WO2020259016A1 - 印刷电路板组件及终端 - Google Patents

印刷电路板组件及终端 Download PDF

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Publication number
WO2020259016A1
WO2020259016A1 PCT/CN2020/084935 CN2020084935W WO2020259016A1 WO 2020259016 A1 WO2020259016 A1 WO 2020259016A1 CN 2020084935 W CN2020084935 W CN 2020084935W WO 2020259016 A1 WO2020259016 A1 WO 2020259016A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
solder joint
end surface
solder
Prior art date
Application number
PCT/CN2020/084935
Other languages
English (en)
French (fr)
Inventor
唐后勋
Original Assignee
维沃移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Priority to BR112021024298A priority Critical patent/BR112021024298A2/pt
Priority to JP2021569411A priority patent/JP7335980B2/ja
Priority to KR1020217038804A priority patent/KR102669585B1/ko
Priority to EP20832668.6A priority patent/EP3972395A4/en
Priority to AU2020305430A priority patent/AU2020305430B2/en
Priority to CA3143077A priority patent/CA3143077C/en
Publication of WO2020259016A1 publication Critical patent/WO2020259016A1/zh
Priority to US17/549,679 priority patent/US11778744B2/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/0949—Pad close to a hole, not surrounding the hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09627—Special connections between adjacent vias, not for grounding vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0465—Shape of solder, e.g. differing from spherical shape, different shapes due to different solder pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Definitions

  • the present disclosure relates to the technical field of terminals, and in particular to a printed circuit board assembly and a terminal.
  • FIG. 1 a represents shielding cover, b represents electronic components, c represents solder balls, d represents the first PCB board, and e represents The frame board is connected in the middle, f represents the second PCB board), and the space in the Z-axis direction is used to expand the usable area of the PCB.
  • the intermediate connection frame plate plays a role of signal connection and electromagnetic shielding.
  • solder balls on the upper and lower sides of the middle connecting frame board, and the solder balls are soldered to the corresponding pads on the first PCB board and the second PCB board. These solder balls bear most of the stress on the intermediate connecting frame board, resulting in a large stress value of a single solder joint, which is likely to cause failure in certain application scenarios.
  • the purpose of the present disclosure is to provide a printed circuit board assembly and a terminal to solve the problem that a single solder joint on the printed circuit board assembly in the related art bears a large stress value and is prone to failure.
  • a printed circuit board assembly including:
  • the first printed circuit board
  • a second printed circuit board is electrically connected to the first printed circuit board through at least four solder joints;
  • the at least four soldering points include a first soldering point, a second soldering point, a third soldering point, and a fourth soldering point arranged in sequence along a predetermined direction, the first soldering point and the second soldering point Connected, the third solder joint is connected with the fourth solder joint, and at least one solder joint and/or at least one printed circuit board cavity is provided between the second solder joint and the third solder joint;
  • the printed circuit board cavity is a groove structure recessed from the surface of the printed circuit board to the inside.
  • the at least one solder joint provided between the second solder joint and the third solder joint is electrically connected to the first printed circuit board and the second printed circuit board.
  • the first printed circuit board and the second printed circuit board are electrically connected through a third printed circuit board;
  • the at least four solder joints further include a fifth solder joint, a sixth solder joint, a seventh solder joint, and an eighth solder joint arranged in sequence along the preset direction.
  • the fifth solder joint is connected to the sixth solder joint.
  • Point communication the seventh solder joint is connected with the eighth solder joint, and at least one solder joint and/or at least one printed circuit board cavity is provided between the sixth solder joint and the seventh solder joint;
  • the third printed circuit board includes a first end surface and a second end surface, and the first end surface passes through the first solder joint, the second solder joint, the third solder joint and the fourth solder joint.
  • Point is electrically connected to the third end surface of the first printed circuit board, and the second end surface is connected to the fifth welding point, the sixth welding point, the seventh welding point and the eighth welding point through The fourth end surface of the second printed circuit board is electrically connected.
  • the at least one solder joint provided between the first end surface and the third end surface of the first printed circuit board electrically connects the first end surface and the third end surface; and/or,
  • the at least one solder joint provided between the second end surface and the fourth end surface of the second printed circuit board is electrically connected to the second end surface and the fourth end surface of the second printed circuit board.
  • the printed circuit board cavity is provided on the third end surface, and/or,
  • the printed circuit board cavity is provided on the fourth end surface of the second printed circuit board, and/or,
  • the printed circuit board cavity is provided on the first end surface of the third printed circuit board, and/or,
  • the printed circuit board cavity is provided on the second end surface of the third printed circuit board.
  • solder joint and the printed circuit board cavity are provided between the second solder joint and the third solder joint, the solder joint and the printed circuit board cavity are spaced apart .
  • the printed circuit board cavity is located between the solder joint and the second solder joint; and/or,
  • the printed circuit board cavity is located between the solder joint and the third solder joint.
  • the third printed circuit board is provided with a through hole, and the solder joints on the first end surface and the solder joints on the second end surface communicate through the through holes.
  • the distance between the solder joint and the second solder joint is greater than or equal to a preset threshold ;and / or,
  • the distance between the solder joint and the third solder joint is greater than or equal to the preset threshold.
  • the printed circuit board cavity occupies the second solder joint and the The entire space between the third solder joints.
  • the embodiments of the present disclosure also provide a terminal, including the above-mentioned printed circuit board assembly.
  • the first printed circuit board is provided; the second printed circuit board is electrically connected to the first printed circuit board through at least four solder joints; wherein the at least The four solder joints include a first solder joint, a second solder joint, a third solder joint, and a fourth solder joint arranged in a predetermined direction.
  • the first solder joint is connected to the second solder joint, and the first solder joint is connected to the second solder joint.
  • the three solder joints are connected to the fourth solder joint, and at least one solder joint and/or at least one printed circuit board cavity is arranged between the second solder joint and the third solder joint; the printed circuit board is empty.
  • the cavity is a groove structure recessed from the surface of the printed circuit board to the inside; it can disperse the stress on a single solder joint, while providing electromagnetic shielding to the signal of the inner solder joint; and on the basis of maintaining the dispersion of the solder joint stress and electromagnetic shielding ability, Increase the gap between the solder joints, including the gap between the XY direction and the Z direction, increase the space for flux volatilization, so as to avoid electromigration between adjacent solder joints along the residual flux channel in a specific environment , Improve the ability of resistance to electromigration; It is a good solution to the problem that the stress value of a single solder joint on the printed circuit board assembly in the related technology is too large and easy to fail.
  • Figure 1 is a schematic diagram of PCB stacking in related technologies
  • FIG. 2 is a schematic diagram 1 of the structure of a printed circuit board assembly according to an embodiment of the disclosure
  • FIG. 3 is a second schematic diagram of the structure of a printed circuit board assembly according to an embodiment of the disclosure.
  • FIG. 5 is a fourth schematic diagram of the structure of the printed circuit board assembly of the embodiment of the disclosure.
  • FIG. 6 is a fifth schematic diagram of the structure of the printed circuit board assembly according to the embodiment of the disclosure.
  • FIG. 7 is a sixth structural diagram of a printed circuit board assembly according to an embodiment of the disclosure.
  • FIG. 8 is a seventh structural diagram of a printed circuit board assembly according to an embodiment of the disclosure.
  • the present disclosure provides a printed circuit board assembly, as shown in FIGS. 2 to 8, including:
  • the first printed circuit board 1 The first printed circuit board 1;
  • the second printed circuit board 2 is electrically connected to the first printed circuit board 1 through at least four solder joints;
  • the at least four solder joints include a first solder joint 3, a second solder joint 4, a third solder joint 5, and a fourth solder joint 6 arranged in sequence along a predetermined direction.
  • the second solder joint 4 is in communication
  • the third solder joint 5 is in communication with the fourth solder joint 6, and at least one solder joint 7 and / Or at least one printed circuit board cavity 8;
  • the printed circuit board cavity 8 is a groove structure recessed from the surface of the printed circuit board to the inside.
  • solder joint 7 is neither connected to the second solder joint 4 nor connected to the third solder joint 5.
  • the printed circuit board assembly provided by the embodiment of the present disclosure is provided with a first printed circuit board; a second printed circuit board, and the second printed circuit board is electrically connected to the first printed circuit board through at least four solder joints;
  • the at least four soldering points include a first soldering point, a second soldering point, a third soldering point, and a fourth soldering point arranged in sequence along a predetermined direction, the first soldering point and the second soldering point Connected, the third solder joint is in communication with the fourth solder joint, and at least one solder joint and/or at least one printed circuit board cavity is provided between the second solder joint and the third solder joint;
  • the printed circuit board cavity is a groove structure recessed from the surface of the printed circuit board to the inside; it can disperse the stress on a single solder joint, and at the same time provide electromagnetic shielding to the signal of the inner solder joint; and maintain the dispersion of the solder joint stress and electromagnetic shielding On the basis of ability,
  • the at least one solder joint 7 provided between the second solder joint 4 and the third solder joint 5 is electrically connected to the first printed circuit board 1 and the second Printed circuit board 2.
  • the first printed circuit board 1 and the second printed circuit board 2 are electrically connected through a third printed circuit board 9; the at least four solders
  • the spot further includes a fifth welding spot 10, a sixth welding spot 11, a seventh welding spot 12, and an eighth welding spot 13 arranged in sequence along the preset direction, and the fifth welding spot 10 is connected to the sixth welding spot.
  • the seventh solder joint 12 is connected with the eighth solder joint 13, and at least one solder joint 14 and/or at least one printed circuit is provided between the sixth solder joint 11 and the seventh solder joint 12 Circuit board cavity 15;
  • the third printed circuit board 9 includes a first end surface and a second end surface, and the first end surface passes through the first solder joint 3, the second solder joint 4, and the first The three solder joints 5 and the fourth solder joint 6 are electrically connected to the third end surface of the first printed circuit board 1, and the second end surface passes through the fifth solder joint 10, the sixth solder joint 11, The seventh solder joint 12 and the eighth solder joint 13 are electrically connected to the fourth end surface of the second printed circuit board 2.
  • solder joint 7 is neither connected to the sixth solder joint 11 nor connected to the seventh solder joint 12.
  • the third printed circuit board functions as an intermediate connection frame board.
  • the at least one solder joint 7 provided between the first end surface and the third end surface of the first printed circuit board 1 electrically connects the first end surface and the first end surface.
  • Three end surfaces; and/or, the at least one solder joint 14 provided between the second end surface and the fourth end surface of the second printed circuit board 2 electrically connects the second end surface and the second printed circuit board The fourth end of the circuit board.
  • the printed circuit board cavity 8 is provided on the third end surface (that is, the end surface facing the third printed circuit board), and/or the printed circuit board cavity
  • the cavity 15 is provided on the fourth end surface of the second printed circuit board (that is, the end surface facing the third printed circuit board), and/or,
  • the printed circuit board cavity 8 is provided on the first end surface of the third printed circuit board, and/or the printed circuit board cavity 15 is provided on the second end surface of the third printed circuit board.
  • solder joint 7 and the printed circuit board cavity 8 are provided between the second solder joint 4 and the third solder joint 5, the solder joint 7
  • the printed circuit board cavity 8 is spaced apart.
  • the printed circuit board cavity 8 is located between the solder joint 7 and the second solder joint 4; and/or, the printed circuit board cavity 8 is located in the solder joint Between point 7 and the third welding point 5.
  • the third printed circuit board 9 is provided with a through hole 16, and the solder joints on the first end surface (including the first solder joint 3, the second solder joint 4, The third solder joint 5, the fourth solder joint 6, and the solder joint 7) and the solder joints on the second end surface (including the fifth solder joint 10, the sixth solder joint 11, the seventh solder joint 12, and the eighth solder joint 13 and the solder joint 14) communicate through the through hole 16.
  • the solder joint 7 and the second solder joint 4 The distance between the two is greater than or equal to a preset threshold; and/or, the distance between the solder joint 7 and the third solder joint 5 is greater than or equal to the preset threshold.
  • the embodiments of the present disclosure provide a printed circuit board assembly that can increase the gap between solder joints, including the gap between the XY direction and the Z direction, and increase the use of In the space where the flux evaporates, the ability to resist electromigration is improved.
  • the first point is that the design of outer solder joints is optimized by connecting two adjacent solder joints to being connected after one solder joint, increasing the gap between solder joints in the XY direction, as shown in Figure 2 to Figure 6;
  • the second point is to add corresponding PCB holes on the PCB board around the outer solder joints to increase the Z-direction gap between the solder joints, as shown in Figures 2 to 4 and Figures 7 and 8;
  • the design of the outer solder joints is optimized by connecting every two adjacent solder joints. After two adjacent solder joints are connected in pairs, a single solder joint is separated and then connected in pairs. The connected area and the individual solder joints will be brushed with solder paste, and the three PCB boards will be soldered to increase the gap in the XY direction between the solder joints, as shown in Figure 2 to Figure 6.
  • the cavity area is a non-welded area, so that the Z-direction gap between the solder joints can be further increased without affecting the welding strength and stress distribution, as shown in Figures 2 to 4.
  • the individual solder joints between the two adjacent sets of connecting solder joints can be removed, and the positions of the individual solder joints can be replaced with PCB holes. Further, the PCB holes provided between the two sets of connecting solder joints can occupy the entire space between the two sets of connecting solder joint positions, as shown in FIGS. 7 and 8.
  • the gap between the PCB board and the intermediate connection frame board is enlarged, which helps the volatilization of the flux, reduces the flux residue, and reduces the risk of solder electromigration.
  • the solution provided by the embodiments of the present disclosure can increase the space for flux volatilization by increasing the gap between the solder joints, including the gap between the XY direction and the Z direction, thereby improving the level of resistance to electromigration.
  • the structure of this solution is not limited to a stack structure of two-layer PCB boards (for example, the above-mentioned first PCB board and second PCB board are connected through the third PCB board), and can be expanded to three or more layers. Layer stack structure application.
  • the embodiment of the present disclosure also provides a terminal, including the above-mentioned printed circuit board assembly.
  • the terminal provided by the embodiment of the present disclosure can realize the various processes and functions realized by the printed circuit board assembly of FIG. 1 to FIG. 8. In order to avoid repetition, details are not described herein again.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

一种印刷电路板组件及终端，其中，印刷电路板组件包括：第一印刷电路板(1)；第二印刷电路板(2)，第二印刷电路板(2)通过至少四个焊点(3,4,5,6)与第一印刷电路板(1)电连接；至少四个焊点包括第一焊点(3)、第二焊点(4)、第三焊点(5)和第四焊点(6)，第一焊点(3)与所述第二焊点(4)连通，第三焊点(5)与所述第四焊点(6)连通，第二焊点(4)与第三焊点(5)之间设置有至少一个焊点(7)和/或至少一个印刷电路板空穴(8)；印刷电路板空穴(8)为由印刷电路板表面向内部凹陷的凹槽结构。

Description

印刷电路板组件及终端
相关申请的交叉引用
本申请主张在2019年6月24日在中国提交的中国专利申请No.201910548773.6的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及终端技术领域，尤其涉及一种印刷电路板组件及终端。
背景技术
随着第五代(5 th Generation,5G)移动通信的到来与应用，智能手机等移动终端PCB(印制电路板)上需要承载的电子器件越来越多。同时由于功耗的增加，对于电池容量与尺寸的要求越来越大。这就导致了XY轴方向上的空间里，PCB面积越来越不够用。目前有些产品尝试将两块或者多块PCB在Z轴方向叠起来布局，如图1所示(a表示屏蔽罩，b表示电子元器件，c表示焊球，d表示第一PCB板，e表示中间连接架板，f表示第二PCB板)，利用Z轴方向的空间扩大PCB可用面积。中间连接架板起到了信号连接与电磁屏蔽的作用。
中间连接架板的上下两面都有焊球，焊球与第一PCB板和第二PCB板上对应的焊盘进行焊接。这些焊球承受了中间连接架板上的绝大部分应力，导致单个焊点的应力值偏大，从而在特定应用场景下容易引起失效。
发明内容
本公开的目的在于提供一种印刷电路板组件及终端，以解决相关技术中印刷电路板组件上的单个焊点所承受的应力值偏大，易失效的问题。
为了解决上述技术问题，本公开是这样实现的：
第一方面，本公开实施例提供了一种印刷电路板组件，包括：
第一印刷电路板；
第二印刷电路板，所述第二印刷电路板通过至少四个焊点与所述第一印 刷电路板电连接；
其中，所述至少四个焊点包括沿预设方向依次排列的第一焊点、第二焊点、第三焊点和第四焊点，所述第一焊点与所述第二焊点连通，所述第三焊点与所述第四焊点连通，所述第二焊点与所述第三焊点之间设置有至少一个焊点和/或至少一个印刷电路板空穴；
所述印刷电路板空穴为由印刷电路板表面向内部凹陷的凹槽结构。
可选地，所述第二焊点与所述第三焊点之间设置的所述至少一个焊点电连接所述第一印刷电路板和所述第二印刷电路板。
可选地，所述第一印刷电路板与所述第二印刷电路板之间通过第三印刷电路板电连接；
所述至少四个焊点还包括沿所述预设方向依次排列的第五焊点、第六焊点、第七焊点和第八焊点，所述第五焊点与所述第六焊点连通，所述第七焊点与所述第八焊点连通，所述第六焊点与所述第七焊点之间设置有至少一个焊点和/或至少一个印刷电路板空穴；
其中，所述第三印刷电路板包括第一端面和第二端面，所述第一端面通过所述第一焊点、所述第二焊点、所述第三焊点和所述第四焊点与所述第一印刷电路板的第三端面电连接，所述第二端面通过所述第五焊点、所述第六焊点、所述第七焊点和所述第八焊点与所述第二印刷电路板的第四端面电连接。
可选地，所述第一端面与所述第一印刷电路板的第三端面之间设置的所述至少一个焊点，电连接所述第一端面与所述第三端面；和/或，
所述第二端面与所述第二印刷电路板的第四端面之间设置的所述至少一个焊点，电连接所述第二端面与所述第二印刷电路板的第四端面。
可选地，所述印刷电路板空穴设于所述第三端面上，和/或，
所述印刷电路板空穴设于所述第二印刷电路板的第四端面上，和/或，
所述印刷电路板空穴设于所述第三印刷电路板的第一端面上，和/或，
所述印刷电路板空穴设于所述第三印刷电路板的第二端面上。
可选地，在所述第二焊点和所述第三焊点之间设有所述焊点和印刷电路板空穴的情况下，所述焊点与所述印刷电路板空穴间隔设置。
可选地，所述印刷电路板空穴位于所述焊点与所述第二焊点之间；和/或，
所述印刷电路板空穴位于所述焊点与所述第三焊点之间。
可选地，所述第三印刷电路板上设有通孔，所述第一端面上的焊点与所述第二端面上的焊点通过所述通孔连通。
可选地，在所述第二焊点和所述第三焊点之间只设有焊点的情况下，所述焊点与所述第二焊点之间的距离大于或等于预设阈值；和/或，
所述焊点与所述第三焊点之间的距离大于或等于所述预设阈值。
可选地，在所述第二焊点和所述第三焊点之间只设有所述印刷电路板空穴的情况下，所述印刷电路板空穴占据所述第二焊点和所述第三焊点之间的整个间隔区域。
第二方面，本公开实施例还提供了一种终端，包括上述的印刷电路板组件。
在本公开实施例中，通过设置第一印刷电路板；第二印刷电路板，所述第二印刷电路板通过至少四个焊点与所述第一印刷电路板电连接；其中，所述至少四个焊点包括沿预设方向依次排列的第一焊点、第二焊点、第三焊点和第四焊点，所述第一焊点与所述第二焊点连通，所述第三焊点与所述第四焊点连通，所述第二焊点与所述第三焊点之间设置有至少一个焊点和/或至少一个印刷电路板空穴；所述印刷电路板空穴为由印刷电路板表面向内部凹陷的凹槽结构；能够分散单个焊点上的应力，同时对内侧焊点的信号提供电磁屏蔽；并且在保持分散焊点应力与电磁屏蔽能力的基础上，增大焊点之间的间隙，包括XY方向与Z方向的间隙，增加用于助焊剂挥发的空间，从而避免特定环境下相邻的焊点之间会沿着残留的助焊剂通道发生电迁移，提升抗电迁移的能力水平；很好的解决了相关技术中印刷电路板组件上的单个焊点所承受的应力值偏大，易失效的问题。
附图说明
图1为相关技术中的PCB堆叠示意图；
图2为本公开实施例的印刷电路板组件结构示意图一；
图3为本公开实施例的印刷电路板组件结构示意图二；
图4为本公开实施例的印刷电路板组件结构示意图三；
图5为本公开实施例的印刷电路板组件结构示意图四；
图6为本公开实施例的印刷电路板组件结构示意图五；
图7为本公开实施例的印刷电路板组件结构示意图六；
图8为本公开实施例的印刷电路板组件结构示意图七。
具体实施方式
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
本公开针对相关技术中印刷电路板组件上的单个焊点所承受的应力值偏大，易失效的问题，提供一种印刷电路板组件，如图2至图8所示，包括：
第一印刷电路板1；
第二印刷电路板2，所述第二印刷电路板2通过至少四个焊点与所述第一印刷电路板1电连接；
其中，所述至少四个焊点包括沿预设方向依次排列的第一焊点3、第二焊点4、第三焊点5和第四焊点6，所述第一焊点3与所述第二焊点4连通，所述第三焊点5与所述第四焊点6连通，所述第二焊点4与所述第三焊点5之间设置有至少一个焊点7和/或至少一个印刷电路板空穴8；
所述印刷电路板空穴8为由印刷电路板表面向内部凹陷的凹槽结构。
在此说明，焊点7不与第二焊点4相连，也不与第三焊点5相连。
本公开实施例提供的所述印刷电路板组件通过设置第一印刷电路板；第二印刷电路板，所述第二印刷电路板通过至少四个焊点与所述第一印刷电路板电连接；其中，所述至少四个焊点包括沿预设方向依次排列的第一焊点、第二焊点、第三焊点和第四焊点，所述第一焊点与所述第二焊点连通，所述第三焊点与所述第四焊点连通，所述第二焊点与所述第三焊点之间设置有至少一个焊点和/或至少一个印刷电路板空穴；所述印刷电路板空穴为由印刷电路板表面向内部凹陷的凹槽结构；能够分散单个焊点上的应力，同时对内侧 焊点的信号提供电磁屏蔽；并且在保持分散焊点应力与电磁屏蔽能力的基础上，增大焊点之间的间隙，包括XY方向与Z方向的间隙，增加用于助焊剂挥发的空间，从而避免特定环境下相邻的焊点之间会沿着残留的助焊剂通道发生电迁移，提升抗电迁移的能力水平；很好的解决了相关技术中印刷电路板组件上的单个焊点所承受的应力值偏大，易失效的问题。
如图2至图8所示，所述第二焊点4与所述第三焊点5之间设置的所述至少一个焊点7电连接所述第一印刷电路板1和所述第二印刷电路板2。
这样能够保证第一印刷电路板与第二印刷电路板之间的正常通信。
为了扩大PCB可用面积，如图3至图8所示，所述第一印刷电路板1与所述第二印刷电路板2之间通过第三印刷电路板9电连接；所述至少四个焊点还包括沿所述预设方向依次排列的第五焊点10、第六焊点11、第七焊点12和第八焊点13，所述第五焊点10与所述第六焊点11连通，所述第七焊点12与所述第八焊点13连通，所述第六焊点11与所述第七焊点12之间设置有至少一个焊点14和/或至少一个印刷电路板空穴15；其中，所述第三印刷电路板9包括第一端面和第二端面，所述第一端面通过所述第一焊点3、所述第二焊点4、所述第三焊点5和所述第四焊点6与所述第一印刷电路板1的第三端面电连接，所述第二端面通过所述第五焊点10、所述第六焊点11、所述第七焊点12和所述第八焊点13与所述第二印刷电路板2的第四端面电连接。
在此说明，焊点7不与第六焊点11相连，也不与第七焊点12相连。第三印刷电路板起到的是中间连接架板的作用。
如图3至图8所示，所述第一端面与所述第一印刷电路板1的第三端面之间设置的所述至少一个焊点7，电连接所述第一端面与所述第三端面；和/或，所述第二端面与所述第二印刷电路板2的第四端面之间设置的所述至少一个焊点14，电连接所述第二端面与所述第二印刷电路板的第四端面。
这样能够保证第一印刷电路板与第二印刷电路板之间的正常通信。
如图3至图8所示，所述印刷电路板空穴8设于所述第三端面(即朝向所述第三印制电路板的端面)上，和/或，所述印刷电路板空穴15设于所述第二印刷电路板的第四端面(即朝向所述第三印制电路板的端面)上，和/或，
所述印刷电路板空穴8设于所述第三印刷电路板的第一端面上，和/或， 所述印刷电路板空穴15设于所述第三印刷电路板的第二端面上。
如图3和图4所示，在所述第二焊点4和所述第三焊点5之间设有所述焊点7和印刷电路板空穴8的情况下，所述焊点7与所述印刷电路板空穴8间隔设置。
这样能够有助于助焊剂残留的挥发。
如图3和图4所示，所述印刷电路板空穴8位于所述焊点7与所述第二焊点4之间；和/或，所述印刷电路板空穴8位于所述焊点7与所述第三焊点5之间。
这样能够进一步有助于助焊剂残留的挥发。
如图3、图5和图7所示，所述第三印刷电路板9上设有通孔16，所述第一端面上的焊点(包括第一焊点3、第二焊点4、第三焊点5、第四焊点6以及焊点7)与所述第二端面上的焊点(包括第五焊点10、第六焊点11、第七焊点12、第八焊点13以及焊点14)通过所述通孔16连通。
这样能够保证第一印刷电路板与第二印刷电路板之间的正常通信。
如图5和图6所示，在所述第二焊点4和所述第三焊点5之间只设有焊点7的情况下，所述焊点7与所述第二焊点4之间的距离大于或等于预设阈值；和/或，所述焊点7与所述第三焊点5之间的距离大于或等于所述预设阈值。
这样能够有助于助焊剂残留的挥发。
如图7和图8所示，在所述第二焊点4和所述第三焊点5之间只设有所述印刷电路板空穴8的情况下，所述印刷电路板空穴占据所述第二焊点和所述第三焊点之间的整个间隔区域。
这样能够最大程度的有助于助焊剂残留的挥发。
在此说明，关于第五焊点10、第六焊点11、第七焊点12和第八焊点13的其他设置类似于第一焊点3、第二焊点4、第三焊点5和第四焊点6的设置，在此不再赘述。
下面对本公开实施例提供的所述印刷电路板组件进行进一步说明。
针对上述技术问题，考虑到在外侧放置相同网络的焊点，并且将相邻的两个焊点相连，从而可以分散单个焊点上的应力，同时对内侧焊点的信号提 供电磁屏蔽；但是，在进行三维印刷电路板组件(3 rd Dimensional Printed Circuit Board Assembly，3DPCBA)的焊接时，需要添加助焊剂来保证焊接的品质。完成焊接后，助焊剂会通过周围的间隙挥发到外部的空间中。而由于外侧相邻的两个焊点相连并且焊接在一起，会导致内侧助焊剂没有足够的间隙用于助焊剂挥发，导致在焊点周围存在助焊剂残留无法挥发的情况。此时，在不同网络的焊点之间存在电压差时，在特定环境下，相邻的焊点之间会沿着残留的助焊剂通道上发生电迁移，最终导致不同网络之间的短路问题。因此，本公开实施例提供了一种印刷电路板组件，能够在保持分散焊点应力与电磁屏蔽能力的基础上，增大焊点之间的间隙，包括XY方向与Z方向的间隙，增加用于助焊剂挥发的空间，从而提升抗电迁移的能力水平。
具体涉及以下两点：
第一点，外侧焊点设计由相邻两个焊点相连优化为间隔一个焊点之后相连，增加焊点之间XY方向上的间隙，如图2至图6所示；
第二点，在外侧焊点周围的PCB板上增加相应的PCB空穴，增加焊点之间Z方向的间隙，如图2至图4以及图7和图8所示；
关于上述第一点：
外侧焊点设计由相邻的每两个焊点相连优化为，相邻两个焊点两两相连后，间隔一个单独的焊点之后再两两相连。连接的区域与单独焊点上都会刷上锡膏，将三个PCB板进行焊接，从而增加焊点之间XY方向上的间隙，如图2至图6所示。
关于上述第二点：
具体可在上述第一点的基础上实现，在焊点周围增加PCB空穴。其中空穴区域为非焊接区域，从而可以在不影响焊接强度与应力分布的前提下，进一步增加焊点间的Z方向空隙，如图2至图4所示。
另外一种可选的方式是，上述第二点单独实现：可以将相邻两组连接焊点之间的单独焊点去掉，在单独焊点的位置替换成PCB空穴。进一步的，两组连接焊点之间设置的PCB空穴可以占据两组连接焊点位置之间的整个间隔区域，如图7和图8所示。
如此，因为空穴的存在，PCB板与中间连接架板之间的空隙加大，有助 于助焊剂的挥发，减少了助焊剂残留，也就降低了焊锡电迁移的风险。
由上可知，本公开实施例提供的方案通过增大焊点之间的间隙，包括XY方向与Z方向的间隙，能够增加用于助焊剂挥发的空间，从而提升抗电迁移的能力水平。
在此说明，本方案的结构不限于两层PCB板的堆叠结构(比如上述第一PCB板和第二PCB板，中间通过第三PCB板相连)，可扩展至三层或三层以上的多层堆叠结构应用当中。
本公开实施例还提供了一种终端，包括上述的印刷电路板组件。
本公开实施例提供的终端能够实现图1至图8的印刷电路板组件实现的各个过程及功能，为避免重复，这里不再赘述。
需要说明的是，在本文中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。此外，本申请中使用“和/或”表示所连接对象的至少其中之一，例如A和/或B和/或C，表示包含单独A，单独B，单独C，A和B都存在，B和C都存在，A和C都存在，以及A、B和C都存在的7种情况。
上面结合附图对本公开的实施例进行了描述，但是本公开并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本公开的启示下，在不脱离本公开宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本公开的保护之内。

Claims (11)

  1. 一种印刷电路板组件，包括：
    第一印刷电路板；
    第二印刷电路板，所述第二印刷电路板通过至少四个焊点与所述第一印刷电路板电连接；
    其中，所述至少四个焊点包括沿预设方向依次排列的第一焊点、第二焊点、第三焊点和第四焊点，所述第一焊点与所述第二焊点连通，所述第三焊点与所述第四焊点连通，所述第二焊点与所述第三焊点之间设置有至少一个焊点和/或至少一个印刷电路板空穴；
    所述印刷电路板空穴为由印刷电路板表面向内部凹陷的凹槽结构。
  2. 根据权利要求1所述的印刷电路板组件，其中，所述第二焊点与所述第三焊点之间设置的所述至少一个焊点电连接所述第一印刷电路板和所述第二印刷电路板。
  3. 根据权利要求1或2所述的印刷电路板组件，其中，所述第一印刷电路板与所述第二印刷电路板之间通过第三印刷电路板电连接；
    所述至少四个焊点还包括沿所述预设方向依次排列的第五焊点、第六焊点、第七焊点和第八焊点，所述第五焊点与所述第六焊点连通，所述第七焊点与所述第八焊点连通，所述第六焊点与所述第七焊点之间设置有至少一个焊点和/或至少一个印刷电路板空穴；
    其中，所述第三印刷电路板包括第一端面和第二端面，所述第一端面通过所述第一焊点、所述第二焊点、所述第三焊点和所述第四焊点与所述第一印刷电路板的第三端面电连接，所述第二端面通过所述第五焊点、所述第六焊点、所述第七焊点和所述第八焊点与所述第二印刷电路板的第四端面电连接。
  4. 根据权利要求3所述的印刷电路板组件，其中，所述第一端面与所述第一印刷电路板的第三端面之间设置的所述至少一个焊点，电连接所述第一端面与所述第三端面；和/或，
    所述第二端面与所述第二印刷电路板的第四端面之间设置的所述至少一 个焊点，电连接所述第二端面与所述第二印刷电路板的第四端面。
  5. 根据权利要求3所述的印刷电路板组件，其中，所述印刷电路板空穴设于所述第三端面上，和/或，
    所述印刷电路板空穴设于所述第二印刷电路板的第四端面上，和/或，
    所述印刷电路板空穴设于所述第三印刷电路板的第一端面上，和/或，
    所述印刷电路板空穴设于所述第三印刷电路板的第二端面上。
  6. 根据权利要求1所述的印刷电路板组件，其中，在所述第二焊点和所述第三焊点之间设有所述焊点和印刷电路板空穴的情况下，所述焊点与所述印刷电路板空穴间隔设置。
  7. 根据权利要求6所述的印刷电路板组件，其中，所述印刷电路板空穴位于所述焊点与所述第二焊点之间；和/或，
    所述印刷电路板空穴位于所述焊点与所述第三焊点之间。
  8. 根据权利要求3所述的印刷电路板组件，其中，所述第三印刷电路板上设有通孔，所述第一端面上的焊点与所述第二端面上的焊点通过所述通孔连通。
  9. 根据权利要求1所述的印刷电路板组件，其中，在所述第二焊点和所述第三焊点之间只设有焊点的情况下，所述焊点与所述第二焊点之间的距离大于或等于预设阈值；和/或，
    所述焊点与所述第三焊点之间的距离大于或等于所述预设阈值。
  10. 根据权利要求1所述的印刷电路板组件，其中，在所述第二焊点和所述第三焊点之间只设有所述印刷电路板空穴的情况下，所述印刷电路板空穴占据所述第二焊点和所述第三焊点之间的整个间隔区域。
  11. 一种终端，包括如权利要求1至10中任一项所述的印刷电路板组件。
PCT/CN2020/084935 2019-06-24 2020-04-15 印刷电路板组件及终端 WO2020259016A1 (zh)

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