WO2013033987A1 - 一种成像盒芯片的修复方法 - Google Patents

一种成像盒芯片的修复方法 Download PDF

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Publication number
WO2013033987A1
WO2013033987A1 PCT/CN2012/073079 CN2012073079W WO2013033987A1 WO 2013033987 A1 WO2013033987 A1 WO 2013033987A1 CN 2012073079 W CN2012073079 W CN 2012073079W WO 2013033987 A1 WO2013033987 A1 WO 2013033987A1
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WO
WIPO (PCT)
Prior art keywords
interface
storage device
imaging cartridge
repair data
cartridge chip
Prior art date
Application number
PCT/CN2012/073079
Other languages
English (en)
French (fr)
Inventor
曾阳云
Original Assignee
Zeng Yangyun
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zeng Yangyun filed Critical Zeng Yangyun
Priority to EP12829588.8A priority Critical patent/EP2755092B1/en
Priority to US14/007,220 priority patent/US9031452B2/en
Publication of WO2013033987A1 publication Critical patent/WO2013033987A1/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G21/00—Arrangements not provided for by groups G03G13/00 - G03G19/00, e.g. cleaning, elimination of residual charge
    • G03G21/16—Mechanical means for facilitating the maintenance of the apparatus, e.g. modular arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/17543—Cartridge presence detection or type identification
    • B41J2/17546—Cartridge presence detection or type identification electronically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/17559—Cartridge manufacturing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/06—Apparatus for electrographic processes using a charge pattern for developing
    • G03G15/08—Apparatus for electrographic processes using a charge pattern for developing using a solid developer, e.g. powder developer
    • G03G15/0822—Arrangements for preparing, mixing, supplying or dispensing developer
    • G03G15/0863—Arrangements for preparing, mixing, supplying or dispensing developer provided with identifying means or means for storing process- or use parameters, e.g. an electronic memory
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/06—Apparatus for electrographic processes using a charge pattern for developing
    • G03G15/08—Apparatus for electrographic processes using a charge pattern for developing using a solid developer, e.g. powder developer
    • G03G15/0894—Reconditioning of the developer unit, i.e. reusing or recycling parts of the unit, e.g. resealing of the unit before refilling with toner
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G21/00—Arrangements not provided for by groups G03G13/00 - G03G19/00, e.g. cleaning, elimination of residual charge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G2215/00—Apparatus for electrophotographic processes
    • G03G2215/00987—Remanufacturing, i.e. reusing or recycling parts of the image forming apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Definitions

  • the present invention relates to the field of imaging technologies, and in particular, to a method for repairing an imaging cartridge chip.
  • An imaging cartridge (such as a toner cartridge, a toner cartridge, an ink cartridge with a printhead, etc.) is mounted in an image forming apparatus (such as a printer, a copying machine, etc.), and the image forming apparatus can perform an image forming operation using the stain contained in the image forming cartridge.
  • an image forming apparatus such as a printer, a copying machine, etc.
  • an imaging cartridge chip is disposed in the imaging box for storing information such as an imaging cartridge model, a color of the dye, a date of manufacture, a capacity of the dye, and a remaining amount of the dye, and each of the imaging cartridge chips is in one-to-one correspondence with the imaging cartridge.
  • the cartridge recycling process includes recycling of the imaging cartridge chip. In the prior art, when the imaging cartridge chip is recovered, it is necessary to screen the imaging cartridge chip and write the data into the imaging cartridge chip in a completely covering manner.
  • the functional interface on the imaging cartridge chip is required, but since the integrated circuits on the imaging cartridge chip are packaged in a thermosetting adhesive or a hard shell to protect the package material. In an integrated circuit, some functional ports are also packaged into the package material. When data is written to the imaging cartridge chip for recycling, the package material needs to be etched away by an acidic solvent, and the functional ports are exposed, and then the data is processed. Write.
  • Embodiments of the present invention provide a method for repairing an imaging cartridge chip, so that the performance of the imaging cartridge chip is not affected during the recycling process of the imaging cartridge chip.
  • An embodiment of the present invention provides a method for repairing an imaging cartridge chip, where the imaging cartridge chip includes a storage device, including:
  • the repair data is written into the storage device through the read/write interface of the imaging cartridge chip and the functional interface.
  • the repairing process of the imaging cartridge chip in the embodiment of the present invention at least the position of the functional interface on the storage device included in the imaging cartridge chip is opened by the laser beam, or at least the packaging material at the functional interface position is scraped or drilled open.
  • the repair data is written to the storage device through the function interface and the read/write interface.
  • the laser beam or the method of scraping or drilling is used for unsealing, and it is relatively easy to control the parameters of the opening, such as the opening diameter and the opening depth, and it is not easy to damage other lines and components on the imaging chip, thereby imaging The performance of the box chip will not be affected.
  • 1 is a schematic structural view of an imaging cartridge chip
  • FIG. 2 is a schematic structural view of a storage device in an imaging cartridge chip
  • FIG. 3 is a flowchart of a method for repairing an imaging cartridge chip according to an embodiment of the present invention
  • FIG. 4 is a schematic structural view of the storage device included in the imaging cartridge chip in the embodiment of the present invention after being opened;
  • FIG. 5 is a flow chart of a method for writing repair data into a storage device in an embodiment of the present invention.
  • Embodiments of the present invention provide a method for repairing an imaging cartridge chip, which is applied to the recovery process of the imaging cartridge chip, or the repair of data stored in the imaging cartridge chip during the fault repair process of the imaging cartridge chip.
  • the imaging cartridge chip generally includes: a circuit board, a plurality of read/write interfaces (two in the embodiment), and a storage device, and the circuit connection between the read/write interface and the storage device (in Not shown in Figure 1, where: the read/write interface is placed on the circuit board in an electrically contactable manner; the storage device is used to store the image cartridge type, color of the dye, date of manufacture, color of dye, and amount of dye remaining, etc.
  • the integrated circuit is packaged by a thermosetting glue or a hard case, and the communication port is led out to the circuit board by pins.
  • the integrated circuit in the storage device is generally composed of a semiconductor or a wafer.
  • a plurality of communication ports are often disposed. Referring to FIG. 2, the communication port generally required before the integrated circuit is packaged is used. Wire the wires to an external pin or board.
  • function ports for special operations such as enabling or controlling, which do not have wires to connect to external pins or boards when considering board wiring problems.
  • the laser beam may be used to at least open the position of the functional interface on the storage device of the imaging cartridge chip, or at least The encapsulation material at the location of the functional interface on the storage device is scraped or drilled; the repair data is written into the storage device through the read/write interface and the functional interface of the imaging cartridge chip.
  • the laser beam or the method of scraping or drilling is used to open the sealing, and it is relatively easy to control the parameters of the opening, such as the opening diameter and the opening depth, and it is not easy to damage other lines and components on the imaging chip, thereby imaging The performance of the box chip will not be affected.
  • all of the encapsulating material on the storage device may be removed, or only the encapsulating material at a specific location of the storage device may be removed.
  • the repair may be performed by the following steps.
  • the flowchart is shown in FIG. 3, and includes:
  • Step 101 Determine a position of a function interface on a storage device of the imaging cartridge chip.
  • the functional interface is disposed on the outer surface of the integrated circuit in the storage device, and the inner surface of the integrated circuit is on one side of the circuit board, and may be used on the surface of the integrated circuit when writing data to the storage device. For some functional interfaces, you only need to determine the location of the functional interface used.
  • These functional interfaces are packaged in the packaging material, and the specific positions of these functional interfaces are not seen from the outer surface, but for the imaging cartridge chip of the same model or size characteristics, the location of the functional interface in the storage device included therein The same is true, so that the specific location of the functional interface in the storage device of the imaging cartridge chip can be known by the characteristics of the type or size of the imaging cartridge chip. And the function interface position of some imaging cartridge chips can also be through the appearance characteristics such as the shape, wiring and size of the imaging cartridge chip. Get it.
  • Step 102 Use a laser beam to at least unscrew the location of the functional interface on the storage device, or at least scrape or drill the encapsulation material at the functional interface location on the storage device.
  • At least the opening of the functional interface at the location of the functional interface means removing at least the encapsulating material covering the functional interface location on the surface of the integrated circuit, i.e., not only the functional interface location can be unsealed.
  • the encapsulation can be performed in the following manners:
  • the laser beam is used for unsealing, and the laser beam has the characteristics of high energy, small convergence point and controllable power, and can conveniently control the opening diameter, the opening depth and the opening time, etc., and the unsealing phase by the acidic solvent in the prior art.
  • the method has the characteristics of high accuracy, high efficiency, safety and environmental protection.
  • a plurality of laser beams may be irradiated at least at the position of the functional interface on the storage device to burn off the encapsulating material, and the multiple lasers
  • the sum of the unsealing depths of the bundles is less than or equal to the thickness of the encapsulating material at the position of the functional interface, so that the unsealing depth can be more accurately grasped.
  • use the laser beam to burn off three-fifths of the target packaging material in an unequal manner, and then burn off the remaining two-fifths of the target packaging material; or use the laser beam to burn off one-half of the equivalent in an equal manner.
  • the target packaging material is burned and the remaining one-half of the target packaging material is burned.
  • the diameter of the opening formed by the multiple laser beam irradiation may be different, and the diameter of the opening formed by the laser beam irradiation is gradually reduced.
  • the shape of the opening is different, for example, square or circular or trapezoidal or triangular, so that different imaging chip chips can be distinguished by opening the opening.
  • At least the package material covering the function interface position on the storage device can be removed with a doctor blade.
  • At least the sealing material covering the functional interface on the storage device can be removed using a drilling tool.
  • a drilling tool When opening with a scraper or a drilling tool, it is possible to control the opening diameter and the opening depth.
  • At least a layer of packaging material may be reserved on the surface of the wafer of the functional interface, so as not to damage the integrated circuit. Surface, reducing the area of oxidation.
  • this functional interface it is necessary to connect the functional interface through the layer of packaging material. For example, as shown in FIG. 4, the laser beam is irradiated at the function interface position on the storage device in an equal manner to perform unsealing, and the target packaging material is burned twice by the laser beam of different opening diameters, so that the second layer is opened.
  • This unsealing method allows for more accurate connection to the functional interface when using the functional interface, and also reduces the packaging material required to package the imaging cartridge chip.
  • Step 103 Write the repair data into the storage device through the read/write interface and the function interface of the imaging cartridge chip.
  • the read/write interface and the function interface can be connected to the repair data write device, and the repair data write device writes the repair data to the storage device of the imaging cartridge chip.
  • Step 104 Encapsulate the imaging cartridge chip.
  • the imaging cartridge chip is packaged mainly by burning or scraping or drilling away the portion of the laser beam in step 102 with a packaging material, and then further baking or cooling the different packaging materials to fix the filled packaging material. If only the function interface location on the memory device is unsealed, only the package needs to be packaged when the package is packaged, which saves the package material. It is confirmed that the imaging cartridge chip is a recycled product; and when the imaging cartridge chip is packaged, different types of imaging cartridge chips can be packaged using different packaging materials, so that different types of imaging chips can be distinguished by the packaging material.
  • the position of the functional interface is opened by using a laser beam, or the packaging material at the position of the functional interface is scraped or drilled.
  • the repair data is written into the storage device through the function interface and the read/write interface, and finally the imaging box chip is packaged.
  • the function interface position is unsealed, and the laser beam used in the unsealing method is relatively easy to control, and it is not easy to damage other lines and components on the imaging cartridge chip, so that the performance of the imaging cartridge chip is not affected.
  • step 103 when the foregoing step 103 is performed, the following steps may be implemented, specifically:
  • A Connect the read/write interface to the repair data writer via wire or wireless.
  • an antenna may be disposed on the read/write interface, and a corresponding antenna is disposed on the repair data writing device to implement communication;
  • the connection between the complex data writing device and the read/write interface is not limited to the wireless mode, and may be connected by wires.
  • the repair data writing device is for writing data to be repaired to the storage device of the imaging cartridge chip.
  • the functional interface is directly connected to the corresponding interface of the repair data writing device.
  • the functional interface and the repair data writing device need to be connected through the conductive electrodes, as shown in FIG.
  • One end of the conductive electrode is pressed on the functional port such that one end of the conductive electrode is in direct contact with the functional interface through the remaining layer of encapsulating material, and the other end of the conductive electrode is connected to the corresponding interface of the repair data writing device.
  • the repair data writing device enables or controls the storage device through the function interface and writes the repair data to the read/write interface.
  • the repair data here refers to information such as the type of imaging cartridge, the color of the dye, the date of manufacture, the capacity of the dye, or the remaining amount of the dye to match the imaging cartridge filled with the stain.
  • the timing signal can be sent to the function interface to control the read and write timing of the storage device; and the control signal can be sent to the function interface to enable the storage device, so that the function is
  • the storage device can enter another mode.
  • the current mode of the storage device cannot modify the stored data, and the data stored in the storage device can be rewritten after the function interface is enabled; for example, the current mode of the storage device is The remaining amount of the dye by the storage cannot be increased, and the remaining amount of the dye stored in the enabled storage device through the functional interface can be changed.
  • the repair data writing device can directly write some or all of the repair data to the read/write interface, so that the storage device overwrites the repair data received by the read/write interface with the corresponding data originally stored in the storage device, for example, the repair data writing device will When the remaining dyeing amount, the date of manufacture, and the like are written into the storage device, the storage device overwrites the written data with the information such as the remaining dyeing amount and the date of manufacture originally stored.
  • the repair data writing device can also write information such as the model and classification of the imaging cartridge to the storage device for coverage, so that the data in the imaging cartridge chip can be repaired to match other types of imaging cartridges.
  • the repair data writing device may first read information such as the model and classification of the imaging box originally stored in the storage device from the read/write interface before writing the repair data to the storage device, and at least correspond to the image type and classification information of the imaging box. Information such as the remaining dyed dose and/or the spent dyed dose matched by the imaging cartridge is written into the storage device, wherein for a stain having a shelf life, the date of manufacture can be written to the storage device.
  • steps A and B do not have an absolute order relationship, and may be executed simultaneously or sequentially, and the process of writing the repair data is for the repair data that needs to be enabled or controlled through the function interface, and is not required.
  • the repair data enabled or controlled by the function interface is written directly to the read/write interface.
  • step B is connected when the function interface is needed, for example, the remaining dyeing amount and the manufacturing date need to be written to the storage device, and the manufacturing date in the storage device cannot be modified, and the repair data is performed.
  • the function interface is required to enable the storage device, and both the read/write interface and the function interface need to be connected to the repair data writing device; when the remaining dyeing amount is written, It is only necessary to connect the read/write interface to the repair data writing device, that is, the writing of the remaining dyeing amount can be realized, and the connection of the function interface and the repair data writing device can be disconnected.
  • the functional interface described in the embodiment of the present invention is not limited to the interface encapsulated in the packaging material, and the read/write interface is not limited to the interface not encapsulated in the packaging material, and some special imaging chip chips are partially special.
  • the repair data can be written from the functional interface to the storage device, such as verifying passwords and the like.
  • the pre-processed imaging cartridge chip in order to make the repair of the imaging cartridge chip more efficient and accurate, it is necessary to pre-process the collected used imaging cartridge chip before performing the above step 101, including screening for appearance, physical characteristics and/or data characteristics. Processing such as identification, classification, and dust removal, and then performing the above steps 101 to 104 on the pre-processed imaging cartridge chip, that is, determining the position of the functional interface, unsealing, writing repair data, and packaging.
  • Data characteristics and/or electrical characteristics can then be identified, ie data characteristics and/or electrical selection
  • the imaging box chip whose characteristics conform to the preset rule refers to the characteristics of the imaging box chip when reading and writing data for the data characteristic, for example, reading and writing data from the read/write interface of the imaging box chip, if the imaging box chip.
  • the data that responds or responds to the preset rules can identify the imaging cartridge chip; for electrical characteristics, it refers to the characteristics of the inherent circuit in the imaging cartridge chip, such as the voltage, current or frequency of the imaging cartridge chip. The information is within a certain range, or a certain capacitor is in the middle of charging and discharging process.
  • the cleaning process here may not be limited before or after the screening process.
  • all of the above preprocessing processes may not be performed, at least one of the processes may be selected, and the above steps 101 to 104 are performed on the processed imaging cartridge chip, but
  • the identification step of data characteristics and/or electrical characteristics is an important step that directly affects the success of the repair of the imaging cartridge chip. Therefore, data specific and/or electrical characteristics are generally required to be identified, that is, data is selected.
  • the imaging cartridge chip having specific and/or electrical characteristics conforming to a preset rule, and performing the above-described steps of determining the position of the functional interface, unsealing, writing repair data, and packaging for the selected imaging cartridge chip.
  • the identification of the electrical characteristics and/or data characteristics of the imaging cartridge chip is not limited to the determination of the location of the functional interface, ie, prior to step 101, but may be performed prior to writing the repair data to the storage device, step 103.
  • the data writing device can identify the electrical characteristics and/or data characteristics of the storage device of the imaging cartridge chip.
  • the repair data writing device is capable of recognizing electrical characteristics and/or data characteristics.
  • the interface contact is unstable, or the storage device is damaged, and the write repair data fails, and the step 103 is required, and in step 104.
  • the imaging cartridge chip is detected to detect whether the written repair data is partially damaged. If it is partially damaged, it means that some data is correctly written into the storage device during the process of writing the repair data.
  • the storage device is not damaged, and the steps of 103 and detecting may be repeated; if not damaged, the encapsulation step in 104 may be performed; if it is completely damaged If it is bad, it can be said that the storage device is damaged, and the imaging cartridge chip is discarded, which greatly improves the efficiency of recycling the imaging cartridge chip.
  • the test device When detecting whether the repaired data is partially damaged, the test device can be connected to the read/write interface of the chip by wire or wirelessly. According to the needs of different types of imaging chip, the test device can also be connected to the function interface for assistance. Detection. Specifically, the data characteristics and/or electrical characteristics of the imaging cartridge chip in which the repair data is written may be detected. For example, the test device sends read and write data to the read/write interface of the imaging cartridge chip, and the data returned by the imaging cartridge chip conforms to the preset. The rules of the data are detected; the test device also sends a certain voltage, current or frequency information to the imaging chip, and then judges according to the information returned by the imaging chip, such as the voltage and current of the information returned by the imaging chip chip. Or whether the frequency is within a certain range, and for example, the test device can detect whether a certain capacitor in the imaging cartridge chip is subjected to a charging and discharging process, etc., thereby detecting the electrical characteristics.
  • Step 103 for performing the repair data writing device used in writing the repair data in the above step 103, not only the function of writing the repair data to the storage device but also the integration of the electrical characteristics and/or the data characteristics can be integrated. And detecting whether the repair data written to the storage device is partially damaged.
  • the imaging cartridge chip encapsulation before detecting step, i.e., step 104 may not be detected by a further detecting device, but other means identifying sequence is complete Step 1 J, the write data and the detected data is written directly by repairing.

Abstract

一种成像盒芯片的修复方法，应用于成像技术领域。在成像盒芯片的修复过程中，利用激光束至少将成像盒芯片中包括的存储装置上功能接口的位置处开封，或至少将功能接口位置处的封装材料刮开或钻开，再通过功能接口和读写接口将修复数据写入到存储装置中。实现了对成像盒芯片的修复。

Description

一种成像盒芯片的修复方法
本申请要求于 2011年 9月 9日提交中国专利局、申请号为 201110268245.9, 发明名称为 "一种成像盒芯片的修复方法" 的中国专利申请优先权， 其全部内 容通过引用结合在本申请中。
技术领域
本发明涉及成像技术领域， 特别涉及一种成像盒芯片的修复方法。
背景技术
在成像装置（比如打印机、 复印机等） 中都安装有成像盒（比如碳粉盒、 粉盒、 带打印头的墨盒等）， 成像装置可以利用成像盒容纳的染色剂进行成像 操作。 当成像盒内的染色剂消耗完后，可以进行回收再利用，这样避免了浪费。
一般在成像盒中设置有成像盒芯片， 用于存储成像盒型号、 染色剂颜色、 制造日期、 染色剂容量及染色剂剩余量等信息，每个成像盒芯片与成像盒一一 对应，对成像盒回收处理包括对成像盒芯片的回收处理。现有技术中对成像盒 芯片进行回收时都需要筛选成像盒芯片，并完全覆盖方式将数据写入到成像盒 芯片中。
在上述将数据写入到成像盒芯片的过程中，需要用到成像盒芯片上的功能 接口，但是由于成像盒芯片上的集成电路都是封装在热固胶或硬壳等封装材料 中以保护集成电路，有些功能端口也被封装到封装材料中， 则在将数据写入到 成像盒芯片进行回收时， 需要通过酸性溶剂将封装材料腐蚀掉，将这些功能端 口露出来， 然后再进行数据的写入。
上述现有的成像盒芯片的回收过程中，使用酸性溶剂腐蚀封装材料时， 可 能会腐蚀成像盒芯片上的其它线路及元器件， 影响成像盒芯片的性能。
发明内容
本发明实施例提供一种成像盒芯片的修复方法,使得在成像盒芯片的回收 过程中， 成像盒芯片的性能不受影响。
本发明实施例提供一种成像盒芯片的修复方法，所述成像盒芯片中包括存 储装置， 包括：
利用激光束至少将所述存储装置上功能接口的位置处进行开封，或至少将 所述存储装置上所述功能接口位置处的封装材料刮开或钻开； 通过所述成像盒芯片的读写接口和所述功能接口将修复数据写入存储装 置中。
在本发明实施例中成像盒芯片的修复过程中，利用激光束至少将成像盒芯 片中包括的存储装置上功能接口的位置处开封，或至少将功能接口位置处的封 装材料刮开或钻开， 再通过功能接口和读写接口将修复数据写入到存储装置 中。这样在进行开封时使用激光束或刮开或钻开等方法进行开封， 比较容易控 制开封的参数， 比如开封口径和开封深度等，且不易损坏成像盒芯片上的其它 线路及元器件， 从而成像盒芯片的性能也不会受到影响。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施 例或现有技术描述中所需要使用的附图作筒单地介绍，显而易见地， 下面描述 中的附图仅仅是本发明的一些实施例， 对于本领域普通技术人员来讲，在不付 出创造性劳动性的前提下， 还可以根据这些附图获得其他的附图。
图 1是成像盒芯片的结构示意图；
图 2是成像盒芯片中的存储装置的结构示意图；
图 3是本发明实施例提供的一种成像盒芯片的修复方法流程图；
图 4是本发明实施例中成像盒芯片包括的存储装置被开封后的结构示意 图；
图 5是本发明实施例中将修复数据写入存储装置中的方法流程图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清 楚、 完整地描述， 显然， 所描述的实施例仅仅是本发明一部分实施例， 而不是 全部的实施例。基于本发明中的实施例， 本领域普通技术人员在没有作出创造 性劳动前提下所获得的所有其他实施例， 都属于本发明保护的范围。
本发明实施例提供一种成像盒芯片的修复方法，该方法应用于对成像盒芯 片的回收过程， 或在对成像盒芯片的故障修复过程中，对成像盒芯片中储存的 数据的修复。
参考图 1所示， 在成像盒芯片中一般包括： 电路板、 多个读写接口 （实施 例中以两个为例）及一个存储装置，读写接口与存储装置之间进行电路连接（在 图 1中没有画出）， 其中： 读写接口以可电接触的方式设置在电路板上； 存储装 置用于储存成像盒型号、 染色剂颜色、 制造日期、 染色剂容量及染色剂剩余量 等信息，是通过热固胶或硬壳将集成电路封装， 并将通信端口以引脚的方式引 出到电路板上。
存储装置中的集成电路一般由半导体即晶圓构成， 在集成电路的表面，往 往设置着多个通信端口， 参考图 2所示， 在集成电路被封装前， 一般会将需要 用到的通信端口用导线连接到外部引脚或电路板上。在集成电路表面，通常还 有一些用于使能或控制等特殊操作的功能端口，在考虑电路板布线的问题而没 有用导线连接到外部引脚或电路板上。
则在对成像盒芯片中的数据进行修复时，可能需要用到集成电路的部分功 能端口， 具体地， 可以利用激光束至少将成像盒芯片的存储装置上功能接口的 位置处进行开封， 或至少将存储装置上功能接口位置处的封装材料刮开或钻 开； 通过成像盒芯片的读写接口和功能接口将修复数据写入存储装置中。这样 在进行开封时使用激光束或刮开或钻开等方法进行开封，比较容易控制开封的 参数， 比如开封口径和开封深度等，且不易损坏成像盒芯片上的其它线路及元 器件， 从而成像盒芯片的性能也不会受到影响。
在具体开封时， 可以将存储装置上的所有封装材料去除，也可以只将存储 装置的特定位置处的封装材料去除。
在一个具体的实施例中， 可以通过如下的步骤进行修复， 流程图如图 3所 示， 包括：
步骤 101 , 确定成像盒芯片的存储装置上功能接口的位置。
在一般情况下， 功能接口都设置在存储装置中集成电路外侧表面上， 而集 成电路内侧表面是靠电路板的一侧，且在写入数据到存储装置时， 可能用到集 成电路表面上的部分功能接口， 则可以只需要确定用到的功能接口的位置。
这些功能接口是封装在封装材料中的，从外表面看是看不到这些功能接口 的具体位置，但对于同一种型号或大小特性等的成像盒芯片， 其中包括的存储 装置中功能接口的位置都是一样的，这样可以通过成像盒芯片的型号或大小等 特性就可以获知成像盒芯片的存储装置中功能接口的具体位置。且有些成像盒 芯片的功能接口位置也可以通过成像盒芯片的形状、布线和尺寸等外观特征而 得到。
步骤 102, 利用激光束至少将存储装置上功能接口的位置处进行开封， 或 至少将存储装置上功能接口位置处的封装材料刮开或钻开。
这里至少将功能接口的位置处进行开封是指至少去除覆盖在集成电路表 面上功能接口位置处的封装材料， 即不仅仅可以对功能接口位置处进行开封。 本实施例中可以通过如下的几种方式进行开封：
( 1 )利用激光束进行开封， 激光束具有能量高、 汇聚点小和功率可控等 特点， 可以方便地控制开封口径， 开封深度及开封时间等， 和现有技术中通过 酸性溶剂进行开封相比， 本实施例的方法具有准确度高、 高效、 安全及环保等 特点。
为了更安全地进行开封而不会损伤存储装置中集成电路上的功能接口，可 以至少在存储装置上功能接口的位置处进行多次激光束的照射以将封装材料 烧掉，且这多次激光束的开封深度之和小于或等于功能接口位置处的封装材料 厚度， 这样可以更加精准地掌握开封深度。 例如： 用不均等的方式先利用激光 束烧掉五分之三的目标封装材料，再烧掉剩余五分之二的目标封装材料； 或者 用均等的方式利用激光束烧掉二分之一的目标封装材料，再烧掉剩余二分之一 的目标封装材料。
其中这多次激光束照射所形成的口径即开封口径可以不同，且激光束照射 所形成的口径即开封口径逐次减小。对于不同类型的成像盒芯片，在存储装置 上进行激光束的开封时， 开封口径形状不同， 比如可以是方形或圓形或梯形或 三角形等， 这样可以通过开封口径来区分不同的成像盒芯片。
( 2 ) 可以利用刮刀至少去除覆盖在存储装置上功能接口位置处的封装材 料。
( 3 ) 可以利用钻孔工具至少去除覆盖在存储装置上功能接口位置处的封 装材料。且利用刮刀或钻孔工具进行开封时，可以控制开封口径和开封深度等。
需要说明的是， 在实际操作中， 为提高开封的安全率， 在通过上述几种方 式进行开封时， 可以至少在功能接口的晶圓表面上保留一层封装材料， 这样不 至于损伤集成电路的表面， 减少氧化的面积。 但是在使用该功能接口， 需要穿 过该层封装材料来连接功能接口。 例如图 4所示， 采用均等的方式对存储装置上功能接口位置处进行激光束 的照射来进行开封， 目标封装材料被不同开封口径的激光束分两次烧掉，使得 第二层的开封口径比第一层的开封口径窄，且在开封时在集成电路的晶圓表面 上保留一层封装材料。这种开封方式可以在使用功能接口时， 更准确地连接到 功能接口， 且还可以减少封装成像盒芯片时所需的封装材料。
步骤 103 , 通过成像盒芯片的读写接口和功能接口将修复数据写入存储装 置中。
在写入修复数据时， 可以将读写接口和功能接口连接到修复数据写入装 置， 由修复数据写入装置将修复数据写入到成像盒芯片的存储装置中。
步骤 104, 对成像盒芯片进行封装。
对成像盒芯片进行封装主要是将步骤 102中激光束烧掉或刮掉或钻掉的部 分用封装材料进行填充， 然后针对不同的封装材料， 进一步进行烘烤或冷却将 填充的封装材料固定。如果只将存储装置上功能接口位置处进行开封， 则在进 行封装时， 只需要对该处进行封装， 这样节省了封装材料。 来确认该成像盒芯片是回收产品； 且在对成像盒芯片进行封装时，对不同类型 的成像盒芯片可以使用不同的封装材料进行封装，从而可以通过封装材料来区 分不同类型的成像芯片。
可见，在本发明实施例中成像盒芯片的修复过程中，确定了功能接口的位 置后， 利用激光束对功能接口的位置处开封， 或将功能接口位置处的封装材料 刮开或钻开，再通过功能接口和读写接口将修复数据写入到存储装置中， 最后 对成像盒芯片进行封装。这样只对功能接口位置处进行开封，且开封使用的激 光束等方法比较容易控制， 不易损坏成像盒芯片上的其它线路及元器件，从而 成像盒芯片的性能也不会受到影响。
参考图 5所示， 在一个具体的实施例中， 在执行上述步骤 103时， 可以通过 如下的步骤来实现， 具体地：
A: 将读写接口通过有线或无线的方式与修复数据写入装置连接。
读写接口通过无线的方式与修复数据写入装置连接时，在读写接口可以设 置有天线， 且在修复数据写入装置上设置有对应的天线， 从而实现通信； 且修 复数据写入装置与读写接口的连接不限于无线方式， 还可以通过导线连接。 其中这里的修复数据写入装置是用于将需要修复的数据写入到成像盒芯 片的存储装置中。
B: 将功能接口与修复数据写入装置的相应接口连接。
如果在步骤 102中进行开封时， 在功能接口的晶圓表面没有保留一层封装 材料， 即将功能接口的晶圓表面露出来， 则将功能接口与修复数据写入装置的 相应接口直接连接。
如果在步骤 102中进行开封时， 在功能接口的晶圓表面上保留了一层封装 材料， 则需要通过导电电极来连接功能接口与修复数据写入装置，如图 4所示， 可以将导电电极的一端按压在功能端口上，使得导电电极的一端穿过保留的一 层封装材料与功能接口直接接触，且导电电极的另一端与修复数据写入装置的 相应接口连接。
C: 修复数据写入装置通过功能接口使能或控制存储装置， 并向读写接口 写入修复数据。
这里修复数据是指成像盒型号、 染色剂颜色、 制造日期、 染色剂容量或染 色剂剩余量等信息， 以匹配填充了染色剂的成像盒。
具体在修复数据写入的过程中，根据功能接口的作用， 可以发送时序信号 给功能接口来控制存储装置的读写时序；还可以向功能接口发送控制信号以进 行使能存储装置，这样通过功能接口的使能，存储装置可以进入另一个模式中， 比如存储装置当前模式是不能修改储存的数据，通过功能接口的使能后存储装 置中储存的数据能进行改写；又比如存储装置当前模式是通过储存的染色剂剩 余量不能改大， 通过功能接口的使能存储装置中储存的染色剂剩余量能改大 等。
且修复数据写入装置可以直接将部分或全部修复数据向读写接口写入，这 样存储装置则将读写接口接收的修复数据覆盖存储装置中原来储存的相应数 据， 比如修复数据写入装置将剩余染色剂量、制造日期等信息写入到存储装置 中， 则存储装置会将写入的数据覆盖原来储存的剩余染色剂量、制造日期等信 息。修复数据写入装置还可以将成像盒型号和分类等信息写入到存储装置中进 行覆盖，这样对成像盒芯片中的数据进行修复后，可以匹配其他型号的成像盒。 修复数据写入装置在写入修复数据到存储装置之前还可以先从读写接口 读取存储装置中原来储存的成像盒型号和分类等信息，并至少将与该成像盒型 号和分类等信息对应成像盒匹配的剩余染色剂量和 /或已消耗染色剂量等信息 写入到存储装置中， 其中对于有保质期的染色剂， 可以将制造日期写入到存储 装置中。
需要说明的是， 上述步骤 A和 B并没有绝对的顺序关系， 可以同时执行也 可以顺序执行，且写入修复数据的过程是针对需要通过功能接口使能或控制的 修复数据，而对于不需要功能接口使能或控制的修复数据则直接向读写接口写 入。
另外， 上述步骤 B是在需要用到功能接口的时候进行连接的， 比如需要将 剩余染色剂量和制造日期写入到存储装置，而该存储装置中的制造日期是不能 修改， 则在进行修复数据的写入过程中， 当写入制造日期时， 需要用到功能接 口进行使能存储装置，则需要将读写接口和功能接口都连接到修复数据写入装 置； 当写入剩余染色剂量时， 只需要将读写接口与连接到修复数据写入装置， 即可以实现剩余染色剂量的写入，则可以断开功能接口与修复数据写入装置的 连接。
且本发明实施例中所述的功能接口并不仅限于封装于封装材料中的接口， 读写接口也不仅限于没有封装于封装材料中的接口，对于某些具体的成像盒芯 片来说，部分特殊的修复数据可以从功能接口写入到存储装置中， 比如验证密 码等数据。
在其它具体的实施例中， 为了对成像盒芯片的修复更高效准确，在进行上 述步骤 101之前还需要对收集的废旧成像盒芯片进行预处理，包括对外观筛选、 物理特性和 /或数据特性识别、 分类和去尘等处理， 然后再对预处理后的成像 盒芯片执行上述步骤 101到 104, 即确定功能接口的位置、 开封、 写入修复数据 和封装的步骤。
可以理解， 从用户收集的成像盒芯片中， 有些形状尺寸不同， 有些型号不 同，有些已经损坏，有些沾有灰尘，有些贴有背胶等，就可以先进行外观筛选， 比如选择没有损伤的成像盒芯片。
然后可以进行数据特性和 /或电气特性的识别， 即选择数据特性和 /或电气 特性符合预置规则的成像盒芯片，对于数据特性来说，是指成像盒芯片在进行 读写数据时所具有的特性， 比如从成像盒芯片的读写接口读写数据，如果该成 像盒芯片有回应或回应的数据符合预置的规则， 则能识别该成像盒芯片； 对于 电气特性来说，是指成像盒芯片中固有电路所具有的特性， 比如成像盒芯片的 电压、 电流或频率的信息在一定范围内， 或某一电容处在充放电过程中等。
还可以根据成像盒芯片的形状、布线和尺寸等进行分类， 以便之后确定功 能接口的位置，使得成像盒芯片的修复更高效。且该分类的处理可以在筛选的 步骤之前或之后。
还可以对成像盒芯片进行清洁处理， 例如将灰尘洗掉或吹掉，将有背胶的 芯片的背胶去除等。这里清洁处理可以在筛选之前或是筛选处理之后，都不进 行限定。
需要说明的是，在成像盒芯片的回收过程中， 可以不执行上述的全部预处 理过程， 可以选择其中的至少一种处理， 并对处理后的成像盒芯片执行上述步 骤 101到 104, 但是进行数据特性和 /或电气特性的识别步骤是比较重要的步骤， 可以直接影响到成像盒芯片的修复是否成功的步骤，因此一般情况下都需要进 行数据特定和 /或电气特征的识别， 即选择数据特定和 /或电气特性符合预置规 则的成像盒芯片，并对选择的成像盒芯片执行上述确定功能接口的位置、开封、 写入修复数据和封装的步骤。
在另一种情况下， 对成像盒芯片的电气特性和 /或数据特性识别不限定在 确定功能接口的位置即步骤 101之前执行， 而可以在写入修复数据到存储装置 即步骤 103之前， 修复数据写入装置可以对成像盒芯片的存储装置进行电气特 性和 /或数据特性的识别， 这种情况下， 修复数据写入装置是具有电气特性和 / 或数据特性的识别的功能的。
在其它的具体实施例中，有可能在写入修复数据的过程中， 出现接口接触 不稳定，或存储装置损坏等因素造成写入修复数据失败，则需要在上述步骤 103 之后， 且在步骤 104的封装步骤之前对成像盒芯片进行检测， 检测写入的修复 数据是否被部分损坏， 如果是被部分损坏， 则说明在写入修复数据的过程中， 有部分数据被正确写入到存储装置中，存储装置没有被损坏，可以重复上述 103 及检测的步骤； 如果未被损坏， 则可以执行 104中的封装步骤； 如果完全被损 坏， 则可以说明该存储装置被损坏， 则丟弃该成像盒芯片， 这样极大地提高回 收成像盒芯片的效率。
在检测写入的修复数据是否被部分损坏时，可以通过测试设备有线或无线 地连接到芯片的读写接口，根据不同型号成像盒芯片的需要，还可以将测试设 备连接到功能接口上来进行协助检测。具体地， 可以对写入修复数据的成像盒 芯片的数据特性和 /或电气特性进行检测， 比如测试设备向成像盒芯片的读写 接口发送读写数据， 则成像盒芯片返回的数据符合预置的规则，从而进行数据 特性的检测； 测试设备还向成像盒芯片发送一定的电压、 电流或频率的信息， 再根据该成像盒芯片返回的信息进行判断， 比如成像盒芯片返回信息的电压、 电流或频率是否在一定的范围之内，又比如测试设备可以检测成像盒芯片中的 某一电容是否进行充放电过程等， 从而通过电气特性的检测。
需要说明的是，对于执行上述步骤 103中写入修复数据时所使用的修复数 据写入装置， 不仅可以具有写入修复数据到存储装置的功能，还可以集成电气 特性和 /或数据特性的识别， 及检测写入到存储装置的修复数据是否被部分损 坏的功能。这样在对成像盒芯片进行封装即步骤 104之前的检测步骤就可以不 用通过另外的检测设备进行检测，而是直接通过修复数据写入装置顺序完成识 另1 J、 写数据和检测的步骤。
以上对本发明实施例所提供的成像盒芯片的修复方法， 进行了详细介绍， 说明只是用于帮助理解本发明的方法及其核心思想； 同时，对于本领域的一般 技术人员，依据本发明的思想，在具体实施方式及应用范围上均会有改变之处， 综上所述， 本说明书内容不应理解为对本发明的限制。

Claims

权 利 要 求
1、 一种成像盒芯片的修复方法， 所述成像盒芯片中包括存储装置， 其特 征在于， 包括：
利用激光束至少将所述存储装置上功能接口的位置处进行开封，或至少将 所述存储装置上所述功能接口位置处的封装材料刮开或钻开；
通过所述成像盒芯片的读写接口和所述功能接口将修复数据写入存储装 置中。
2、 如权利要求 1所述的方法， 其特征在于， 所述利用激光束至少将所述存 储装置上所述功能接口的位置处进行开封，或至少将所述存储装置上所述功能 接口位置处的封装材料刮开或钻开， 之前还包括：
确定成像盒芯片的存储装置上功能接口的位置。
3、 如权利要求 1所述的方法， 其特征在于， 所述利用激光束至少将所述存 储装置上所述功能接口的位置处进行开封具体包括：
至少在所述存储装置上所述功能接口的位置处进行多次激光束的照射；所 述多次激光束的开封深度之和小于或等于所述功能接口位置处的封装材料厚 度。
4、 如权利要求 3所述的方法， 其特征在于， 所述多次激光束的开封口径不 同， 且激光束的开封口径逐次减小。
5、 如权利要求 4所述的方法， 其特征在于， 在不同类型的成像盒芯片中存 储装置上进行激光束的开封时， 开封口径形状不同。
6、 如权利要求 1所述的方法， 其特征在于， 还包括： 对所述成像盒芯片进 行封装；
且所述对所述成像盒芯片进行封装时，对不同类型的成像盒芯片使用不同 的封装材料进行封装。
7、 如权利要求 1所述的方法， 其特征在于， 所述通过所述成像盒芯片的读 写接口和所述功能接口将修复数据写入存储装置中具体包括：
将所述读写接口通过有线或无线的方式与修复数据写入装置连接； 将所述功能接口与修复数据写入装置的相应接口连接；
所述修复数据写入装置通过功能接口使能或控制所述存储装置，并向所述 读写接口写入修复数据。
8、 如权利要求 7所述的方法， 其特征在于， 所述利用激光束至少将所述存 储装置上所述功能接口的位置处进行开封时，或至少将所述存储装置上所述功 能接口位置处的封装材料刮开或钻开时，至少在所述功能接口的晶圓表面上保 留一层封装材料；
则所述将所述功能接口与修复数据写入装置的相应接口连接具体包括： 将导电电极一端穿过所述功能接口的晶圓表面上保留的一层封装材料，与 所述功能接口接触， 导电电极的另一端连接所述修复数据写入装置的相应接 口。
9、 如权利要求 7所述的方法， 其特征在于， 所述向所述读写接口写入修复 数据之前还包括：
所述修复数据写入装置从读写接口读取所述存储装置中原来储存的成像 盒型号和分类；
则所述向所述读写接口写入修复数据具体包括：
向所述读写接口至少写入与所述成像盒型号和分类对应成像盒匹配的剩 余染色剂量和 /或已消耗染色剂量。
10、 如权利要求 1至 9任一项所述的方法， 其特征在于， 所述利用激光束至 少将所述存储装置上所述功能接口的位置处进行开封，或至少将所述存储装置 上所述功能接口位置处的封装材料刮开或钻开， 之前还包括：
选择电气特性和 /或数据特性符合预置规则的成像盒芯片， 并对所述选择 的成像盒芯片执行所述开封和写入修复数据的步骤。
11、 如权利要求 1至 9任一项所述的方法， 其特征在于， 所述通过所述成像 盒芯片的读写接口和所述功能接口将修复数据写入存储装置中之后， 还包括： 检测写入所述存储装置的修复数据是否被部分损坏， 如果是被部分损坏， 则重复上述写入修复数据和检测的步骤。
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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104599997A (zh) * 2015-01-30 2015-05-06 工业和信息化部电子第五研究所 塑料封装金属丝键合器件的开封方法
CN105216453B (zh) * 2015-10-22 2017-05-24 杭州旗捷科技有限公司 打印机设备、再生墨盒、墨盒再生芯片及再生墨盒返修方法
CN105398226B (zh) * 2015-12-22 2017-03-29 杭州旗捷科技有限公司 再生墨盒的修复方法、修复芯片和再生墨盒
CN106098571B (zh) * 2016-08-08 2018-12-28 湖北三江航天红峰控制有限公司 一种塑封电子元器件的预开封方法
JP7000730B2 (ja) * 2017-08-01 2022-01-19 ブラザー工業株式会社 ドラムユニットおよび画像形成装置
EP3991974A4 (en) * 2019-06-28 2023-07-12 Zhuhai Ninestar Management Co., Ltd. INK CONTAINER CHIP AND INK CONTAINER
CN113909697A (zh) * 2020-07-08 2022-01-11 芯恩（青岛）集成电路有限公司 激光开封系统及激光开封方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006059301A (ja) * 2004-08-24 2006-03-02 Toshiba Tec Corp 商品販売データ処理装置
CN101121328A (zh) * 2007-09-11 2008-02-13 珠海天威飞马打印耗材有限公司 墨盒再生方法
US20080219692A1 (en) * 2007-03-07 2008-09-11 Konica Minolta Business Technologies, Inc. Process cartridge for use in image forming apparatus and image forming apparatus
CN102173208A (zh) * 2011-01-28 2011-09-07 珠海艾派克微电子有限公司 一种成像装置的存储芯片复位装置及方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5961860A (en) * 1995-06-01 1999-10-05 National University Of Singapore Pulse laser induced removal of mold flash on integrated circuit packages
US6335208B1 (en) * 1999-05-10 2002-01-01 Intersil Americas Inc. Laser decapsulation method
US7694246B2 (en) * 2002-06-19 2010-04-06 Formfactor, Inc. Test method for yielding a known good die
JP4301786B2 (ja) * 2002-09-11 2009-07-22 エステー産業株式会社 使用済みインクカートリッジのための再利用化用具
US7424245B2 (en) * 2005-10-19 2008-09-09 Static Control Components, Inc. Systems and methods for remanufacturing imaging components
US20090011522A1 (en) * 2007-07-02 2009-01-08 Drennan Monte D Semiconductor Device Package Disassembly
US7971947B2 (en) * 2008-04-07 2011-07-05 Static Control Components, Inc. Systems and methods for remanufacturing imaging components
CN102096367B (zh) * 2011-01-26 2012-10-03 珠海艾派克微电子有限公司 一种成像盒芯片复位方法和装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006059301A (ja) * 2004-08-24 2006-03-02 Toshiba Tec Corp 商品販売データ処理装置
US20080219692A1 (en) * 2007-03-07 2008-09-11 Konica Minolta Business Technologies, Inc. Process cartridge for use in image forming apparatus and image forming apparatus
CN101121328A (zh) * 2007-09-11 2008-02-13 珠海天威飞马打印耗材有限公司 墨盒再生方法
CN102173208A (zh) * 2011-01-28 2011-09-07 珠海艾派克微电子有限公司 一种成像装置的存储芯片复位装置及方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2755092A4 *

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