WO2020248786A1 - Oled封装结构、封装方法及显示装置 - Google Patents

Oled封装结构、封装方法及显示装置 Download PDF

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Publication number
WO2020248786A1
WO2020248786A1 PCT/CN2020/091380 CN2020091380W WO2020248786A1 WO 2020248786 A1 WO2020248786 A1 WO 2020248786A1 CN 2020091380 W CN2020091380 W CN 2020091380W WO 2020248786 A1 WO2020248786 A1 WO 2020248786A1
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Prior art keywords
oled
display substrate
packaging
layer
packaging structure
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PCT/CN2020/091380
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English (en)
French (fr)
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罗程远
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京东方科技集团股份有限公司
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Priority to US17/271,579 priority Critical patent/US11793018B2/en
Publication of WO2020248786A1 publication Critical patent/WO2020248786A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness

Definitions

  • the present disclosure relates to the field of display technology, and in particular to an OLED packaging structure, packaging method and display device.
  • OLED Organic Light-Emitting Diode, organic electroluminescent display panel
  • OLED Organic Light-Emitting Diode, organic electroluminescent display panel
  • the embodiments of the present disclosure provide an OLED packaging structure configured to encapsulate an OLED device on a display substrate, including:
  • a packaging cover plate having a first surface opposite to the display substrate
  • a frame sealant layer located on the first surface and arranged around the edge of the first surface
  • the filling layer is filled in the area enclosed by the frame sealing layer;
  • a plurality of supporting blocks are distributed in the area where the frame sealing adhesive layer is located and have a preset flexibility, and the supporting blocks are configured to fix the box thickness between the packaging cover plate and the display substrate.
  • the support block has the same main body material as the frame sealant layer;
  • the main body material of the supporting block is doped with a reinforcing material, and the reinforcing material is configured to enhance the strength of the supporting block.
  • the reinforcing material is a nanowire.
  • the volume ratio of the nanowires in the supporting block is 10%-50%.
  • the surface of the support block in contact with the display substrate is a plane.
  • the width of the frame sealant layer is greater than the width of the support block in the region.
  • At least one supporting block is provided on each edge of the first surface of the packaging cover plate.
  • each edge of the first surface of the packaging cover plate is provided with multiple supporting blocks.
  • the material of the frame sealant layer is ultraviolet curable resin glue or thermosetting resin glue
  • the viscosity of the frame sealing glue layer is 100000mPa ⁇ s-400000mPa ⁇ s.
  • the material of the filling layer is ultraviolet curing resin glue or thermosetting resin glue
  • the viscosity of the filler layer is 100 mPa ⁇ s-2000 mPa ⁇ s.
  • embodiments of the present disclosure also provide an OLED packaging method, including:
  • the encapsulation cover plate and the surface of the display substrate with the OLED device are pressed together, and the frame sealing glue layer and the filling glue layer are cured.
  • the manufacturing a plurality of supporting blocks includes:
  • the frame sealant is doped with nanowires for curing, it is cut into blocks with a preset thickness.
  • the embodiments of the present disclosure also provide a display device, including: the above-mentioned OLED packaging structure provided by the embodiments of the present disclosure, and a display substrate with OLED devices.
  • FIG. 1 is a schematic structural diagram of an OLED packaging structure in the related art
  • FIG. 2 is a schematic structural diagram of an OLED packaging structure provided by an embodiment of the disclosure.
  • FIG. 3 is a schematic diagram of a supporting block structure of an OLED packaging structure provided by an embodiment of the disclosure.
  • FIG. 4 is a schematic diagram of another supporting block structure of an OLED packaging structure provided by an embodiment of the disclosure.
  • FIG. 5 is a flowchart of an OLED packaging method provided by an embodiment of the disclosure.
  • dam-filled packaging which uses frame sealant (Dam) and filler (Fill) together to complete the device packaging method, because of its good water and oxygen barrier effect, simple production process, can be applied to large-scale device packaging And other characteristics are favored.
  • a spherical spacer 7 is usually added to the frame sealant layer 4, and the package is laminated In the process, it plays a role of supporting the display substrate 1 and the packaging cover 3, which can prevent the edge pressing degree from being inconsistent, causing the problem of uneven box thickness.
  • the material of the spherical spacer 7 is mostly hard silicon or silicide, it is easy to damage the exposed metal wires 8 on the display substrate 1 during the packaging and pressing process, especially the metal wires 8 overlapping up and down. Causes crushing, or affects electrical properties after contacting the electrode, resulting in undesirable phenomena such as dark lines in the device, which affects the production yield.
  • an OLED packaging structure provided by an embodiment of the present disclosure is configured to package an OLED device 2 on a display substrate 1.
  • the OLED packaging structure includes:
  • the packaging cover 3 is provided with a frame sealing glue layer 4 around the edge of the first surface of the packaging cover 3 opposite to the display substrate 1, and a filling glue layer 5 is filled in the area enclosed by the frame sealing glue layer 4;
  • a plurality of supporting blocks 6 with preset flexibility are distributed in the area where the frame sealing glue layer 4 is located, and the supporting blocks are configured to fix the box thickness between the packaging cover 3 and the display substrate 1.
  • the encapsulation cover 3 when the encapsulation cover 3 is used to package the display substrate 1 with the OLED device 2, the encapsulation cover 3 is arranged on the upper side of the display substrate 1, and the OLED is arranged on the opposite surface of the display substrate 1 and the encapsulation cover 3.
  • the size of the device 2 and the package cover 3 can be adapted to the size of the display substrate 1.
  • the material of the packaging cover 3 can be glass, quartz, plastic, etc.
  • the frame sealing glue layer 4 and the filling glue layer 5 are configured to connect the encapsulation cover 3 and the display substrate 1 to realize the encapsulation of the OLED device 2 on the display substrate 1 to avoid corrosion and damage of the OLED device 2 in contact with external water vapor .
  • the frame sealant layer 4 is formed by coating a frame sealant (Dam) on a predetermined position around the edge of the package cover 3.
  • the preset position can correspond to the non-display area of the display substrate 1, and the filling layer 5 is Filler is coated and formed in the area enclosed by the frame sealant layer 4.
  • the thickness difference between the packaging cover 3 and the display substrate 1 In the case of uniformity, especially for large-size display substrates, uneven cell thickness is more likely to occur when the packaging cover 3 and the display substrate 1 are pressed together. The uneven cell thickness will affect the display performance of the display panel. The uniform cell thickness is especially important for top-emitting OLEDs. If the cell thickness is uneven, display distortion caused by the optical path difference will occur, and if the cover is provided with a color film, the cell thickness Unevenness can also cause lateral light leakage.
  • a support block 6 for fixing the thickness between the packaging cover 3 and the display substrate 1 is adopted.
  • the supporting block 6 has a preset thickness, and the preset thickness is equal to the preset distance between the display substrate 1 and the packaging cover 3, that is, the thickness of the supporting block 6 is equal to the difference between the display substrate 1 and the packaging cover 3.
  • the support block 6 is arranged around the area where the frame sealant layer 4 is located, which can prevent the support block 6 from being disturbed by the OLED device 2 and the like on the display substrate 1 when the support block 6 is set in the area where the filling layer 5 is located.
  • the support block 6 can play a supporting role between the display substrate 1 and the packaging cover 2, so that the box thickness can be fixed so that the display substrate 1 and the packaging cover 2
  • the thickness of the box is uniform.
  • the support block 6 has a preset flexibility.
  • the preset flexibility here can be set so that when the display substrate 1 and the packaging cover 3 are pressed together, excessive pressure will not be generated on the display substrate 1 to avoid the excessive rigidity of the support structure. Excessive squeezing of the exposed metal wires 8 on the display substrate 1, especially the overlapping metal wires 8 (insulating material is used between the metal wires 8), causes crushing of the metal wires 8, or causes The electrical properties are affected after contact with the electrode, causing dark lines in the display device. Therefore, the support block 6 with preset flexibility can protect the display substrate 1 while fixing the thickness of the box, so as to improve the yield of the display device.
  • the support block 6 should not have too much flexibility.
  • the display substrate 1 and the packaging cover 3 will deform when the display substrate 1 and the packaging cover 3 are pressed together.
  • the distance between the packaging cover plates 3 is fixed, so that the effect of uniform box thickness cannot be achieved.
  • a material with a certain degree of flexibility can be used, and a material with a reinforcing effect can be added to it, or it can also be made with It is made of materials with moderate flexibility and hardness, which aims to achieve a uniform box thickness between the display substrate 1 and the packaging cover 3 without excessive pressure and damage to the display substrate 1.
  • a material that does not affect the sealing performance of the frame sealant layer 4 should also be selected.
  • a plurality of support blocks 6 are provided on the edge of the first surface of the packaging cover 1 and in the area where the packaging glue layer 4 is located. Specifically, at least one support block 6 should be provided on each edge of the first surface of the packaging cover 3. Further, in the above-mentioned packaging structure provided by the embodiment of the present disclosure, a plurality of support blocks 6 may be uniformly arranged on each edge of the first surface of the packaging cover 3.
  • the shape of the support block 6 may be set to various shapes such as a cube, a rectangular parallelepiped, and the like.
  • the surface of the support block 6 in contact with the display panel 1 may be set to be a plane.
  • the support The surface of the structure in contact with the display substrate 1 being flat can increase the contact area between the support structure and the surface of the display substrate 1, thereby avoiding excessive pressure on the display substrate 1 and causing damage to the OLED device 2.
  • the height of the support block 6 is equal to the box thickness, and the length and width of the support block 6 can be set according to actual conditions.
  • the width of the support block 6 can be smaller than the width of the frame sealing glue layer 4 at each edge, so that the contact area between the frame sealing glue layer 4 and the packaging cover 3 and the display substrate 1 can be increased to improve the packaging effect.
  • the packaging cover 3 is bonded to the display substrate 1 through the frame sealing glue layer 4 and the filling glue layer 5 to realize the packaging process.
  • a plurality of support blocks 6 are arranged in the area, which can fix the box thickness during the pressing process of the packaging cover 3 and the display substrate 1 and ensure uniform box thickness, especially for large-size display panels. Since the support block 6 has a preset flexibility, excessive pressure will not be generated on the display substrate 1 during the pressing process of the packaging cover 2 and the display substrate 1, which can prevent crushing of exposed wires or contact with electrodes. Influencing the electrical properties, it can play a role in improving the display image quality of the display panel, and improving the yield and competitiveness.
  • the material of the support block 6 has a variety of different options.
  • the main body material of the support block 6 can be made of the same material as the frame sealant layer 4. to make.
  • the frame sealant used to make the frame sealant layer 4 can be used to make the support block 6.
  • the frame sealant has good performance of blocking water vapor, and the hardness of the cured frame sealant is not large, which can meet the preset requirements.
  • the requirement of flexibility on the other hand, can facilitate the production of the support block 6 and save the preparation process of other materials.
  • the direct use of frame sealant can improve the efficiency and cost of packaging.
  • the support block 6 made of frame sealant is cured, it will still be deformed after being stressed.
  • the pressing of the package cover 1 and the display substrate 3 will easily cause the support block 6 to deform, which cannot be effective.
  • the support function of the support block cannot play the role of fixing the thickness of the box. Therefore, the main material of the support block 6 can be doped with reinforcing material.
  • the reinforcing material is configured to enhance the strength of the support block 6. After the reinforcing material is doped, the support can be made The strength of the block 6 is strengthened, which can effectively support and fix the packaging cover 3 and the display substrate 1 and prevent the thickness of the box from changing during the pressing process.
  • the above-mentioned reinforcing material can have a variety of specific arrangements.
  • the reinforcing material can be a nanowire, and a nanowire can be defined as a one-dimensional structure that is limited to 100 nanometers in the lateral direction, and there is no restriction in the longitudinal direction.
  • the material of the nanowire used here can be inorganic materials such as C, ZnS, ZnO, TiO2, etc.
  • the diameter can be 10nm-50nm, and the length can be in the range of 10 ⁇ m-500 ⁇ m. As the size decreases, nanowires will exhibit better mechanical properties than ordinary bulk materials, and their strength will become stronger and toughness will become better.
  • Adding nanowires to the support block 6 can increase the strength of the support block 6 and reduce the deformation of the support block 6 when the force is applied to it, so as to ensure that the support block 6 is pressed against the packaging cover 3 and the display substrate 1. With good supporting performance, it can fix the cell thickness between the display substrate 1 and the packaging cover 3 during the sealing process, make the cell thickness uniform, and ensure the use performance of the OLED display device.
  • the hardness of the support block 6 after the nanowires are added can be controlled to avoid causing the hardness of the support block 6 to affect the display function of the display substrate 1.
  • the volume ratio of the nanowire in the support block 6 may be 10%-50%.
  • the shape of the support block 6 can have a variety of specific arrangements.
  • a spherical spacer 7 is used to be arranged between the display substrate 1 and the package cover 3, as shown in FIG. As shown in 1, play a supporting role in the pressing process of the display substrate 1 and the package cover 3.
  • the shape of the spherical spacer 7 is a sphere.
  • the arrangement of the sphere can easily cause the support to be unstable, and is compatible with the display substrate 1 and the package.
  • the contact of the cover plate 3 is all point contact, and the contact area is small, causing the pressure generated during the pressing to concentrate on the display substrate 1.
  • the surface of the support block 6 in contact with the display substrate 1 can be a plane, and the plane is in contact with the display substrate 1. Under the same applied pressure, the contact area increases, and the display substrate 1 is exposed to The pressure is reduced, that is, the effect of the pressure on the display substrate 1 can be reduced.
  • the shape of the support block 6 also has various configurations. The surface of the support block 6 in contact with the display substrate 1 is the third surface, and the opposite surface in contact with the package cover 3 is the second surface, and the second surface can be set as a flat surface. .
  • the support block 6 is in plane contact with the display substrate 1 and the packaging cover 3, which can improve the stability of the support for the display substrate 1 and the packaging cover 3.
  • the support block 6 can be set as a cylinder, a cube, Cuboid, etc., there are no specific restrictions here.
  • the material of the frame sealing adhesive layer 4 can be ultraviolet curable resin glue or thermosetting resin glue, which has hydrophobic properties, and specifically can be: epoxy resin, acrylic resin Glycidyl ester, glycidyl methacrylate, methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, 6,7-epoxyheptyl methacrylate, methacrylic acid-2 -Homopolymer or copolymer of monomers such as hydroxyethyl, melamine formaldehyde resin, unsaturated polyester resin, silicone resin, furan resin, etc.
  • the viscosity range of the frame sealing adhesive layer 4 may be 100000 mPa ⁇ s-400000 mPa ⁇ s.
  • the material of the filling layer 5 can be an ultraviolet curable resin glue or a thermosetting resin glue, which has hydrophobic properties, and specifically can be: epoxy resin, acrylic ring Propylene oxide, glycidyl methacrylate, methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, 6,7-epoxyheptyl methacrylate, 2-methacrylic acid Homopolymer or copolymer of monomers such as hydroxyethyl, melamine formaldehyde resin, unsaturated polyester resin, silicone resin, furan resin, etc.
  • the viscosity range of the filler layer 5 may be 100 mPa ⁇ s-2000 mPa ⁇ s.
  • the embodiments of the present disclosure also provide an OLED packaging method.
  • the OLED packaging method includes:
  • the support block 6 has a preset flexibility, it will not exert excessive pressure on the display substrate during the pressing process of the packaging cover 3 and the display substrate 1, which can prevent the pressure from being damaged on the exposed wires or the influence after touching the electrodes Electrical properties can play a role in improving the quality of the display screen of the display panel, and improving the yield and competitiveness.
  • manufacturing the support block 6 may specifically include: doping nanowires in the frame sealant for curing, and then cutting it into blocks with a preset thickness body.
  • the support block 6 is a block with preset flexibility that plays a supporting role during the pressing process of the packaging cover 3 and the display substrate 1, and can be made of frame sealant to improve the curing of the support block 6 Hardness, reduce the deformation after being stressed.
  • Nanowires can be added to the frame sealant during production. As the size decreases, the nanowires will exhibit better mechanical properties than ordinary bulk materials, and their strength It becomes stronger and tougher. Adding nanowires to the support block can increase the strength of the support block.
  • the nanowire can be made of inorganic materials such as C, ZnS, ZnO, TiO2, and its diameter can be 10nm-50nm, and the length can range from 10 ⁇ m to 500 ⁇ m; specifically, the volume ratio of the nanowire in the support block 6 can be 10% ⁇ 50%.
  • the above-mentioned nanowires are uniformly mixed in the frame sealing glue, and the mixture is irradiated with UV light to cure the molding, and then cut into a support block with a preset thickness.
  • the preset thickness of the support block 6 should be 10 ⁇ m, and the cured frame sealant is cut into multiple blocks with a thickness of 10 ⁇ m.
  • the size of each support block 6 can be equal.
  • the shape of the support block 6 can be cut into a rectangular parallelepiped, which can facilitate cutting, improve the production efficiency of the support block 6 and help improve the support stability of the support block 6.
  • the width of the supporting block 6 may be smaller than the width of the corresponding frame sealing adhesive layer 4.
  • a rectangular parallelepiped The length and width of the shaped support block 6 are set to 1mm, and the adjacent support blocks 6 are set at an interval of 1mm, which not only ensures the support for the package cover 3 and the display substrate 1, but also ensures the frame sealant layer 4 has sufficient coating area and can be packaged with reliability; or, as shown in Figure 3, multiple support blocks 6 can be arranged side by side on the same width position of the frame sealant layer 4, such as the first part of the package cover 3.
  • the length and width of the rectangular parallelepiped support block 6 can be set to 0.5mm, and two supports are arranged side by side on the same width position of the frame sealant layer 4 Block 6, can be set between two supporting blocks 6.
  • embodiments of the present disclosure also provide a display device, which includes the above-mentioned OLED packaging structure and a display substrate with OLED devices.
  • the box thickness can be fixed during the pressing process of the packaging cover plate and the display substrate.
  • the effect of ensuring uniform box thickness, especially for large-size display devices, is more obvious.
  • the support block has a preset flexibility, it will not generate excessive pressure on the display substrate during the pressing process of the packaging cover and the display substrate, which can prevent the bare wires from being crushed or the electrical properties will be affected after contacting the electrodes. It can improve the display picture quality of the display device, and can improve the yield and competitiveness of the display device.

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Abstract

本公开公开了一种OLED封装结构、封装方法及显示装置，涉及显示技术领域，达到了封装结构在保证显示基板与封装盖板之间的盒厚均匀的同时，不影响OLED器件的显示性能的目的。本公开的主要技术方案为：封装盖板，所述封装盖板与所述显示基板相对的第一表面边缘上环绕设置有封框胶层，及在所述封框胶层所围成区域内填充有填充胶层；其中，所述封框胶层对应的区域内分布有多个具有预设柔性的支撑块，所述支撑块的厚度与所述封装盖板和所述显示基板之间的预设距离相等。

Description

OLED封装结构、封装方法及显示装置
相关申请的交叉引用
本公开要求在2019年06月14日提交中国专利局、申请号为201910516258.X、申请名称为“一种OLED封装结构、封装方法及显示器件”的中国专利申请的优先权，其全部内容通过引用结合在本公开中。
技术领域
本公开涉及显示技术领域，尤其涉及一种OLED封装结构、封装方法及显示装置。
背景技术
OLED(Organic Light-Emitting Diode，有机电致发光显示面板)是近年来逐渐发展起来的显示照明技术，尤其在显示行业，由于其具有高响应、高对比度、可柔性化等优点，被视为拥有广泛的应用前景。但是，由于OLED器件在水汽和氧气的作用下，会出现腐蚀损坏的现象，因此，选择较好的封装方式对OLED器件来说尤为重要。
发明内容
本公开实施例提供了一种OLED封装结构，被配置为封装显示基板上的OLED器件，包括：
封装盖板，具有与所述显示基板相对的第一表面；
封框胶层，位于所述第一表面且环绕所述第一表面的边缘设置；
填充胶层，填充在所述封框胶层所围成的区域内；
多个支撑块，分布于所述封框胶层所在区域内且具有预设柔性，所述支撑块被配置为固定所述封装盖板和所述显示基板之间的盒厚。
可选地，在本公开实施例提供的OLED封装结构中，所述支撑块具有与 所述封框胶层相同的主体材料；
所述支撑块的主体材料内掺杂有加强材料，所述加强材料被配置为增强所述支撑块的强度。
可选地，在本公开实施例提供的OLED封装结构中，所述加强材料为纳米线。
可选地，在本公开实施例提供的OLED封装结构中，所述纳米线在所述支撑块内所占体积比为10％～50％。
可选地，在本公开实施例提供的OLED封装结构中，所述支撑块与所述显示基板接触的表面为平面。
可选地，在本公开实施例提供的OLED封装结构中，所述封框胶层的宽度大于所在区域内的所述支撑块的宽度。
可选地，在本公开实施例提供的OLED封装结构中，所述封装盖板的第一表面的每个边缘至少设置一个所述支撑块。
可选地，在本公开实施例提供的OLED封装结构中，所述封装盖板的第一表面的每个边缘均设置多个所述支撑块。
可选地，在本公开实施例提供的OLED封装结构中，所述封框胶层的材料为紫外固化型树脂胶或热固化型树脂胶；
所述封框胶层的粘稠度为100000mPa·s-400000mPa·s。
可选地，在本公开实施例提供的OLED封装结构中，所述填充胶层的材料为紫外固化型树脂胶或热固化型树脂胶；
所述填充胶层的粘稠度为100mPa·s-2000mPa·s。
另一方面，本公开实施例还提供了一种OLED封装方法，包括：
制作多个支撑块，并将所述多个支撑块排布在封装盖板的第一表面边缘的将要形成的封框胶层所在区域内；
在所述封装盖板的第一表面边缘环绕涂布所述封框胶层；
在所述封框胶层所围成的区域内涂布填充胶层；
将所述封装盖板与显示基板具有OLED器件的一侧表面进行压合，并对 所述封框胶层和所述填充胶层进行固化。
可选地，在本公开实施例提供的OLED封装方法中，所述制作多个支撑块，包括：
在封框胶中掺杂纳米线进行固化后，裁切为具有预设厚度的块体。
另一方面，本公开实施例还提供了一种显示装置，包括：本公开实施例提供的上述OLED封装结构，以及具有OLED器件的显示基板。
附图说明
图1为相关技术中一种OLED封装结构的结构示意图；
图2为本公开实施例提供的一种OLED封装结构的结构示意图；
图3为本公开实施例提供的一种OLED封装结构的支撑块结构示意图；
图4为本公开实施例提供的一种OLED封装结构的另一种支撑块结构示意图；
图5为本公开实施例提供的一种OLED封装方法的流程图。
具体实施方式
目前普遍应用的OLED封装方法中包括片胶封装、玻璃胶封装、坝式填充封装等。其中，坝式填充封装，即采用封框胶(Dam)和填充胶(Fill)共同完成对器件的封装方式，因具有良好的阻隔水氧效果、简单的生产流程、可应用于大尺寸器件封装等特点而深受青睐。
如图1所示，在采用封框胶(Dam)和填充胶(Fill)的封装结构中，为了固定盒厚，通常在封框胶层4中加入球状隔垫物7，在封装压合的过程中起到支撑显示基板1与封装盖板3的作用，可以防止边缘压合程度不一致，造成盒厚不均的问题。但由于球状隔垫物7的材料多为质地较硬的硅或硅化物，在封装压合的过程中，容易对显示基板1上裸露的金属导线8，尤其是上下交叠的金属导线8部位造成压伤，或者接触电极后影响电性，从而造成器件产生暗线等不良现象，影响了生产的良率。
为了使本公开的目的，技术方案和优点更加清楚，下面结合附图，对本公开实施例提供的OLED封装结构、封装方法及显示装置的具体实施方式进行详细地说明。应当理解，下面所描述的优选实施例仅用于说明和解释本公开，并不用于限定本公开。并且在不冲突的情况下，本公开中的实施例及实施例中的特征可以相互组合。
附图中各部件的形状和大小不反应真实比例，目的只是示意说明本公开内容。
如图2-图4所示，本公开实施例提供的一种OLED封装结构，被配置为封装显示基板1上的OLED器件2，该OLED封装结构包括：
封装盖板3，封装盖板3与显示基板1相对的第一表面边缘上环绕设置有封框胶层4，及在封框胶层4所围成的区域内填充有填充胶层5；
其中，封框胶层4所在区域内分布有多个具有预设柔性的支撑块6，支撑块被配置为固定封装盖板3和显示基板1之间的盒厚。
具体地，在采用封装盖板3对具有OLED器件2的显示基板1进行封装时，封装盖板3设置在显示基板1的上侧，显示基板1与封装盖板3相对的表面上设置有OLED器件2，封装盖板3的尺寸可以与显示基板1的尺寸相适配。封装盖板3的材料可以采用玻璃、石英、塑料等。封框胶层4和填充胶层5被配置为连接封装盖板3和显示基板1，以实现对显示基板1上的OLED器件2进行封装，避免OLED器件2与外部水汽接触出现腐蚀损坏的情况。
具体地，封框胶层4采用封框胶(Dam)在封装盖板3的边缘一周预设位置上涂布形成，其预设位置可以对应显示基板1的非显示区域，填充胶层5采用填充胶(Fill)在由封框胶层4围成的区域内涂布形成。
具体地，在封框胶层4和填充胶层5涂布完成后，对封装盖板3和显示基板1进行压合的过程中，容易造成封装盖板3和显示基板1之间盒厚不均的情况，尤其是针对大尺寸的显示基板，在封装盖板3和显示基板1压合时更易出现盒厚不均的情况。盒厚不均会影响显示面板的显示性能，盒厚均匀尤其对于顶发射OLED很重要，若盒厚不均会出现光程差造成的显示失真， 且若盖板上设置有彩膜，盒厚不均还会造成侧向漏光的情况。
基于此，本公开实施例提供的上述OLED封装结构中，采用了用于固定封装盖板3和显示基板1之间盒厚的支撑块6。具体地，支撑块6具有预设的厚度，其预设的厚度等于显示基板1与封装盖板3之间的预设距离，即，支撑块6的厚度等于显示基板1与封装盖板3之间的盒厚。将支撑块6环绕设置在封框胶层4所在区域，可以避免将支撑块6设置在填充胶层5所在区域时其设置位置受到显示基板1上的OLED器件2等的干扰。在显示基板1与封装盖板2扣合时，支撑块6能够在显示基板1与封装盖板2之间起到支撑的作用，从而可以固定盒厚，使显示基板1与封装盖板2之间的盒厚均匀。
且支撑块6具有预设柔性，这里的预设柔性可以设置为在显示基板1与封装盖板3压合时，不会对显示基板1产生过大的压力，避免硬度过大的支撑结构会产生对显示基板1上裸露的金属导线8，尤其是在上下交叠的金属导线8(金属导线8间采用绝缘材料间隔)的部位的过大挤压，造成金属导线8的压伤，或者导致接触电极后影响电性，造成显示器件出现暗线的现象。因此，具有预设柔性的支撑块6的设置可以在固定盒厚的同时，起到对显示基板1的保护作用，以提高显示器件的良品率。
此外，支撑块6也不应具有过大的柔性，当支撑块6的柔性过大时，显示基板1与封装盖板3压合时会导致支撑块6的变形，无法达到对显示基板1与封装盖板3之间的距离进行固定，从而无法实现盒厚均匀的作用。
因此，在本公开实施例提供的上述封装结构中，在制作支撑块6时，可以采用具有一定柔性的材料，并且，可以在其中加入起到加固作用的材料制成，或，还可以采用具有柔性和硬度均适中的材料制成，旨在达到显示基板1与封装盖板3之间的盒厚均匀且不对显示基板1产生过大压力和破坏即可。此外，在选择支撑块6的材料时，除需要考虑材料的柔性外，还应选择不影响封框胶层4密封性的材料。
具体地，为实现盒厚均匀的效果，在本公开实施例提供的上述封装结构中，在封装盖板1的第一表面边缘且在封装胶层4所在区域设置多个支撑块6。 具体地，封装盖板3的第一表面的每个边缘应至少应设置一个支撑块6。进一步地，在本公开实施例提供的上述封装结构中，可以在封装盖板3的第一表面的每个边缘均匀设置多个支撑块6。
具体地，在本公开实施例提供的上述封装结构中，支撑块6的形状可以设置为正方体、长方体等多种形状。
可选地，在本公开实施例提供的上述封装结构中，支撑块6与显示面板1接触的表面可以设置为平面，相比于现有的采用球状隔垫物7作支撑结构的方式，支撑结构与显示基板1接触的表面为平面可以增大支撑结构与显示基板1表面的接触面积，从而可以避免对显示基板1的局部产生过大的压力，而造成对OLED器件2的损坏。
具体地，在本公开实施例提供的上述封装结构中，支撑块6的高度与盒厚相等，支撑块6的长度和宽度可以根据实际情况设定。例如：支撑块6的宽度可以小于每个边缘的封框胶层4的宽度，从而可以增大封框胶层4与封装盖板3和显示基板1的接触面积，以提高封装效果。
本公开实施例提供的OLED封装结构，通过封框胶层4和填充胶层5将封装盖板3与显示基板1粘合实现封装过程，通过在封装胶层4对应的封装盖板3边缘的区域设置多个支撑块6，能够在封装盖板3和显示基板1压合的过程中起到固定盒厚，保证盒厚均匀的作用，尤其是针对大尺寸的显示面板的作用效果更加明显。由于支撑块6具有预设的柔性，在封装盖板2和显示基板1压合的过程中不会对显示基板1产生过大的压力，可以防止造成对裸露导线的压伤，或者接触电极后影响电性，可以起到提高显示面板的显示画面品质，提高良品率和竞争力的作用。
可选地，在本公开实施例提供的上述封装结构中，支撑块6的材料有多种不同的可选择性，例如，支撑块6的主体材料可以采用与封框胶层4相同的材料制成。在选择支撑块6的主体材料时，应保证支撑块6不会影响封装、阻挡水汽的效果，防止由于支撑块6的设置而导致水汽的进入，对OLED器件2造成损坏。具体地，可以选用制作封框胶层4的封框胶来制作支撑块6， 一方面，封框胶具有良好的阻挡水汽的性能，且封框胶固化后的硬度不大，能够满足预设柔性的要求，另一方面，可以便于支撑块6的制作，节省了其他材料的制备过程，直接采用封框胶可以提高封装的效率及成本。
由于由封框胶制成的支撑块6在固化后，受力后仍会存在变形的情况，在封装盖板1与显示基板3的压合容易造成支撑块6的变形，则无法起到有效的支撑作用，无法起到固定盒厚的作用，因此，可以在支撑块6的主体材料内掺杂加强材料，加强材料被配置为增强支撑块6的强度，掺杂加强材料后，可以使支撑块6的强度加强，能够对封装盖板3与显示基板1进行有效的支撑固定，防止压合过程中盒厚发生变化。
具体地，上述的加强材料可以有多种具体的设置形式。加强材料可以为纳米线，纳米线可以定义为是一种具有在横向上被限制在100纳米以下的一维结构，其在纵向上没有限制。这里使用的纳米线的材料可以选用C、ZnS、ZnO、TiO2等无机材料，其直径可以为10nm～50nm，长度的范围可以是10μm～500μm。随着尺寸的减小，纳米线会表现为比一般的大块材料更好的机械性能，其强度变强，韧性变好。将纳米线加入到支撑块6中可以起到增加支撑块6的强度，减小支撑块6受力产生形变的作用，从而可以保证在封装盖板3与显示基板1压合时，支撑块6具有良好的支撑性能，能够起到密封过程中固定显示基板1与封装盖板3之间的盒厚，使盒厚均匀，保证OLED显示装置的使用性能。
具体地，通过限制纳米线占支撑块6的整体比例，可以对纳米线加入后支撑块6的硬度进行控制，避免造成支撑块6的硬度而存在影响显示基板1显示功能的情况发生。可选地，在本公开实施例提供的上述封装结构中，纳米线在支撑块6内所占体积比可以为10％～50％。
在本公开实施例提供的上述封装结构中，支撑块6的形状可以有多种具体的设置方式，相关技术中采用球状垫隔物7设置在显示基板1和封装盖板3之间，如图1所示，在显示基板1和封装盖板3的压合过程中起到支撑的作用，球状垫隔物7的形状为球体，球体的设置容易导致支撑不稳定，且与显 示基板1和封装盖板3的接触均为点接触，接触面积较小，导致在压合时产生的压力集中一点作用在显示基板1上，局部的压力过大会造成对显示基板1的金属导线8或其他器件的压伤。基于此，如图2所示，可以将支撑块6与显示基板1接触的表面为平面，通过平面与显示基板1接触，在作用压力相同的情况下，接触面积增大，显示基板1受到的压强减小，即压力对显示基板1的作用效果可以减小。支撑块6的形状也有多种设置形式，支撑块6与显示基板1接触的表面为第三表面，与其相对的、与封装盖板3接触的表面为第二表面，第二表面可以设置为平面。支撑块6与显示基板1和封装盖板3均通过平面接触，可以提高对显示基板1和封装盖板3支撑的稳定性，在此前提下，可以将支撑块6设置为圆柱体、正方体、长方体等，此处不做具体限制。
可选地，在本公开实施例提供的上述封装结构中，封框胶层4的材料可以采用紫外固化型树脂胶或热固化型树脂胶，具有疏水性质，具体可以为：环氧树脂、丙烯酸环氧丙酯、甲基丙烯酸环氧丙酯、甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸正丁酯、甲基聚丙烯酸6，7-环氧庚酯、甲基丙烯酸-2-羟基乙酯等单体的均聚物或共聚物、三聚氰胺甲醛树脂、不饱和聚酯树脂、有机硅树脂、呋喃树脂等。且封框胶层4的粘稠度范围可以为100000mPa·s-400000mPa·s。
可选地，在本公开实施例提供的上述封装结构中，填充胶层5的材料可以采用紫外固化型树脂胶或热固化型树脂胶，具有疏水性质，具体可以为：环氧树脂、丙烯酸环氧丙酯、甲基丙烯酸环氧丙酯、甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸正丁酯、甲基聚丙烯酸6，7-环氧庚酯、甲基丙烯酸-2-羟基乙酯等单体的均聚物或共聚物、三聚氰胺甲醛树脂、不饱和聚酯树脂、有机硅树脂、呋喃树脂等。且填充胶层5的粘稠度范围可以为100mPa·s-2000mPa·s。
基于同一发明构思，本公开实施例还提供了一种OLED封装方法，如图5所示，该OLED封装方法包括：
S1：制作多个支撑块6，并将多个支撑块6排布在封装盖板3的第一表面边缘的将要形成的封框胶层所在区域内；
S2：在封装盖板3的第一表面边缘环绕涂布封框胶层4；
S3：在封框胶层4所围成的区域内涂布填充胶层5；
S4：将封装盖板3与显示基板1具有OLED器件的一侧表面进行压合，并对封框胶层4和填充胶层5进行固化。
本公开实施例提供的上述OLED封装方法，通过在封装胶层4对应的封装盖板3边缘的区域设置多个支撑块6，能够在封装盖板3和显示基板1压合的过程中起到固定盒厚，保证盒厚均匀的作用，尤其是针对大尺寸的显示面板的作用效果更加明显。由于支撑块6具有预设的柔性，在封装盖板3和显示基板1压合的过程中不会对显示基板产生过大的压力，可以防止造成对裸露导线的压伤，或者接触电极后影响电性，可以起到提高显示面板的显示画面品质，提高良品率和竞争力的作用。
可选地，在本公开实施例提供的上述OLED封装方法中，制作支撑块6，可以具体包括：在封框胶中掺杂纳米线进行固化后，将其裁切为具有预设厚度的块体。
具体地，支撑块6为具有预设柔性的、在封装盖板3和显示基板1压合过程中起到支撑作用的块体，可以采用封框胶制成，为提高支撑块6固化后的硬度，减小受力后的形变，在制作时，可以在封框胶中加入纳米线，随着尺寸的减小，纳米线会表现为比一般的大块材料更好的机械性能，其强度变强，韧性变好，将纳米线加入到支撑块中可以起到增加支撑块的强度。纳米线可以采用C、ZnS、ZnO、TiO2等无机材料，其直径可以为10nm～50nm，长度的范围可以是10μm～500μm；具体地，纳米线在支撑块6内所占体积比可以为10％～50％。
在操作时，将封框胶中均匀混合上述的纳米线，混合后照射UV光固化成型，再通过裁切的方式制作成具有预设厚度的支撑块。例如，当封装盖板3与显示基板1之间的盒厚为10μm，则支撑块6的预设厚度应为10μm，将固 化后的封框胶裁切为多个厚度均为10μm的块体，且每个支撑块6的大小可以均相等。进一步的，可以将支撑块6的形状裁切为长方体，可以便于裁切，提高支撑块6的制作效率，且有利于提高支撑块6的支撑稳定性。支撑块6的宽度可以小于对应的封框胶层4的宽度，例如，封装盖板3的第一表面的边缘设置封框胶层4的宽度为3mm时，如图4所示，可以将长方体状的支撑块6的长度和宽度设置为1mm，且相邻的支撑块6之间间隔1mm设置，这样既保证了对封装盖板3和显示基板1的支撑性，也保证了封框胶层4具有足够的涂布面积，能够封装的可靠性；或，如图3所示，还可以在封框胶层4的同一宽度位置上并排设置多个支撑块6，如封装盖板3的第一表面的边缘设置封框胶层4的宽度为3mm时，可以将长方体状的支撑块6的长度和宽度设置为0.5mm，且在封框胶层4的同一宽度位置上并排设置两个支撑块6，两个支撑块6之间可以设置。
基于同一发明构思，本公开实施例还提供了一种显示装置，该显示装置包括：上述的OLED封装结构，以及具有OLED器件的显示基板。
本公开实施例提供的显示装置，通过在封装结构的封装胶层对应的封装盖板边缘的区域设置多个支撑块，能够在封装盖板和显示基板压合的过程中起到固定盒厚，保证盒厚均匀的作用，尤其是针对大尺寸的显示装置的作用效果更加明显。由于支撑块具有预设的柔性，在封装盖板和显示基板压合的过程中不会对显示基板产生过大的压力，可以防止造成对裸露导线的压伤，或者接触电极后影响电性，可以起到提高显示装置的显示画面品质，并可提高显示装置的良品率和竞争力的作用。
以上，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以权利要求的保护范围为准。

Claims (13)

  1. 一种OLED封装结构，被配置为封装显示基板上的OLED器件，其中，包括：
    封装盖板，具有与所述显示基板相对的第一表面；
    封框胶层，位于所述第一表面且环绕所述第一表面的边缘设置；
    填充胶层，填充在所述封框胶层所围成的区域内；
    多个支撑块，分布于所述封框胶层所在区域内且具有预设柔性，所述支撑块被配置为固定所述封装盖板和所述显示基板之间的盒厚。
  2. 根据权利要求1所述的OLED封装结构，其中，所述支撑块具有与所述封框胶层相同的主体材料；
    所述支撑块的主体材料内掺杂有加强材料，所述加强材料被配置为增强所述支撑块的强度。
  3. 根据权利要求2所述的OLED封装结构，其中，所述加强材料为纳米线。
  4. 根据权利要求3所述的OLED封装结构，其中，所述纳米线在所述支撑块内所占体积比为10％～50％。
  5. 根据权利要求1所述的OLED封装结构，其中，所述支撑块与所述显示基板接触的表面为平面。
  6. 根据权利要求1所述的OLED封装结构，其中，所述封框胶层的宽度大于所在区域内的所述支撑块的宽度。
  7. 根据权利要求1所述的OLED封装结构，其中，所述封装盖板的第一表面的每个边缘至少设置一个所述支撑块。
  8. 根据权利要求6所述的OLED封装结构，其中，所述封装盖板的第一表面的每个边缘均设置多个所述支撑块。
  9. 根据权利要求1所述的OLED封装结构，其中，所述封框胶层的材料为紫外固化型树脂胶或热固化型树脂胶；
    所述封框胶层的粘稠度为100000mPa·s-400000mPa·s。
  10. 根据权利要求1所述的OLED封装结构，其中，所述填充胶层的材料为紫外固化型树脂胶或热固化型树脂胶；
    所述填充胶层的粘稠度为100mPa·s-2000mPa·s。
  11. 一种OLED封装方法，其中，包括：
    制作多个支撑块，并将所述多个支撑块排布在封装盖板的第一表面边缘的将要形成的封框胶层所在区域内；
    在所述封装盖板的第一表面边缘环绕涂布所述封框胶层；
    在所述封框胶层所围成的区域内涂布填充胶层；
    将所述封装盖板与显示基板具有OLED器件的一侧表面进行压合，并对所述封框胶层和所述填充胶层进行固化。
  12. 根据权利要求11所述的OLED封装方法，其中，所述制作多个支撑块，包括：
    在封框胶中掺杂纳米线进行固化后，裁切为具有预设厚度的块体。
  13. 一种显示装置，其中，包括：如权利要求1-10任一所述的OLED封装结构，以及具有OLED器件的显示基板。
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