the software module may reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium known in the art.
  • An exemplary storage medium is coupled to the processor such that the processor can read information from or write information to the storage medium.
  • the storage medium may be integrated with the processor.
  • the processor and the storage medium may reside in the ASIC.
  • the ASIC can reside in the user terminal.
  • the processor and the storage medium may reside as discrete components in the user terminal.
  • functions may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software, the functions can be stored as one or more instructions or codes on a computer-readable medium or transmitted through the computer-readable medium.
  • Computer-readable media include computer storage media and communication media, including any media that facilitates the transfer of a computer program from one location to another location.
  • a storage medium may be any available medium that can be accessed by a general-purpose or special-purpose computer.
  • the computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage devices, magnetic disk storage devices or other magnetic storage devices, or may be used to carry or store instructions in the form of Or any other medium that can be accessed by a general-purpose or special-purpose computer or general-purpose or special-purpose processor. Also, any connection is properly termed a computer-readable medium.
  • coaxial cable, fiber optic cable, twisted pair, digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwave to send software from a website, server, or other remote source
  • coaxial cable Cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are all included in the definition of media.
  • magnetic disks and optical disks include compact disks (CDs), laser disks, optical disks, digital versatile disks (DVD), floppy disks, and Blu-ray disks. Disks usually reproduce data magnetically, while optical disks use lasers to optically reproduce data. . Combinations of the above content should also be included in the scope of computer-readable media.
  • the program can be stored in a computer-readable storage medium.
  • the storage medium can be a read-only memory, a magnetic disk or an optical disk, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention concerne un procédé de conception de pastilles de carte de circuit imprimé comprenant les étapes suivantes : l'utilisation d'un trépan d'une première taille pour percer une carte de circuit imprimé à partir d'un premier côté (S1) ; l'utilisation d'un trépan d'une seconde taille pour rétro-percer un second côté de la carte de circuit imprimé de façon à former un trou traversant en forme de pyramide (S2) ; le réglage des moyens de connexion d'une deuxième et d'une troisième couches d'une couche interne de la carte de circuit imprimé qui comprend le trou traversant en forme de pyramide pour une connexion complète (S3) ; et la disposition d'une pastille d'une troisième taille sur une première couche de la couche interne, ainsi que la disposition d'une pastille d'une quatrième taille sur la dernière couche de la couche interne (S4), la quatrième taille étant supérieure aux deuxième et troisièmes tailles, et les deuxième et troisième tailles étant supérieures à la première taille. Au moyen de la disposition d'un trou traversant en forme de pyramide, la quantité de fuite d'étain dans le trou est augmentée dans la plus grande mesure, de sorte que des problèmes tels qu'une étain insuffisant sur un dispositif de brasage par vague, un brasage factice et un faux brasage peuvent être empêchés.
PCT/CN2020/098405 2019-10-31 2020-06-28 Procédé de conception de pastilles de carte de circuit imprimé, dispositif et milieu WO2021082485A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US17/772,946 US20220377905A1 (en) 2019-10-31 2020-06-28 Method for Designing PCB Pads, Device and Medium

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201911049653.8A CN110996513B (zh) 2019-10-31 2019-10-31 一种设计pcb焊盘的方法、设备及介质
CN201911049653.8 2019-10-31

Publications (1)

Publication Number Publication Date
WO2021082485A1 true WO2021082485A1 (fr) 2021-05-06

Family

ID=70082943

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/098405 WO2021082485A1 (fr) 2019-10-31 2020-06-28 Procédé de conception de pastilles de carte de circuit imprimé, dispositif et milieu

Country Status (3)

Country Link
US (1) US20220377905A1 (fr)
CN (1) CN110996513B (fr)
WO (1) WO2021082485A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110996513B (zh) * 2019-10-31 2021-02-02 苏州浪潮智能科技有限公司 一种设计pcb焊盘的方法、设备及介质
CN111836467A (zh) * 2020-07-16 2020-10-27 苏州浪潮智能科技有限公司 一种pcb及其波峰焊良率改善焊盘结构
CN116595939B (zh) * 2023-07-17 2023-09-22 上海合见工业软件集团有限公司 叠层设计散热焊盘结构生成方法、电子设备和介质

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6646886B1 (en) * 2002-04-12 2003-11-11 Cisco Technology, Inc. Power connection structure
CN102291947A (zh) * 2011-07-29 2011-12-21 杭州华三通信技术有限公司 Pcb板上阶梯结构处通孔焊盘的制作方法以及pcb板
CN103889147A (zh) * 2014-04-04 2014-06-25 杭州华三通信技术有限公司 Pcb阶梯板的加工方法及pcb阶梯板
CN104270903A (zh) * 2014-10-13 2015-01-07 浪潮(北京)电子信息产业有限公司 一种实现pcb上锡的方法和装置
CN110996513A (zh) * 2019-10-31 2020-04-10 苏州浪潮智能科技有限公司 一种设计pcb焊盘的方法、设备及介质

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009195938A (ja) * 2008-02-21 2009-09-03 Mitsuo Ebisawa 半田鏝、それを用いて電子機器を製造する方法
CN101925253A (zh) * 2009-06-17 2010-12-22 鸿富锦精密工业（深圳）有限公司 印刷电路板及其钻孔方法
CN102186312B (zh) * 2011-04-29 2013-04-17 摩比天线技术（深圳）有限公司 一种印刷电路板的通孔回流焊接方法和模板
JP2015225960A (ja) * 2014-05-28 2015-12-14 富士通株式会社 プリント基板、電子装置およびプリント基板の製造方法
CN107027238B (zh) * 2016-01-29 2020-08-18 奥特斯(中国)有限公司 包括铜填充多径激光钻孔的元件载体
US20170231099A1 (en) * 2016-02-05 2017-08-10 Dell Products, Lp Electrical Breaks in PCB Vias
CN206620355U (zh) * 2016-12-28 2017-11-07 液化空气（中国）研发有限公司 一种波峰焊的印刷电路板
CN207802535U (zh) * 2017-12-26 2018-08-31 深圳市富盛电子有限公司 防止焊接元件脱落的柔性线路板
US20200053882A1 (en) * 2018-08-10 2020-02-13 Arista Networks, Inc. Network devices and network elements with belly to belly small format pluggable modules

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6646886B1 (en) * 2002-04-12 2003-11-11 Cisco Technology, Inc. Power connection structure
CN102291947A (zh) * 2011-07-29 2011-12-21 杭州华三通信技术有限公司 Pcb板上阶梯结构处通孔焊盘的制作方法以及pcb板
CN103889147A (zh) * 2014-04-04 2014-06-25 杭州华三通信技术有限公司 Pcb阶梯板的加工方法及pcb阶梯板
CN104270903A (zh) * 2014-10-13 2015-01-07 浪潮(北京)电子信息产业有限公司 一种实现pcb上锡的方法和装置
CN110996513A (zh) * 2019-10-31 2020-04-10 苏州浪潮智能科技有限公司 一种设计pcb焊盘的方法、设备及介质

Also Published As

Publication number Publication date
CN110996513B (zh) 2021-02-02
US20220377905A1 (en) 2022-11-24
CN110996513A (zh) 2020-04-10

Similar Documents

Publication Publication Date Title
WO2021082485A1 (fr) Procédé de conception de pastilles de carte de circuit imprimé, dispositif et milieu
TWI308037B (en) An apparatus and method for improving printed circuit board signal layer transitions
WO2015043499A1 (fr) Structure d'encapsulation de semi-conducteurs et son procédé de fabrication
CN108135070A (zh) 埋金属块pcb及其制作方法
JP6338895B2 (ja) 電気又は電子装置
JP6151461B2 (ja) 単一方向の加熱を用いる強化ガラスを使用する基板の反り制御
US20130171887A1 (en) Electric connector
US20060175693A1 (en) Systems, methods, and apparatus for generating ball-out matrix configuration output for a flex circuit
TW201340792A (zh) 印刷電路板
JP2009206154A (ja) 配線基板、及びその製造方法
Yoon et al. Thermally enhanced GaN hybrid‐IC power amplifier using embedded IC process in a copper sheet
WO2020206880A1 (fr) Procédé et dispositif de conception de plan de référence de condensateurs de blocage de courant continu
WO2019205535A1 (fr) Structure de dissipation de chaleur et son procédé de mise en œuvre, et dispositif de dissipation de chaleur
US8420948B2 (en) Printed circuit board
US10939559B2 (en) Removing unwanted flux from an integrated circuit package
CN114423157A (zh) Pcb板的制作方法、装置、电路板以及pcb板
JP2007188934A (ja) マルチチップモジュール
CN106852025A (zh) 一种金手指的制作方法
CN218941436U (zh) Pcb封装电路及pcb板
CN110740589A (zh) 一种多层pcb板的设计方法、设备及介质
CN219718977U (zh) 散热组件和电子设备
TWI246881B (en) Substrate with high heat-conductivity and its manufacturing process
CN113225902B (zh) 一种印刷电路结构、矿灯和整流器
CN114867213B (zh) 高速压接器件的过孔优化方法、系统、终端及存储介质
JPH06169048A (ja) 導体ピンの接合方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20882366

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20882366

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 20882366

Country of ref document: EP

Kind code of ref document: A1

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 09/11/2022)

122 Ep: pct application non-entry in european phase

Ref document number: 20882366

Country of ref document: EP

Kind code of ref document: A1