CN102998957B - 一种成像盒芯片的修复方法 - Google Patents
一种成像盒芯片的修复方法 Download PDFInfo
- Publication number
- CN102998957B CN102998957B CN201110268245.9A CN201110268245A CN102998957B CN 102998957 B CN102998957 B CN 102998957B CN 201110268245 A CN201110268245 A CN 201110268245A CN 102998957 B CN102998957 B CN 102998957B
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- Prior art keywords
- box chip
- write
- interface
- imaging box
- repair data
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000003384 imaging method Methods 0.000 title claims abstract description 137
- 238000000034 method Methods 0.000 title claims abstract description 45
- 230000006378 damage Effects 0.000 claims abstract description 11
- 230000008439 repair process Effects 0.000 claims description 71
- 230000005055 memory storage Effects 0.000 claims description 61
- 239000000463 material Substances 0.000 claims description 47
- 239000013078 crystal Substances 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 6
- 238000004043 dyeing Methods 0.000 claims description 6
- 230000008569 process Effects 0.000 abstract description 21
- 238000005553 drilling Methods 0.000 abstract 1
- 238000007790 scraping Methods 0.000 abstract 1
- 239000003566 sealing material Substances 0.000 abstract 1
- 230000006870 function Effects 0.000 description 13
- 239000003086 colorant Substances 0.000 description 12
- 238000005538 encapsulation Methods 0.000 description 6
- 238000012216 screening Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 238000004064 recycling Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000002679 ablation Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G21/00—Arrangements not provided for by groups G03G13/00 - G03G19/00, e.g. cleaning, elimination of residual charge
- G03G21/16—Mechanical means for facilitating the maintenance of the apparatus, e.g. modular arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17543—Cartridge presence detection or type identification
- B41J2/17546—Cartridge presence detection or type identification electronically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17559—Cartridge manufacturing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/06—Apparatus for electrographic processes using a charge pattern for developing
- G03G15/08—Apparatus for electrographic processes using a charge pattern for developing using a solid developer, e.g. powder developer
- G03G15/0822—Arrangements for preparing, mixing, supplying or dispensing developer
- G03G15/0863—Arrangements for preparing, mixing, supplying or dispensing developer provided with identifying means or means for storing process- or use parameters, e.g. an electronic memory
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/06—Apparatus for electrographic processes using a charge pattern for developing
- G03G15/08—Apparatus for electrographic processes using a charge pattern for developing using a solid developer, e.g. powder developer
- G03G15/0894—Reconditioning of the developer unit, i.e. reusing or recycling parts of the unit, e.g. resealing of the unit before refilling with toner
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G21/00—Arrangements not provided for by groups G03G13/00 - G03G19/00, e.g. cleaning, elimination of residual charge
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G2215/00—Apparatus for electrophotographic processes
- G03G2215/00987—Remanufacturing, i.e. reusing or recycling parts of the image forming apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Electrophotography Configuration And Component (AREA)
- Credit Cards Or The Like (AREA)
- Ink Jet (AREA)
Abstract
Description
Claims (9)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110268245.9A CN102998957B (zh) | 2011-09-09 | 2011-09-09 | 一种成像盒芯片的修复方法 |
EP12829588.8A EP2755092B1 (en) | 2011-09-09 | 2012-03-27 | Method for restoring imaging cartridge chip |
US14/007,220 US9031452B2 (en) | 2011-09-09 | 2012-03-27 | Method for restoring imaging cartridge chip |
PCT/CN2012/073079 WO2013033987A1 (zh) | 2011-09-09 | 2012-03-27 | 一种成像盒芯片的修复方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110268245.9A CN102998957B (zh) | 2011-09-09 | 2011-09-09 | 一种成像盒芯片的修复方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102998957A CN102998957A (zh) | 2013-03-27 |
CN102998957B true CN102998957B (zh) | 2015-06-24 |
Family
ID=47831485
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110268245.9A Active CN102998957B (zh) | 2011-09-09 | 2011-09-09 | 一种成像盒芯片的修复方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9031452B2 (zh) |
EP (1) | EP2755092B1 (zh) |
CN (1) | CN102998957B (zh) |
WO (1) | WO2013033987A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104599997A (zh) * | 2015-01-30 | 2015-05-06 | 工业和信息化部电子第五研究所 | 塑料封装金属丝键合器件的开封方法 |
CN105216453B (zh) * | 2015-10-22 | 2017-05-24 | 杭州旗捷科技有限公司 | 打印机设备、再生墨盒、墨盒再生芯片及再生墨盒返修方法 |
CN105398226B (zh) * | 2015-12-22 | 2017-03-29 | 杭州旗捷科技有限公司 | 再生墨盒的修复方法、修复芯片和再生墨盒 |
CN106098571B (zh) * | 2016-08-08 | 2018-12-28 | 湖北三江航天红峰控制有限公司 | 一种塑封电子元器件的预开封方法 |
JP7000730B2 (ja) * | 2017-08-01 | 2022-01-19 | ブラザー工業株式会社 | ドラムユニットおよび画像形成装置 |
JP7256331B2 (ja) * | 2019-06-28 | 2023-04-11 | ジュハイ ナインスター マネージメント カンパニー リミテッド | インク容器のチップ及びインク容器 |
CN113909697B (zh) * | 2020-07-08 | 2024-07-16 | 芯恩(青岛)集成电路有限公司 | 激光开封系统及激光开封方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101121328A (zh) * | 2007-09-11 | 2008-02-13 | 珠海天威飞马打印耗材有限公司 | 墨盒再生方法 |
CN102173208A (zh) * | 2011-01-28 | 2011-09-07 | 珠海艾派克微电子有限公司 | 一种成像装置的存储芯片复位装置及方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5961860A (en) * | 1995-06-01 | 1999-10-05 | National University Of Singapore | Pulse laser induced removal of mold flash on integrated circuit packages |
US6335208B1 (en) * | 1999-05-10 | 2002-01-01 | Intersil Americas Inc. | Laser decapsulation method |
US7694246B2 (en) * | 2002-06-19 | 2010-04-06 | Formfactor, Inc. | Test method for yielding a known good die |
JP4301786B2 (ja) * | 2002-09-11 | 2009-07-22 | エステー産業株式会社 | 使用済みインクカートリッジのための再利用化用具 |
JP3965172B2 (ja) * | 2004-08-24 | 2007-08-29 | 東芝テック株式会社 | 商品販売データ処理装置 |
US7424245B2 (en) * | 2005-10-19 | 2008-09-09 | Static Control Components, Inc. | Systems and methods for remanufacturing imaging components |
JP4513818B2 (ja) * | 2007-03-07 | 2010-07-28 | コニカミノルタビジネステクノロジーズ株式会社 | 画像形成装置用プロセスカートリッジ及び画像形成装置 |
US20090011522A1 (en) * | 2007-07-02 | 2009-01-08 | Drennan Monte D | Semiconductor Device Package Disassembly |
US7971947B2 (en) * | 2008-04-07 | 2011-07-05 | Static Control Components, Inc. | Systems and methods for remanufacturing imaging components |
CN102096367B (zh) * | 2011-01-26 | 2012-10-03 | 珠海艾派克微电子有限公司 | 一种成像盒芯片复位方法和装置 |
-
2011
- 2011-09-09 CN CN201110268245.9A patent/CN102998957B/zh active Active
-
2012
- 2012-03-27 US US14/007,220 patent/US9031452B2/en active Active
- 2012-03-27 WO PCT/CN2012/073079 patent/WO2013033987A1/zh active Application Filing
- 2012-03-27 EP EP12829588.8A patent/EP2755092B1/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101121328A (zh) * | 2007-09-11 | 2008-02-13 | 珠海天威飞马打印耗材有限公司 | 墨盒再生方法 |
CN102173208A (zh) * | 2011-01-28 | 2011-09-07 | 珠海艾派克微电子有限公司 | 一种成像装置的存储芯片复位装置及方法 |
Also Published As
Publication number | Publication date |
---|---|
EP2755092A4 (en) | 2015-03-25 |
EP2755092A1 (en) | 2014-07-16 |
WO2013033987A1 (zh) | 2013-03-14 |
US20140056611A1 (en) | 2014-02-27 |
EP2755092B1 (en) | 2018-10-31 |
US9031452B2 (en) | 2015-05-12 |
CN102998957A (zh) | 2013-03-27 |
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C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: ZHUHAI APEX MICROELECTRONICS CO., LTD. Free format text: FORMER OWNER: CENG YANGYUN Effective date: 20140513 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 519000 ZHUHAI, GUANGDONG PROVINCE TO: 519015 ZHUHAI, GUANGDONG PROVINCE |
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TA01 | Transfer of patent application right |
Effective date of registration: 20140513 Address after: 519015, No. 63, Mingzhu Road, Zhuhai City, Guangdong Province, 04 floors, 7 floors Applicant after: APEX MICROELECTRONICS Co.,Ltd. Address before: 519000, No. 63, Mingzhu Road, Zhuhai City, Guangdong Province, 04 floors, 7 floors Applicant before: Zeng Yangyun |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 519015 7th Floor, Building 04, No. 63, Mingzhu North Road, Zhuhai, Guangdong Patentee after: Jihai Microelectronics Co.,Ltd. Address before: 519015 7th Floor, Building 04, No. 63, Mingzhu North Road, Zhuhai, Guangdong Patentee before: APEX MICROELECTRONICS Co.,Ltd. |