WO2020259228A1 - 墨水容器的芯片及墨水容器 - Google Patents

墨水容器的芯片及墨水容器 Download PDF

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Publication number
WO2020259228A1
WO2020259228A1 PCT/CN2020/093980 CN2020093980W WO2020259228A1 WO 2020259228 A1 WO2020259228 A1 WO 2020259228A1 CN 2020093980 W CN2020093980 W CN 2020093980W WO 2020259228 A1 WO2020259228 A1 WO 2020259228A1
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WO
WIPO (PCT)
Prior art keywords
chip
substrate
positioning
ink container
conductive sheet
Prior art date
Application number
PCT/CN2020/093980
Other languages
English (en)
French (fr)
Inventor
马浩铭
陈伟健
邱涌群
梁仕超
贾志铮
朱一静
Original Assignee
珠海纳思达企业管理有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201922184114.7U external-priority patent/CN211641446U/zh
Priority claimed from CN202020311962.XU external-priority patent/CN212499511U/zh
Application filed by 珠海纳思达企业管理有限公司 filed Critical 珠海纳思达企业管理有限公司
Priority to JP2022506320A priority Critical patent/JP7256331B2/ja
Priority to EP20832692.6A priority patent/EP3991974A4/en
Publication of WO2020259228A1 publication Critical patent/WO2020259228A1/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/17543—Cartridge presence detection or type identification
    • B41J2/17546—Cartridge presence detection or type identification electronically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/1752—Mounting within the printer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/17526—Electrical contacts to the cartridge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/17526—Electrical contacts to the cartridge
    • B41J2/1753—Details of contacts on the cartridge, e.g. protection of contacts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/17536—Protection of cartridges or parts thereof, e.g. tape
    • B41J2/1754—Protection of cartridges or parts thereof, e.g. tape with means attached to the cartridge, e.g. protective cap

Definitions

  • This invention requires a Chinese patent invention submitted to the Chinese Patent Office on June 28, 2019, with an application number of 201921005051.8, and an application name of "a chip for ink container and ink container using the chip", in July 2019 Submitted to the Chinese Patent Office on the 18th, the application number is 201921138083.5, the application name is "a chip for ink container and ink container using the chip” for a Chinese patent invention, submitted to the Chinese Patent Office, application on December 9, 2019 No.
  • the application name is "Ink container chip and ink container” Chinese patent invention, submitted to the Chinese Patent Office on December 19, 2019, the application number is 201922297657.X, the application name is "a kind of ink container
  • the Chinese patent invention of the chip and the ink container using the chip” was submitted to the Chinese Patent Office on March 13, 2020, the application number is 202020311962.X, and the application name is "A chip for ink containers and the use of the chip "Ink container” is the priority of the Chinese patent invention, the entire content of which is incorporated in the present invention by cross-reference.
  • the invention relates to the technical field of inkjet printers, in particular to an ink container chip and an ink container.
  • the existing inkjet printer is provided with a holding part for accommodating the ink container, and at least one ink container is detachably installed in the holding part.
  • the ink container includes a chip, and the chip is electrically connected to the contact pin of the inkjet printer to realize the ink container and Signal transmission between inkjet printers.
  • the chip generally includes a circuit board, a stable base and a plurality of contacts, the contacts are used to electrically connect with the contact pins of the inkjet printer; the stable base is provided with a plurality of positioning jacks, and each positioning jack is inserted with one
  • the contact piece is provided with a contact part electrically connected with the contact pin, and the contact part passes through the stabilizer seat and protrudes from the surface of the stabilizer seat, so that the contact part is connected with the contact pin of the inkjet printer.
  • the chip 1 has: a circuit board 11, a contact 12, and a stable seat 13.
  • the number of contact members 12 is plural, and each contact member 12 has a contact portion 120 for electrically contacting a printer device (inkjet printer).
  • a plurality of positioning holes are provided on the stable seat 13 corresponding to the contact piece 12. Each contact piece 12 needs to pass through the positioning hole on the stable base 13 to expose the contact portion 120 to facilitate contact with the printer device.
  • the embodiment of the present invention provides a chip for an ink container and an ink container.
  • the conductive sheet is mounted on a substrate through a positioning and mounting part.
  • the chip and the inkjet printer realize signal transmission through the battery core connection part of the conductive sheet, and improve the ink The production efficiency of the container.
  • One aspect of the embodiments of the present invention provides a chip for an ink container, the chip is electrically connected to the contact pins of the inner holding part of the inkjet printer; the feature is that the chip includes a substrate and at least the chip is mounted on the substrate.
  • a conductive sheet; the substrate has at least one substrate terminal in contact with the stylus of the inkjet printer, and a positioning portion for positioning the at least one conductive sheet; the conductive sheet includes a body and one end of the body
  • the battery core connection part, the battery core connection part abuts the contact pin;
  • the body is provided with at least one positioning installation part, the positioning installation part is matched with the positioning part; the body and the The surfaces of the substrate are parallel and are mounted on the positioning part through the positioning and mounting part.
  • the substrate terminal is located on the +X-axis side of the chip substrate, and the cell connection portion protrudes from the surface where the substrate terminal is located toward the +X-axis direction;
  • the battery core connection portion has a conductive sheet contact area for contacting the contact pin, and the conductive sheet contact area is located at the +X axis end of the battery core connection portion; wherein, the ink container is mounted to The direction of the holding portion is the Z-axis direction, the position of the front end side of the installation is the -Z-axis direction, and the direction perpendicular to the Z-axis direction and parallel to the surface where the substrate terminal is located is the Y-axis direction, which is perpendicular to the The direction of the Z-axis direction and the Y-axis direction is the X-axis direction, and the direction in which the inside of the ink container points to the chip is the +X-axis direction; viewed along the +X-axis direction, when the +Z-axis is
  • the positioning and mounting portion is located on the +X axis side or the -X axis side of the main body.
  • the substrate is provided with a plurality of the positioning holes; the plurality of the positioning holes are divided into a first positioning hole group and a second positioning hole group that are distributed in rows and parallel to each other; wherein, the first positioning holes
  • the positioning holes in the group and the positioning holes of the second positioning hole group are arranged oppositely or staggered.
  • the number of the conductive sheets is multiple.
  • the conductive sheets are symmetrically distributed on the chip substrate along the center line L1, wherein the center line L1 passes through the chip substrate.
  • the center point of the chip in the Y-axis direction is parallel to the Z-axis direction.
  • the battery core connecting portion and the positioning and mounting portion are respectively located on the same side of the body.
  • the plurality of substrate terminals have substrate terminal contact portions that are in contact with corresponding contact pins;
  • the cell connection part of the conductive sheet is located in the +Z axis direction of the substrate terminal contact part.
  • the conductive sheet is located in the +Z axis direction of the substrate terminal.
  • a plurality of substrate terminals have substrate terminal contact portions that are in contact with corresponding contact pins; the substrate terminal contact portions are arranged in multiple rows in the Z-axis direction, and the cells of the conductive sheet are connected The portion is located between the multiple rows of substrate terminal contact portions.
  • the substrate terminals are arranged in multiple rows in the Z-axis direction, and the cell connection portion is located between the multiple rows of substrate terminals; in the Z-axis direction, the cell connection portion and the The installation positioning parts are respectively located on both sides of the body.
  • the size of the battery core connecting portion in the Y-axis direction is larger than the size in the Z-axis direction.
  • the substrate is further provided with a substrate terminal electrically connected to the contact pin, an additional terminal is provided between the substrate terminal and the cell connection part of the conductive sheet; the additional terminal is connected to at least one The chip's data storage chip is connected to the chip terminal electrically connected.
  • the chip has two conductive sheets, respectively a first conductive sheet and a second conductive sheet; the first conductive sheet and the second conductive sheet are symmetrically distributed along the chip.
  • an ink container including a chip of the ink container; a plurality of limit slots are provided on the chip, and a plurality of limit slots are provided on the ink container.
  • Cooperating limit block; the chip is detachably mounted on the ink container through the limit slot and the limit block.
  • the ink container includes a box body for storing ink jets and a chip holder mounted on the box body; a plurality of the limit blocks are located on the surface of the chip holder close to the contact pins.
  • the box body is provided with a mounting cavity for accommodating the chip carrier;
  • the chip carrier includes a first connecting part for connecting with the box body and a first fixing part for fixing the chip, so Both sides of the first connecting portion are respectively provided with first limiting bosses, and the side walls of the mounting cavity are respectively provided with first locking holes that cooperate with the first positioning bosses;
  • the first connection A second limiting boss is provided at one end of the part away from the first fixing part, and an elastic element is sleeved on the second limiting boss, and the elastic element abuts against the inner wall of the installation cavity.
  • an end of the first connecting portion away from the first fixing portion is provided with an inclined surface, and the second limiting boss is located on the inclined surface; so that the chip and the chip carrier are rotatable in the mounting cavity When the ink container is in contact with the holding portion of the inkjet printer, there is a gap between the chip and the sidewall member of the holding portion of the inkjet printer.
  • the ink container chip and ink container provided by the embodiments of the present invention have the following advantages:
  • the chip includes a substrate and a conductive sheet arranged on the substrate.
  • the conductive sheet includes a main body, a battery core connecting portion, and a positioning and mounting portion.
  • the battery core connecting portion is located at one end of the body,
  • the positioning and mounting part is located on one side of the main body.
  • the substrate is provided with a positioning part that matches with the positioning and mounting part.
  • the conductive sheet is inserted into the positioning part through the positioning and mounting part to keep the main body and the substrate in close contact.
  • the stylus of the ink printer is electrically connected, and the information transmission between the chip and the inkjet printer has been completed.
  • the conductive sheet is inserted into the substrate through the positioning and mounting portion, and the body and the surface of the substrate remain parallel, which increases the contact between the conductive sheet and the substrate.
  • the area makes the assembly more stable and simple; in addition, the cell connection part of the conductive sheet is located at one end of the body, which prevents the cell connection part from being easily deformed due to the installation process, and can improve the contact between the cell connection part and the inkjet printer.
  • the length of the battery core connection part in the Y-axis direction is greater than the length in the Z-axis direction, and the length in the Y-axis direction is relatively large, even if the ink container has a positional deviation or offset in the Y-axis direction. It will not cause the chip to be unrecognized, making the contact between the conductive sheet and the contact pin more stable; the positional relationship between the cell connection part and the substrate terminal and the contact part of the substrate terminal prevents the conductive sheet from entering the contact pin groove, avoiding contact The needle is excessively squeezed and the electrical connection fails.
  • the ink container chip and ink container provided by the present invention can solve other problems
  • the technical problems, other technical features contained in the technical solutions, and the beneficial effects brought by these technical features will be further described in detail in the specific implementation.
  • FIG. 1 is a schematic diagram of an ink container installed to a holding part according to an embodiment of the present invention
  • Figure 2 is a first structural diagram of an ink container provided by the implementation of the present invention.
  • FIG. 3 is a schematic structural diagram of a holding part provided by an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of the structure of a contact pin holder provided by an embodiment of the present invention.
  • FIG. 5 is a schematic diagram of the structure of the contact pin shown in FIG. 4;
  • FIG. 6 is an exploded schematic diagram of a chip provided by an embodiment of the present invention.
  • FIG. 7 is a schematic diagram of the front surface structure of the substrate in FIG. 6;
  • FIG. 8 is a schematic diagram of the back surface structure of the substrate in FIG. 6;
  • FIG. 9 is a schematic diagram of the front structure of the conductive sheet in FIG. 6;
  • FIG. 10 is a schematic diagram of the backside structure of the conductive sheet in FIG. 6;
  • FIG. 11 is a schematic diagram of a connection mode of the conductive sheet and the substrate in FIG. 6;
  • FIG. 12 is a schematic diagram of a first connection mode of the conductive sheet and the substrate in FIG. 6;
  • Fig. 13 is a schematic diagram 1 of the second connection mode of the conductive sheet and the substrate in Fig. 6;
  • FIG. 14 is a second schematic diagram of the second connection mode of the conductive sheet and the substrate in FIG. 6;
  • 15 is a schematic diagram of the connection between the chip and the contact pin holder provided by an embodiment of the present invention.
  • 16 and 17 are schematic diagrams of the chip in the second embodiment
  • 19 is a schematic diagram of the electrical connection between the chip and the contact pin holder in the second embodiment
  • 20 is a first schematic diagram of the connection between the chip and the ink container provided by an embodiment of the present invention.
  • 21 is a schematic diagram 1 of the arrangement of additional terminals on a substrate provided by an embodiment of the present invention.
  • 22 is a schematic diagram 1 of the layout of the left terminal and the right terminal on the substrate provided by an embodiment of the present invention
  • FIG. 23 is a second schematic diagram of the layout of the left terminal and the right terminal on the substrate provided by the embodiment of the present invention.
  • FIG. 24 is a schematic diagram of the second arrangement of the substrate terminals on the substrate provided in the embodiment of the present invention.
  • 25 is a schematic diagram of a third arrangement of the substrate terminals on the substrate provided in the embodiment of the present invention.
  • Figure 26 is a schematic structural view of an ink container provided by another embodiment of the present invention.
  • FIG. 27 is a schematic structural diagram of a holding part provided by another embodiment of the present invention.
  • Fig. 28 is a schematic diagram of a chip of the third embodiment.
  • Fig. 29 is a schematic diagram of a chip of the fourth embodiment.
  • FIG. 30 is a schematic diagram of the connection between a chip rack and a chip provided by another embodiment of the present invention.
  • FIG. 31 is a schematic structural diagram of a chip rack provided by an embodiment of the present invention.
  • 32 is a schematic diagram of the connection between the chip rack and the box body provided by an embodiment of the present invention.
  • FIG. 33 is a first schematic diagram of the connection between the chip holder and the contact pins according to an embodiment of the present invention.
  • FIG. 34 is a second schematic diagram of the connection between the chip holder and the contact pins according to an embodiment of the present invention.
  • 35 is a schematic diagram of the chip of the fifth embodiment.
  • Fig. 36 is a schematic diagram of the chip of the sixth embodiment.
  • the inkjet printer has a holding part 200, and the holding part 200 is used for accommodating an ink container, and can carry multiple or one ink container 300.
  • the ink container 300 is detachably mounted on the holding part 200. When the ink container 300 is used up, it needs to be replaced with a new one.
  • the ink container 300 includes a chip 100, a handle 330, an ink outlet 311, and a box body 310; the holding part 200 has a stylus holder 201, an ink supply part 202, a fixing part 204, and an opening 205; the box body 310 stores ink, and the ink passes through The ink outlet 311 reaches the ink supply unit 202, and the ink supply unit 202 can supply ink to the print head, so that the ink can be used to perform printing.
  • the chip 100 can be electrically connected with the contact pins on the contact pin holder 201 for mutual transmission of electrical signals.
  • the handle 330 is used to fix the ink container 300 to the holding part 200, and the handle 330 cooperates with the fixing part 204 to prevent the ink container 300 from being detached from the holding part 200.
  • the three-dimensional rectangular coordinate system of the holding portion is set, that is, the XYZ axis coordinate system, and the direction in which the ink container 300 is mounted to the holding portion 200 is the -Z axis direction, and the direction in which the ink container 300 is separated from the holding portion is In the +Z axis direction, the opening 205 is located in the +Z axis direction, and the bottom wall 200a is located in the -Z axis direction.
  • the inkjet printer is placed flat on a desk or printing table, the opening 205 of the holding portion 200 is located above the direction of gravity, and the bottom wall 200a is located below the direction of gravity, thus facilitating the user to install or remove the ink container 300 .
  • the holding part 200 can carry multiple or one ink container 300, and has multiple or one installation positions 203, and the four ink containers can store four different colors of ink, such as black, yellow, blue, and red.
  • the holding part 200 can carry 4 ink containers 300 and has 4 installation positions 203;
  • the holding part 200 is a roughly rectangular or square member with an opening 205, and the inner side wall and bottom wall 200a of the holding part 200
  • the installation position 203 is formed.
  • the stylus holder 201 is installed on the first side wall 200c of the holding portion 200, the installation positions 203 are arranged in sequence in the Y-axis direction, and the four installation positions 203 are arranged in sequence in the Y-axis direction.
  • the direction perpendicular to the Y axis and the Z axis is the X axis direction
  • the direction from the mounting position 203 to the contact pin holder 201 is the +X axis direction
  • the +X axis is perpendicular to the first side wall 200c; when viewed along the +X axis direction, when the +Z axis is up on the YZ plane, the +Y axis direction is on the left hand side.
  • the three-dimensional rectangular coordinate system of the ink container 300 provided in this embodiment is consistent with the three-dimensional rectangular coordinate system of the holding portion 200.
  • the contact pin holder 201 has a base 210 and a plurality of contact pins mounted on the base 210, which are a first contact pin 211 to a ninth contact pin 219 respectively.
  • the contact pin is a thin metal sheet that can conduct electricity and is not easy to wear.
  • the base 210 has a plurality of slits, namely the first slit 221 to the ninth slit 229; the plurality of slits 221-229 correspond to the plurality of contact pins 211-219, and the plurality of slits 221-229 are U A font shape, which has a slit opening in the +Z axis direction, and the plurality of contact pins 211-219 are installed in the plurality of slits 221-229 along the ⁇ Z axis direction through the slit opening.
  • the first contact pin 211 is installed in the first slit 221 through the slit along the -Z axis direction; the second contact pin 212 to the ninth contact pin 219 are installed in the same manner as the same, which will not be repeated here.
  • each of the first contact pin 211 to the ninth contact pin 219 is connected to the main circuit of the inkjet printer through a circuit inside the holding portion 200; the other side is electrically connected to the chip 100.
  • the structures of the first contact pin 211 to the ninth contact pin 219 are the same, as shown in FIG. 4. Taking the first contact pin 211 as an example, the structure of each contact pin is introduced: the first contact pin 211 is divided into a first part 211a, a second part 211b, and a third part 211c.
  • the first part 211a or the third part 211c is used to contact the chip 100; the second part 211b is used to connect to the internal circuit of the inkjet printer, for example, it is connected to the main circuit of the inkjet printer through the holder chip 100.
  • the third part 211c is connected to the first part 211a and the second part 211b.
  • the first part 211a of the contact pin is in contact with the first substrate terminal 201 to form a contact area; the second part 211b is connected with the circuit in the inkjet printer.
  • the third part 211c connects the first part 211a and the second part 211b.
  • the third part is located in the +Z axis direction of the first contact pin 211, and the first contact pin 211 is fixed to the first narrow part by the third part 211c or a part of the third part 211c (for example, the horizontal part 211f of the third part 211c). Seam 221.
  • the first part 211a and the second part 211b are arranged at the end of the first stylus 211 in the -Z axis direction, so that the first part 211a and the second part 211b can be elastically deformed and easily return to their original shape after deformation.
  • the first part 211a of the first contact pin 211 is arranged in the -X axis direction
  • the second part 211b is arranged in the +X axis direction.
  • the first part 211 a and the second part 211 b protrude from the base 210, and the third part 211 c does not protrude from the base 210.
  • the first part 211a and the second part 211b protrude from the base 210 in the X-axis direction, and the base 210 is located between the first part 211a and the second part 211b.
  • the first part 211a is closer to the installation position 203 than the second part 211b.
  • the third portion 211c is divided into a first vertical portion 211d and a second vertical portion 211e perpendicular to the X-axis direction, and a horizontal portion 211f parallel to the X-axis direction; the horizontal portion 211f connects the first vertical portion 211d and the two vertical portions 211e.
  • the first vertical portion 211d and the second vertical portion 211e extend in the Z-axis direction.
  • the first vertical portion 211d is closer to the installation position 203 than the second vertical portion 211e.
  • the end of the first vertical part 211d is connected to the first part 211a
  • the end of the second vertical part 211e is connected to the second part 211b.
  • the structure of the first contact pin 211 can make the first part 211a and the second part 211b of the first contact pin 211 have elasticity, avoiding the hard contact with the internal circuit of the inkjet printer and the chip 100 from wearing out A terminal 31 and a first contact pin 211.
  • the second contact pin 212 to the seventh contact pin 217 have the same arrangement and structure as the first contact pin 211, and detailed illustrations and explanations thereof will not be provided here.
  • the eighth contact pin 218 and the ninth contact pin 219 are respectively electrically connected to the conductive sheet 30 through the first vertical portions 219d and 219d, and the rest have the same arrangement and structure as the first contact pin 211, and detailed drawings thereof will not be provided here. Show and elaborate.
  • the chip 100 of the ink container provided by the embodiment of the present invention is electrically connected to the contact pins of the holding portion 200 in the inkjet printer;
  • the chip 100 includes a substrate 10 and is mounted on the substrate 10
  • the upper at least one conductive sheet 20 wherein the substrate 10 has at least one substrate terminal in contact with the stylus of the inkjet printer and a positioning portion 11 for positioning at least one conductive sheet 20,
  • the conductive sheet 20 includes a body 21 and one end of the body 21
  • the battery connection part 22, the battery connection part 22 abuts the contact pin;
  • the body 21 is provided with at least one positioning and mounting part 23, the body 21 is parallel to the surface of the substrate 10, and the body 21 is mounted on the substrate 10 and passes through
  • the positioning installation part 23 is installed on the positioning part 11.
  • the ink container usually includes a chip 100, and the chip 100 is electrically connected to a contact pin of an inkjet printer, so that the ink container information stored in the chip 100 of the ink container is transmitted to the inkjet printer.
  • the chip 100 includes a substrate 10, which is rectangular as a whole.
  • the substrate has a front surface 10a, a back surface 10b, a left surface 10c, a right surface 10d, an upper surface 10f, and a lower surface 10e.
  • the front surface 10a and the back surface 10b are parallel and
  • the left surface 10c and the right surface 10d are respectively located on the -Y axis side and the +Y axis side of the chip 100; the upper surface 10f and the lower surface 10e are parallel and oppositely arranged.
  • the substrate terminal is located on the front surface 10a.
  • One or more conductive sheets 20 are provided at one end of the substrate 10, and the conductive sheets 20 are in contact with the contact pins of the inkjet printer.
  • the chip 100 is electrically connected to the contact pins.
  • the surface of the substrate 10 facing the contact pins is the front surface 10a of the substrate 10, and the surface opposite to the front surface 10a of the substrate 10 is the surface of the substrate 10. ⁇ 10b.
  • seven substrate terminals may be arranged on the substrate 10, namely the first substrate terminal 31 to the seventh substrate terminal 37, and in the X axis direction, the substrate terminals 201-207 are located on the +X axis side of the chip substrate 10. .
  • the first substrate terminal 31 is in contact with the first portion 211a of the first contact pin 211, and the area in contact with the first contact pin 211 is the first substrate contact area.
  • the first substrate terminal 31 to the seventh substrate terminal 37 respectively have a first substrate contact area to a seventh substrate contact area, which are collectively referred to as a substrate contact area.
  • the multiple substrate contact areas are arranged in multiple rows in the Z-axis direction.
  • the first substrate terminal 31 to the seventh substrate terminal 37 are arranged in two rows in the Z-axis direction.
  • the first substrate terminal 31 to the fourth substrate terminal 34 are on the first row, and the fifth substrate terminal 35 to The seventh substrate terminal 37 is on the second row; further, along the -Z axis direction, the first substrate contact area to the fourth substrate contact area are on the first row, and the fifth substrate contact area to the seventh substrate contact area are on the first row. On the second row.
  • two conductive sheets 20 are provided on the substrate.
  • the two conductive sheets 20 are a first conductive sheet 20a and a second conductive sheet 20b.
  • the first conductive sheet 20a and the second conductive sheet 20b are arranged on the substrate.
  • the centerline L1 passes through the center point in the Y-axis direction of the chip 100 and is parallel to the Z-axis direction
  • the first conductive sheet 20a and the second conductive sheet 20b are symmetrically distributed with the centerline L1 as the center of symmetry
  • the center line L1 passes through the sixth substrate terminal 206.
  • the chip 100 is symmetrical with the center line L1 as the center of symmetry.
  • the conductive sheet 20 is positioned with the chip substrate 10 by the positioning portion 11.
  • the positioning form can be a fixed form such as pasting, welding, and clamping.
  • the conductive sheet 20 provided in this embodiment includes a rectangular body 21.
  • One end of the body 21 is provided with a battery core connection portion 22, and the battery core connection portion 22 can be bent outwards by one end of the body 21 Formed, the body 21 is provided with at least one positioning and mounting portion 23 along the direction from the battery core connecting portion 22 to the other end, and the positioning and mounting portion 23 is located at the edge of one side of the body 21.
  • the chip 100 is electrically connected to the contact pin, the surface of the body 21 facing the contact pin is the first surface 20e of the conductive sheet 20, and the surface opposite to the first surface 20e is the second surface 20g.
  • the battery connection part 22 and the positioning installation part 23 may be respectively located on the first surface 20e, or the battery connection part 22 is located on the first surface 20e and the positioning installation part 23 is located on the second surface 20g.
  • the cell connecting portion 22 and the positioning and mounting portion 23 can be in a sheet-like structure or a columnar structure.
  • the shape of the cell connecting portion 22 and the positioning and mounting portion 23 is not limited in this embodiment, and the cells may preferably be connected
  • the part 22 and the positioning installation part 23 are arranged in a sheet-like structure.
  • the substrate 10 is provided with a positioning portion 11 for inserting the positioning and mounting portion 23, and the number of the positioning portion 11 is the same according to the number of the positioning and mounting portion 23; the positioning portion includes a positioning hole.
  • the positioning portion 11 is a positioning hole.
  • a plurality of positioning and mounting portions 23 may be provided on the conductive sheet 20, and the plurality of positioning and mounting portions 23 are respectively provided on both sides of the main body 21.
  • the positioning and mounting portions 23 may be arranged along the edge of the main body 21; for example, two positioning and mounting portions 23 may be provided on both sides of the main body 21, and the positioning and mounting portions 23 on each side may be arranged oppositely or staggered.
  • the positioning and mounting portion 23 and the cell connection portion 22 can be located on the first surface 20e of the body 21, and the conductive sheet 20 is removed from the substrate 10
  • the back surface 10b is installed, the positioning installation portion 23 is inserted into the positioning hole 11 on the substrate 10, and the body 21 is attached to the back surface 10b of the substrate 10, and the cell connection portion 22 protrudes from the front surface 10a of the substrate 10.
  • the positioning and mounting portion 23 is located on the first surface 20e of the main body 21, and the battery connection portion 22 is located on the second surface 20g of the main body 21; at this time, the positioning and mounting portion 23 of the conductive sheet 20 is removed from the substrate 10
  • the front surface 10a of the substrate 10 is installed and inserted into the positioning hole 11 of the substrate 10, so that the main body 21 is parallel to the front surface 10a of the substrate 10, or even attached, and the cell connecting portion 22 protrudes from the front surface 10a of the substrate 10.
  • a guide angle may be provided at the end of the positioning and mounting portion 23 away from the body 21.
  • the positioning and mounting portion 23 having a sheet-like structure may be located away from the body 21.
  • One end of 21 is chamfered to form a tapered portion 23a, which is convenient for the positioning and installation portion 23 to be inserted into the positioning hole 11; a rounded corner can be set at the end of the positioning and installation portion 23 of the columnar structure away from the body 21 to form a curved surface, which is convenient for positioning and installation The portion 23 is inserted into the positioning hole 11.
  • the chip is provided with a conductive sheet 20, the conductive sheet 20 is inserted into the positioning hole 11 of the substrate 10 through its positioning and mounting portion 23, and the body 21 of the conductive sheet 20 is attached to the substrate 10
  • the battery core connecting portion 22 is provided protruding from the main body 21; the main body 21 is attached to the substrate 10 to increase the contact area between the two, making the assembly easier; in addition, the battery core connecting portion 22 of the conductive sheet 20 is located in the main body 21 At one end of the conductive sheet 20, during the installation process of the conductive sheet 20, the battery connection part 22 is not easily deformed, which can improve the stability of the electrical connection between the battery connection part and the contact pins of the inkjet printer.
  • the battery connection part 22 can be vertically arranged on the main body 21 to facilitate electrical connection with the contact pins, and the positioning installation part 23 can also be vertically installed on the main body 21 to facilitate the insertion of the positioning installation part 23 on the substrate 10
  • the axis of the positioning hole 11 of the substrate 10 can be perpendicular to the surface of the substrate 10, which facilitates the positioning of the positioning hole 11 on the substrate 10.
  • the positioning and mounting portion 23 and the chip 100 connection portion can also be installed on the body 21 obliquely.
  • the cell connection portion 22 and the positioning and mounting portion 23 are preferably arranged vertically on the body 21.
  • the conductive sheet 20 can be inserted into the positioning hole 11 on the substrate 10 through its positioning and mounting portion 23 to detachably connect the conductive sheet 20 to the substrate 10; in addition, in this embodiment, the body 21 of the conductive sheet 20 is connected to the The substrate 10 is attached, and the conductive sheet 20 can also be bonded or welded to the substrate 10 through the body 21, which can increase the connection strength between the conductive sheet 20 and the substrate 10; the battery core connection portion 22 is provided at one end of the body 21, and the battery core The mounting direction of the connecting portion 22 is different from the attaching direction of the main body 21.
  • the cell connecting portion 22 is vertically arranged on the main body 21; if the main body 21 is welded or bonded, the conductive sheet 20 is fixed to the substrate 10 In the process, even if the main body 21 is deformed, the cell connecting portion 22 will not be deformed, and the stability of the electrical connection between the cell connecting portion 22 and the contact pin can be ensured.
  • the conductive sheet 20 may be inserted into the positioning hole 11 using the positioning and mounting portion 23 alone, or may be welded or bonded to the substrate 10 by the body 21 alone; or, the conductive sheet 20 may be inserted into the positioning hole 11 by the positioning and mounting portion 23 alone.
  • the main body 21 and the substrate 10 are welded to enhance the connection strength between the conductive sheet 20 and the substrate 10; preferably, the conductive sheet 20 is inserted into the positioning hole 11 using the positioning and mounting portion 23; for this embodiment Wherein, the conductive sheet 20 is inserted into the positioning hole 11 through the positioning and mounting portion 23.
  • the substrate 10 is provided with Take two conductive sheets 20 as an example.
  • the two conductive sheets 20 are respectively the first conductive sheet 20a and the second conductive sheet 20b. Based on the first conductive sheet 20a and the second conductive sheet 20b, the positioning holes 11 provided on the substrate 10 are performed. Description.
  • first conductive sheets 20a and second conductive sheets 20b are provided on the substrate of the chip 100, wherein the first conductive sheet 20a is arranged on the -Y side of the second conductive sheet 20b.
  • a conductive sheet 20a is taken as an example, and the structure of the conductive sheet is introduced in detail.
  • the first conductive sheet 20a provided in this embodiment has: a cell connecting portion 22 in contact with the eighth contact pin 218, a positioning and mounting portion 23 fixed on the substrate 10, and a body connecting the cell connecting portion 22 and the positioning and mounting portion 23 twenty one.
  • the positioning mounting portion 23 cooperates with the positioning hole 11 for positioning the first conductive sheet 20a.
  • the first conductive sheet 20a has a conductive sheet contact area 22a that is in contact with the first vertical portion 218d of the eighth contact pin 218, and the conductive sheet contact area 22a is located at the +X axis end of the cell connection portion 22 of the first conductive sheet 20a, Further, the conductive sheet contact area 22a is located at the +X axis end of the first conductive sheet 20a.
  • the cell connecting portion 22 is perpendicular to the main body 21, and the positioning and mounting portion 23 is perpendicular to the main body 21; the main body 21 is arranged on and parallel to the front surface 10a where the substrate terminals 201-207 are located.
  • the first conductive sheet 20a includes a first surface 20e, a second surface 20g, a third surface 20c, a fourth surface 20d, and a fifth surface 20f.
  • the first surface 20e and the second surface 20g are parallel and opposite to each other, and they are parallel to the front surface 10a.
  • the third surface 20c is parallel to and opposite to the fourth surface 20d.
  • the third surface 20c and the fourth surface 20d are respectively located on the -Y axis side and the +Y axis side of the first conductive sheet 20a.
  • the first surface 20e and the second surface 20g are also two surfaces of the body 21.
  • the third surface 20c and the fifth surface 20f are the two surfaces of the battery core connecting portion 22, and they are parallel and opposite to each other.
  • the third surface 20c and the fifth surface 20f are respectively located on the ⁇ Y axis side and the +Y axis side of the cell connection portion 22.
  • the cell connecting portion 22 is perpendicular to the main body 21, and the positioning and mounting portion 23 is perpendicular to the main body 21.
  • This structure reduces the number of parts of the chip, has a simple structure and high production efficiency.
  • the contact area between the conductive sheet and the substrate is increased, and the positioning position of the conductive sheet and the substrate is increased, so that the design of the positioning and mounting part becomes simple and easy to operate, thereby making the assembly of the conductive sheet and the substrate 10 easier.
  • the deformation of the battery core connecting portion 22 will result in the failure to accurately contact the eighth contact pin 218.
  • the body 21 is arranged on and parallel to the front surface 10a where the substrate terminal is located, so that during the reproduction process, only the front surface 10a of the substrate 10 is needed to complete the installation, positioning, and welding of the conductive sheet, without the need to transfer to the substrate 10.
  • the back surface 10b is made to facilitate production and improve production efficiency.
  • the positioning mounting portion 23 is 4 protrusions protruding from the body 21, and the 4 protrusions are perpendicular to the front surface 10a of the substrate; the positioning hole 11 is used to cooperate with the positioning mounting portion 23, and the 4 protrusions are inserted into the positioning hole 11 , Making the installation of the conductive sheet easier and more convenient.
  • the first conductive sheet 20a and the first vertical portion 218d of the eighth contact pin 218 are because the first conductive sheet 20a is made of metal and is welded to The substrate 10 does not have elasticity.
  • the first conductive sheet 20a When the ink container 300 is mounted on the holding portion 200, the first conductive sheet 20a will press the first vertical portion 218d of the eighth contact pin 218, so that the first vertical portion 218d will move in the +X axis direction, and the first conductive sheet
  • the contact area 22a of 20a will enter the eighth slit 228, the +X axis side of the first conductive sheet 20a will be inserted into the eighth slit 288, and a part of the third surface 20c and the fifth surface 20f will also be inserted into the
  • the eight slits 228 have a positioning effect on the chip and increase the accuracy of contact between the chip and the contact pin.
  • the second conductive sheet 20b has the same contact form and function as the first conductive sheet 20a, and a detailed description thereof will not be provided here.
  • a plurality of positioning holes 11 are provided on the substrate 10, and the plurality of positioning holes 11 are divided into a plurality of positioning hole groups distributed in rows and parallel, and the row spacing between adjacent positioning hole groups is determined according to the positioning and mounting part of the conductive sheet. Adjustment.
  • the positioning holes between adjacent hole groups can be arranged oppositely or staggered.
  • a first conductive sheet 20a and a second conductive sheet 20b are provided on the substrate 10 with left-right symmetry, wherein each conductive sheet includes four positioning and mounting portions 23. Accordingly, the substrate 10 needs to be provided with four The two positioning holes 11 are used to install a conductive sheet 20.
  • the substrate 10 is provided with two rows of positioning hole groups, which include a first positioning hole group and a second positioning hole group.
  • the first positioning hole group and the second hole group are arranged on the substrate 10 at intervals.
  • the group includes four first positioning holes 11a located in the same row, the second positioning hole group includes four second positioning holes 11b located in the same row, and the first positioning hole group is arranged above the second positioning hole group;
  • a positioning hole 11a and a second positioning hole 11b may be arranged oppositely or alternately; correspondingly, the positioning and mounting parts 23 on both sides of the conductive sheet 20 may be arranged oppositely or alternately.
  • the positioning and mounting portion 23 is provided with a bending portion at one end away from the main body 21; the bending portion is connected to the positioning and mounting portion 23, and the bending portion is clamped on the substrate 10 and is located away from the substrate 10 On a surface of the body 21. Specifically, one end of the positioning and mounting portion 23 is connected to the body 21, and the other end is inserted into the positioning portion 11 of the substrate 10 and protrudes from the surface of the substrate 10 (the back surface 10b or the front surface 10a).
  • this embodiment takes the conductive sheet 20 mounted on the front surface 10a of the substrate 10 as an example for description: the positioning and mounting portion 23 is inserted into the positioning portion 11 from the front surface 10a of the substrate 10, and the positioning and mounting portion 23 The end away from the main body 21 protrudes from the back surface 10b of the substrate 10 and is bent to form a bent portion.
  • the bent portion can be attached to the back surface 10b of the substrate 10 to prevent the positioning and mounting portion 23 from falling out of the insertion hole.
  • the positioning and mounting portion 23 is inserted into the positioning portion 11 from the back surface 10b of the substrate 10, and the end of the positioning and mounting portion 23 away from the body 21 protrudes from the front surface 10a of the substrate 10 and is bent to form a bent portion.
  • the bent portion can be attached to the front surface 10a of the substrate 10 to prevent the positioning and mounting portion 23 from falling off from the insertion hole; as shown in FIGS. 13 and 14.
  • the number of conductive sheets may be one or more. When the number of conductive sheets is an even number, the conductive sheets are symmetrically distributed on the chip substrate 10 along the center line L1.
  • the number of holes in the second part of the conductive sheet and the chip substrate 10 can be one or more, both of which can achieve the purpose of positioning.
  • the first conductive sheet 20a and the second conductive sheet 20b may be two parts arranged on the same metal sheet during the production process, and the metal sheet is positioned and welded to After the chip substrate 10 is mounted, a punch is used to punch the metal sheet into a first conductive sheet 20a and a second conductive sheet 20b.
  • This production method increases the operability of the producer, optimizes the production process, and increases the production efficiency.
  • FIG. 15 is a schematic diagram of the contact pin holder 201 and the chip 100 in the first embodiment.
  • FIG. 15 is a schematic diagram of the chip 100 and the contact pin holder 201 when the ink container 300 is mounted on the holding part 200.
  • the first conductive sheet 20a is in contact with the first vertical portion 218d of the eighth contact pin 218, because the first conductive sheet 20a is made of a metal material and is welded to the chip substrate 10, and has no elasticity.
  • the first conductive sheet 20a When the ink container 300 is installed on the holding portion 200, the first conductive sheet 20a will press the first vertical portion 218d of the eighth contact pin 218, so that the first vertical portion 218k will move in the +X axis direction, and the first conductive sheet
  • the contact area 2082 of 20a will enter the eighth slit 228, the +X axis side of the first conductive sheet 20a is inserted into the eighth slit 228, and a part of the third surface 20c and the fifth surface 20f will also be inserted into the eighth slit In 228, the chip 100 is positioned to increase the accuracy of the contact between the chip 100 and the contact pin.
  • the second conductive sheet 20b has the same contact form and function as the first conductive sheet 20a, and a detailed description thereof will not be provided here.
  • the chip 100 has: a set of first limiting slots 12, a set of second limiting slots 13, and a set of third limiting slots 14.
  • a set of first limiting grooves 12, a set of second limiting grooves 13, and a set of third limiting grooves 14 are through grooves that penetrate through the thickness direction of the chip substrate 10 (ie, the X-axis direction).
  • the third limiting slot 14 is provided on the side of the -Y axis, the -Z axis and the side of the +Y axis and the -Z axis of the chip 100.
  • the third limiting groove 14 has a first limiting groove surface 14a on the +Y axis side.
  • the contact pin 219 plays a role of positioning and increases the accuracy of the contact between the chip 100 and the contact pin.
  • the second limiting groove 13 is provided on the ⁇ Y axis side and the +Y axis side of the chip 100.
  • the first limiting slot 12 is provided on the -Y axis, +Z axis side and the +Y axis, +Z axis side of the chip 100.
  • the internal application of the inkjet printer to the eighth contact pin 218 and the ninth contact pin 219 is a high voltage (such as a 42V square wave) to detect the ink volume of the ink container 300 or to detect whether the ink container 300 is installed in ⁇ 200 ⁇ .
  • the operating voltage of the wafer 40 is relatively low, so the inkjet printer applies a low voltage (2.7V-3.3V) to the first contact pin 211 to the seventh contact pin 217 and the wafer 40.
  • the eighth contact pin 218 and the ninth contact pin 219 are located in the third limit slot 14
  • the third limiting groove surface 14a has a blocking and isolating effect on the eighth contact pin 218 and the ninth contact pin 219, which prevents the eighth contact pin 218 and the ninth contact pin 219 from contacting the substrate terminals, increasing This improves the safety of the chip 100 and avoids damaging the chip 100 and the circuits in the inkjet printer.
  • the chip 100 can be fixed to the ink container 300 through the second limit groove 13 or the first limit groove 12 and the corresponding protrusions provided on the ink container 300, or it can be fixed to the ink container 300 by pasting. On the container 300.
  • the first conductive sheet 20a and the second conductive sheet 20b are positioned with the chip 100 substrate 10 through the first positioning hole 11a and the second positioning hole 11b, and the conductive sheet is welded It is soldered on the substrate 10 of the chip 100.
  • the substrate 10 is provided with a left terminal 38a, a right terminal 38b, a left rear terminal 39a, a right rear terminal 39b, a wafer 40, and electronic components.
  • the left terminal 38a corresponds to the first conductive sheet 20a
  • the right terminal 38b corresponds to the second conductive sheet 20b.
  • first spot heated tin (for soldering) on the left terminal 38a and then place the first conductive sheet 20a on the substrate 10 through the first positioning hole 11a.
  • the tin will first The conductive sheet 20a and the substrate 10 are welded together.
  • the left terminal 38a is connected to the left rear terminal 39a provided on the back surface 10b of the substrate 10 through wiring in the substrate 10, and the left rear terminal 39a is connected to the wafer 40 or electronic components through the wiring in the substrate 10.
  • the second conductive sheet 20b has the same production process and arrangement as the first conductive sheet 20a.
  • first spot heated tin (for soldering) on the right terminal 38b and then pass the second conductive sheet 208 through the
  • the two positioning holes 11b are placed on the substrate 10 of the chip 100, and at the same time, the tin will solder the second conductive sheet 20b and the substrate 10 together.
  • the right terminal 38b is connected to the right rear terminal 39b provided on the back surface 10b of the substrate 10 through wiring in the substrate 10, and the right rear terminal 39b is connected to the wafer 40 or electronic components through the wiring in the substrate 10. This allows the second conductive sheet 20b to perform corresponding functions.
  • this embodiment is to enhance the connection strength between the conductive sheet and the substrate.
  • the substrate 10 is provided with a left terminal 38a and a right terminal 38b at one end close to its upper surface 10f.
  • the left terminal 38a and the right terminal 38b are both located on the substrate.
  • the left terminal 38a extends to the upper side of the substrate and the left side to the edge of the substrate to increase the surface area of the left terminal 38b, thereby increasing the welding area with the left conductive sheet And solder joints, which can enhance the connection strength between the left conductive sheet and the substrate and prevent it from falling off the substrate; similarly, the upper and right sides of the right terminal 38b extend to the edge of the substrate to increase the surface area of the right terminal, thereby The welding area and solder joints with the left conductive sheet can be increased, and the connection strength between the left conductive sheet and the substrate can be enhanced to prevent it from falling off the substrate.
  • the surface areas of the left terminal 38a and the right terminal 38b are further increased, as shown in FIG. 23 As shown, the left side of the left terminal 38a can be extended and wrapped around the left side positioning hole, and a gap is maintained with the right terminal. In addition, the right side of the right terminal 38b can be extended and wrapped around the right side positioning hole, and the left terminal 38a Keep the gap.
  • the substrate 10 is provided with a substrate terminal 30 electrically connected to the contact pins, an additional terminal is also provided between the substrate terminal 30 and the conductive sheet 20; the additional terminal and at least one wafer 40 that stores data with the chip 100 Phase connection.
  • one or more substrate terminals 30 are provided on the substrate 10, the number of which can be the same as the number of contact pins.
  • the number of contact pins and the number of substrate terminals 30 may also be different.
  • One of the contact pins is empty, which is an empty contact pin. The empty contact pin is not connected to the internal circuit of the inkjet printer or the connected circuit does not affect Use of ink containers.
  • the substrate 10 has only 4 substrate terminals and the contact pins have 9 contact pins.
  • the first substrate terminal 31 on the substrate 10 has an extension part, which contacts the first contact pin 211 and the second contact pin 212 at the same time, and the first substrate terminal 31 has two contact areas. Using this technology can be used to detect whether the ink container 300 is correctly installed in the holder 200.
  • the first contact pin 211 and the second contact pin 212 are in contact with the first substrate terminal 31 at the same time, and the first contact pin 211 and the second contact pin 212 will be covered by the first substrate.
  • the terminals 31 are connected together, and the voltages on the first contact pin 211 and the second contact pin 212 are the same. In the end, it is only necessary to detect whether the voltage on the first contact pin 211 and the second contact pin 212 become consistent. Whether the first substrate terminal 31 is contacted at the same time, the installation test is further completed.
  • the position of the substrate 10 corresponding to the fourth contact pin 214 (that is, the position of the fourth substrate terminal 34 on the substrate 10) does not have a terminal, and the substrate 10 does not have a contact area with the fourth contact pin 214.
  • the fourth contact pin 214 is not connected to the internal circuit of the inkjet printer and is an empty contact pin.
  • the remaining substrate terminals, conductive sheets, and chip 100 are consistent with the connection form of the seven substrate terminals provided on the substrate.
  • FIG. 25 is a schematic diagram of another chip 100 of the first embodiment.
  • the substrate 10 has seven substrate terminals 31-37, and the seven substrate terminals 31-37 are arranged in a row in a rectangular shape.
  • the contact area is still consistent with the chip 100 shown in FIG. 6.
  • the shape of the substrate terminal on the substrate 10 is changed, and the beneficial effects of this embodiment can still be achieved.
  • the substrate 10 is provided with a first substrate terminal 31, a second substrate terminal, a third substrate terminal 33, a fourth substrate terminal 34, a fifth substrate terminal 35, a sixth substrate terminal 36, and a first substrate terminal.
  • Seven substrate terminals 37, and a first conductive sheet 20a and a second conductive sheet 20b are provided at one end of the substrate, and a first additional terminal 51a and a second conductive sheet are provided between the substrate terminal and the first conductive sheet 20a.
  • a second additional terminal 51b is provided in between; the second substrate terminal 32, the third substrate terminal 33, the fifth substrate terminal 35, and the seventh substrate terminal 37 (hereinafter collectively referred to as the wafer 40 terminal) are connected to the wafer 40.
  • the first additional terminal 51 a is connected to the second substrate terminal 32 (for example, by a wire provided on the substrate 10 ), and the second additional terminal 51 b is connected to the seventh substrate terminal 37. That is, the first additional terminal 51a and the second additional terminal 51b may correspond to the extension portions of the substrate terminal connected to the wafer 40. Because of the existence of the first additional terminal 51a and the second additional terminal 51b, there is a barrier between the conductive sheet and the first substrate terminal 30 and the second substrate terminal 30. This structure reduces the conductive sheet 20 and the first substrate terminal 31, The two substrate terminals 32 may be short-circuited in series. Moreover, the wafer terminal is usually equipped with an ESD protection circuit.
  • the ESD protection circuit can allow the first substrate terminal to withstand hundreds of volts to thousands of volts. Therefore, even if the wafer 40 terminal and the conductive sheet 20/first substrate terminal 31, A short circuit occurs between the second substrate terminals 32, and the risk of damage to the inkjet printer/ink container is relatively low. In this way, the wafer terminals are arranged between the conductive sheet 20 and the first substrate terminals 31 and the second substrate terminals 32 to reduce The possibility of short-circuit series between them reduces the risk of damage.
  • FIG. 20 is a schematic diagram of the above-mentioned chip 100 being mounted on an ink container 300.
  • the adapter 340 is a part of the ink container 300. Generally, the adapter 340 cooperates with the box body 310 to form a complete ink container 300. When the ink in the cartridge body 310 is exhausted, only the cartridge body 310 needs to be replaced, and the adapter can continue to be used, which reduces the cost and saves resources.
  • the adapter 340 has a notch 343 for inserting the ink outlet 311, a chip mounting surface 340c, two opposite first raised posts 341 and two opposite second raised posts 342.
  • the chip 100 is placed on the chip mounting surface 340c.
  • Two oppositely arranged first limiting slots 11 and two oppositely arranged second limiting slots 13 on the chip 100 are used to fix the chip 100 on the ink container 300.
  • the two first raised posts 341 on the adapter 340 are respectively matched with the two second limiting slots 13 and the two second raised posts 342 are respectively matched with the first limiting slots 11, so that the chip 100 can be fixed in the ink container 300 up.
  • the shapes of the first protrusion 341 and the second limiting groove 13 match each other.
  • the first protrusion 341 abuts the third limiting groove 11, so that the chip 100 does not Move on the adapter 340.
  • the mating form of the second protruding column 342 and the first limiting groove 11 is consistent, and detailed description thereof will not be provided here.
  • this embodiment also provides another ink container, including a chip 100 of the ink container; the chip 100 is provided with a plurality of limit slots, and the ink container is provided with A plurality of limit blocks matched with the limit slot; the chip 100 can be detachably mounted on the ink container through the limit slot and the limit block.
  • FIG. 26 another ink container provided by this embodiment includes a chip holder 320, and the chip holder 320 can be detachably mounted on the ink container.
  • FIG. 27 is a holding part that matches the ink container. 200, for mounting the ink container with the chip holder 320 to the holding part 200.
  • the ink container 300 includes a box body 310, an ink outlet 311 provided on the box body 310, and a clamping part 312.
  • the clamping part 312 is used to connect the box body 310 to the holding part 200 of the inkjet printer.
  • One side of the ink outlet 311 is provided with a mounting surface for mounting the chip 100, and a plurality of limit blocks are provided on both sides of the mounting surface, and the substrate 10 of the chip 100 is provided with a plurality of limit slots, which can be set in On the left and right sides of the substrate 10, the position of the limiting block on the box body and the position of the limiting groove on the substrate 10 are not limited, and the chip 100 can be detachably connected to the box body.
  • the holding part 200 has a bottom wall 200a.
  • Ink is stored in the cartridge 310, and the ink reaches the ink supply unit 202 through the ink outlet 311, and the ink supply unit 202 can supply the ink to the print head, so that the ink can be used to perform printing.
  • the first side wall 200c in the holding portion 200 is not perpendicular to the bottom wall 200a, but is inclined relative to the bottom wall 200a.
  • the chip 100 is mounted on the chip holder 320, and the combination of the chip holder 320 and the chip 100 is installed at an inclined position on the ink container 300 through the first locking hole 313.
  • the chip 100 can be electrically connected to the contact pins on the contact pin holder 201 for mutual transmission of electrical signals.
  • the clamping portion 312 is used for fixing the ink container 300 to the holding portion 200, and the clamping portion 312 cooperates with the fixing portion 204 to prevent the ink container 300 from being separated from the holding portion 200.
  • the box body 310 also includes a chip holder 320, which is used to fix the chip 100.
  • the chip 100 is detachably connected to the chip holder 320 and is located on the box body 310 at the chip mounting position.
  • the box body 310 is provided with a chip for mounting the chip.
  • the mounting cavity of the rack 320 so that the chip rack 320 can be inserted and installed in the mounting cavity.
  • the limit block provided on the box body 310 can be located on the chip rack 320 and close to the surface of the mounting surface of the chip 100; the chip 100 is provided with multiple The limit slot matched with the limit block allows the chip 100 to be detachably connected to the chip holder 320, and then the chip holder 320 is fixed on the box body 310 to realize the mounting of the chip 100 on the ink container.
  • the box body 310 is provided with at least one first locking hole 313 on both sides of the mounting cavity.
  • the chip carrier 320 includes a first connecting portion 325 and a first fixing portion 321.
  • the first fixing portion 321 is provided with On the mounting surface of the chip 100, the first connecting portion 325 is used to fix the chip holder 320 on the box body 310, and first positioning bosses that are matched with the first positioning holes 313 are respectively provided on both sides of the first connecting portion 325 326. After the chip carrier 320 is inserted into the mounting cavity, the first positioning boss 326 can be inserted into the first positioning hole 11a to fix the chip carrier 320 on the box body 310.
  • the first connecting portion 325 can be formed by extending the first fixing portion 321, that is, one end of the first connecting portion 325 is connected to the first fixing portion 321, and the other of the first connecting portion 325
  • One end is provided with a second limiting boss 327
  • an elastic element 328 is sleeved on the second limiting boss 327
  • one end of the elastic element 328 is formed by abutting between the second limiting boss 327 and the first connecting portion 325
  • the other end of the elastic element 328 abuts on the inner wall of the mounting cavity.
  • the elastic element 328 provided in this embodiment may be made of silica gel or rubber.
  • the second limiting boss 327 may be a cylinder, and an abutting surface is formed between the cylinder and the first connecting portion 325; the elastic element 328 is sleeved on the cylinder, One end abuts against the abutting surface, and the other end abuts against the inner wall of the mounting cavity, so that the chip holder 320 is elastically mounted in the mounting cavity of the box body 310.
  • an inclined surface 329 is provided at one end of the first connecting portion 325 away from the first fixing portion 321, and the inclination angle of the inclined surface 329 is inclined toward the rotation direction of the chip carrier 320, so that the first connecting portion 325 There is a certain gap between the end of the chip carrier 320 and the cavity wall of the mounting cavity, so that the chip carrier 320 can rotate in the mounting cavity; when the ink container 300 with the chip carrier 320 is installed to the holder 200 of the printer, the two sides of the chip carrier 320 A first positioning boss 326 is provided, and a first locking hole 313 is provided on the box body of the ink container 300, and the first positioning boss 326 is installed in the first locking hole 313 and the first positioning boss 326 can be positioned at Rotate in the first position hole 313; when the chip holder 320 is inserted into the ink container 300 of the inkjet printer, the first positioning boss 326 is inserted into the first position hole 313, and the box body is rotated to
  • the inclined surface 329 provided on the first connecting portion 325 allows the chip carrier 320 to have a certain rotatable angle in the mounting cavity, and the rotation angle may be 10° to 15°, preferably 12.4°.
  • the chip 100 of this embodiment includes at least one conductive sheet, and the following uses two conductive sheets as an example for description.
  • 16 and 17 are schematic diagrams of the chip in the second embodiment. As shown in FIGS. 16 and 17, the chip 100 has a chip substrate 10, a first conductive sheet 20a, and a second conductive sheet 20b.
  • the seven substrate terminals 31-37 on the chip substrate 10 are arranged in two rows in the Z-axis direction, and along the -Z-axis direction, they are the first row R1 and the second row R2 in sequence.
  • the chip 100 has a first recess 151, a second recess 152, a third recess 153, a fourth recess 154, a fifth recess 155, a sixth recess 156, and a seventh recess 157.
  • the third recess 153, the fourth recess 154, and the seventh recess 157 can be used as positioning recesses to fix the chip 100 to the adapter 340 or the ink container 300.
  • the third recess 153, the fourth recess 154, and the seventh recess 157 Matching with the protrusions on the chip holder 320 or the adapter 340 or the ink container 300 are used to fix the chip 100 on the chip holder 320 or the adapter 340 or the ink container 300.
  • the third concave portion 153 and the fourth concave portion 154 are located on the +Z axis direction side of the chip 100 and have a circular hole shape;
  • the seventh concave portion 157 is located on the ⁇ Z axis direction side of the chip 100 and have a semicircular shape.
  • the third recess 153, the fourth recess 154, and the seventh recess 157 may have other shapes, as long as the chip 100 can be secured.
  • the positioning portion 11 of the positioning conductive sheet 20 is two through holes passing through the chip 100 in the thickness direction.
  • the positioning portion 11 may be a plurality of positioning holes.
  • the positioning portion 11 is a first positioning hole 11a and a second positioning hole 11b.
  • the positioning mounting portion 23 of the conductive sheet 20 passes through the positioning portion 11 to position the conductive sheet 20.
  • the positioning installation portion 23 is a protrusion protruding from the main body 21, and the positioning installation portion 23 is inserted into the corresponding positioning portion 11.
  • the conductive sheet 20 can be fixed to the conductive sheet 20 by fixing the positioning and mounting portion 23, the main body 21 and the corresponding parts of the chip substrate by welding or pasting.
  • the substrate terminals 31-37 are arranged on the front surface 10a of the chip 100, the substrate terminals 31-37 are in contact with the corresponding contact pins on the contact pin holder 201, and each substrate terminal has a substrate terminal contact that contacts the corresponding contact pin.
  • the front surface 10a of the chip 100 is the front surface 10a of the chip substrate
  • the back surface 10b of the chip 100 is the back surface 10b of the chip substrate.
  • the body 21 of the conductive sheet 20a, 20b is arranged on the back surface side of the chip 100; the cell connection portion 22 of the conductive sheet 20a, 20b passes through the fifth recess 155 and the sixth recess 156 of the chip 100 from the back surface 10b side And it protrudes from the front surface 10a.
  • the main body 21 of the conductive sheets 20a, 20b is disposed on the back surface 10b side of the chip 100, and the cell connection portion 22 of the conductive sheets 20a, 20b extends from the main body 21 toward the +X axis side of the chip substrate.
  • the cell connecting portion 22 passes through the fifth recess 155 and the sixth recess 156 as avoiding recesses, and protrudes from the front surface side of the chip substrate to contact the corresponding contact pins.
  • the reasonable layout of the substrate terminals and the conductive sheets is better realized, making the chip 100 easier to achieve miniaturization.
  • the fifth recess 155 and the sixth recess 156 are respectively located on the ⁇ Y axis side and the +Y axis side of the chip 100.
  • the 7 substrate terminal contacts are arranged in two rows in the Z-axis direction, along the -Z-axis direction, in the first row and the second row.
  • the cell connection portions 22 of the conductive sheets 20a and 20b are located in the first and second rows. Between rows. Further, the cell connection portions 22 of the conductive sheets 20a, 20b are located between the first row R1 and the second row R2 of the substrate terminals 31-37 spaced apart in the Z-axis direction.
  • the substrate terminal contact portions are arranged in multiple rows in the Z-axis direction, and the cell connection portions 22 of the conductive sheet 20 are located between the multiple rows formed by the substrate terminal contact portions.
  • the substrate terminals 30 may be arranged in multiple rows (for example, 3 rows, 4 rows) in the Z-axis direction, and the cell connection portions 22 of the conductive sheet 20 are located between the multiple rows formed by the substrate terminals.
  • This arrangement can make the conductive sheet 20 contact the first part 218a of the eighth contact pin 218 and the first part 219a of the ninth contact pin 219 when in contact with the contact pin, instead of the conductive sheet in the first embodiment. 20 and the first vertical portion 218d of the eighth contact pin 218, and the first vertical portion 219d of the ninth contact pin 219.
  • At least a part of the cell connecting portion 22 of the conductive sheet 20 penetrates into the contact pin groove, and needs to press the first vertical portion 218d of the eighth contact pin 218 and the first vertical portion of the ninth contact pin 219 219d, because the first vertical portion 218d and the first vertical portion 219d of the ninth contact pin 219 are relatively close to the fixed parts (horizontal portions 218f, 219f) of the contact pin, which makes it easy to over-press the contact pins 218 and 219, which may cause contact Damage to the needle or failure of its elastic deformability.
  • the conductive sheets 20a and 20b are in contact with the first portion 218a of the eighth contact pin 218 and the first portion 219a of the ninth contact pin 219.
  • the conductive sheet will not enter the contact pin groove and is easier to contact with the contact pin. Contact, while avoiding the situation of electrical connection failure caused by excessive squeezing of the contact pin.
  • FIG. 18 is a schematic diagram of the first conductive sheet 20a.
  • the cell connecting portion 22 of the first conductive sheet 20a is perpendicular to the main body 21, and the positioning and mounting portion 23 is perpendicular to the main body 21; the main body 21 is parallel to the surface 10a where the substrate terminals are located and is arranged on one side of the back surface 10b of the chip 100.
  • the length D1 of the core connecting portion 22 in the Y-axis direction is greater than the length D2 in the Z-axis direction.
  • the length in the Y-axis direction is relatively large, even if the ink container has a positional deviation or offset in the Y-axis direction, it will not cause the chip to be unrecognizable, making the contact between the conductive sheet and the contact pin more stable.
  • the arrangement and structure of the second conductive sheet 20b and the first conductive sheet 20a are symmetrically arranged along the center line L1.
  • the chip substrate 10 is provided with a left rear terminal 39a, a right rear terminal 39b, a wafer 40, and electronic components.
  • the left rear terminal 39a corresponds to the first conductive sheet 20a
  • the right rear terminal 39b corresponds to the second conductive sheet 20b.
  • the first conductive sheet 20a is fixed to the chip substrate 10 through the left rear terminal 39a by welding or pasting, and the first conductive sheet 20a is electrically connected to the wafer 230 or the electronic component 231 through the left rear terminal 39a.
  • the second conductive sheet 20b is fixed to the chip substrate 10 through the right rear terminal 39b by welding or pasting, and the second conductive sheet 20b is electrically connected to the wafer 40 or electronic components through the right rear terminal 39b.
  • the positioning and mounting portion 23 of the first conductive sheet 20a is in the -Z axis direction of the cell connecting portion 22, and further, the substrate terminals 31-34 of the first row R1 are positioned on the positioning and mounting portion 23 of the first conductive sheet 20a and the cell Between the connecting parts 22, the chip can be further miniaturized and the size of the chip can be reduced.
  • the cell connection portion 22 and the positioning and mounting portion 23 of the first conductive sheet 20a may be located on both sides of the main body 21 respectively.
  • the cell connecting portion 22 and the positioning and mounting portion 23 may be located on the same side of the main body 21 respectively.
  • additional terminals may be provided on the front surface 10a of the chip substrate.
  • the additional terminals are blocked between the cell connection portion of the conductive sheet and the corresponding adjacent substrate terminal, that is, between the substrate terminal 30 and the conductive sheet 20
  • An additional terminal is also provided to avoid short circuit between the conductive sheet and the adjacent substrate terminal.
  • the additional terminal can extend from the substrate terminal located on the inner side in the Y-axis direction, and the additional terminal is connected to at least one chip 100 that stores data. 40 phase connection.
  • the second substrate terminal 32 of the chip 100 has an additional terminal 32a
  • the third substrate terminal 33 has an additional terminal 33a.
  • the additional terminal 32a is provided between the first substrate terminal 31 and the first conductive sheet 20a
  • the additional terminal 33a is provided between the fourth substrate terminal 34 and the second conductive sheet 20b.
  • the additional terminal has the same technical effect as the first embodiment, and its detailed description will not be provided here.
  • the chip 100 is placed on the chip mounting surface 340c of the ink container.
  • the third recess 153, the fourth recess 154, and the seventh recess 157 on the chip 100 are parts for fixing the chip 100 on the adapter 340.
  • the protrusions on the adapter 340 cooperate with the third recess 153, the fourth recess 154, and the seventh recess 157, so that the chip 100 can be fixed on the adapter 340.
  • the chip 100 of the second embodiment is mounted on the adapter 340 and the chip holder 320 is the same as that of the first embodiment.
  • the detailed explanation will not be provided here.
  • the chip mounting surface of the chip carrier 320 has three bumps. These three protrusions respectively abut against the seventh recess 157, the third recess 153, and the fourth recess 154 on the chip 100, so that the chip 100 is fixed on the chip holder 320.
  • bumps can also be provided on the chip holder 320 to prevent displacement of the first conductive sheet 20a and the second conductive sheet 20b when subjected to external force; specifically, it can be on the -Y axis side of the first conductive sheet 20a,
  • the two conductive sheets 20b are provided with protrusions on the +Y-axis side to block the movement of the first conductive sheet 20a and the second conductive sheet 20b in the Y-axis direction, thereby increasing the accuracy of the contact between the chip 100 and the contact pin.
  • the rest is consistent with the first embodiment.
  • the length of the first substrate terminal 31' on the chip substrate 10' in the Y-axis direction is longer than that of the other terminals. It is in contact with the first contact pin 211 and the second contact pin 212 at the same time.
  • the first substrate terminal 31' has two Contact area. Using this technology can be used to detect whether the ink container 300 is correctly installed in the holding portion 200.
  • the first contact pin 211 and the second contact pin 212 are in contact with the first substrate terminal 31' at the same time, and the first contact pin 211 and the second contact pin 212 will be first
  • the substrate terminals 31' are connected together, and the voltages on the first contact pin 211 and the second contact pin 212 are the same. In the end, it is only necessary to detect whether the voltage on the first contact pin 211 and the second contact pin 212 become consistent. Determine whether the first substrate terminal 31' is simultaneously contacted, and further complete the installation inspection.
  • the chip substrate 10' does not have a terminal at the position corresponding to the fourth contact pin 214 (that is, the position of the fourth substrate terminal 34 on the chip 100), and there is no contact with the fourth contact pin 214 on the chip substrate 10' area.
  • the fourth contact pin 214 is not connected to the internal circuit of the inkjet printer and is an empty contact pin.
  • the remaining substrate terminals and conductive sheets 20a-20b are consistent with the chip 100. There are only 8 contact areas on the chip 100'.
  • Fig. 29 is a schematic diagram of a chip of the fourth embodiment.
  • the chip substrate 10" of the chip 100" has: substrate terminals 31"-37".
  • the substrate terminals 31"-37" are arranged in a row in a rectangular shape. But its contact area is still the same as that of the chip shown in Figure 10. Only the shape of the terminal on the chip substrate of the chip is changed, and the beneficial effects of the present application can still be achieved.
  • the 7 substrate terminal contacts are arranged in two rows in the Z-axis direction, along the -Z-axis direction, in the first row and the second row in sequence.
  • the cell connection portions of the conductive sheets 20a, 20b are located in the first row and the second row between.
  • the substrate terminal contact portions are arranged in multiple rows in the Z-axis direction, and the cell connection portions of the conductive sheets 20a, 20b are located between the multiple rows formed by the substrate terminal contact portions.
  • the characteristics of the substrate terminals and recesses are the same as those described in the first embodiment.
  • Fig. 35 is a schematic diagram of a chip of the fifth embodiment.
  • the difference from the second embodiment is that a part of the substrate terminals are arranged on the lower surface of the chip.
  • the fifth substrate terminal 35 to the seventh substrate terminal 37 are provided on the lower surface 10e of the substrate 10 of the chip 100.
  • the fifth substrate terminal 35, the sixth substrate terminal 36, and the seventh substrate terminal 37 are not only provided on the lower surface 10e, but also provided on the front surface 10a and the back surface 10b.
  • the fifth substrate terminal 35, the sixth substrate terminal 36, and the seventh substrate terminal 37 can be brought into contact with the slope portion of the first portion of the corresponding contact pin.
  • the fifth substrate terminal 35 is in contact with the slope portion of the first portion 215a of the fifth contact pin 215. In this way, the force exerted by the contact pin on the chip can be reduced, and the damage of the chip can be better avoided.
  • the third recess 153, the fourth recess 154, and the eighth recess 158 have a semicircular shape and are used to fix the chip to the ink cartridge.
  • the substrate terminals are on the front surface 10a. In the X-axis direction, most of the substrate terminals 31 to 37 are located on the +X-axis side of the chip substrate 10. It can also be considered that the substrate terminals 31 to 37 are located on the +X axis side of the chip substrate 10 in the X axis direction. The technical effect of the second embodiment can also be achieved.
  • Embodiment 6 is a diagrammatic representation of Embodiment 6
  • Fig. 36 is a schematic diagram of a chip of the sixth embodiment.
  • the difference from the first embodiment is that a part of the substrate terminals are arranged on the lower surface of the chip.
  • the fifth substrate terminal 35 to the seventh substrate terminal 37 are provided on the lower surface 10e of the substrate 10 of the chip 100.
  • the fifth substrate terminal 35, the sixth substrate terminal 36, and the seventh substrate terminal 37 are not only provided on the lower surface 100e, but also provided on the front surface 10a and the back surface 10b.
  • the fifth substrate terminal 35, the sixth substrate terminal 36, and the seventh substrate terminal 37 can be brought into contact with the slope portion of the first portion of the corresponding contact pin.
  • the fifth substrate terminal 35 is in contact with the slope portion of the first portion 215 a of the fifth contact pin 215. In this way, the force exerted by the contact pin on the chip can be reduced, and the damage of the chip can be better avoided.
  • the substrate terminals are on the front surface 10a. In the X-axis direction, most of the substrate terminals 31 to 37 are located on the +X-axis side of the chip substrate 10. It can also be considered that the substrate terminals 31 to 37 are located on the +X axis side of the chip substrate 10 in the X axis direction. The technical effect of the first embodiment can also be achieved.
  • the chip 100 is detachably connected to the chip holder 320.
  • the chip 100 includes a substrate 10, one end of the substrate 10 is provided with a conductive sheet 20, and a conductive sheet 20 is provided along the substrate 10. From one end to its opposite end (as shown in FIG.
  • a set of first limiting slots 12, a set of second limiting slots 13 and a set of third limiting slots are sequentially provided on the substrate 10
  • the position slot 14, the first limit slot 12, the second limit slot 13, and the third limit slot 14 are used as avoiding recesses, and each set of limit slots includes two limit slots symmetrically arranged on both sides of the chip 100;
  • a limiting slot 12 is arranged close to the conductive sheet 20.
  • the third limiting slot 14 extends from the edge of the substrate 10 away from the conductive sheet 20 to near the middle.
  • the length direction of the third limiting slot 14 is parallel to the X-axis direction.
  • the positioning slot 13 is arranged between the first limiting slot 12 and the second limiting slot 13, the second limiting slot 13 can be set as an arc slot, and the first limiting slot 12 and the third limiting slot 14 can be rectangular Notch;
  • the first fixing portion 321 on the chip carrier 320 is provided with a first limiting block 322 matching the first limiting slot 12, and a first limiting block 322 matching the second limiting slot 13 with the first fixing portion 321
  • the second limit block 323 and the third limit block 324 matched with the third limit slot 14; when the chip 100 needs to be installed on the chip holder 320, the first limit block 322 can be abutted on the first limit slot In 12, the second limiting block 323 abuts in the second limiting slot 13, and the third limiting block 324 abuts in the third limiting slot 14, thereby detachably connecting the chip 100 to the chip holder 320.
  • the height of the first limiting block 322 can be protruded from the front surface 10a of the substrate 10.
  • the first limiting block 322 partially abuts on the substrate 10 of the chip 100 and partially abuts Connecting to the cell connection portion 22 of the conductive sheet 20 can prevent the cell connection portion 22 from being deformed, and can enhance the stability of the electrical connection between the cell connection portion 22 and the contact pin.

Landscapes

  • Ink Jet (AREA)

Abstract

一种墨水容器的芯片（100）及墨水容器（300），芯片（100）与喷墨打印机内保持部（200）的触针电性连接；芯片（100）包括基板（10）及安装在基板（10）上的至少一个导电片（20）；基板（10）具有至少一个与喷墨打印机的触针相接触的基板端子以及定位至少一个导电片（20）的定位部（11）；导电片（20）包括本体（21）以及设置在本体（21）一端的电芯连接部（22），电芯连接部（22）与触针相抵接；本体（21）设置有至少一个定位安装部（23），定位安装部（23）与定位部（11）相配合；本体（21）与基板（10）的表面相平行并通过定位安装部（23）安装在定位部上（11）。增大了导电片与基板的接触面积，使得装配更加稳固、简单；同时提升了电芯连接部与触针电性连接稳定性。

Description

墨水容器的芯片及墨水容器
本发明要求于2019年06月28日提交中国专利局、申请号为201921005051.8、申请名称为“一种用于墨水容器的芯片及使用该芯片的墨水容器”的中国专利发明、于2019年07月18日提交中国专利局、申请号为201921138083.5、申请名称为“一种用于墨水容器的芯片及使用该芯片的墨水容器”的中国专利发明、于2019年12月09日提交中国专利局、申请号为201922184114.7、申请名称为“墨水容器的芯片及墨水容器”的中国专利发明、于2019年12月19日提交中国专利局、申请号为201922297657.X、申请名称为“一种用于墨水容器的芯片及使用该芯片的墨水容器”的中国专利发明和于2020年03月13日提交中国专利局、申请号为202020311962.X、申请名称为“一种用于墨水容器的芯片及使用该芯片的墨水容器”的中国专利发明的优先权，其全部内容通过交叉引用结合在本发明中。
技术领域
本发明涉及喷墨打印机技术领域，尤其涉及一种墨水容器的芯片及墨水容器。
背景技术
现有的喷墨打印机中设置有用于容纳墨水容器的保持部，保持部内可拆卸安装有至少一个墨水容器，墨水容器包括芯片，芯片与喷墨打印机的触针电性连接，以实现墨水容器与喷墨打印机之间的信号传输。
芯片一般包括电路板、稳固座及多个接触件，接触件用于与喷墨打印机的触针电性连接；稳固座设置有多个定位插孔，且每个定位插孔内插接有一个接触件，接触件设置有与触针电性连接的接触部分，且接触部分穿过稳定座并凸出稳定座的表面，以使接触部分与喷墨打印机的触针连接。如中国专利CN201510264696.3所描述的内容，如CN201510264696.3专利 的图6所示，芯片1具有：电路板11、接触件12、稳固座13。接触件12的数量是多个，每个接触件12上具有用于电接触打印机设备(喷墨打印机)的接触部分120。稳固座13上设置有多个定位插孔，与接触件12相对应。每个接触件12均需要穿过稳固座13上的定位插孔，使接触部分120露出来以便于与打印机设备相接触。
然而，由于接触件及稳定座等体积较小，并且芯片上还布置有多个零部件，在安装接触件及稳定座时，预留给接触件和稳定座的安装操作空间很小，导致装配困难，降低了墨水容器的生产效率。
发明内容
本发明实施例提供了一种墨水容器的芯片及墨水容器，其将导电片通过定位安装部安装在基板上，芯片与喷墨打印机通过导电片的电芯连接部实现信号传输，并且提高了墨水容器的生产效率。
为了实现上述目的，本发明实施例采用如下技术方案：
本发明实施例一方面提供了一种墨水容器的芯片，所述芯片与喷墨打印机内保持部的触针电性连接；其特征在于，所述芯片包括基板及安装在所述基板的上至少一个导电片；所述基板具有至少一个与所述喷墨打印机的触针相接触的基板端子、以及定位所述至少一个导电片的定位部；所述导电片包括本体以及设置在所述本体一端的电芯连接部，所述电芯连接部与所述触针相抵接；所述本体设置有至少一个定位安装部，所述定位安装部与所述定位部相配合；所述本体与所述基板的表面相平行并通过所述定位安装部安装在所述定位部上。
进一步的，在X轴方向上，所述基板端子位于所述芯片基板的+X轴一侧，所述电芯连接部朝向所述+X轴方向凸出于所述基板端子所在的表面；所述电芯连接部上具有用于与所述触针相接触的导电片接触区域，且所述导电片接触区域位于所述电芯连接部的+X轴端；其中，所述墨水容器安装到所述保持部的方向为Z轴方向，安装的前端侧位置是-Z轴方向，垂直于所述Z轴方向且与所述基板端子所在的表面平行的方向为Y轴方向，垂直于所述Z轴方向和所述Y轴方向的方向为X轴方向，所述墨水容器内部指向所述芯片的方向为+X轴方向；沿+X轴方向观察，在YZ平 面上+Z轴在上方时，+Y轴方向位于左手侧。
进一步的，所述定位安装部位于所述本体的+X轴一侧或-X轴一侧。
进一步的，所述基板上设置有多个所述定位孔；多个所述定位孔分成呈行分布且相互平行的第一定位孔组和第二定位孔组；其中，所述第一定位孔组内的定位孔与所述第二定位孔组的定位孔相对设置或者交错设置。
进一步的，所述导电片的数量为多个，当所述导电片的数量是偶数个时，所述导电片沿中心线L1对称分布在所述芯片基板上，其中，中心线L1穿过所述芯片的所述Y轴方向上的中心点且平行于所述Z轴方向。
进一步的，在所述X轴方向上，所述电芯连接部与所述定位安装部分别位于所述本体的同侧。
进一步的，多个基板端子上具有与相应的触针相接触的基板端子接触部；
导电片的电芯连接部位于基板端子接触部的+Z轴方向上。
进一步的，导电片位于基板端子的+Z轴方向上。
进一步的，多个基板端子上具有与相应的触针相接触的基板端子接触部；所述基板端子接触部在所述Z轴方向上分多排排列，所述导电片的所述电芯连接部位于所述多排基板端子接触部之间。
进一步的，所述基板端子在所述Z轴方向上分多排排列，电芯连接部位于所述多排基板端子之间；在所述Z轴方向上，所述电芯连接部和所述安装定位部分别位于所述本体的两侧。
进一步的，所述电芯连接部在所述Y轴方向的尺寸大于在所述Z轴方向上的尺寸。
进一步的，所述基板还设置有与所述触针相电连接的基板端子，所述基板端子与所述导电片的电芯连接部之间设置有附加端子；所述附加端子与至少一个与芯片的存储数据的晶元相连接的晶元端子电性连接。
进一步的，所述芯片具有两个所述导电片分别为第一导电片、第二导电片；所述第一导电片和所述第二导电片沿所述芯片左右对称分布。
本发明实施例另一方面提供了一种墨水容器，包括所述墨水容器的芯片；所述芯片上设置有多个限位槽，所述墨水容器上设置有多个与所述限位槽相配合的限位块；所述芯片通过所述限位槽及所述限位块可拆卸安装 在所述墨水容器上。
进一步的，所述墨水容器包括用于存储喷墨的盒体及安装在所述盒体上的芯片架；多个所述限位块位于所述芯片架靠近所述触针的表面上。
进一步的，所述盒体设置有容纳所述芯片架的安装腔；所述芯片架包括用于与所述盒体连接的第一连接部及用于固定所述芯片的第一固定部，所述第一连接部的两侧分别设置有第一限位凸台，所述安装腔的侧壁分别设置有与所述第一定位凸台相配合的第一卡位孔；所述第一连接部远离所述第一固定部的一端设置有第二限位凸台，所述第二限位凸台上套接有弹性元件，且所述弹性元件抵接在所述安装腔的内壁上。
进一步的，所述第一连接部远离所述第一固定部的一端设置有斜面，所述第二限位凸台位于所述斜面上；使得芯片及芯片架在所述安装腔内并可旋转；当所述墨水容器与所述喷墨打印机的保持部接触时，芯片与所述喷墨打印机的保持部的侧壁部件之间具有间隙。
与现有技术相比，本发明实施例提供的墨水容器的芯片及墨水容器具有以下优点；
本发明实施例提供的墨水容器的芯片及墨水容器，其芯片包括基板及设置在基板上的导电片，导电片包括本体、电芯连接部、定位安装部，电芯连接部位于本体的一端，定位安装部位于本体的一侧，基板设置有与定位安装部配合的定位部，导电片通过定位安装部插接在定位部内，并可使本体与基板保持贴合，电芯连接部用于喷墨打印机的触针电性连接，已完成芯片与喷墨打印机之间的信息传输。
与现有技术相比，本发明实施例提供的墨水容器的芯片及墨水容器，导电片通过定位安装部插接在基板上，本体与基板的表面保持平行，增大了导电片与基板的接触面积，使得装配更加稳固、简单；另外，导电片的电芯连接部位于本体的一端，防止因安装工艺造成电芯连接部容易发生变形的问题，可提升电芯连接部与喷墨打印机的触针电性连接稳定性；电芯连接部在Y轴方向的长度大于Z轴方向上的长度，Y轴方向上的长度比较大，即使墨水容器在Y轴方向上产生位置偏差或者偏移，也不会导致芯片无法识别的情况，使得导电片与触针接触更加稳定；电芯连接部与基板端子、基板端子接触部的位置关系，使得导电片不会进入到触针槽内，避免 造成触针过渡挤压而产生电连接失效的情况。
除了上面所描述的本发明解决的技术问题、构成技术方案的技术特征以及由这些技术方案的技术特征所带来的有益效果外，本发明提供的墨水容器的芯片及墨水容器所能解决的其他技术问题、技术方案中包含的其他技术特征以及这些技术特征带来的有益效果，将在具体实施方式中作出进一步详细的说明。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对本发明实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一部分实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图。
图1为本发明实施例提供的墨水容器安装至保持部示意图；
图2为本发明实施提供的墨水容器的结构示意图一；
图3为本发明实施例提供的保持部的结构示意图；
图4为本发明实施例提供的触针架的结构示意图；
图5为图4中所示的触针的结构示意图；
图6为本发明实施例提供的芯片的爆炸示意图；
图7为图6中基板的正表面结构示意图；
图8为图6中基板的背表面结构示意图；
图9为图6中导电片的正面结构示意图；
图10为图6中导电片的背面结构示意图；
图11为图6中导电片与基板的连接方式一示意图一；
图12为图6中导电片与基板的连接方式一示意图二；
图13为图6中导电片与基板的连接方式二示意图一；
图14为图6中导电片与基板的连接方式二示意图二；
图15为本发明实施例提供的芯片与触针架的连接示意图；
图16和图17为实施例二中的芯片示意图；
图18为实施例二的左导电片的示意图；
图19为实施例二的芯片与触针架电连接的示意图；
图20为本发明实施例提供的芯片与墨水容器的连接示意图一；
图21为本发明实施例提供的附加端子在基板上的布置示意图一；
图22为本发明实施例提供的左端子及右端子在基板上的布置示意图一；
图23为本发明实施例提供的左端子及右端子在基板上的布置示意图二；
图24为本发明实施例中提供的基板端子在基板上的第二种布置示意图；
图25为本发明实施例中提供的基板端子在基板上的第三种布置示意图；
图26为本发明另一实施例提供的墨水容器的结构示意图；
图27为本发明另一实施例提供的保持部的结构示意图；
图28为实施例三的芯片示意图；
图29为实施例四的芯片示意图；
图30为本发明另一实施例提供的芯片架与芯片的连接示意图；
图31为本发明实施例提供的芯片架的结构示意图；
图32为本发明实施例提供的芯片架与盒体的连接示意图；
图33为本发明实施例提供的芯片架与触针连接示意图一；
图34为本发明实施例提供的芯片架与触针连接示意图二；
图35为实施例五的芯片示意图；
图36为实施例六的芯片示意图。
具体实施方式
为了使本发明的上述目的、特征和优点能够更加明显易懂，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动的前提下所获得的所有其它实施例，均属于本发明保护的范围。
实施例一：
如图1至图3所示，喷墨打印机上具有保持部200，保持部200用于容纳墨水容器，可承载多个或者一个墨水容器300。墨水容器300可拆卸的安装到保持部200上，当墨水容器300使用完毕后，需要更换新的墨水容器。墨水容器300包括芯片100、把手330、出墨口311、盒体310；保持部200具有触针架201、供墨部202、固定部204及开口205；盒体310内存储有墨水，墨水经出墨口311到达供墨部202处，进而供墨部202可以将墨水供给到打印头处，从而墨水可以用于执行打印的动作。芯片100可以与触针架201上的触针相电连接，用于电信号之间的相互传输。把手330用于将墨水容器300固定到保持部200上，把手330与固定部204相配合防止墨水容器300从保持部200中脱离出来。
如图2所示，设定保持部的三维直角坐标系，即XYZ轴坐标系，以墨水容器300安装到保持部200的方向为-Z轴方向，则墨水容器300从保持部脱离的方向为+Z轴方向，开口205位于+Z轴方向上，底壁200a位于-Z轴方向上。一般情况下，喷墨打印机平放在办公桌面或者打印桌面上，保持部200的开口205位于重力方向的上方，底壁200a位于重力方向的下方，由此方便了使用者安装或者拆卸墨水容器300。
进一步的，保持部200可以承载多个或者一个墨水容器300，具有多个或者一个安装位203，4个墨水容器内可以存储4种不同颜色的墨水，例如黑色、黄色、蓝色、红色。如图3所示，保持部200可以承载4个墨水容器300，具有4个安装位203；保持部200是一个近似长方形或者正方形的具有开口205的部件，保持部200的内侧壁及底壁200a构成了安装位203。触针架201安装在保持部200的第一侧壁200c上，安装位203在Y轴方向上依次排列，4个安装位203在Y轴方向上依次排列。同时垂直于Y轴和Z轴的方向为X轴方向，其中，从安装位203指向触针架201的方向为+X轴方向。+X轴垂直于第一侧壁200c；沿+X轴方向观察，在YZ平面上+Z轴在上方时，+Y轴方向位于左手侧。另外，本实施例设置的墨水容器300的三维直角坐标系与保持部200的三维直角坐标系一致。
如图4所示，触针架201具有：基座210、安装在基座210上的多个触针，分别为第一触针211-第九触针219。触针为薄片状的金属片，可以 起到导电作用，且不易磨损。基座210具有多个狭缝，分别为第一夹缝221至第九夹缝229；多个狭缝221-229与多个触针211-219一一对应，多个狭缝221-229均呈U字形，其具有+Z轴方向的狭缝口，多个触针211-219沿-Z轴方向通过狭缝口安装到多个狭缝221-229中。例如，第一触针211沿-Z轴方向通过狭缝口安装到第一狭缝221中；第二触针212-第九触针219的安装方式与之相同，在此不重复阐述。
第一触针211-第九触针219中的每一个触针的一侧通过保持部200内部的电路连接到喷墨打印机的主电路上；另一侧与芯片100电性连接。其中，第一触针211-第九触针219的结构一致，均如图4所示。以第一触针211为例对每个触针的结构进行介绍：第一触针211分为第一部分211a、第二部分211b、第三部分211c。第一部分211a或者第三部分211c用于与芯片100相接触；第二部分211b用于与喷墨打印机内部电路相连接，例如：其通过保持部芯片100与喷墨打印机内的主电路相连接。第三部分211c与第一部分211a、第二部211b相连接。
参阅图2并结合图6，基板10上具有至少一个基板端子30，可在基板10上布置有7个基板端子31-37。其中，触针第一部分211a与第一基板端子201相接触，形成有接触区域；第二部分211b与喷墨打印机内的电路相连接。第三部分211c连接第一部分211a和第二部分211b。第三部分位于第一触针211的+Z轴方向，第一触针211通过第三部分211c或者是第三部分211c的一部分(例如是第三部分211c的水平部分211f)固定在第一狭缝221中。第一部分211a、第二部分211b设置在第一触针211的-Z轴方向的末端，使得，第一部分211a、第二部分211b可以弹性变形且变形后易恢复至原状。第一触针211第一部分211a设置在-X轴方向，第二部分211b设置在+X轴方向。第一部分211a、第二部分211b突出于基座210，第三部分211c非突出于基座210。
进一步的，第一部分211a、第二部分211b在X轴方向上突出于基座210，基座210位于第一部分211a与第二部分211b之间。第一部分211a相比第二部分211b更靠近安装位203。第三部分211c分为垂直于X轴方向的第一垂直部分211d与第二垂直部分211e、平行于X轴方向的水平部分211f；水平部分211f连接第一垂直部分211d与二垂直部分211e。第一 垂直部分211d与第二垂直部分211e沿Z轴方向延伸。第一垂直部分211d相比第二垂直部分211e更靠近安装位203。第一垂直部分211d的末端连接第一部分211a，第二垂直部分211e末端连接第二部分211b，当水平部分211f或者第一垂直部分211d、第二垂直部分211e的+Z轴方向上固定在第一狭缝221的时候，第一触针211的此种结构可以使得第一触针211的第一部分211a、第二部分211b具有弹性，避免了因与喷墨打印机内部电路、芯片100硬性接触磨损第一端子31、第一触针211。第二触针212-第七触针217与第一触针211具有相同的布置、结构，这里将不再提供其详细图示和阐述。第八触针218、第九触针219分别通过第一垂直部分219d、219d与导电片30相电连接，其余与第一触针211具有相同的布置、结构，这里将不再提供其详细图示和阐述。
参阅图2并结合图6和图7，本发明实施例提供的墨水容器的芯片100，芯片100与喷墨打印机内保持部200的触针电性连接；芯片100包括基板10及安装在基板10的上至少一个导电片20；其中基板10具有至少一个与喷墨打印机的触针相接触的基板端子以及定位至少一个导电片20的定位部11，导电片20包括本体21以及设置在本体21一端的电芯连接部22，电芯连接部22与触针相抵接；本体21设置有至少一个定位安装部23，本体21与基板10的表面平行，且本体21贴合安装在基板10上并通过定位安装部23安装在定位部11上。
具体的，墨水容器通常包括芯片100，芯片100与喷墨打印机的触针电性连接，以使墨水容器的芯片100中存储的墨水容器信息传输至喷墨打印机。芯片100包括基板10，基板10整体呈矩形，基板具有正表面10a、背表面10b、左表面10c、右表面10d、上表面10f、下表面10e，其中，正表面10a与背表面10b相平行且相对设置；左表面10c与右表面10d分别是位于芯片100的-Y轴侧及+Y轴侧；上表面10f与下表面10e相平行且相对设置。基板端子位于正表面10a上。在基板10的一端设置有一个或者多个导电片20，导电片20与喷墨打印机的触针接触。当墨水容器安装至喷墨打印机上时，芯片100与触针电性连接，基板10面对触针的面为基板10的正表面10a，与基板10的正面表10a相对的面为基板10的背表面10b。
进一步的，基板10上可布置有七个基板端子，分别为第一基板端子31至第七基板端子37，且在X轴方向上，基板端子201-207位于芯片基板10的+X轴一侧。第一基板端子31与第一触针211的第一部分211a相接触，与第一触针211相接触的区域为第一基板接触区域。第一基板端子31至第七基板端子37上分别具有第一基板接触区域至第七基板接触区域，统称为基板接触区域。多个基板接触区域在Z轴方向上呈多排排列。第一基板端子31至第七基板端子37在Z轴方向上呈两排排列，沿-Z轴方向，第一基板端子31至第四基板端子34在第一排上，第五基板端子35至第七基板端子37在第二排上；进一步的，沿-Z轴方向，第一基板接触区域至第四基板接触区域在第一排上，第五基板接触区域至第七基板接触区域在第二排上。
优选的，本实施中，基板上设置有两个导电片20，两个导电片20为第一导电片20a和第二导电片20b，第一导电片20a与第二导电片20b设置在基板的正表面10a上的；中心线L1穿过芯片100的Y轴方向上的中心点且平行于Z轴方向，第一导电片20a与第二导电片20b以中心线L1为对称中心，对称的分布在基板10上；且中心线L1穿过第六基板端子206。进一步的，芯片100以中心线L1为对称中心相对称。导电片20通过定位部11与芯片基板10相定位。定位形式可以是粘贴、焊接、卡接等固定形式。
如图9和图10所示，本实施例提供的导电片20包括呈矩形状的本体21，本体21的一端设置有电芯连接部22，电芯连接部22可由本体21一端向外折弯形成，本体21沿着电芯连接部22至另一端的方向设置有至少一个定位安装部23，定位安装部23位于本体21一侧的边缘处。当墨水容器安装到喷墨打印机上时，芯片100与触针电性连接，本体21面对触针的面为导电片20的第一表面20e，与第一表面20e相对的面为第二表面20g。其中，电芯连接部22和定位安装部23可分别位于第一表面20e上，或者电芯连接部22位于第一表面20e上，定位安装部23位于第二表面20g上。可以理解的是，电芯连接部22和定位安装部23可呈片状结构及柱状结构，本实施例对电芯连接部22和定位安装部23的形状不加以限制，可优选将电芯连接部22和定位安装部23设置成片状结构。
基板10上设置有用于插接定位安装部23的定位部11，定位部11的数量根据定位安装部23的数量一致；定位部包括定位孔。优选的，定位部11为定位孔。本实施例中为增强导电片20与基板10之间的连接强度或者稳定性，导电片20上可设置有多个定位安装部23，多个定位安装部23分别设置在本体21的两侧，且定位安装部23可沿本体21的边缘设置；例如，本体21的两侧可分别设置有两个定位安装部23，且位于每侧的定位安装部23可相对设置或者交错设置。
待需要将导电片20连接至基板10上时，当选用的导电片20，其定位安装部23和电芯连接部22可位于本体21的第一表面20e，此时导电片20从基板10的背表面10b安装，定位安装部23插入位于基板10上的定位孔11内，且本体21贴合在基板10的背表面10b上，电芯连接部22凸出基板10的正表面10a。当选用的导电片20，其定位安装部23位于本体21的第一表面20e、电芯连接部22位于本体21的第二表面20g上；此时，导电片20的定位安装部23从基板10的正表面10a安装，并插入基板10的定位孔11内，使本体21与基板10的正表面10a平行，甚至贴合，电芯连接部22凸出基板10的正表面10a。
为便于将导电片20的定位安装部23插接在定位孔11内，可在定位安装部23远离本体21的一端设置有引导角，例如，可在呈片状结构的定位安装部23远离本体21的一端进行倒角以形成锥形部23a，便于定位安装部23插入定位孔11内；可在柱状结构的定位安装部23远离本体21的一端设定圆角以形成弧面，便于定位安装部23插入定位孔11内。
本实施例提供的墨水容器的芯片，芯片设置有导电片20，导电片20通过其定位安装部23插接在基板10的定位孔11内，并且导电片20的本体21贴合设置在基板10上，电芯连接部22凸出本体21设置；本体21贴合设置在基板10上可增大两者的接触面积，使得装配更加简单；另外，导电片20的电芯连接部22位于本体21的一端，在导电片20的安装过程中，电芯连接部22不容易发生变形，可提升电芯连接部与喷墨打印机的触针电性连接稳定性。
进一步的，电芯连接部22可垂直设在本体21上，可便于与触针电性连接，定位安装部23亦可垂直安装在本体21上，可便于将定位安装部23 插接在基板10的定位孔11内，同时，基板10的定位孔11的轴线可垂直于基板10的表面，便于在基板10上设置定位孔11。可以理解的是，定位安装部23、芯片100连接部也可倾斜设置在本体21上，本实施优选的将电芯连接部22、定位安装部23垂直设置在本体21上。
导电片20可通过其定位安装部23插接在基板10上的定位孔11内，以将导电片20可拆卸连接在基板10上；另外，在本实施例中，导电片20的本体21与基板10贴合，也可通过本体21将导电片20粘接或者焊接在基板10上，可增加导电片20与基板10的连接强度；电芯连接部22设置在本体21的一端，且电芯连接部22的安装方向与本体21的贴合方向不同，优选的，将电芯连接部22垂直设置在本体21上；若利用本体21焊接或者粘接等工艺将导电片20固定在基板10的过程中，即使本体21发生变形也不会导致电芯连接部22变形，可保证电芯连接部22与触针的电性连接的稳固性。
进一步的，导电片20可单独采用定位安装部23插接在定位孔11内，也可单独利用本体21焊接或者粘接在基板10上；或者，导电片20在利用定位安装部23插接在基板10上后，再将本体21与基板10进行焊接，可增强导电片20与基板10的连接强度；优选的将导电片20利用定位安装部23插接在定位孔11内；对于本实施例中，导电片20通过定位安装部23插接在定位孔11内，由于基板10上设置有多个导电片20，且多个导电片20可阵列分布在基板10上，以基板10上设置有两个导电片20为例，两个导电片20分别为第一导电片20a和第二导电片20b，基于第一导电片20a和第二导电片20b对基板10上的设置的定位孔11进行说明。
例如，本实施例中芯片100基板上设置有两个左右对称的第一导电片20a和第二导电片20b，其中，第一导电片20a布置在第二导电片20b的-Y侧，以第一导电片20a为例，对导电片的结构进行详细介绍。
本实施提供的第一导电片20a具有：与第八触针218相接触的电芯连接部22、固定在基板10上的定位安装部23、连接电芯连接部22和定位安装部23的本体21。定位安装部23与定位孔11相配合，用于定位第一导电片20a。第一导电片20a具有与第八触针218的第一垂直部分218d相接触的导电片接触区域22a，导电片接触区域22a位于第一导电片20a的 电芯连接部22的+X轴端，进一步的，导电片接触区域22a位于第一导电片20a的+X轴端。电芯连接部22与本体21相垂直，定位安装部23与本体21相垂直；本体21设置在基板端子201-207所在的正表面10a上且与之平行。第一导电片20a包括：第一表面20e、第二表面20g、第三表面20c、第四表面20d、第五表面20f。第一表面20e与第二表面20g相平行且相背设置，两者与正表面10a平行。第三表面20c与第四表面20d相平行且相背设置。第三表面20c与第四表面20d分别位于第一导电片20a的-Y轴侧及+Y轴侧。第一表面20e、第二表面20g也是本体21的两个表面。第三表面20c、第五表面20f是电芯连接部22的两个表面，两者相平行且相背设置。第三表面20c与第五表面20f分别位于电芯连接部22的-Y轴侧及+Y轴侧。
电芯连接部22与本体21相垂直，定位安装部23与本体21相垂直，此结构使得芯片减小了零部件数量，结构简单，生产效率高。同时增大了导电片与基板的接触面积，增大了导电片与基板定位的位置，使得定位安装部的设计变得简单，易于操作，进而使得导电片与基板10的装配变得容易。再者，防止因焊接、粘贴等工艺对电芯连接部产生影响导致其变形。
电芯连接部22变形会导致无法准确的与第八触针218相接触。本体21设置在基板端子所在的正表面10a上且与之平行，使得再生产过程中，只需要在基板10的正面10a即可完成导电片的安装、定位、焊接的工作，不需要转到基板10的背表面10b进行，便于生产，提高生产效率。定位安装部23是4个从本体21上突出的凸起，4个凸起垂直于基板的正表面10a；使用定位孔11与定位安装部23相配合，4个凸起插入到定位孔11中，使得导电片的安装更加简单方便。
如图15所示，当墨水容器300安装到保持部200上的时候，第一导电片20a与第八触针218的第一垂直部分218d，因为第一导电片20a是金属材质，且焊接在基板10上，不具有弹性。墨水容器300安装到保持部200上的时候，第一导电片20a会压迫第八触针218的第一垂直部分218d，使得第一垂直部分218d会向+X轴方向移动，进而第一导电片20a的接触区域22a会进入到第八狭缝228中，第一导电片20a的+X轴侧插入到第八狭缝288中，第三表面20c、第五表面20f的一部分也会插入到第八狭 缝228中，使得对芯片起到定位作用，增加了芯片与触针接触的准确性。第二导电片20b与第一导电片20a具有相同的接触形式、功能，这里将不再提供其详细阐述。
进一步的，基板10上设置有多个定位孔11，多个定位孔11分成呈行分布且平行的多个定位孔组，且相邻定位孔组间的行间距根据导电片的定位安装部进行调整。相邻孔组间的定位孔可相对设置，或者交错设置。例如，本实施中基板10上设置有左右对称的第一导电片20a和第二导电片20b，其中，每个导电片均包括四个定位安装部23，相应的，基板10上需设置有四个定位孔11用于安装一导电片20。
因此，基板10上设置有两行定位孔组，其包括第一定位孔组和第二定位孔组，第一定位孔组和第二孔组呈行间隔设置在基板10上，第一定位孔组包括位于同一行的四个第一定位孔11a，第二定位孔组包括位于同一行的四个第二定位孔11b，且第一定位孔组排布在第二定位孔组的上方；第一定位孔11a与第二定位孔11b可相对设置，或者交错设置；相应的，位于导电片20两侧的定位安装部23可相对设置或者交错设置。
在上述实施例的基础上，定位安装部23远离本体21的一端设置有折弯部；折弯部与定位安装部23相连接，且折弯部卡接在基板10上，且位于基板10背离本体21的一表面上。具体的，定位安装部23的一端连接在本体21上，另一端插入基板10的定位部11内且凸出基板10的表面(背表面10b或者正表面10a)。参阅图11和图12，本实施例以导电片20安装在基板10的正表面10a为例进行说明：定位安装部23从基板10的正表面10a插接在定位部11内，定位安装部23远离本体21的一端凸出基板10的背表面10b并进行折弯以形成折弯部，折弯部可贴合在基板10的背表面10b上，防止定位安装部23从插接孔内脱落。同样的，定位安装部23从基板10的背表面10b插接在定位部11内，定位安装部23远离本体21的一端凸出基板10的正表面10a并进行折弯以形成折弯部，折弯部可贴合在基板10的正表面10a上，防止定位安装部23从插接孔内脱落；如图13和图14所示。
导电片的个数可以是一个或者多个，当导电片的数量是偶数个时，导电片沿中心线L1对称分布在芯片基板10上。
导电片的第二部分与芯片基板10的孔的个数可以是一个或者多个，均可以达到定位的目的。
进一步的，为了增加生产过程中的效率和可操作度，第一导电片20a、第二导电片20b在生产过程中可以是设置在同一个金属片上的两部分，将上述金属片定位且焊接到芯片基板10上后，采用冲头将金属片冲断成第一导电片20a、第二导电片20b。此生产方式，增加了生产者的可操作度，优化了生产流程，增加了生产效率。
图15是实施例一的触针架201与芯片100相配合的示意图。图15是墨水容器300安装到保持部200上的时候，芯片100与触针架201的示意图。第一导电片20a与第八触针218的第一垂直部分218d相接触，因为第一导电片20a是金属材质，且焊接在芯片基板10上，不具有弹性。墨水容器300安装到保持部200上的时候，第一导电片20a会压迫第八触针218的第一垂直部分218d，使得第一垂直部分218k会向+X轴方向移动，进而第一导电片20a的接触区域2082会进入到第八夹缝228中，第一导电片20a的+X轴侧插入到第八夹缝228中，第三表面20c、第五表面20f的一部分也会插入到第八夹缝228中，使得对芯片100起到定位作用，增加了芯片100与触针接触的准确性。第二导电片20b与第一导电片20a具有相同的接触形式、功能，这里将不再提供其详细阐述。
如图6、图15所示，芯片100具有：一组第一限位槽12、一组第二限位槽13以及一组第三限位槽14。优选的，一组第一限位槽12、一组第二限位槽13以及一组第三限位槽14是贯穿芯片基板10厚度方向(即X轴方向)的通槽。第三限位槽14设置在芯片100的-Y轴、-Z轴侧和+Y轴、-Z轴侧。第三限位槽14具有+Y轴侧的第一限位槽表面14a。当墨水容器300安装到保持部200上时，第八触针218的第一部分218a位于芯片100的第一限位槽14处，第三限位槽表面14a会对第八触针218、第九触针219起到一个定位的作用，增加了芯片100与触针接触的准确性。第二限位槽13设置在芯片100的-Y轴侧和+Y轴侧。第一限位槽12设置在芯片100的-Y轴、+Z轴侧和+Y轴、+Z轴侧。
另一方面，喷墨打印机内部对第八触针218、第九触针219施加是高压(例如42V的方波)，用于检测墨水容器300的墨水容量或者检测检测 墨水容器300是否安装到保持部200上。晶圆40的动作电压较低，故喷墨打印机对第一触针211-第七触针217及晶圆40施加的是低压(2.7V-3.3V)。对第一限位槽12、第二限位槽13的位置设置，特别是当墨水容器300安装到保持部200上时，第八触针218、第九触针219位于第三限位槽14内，第三限位槽表面14a对第八触针218、第九触针219有阻挡、隔绝作用，防止了第八触针218、第九触针219接触到基板端子上的可能性，增加了芯片100的安全性，避免了损坏芯片100、喷墨打印机内的电路。
芯片100可以通过第二限位槽13或者第一限位槽12与墨水容器300上相对应设置的凸起相配合的方式来固定在墨水容器300上，也可以通过粘贴的方式来固定在墨水容器300上。
参阅图7和图8，在另一实施例中，第一导电片20a和第二导电片20b通过第一定位孔11a和第二定位孔11b与芯片100基板10相定位，导电片通过焊接的方式将其焊接在芯片100基板10上。具体的，基板10上设置有左端子38a、右端子38b、左后端子39a、右后端子39b、晶元40、电子元器件。左端子38a与第一导电片20a相对应，右端子38b与第二导电片20b相对应。在生产过程中，首先在左端子38a上点加热后的锡(用于焊接)，然后将第一导电片20a通过第一定位孔11a放置到基板10上，与此同时，锡会将第一导电片20a与基板10焊接到一起。左端子38a通过基板10内的布线与设置在基板10的背表面10b上的左后端子39a相连接，左后端子39a通过基板10内的布线与晶元40或者电子元器件相连接。使得第一导电片20a可以发挥对应的功能。第二导电片20b与第一导电片20a具有相同的生产过程和布置，在生产过程中，首先在右端子38b上点加热后的锡(用于焊接)，然后将第二导电片208通过第二定位孔11b放置到芯片100基板10上，与此同时，锡会将第二导电片20b与基板10焊接到一起。右端子38b通过基板10内的布线与设置在基板10的背表面10b上的右后端子39b相连接，右后端子39b通过基板10内的布线与晶元40或者电子元器件相连接。使得第二导电片20b可以发挥对应的功能。
进一步的，本实施为增强导电片与基板的连接强度，如图22所示，基板10靠近其上表面10f的一端设置有左端子38a、右端子38b，左端子 38a、右端子38b均位于基板的正表面10a上；本实施例中将左端子38a的延伸至基板上侧及左侧延伸至基板的边缘处，以增大左端子38b的表面积，进而可增大与左导电片的焊接面积及焊点，可以增强左导电片与基板的连接强度，防止其从基板上脱落；同样的，右端子38b的上侧及右侧延伸至基板的边缘处，以增大右端子的表面积，进而可增大与左导电片的焊接面积及焊点，可以增强左导电片与基板的连接强度，防止其从基板上脱落。可以理解的是，左端子38a的右侧与右端子38b的左侧之间具有间隙，为进一步降低两者之间的间隙，进一步增大左端子38a及右端子38b的表面积，如图23所示，可将左端子38a的左侧延伸并包裹其左侧定位孔，并与右端子保持间隙，另外，可将右端子38b的右侧延伸并包裹其右侧定位孔，并与左端子38a保持间隙。
本实施例中，基板10设置有与触针相电连接的基板端子30，基板端子30与导电片20之间还设置有附加端子；附加端子与至少一个与芯片100的存储数据的晶元40相连接。具体的，基板10上设置有一个或者多个基板端子30，其数量可以与触针的数量相一致。当然，触针的数量与基板端子30的个数也可以不一致。例如，基板10上只有5个基板端子、触针有9个触针，其中有一个触针是空置的，是空置触针，空置触针不连接喷墨打印机的内部电路或者连接的电路不影响墨水容器的使用。在另一种实施方式中：基板10上只有4个基板端子、触针有9个触针，除了上述的空置触针外，有2个触针同时与1个基板端子相连接，用于安装检测作用。具体如图24所示，基板10上只有5个基板端子。基板10上的第一基板端子31有延伸部分，其与第一触针211、第二触针212同时接触，第一基板端子31具有2个接触区域。使用此技术可以用于检测墨水容器300是否正确安装到保持部200内。如果墨水容器300正确安装到保持部200内的话，第一触针211、第二触针212同时与第一基板端子31接触，第一触针211、第二触针212就会被第一基板端子31连接到一起，第一触针211与第二触针212上的电压都是一致，最终只需要检测第一触针211与第二触针212上的电压是否变得一致即可得出是否同时接触到第一基板端子31，进一步的完成装机检测。基板10与第四触针214对应的位置(即基板10上的第四基板端子34的位置处)不具有端子，在基板10上不具有 与第四触针214相接触的接触区域。第四触针214不连接喷墨打印机的内部电路，是一个空置触针。其余基板端子、导电片与芯片100均参照基板上设置有7个基板端子的连接形式相一致。
进一步的，如图25是实施例一的另一种芯片100的示意图。基板10具有：七个基板端子31-37，且七个基板端子31-37呈长方形状依次排列为一排。但是其接触区域仍然与图6所示的芯片100一致。基板10上的基板端子的形状改变，仍可达到本实施例的有益效果。
进一步的，如图21所示，基板10上设置有第一基板端子31、第二基板端子、第三基板端子33、第四基板端子34、第五基板端子35、第六基板端子36及第七基板端子37，以及在基板的一端设置有第一导电片20a和第二导电片20b，且上述基板端子与第一导电片20a之间设置有第一附加端子51a、与第二导电片之间设置有第二附加端子51b；其中，第二基板端子32、第三基板端子33、第五基板端子35、第七基板端子37(以下统称为晶元40端子)与晶元40相连接。
第一附加端子51a与第二基板端子32相连接(例如，通过设置在基板10上的导线相连接)，第二附加端子51b与第七基板端子37相连接。即，第一附加端子51a、第二附加端子51b可相当于与晶元40相连接的基板端子的延伸部。因为第一附加端子51a、第二附加端子51b的存在，使得导电片与第一基板端子30、第二基板端子30之间有阻挡，此结构降低了导电片20与第一基板端子31、第二基板端子32发生短路串联的可能性。而且，晶元端子通常设置ESD保护电路，ESD保护电路能够让第一基板端子承受数百伏-数千伏的电击电压，故，即使晶元40端子与导电片20/第一基板端子31、第二基板端子32之间发生短路，喷墨打印机/墨水容器被损坏的风险比较低，如此设置在导电片20与第一基板端子31、第二基板端子32之间设置晶元端子，降低了他们之间短路串联的可能性，降低损坏的风险。
图20是上述芯片100安装到一种墨水容器300上的示意图。适配器340是墨水容器300的一部分，一般情况下，适配器340与盒体310相配合，形成一个完整的墨水容器300。当盒体310中的墨水消耗完的时候，只需要更换盒体310即可，适配器可继续使用，降低了成本，节约了资源。 适配器340上具有供出墨口311插入的缺口343、芯片安装表面340c、两个相对设置的第一凸起柱341及两个相对设置的第二凸起柱342。
芯片100放置在芯片安装表面340c上。芯片100上的两个相对设置的第一限位槽11及两个相对设置的第二限位槽13，用于将芯片100固定在墨水容器300上。适配器340上的两个第一凸起柱341分别与两个第二限位槽13配合两个第二凸起柱342分别与第一限位槽11相配合，使得芯片100可以固定在墨水容器300上。第一凸起柱341与第第二限位槽13的形状相互匹配，当芯片100安装到适配器340上时，第一凸起柱341与第三限位槽11相抵接，使得芯片100不会在适配器340上移动。第二凸起柱342与第一限位槽11的配合形式一致，这里将不再提供其详细阐述。
如图26、图27、图30-图34所示，本实施例还提供了另一种墨水容器，包括墨水容器的芯片100；芯片100上设置有多个限位槽，墨水容器上设置有多个与限位槽相配合的限位块；芯片100通过限位槽及限位块可拆卸安装在墨水容器上。
具体的，如图26所示为本实施例提供的另一种墨水容器，其包括芯片架320，且芯片架320可拆卸安装在在墨水容器上，图27为上述墨水容器相配合的保持部200，用于将此种带有芯片架320的墨水容器安装至保持部200上。
墨水容器300包括盒体310及设置在盒体310上的出墨口311及卡接部312，卡接部312用于将盒体310连接在喷墨打印机的保持部200上，盒体310远离出墨口311的一侧设置有用于安装芯片100的安装面，且安装面的两侧设置有多个限位块，芯片100的基板10设置有多个限位槽，限位槽可设置在基板10的左、右两侧，对于限位块在盒体的位置及限位槽在基板10上的位置不加以限制，可将芯片100可拆卸连接在盒体上即可。保持部200具有底壁200a。盒体310内存储有墨水，墨水经出墨部311到达供墨部202处，进而供墨部202可以将墨水供给到打印头处，从而墨水可以用于执行打印的动作。保持部200中的第一侧壁200c并非垂直于底壁200a，而是相对于底壁200a来说是倾斜的。芯片100安装芯片架320上，芯片架320与芯片100的组合体通过第一卡位孔313安装到墨水容器300上的倾斜部位处。芯片100可以与触针架201上的触针相电连 接，用于电信号之间的相互传输。卡接部312用于将墨水容器300固定到保持部200上，卡接部312与固定部204相配合防止墨水容器300从保持部200中脱离出来。
进一步的，盒体310还包括芯片架320，芯片架320用于固定芯片100，芯片100可拆卸连接在芯片架320上，位于芯片安装位置的盒体310上，盒体310设置有用于安装芯片架320的安装腔，以便芯片架320插接安装在安装腔内，盒体310上设置的限位块可位于芯片架320上，且靠近芯片100安装面的表面设置；芯片100设置有多个与限位块相配合的限位槽，从而可将芯片100可拆卸连接在芯片架320上，再将芯片架320固定在盒体310上，以实现将芯片100安装至墨水容器上。
盒体310在安装腔的两侧分别设置有至少一个第一卡位孔313，相应的，芯片架320包括第一连接部325和第一固定部321，第一固定部321上设置有用于安装芯片100的安装面，第一连接部325用于将芯片架320固定在盒体310上，第一连接部325的两侧分别设置有与第一卡位孔313相配合的第一定位凸台326，待芯片架320插入安装腔内，第一定位凸台326可卡入第一定位孔11a内，以将芯片架320固定在盒体310上。
参阅图30、图31及图32所示，第一连接部325可由第一固定部321延伸生成，即第一连接部325的一端与第一固定部321相衔接，第一连接部325的另一端设置有第二限位凸台327，第二限位凸台327上套接有弹性元件328，弹性元件328的一端抵接在第二限位凸台327与第一连接部325之间形成的抵接面上，弹性元件328的另一端抵接在安装腔的内壁上。本实施例提供的弹性元件328可以是采用硅胶或者橡胶制作，第二限位凸台327可以是圆柱，圆柱与第一连接部325之间形成抵接面；弹性元件328套接在圆柱上，其一端抵接在抵接面上，另一端抵接在安装腔的内壁上，进而将芯片架320弹性安装在盒体310的安装腔内。
进一步的，如图33和图34所示，在第一连接部325远离第一固定部321的一端设置有斜面329，斜面329倾斜角度朝向芯片架320的转动方向倾斜，使得第一连接部325的端部距离安装腔的腔壁具有一定间隙，以便于芯片架320在安装腔内可转动；在带有芯片架320的墨水容器300安装至打印机的保持部200时，芯片架320的两侧设置有第一定位凸台326， 且墨水容器300的盒体上设置有第一卡位孔313，且第一定位凸台326安装在第一卡位孔313并且第一定位凸台326可在第一卡位孔313内转动；待芯片100架320插入喷墨打印机的墨水容器300内，第一定位凸台326卡入第一卡位孔313内，转动盒体，可使芯片架320相对保持部200可转动并调节芯片100相对触针架210的安装位置，使得导电片20与触针211接触。本实施例中，第一连接部325设置的斜面329，以使芯片架320在安装腔内具有一定的可旋转角度，其旋转角度可为10°至15°，优选为12.4°。当墨水容器与保持部200接触时，芯片100与喷墨打印机的保持部200的侧壁部件之间具有间隙，防止在墨水容器安装至保持部200时，保持部200触碰导电片20；避免导电片20被刮伤或者从基板10上脱落。
实施例二：
本实施例的芯片100包括至少一个导电片，下面以导电片为两个为例来说明。图16和图17是实施例二中的芯片示意图。如图16和图17所示，芯片100具有芯片基板10、第一导电片20a、第二导电片20b。芯片基板10上的7个基板端子31-37在Z轴方向上呈两排排列，沿-Z轴方向，依次为第一排R1、第二排R2。芯片100具有：第一凹部151、第二凹部152、第三凹部153、第四凹部154、第五凹部155、第六凹部156、第七凹部157。其中，第三凹部153、第四凹部154、第七凹部157可以作为定位凹部将芯片100固定到适配器340或者墨水容器300上，具体的，第三凹部153、第四凹部154、第七凹部157与芯片架320或者适配器340或者墨水容器300上的凸起相匹配，用于把芯片100固定在芯片架320或者适配器340或者墨水容器300上。其中，第三凹部153、第四凹部154位于芯片100的+Z轴方向侧，为圆孔形状；第七凹部157位于芯片100的-Z轴方向侧，为半圆形形状。本领域的技术人员可以理解，第三凹部153、第四凹部154、第七凹部157可以是其它形状，只要能保证可以固定芯片100即可。
定位导电片20的定位部11，是2个贯穿芯片100厚度方向上的贯穿孔。优选的，定位部11可以是多个定位孔，具体的在本实施例中，定位部11为第一定位孔11a，第二定位孔11b。导电片20的定位安装部23穿过定位部11来定位导电片20。进一步的，定位安装部23为从本体21突出的凸起，定位安装部23插设在到对应的定位部11中。导电片20可以 通过焊接、黏贴的方式通过定位安装部23、本体21与芯片基板相应部分的固定来固定导电片20。
基板端子31-37设置在芯片100的正表面10a上，基板端子31-37与触针架201上相应的触针相接触，每个基板端子均具有与相应的触针相接触的基板端子接触部，其中可以理解的是，芯片100的正表面10a即为芯片基板的正表面10a，芯片100的背表面10b即为芯片基板的背表面10b。导电片20a、20b的本体21设置在芯片100的背表面一侧；导电片20a、20b的电芯连接部22从背表面10b一侧开始穿过芯片100的第五凹部155、第六凹部156且突出于正表面10a。此种结构，可以使得，导电片20a、20b的本体21设置在芯片100的背表面10b侧，导电片20a、20b的电芯连接部22从本体21朝向芯片基板的+X轴一侧延伸，电芯连接部22穿过作为避让凹部的第五凹部155、第六凹部156，并突出于芯片基板的正表面侧，而与相应的触针相接触。更好的实现了基板端子与导电片的合理布局，使得芯片100更容易实现小型化。
第五凹部155、第六凹部156分别位于芯片100的-Y轴侧和+Y轴侧。7个基板端子接触部在Z轴方向上呈两排排列，沿-Z轴方向，依次为第一排、第二排，导电片20a、20b的电芯连接部22位于第一排和第二排之间。进一步的，导电片20a、20b的电芯连接部22位于基板端子31-37在Z轴方向上分隔排布的第一排R1和第二排R2之间。
进一步的，基板端子接触部在Z轴方向上呈多排排列，导电片20的电芯连接部22位于基板端子接触部形成的多排之间。
进一步的，基板端子30在Z轴方向上可以排列为多排(例如，3排、4排)，导电片20的电芯连接部22位于基板端子形成的多排之间。
如此设置，可以使得，导电片20与触针接触时，会接触到第八触针218的第一部分218a、第九触针219的第一部分219a，而并不是第一实施例内容中的导电片20与第八触针218的第一垂直部分218d、第九触针219的第一垂直部分219d。第一实施例内容中导电片20的电芯连接部22的至少一部分深入到触针槽内，并且需要压迫第八触针218的第一垂直部分218d、第九触针219的第一垂直部分219d，因为第一垂直部分218d、第九触针219的第一垂直部分219d距离触针的固定部位(水平部分218f、 219f)较近，使得容易过度压迫触针218、219，可能会造成触针的损坏或者弹性变形能力失效。本实施例中的导电片20a、20b与第八触针218的第一部分218a、第九触针219的第一部分219a相接触，导电片不会进入到触针槽内，且更容易与触针相接触，同时避免造成触针过渡挤压而产生电连接失效的情况。
图18是第一导电片20a的示意图。第一导电片20a的电芯连接部22与本体21相垂直，定位安装部23与本体21相垂直；本体21与基板端子所在表面10a平行且设置在芯片100的背表面10b的一侧，电芯连接部22在Y轴方向的长度D1大于Z轴方向上的长度D2。Y轴方向上的长度比较大，即使墨水容器在Y轴方向上产生位置偏差或者偏移，也不会导致芯片无法识别的情况，使得导电片与触针接触更加稳定。第二导电片20b的设置方式、结构与第一导电片20a是沿中心线L1对称设置的。
进一步的，如图19所示，当墨水容器安装到保持部内，因为导电片20a、20b与触针的第一部分接触，且导电片接触区域22a会对触针的第一部分产生一个压迫力，使得触针218、219相比其他与基板端子相接触的触针211-217来说，被压缩量更大，从而触针218、219相比触针211-217来说更靠近+X轴方向，从而触针218、219不会进入到第三凹部14。
芯片基板10上设置有左后端子39a、右后端子39b、晶元40、电子元器件。左后端子39a与第一导电片20a相对应，右后端子39b与第二导电片20b相对应。第一导电片20a通过焊接或者黏贴的方式左后端子39a与芯片基板10固定且第一导电片20a通过左后端子39a与晶元230或者电子元器件231产生电连接。第二导电片20b通过焊接或者黏贴的方式右后端子39b与芯片基板10固定且第二导电片20b通过右后端子39b与晶元40或者电子元器件产生电连接。
第一导电片20a的定位安装部23在电芯连接部22的-Z轴方向上，进一步的，第一排R1的基板端子31-34在第一导电片20a的定位安装部23和电芯连接部22之间，使得芯片可以进一步小型化，缩小芯片的尺寸。本申请实施例中，在Z轴方向上，第一导电片20a的电芯连接部22和定位安装部23可以分别位于本体21的两侧。而在X轴方向上，电芯连接部22与定位安装部23可以分别位于本体21的同侧。
进一步的，在芯片基板的正表面10a上还可以设有附加端子，附加端子阻隔在导电片的电芯连接部和对应相邻的基板端子之间，即，基板端子30与导电片20之间还设置有附加端子，以避免导电片和相邻基板端子的短路，附加端子可以从Y轴方向上位于内侧的基板端子上延伸出，且附加端子与至少一个与芯片100的存储数据的晶元40相连接。
例如，如图16所示，芯片100的第二基板端子32具有附加端子32a，第三基板端子33具有附加端子33a。附加端子32a设置在第一基板端子31与第一导电片20a之间，附加端子33a设置在第四基板端子34与第二导电片20b之间。附加端子与实施例一的技术效果一致，这里将不再提供其详细阐述。
芯片100放置在墨水容器的芯片安装表面340c上。芯片100上的第三凹部153、第四凹部154、第七凹部157是用于将芯片100固定在适配器340上的部分。适配器340上的凸起与第三凹部153、第四凹部154、第七凹部157相配合，使得芯片100可以固定在适配器340上。
实施例二的芯片100安装到适配器340、芯片架320与实施例一相同。这里将不再提供其详细阐述。芯片架320的芯片安装表面上具有三个凸起。这三个凸起分别跟芯片100上的第七凹部157、第三凹部153、第四凹部154抵接，使得芯片100固定在芯片架320上。此外，也可以在芯片架320上设置凸起，防止第一导电片20a、第二导电片20b受到外力作用的时候产生位移；具体的，可以在第一导电片20a的-Y轴侧，第二导电片20b的+Y轴侧设置凸起，阻挡第一导电片20a、第二导电片20b在Y轴方向上的移动，增加了芯片100与触针接触的准确性。
墨水容器300安装到保持部200的方式与实施例一相同，这里将不再提供其详细阐述。
其余与实施例一一致。
实施例三：
如图28所示，芯片基板10’上只有5个基板端子31’、33’、35’、36’、37’。芯片基板10’上的第一基板端子31’在Y轴方向上的长度比其他端子要长，其与第一触针211、第二触针212同时接触，第一基板端子31’具有2个接触区域。使用此技术可以用于检测墨水容器300是否正确安装到保 持部200内。如果墨水容器300正确安装到保持部200内的话，第一触针211、第二触针212同时与第一基板端子31’接触，第一触针211、第二触针212就会被第一基板端子31’连接到一起，第一触针211与第二触针212上的电压都是一致，最终只需要检测第一触针211与第二触针212上的电压是否变得一致即可得出是否同时接触到第一基板端子31’，进一步的完成装机检测。芯片基板10’与第四触针214对应的位置(即芯片100上的第四基板端子34的位置处)不具有端子，在芯片基板10’上不具有与第四触针214相接触的接触区域。第四触针214不连接喷墨打印机的内部电路，是一个空置触针。其余基板端子、导电片20a-20b与芯片100一致。芯片100’上只具有8个接触区域。
其余与实施例二一致。
实施例四：
图29是实施例四的芯片示意图。芯片100”的芯片基板10”具有：基板端子31”-37”。基板端子31”-37”呈长方形状依次排列为一排。但是其接触区域仍然与图10所示的芯片一致。仅仅是芯片的芯片基板上的端子的形状改变，仍可达到本申请的有益效果。
7个基板端子接触部在Z轴方向上呈两排排列，沿-Z轴方向，依次为第一排、第二排，导电片20a、20b的电芯连接部位于第一排和第二排之间。
进一步的，基板端子接触部在Z轴方向上呈多排排列，导电片20a、20b的电芯连接部位于基板端子接触部形成的多排之间。
基板端子、凹部等特征与实施例一描述的一致。
实施例五：
图35是实施例五的芯片示意图。
与实施例二不同的是：一部分基板端子设置在芯片的下表面上。如图35所示，第五基板端子35至第七基板端子37设置在芯片100的基板10的下表面10e上。优选的，第五基板端子35、第六基板端子36、第七基板端子37不但设置在下表面10e上，而且还设置在正表面10a和背表面10b上。如此结构，可以使得第五基板端子35、第六基板端子36、第七基板端子37与相应触针的第一部分的斜坡部相接触。具体的，第五基板端 子35与第五触针215的第一部分215a的斜坡部相接触。如此，可以使得降低了触针给予芯片的作用力，更好的避免了芯片被损伤的情况。
第三凹部153、第四凹部154、第八凹部158为半圆形形状，是用于将芯片固定到墨盒上的。
其基板端子大部分在正表面10a上。在X轴方向上，基板端子31-37大部分位于芯片基板10的+X轴一侧。也可以认为是，在X轴方向上，基板端子31-37位于芯片基板10的+X轴一侧。也能达到实施例二的技术效果。
实施例六：
图36是实施例六的芯片示意图。
与实施例一不同的是：一部分基板端子设置在芯片的下表面上。如图35所示，第五基板端子35至第七基板端子37设置在芯片100的基板10的下表面10e上。优选的，第五基板端子35、第六基板端子36、第七基板端子37不但设置在下表面100e上，而且还设置在正表面10a和背表面10b上。如此结构，可以使得第五基板端子35、第六基板端子36、第七基板端子37与相应触针的第一部分的斜坡部相接触。具体的，第五基板端子35与第五触针215的第一部分215a的斜坡部相接触。如此，可以使得降低了触针给予芯片的作用力，更好的避免了芯片被损伤的情况。
其基板端子大部分在正表面10a上。在X轴方向上，基板端子31-37大部分位于芯片基板10的+X轴一侧。也可以认为是，在X轴方向上，基板端子31-37位于芯片基板10的+X轴一侧。也能达到实施例一的技术效果。
进一步的，参阅图12，本实施例中芯片100可拆卸连接在芯片架320上，具体的，芯片100包括基板10，基板10的一端设置有导电片20，沿基板10设置有导电片20的一端至其相对端的方向(如图3所示，沿基板10的X轴方向)，基板10上依次设置有一组第一限位槽12，一组第二限位槽13及一组第三限位槽14，第一限位槽12、第二限位槽13及第三限位槽14作为避让凹部，且每组限位槽包括两个对称设置在芯片100两侧的限位槽；第一限位槽12靠近导电片20设置，第三限位槽14由基板10远离导电片20的一端边缘延伸至中部附近，第三限位槽14的长度方向与 X轴方向平行，第二限位槽13设置在第一限位槽12和第二限位槽13之间，第二限位槽13可设置成弧形槽，第一限位槽12和第三限位槽14可为矩形缺口；芯片架320上的第一固定部321设置有与第一固定部321设置有与第一限位槽12相配合的第一限位块322、与第二限位槽13相配合的第二限位块323以及与第三限位槽14相配合的第三限位块324；待芯片100需安装至芯片架320上，可使第一限位块322抵接在第一限位槽12内，第二限位块323抵接在第二限位槽13内，第三限位块324抵接在第三限位槽14内，进而将芯片100可拆卸连接在芯片架320上。
进一步的，为防止电芯连接部22变形，可将第一限位块322的高度凸出基板10的正表面10a，第一限位块322部分抵接在芯片100的基板10上，部分抵接在导电片20的电芯连接部22上，能够避免电芯连接部22变形，可增强电芯连接部22与触针电性连接地稳定性。
最后应说明的是：以上各实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述各实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。

Claims (16)

  1. 一种墨水容器的芯片，所述芯片与喷墨打印机内保持部的触针电性连接；其特征在于，所述芯片包括基板及安装在所述基板的上至少一个导电片；
    所述基板具有至少一个与所述喷墨打印机的触针相接触的基板端子、以及定位所述至少一个导电片的定位部；
    所述导电片包括本体以及设置在所述本体一端的电芯连接部，所述电芯连接部与所述触针相抵接；
    所述本体设置有至少一个定位安装部，所述定位安装部与所述定位部相配合；
    所述本体与所述基板的表面相平行并通过所述定位安装部安装在所述定位部上。
  2. 根据权利要求1所述的墨水容器的芯片，其特征在于，
    在X轴方向上，所述基板端子位于所述芯片基板的+X轴一侧，所述电芯连接部朝向所述+X轴方向凸出于所述基板端子所在的表面；
    所述电芯连接部上具有用于与所述触针相接触的导电片接触区域，且所述导电片接触区域位于所述电芯连接部的+X轴端；
    其中，所述墨水容器安装到所述保持部的方向为Z轴方向，安装的前端侧位置是-Z轴方向，垂直于所述Z轴方向且与所述基板端子所在的表面平行的方向为Y轴方向，垂直于所述Z轴方向和所述Y轴方向的方向为X轴方向，所述墨水容器内部指向所述芯片的方向为+X轴方向；沿+X轴方向观察，在YZ平面上+Z轴在上方时，+Y轴方向位于左手侧。
  3. 根据权利要求2所述的墨水容器的芯片，其特征在于，所述定位安装部位于所述本体的+X轴一侧或-X轴一侧。
  4. 根据权利要求1-3任一项所述的墨水容器的芯片，其特征在于，所述定位部包括设置在所述基板上的多个定位孔；
    多个所述定位孔分成呈行分布且相互平行的第一定位孔组和第二定位孔组；
    其中，所述第一定位孔组内的定位孔与所述第二定位孔组的定位孔相 对设置或者交错设置。
  5. 根据权利要求1-3任一项所述的用于墨水容器的芯片，其特征在于，
    所述导电片的数量为多个，当所述导电片的数量是偶数个时，所述导电片沿中心线L1对称分布在所述芯片基板上，其中，中心线L1穿过所述芯片的所述Y轴方向上的中心点且平行于所述Z轴方向。
  6. 根据权利要求2所述的用于墨水容器的芯片，其特征在于，
    在所述X轴方向上，所述电芯连接部与所述定位安装部分别位于所述本体的同侧。
  7. 根据权利要求2所述的用于墨水容器的芯片，其特征在于，多个所述基板端子上具有与相应的触针相接触的基板端子接触部；
    所述导电片的所述电芯连接部位于所述基板端子接触部的+Z轴方向上。
  8. 根据权利要求7所述的用于墨水容器的芯片，其特征在于，所述导电片位于所述基板端子的+Z轴方向上。
  9. 根据权利要求7所述的用于墨水容器的芯片，其特征在于，
    所述基板端子接触部在所述Z轴方向上分多排排列，所述导电片的所述电芯连接部位于所述多排基板端子接触部之间。
  10. 根据权利要求1-3任一项所述的用于墨水容器的芯片，其特征在于，
    所述基板端子在所述Z轴方向上分多排排列，电芯连接部位于所述多排基板端子之间；在所述Z轴方向上，所述电芯连接部和所述安装定位部分别位于所述本体的两侧。
  11. 根据权利要求1-3任一项所述的用于墨水容器的芯片，其特征在于，
    所述电芯连接部在所述Y轴方向的尺寸大于在所述Z轴方向上的尺寸。
  12. 根据权利要求1-3任一项所述的墨水容器的芯片，其特征在于，所述基板端子与所述导电片的所述电芯连接部之间设置有附加端子；
    所述附加端子与至少一个与芯片的存储数据的晶元相连接的晶元端子电性连接。
  13. 一种墨水容器，其特征在于，包括权利要求1至12任一项所述的墨水容器的芯片；
    所述芯片上设置有多个限位槽，所述墨水容器上设置有多个与所述限位槽相配合的限位块；
    所述芯片通过所述限位槽及所述限位块可拆卸安装在所述墨水容器上。
  14. 根据权利要求13所述的墨水容器，其特征在于，所述墨水容器包括用于存储喷墨的盒体及安装在所述盒体上的芯片架；
    多个所述限位块位于所述芯片架靠近所述触针的表面上。
  15. 根据权利要求14所述的墨水容器，其特征在于，所述盒体设置有容纳所述芯片架的安装腔；
    所述芯片架包括用于与所述盒体连接的第一连接部及用于固定所述芯片的第一固定部，所述第一连接部的两侧分别设置有第一限位凸台，所述安装腔的侧壁分别设置有与所述第一定位凸台相配合的第一卡位孔；
    所述第一连接部远离所述第一固定部的一端设置有第二限位凸台，所述第二限位凸台上套接有弹性元件，且所述弹性元件抵接在所述安装腔的内壁上。
  16. 根据权利要求15所述的墨水容器，其特征在于，所述第一连接部远离所述第一固定部的一端设置有斜面，所述第二限位凸台位于所述斜面上，使得芯片及芯片架在所述安装腔内并可旋转；当所述墨水容器与所述喷墨打印机的保持部接触时，所述芯片与所述喷墨打印机的保持部的侧壁部件之间具有间隙。
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