WO2021014772A1 - 基板処理装置および基板処理方法 - Google Patents

基板処理装置および基板処理方法 Download PDF

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Publication number
WO2021014772A1
WO2021014772A1 PCT/JP2020/021852 JP2020021852W WO2021014772A1 WO 2021014772 A1 WO2021014772 A1 WO 2021014772A1 JP 2020021852 W JP2020021852 W JP 2020021852W WO 2021014772 A1 WO2021014772 A1 WO 2021014772A1
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WO
WIPO (PCT)
Prior art keywords
substrate
treatment liquid
liquid
annular member
discharge path
Prior art date
Application number
PCT/JP2020/021852
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
仁司 中井
Original Assignee
株式会社Ｓｃｒｅｅｎホールディングス
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｓｃｒｅｅｎホールディングス filed Critical 株式会社Ｓｃｒｅｅｎホールディングス
Priority to CN202080044791.1A priority Critical patent/CN114008756A/zh
Priority to KR1020227001927A priority patent/KR102636437B1/ko
Publication of WO2021014772A1 publication Critical patent/WO2021014772A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
PCT/JP2020/021852 2019-07-19 2020-06-03 基板処理装置および基板処理方法 WO2021014772A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202080044791.1A CN114008756A (zh) 2019-07-19 2020-06-03 基板处理装置以及基板处理方法
KR1020227001927A KR102636437B1 (ko) 2019-07-19 2020-06-03 기판 처리 장치 및 기판 처리 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-133864 2019-07-19
JP2019133864A JP7372068B2 (ja) 2019-07-19 2019-07-19 基板処理装置および基板処理方法

Publications (1)

Publication Number Publication Date
WO2021014772A1 true WO2021014772A1 (ja) 2021-01-28

Family

ID=74193125

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2020/021852 WO2021014772A1 (ja) 2019-07-19 2020-06-03 基板処理装置および基板処理方法

Country Status (5)

Country Link
JP (1) JP7372068B2 (ko)
KR (1) KR102636437B1 (ko)
CN (1) CN114008756A (ko)
TW (1) TWI803755B (ko)
WO (1) WO2021014772A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023045549A (ja) * 2021-09-22 2023-04-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH081064A (ja) * 1994-06-20 1996-01-09 Dainippon Screen Mfg Co Ltd 回転処理装置
JP2008021983A (ja) * 2006-06-16 2008-01-31 Tokyo Electron Ltd 液処理装置および液処理方法
JP2015088598A (ja) * 2013-10-30 2015-05-07 東京エレクトロン株式会社 液処理装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8936368B2 (en) 2010-01-29 2015-01-20 Nec Display Solutions, Ltd. Illumination optical system and projector using the same
JP6670674B2 (ja) * 2016-05-18 2020-03-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6881922B2 (ja) * 2016-09-12 2021-06-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH081064A (ja) * 1994-06-20 1996-01-09 Dainippon Screen Mfg Co Ltd 回転処理装置
JP2008021983A (ja) * 2006-06-16 2008-01-31 Tokyo Electron Ltd 液処理装置および液処理方法
JP2015088598A (ja) * 2013-10-30 2015-05-07 東京エレクトロン株式会社 液処理装置

Also Published As

Publication number Publication date
TW202115773A (zh) 2021-04-16
JP2021019092A (ja) 2021-02-15
CN114008756A (zh) 2022-02-01
KR20220024748A (ko) 2022-03-03
KR102636437B1 (ko) 2024-02-14
TWI803755B (zh) 2023-06-01
JP7372068B2 (ja) 2023-10-31

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