WO2013033988A1 - 一种成像盒芯片的修复装置 - Google Patents

一种成像盒芯片的修复装置 Download PDF

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Publication number
WO2013033988A1
WO2013033988A1 PCT/CN2012/073080 CN2012073080W WO2013033988A1 WO 2013033988 A1 WO2013033988 A1 WO 2013033988A1 CN 2012073080 W CN2012073080 W CN 2012073080W WO 2013033988 A1 WO2013033988 A1 WO 2013033988A1
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WO
WIPO (PCT)
Prior art keywords
interface
imaging cartridge
repair
cartridge chip
data
Prior art date
Application number
PCT/CN2012/073080
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English (en)
French (fr)
Inventor
曾阳云
Original Assignee
Zeng Yangyun
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zeng Yangyun filed Critical Zeng Yangyun
Publication of WO2013033988A1 publication Critical patent/WO2013033988A1/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G21/00—Arrangements not provided for by groups G03G13/00 - G03G19/00, e.g. cleaning, elimination of residual charge
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/06—Apparatus for electrographic processes using a charge pattern for developing
    • G03G15/08—Apparatus for electrographic processes using a charge pattern for developing using a solid developer, e.g. powder developer
    • G03G15/0822—Arrangements for preparing, mixing, supplying or dispensing developer
    • G03G15/0863—Arrangements for preparing, mixing, supplying or dispensing developer provided with identifying means or means for storing process- or use parameters, e.g. an electronic memory
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G2215/00—Apparatus for electrophotographic processes
    • G03G2215/00987—Remanufacturing, i.e. reusing or recycling parts of the image forming apparatus

Definitions

  • the present invention relates to the field of imaging technology, and in particular to a repair device for an imaging cartridge chip.
  • An imaging cartridge (such as a toner cartridge, a toner cartridge, an ink cartridge with a printhead, etc.) is mounted in an image forming apparatus (such as a printer, a copying machine, etc.), and the image forming apparatus can perform an image forming operation using the stain contained in the image forming cartridge.
  • an image forming apparatus such as a printer, a copying machine, etc.
  • an imaging cartridge chip is disposed in the imaging cartridge for storing information such as an imaging cartridge model, a color of the dye, a date of manufacture, a capacity of the dye, and a remaining amount of the dye, and the integrated circuit of the imaging cartridge chip is passed through a thermosetting adhesive or a hard shell.
  • the package material is packaged, some functional interfaces are also packaged into the package material.
  • Each imaging cartridge chip corresponds to an imaging cartridge - the recovery processing of the imaging cartridge includes the recycling of the imaging cartridge chip.
  • the functional port encapsulated in the packaging material is exposed by etching with an acidic solvent, and then the repair data is written into the imaging cartridge chip through the functional interface. .
  • the embodiment of the invention provides a repairing device for the imaging cartridge chip, so that the writing process of the repair data can be stably performed without newly adding a conductive member on the imaging cartridge chip, and the process is completed.
  • the embodiment of the invention provides a repairing device for an imaging cartridge chip, comprising: an interface device, a functional electrode and a repair processing device, wherein: The interface device is configured to connect the read/write interface of the repair processing device and the imaging cartridge chip by wireless or wired manner;
  • One end of the functional electrode is connected to the repair processing device, and the other end of the functional electrode is a conductive pin;
  • the repair processing device is configured to write repair data into the storage device of the imaging cartridge chip through a read/write interface respectively connected between the interface device and the functional electrode and a functional interface on the storage device of the imaging cartridge chip .
  • the interface between the repair processing device and the imaging box chip is connected through the interface device, and the functional interface on the storage device of the imaging box chip is connected through the conductive pin at one end of the functional electrode to make the function
  • the interface is connected to the repair processing device, so that the repair processing device can write the repair data to the storage device of the imaging cartridge chip through the read/write interface and the function interface. Since the repairing device of the embodiment is connected by a conductive pin when connecting the function interface, although the function interface is relatively small, the conductive pin can be directly pressed onto the function interface and connected to the function interface, and the device can be omitted from the imaging chip.
  • the conductive member can stably perform the writing process of the repair data, and the process is completed.
  • 1 is a schematic structural view of an imaging cartridge chip
  • FIG. 2 is a schematic structural view of a storage device in an imaging cartridge chip
  • FIG. 3 is a schematic structural diagram of a repairing device for an imaging cartridge chip according to an embodiment of the present invention
  • FIG. 4 is a flow chart of a method for repairing an imaging cartridge chip according to an embodiment of the present invention
  • FIG. 5 is a schematic structural view of the storage device included in the imaging cartridge chip after being opened in the embodiment of the present invention
  • FIG. 6 is a flow chart of a method of writing repair data into a storage device in an embodiment of the present invention.
  • Embodiments of the present invention provide a repairing device for an imaging cartridge chip, which is used for repairing an imaging cartridge chip, or repairing data stored in an imaging cartridge chip during a fault repair process of the imaging cartridge chip.
  • the imaging chip chip generally includes: a circuit board 1 , a plurality of read/write interfaces 2 (two in the embodiment as an example), and a storage device 3 , between the read/write interface 2 and the storage device 3 Making a circuit connection (not shown in Figure 1), wherein: the read/write interface 2 is electrically connected to the circuit board 1; the storage device 3 is used to store the imaging cartridge model, color of the dye, date of manufacture, dyeing Information such as the capacity of the agent and the amount of dye remaining is encapsulated by a thermoset or hard case, and the communication port is led out to the board as pin 31.
  • the integrated circuit 30 in the storage device 3 is generally composed of a semiconductor or a wafer.
  • a plurality of communication ports are often provided. As shown in FIG. 2, it is generally required before the integrated circuit 30 is packaged.
  • the used communication port is connected to the external pin 31 or the circuit board 1 by a wire 301.
  • function ports 302 for special operations such as enabling or controlling, and wires are not connected to the external pins 31 or the board 1 in consideration of board wiring problems.
  • the repairing device of the imaging cartridge chip comprises: at least one interface device 4, at least one functional electrode 5 and repair processing device 6, specifically:
  • the interface device 4 is configured to connect the read/write interface of the repair processing device and the imaging box chip by wireless or wired manner;
  • One end of the functional electrode 5 is connected to the repair processing device 6, and the other end of the functional electrode 5 is a conductive needle; the repair processing device 6 is used for storing the read/write interface 2 and the imaging cartridge chip respectively connected by the interface device 4 and the functional electrode 5.
  • the function interface 302 on the device 3 has been opened to write the repair data into the storage device 3 of the imaging cartridge chip. It can be seen that, in the repairing device of the embodiment of the present invention, the repair processing device 6 and the read/write interface 2 of the imaging cartridge chip are connected through the interface device 4, and the storage device 3 connected to the imaging cartridge chip through the conductive pin of the functional electrode 5 is opened.
  • the function interface 302 is output, so that the function interface 302 is connected to the repair processing device 6, so that the repair processing device 6 can write the repair data into the storage device 3 of the imaging cartridge chip through the read/write interface 2 and the function interface 302. Since the repairing device of the embodiment is connected by the conductive pin when the function interface 302 is connected, although the function interface is relatively small, the conductive pin can be directly pressed onto the function interface 302 and connected to the function interface 302, and the imaging chip can be omitted. The new conductive member can stably perform the writing process of the repair data, and the process is completed, and since the connection between the function interface 302 and the repairing device is connected through the conductive pin, it is not easy to be broken, so that the repair data is written. The entry is relatively stable.
  • the conductive pin is connected to the function interface 302 instead of the wire to connect the function interface, the conductive pin can be connected to the function interface when the function interface 302 is needed during the repair process, and disconnected when not needed.
  • the connection of the functional interface does not require the connection between the functional interface and the repair device during the entire repair process.
  • a slot 41 may be provided in the interface device 4 in the repairing device, and a conductive elastic piece 411 is provided in the slot 41, and the slot 41 has a notch 410 at one end.
  • the read/write interface 2 of the imaging cartridge chip is in contact with the conductive elastic piece 411, and the functional interface 302 is located at the notch 410, so that the conductive pin of the conductive electrode 5 can pass through.
  • the notch 410 is directly connected to the function interface 302; at least one connection interface 42 is further disposed on the interface device 4, wherein the conductive elastic piece 411 in the slot 41 is electrically connected to the connection interface 42 (not shown in FIG. 3 to be connected).
  • the conductive elastic piece 411 provided in the slot 41 of the interface device 4 shown in Fig. 3 is lowered with the notch 410 facing upward.
  • the read/write interface 2 and the function interface 302 are not on the same side of the circuit board 1 on the imaging cartridge chip, that is, the read/write interface 2 is on one side of the circuit board 1, and the functional interface 302 is on the other side of the circuit board 1. one side.
  • the interface device 4 is not limited to the interface shown in FIG. 3, and may be connected to the imaging box chip of the read/write interface 2 and the function interface 302 on the same side of the circuit board 1.
  • a plurality of interface devices 4 can be connected to the repair processing device 6.
  • the number of the conductive elastic pieces 411 and the connection interface 42 in the interface device 4 is not necessarily the same, and the connection between the conductive elastic piece 411 and the connection interface 42 may be one-to-many, or many-to-one, or many-to-many.
  • an insulating handle 51 and a conductive pin 52 may be included in the functional electrode 5, the non-needle tip of the conductive pin 52 is fixed on the insulating handle 51, and the non-needle tip is connected to the repair through the insulating handle 51.
  • the processing device 6 thus prevents instability of the connection between the functional interface and the repair processing device 6, and facilitates the repair operation.
  • the repair processing device 6 may have other functions in addition to the function of writing the repair data to the storage device.
  • the repair processing device 6 may also be used to read and write the interface 2 and/or the function interface 302. Detecting whether the electrical characteristics and/or data characteristics of the imaging cartridge chip conform to a preset rule, that is, identifying the electrical characteristics and/or data characteristics of the imaging cartridge chip; for example, the repair processing device 6 can also be used to read and write the interface 2 And/or the function interface 302, testing whether the repair data written to the storage device 3 is partially damaged or the like.
  • the data characteristics it refers to the characteristics of the imaging box chip when reading and writing data, such as reading and writing data from the read/write interface of the imaging box chip, if the imaging box chip has response or response data conforms to the preset.
  • the rule can identify the imaging chip; for electrical characteristics, it refers to the characteristics of the inherent circuit in the imaging chip, such as the voltage, current or frequency information of the imaging chip, within a certain range, or a certain
  • the capacitor is in the middle of charging and discharging process.
  • the operation of the repair processing device 6 can be controlled by another pointing device 7 connected to the repair processing device 6, wherein the pointing device 7 can specifically be directed to the repair processing device 6 transmitting a control signal to enter a certain functional mode, wherein the operations that the pointing device 7 can control may include:
  • Repair processing device 6 writes the operation of repairing data to the storage device
  • the repair processing device 6 detects, after reading the electrical characteristics and/or data characteristics of the imaging cartridge chip, by detecting the electrical characteristics and/or data characteristics of the imaging cartridge chip through the read/write interface and/or the functional interface, Performing operations to write repair data to the storage device; or,
  • the repair processing device 6 tests whether the repair data written to the storage device is partially damaged through the read/write interface and/or the functional interface after writing the repair data to the storage device; or
  • the repair processing device 6 writes the repair data to the storage device after detecting that the electrical characteristics and/or data characteristics of the imaging cartridge chip conform to the preset rules through the read/write interface and/or the function interface, and after writing the repair data to the storage device Tests whether the repair data written to the storage device is partially damaged or the like through a read/write interface and/or a function interface.
  • the data in the imaging box chip can be repaired by the following steps.
  • the flowchart is as shown in FIG. 4, and includes:
  • Step 101 Determine the location of the function interface on the storage device 3 of the imaging cartridge chip.
  • the functional interface 302 is disposed on the outer surface of the integrated circuit 30 in the storage device 3, while the inner surface of the integrated circuit 30 is on the side of the circuit board 1, and may be used when writing data to the storage device 3. To a portion of the functional interface 302 on the surface of the integrated circuit 30, it may only be necessary to determine the location of the functional interface 302 used.
  • These functional interfaces 302 are packaged in the packaging material, and the specific positions of these functional interfaces are not seen from the outer surface, but for the imaging cartridge chip of the same model or size characteristics, the functional interface in the storage device 3 included therein The positions are all the same, so that the specific position of the functional interface in the storage device 3 of the imaging cartridge chip can be known by the characteristics of the type or size of the imaging cartridge chip. Moreover, the functional interface locations of some of the imaging cartridge chips can also be obtained by external features such as the shape, wiring, and size of the imaging cartridge chip.
  • Step 102 unwinding the position of the function interface 302 on the storage device 3 with a laser beam, or scraping or drilling the encapsulating material at the position of the function interface 302 on the storage device 3.
  • Unsealing the location of the functional interface 302 herein means removing the encapsulation material at the location of the functional interface 302 over the surface of the integrated circuit 30.
  • the encapsulation can be performed in the following manners:
  • the laser beam is used for unsealing, and the laser beam has the characteristics of high energy, small convergence point and controllable power, and can conveniently control the opening diameter, the opening depth and the opening time, etc., and the unsealing phase by the acidic solvent in the prior art.
  • the method has the characteristics of high accuracy, high efficiency, safety and environmental protection.
  • multiple laser beams may be irradiated at the location of the functional interface 302 on the storage device 3 to burn the encapsulating material, and
  • the sum of the unsealing depths of the plurality of laser beams is less than or equal to the thickness of the encapsulating material at the position of the functional interface 302, so that the unsealing depth can be more accurately grasped.
  • use the laser beam to burn off three-fifths of the target packaging material in an unequal manner, and then burn off the remaining two-fifths of the target packaging material; or use the laser beam to burn off one-half of the equivalent in an equal manner.
  • the target packaging material is burned and the remaining one-half of the target packaging material is burned.
  • the diameter of the opening formed by the multiple laser beam irradiation may be different, and the diameter of the opening formed by the laser beam irradiation is gradually reduced.
  • the shape of the opening is different, for example, it may be square or circular or trapezoidal or triangular, so that different imaging chip chips can be distinguished by opening the opening.
  • the package material covering the position of the function interface 302 on the storage device 3 can be removed by a doctor blade.
  • a drilling tool can be used to remove the packaging material covering the functional interface location on the storage device.
  • a scraper or drilling tool it is possible to control the opening diameter and the opening depth.
  • a layer of encapsulation material may be left on the surface of the wafer of the functional interface 302, so as not to damage the integrated circuit. Surface, reducing the area of oxidation.
  • this functional interface it is necessary to pass through the layer of packaging material to connect the functional interface 302.
  • the laser beam is irradiated at the position of the function interface 302 on the storage device 3 in an equal manner to perform unsealing, and the target packaging material is burned twice by the laser beam of different opening diameters, so that the second layer is The unsealing aperture is narrower than the opening of the first layer and retains a layer of encapsulation material on the wafer surface of the integrated circuit 30 during unsealing.
  • This unsealing method allows for more accurate connection to the functional interface 302 when the functional interface 302 is used, and also reduces the packaging material required to package the imaging cartridge chip.
  • Step 103 The repair data is written into the storage device 3 through the read/write interface 2 and the function interface 302 of the imaging cartridge chip by using the repairing device of the imaging cartridge chip as shown in FIG.
  • the read/write interface 2 and the function interface 302 can be connected to the repairing device of the imaging cartridge chip, and the repair data is written by the repairing device of the imaging cartridge chip into the storage device 3 of the imaging cartridge chip.
  • Step 104 Encapsulate the imaging cartridge chip.
  • the imaging cartridge chip is mainly packaged by burning or scraping or drilling the laser beam in step 102 with a packaging material, and then further baking or cooling for different packaging materials can be confirmed by the packaging material.
  • the imaging cartridge chip is a recycled product; and when the imaging cartridge chip is packaged, different types of imaging cartridge chips can be packaged using different packaging materials, so that different types of imaging chips can be distinguished by the packaging material. It can be seen that, in the repair process of the imaging cartridge chip in the embodiment of the present invention, after the position of the functional interface is determined, the position of the functional interface is opened by using a laser beam, or the packaging material at the position of the functional interface is scraped or drilled.
  • the repair device of the imaging cartridge chip is used to write the repair data into the storage device through the functional interface and the read/write interface, and finally the imaging cartridge chip is packaged.
  • the function interface position is unsealed, and the laser beam used in the unsealing method is relatively easy to control, and it is not easy to damage other lines and components on the imaging box chip, so that the performance of the imaging box chip is not affected.
  • the repair data can be written into the storage device 3 by using the repair device of the imaging cartridge chip as shown in FIG. 3, specifically:
  • the read/write interface 2 is connected to the interface device 4 of the repairing device of the imaging cartridge chip by wire or wirelessly.
  • an antenna can be disposed on the read/write interface 2, and a corresponding antenna is disposed on the interface device 4 to implement communication; and the interface device 4 and the read/write interface 2 are realized.
  • the connection is not limited to the wireless mode, and can also be connected by wires.
  • the imaging chip chip can be inserted into the slot 41 provided on the interface device 4, so that the read/write interface 2 and the conductive elastic piece 411 and the read/write interface in the slot 41 are connected. 2 contact, and the function interface 302 is located at the notch 410 at one end of the slot 41, and connects the connection interface 42 provided on the interface device 4 with the repair processing device 6.
  • the function interface 302 is connected to the functional electrode 5 of the repairing device of the imaging cartridge chip.
  • the conductive pin of the functional electrode 5 is directly pressed to the functional interface 302 for connection. .
  • a layer of encapsulation material remains on the surface of the wafer of the functional interface 302.
  • the conductive pin of the functional electrode 5 needs to be pressed on the functional port 302, so that the functional electrode 5 is One end is in direct contact with the functional interface 302 through a remaining layer of encapsulating material.
  • the repair processing device 6 of the repairing device of the imaging cartridge chip enables or controls the storage device 3 through the function interface 302, and writes the repair data to the read/write interface 2.
  • the repair data here refers to information such as the type of imaging cartridge, the color of the dye, the date of manufacture, the capacity of the dye, or the remaining amount of the dye to match the imaging cartridge filled with the stain.
  • the repair processing device 6 can send a timing signal to the function interface 302 to control the read and write timing of the storage device 3; the repair processing device 6 can also send a control signal to the function interface 302 to enable the storage device 3, so that the storage device 3 can enter another mode by enabling the function interface 302.
  • the current mode of the storage device 3 cannot modify the stored data.
  • the data stored in the post-enable storage device 3 of the function interface 302 can be rewritten; for example, the current mode of the storage device 3 cannot be changed by the remaining amount of the stored dye, and is stored in the enabled storage device 3 through the function interface 302. The remaining amount of the dye can be changed to a larger value.
  • the repair processing device 6 can directly write some or all of the repair data to the read/write interface, so that the storage device 3 overwrites the repair data received by the read/write interface with the corresponding data originally stored in the storage device 3, for example, the repair processing device 6
  • the storage device 3 overwrites the written data with information such as the remaining dyeing amount, the date of manufacture, and the like originally stored.
  • the repair processing device 6 can also write information such as the model and classification of the imaging cartridge to the storage device 3 for coverage, so that the data in the imaging cartridge chip can be repaired to match other types of imaging cartridges.
  • the pointing device 7 can trigger the repair processing device 6 to read the image type and classification information originally stored in the storage device 3 from the read/write interface 2 before writing the repair data to the storage device. And at least information such as the remaining dyeing amount and/or the consumed dyeing amount matched with the imaging cartridge corresponding to the imaging cartridge model and classification information, etc., is written into the storage device 3, wherein for the stain having the shelf life, the manufacturing date can be Write to the storage device 3.
  • steps A and B do not have an absolute order relationship, and may be executed simultaneously or sequentially, and the process of writing the repair data is for the repair data that needs to be enabled or controlled through the function interface, and is not required.
  • the repair data enabled or controlled by the function interface is written directly to the read/write interface.
  • step B is connected when the function connection 302 is needed.
  • the remaining dyeing amount and the manufacturing date need to be written to the storage device 3, and the manufacturing date in the storage device 3 cannot be modified.
  • the function interface 302 is required to enable the storage device 3, and the read/write interface 2 and the function interface 302 need to be connected to the repair device of the imaging cartridge chip.
  • the remaining dyeing dose only the read/write interface 2 and the repairing device connected to the imaging cartridge chip need to be written, that is, the writing of the remaining dyeing dose can be realized, and the function interface 302 and the repairing device of the imaging cartridge chip can be disconnected. Connection.
  • the functional interface described in the embodiments of the present invention is not limited to the interface encapsulated in the packaging material, and the read/write interface is not limited to the interface not encapsulated in the packaging material, for some specific imaging cartridge cores.
  • some special repair data can be written from the function interface to the storage device, such as verifying passwords and other data.
  • the pre-processed imaging cartridge chip in order to make the repair of the imaging cartridge chip more efficient and accurate, it is necessary to pre-process the collected used imaging cartridge chip before performing the above step 101, including screening for appearance, physical characteristics and/or data characteristics. Processing such as identification, classification, and dust removal, and then performing the above steps 101 to 104 on the pre-processed imaging cartridge chip, that is, determining the position of the functional interface, unsealing, writing repair data, and packaging.
  • Identification of the data characteristics and/or electrical characteristics can then be performed, i.e., an imaging cartridge chip that selects data characteristics and/or electrical characteristics that conform to preset rules.
  • the repair processing device 6 in the repairing device of the imaging cartridge chip can be used to identify the data characteristics and/or electrical characteristics of the imaging cartridge chip through the connected read/write interface 2 and the function interface 302.
  • the cleaning process here may not be limited before or after the screening process.
  • all of the above preprocessing processes may not be performed, at least one of the processes may be selected, and the above steps 101 to 104 are performed on the processed imaging cartridge chip, but
  • the identification step of data characteristics and/or electrical characteristics is an important step that directly affects the success of the repair of the imaging cartridge chip. Therefore, data specific and/or electrical characteristics are generally required to be identified, that is, data is selected.
  • the imaging cartridge chip having specific and/or electrical characteristics conforming to a preset rule, and performing the above-described steps of determining the position of the functional interface, unsealing, writing repair data, and packaging for the selected imaging cartridge chip.
  • the identification of the electrical characteristics and/or data characteristics of the imaging cartridge chip is not limited to the determination of the location of the functional interface, ie, prior to step 101, but the repair of the data can be written to the storage device. That is, before step 103, the repairing device of the imaging cartridge chip can identify the electrical characteristics and/or data characteristics of the storage device 3 of the imaging cartridge chip. In this case, the repair processing device 6 of the repairing device of the imaging cartridge chip has electrical The ability to identify features and/or data characteristics.
  • the interface contact is unstable, or the storage device is damaged, and the write repair data fails, and the step 103 is required, and in step 104.
  • the imaging cartridge chip is detected to detect whether the written repair data is partially damaged. If it is partially damaged, it means that some data is correctly written into the storage device during the process of writing the repair data.
  • the storage device is not damaged, and the steps of 103 and detecting may be repeated; if not damaged, the encapsulation step in 104 may be performed; if it is completely damaged, the storage device may be damaged, and the imaging cartridge is discarded.
  • the chip which greatly improves the efficiency of recycling the imaging cartridge chip.
  • the interface device 4 of the repairing device of the imaging cartridge chip can be connected to the read/write interface of the chip by wire or wirelessly, and can be imaged according to the needs of different types of imaging cartridge chips.
  • the function electrode 5 of the repair device of the cassette chip is connected to the function interface for assisted detection. Specifically, the data characteristics and/or electrical characteristics of the imaging cartridge chip in which the repair data is written may be detected. For example, in the repairing device of the imaging cartridge chip, the repair processing device 6 sends the read/write data to the read/write interface of the imaging cartridge chip.
  • the data returned by the imaging cartridge chip conforms to preset rules for detecting data characteristics; the repair processing device 6 of the repairing device of the imaging cartridge chip also transmits a certain voltage, current or frequency information to the imaging cartridge chip, and then according to the imaging
  • the information returned by the chip chip is judged, for example, whether the voltage, current or frequency of the information returned by the imaging chip chip is within a certain range, and in the repair device of the imaging cartridge chip, the repair processing device 6 can detect one of the imaging chip chips. Whether the capacitor is subjected to a charge and discharge process or the like, thereby detecting the electrical characteristics.
  • the repair processing device 6 in the repair device for performing the imaging cartridge chip used in writing the repair data in the above step 103 can not only have the function of writing the repair data to the storage device, but also integrate the electrical characteristics and / or identification of data characteristics, and testing whether the repair data written to the storage device is partially damaged. This allows the steps of identifying, writing data and testing to be done directly through the repair device of the imaging cartridge chip. And the different operations of the repair processing device 6 can be performed under the indication of the pointing device 7.

Abstract

一种成像盒芯片的修复装置，通过接口装置（4）连接修复处理装置（6）与成像盒芯片的读写接口（2），并通过功能电极（5）一端的导电针（52）连接成像盒芯片的存储装置（3）上已开封出的功能接口（302），使得功能接口（302）与修复处理装置（6）连接，这样修复处理装置（6）就可以通过读写接口（2）和功能接口（302），将修复数据写入到成像盒芯片的存储装置（3）中，实现了对成像盒芯片的修复。

Description

一种成像盒芯片的修复装置
本申请要求于 2011 年 9 月 9 日提交中国专利局、 申请号为 201110268243.X, 发明名称为 "一种成像盒芯片的修复装置" 的中国专利申请 优先权， 其全部内容通过引用结合在本申请中。
技术领域
本发明涉及成像技术领域， 特别涉及成像盒芯片的修复装置。
背景技术
在成像装置（比如打印机、 复印机等） 中都安装有成像盒（比如碳粉盒、 粉盒、 带打印头的墨盒等）， 成像装置可以利用成像盒容纳的染色剂进行成像 操作。 当成像盒内的染色剂消耗完后，可以进行回收再利用，这样避免了浪费。
一般在成像盒中设置有成像盒芯片， 用于存储成像盒型号、 染色剂颜色、 制造日期、 染色剂容量及染色剂剩余量等信息，且成像盒芯片的集成电路通过 热固胶或硬壳等封装材料封装起来，有些功能接口也被封装到封装材料中。每 个成像盒芯片与成像盒——对应，对成像盒回收处理包括对成像盒芯片的回收 处理。现有技术中对成像盒芯片进行回收时都需要 选成像盒芯片，通过酸性 溶剂的腐蚀将被封装在封装材料中的功能端口露出来，然后通过功能接口将修 复数据写入到成像盒芯片中。
由于这些功能接口很细小， 为了提高修复数据写入的稳定性，在通过功能 接口将修复数据写入到成像盒芯片过程中，需要在成像盒芯片上新增一个导电 部件，将这些功能接口通过导线引出到该导电部件， 并将该导电部件与修复装 置进行连接， 从而实现功能接口与修复装置的连接， 并进行修复数据的写入。 这样需要在成像盒芯片上新增导电部件，会改变原有成像盒芯片的结构，且工 艺复杂， 功能接口与导电部件之间的导线容易折断，使得成像盒芯片的修复不 稳定。
发明内容
本发明实施例提供成像盒芯片的修复装置，使得不需要在成像盒芯片上新 增导电部件就能稳定地进行修复数据的写入过程， 筒化了工艺。
本发明实施例提供一种成像盒芯片的修复装置， 包括： 接口装置、 功能电 极和修复处理装置， 其中： 所述接口装置，用于通过无线或有线的方式连接修复处理装置与成像盒芯 片的读写接口；
所述功能电极的一端连接到所述修复处理装置，所述功能电极的另一端为 导电针；
所述修复处理装置，用于通过接口装置和功能电极分别连接的读写接口和 成像盒芯片的存储装置上已开封处的功能接口，将修复数据写入到所述成像盒 芯片的存储装置中。
本发明实施例的修复装置中，通过接口装置连接修复处理装置与成像盒芯 片的读写接口，并通过功能电极一端的导电针连接成像盒芯片的存储装置上已 开封出的功能接口，使得功能接口与修复处理装置连接， 这样修复处理装置就 可以通过读写接口和功能接口， 将修复数据写入到成像盒芯片的存储装置中。 由于本实施例的修复装置在连接功能接口时通过导电针连接，虽然功能接口比 较细小，但是能将该导电针直接按压到功能接口上与功能接口连接， 可以不需 要在成像盒芯片上新增导电部件就能稳定地进行修复数据的写入过程，筒化了 工艺。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施 例或现有技术描述中所需要使用的附图作筒单地介绍，显而易见地， 下面描述 中的附图仅仅是本发明的一些实施例， 对于本领域普通技术人员来讲，在不付 出创造性劳动性的前提下， 还可以根据这些附图获得其他的附图。
图 1是成像盒芯片的结构示意图；
图 2是成像盒芯片中的存储装置的结构示意图；
图 3是本发明实施例提供的一种成像盒芯片的修复装置的结构示意图； 图 4是本发明实施例中一种成像盒芯片的修复方法流程图；
图 5是本发明实施例中成像盒芯片包括的存储装置被开封后的结构示意 图；
图 6是本发明实施例中将修复数据写入存储装置中的方法流程图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清 楚、 完整地描述， 显然， 所描述的实施例仅仅是本发明一部分实施例， 而不是 全部的实施例。基于本发明中的实施例， 本领域普通技术人员在没有作出创造 性劳动前提下所获得的所有其他实施例， 都属于本发明保护的范围。
本发明实施例提供一种成像盒芯片的修复装置，该装置用于对成像盒芯片 的回收过程， 或在对成像盒芯片的故障修复过程中，对成像盒芯片中储存的数 据进行修复。
参考图 1所示， 在成像盒芯片中一般包括： 电路板 1、 多个读写接口 2 (实 施例中以两个为例）及一个存储装置 3 , 读写接口 2与存储装置 3之间进行电路 连接（在图 1中没有画出）， 其中： 读写接口 2以可电接触的方式设置在电路板 1 上； 存储装置 3用于储存成像盒型号、 染色剂颜色、 制造日期、 染色剂容量及 染色剂剩余量等信息，是通过热固胶或硬壳将集成电路封装， 并将通信端口以 引脚 31的方式引出到电路板上。
存储装置 3中的集成电路 30—般由半导体即晶圓构成， 在集成电路 30的表 面， 往往设置着多个通信端口， 参考图 2所示， 在集成电路 30被封装前， 一般 会将需要用到的通信端口用导线 301连接到外部引脚 31或电路板 1上。在集成电 路 30表面， 通常还有一些用于使能或控制等特殊操作的功能端口 302, 在考虑 电路板布线的问题而没有用导线连接到外部引脚 31或电路板 1上。
则在对成像盒芯片中的数据进行修复时，可能需要用到集成电路的部分功 能端口， 这就需要先将存储装置 3上被封装的功能接口 302位置处进行开封，将 功能接口 302露出来， 并通过本发明实施例的修复装置对成像盒芯片的数据进 行修复， 其中：
参考图 3所示， 成像盒芯片的修复装置包括： 至少一个接口装置 4、 至少一 个功能电极 5和修复处理装置 6, 具体地：
接口装置 4, 用于通过无线或有线的方式连接修复处理装置与成像盒芯片 的读写接口；
功能电极 5的一端连接到修复处理装置 6, 功能电极 5的另一端为导电针； 修复处理装置 6 , 用于通过接口装置 4和功能电极 5分别连接的读写接口 2 和成像盒芯片的存储装置 3上已开封处的功能接口 302,将修复数据写入到成像 盒芯片的存储装置 3中。 可见， 本发明实施例的修复装置中， 通过接口装置 4连接修复处理装置 6 与成像盒芯片的读写接口 2,并通过功能电极 5—端的导电针连接成像盒芯片的 存储装置 3上已开封出的功能接口 302 , 使得功能接口 302与修复处理装置 6连 接， 这样修复处理装置 6就可以通过读写接口 2和功能接口 302, 将修复数据写 入到成像盒芯片的存储装置 3中。由于本实施例的修复装置在连接功能接口 302 时通过导电针连接， 虽然功能接口比较细小，但是能将该导电针直接按压到功 能接口 302上与功能接口 302连接，可以不需要在成像盒芯片上新增导电部件就 能稳定地进行修复数据的写入过程， 筒化了工艺， 且由于在功能接口 302与修 复装置之间的连接是通过导电针连接， 不容易折断，使得修复数据的写入比较 稳定。
另外， 由于使用导电针连接功能接口 302, 而不是导线形式连接功能接口， 则在修复过程中可以在需要用到功能接口 302时， 将导电针与功能接口连接， 而在不需要时断开与功能接口的连接，而不需要整个修复过程中都维护功能接 口与修复装置之间的连接。
由于成像盒芯片一般体积较小， 为了方便操作， 在一个具体的实施例中， 可以在修复装置中的接口装置 4上设置一个插槽 41 , 在插槽 41内有导电弹片 411 , 且插槽 41一端有缺口 410, 当成像盒芯片插入到插槽 41后， 成像盒芯片的 读写接口 2与导电弹片 411接触， 且功能接口 302位于缺口 410处，使得导电电极 5的导电针可以穿过缺口 410直接与功能接口 302连接；在接口装置 4上还设置有 至少一个连接接口 42,其中插槽 41内的导电弹片 411与连接接口 42导电连接（图 3中没有画出待连接）。
需要说明的是， 图 3中所示的接口装置 4中插槽 41内设置的导电弹片 411靠 下， 而缺口 410朝上。 这样连接的成像盒芯片中， 读写接口 2和功能接口 302不 在该成像盒芯片上电路板 1的同一面， 即读写接口 2在电路板 1的一面， 功能接 口 302在电路板 1的另一面。 而接口装置 4并不限于图 3所示的接口，还可以连接 读写接口 2和功能接口 302在电路板 1同一面的成像盒芯片。且在修复处理装置 6 上可以连接有多个接口装置 4。
接口装置 4中导电弹片 411和连接接口 42的数量不一定相同， 则导电弹片 411与连接接口 42之间的连接可以是一对多， 或多对一， 也可以是多对多。 在另一个具体的实施例中， 在功能电极 5中可以包括绝缘把手 51和导电针 52, 导电针 52的非针尖端固定在绝缘把手 51上， 且非针尖端穿过绝缘把手 51 连接到修复处理装置 6,这样防止了功能接口与修复处理装置 6之间连接的不稳 定， 且方便了修复操作。
在其他具体实施例中， 修复处理装置 6除了具有写修复数据到存储装置的 功能外， 还可以具体其他功能， 比如该修复处理装置 6还可以用于通过读写接 口 2和 /或功能接口 302, 检测成像盒芯片的电气特性和 /或数据特性是否符合预 置规则， 即对成像盒芯片进行电气特性和 /或数据特性的识别； 又比如修复处 理装置 6还可以用于通过读写接口 2和 /或功能接口 302, 测试写入存储装置 3的 修复数据是否被部分损坏等。
其中对于数据特性来说， 是指成像盒芯片在进行读写数据时所具有的特 性， 比如从成像盒芯片的读写接口读写数据，如果该成像盒芯片有回应或回应 的数据符合预置的规则， 则能识别该成像盒芯片； 对于电气特性来说， 是指成 像盒芯片中固有电路所具有的特性， 比如成像盒芯片的电压、 电流或频率的信 息在一定范围内， 或某一电容处在充放电过程中等。
由于修复处理装置 6具有了多种功能， 修复装置中就可以通过另外一个连 接在修复处理装置 6上的指示装置 7 , 来控制修复处理装置 6的操作， 其中指示 装置 7具体可以向修复处理装置 6发送控制信号来进入某个功能模式，这里指示 装置 7可以控制的操作可以包括：
修复处理装置 6写修复数据到存储装置的操作； 或，
修复处理装置 6在通过读写接口和 /或功能接口，检测到成像盒芯片的电气 特性和 /或数据特性符合预置规则时， 即对成像盒芯片进行电气特性和 /或数据 特性识别后， 进行写修复数据到存储装置的操作； 或，
修复处理装置 6在写修复数据到存储装置后， 通过读写接口和 /或功能接 口， 测试写入存储装置的修复数据是否被部分损坏的操作； 或，
修复处理装置 6在通过读写接口和 /或功能接口，检测到成像盒芯片的电气 特性和 /或数据特性符合预置规则时， 写修复数据到存储装置， 并在写修复数 据到存储装置后， 通过读写接口和 /或功能接口， 测试写入存储装置的修复数 据是否被部分损坏的操作等。 在本发明实施例中可以通过如下的步骤进行对成像盒芯片中的数据进行 修复， 流程图如图 4所示， 包括：
步骤 101 , 确定成像盒芯片的存储装置 3上功能接口的位置。
在一般情况下， 功能接口 302都设置在存储装置 3中集成电路 30外侧表面 上， 而集成电路 30内侧表面是靠电路板 1的一侧， 且在写入数据到存储装置 3 时， 可能用到集成电路 30表面上的部分功能接口 302, 则可以只需要确定用到 的功能接口 302的位置。
这些功能接口 302是封装在封装材料中的， 从外表面看是看不到这些功能 接口的具体位置，但对于同一种型号或大小特性等的成像盒芯片， 其中包括的 存储装置 3中功能接口的位置都是一样的， 这样可以通过成像盒芯片的型号或 大小等特性就可以获知成像盒芯片的存储装置 3中功能接口的具体位置。 且有 些成像盒芯片的功能接口位置也可以通过成像盒芯片的形状、布线和尺寸等外 观特征而得到。
步骤 102, 利用激光束对存储装置 3上功能接口 302的位置处进行开封， 或 将存储装置 3上功能接口 302位置处的封装材料刮开或钻开。
这里对功能接口 302的位置处进行开封是指去除覆盖在集成电路 30表面上 功能接口 302位置处的封装材料。 本实施例中可以通过如下的几种方式进行开 封：
( 1 )利用激光束进行开封， 激光束具有能量高、 汇聚点小和功率可控等 特点， 可以方便地控制开封口径， 开封深度及开封时间等， 和现有技术中通过 酸性溶剂进行开封相比， 本实施例的方法具有准确度高、 高效、 安全及环保等 特点。
为了更安全地进行开封而不会损伤存储装置 3中集成电路 30上的功能接口 302, 可以在存储装置 3上功能接口 302的位置处进行多次激光束的照射以将封 装材料烧掉， 且这多次激光束的开封深度之和小于或等于功能接口 302位置处 的封装材料厚度， 这样可以更加精准地掌握开封深度。 例如： 用不均等的方式 先利用激光束烧掉五分之三的目标封装材料，再烧掉剩余五分之二的目标封装 材料； 或者用均等的方式利用激光束烧掉二分之一的目标封装材料，再烧掉剩 余二分之一的目标封装材料。 其中这多次激光束照射所形成的口径即开封口径可以不同，且激光束照射 所形成的口径即开封口径逐次减小。对于不同类型的成像盒芯片，在存储装置
3上进行激光束的开封时， 开封口径形状不同， 比如可以是方形或圓形或梯形 或三角形等， 这样可以通过开封口径来区分不同的成像盒芯片。
( 2 )可以利用刮刀去除覆盖在存储装置 3上功能接口 302位置处的封装材 料。
( 3 ) 可以利用钻孔工具去除覆盖在存储装置上功能接口位置处的封装材 料。 且利用刮刀或钻孔工具进行开封时， 可以控制开封口径和开封深度等。
需要说明的是， 在实际操作中， 为提高开封的安全率， 在通过上述几种方 式进行开封时， 可以在功能接口 302的晶圓表面上保留一层封装材料， 这样不 至于损伤集成电路的表面， 减少氧化的面积。 但是在使用该功能接口， 需要穿 过该层封装材料来连接功能接口 302。
例如图 5所示， 采用均等的方式对存储装置 3上功能接口 302位置处进行激 光束的照射来进行开封， 目标封装材料被不同开封口径的激光束分两次烧掉， 使得第二层的开封口径比第一层的开封口径窄，且在开封时在集成电路 30的晶 圓表面上保留一层封装材料。 这种开封方式可以在使用功能接口 302时， 更准 确地连接到功能接口 302, 且还可以减少封装成像盒芯片时所需的封装材料。
步骤 103 , 利用如图 3所示的成像盒芯片的修复装置，通过成像盒芯片的读 写接口 2和功能接口 302将修复数据写入存储装置 3中。
在写入修复数据时，可以将读写接口 2和功能接口 302连接到成像盒芯片的 修复装置，由成像盒芯片的修复装置将修复数据写入到成像盒芯片的存储装置 3中。
步骤 104, 对成像盒芯片进行封装。
对成像盒芯片进行封装主要是将步骤 102中激光束烧掉或刮掉或钻掉的部 分用封装材料进行填充， 然后针对不同的封装材料， 进一步进行烘烤或冷却将 可以通过封装材料来确认该成像盒芯片是回收产品；且在对成像盒芯片进行封 装时，对不同类型的成像盒芯片可以使用不同的封装材料进行封装，从而可以 通过封装材料来区分不同类型的成像芯片。 可见，在本发明实施例中成像盒芯片的修复过程中，确定了功能接口的位 置后， 利用激光束对功能接口的位置处开封， 或将功能接口位置处的封装材料 刮开或钻开，再利用成像盒芯片的修复装置通过功能接口和读写接口将修复数 据写入到存储装置中， 最后对成像盒芯片进行封装。这样只对功能接口位置处 进行开封，且开封使用的激光束等方法比较容易控制， 不易损坏成像盒芯片上 的其它线路及元器件， 从而成像盒芯片的性能也不会受到影响。
参考图 6所示， 在一个具体的实施例中， 在执行上述步骤 103时， 可以利用 如图 3所示的成像盒芯片的修复装置将修复数据写入到存储装置 3中， 具体地：
A: 将读写接口 2通过有线或无线的方式与成像盒芯片的修复装置的接口 装置 4连接。
读写接口 2通过无线的方式与接口装置 4连接时， 在读写接口 2可以设置有 天线， 且在接口装置 4上设置有对应的天线， 从而实现通信； 且接口装置 4与读 写接口 2的连接不限于无线方式， 还可以通过导线连接， 具体地， 可以将成像 盒芯片插入接口装置 4上设置的插槽 41 ,使得读写接口 2与插槽 41内的导电弹片 411与读写接口 2接触， 且功能接口 302位于插槽 41一端的缺口 410处， 并将接口 装置 4上设置的连接接口 42与修复处理装置 6连接。
B: 将功能接口 302与成像盒芯片的修复装置的功能电极 5连接。
如果在步骤 102中进行开封时， 在功能接口的晶圓表面没有保留一层封装 材料， 即将功能接口的晶圓表面露出来， 则直接将功能电极 5的导电针按压到 功能接口 302处进行连接。
如果在步骤 102中进行开封时，在功能接口 302的晶圓表面上保留了一层封 装材料， 如图 5所示， 需要将功能电极 5的导电针按压在功能端口 302上， 使得 功能电极 5的一端穿过保留的一层封装材料与功能接口 302直接接触。
C: 成像盒芯片的修复装置的修复处理装置 6通过功能接口 302使能或控制 存储装置 3 , 并向读写接口 2写入修复数据。
这里修复数据是指成像盒型号、 染色剂颜色、 制造日期、 染色剂容量或染 色剂剩余量等信息， 以匹配填充了染色剂的成像盒。
具体在修复数据写入的过程中，根据功能接口 302的作用，修复处理装置 6 可以发送时序信号给功能接口 302来控制存储装置 3的读写时序；修复处理装置 6还可以向功能接口 302发送控制信号以进行使能存储装置 3 , 这样通过功能接 口 302的使能， 存储装置 3可以进入另一个模式中， 比如存储装置 3当前模式是 不能修改储存的数据，通过功能接口 302的使能后存储装置 3中储存的数据能进 行改写； 又比如存储装置 3当前模式是通过储存的染色剂剩余量不能改大， 通 过功能接口 302的使能存储装置 3中储存的染色剂剩余量能改大等。
且修复处理装置 6可以直接将部分或全部修复数据向读写接口写入， 这样 存储装置 3则将读写接口接收的修复数据覆盖存储装置 3中原来储存的相应数 据， 比如修复处理装置 6将剩余染色剂量、 制造日期等信息写入到存储装置 3 中， 则存储装置 3会将写入的数据覆盖原来储存的剩余染色剂量、 制造日期等 信息。修复处理装置 6还可以将成像盒型号和分类等信息写入到存储装置 3中进 行覆盖，这样对成像盒芯片中的数据进行修复后，可以匹配其他型号的成像盒。
成像盒芯片的修复装置中指示装置 7可以触发修复处理装置 6在写入修复 数据到存储装置之前，还可以先从读写接口 2读取存储装置 3中原来储存的成像 盒型号和分类等信息，并至少将与该成像盒型号和分类等信息对应成像盒匹配 的剩余染色剂量和 /或已消耗染色剂量等信息写入到存储装置 3中， 其中对于有 保质期的染色剂， 可以将制造日期写入到存储装置 3中。
需要说明的是， 上述步骤 A和 B并没有绝对的顺序关系， 可以同时执行也 可以顺序执行，且写入修复数据的过程是针对需要通过功能接口使能或控制的 修复数据，而对于不需要功能接口使能或控制的修复数据则直接向读写接口写 入。
另外， 上述步骤 B是在需要用到功能接 ,302的时候进行连接的， 比如需要 将剩余染色剂量和制造日期写入到存储装置 3 ,而该存储装置 3中的制造日期是 不能修改， 则在进行修复数据的写入过程中， 当写入制造日期时， 需要用到功 能接口 302进行使能存储装置 3 ,则需要将读写接口 2和功能接口 302都连接到成 像盒芯片的修复装置； 当写入剩余染色剂量时， 只需要将读写接口 2与连接到 成像盒芯片的修复装置， 即可以实现剩余染色剂量的写入， 则可以断开功能接 口 302与成像盒芯片的修复装置的连接。
且本发明实施例中所述的功能接口并不仅限于封装于封装材料中的接口， 读写接口也不仅限于没有封装于封装材料中的接口，对于某些具体的成像盒芯 片来说，部分特殊的修复数据可以从功能接口写入到存储装置中， 比如验证密 码等数据。
在其它具体的实施例中， 为了对成像盒芯片的修复更高效准确，在进行上 述步骤 101之前还需要对收集的废旧成像盒芯片进行预处理，包括对外观筛选、 物理特性和 /或数据特性识别、 分类和去尘等处理， 然后再对预处理后的成像 盒芯片执行上述步骤 101到 104, 即确定功能接口的位置、 开封、 写入修复数据 和封装的步骤。
可以理解， 从用户收集的成像盒芯片中， 有些形状尺寸不同， 有些型号不 同，有些已经损坏，有些沾有灰尘，有些贴有背胶等，就可以先进行外观筛选， 比如选择没有损伤的成像盒芯片。
然后可以进行数据特性和 /或电气特性的识别， 即选择数据特性和 /或电气 特性符合预置规则的成像盒芯片。具体地， 可以利用成像盒芯片的修复装置中 的修复处理装置 6通过连接的读写接口 2和功能接口 302, 对成像盒芯片进行数 据特性和 /或电气特性的识别。
还可以根据成像盒芯片的形状、布线和尺寸等进行分类， 以便之后确定功 能接口的位置，使得成像盒芯片的修复更高效。且该分类的处理可以在筛选的 步骤之前或之后。
还可以对成像盒芯片进行清洁处理， 例如将灰尘洗掉或吹掉，将有背胶的 芯片的背胶去除等。这里清洁处理可以在筛选之前或是筛选处理之后，都不进 行限定。
需要说明的是，在成像盒芯片的回收过程中， 可以不执行上述的全部预处 理过程， 可以选择其中的至少一种处理， 并对处理后的成像盒芯片执行上述步 骤 101到 104, 但是进行数据特性和 /或电气特性的识别步骤是比较重要的步骤， 可以直接影响到成像盒芯片的修复是否成功的步骤，因此一般情况下都需要进 行数据特定和 /或电气特征的识别， 即选择数据特定和 /或电气特性符合预置规 则的成像盒芯片，并对选择的成像盒芯片执行上述确定功能接口的位置、开封、 写入修复数据和封装的步骤。
在另一种情况下， 对成像盒芯片的电气特性和 /或数据特性识别不限定在 确定功能接口的位置即步骤 101之前执行， 而可以在写入修复数据到存储装置 即步骤 103之前，成像盒芯片的修复装置可以对成像盒芯片的存储装置 3进行电 气特性和 /或数据特性的识别， 这种情况下， 成像盒芯片的修复装置的修复处 理装置 6是具有电气特性和 /或数据特性的识别的功能的。
在其它的具体实施例中，有可能在写入修复数据的过程中， 出现接口接触 不稳定，或存储装置损坏等因素造成写入修复数据失败，则需要在上述步骤 103 之后， 且在步骤 104的封装步骤之前对成像盒芯片进行检测， 检测写入的修复 数据是否被部分损坏， 如果是被部分损坏， 则说明在写入修复数据的过程中， 有部分数据被正确写入到存储装置中，存储装置没有被损坏，可以重复上述 103 及检测的步骤； 如果未被损坏， 则可以执行 104中的封装步骤； 如果完全被损 坏， 则可以说明该存储装置被损坏， 则丟弃该成像盒芯片， 这样极大地提高回 收成像盒芯片的效率。
在检测写入的修复数据是否被部分损坏时，可以通过成像盒芯片的修复装 置中接口装置 4有线或无线地连接到芯片的读写接口， 根据不同型号成像盒芯 片的需要， 还可以将成像盒芯片的修复装置中功能电极 5连接到功能接口上来 进行协助检测。 具体地， 可以对写入修复数据的成像盒芯片的数据特性和 /或 电气特性进行检测， 比如成像盒芯片的修复装置中修复处理装置 6向成像盒芯 片的读写接口发送读写数据， 则成像盒芯片返回的数据符合预置的规则，从而 进行数据特性的检测； 成像盒芯片的修复装置中修复处理装置 6还向成像盒芯 片发送一定的电压、 电流或频率的信息，再根据该成像盒芯片返回的信息进行 判断， 比如成像盒芯片返回信息的电压、 电流或频率是否在一定的范围之内， 又比如成像盒芯片的修复装置中修复处理装置 6可以检测成像盒芯片中的某一 电容是否进行充放电过程等， 从而通过电气特性的检测。
需要说明的是， 对于执行上述步骤 103中写入修复数据时所使用的成像盒 芯片的修复装置中修复处理装置 6, 不仅可以具有写入修复数据到存储装置的 功能， 还可以集成电气特性和 /或数据特性的识别， 及测试写入到存储装置的 修复数据是否被部分损坏的功能。这样可以直接通过成像盒芯片的修复装置顺 序完成识别、 写数据和测试的步骤。 且修复处理装置 6的不同操作可以在指示 装置 7的指示触发下进行。
以上对本发明实施例所提供的成像盒芯片的修复装置， 进行了详细介绍， 说明只是用于帮助理解本发明的方法及其核心思想； 同时，对于本领域的一般 技术人员，依据本发明的思想，在具体实施方式及应用范围上均会有改变之处， 综上所述， 本说明书内容不应理解为对本发明的限制。

Claims

1、 一种成像盒芯片的修复装置， 其特征在于， 包括： 至少一个接口装置、 至少一个功能电极和修复处理装置， 其中：
所述接口装置，用于通过无线或有线的方式连接修复处理装置与成像盒芯 片的读写接口；
所述功能电极的一端连接到所述修复处理装置，所述功能电极的另一端为 导电针；
所述修复处理装置，用于通过接口装置和功能电极分别连接的读写接口和 成像盒芯片的存储装置上已开封处的功能接口，将修复数据写入到所述成像盒 芯片的存储装置中。
2、 如权利要求 1所述的成像盒芯片的修复装置， 其特征在于， 所述接口装 置上设置有插槽， 在插槽内有导电弹片， 且插槽一端有缺口， 使得所述成像盒 芯片插入所述插槽后， 所述成像盒芯片的读写接口与导电弹片接触，且功能接 口位于所述缺口处；
在所述接口装置上还设置有至少一个连接接口，所述导电弹片与连接接口 导电连接。
3、 如权利要求 1所述的成像盒芯片的修复装置， 其特征在于， 所述功能电 极包括绝缘把手和导电针， 所述导电针的非针尖端固定在绝缘把手上，且所述 非针尖端穿过绝缘把手连接到所述修复处理装置。
4、 如权利要求 1至 3任一项所述的成像盒芯片的修复装置， 其特征在于， 所述修复处理装置， 还用于通过所述读写接口和 /或功能接口， 检测所述成像 盒芯片的电气特性和 /或数据特性是否符合预置规则。
5、 如权利要求 4所述的成像盒芯片的修复装置， 其特征在于， 所述修复处 理装置， 还用于通过所述读写接口和 /或功能接口， 测试写入所述存储装置的 修复数据是否被部分损坏。
6、 如权利要求 1至 3任一项所述的成像盒芯片的修复装置， 其特征在于， 所述修复处理装置， 还用于通过所述读写接口和 /或功能接口， 测试写入所述 存储装置的修复数据是否被部分损坏。
7、 如权利要求 1至 3任一项所述的成像盒芯片的装置， 其特征在于， 还包 括连接在所述修复处理装置上的指示装置， 用于控制所述修复处理装置的操 作；
所述控制的操作包括： 所述写修复数据到存储装置的操作；
或， 在通过所述读写接口和 /或功能接口， 检测到所述成像盒芯片的电气 特性和 /或数据特性符合预置规则时， 进行所述写修复数据到存储装置的操作； 或， 在写修复数据到存储装置后， 通过所述读写接口和 /或功能接口， 测 试写入所述存储装置的修复数据是否被部分损坏的操作；
或， 在通过所述读写接口和 /或功能接口， 检测到所述成像盒芯片的电气 特性和 /或数据特性符合预置规则时， 写修复数据到存储装置， 并在写修复数 据到存储装置后， 通过所述读写接口和 /或功能接口， 测试写入所述存储装置 的修复数据是否被部分损坏的操作。
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