WO2020215396A1 - 显示面板的封装结构及其封装方法 - Google Patents

显示面板的封装结构及其封装方法 Download PDF

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Publication number
WO2020215396A1
WO2020215396A1 PCT/CN2019/086813 CN2019086813W WO2020215396A1 WO 2020215396 A1 WO2020215396 A1 WO 2020215396A1 CN 2019086813 W CN2019086813 W CN 2019086813W WO 2020215396 A1 WO2020215396 A1 WO 2020215396A1
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Prior art keywords
layer
filler
display area
display panel
packaging
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PCT/CN2019/086813
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English (en)
French (fr)
Inventor
苗洋
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深圳市华星光电半导体显示技术有限公司
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Publication of WO2020215396A1 publication Critical patent/WO2020215396A1/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the invention relates to the field of display technology, in particular to a packaging structure of a display panel and a packaging method thereof.
  • OLED displays have the advantages of self-luminescence, no need for backlight, high contrast, wide color gamut, thin thickness, wide viewing angle, fast response speed, and can be used for flexible panels. It is a new generation of flat display technology.
  • each packaging method has its advantages and limitations.
  • frame glue, fillers, etc. are suitable for the packaging of display panels with top emission structures.
  • the introduction of fillers can effectively reduce the Newton ring phenomenon, but the existing fillers still have a certain degree of fluidity after curing, so It is easy to come into contact with other adhesive layers, and the existing fillers will produce alcohols after prolonged contact with the moisture absorption layer, which will degrade the panel. Therefore, the existing packaging method needs to be improved to make it more suitable for the packaging of OLED display panels.
  • the present invention provides a display panel packaging structure and packaging method thereof, changing the composition of the filler, providing a new filler, and curing the filler and the packaging glue after packaging to avoid the filler from flowing, Reacts with other adhesive layers such as moisture absorption layer, affecting the packaging effect.
  • the present invention provides a display panel packaging structure, including a substrate, having a display area and a non-display area surrounding the display area; and a frame adhesive layer disposed in the non-display area and surrounding the display Area; filler, filled in the range enclosed by the frame glue layer and form a filling layer; the filler includes a transparent adhesive and cellulose nanofibers; a cover plate, the cover is connected to the On the filling layer and the frame adhesive layer.
  • the mass of the viscous transparent polymer accounts for 80-90% of the total filler; the mass of the cellulose nanofibers accounts for 3% of the total filler. %-10%;
  • the filler also includes a desiccant whose mass accounts for 3%-10% of the entire filler.
  • the adhesive transparent polymer includes at least one of acrylic resin and epoxy resin.
  • the substrate includes a thin film transistor structure layer; and an OLED device disposed on the thin film transistor structure layer and located in the display area; a water blocking layer completely covers the OLED device; The filling layer completely covers the water blocking layer.
  • the packaging structure of the display panel further includes a moisture absorption layer.
  • the moisture absorption layer is provided in the non-display area and surrounds the non-display area within the interval enclosed by the frame adhesive layer. Display area; the filler is filled in the range enclosed by the moisture absorption layer.
  • the water blocking layer includes at least one of a silicon oxide layer, a silicon nitride layer, or a silicon oxynitride layer.
  • the present invention also provides a packaging method for a display panel, which includes the following steps: providing a substrate and a cover plate; the substrate has a display area and a non-display area surrounding the display area; and coating frame glue on the cover plate A frame adhesive layer corresponding to the non-display area is formed around one side of the cover, and a frame adhesive layer corresponding to the non-display area is formed; in the interval enclosed by the frame adhesive layer, a transparent adhesive polymer is printed and At the same time, cellulose nanofibers are sprayed to form a filler; the cover plate with the filler and the substrate are vacuum bonded, wherein the frame glue layer is located in the non-display area, and the filler forms a mixture after pressing Uniform filling layer; curing the frame adhesive layer and filling layer.
  • the method before the step of printing the adhesive transparent polymer, the method further includes applying a moisture absorbent to the periphery of one side of the cover plate within the interval enclosed by the frame adhesive layer, In addition, a moisture absorption layer corresponding to the non-display area is formed around one surface of the cover plate, and in the step of printing the adhesive transparent polymer, the filler is located in the range enclosed by the moisture absorption layer.
  • the step of providing a substrate includes fabricating a thin film transistor structure layer; fabricating an OLED device on the thin film transistor structure layer; forming a water blocking layer on the thin film transistor structure layer and the water blocking layer It completely covers the OLED device.
  • the step of curing the frame glue layer and the filling layer includes irradiating or heating the frame glue layer, the moisture absorption layer and the mixed glue layer by ultraviolet rays, and then cooling and curing the frame glue Layer, the moisture absorption layer and the mixed glue layer.
  • the filler prepared by mixing epoxy resin and cellulose nanofibers have higher strength, better hydrophobicity, and can interact better with epoxy resin. Compared with traditional fillers, it has stronger strength, weaker fluidity and better stability.
  • the filling layer formed by the display panel packaging method of the present invention will not react with the moisture absorption layer and can display The panel realizes effective protection.
  • FIG. 1 is a top view of a substrate according to an embodiment of the present invention, which mainly reflects the distribution area of the display area, the non-display area and the OLDE device.
  • FIG. 2 is a top view of a substrate with a water blocking layer formed with an embodiment of the present invention, which mainly reflects the distribution area of the water blocking layer.
  • Fig. 3 is a bottom view of a cover plate formed with a frame adhesive layer and a moisture absorption layer according to an embodiment of the present invention, which mainly reflects the distribution area of the frame adhesive layer and the moisture absorption layer.
  • Fig. 4 is a bottom view of a cover plate with a filling layer formed with an embodiment of the present invention, which mainly reflects the distribution area of the filling layer.
  • FIG. 5 is a schematic diagram of the display panel packaging structure of the present invention.
  • the packaging structure 1 of the display panel of the present invention includes a substrate 11, a cover 12, a water blocking layer 13, a frame glue layer 14, a filling layer 15 and a moisture absorption layer 16.
  • the substrate 11 includes a thin film transistor structure layer 111 and an OLED device 112, and the OLED device 112 is disposed on the thin film transistor structure layer 111.
  • the substrate 11 has a display area 101 and a non-display area 102 surrounding the display area 101.
  • the OLED device 112 is located in the display area 101. Since the layer structure constituting the thin film transistor structure layer 111 is not the focus of the present invention, the layer structure is not specifically shown in the figure. Here, only the structure constituting the thin film transistor structure layer 111 will be briefly described.
  • the specific structure of the thin film transistor structure layer 111 generally includes an active layer, a gate insulating layer, a gate electrode, an interlayer dielectric layer, source and drain electrodes, and contact holes.
  • the active layer is provided on the buffer layer, the active layer has a source region and a drain region; the gate insulating layer covers the active layer and the buffer layer; The gate is provided on the gate insulating layer; the interlayer dielectric layer covers the gate and the gate insulating layer; the contact hole penetrates from the interlayer dielectric layer to the On the source layer, and one of the contact holes corresponds to the source region, and the other contact hole corresponds to the drain region; the source and drain are provided on the interlayer dielectric layer, so The source is connected to the source region from the corresponding contact hole, and the drain is connected to the drain region from the corresponding contact hole; of course, in this embodiment, the substrate 11 may also include a flat layer . The flat layer covers the source electrode, the drain electrode, and the interlayer dielectric layer. The pixel definition layer is provided on the flat layer. The pixel definition layer has grooves.
  • the OLED device 112 is arranged on the thin film transistor structure layer 111 of the display area 101. More specifically, the OLED device 112 is disposed on the flat layer of the substrate 11 and located in the slot.
  • the specific structure of the OLED device 112 sequentially includes a first electrode, a hole transport layer, a light emitting layer, an electron transport layer, and a second electrode.
  • the first electrode is an anode, which is arranged on the flat layer and connected to the drain.
  • the hole transport layer, the light-emitting layer, the electron transport layer, and the second electrode are sequentially disposed on the first electrode.
  • the second electrode is a cathode.
  • the water blocking layer 13 completely covers the OLED device 112 to block water vapor.
  • the water blocking layer 13 includes at least one of a silicon oxide layer, a silicon nitride layer or a silicon oxynitride layer. More specifically, in this embodiment, the water blocking layer 13 may be provided with a silicon oxide layer or a silicon nitride layer or a silicon oxynitride layer. It is also possible to provide a stacked structure of two or more layers, such as a silicon oxide layer and a silicon nitride layer. Multiple layers may also be provided, such as a silicon oxide layer, a silicon nitride layer, and a silicon oxide layer, and so on.
  • the frame adhesive layer 14 is provided in the non-display area 102 and surrounds the display area 101; within the interval enclosed by the frame adhesive layer 14, the moisture absorption layer 16 is provided in The non-display area 102 surrounds the display area 101.
  • the filling layer 15 completely covers the water blocking layer 13.
  • the filler is filled in the interval enclosed by the moisture absorption layer 16 to form the filling layer 15.
  • the filler includes adhesive transparent polymer and cellulose nanofibers; in the filler, the weight of the adhesive transparent polymer accounts for 80-90% of the entire filler; the fiber The mass of the plain nanofibers accounts for 3%-10% of the entire filler; the filler also includes a desiccant whose mass accounts for 3%-10% of the entire filler. The mass ratio of the cellulose nanofibers should not be too high, too high will easily affect the light transmittance of the display panel, and further affect the display effect of the display panel.
  • the adhesive transparent polymer includes at least one of acrylic resin and epoxy resin.
  • the cover plate 12 covers the filling layer 15 and the frame adhesive layer 14.
  • the frame adhesive layer 14, the moisture absorption layer 16 and the filling layer 15 are all disposed on the cover plate 12, and then the cover plate 12 is bonded to the substrate 11.
  • the present invention will be described in more detail below through the packaging method of the display panel.
  • the packaging method of the display panel of the present invention includes the following steps.
  • a substrate 11 and a cover 12 are provided; the substrate 11 has a display area 101 and a non-display area 102 surrounding the display area 101.
  • a thin film transistor structure layer 111 is first produced.
  • the specific structure of the thin film transistor structure layer 111 has been described in detail above, and will not be repeated here. ; And then fabricate OLED devices 112 on the thin film transistor structure layer 111.
  • a water blocking layer 13 is formed on the thin film transistor structure layer 111 and the water blocking layer 13 completely covers the OLED device 112.
  • the water blocking layer 13 may be provided with a silicon oxide layer, a silicon nitride layer, or a silicon oxynitride layer, or a stacked structure of two or more layers.
  • a deposition method is used to deposit the water blocking material on the surface of the OLED device 112.
  • the frame glue is coated on the cover plate 12, and a ring of frame glue layer 14 corresponding to the non-display area 102 is formed on the cover plate 12.
  • a moisture absorbent is coated on the cover plate 12, and a circle and the non-display area are formed on the cover plate 12. 102 corresponding to the moisture absorption layer 16.
  • the cover plate 12 with the filler and the substrate 11 are vacuum bonded, wherein the frame adhesive layer 14 is located in the non-display area 102, and the filler forms a mixture after pressing. Uniform filling layer 15.
  • the frame adhesive layer 14 and the filling layer 15 are cured.
  • the step of curing the frame adhesive layer 14 and the filling layer 15 includes irradiating or heating the frame adhesive layer 14, the moisture absorption layer 16 and the mixed adhesive layer by ultraviolet rays, and then cooling and curing the frame adhesive layer 14, the The moisture absorption layer 16 and the mixed adhesive layer.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

本发明公开了一种显示面板的封装结构及其封装方法，显示面板的封装结构包括基板，具有显示区和围绕显示区的非显示区；边框胶层设于所述非显示区且围绕所述显示区；填充剂填充于所述边框胶层所围成的区间范围内且形成填充层；所述填充剂中包括胶黏性的透明聚合物和纤维素纳米纤维；盖板盖接于所述填充层和所述边框胶层上。本发明的显示面板封装结构，通过混合环氧树脂和纤维素纳米纤维制备的填充剂，相比传统的填充剂具有更强的强度，更弱的流动性和更好的稳定性，通过本发明的显示面板封装方法形成的填充层，不会与吸湿层发生反应，能够对显示面板实现有效地保护。

Description

显示面板的封装结构及其封装方法 技术领域
本发明涉及显示技术领域，具体为一种显示面板的封装结构及其封装方法。
 背景技术
有机发光二极管（Organic Light-Emitting Diode, OLED）显示器由于具备自发光，不需要背光源、对比度高、色域宽、厚度薄、视角广、反应速度快和可用于挠曲面板等优点，被认为是下一代平面显示新型技术。
但是OLED显示器中，显示面板的寿命容易受到水汽的影响，因此，需要对显示面板进行有效地封装。目前，每一种封装方法都有其优势和局限。比如通过边框胶、填充剂等适用于顶发射结构的显示面板的封装，填充剂的引入能够有效地较少牛顿环现象，但是现有的填充剂在固化后仍然会有一定的流动性，因此容易同其他胶层发生接触，而现有填充剂在同吸湿层长时间接触后会生产醇类物质对面板造成劣化。因此，需要对现有的封装方法进行改进，以使其更加适用于OLED显示面板的封装。
 技术问题
为解决上述技术问题：本发明提供一种显示面板的封装结构及其封装方法，改变填充剂的成分，提供新的填充剂，并在封装后固化填充剂和封装胶等以避免填充剂流动，与其他胶层如吸湿层发生反应，影响封装效果。
 技术解决方案
解决上述问题的技术方案是：本发明提供一种显示面板的封装结构，包括基板，具有显示区和围绕显示区的非显示区；边框胶层，设于所述非显示区且围绕所述显示区；填充剂，填充于所述边框胶层所围成的区间范围内且形成填充层；所述填充剂中包括胶黏性的透明聚合物和纤维素纳米纤维；盖板，盖接于所述填充层和所述边框胶层上。
在本发明一实施例中，在所述填充剂中，所述胶黏性的透明聚合物的质量占整个填充剂的80-90％；所述纤维素纳米纤维的质量占整个填充剂的3％-10％；所述填充剂中还包括干燥剂，其质量占整个填充剂的3％-10％。
在本发明一实施例中，所述胶黏性的透明聚合物包括丙烯酸树脂、环氧树脂中的至少一种。
在本发明一实施例中，所述基板包括薄膜晶体管结构层；以及OLED器件，设于所述薄膜晶体管结构层上且位于所述显示区；阻水层，完全覆盖于所述OLED器件上；所述填充层完全覆盖于所述阻水层上。
在本发明一实施例中，所述的显示面板的封装结构还包括吸湿层，在所述边框胶层所围成的区间范围内，所述吸湿层设于所述非显示区且围绕所述显示区；所述填充剂填充于所述吸湿层所围成的区间范围内。
在本发明一实施例中，所述阻水层包括氧化硅层、氮化硅层或者氮氧化硅层中的至少一层。
本发明还提供了一种显示面板的封装方法，包括以下步骤：提供一基板以及一盖板；所述基板具有显示区和围绕显示区的非显示区；将边框胶涂布在所述盖板的一面的四周，且在所述盖板的一面的四周形成与所述非显示区对应的边框胶层；在所述边框胶层围成的区间范围内，打印胶黏性的透明聚合物并同时喷涂纤维素纳米纤维形成填充剂；真空贴合带有所述填充剂的盖板与所述基板，其中所述边框胶层位于所述非显示区，经过压合后所述填充剂形成混合均匀的填充层；固化所述边框胶层、填充层。
在本发明一实施例中，在打印胶黏性的透明聚合物步骤之前，还包括在所述边框胶层围成的区间范围内，将吸湿剂涂布在所述盖板的一面的四周，且在所述盖板的一面的四周形成与所述非显示区对应的吸湿层，在打印胶黏性的透明聚合物步骤中，所述填充剂位于所述吸湿层围成的区间范围内。
在本发明一实施例中，在提供一基板的步骤中包括制作薄膜晶体管结构层；制作OLED器件于所述薄膜晶体管结构层上；形成阻水层于薄膜晶体管结构层上且所述阻水层完全覆盖于所述OLED器件。
在本发明一实施例中，在固化所述边框胶层、填充层步骤中包括通过紫外线照射或者加热所述边框胶层、所述吸湿层和所述混合胶层，再冷却固化所述边框胶层、所述吸湿层和所述混合胶层。
 有益效果
本发明的显示面板封装结构，通过混合环氧树脂和纤维素纳米纤维制备的填充剂，纤维素纳米纤维具有较高的强度，较好的疏水性，并能同环氧树脂进行较好的交联；相比传统的填充剂具有更强的强度，更弱的流动性和更好的稳定性，通过本发明的显示面板封装方法形成的填充层，不会与吸湿层发生反应，能够对显示面板实现有效地保护。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
下面结合附图和实施例对本发明作进一步解释。
图1是本发明实施例的基板的俯视图，主要体现显示区和非显示区以及OLDE器件的分布区域。
图2是本发明实施例的形成有阻水层的基板的俯视图，主要体现阻水层的分布区域。
图3是本发明实施例的形成有边框胶层、吸湿层的盖板的仰视图，主要体现边框胶层、吸湿层的分布区域。
图4是本发明实施例的形成有填充层的盖板的仰视图，主要体现填充层的分布区域。
图5是本发明的显示面板封装结构的示意图。
附图标记：
1封装结构；
101显示区；             102非显示区；
11基板；                12盖板；
13阻水层；              14边框胶层；
15填充层；              16吸湿层；
111薄膜晶体管结构层；   112 OLED器件。
 本发明的实施方式
下面详细描述本发明的实施方式，所述实施方式的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的，仅用于解释本发明，而不能理解为对本发明的限制。
以下实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「顶」、「底」等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
如图5所示，在一实施例中，本发明的显示面板的封装结构1，包括基板11、盖板12、阻水层13、边框胶层14、填充层15以及吸湿层16。其中所述基板11包括薄膜晶体管结构层111以及OLED器件112，所述OLED器件112设于所述薄膜晶体管结构层111上。
参见图1所示，所述基板11具有显示区101和围绕显示区101的非显示区102。
请同时参见图2、图5所示，所述OLED器件112位于所述显示区101。由于构成所述薄膜晶体管结构层111的层结构并非本案发明重点，所以图中未具体表现其层结构。此处，仅简单描述一下构成所述薄膜晶体管结构层111的结构。例如：在显示区101，所述薄膜晶体管结构层111的具体结构一般包括有源层、栅极绝缘层、栅极、层间电介质层、源极和漏极、接触孔。其中，所述有源层设于所述缓冲层上，所述有源层具有源极区和漏极区；所述栅极绝缘层覆于所述有源层以及所述缓冲层上；所述栅极设于所述栅极绝缘层上；所述层间电介质层覆于所述栅极和所述栅极绝缘层上；所述接触孔从所述层间电介质层贯穿至所述有源层上，且其中一所述接触孔对应于源极区，其中另一所述接触孔对应于所述漏极区；所述源极和漏极设于所述层间电介质层上，所述源极从对应的所述接触孔连接至所述源极区，所述漏极从对应的所述接触孔连接至所述漏极区；当然本实施例中，基板11还可包括平坦层。所述平坦层覆于所述源极、所述漏极以及所述层间电介质层上。所述像素定义层设于所述平坦层上。所述像素定义层上具有开槽。
在所述显示区101的所述薄膜晶体管结构层111上设置有所述OLED器件112。再具体地讲，所述OLED器件112设于所述基板11的所述平坦层上且位于所述开槽中。所述OLED器件112的具体结构依次包括第一电极、空穴传输层、发光层、电子传输层以及第二电极。本实施例中，所述第一电极为阳极，其设置在平坦层上且与漏极连接。所述空穴传输层、所述发光层、所述电子传输层以及所述第二电极依次设置在所述第一电极上。所述第二电极为阴极。
参见图2所示，所述阻水层13完全覆盖于所述OLED器件112上，用以阻隔水汽。本实施例中，所述阻水层13包括氧化硅层、氮化硅层或者氮氧化硅层中的至少一层。再具体的讲，本实施例中，所述阻水层13可以设置一层氧化硅层或者一层氮化硅层或者一层氮氧化硅层。也可以设置两层或两层以上的叠层结构，如一层氧化硅层和一层氮化硅层等等。也可以设置多层，如一层氧化硅层、一层氮化硅层和一层氧化硅层，等等。
参见图3所示，所述边框胶层14设于所述非显示区102且围绕所述显示区101；在所述边框胶层14所围成的区间范围内，所述吸湿层16设于所述非显示区102且围绕所述显示区101。
参见图4所示，所述填充层15完全覆盖于所述阻水层13上。本实施例中，填充剂填充于所述吸湿层16所围成的区间范围内且形成填充层15。所述填充剂中包括胶黏性的透明聚合物和纤维素纳米纤维；在所述填充剂中，所述胶黏性的透明聚合物的质量占整个填充剂的80-90％；所述纤维素纳米纤维的质量占整个填充剂的3％-10％；所述填充剂中还包括干燥剂，其质量占整个填充剂的3％-10％。所述纤维素纳米纤维的质量占比不能过高，过高则容易影响显示面板的透光性，进一步影响显示面板的显示效果。所述胶黏性的透明聚合物包括丙烯酸树脂、环氧树脂中的至少一种。
所述盖板12覆盖所述填充层15和所述边框胶层14上。本实施例中，所述边框胶层14、所述吸湿层16以及所述填充层15均设置在盖板12上，之后通过所述盖板12与所述基板11贴合而成。下面通过显示面板的封装方法来对本发明进行更详细的说明。
本发明的显示面板的封装方法，包括以下步骤。
参见图1、图3所示，提供一基板11以及一盖板12；所述基板11具有显示区101和围绕显示区101的非显示区102。
参见图1至图2所示，在提供所述基板11步骤中，首先制作薄膜晶体管结构层111，所述薄膜晶体管结构层111的具体结构在上文中已经具体说明，在此就不一一赘述；再制作OLED器件112于所述薄膜晶体管结构层111上。
参见图2所示，形成阻水层13于所述薄膜晶体管结构层111上且所述阻水层13完全覆盖于所述OLED器件112。本实施例中，所述阻水层13可以设置一层氧化硅层或者一层氮化硅层或者一层氮氧化硅层，也可以设置两层或两层以上的叠层结构。在具体形成阻水层13时，本实施例中采用沉积法将阻水材料沉积在所述OLED器件112的表面。
参见图3所示，将边框胶涂布在所述盖板12上，且在所述盖板12形成一圈与所述非显示区102对应的边框胶层14。
参见图3所示，在所述边框胶层14围成的区间范围内，将吸湿剂涂布在所述盖板12上，且在所述盖板12上形成一圈与所述非显示区102对应的吸湿层16。
参见图4所示，在所述吸湿层16围成的区间范围内，打印胶黏性的透明聚合物并同时喷涂纤维素纳米纤维形成填充剂.
参见图5所示，真空贴合带有所述填充剂的盖板12与所述基板11，其中所述边框胶层14位于所述非显示区102，经过压合后所述填充剂形成混合均匀的填充层15。
固化所述边框胶层14、填充层15。在固化所述边框胶层14、填充层15步骤中包括通过紫外线照射或者加热所述边框胶层14、所述吸湿层16和所述混合胶层，再冷却固化所述边框胶层14、所述吸湿层16和所述混合胶层。
以上仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。

Claims (10)

  1. 一种显示面板的封装结构，其包括：
    基板，具有显示区和围绕显示区的非显示区；
    边框胶层，设于所述非显示区且围绕所述显示区；
    填充剂，填充于所述边框胶层所围成的区间范围内且形成填充层；所述填充剂中包括胶黏性的透明聚合物和纤维素纳米纤维；
    盖板，覆盖所述填充层和所述边框胶层。
  2. 根据权利1所述的显示面板的封装结构，其中，在所述填充剂中，所述胶黏性的透明聚合物的质量占整个填充剂的80-90％；所述纤维素纳米纤维的质量占整个填充剂的3％-10％；所述填充剂中还包括干燥剂，其质量占整个填充剂的3％-10％。
  3. 根据权利要求1所述的显示面板的封装结构，其中，所述胶黏性的透明聚合物包括丙烯酸树脂、环氧树脂中的至少一种。
  4. 根据权利要求1所述的显示面板的封装结构，其中，所述基板包括：
    薄膜晶体管结构层；以及
      OLED器件，设于所述薄膜晶体管结构层上且位于所述显示区；
    阻水层，完全覆盖于所述OLED器件上；
    所述填充层完全覆盖于所述阻水层上。
  5. 根据权利要求4所述的显示面板的封装结构，其中，还包括吸湿层，在所述边框胶层所围成的区间范围内，所述吸湿层设于所述非显示区且围绕所述显示区；所述填充剂填充于所述吸湿层所围成的区间范围内。
  6. 根据权利要求4所述的显示面板的封装结构，其中，所述阻水层包括氧化硅层、氮化硅层或者氮氧化硅层中的至少一层。
  7. 一种显示面板的封装方法，其包括以下步骤：
    提供一基板以及一盖板；所述基板具有显示区和围绕显示区的非显示区；
    将边框胶涂布在所述盖板上，且在所述盖板上形成一圈与所述非显示区对应的边框胶层；
    在所述边框胶层围成的区间范围内，打印胶黏性的透明聚合物并同时喷涂纤维素纳米纤维形成填充剂；
    真空贴合带有所述填充剂的盖板与所述基板，其中所述边框胶层位于所述非显示区，经过压合后所述填充剂形成混合均匀的填充层；
    固化所述边框胶层、所述填充层。
  8. 根据权利要求7所述的显示面板的封装方法，其中，在打印胶黏性的透明聚合物步骤之前，还包括在所述边框胶层围成的区间范围内，将吸湿剂涂布在所述盖板上，且在所述盖板上形成一圈与所述非显示区对应的吸湿层，在打印胶黏性的透明聚合物步骤中，所述填充剂位于所述吸湿层围成的区间范围内。
  9. 根据权利要求8所述的显示面板的封装方法，其中，在提供所述基板的步骤中包括：
    制作薄膜晶体管结构层；
    制作OLED器件于所述薄膜晶体管结构层上；
    形成阻水层于所述薄膜晶体管结构层上且所述阻水层完全覆盖所述OLED器件。
  10. 根据权利要求9所述的显示面板的封装方法，其中，在固化所述边框胶层和所述填充层的步骤中包括：
    通过紫外线照射或者加热所述边框胶层、所述吸湿层，再冷却固化所述边框胶层、所述吸湿层和所述混合胶层。
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