WO2020194440A1 - プリント配線板および電子機器 - Google Patents
プリント配線板および電子機器 Download PDFInfo
- Publication number
- WO2020194440A1 WO2020194440A1 PCT/JP2019/012459 JP2019012459W WO2020194440A1 WO 2020194440 A1 WO2020194440 A1 WO 2020194440A1 JP 2019012459 W JP2019012459 W JP 2019012459W WO 2020194440 A1 WO2020194440 A1 WO 2020194440A1
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- Prior art keywords
- electrode pad
- printed wiring
- wiring board
- barrier conductor
- electrode
- Prior art date
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
Definitions
- the present invention relates to a printed wiring board and an electronic device to which electrodes of electronic components are soldered.
- One of the methods for soldering electronic components to a printed wiring board is a soldering method called mixed mounting.
- an adhesive is applied to one surface of the printed wiring board, and the surface mount component is mounted on the adhesive to temporarily fix the surface mount component.
- the printed wiring board is inverted, an electronic component lead (insertion component) is inserted into the through hole from the other surface side of the printed wiring board, and the surface mount component and the insertion component are jet-soldered at once.
- insertion component an electronic component lead
- the adhesive when the surface mount component is mounted on the adhesive, the adhesive may squeeze out onto the electrode pad of the printed wiring board due to the spreading action of the adhesive by the surface mount component.
- soldering metal bonding
- the printed wiring board described in Patent Document 1 is provided with a frame-shaped copper foil for preventing the adhesive from spreading between the electrode pads.
- the present invention has been made in view of the above, and an object of the present invention is to obtain a printed wiring board capable of suppressing the spread of an adhesive while preventing a short circuit between electrode pads.
- the printed wiring board of the present invention is soldered to the first electrode pad to be soldered to the first electrode of the electronic component and to the second electrode of the electronic component. It includes a second electrode pad to be attached, a first barrier conductor connected to the first electrode pad, and a second barrier conductor connected to the second electrode pad.
- the first barrier conductor and the second barrier conductor are arranged at positions facing each other with an adhesive region in which the adhesive is arranged when the electronic components are bonded, and the first electrode pad is the first.
- the first electrode pad and the second electrode pad are arranged so as to face the adhesive region via the barrier conductor and the second electrode pad to face the adhesive region via the second barrier conductor. ..
- the printed wiring board according to the present invention has the effect of suppressing the spread of the adhesive while preventing a short circuit between the electrode pads.
- the figure which shows the state which is soldering to the printed wiring board of FIG. The figure which shows the structure of the printed wiring board after soldering to the printed wiring board of FIG.
- FIG. 1 is a top view showing the configuration of the printed wiring board according to the first embodiment.
- FIG. 2 is a diagram showing a state in which an adhesive is applied to the printed wiring board of FIG.
- the printed wiring board has the horizontal right direction of the paper surface as the X-axis direction, the vertical direction of the paper surface as the Y-axis direction, and the direction perpendicular to the paper surface as the Z-axis direction.
- the configuration of 1X will be described.
- Electrode pads 2A and 2B for joining the electronic components 5 described later are provided on the upper surface of the printed wiring board 1X.
- the electrode pads 2A and 2B each have a rectangular upper surface having two sides extending in the X-axis direction and two sides extending in the Y-axis direction.
- the electrode pads 2A and 2B are placed on the printed wiring board 1X so that one side extending in the Y-axis direction of the electrode pad 2A and one side extending in the Y-axis direction of the electrode pad 2B face each other via the gap region 15. Have been placed.
- An adhesive 4 for adhering the electronic component 5 is arranged in the central region of the gap region 15. When joining the electronic component 5 to the printed wiring board 1X, the adhesive 4 is provided so that the electrode pad 2A and the electrode pad 2B are bridged by the electronic component 5 and the electronic component 5 adheres to the adhesive 4.
- the electronic component 5 is pressed from above.
- barrier conductors 3A and 3B that serve as a barrier for the adhesive 4 when the electronic component 5 spreads the adhesive 4 are formed.
- the barrier conductor 3A prevents the adhesive 4 from entering the electrode pad 2A, and also prevents the solder from entering the end of the electrode 51A (the electrode end 57A described later).
- the barrier conductor 3B prevents the adhesive 4 from entering the electrode pad 2B, and also prevents the solder from entering the end of the electrode 51B (the electrode end 57B described later).
- the barrier conductor 3A is connected to the electrode pad 2A, and the barrier conductor 3B is connected to the electrode pad 2B.
- the barrier conductor 3A is arranged between the gap region 15 and the electrode pad 2A, and the barrier conductor 3B is arranged between the gap region 15 and the electrode pad 2B.
- the barrier conductor 3A is integrally formed of the same conductor as the electrode pad 2A, and the barrier conductor 3B is integrally formed of the same conductor as the electrode pad 2B.
- the barrier conductor 3A and the electrode pad 2A may be formed separately.
- the barrier conductor 3B and the electrode pad 2B may be formed separately. Further, the barrier conductor 3A and the electrode pad 2A may be different types of conductors. Further, the barrier conductor 3B and the electrode pad 2B may be different types of conductors.
- the barrier conductors 3A and 3B are arranged so as to surround a part around the gap region 15.
- the barrier conductors 3A and 3B each have a linear shape at one end and a curved line at the other end. That is, the barrier conductor 3A has a straight side at one end in the X-axis direction and a curved side 31A which is a curved side at the other end. Further, the barrier conductor 3B has a straight side at one end in the X-axis direction and a curved side 31B which is a curved side at the other end.
- the straight side of the barrier conductor 3A is joined to the side extending in the Y-axis direction of the electrode pad 2A, and the straight side of the barrier conductor 3B is joined to the side extending in the Y-axis direction of the electrode pad 2B.
- the curved side 31A of the barrier conductor 3A and the curved side 31B of the barrier conductor 3B face each other via the gap region 15.
- the curved side 31A of the barrier conductor 3A is an arc equidistant from the center of the gap region 15
- the curved side 31B of the barrier conductor 3B is an arc equidistant from the center of the gap region 15.
- the distance between the curved sides 31A and 31B differs depending on the position on the curved sides 31A and 31B.
- the distance in the X-axis direction between the curved sides 31A and 31B is the longest distance (longest distance L2) between the center of the curved side 31A and the center of the curved side 31B.
- the distance in the X-axis direction between the curved sides 31A and 31B is the shortest distance (shortest distance L1) between the position of the minimum Y coordinate of the curved side 31A and the position of the minimum Y coordinate of the curved side 31B.
- the distance in the X-axis direction between the curved sides 31A and 31B is the shortest distance between the position of the maximum Y coordinate of the curved side 31A and the position of the maximum Y coordinate of the curved side 31B (shortest distance L1). It becomes.
- the distance between the curved sides 31A and 31B in the X-axis direction is the longest between the center of the curved side 31A and the center of the curved side 31B, and becomes shorter as the distance from the center of the curved sides 31A and 31B increases.
- the portion of the barrier conductor 3A that forms the shortest distance L1 is a protrusion when the barrier conductor 3A is viewed from above.
- the portion of the barrier conductor 3B that forms the shortest distance L1 is a protrusion when the barrier conductor 3B is viewed from above.
- the gap region 15 surrounded by the curved sides 31A and 31B is arranged so as to secure a specific distance from the center of the gap region 15.
- the adhesive 4 is applied to the center of the gap region 15, which is a circular region, by an arbitrary method.
- the center of the gap region 15 is the center of the region on which the electronic component 5 is mounted.
- the curved sides 31A and 31B are not limited to arcs, but may be curves such as elliptical arcs. Further, instead of the curved sides 31A and 31B, a side shape in which the sides of a plurality of straight lines are connected may be used. In this case, a plurality of sides are arranged along the curve.
- FIG. 3 is a diagram showing a state in which electronic components are mounted on the printed wiring board of FIG.
- the electronic component 5 is a surface mount component mounted on the surface of the printed wiring board 1X.
- the chip-shaped electronic component 5 has a rectangular upper surface having two sides extending in the X-axis direction and two sides extending in the Y-axis direction.
- the electronic component 5 is provided with an electrode 51A soldered to the electrode pad 2A of the printed wiring board 1X and an electrode 51B soldered to the electrode pad 2B of the printed wiring board 1X.
- the electrode 51A is arranged at one end, and the electrode 51B is arranged at the other end.
- the surface of the central portion 55 sandwiched between the electrodes 51A and 51B is formed of an insulating member.
- the electronic component 5 is composed of a central portion 55 whose surface is formed of an insulating member and electrodes 51A and 51B arranged at positions facing each other via the central portion 55.
- the distance between the electrodes which is the distance between the electrodes 51A and 51B, is the distance M1 between the electrodes. That is, the distance (dimension) of the central portion 55 in the X-axis direction in FIG. 3 is the distance between electrodes M1.
- At least a part of the electrode 51A overlaps the electrode pad 2A, at least a part of the electrode 51B overlaps the electrode pad 2B, at least a part of the electrode 51A overlaps the adhesive 4, and at least a part of the electrode 51B. Is placed on the printed wiring board 1X so as to overlap the adhesive 4.
- the longest distance L2 of the barrier conductors 3A and 3B is equal to or greater than the distance between electrodes M1.
- the adhesive 4 is spread by the electronic component 5.
- the barrier conductors 3A and 3B have dimensions and shapes such that the curved sides 31A and 31B can be covered by the electronic component 5.
- the electronic component 5 is arranged on the barrier conductors 3A and 3B so that the curved sides 31A and 31B are covered by the electronic component 5. That is, the electronic component 5 is arranged so that the locations where the shortest distance L1 and the longest distance L2 of the barrier conductors 3A and 3B are within the outer range of the electronic component 5.
- the printed wiring board 1X is provided with a through hole, and an insertion component (not shown) is inserted into the through hole from the back surface side of the printed wiring board 1X.
- the insert parts will be described later.
- the printed wiring board 1X has an electrode pad 2A (first electrode pad) soldered to the electrode 51A (first electrode) of the electronic component 5 and an electrode 51B (second electrode) of the electronic component 5. ),
- the barrier conductor 3A and the barrier conductor 3B are arranged at positions facing each other with a gap region 15 (adhesive region) in which the adhesive 4 is arranged when the electronic component 5 is adhered, and the electrode pad 2A is provided.
- the electrodes 51A and 51B are arranged so as to face the gap region 15 via the barrier conductor 3A and the electrode pad 2B to face the gap region 15 via the barrier conductor 3B.
- FIG. 4 is a diagram for explaining the state of the adhesive when the electronic component is removed from the printed wiring board of FIG.
- the adhesive 4 spread by the electronic component 5
- the adhesive 4 spreads within the gap region 15. Since the barrier conductors 3A and 3B are formed on the outside of the gap region 15, the spread of the adhesive 4 is suppressed by the barrier conductors 3A and 3B and does not reach the electrode pads 2A and 2B.
- the adhesive 4 expanded by the electronic component 5 and suppressed by the barrier conductors 3A and 3B becomes the crushed adhesive 40.
- Jet soldering (flow soldering) is performed on the printed wiring board 1X on which the electronic component 5 and the insertion component are arranged.
- FIG. 5 is a diagram showing a state of being soldered to the printed wiring board of FIG.
- FIG. 5 shows a side view of the printed wiring board 1X.
- the illustration of the insertion component inserted into the through hole is omitted.
- the adhesive 4 is applied to the printed wiring board 1X, the electronic component 5 is mounted on the adhesive 4, and then the insertion component is inserted.
- the printed wiring board 1X is put into a jet soldering apparatus 6 for jet soldering.
- the jet soldering apparatus 6 jet solders the printed wiring board 1X by ejecting molten solder 7 from the jet outlet. In this way, the jet soldering apparatus 6 solders by immersing the electronic component 5 temporarily fixed with the adhesive 4 in the molten solder 7.
- FIG. 6 is a diagram showing the configuration of the printed wiring board after soldering to the printed wiring board of FIG.
- FIG. 6 shows a cross-sectional view taken along the line AA of the printed wiring board 1X shown in FIG. Since the printed wiring board 1X is jet-soldered, the electrode 51A of the electronic component 5 and the electrode pad 2A of the printed wiring board 1X are joined by the solder 8A. Further, the electrode 51B of the electronic component 5 and the electrode pad 2B of the printed wiring board 1X are joined by the solder 8B.
- the crushed adhesive 40 spreads to the barrier conductors 3A and 3B, so that solder is not bonded to the electrode ends 57A and 57B.
- the electrode end 57A is the boundary between the central position of the barrier conductor 3A and the central portion 55
- the electrode end 57B is the boundary between the central position of the barrier conductor 3B and the central portion 55.
- the electrode pads 2A and 2B and the barrier conductors 3A and 3B connected to the electrode pads 2A and 2B are formed on the surface of the printed wiring board 1X.
- the longest distance L2 between the barrier conductors 3A and 3B is equal to or greater than the distance M1 between the electrodes of the electronic component 5 to be mounted later.
- the adhesive 4 is applied to the center between the electrode pads 2A and 2B on the printed wiring board 1X, and the electronic component 5 is mounted directly above the adhesive 4. As a result, the adhesive 4 is spread and becomes a crushed adhesive 40. Since the crushed adhesive 40 is prevented from flowing into the electrode pads 2A and 2B by the barrier conductors 3A and 3B, it does not hinder the subsequent soldering.
- the crushed adhesive 40 does not hinder the bonding of the solder 8A between the barrier conductor 3A and the electrode pad 2A, and does not hinder the bonding of the solder 8B between the barrier conductor 3B and the electrode pad 2B.
- the barrier conductors 3A and 3B prevent the soldering (metal bonding) from being hindered, so that the soldering quality of the printed wiring board 1X can be prevented from deteriorating.
- the adhesive 4 adheres to the electrode ends 57A and 57B on the bottom surface of the electronic component 5. Therefore, as shown in FIG. 6, the solders 8A and 8B are not adhered to the electrode ends 57A and 57B. As a result, even if the printed wiring board 1X is distorted after soldering, it is possible to prevent cracks from entering the inside of the electronic component 5 starting from the electrode ends 57A and 57B on the bottom surface of the electronic component 5.
- the portion forming the shortest distance L1 (the first portion in the barrier conductor 3A and the second portion in the barrier conductor 3B) is within the outer range (within the bottom range) of the electronic component 5. It is arranged like.
- the first portion of the barrier conductor 3A is a protrusion-like region when the barrier conductor 3A is viewed from the upper surface side
- the second portion of the barrier conductor 3B is a protrusion when the barrier conductor 3B is viewed from the upper surface side. It is a shaped area.
- the protruding region forming the shortest distance L1 and the electrodes 51A and 51B of the electronic component 5 can be easily overlapped.
- the protruding region forming the shortest distance L1 of the barrier conductors 3A and 3B is a region firmly joined to the electrodes 51A and 51B. Therefore, by setting the protruding region forming the shortest distance L1 within the outer range of the electronic component 5, the electrode 51A and the barrier conductor 3A are firmly joined, and the electrode 51B and the barrier conductor 3B are firmly bonded. Be joined.
- the electrode of the electronic component will come off from the electrode pad of the printed wiring board, and soldering will not be possible. ..
- the strain generated in the printed wiring board after soldering may cause cracks inside the electronic component starting from the electrode end on the bottom surface of the electronic component. ..
- the minimum distance between the conductor and the non-conductor in the printed wiring board (line and). It becomes difficult to keep the constraint of space).
- the electrode pads are likely to be short-circuited via the barrier pattern. Therefore, the soldering quality is lowered and the insulation reliability is lowered.
- FIG. 7 is a diagram showing a configuration of an electronic device provided with a printed wiring board according to the first embodiment.
- the printed wiring board 1X shown in FIG. 6 is mounted on the electronic device 100.
- the electronic component 5 and the insertion component are solder-bonded to the printed wiring board 1X included in the electronic device 100.
- the barrier conductor 3A connected to the electrode pad 2A and the electrode pad 2A and the barrier conductor connected to the electrode pad 2B and the electrode pad 2B are connected between the electrode pads 2A and 2B on the printed wiring board 1X. 3B and 3B are formed.
- the electrode pads 2A and 2B can suppress the spread of the adhesive 4.
- a wide gap region 15 can be secured, a short circuit between the electrode pads 2A and 2B can be prevented. Therefore, it is possible to suppress the spread of the adhesive 4 while preventing a short circuit between the electrode pads 2A and 2B.
- Embodiment 2 Next, a second embodiment of the present invention will be described with reference to FIG.
- the barrier for preventing the adhesive 4 from sticking out is raised by forming the resin on the upper surfaces of the barrier conductors 3A and 3B.
- FIG. 8 is a top view showing the configuration of the printed wiring board according to the second embodiment.
- components that achieve the same functions as the printed wiring board 1X of the first embodiment shown in FIG. 1 are designated by the same reference numerals, and redundant description will be omitted.
- the resin 9A is formed on the barrier conductor 3A and the resin 9B is formed on the barrier conductor 3B as compared with the printed wiring board 1X.
- the resin 9A is superposed on the center of the upper surface of the barrier conductor 3A
- the resin 9B is superposed on the center of the upper surface of the barrier conductor 3B. That is, the resins 9A and 9B are arranged at positions forming the longest distance L2 on the upper surfaces of the barrier conductors 3A and 3B.
- the resin 9A may be overlapped on the entire upper surface of the barrier conductor 3A or may be overlapped on a part thereof.
- the resin 9B may be overlapped on the entire upper surface of the barrier conductor 3B or may be overlapped on a part thereof.
- Resins 9A and 9B are auxiliary materials used when the printed wiring board 1Y is manufactured. Examples of the resins 9A and 9B are solder resist and symbol printing ink. The resins 9A and 9B may be laminated only once or may be laminated a plurality of times.
- the resin 9A and 9B are arranged at the positions forming the longest distance L2 of the barrier conductors 3A and 3B, so that the height of the barrier is increased. Therefore, the effect of preventing the crushed adhesive 40 from entering the electrode pads 2A and 2B is higher than that of the printed wiring board 1X.
- the method of applying the adhesive 4 in the first and second embodiments is a method of transferring the adhesive 4 via a metal mask with a printing machine as in the case of solder paste printing, and a method of transferring the adhesive 4 with an adhesive coating machine via a nozzle.
- a method of transferring the adhesive 4 and a method of ejecting the adhesive 4 onto the printed wiring boards 1X and 1Y with a jet dispenser and applying the adhesive are a method of transferring the adhesive 4 via a metal mask with a printing machine as in the case of solder paste printing, and a method of transferring the adhesive 4 with an adhesive coating machine via a nozzle.
- the printed wiring boards 1X and 1Y used in the first and second embodiments are made of a material having an insulating property, for example, a glass woven fabric, a glass non-woven fabric, a paper base material, or an epoxy resin, a polyimide resin, or a phenol resin.
- An impregnated substrate is used.
- the material of the molten solder 7 used in the first and second embodiments contains, for example, 3% by mass Ag (silver) and 0.5% by mass Cu (copper), and the balance is Sn (tin) and unavoidable impurities. It is possible to use a certain solder alloy (Sn-3Ag-0.5Cu).
- the material of the molten solder 7 is not limited to this, and is Sn—Cu solder, Sn—Bi (bismuth) solder, Sn—In (indium) solder, Sn—Sb (antimon) solder, Sn. -Pb (lead) -based solder may be used.
- the barrier for preventing the adhesive 4 from sticking out becomes high.
- the effect of preventing the adhesive 4 from entering the electrode pads 2A and 2B can be enhanced.
- the effect of preventing the solders 8A and 8B from entering the electrode ends 57A and 57B can be enhanced.
- the configuration shown in the above-described embodiment shows an example of the content of the present invention, can be combined with another known technique, and is one of the configurations without departing from the gist of the present invention. It is also possible to omit or change the part.
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Abstract
Description
図1は、実施の形態1にかかるプリント配線板の構成を示す上面図である。図2は、図1のプリント配線板に接着剤を塗布した状態を示す図である。図1、図2および後述する図3、図4、図8では、紙面の横右方向をX軸方向、紙面の縦方向をY軸方向、紙面に垂直な方向をZ軸方向としてプリント配線板1Xの構成を説明する。
つぎに、図8を用いてこの発明の実施の形態2について説明する。実施の形態2では、障壁導体3A,3Bの上面に樹脂を形成しておくことによって、接着剤4のはみ出しを防止するための障壁を高くする。
Claims (8)
- 電子部品の第1の電極にはんだ付けされる第1の電極パッドと、
前記電子部品の第2の電極にはんだ付けされる第2の電極パッドと、
前記第1の電極パッドに繋がっている第1の障壁導体と、
前記第2の電極パッドに繋がっている第2の障壁導体と、
を備え、
前記第1の障壁導体と前記第2の障壁導体とは、前記電子部品を接着する際に接着剤が配置される接着剤領域を挟んで対向する位置に配置され、且つ前記第1の電極パッドが前記第1の障壁導体を介して前記接着剤領域に対向し、前記第2の電極パッドが前記第2の障壁導体を介して前記接着剤領域に対向するよう、前記第1の電極パッドおよび前記第2の電極パッドが配置されているプリント配線板。 - 前記第1の障壁導体および前記第2の障壁導体は、
前記接着剤領域の周りの一部を囲うよう配置されている、
請求項1に記載のプリント配線板。 - 前記第1の電極パッドと前記第2の電極パッドとが並ぶ方向における前記第1の障壁導体と前記第2の障壁導体との間で最長距離をなす箇所の前記最長距離は、前記第1の電極と前記第2の電極との間の距離である電極間距離以上である、
請求項1または2に記載のプリント配線板。 - 前記第1の障壁導体のうち、前記第1の電極パッドと前記第2の電極パッドとが並ぶ方向における前記第1の障壁導体と前記第2の障壁導体との間で最短距離をなす第1の箇所、および前記第2の障壁導体のうち、前記第1の電極パッドと前記第2の電極パッドとが並ぶ方向における前記第1の障壁導体と前記第2の障壁導体との間で最短距離をなす第2の箇所は、前記電子部品が搭載された場合に、前記電子部品の底面範囲内に収まる、
請求項1から3の何れか1つに記載のプリント配線板。 - 前記第1の障壁導体の上面および前記第2の障壁導体の上面に樹脂が形成されている、
請求項1から4の何れか1つに記載のプリント配線板。 - 前記樹脂は、ソルダレジストまたはシンボル印刷インクである、
請求項5に記載のプリント配線板。 - 前記第1の障壁導体は、前記第1の電極パッドと同じ導体で前記第1の電極パッドと一体形成されており、前記第2の障壁導体は、前記第2の電極パッドと同じ導体で前記第2の電極パッドと一体形成されている、
請求項1から6の何れか1つに記載のプリント配線板。 - 請求項1から7の何れか1つに記載のプリント配線板を有する電子機器。
Priority Applications (6)
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US17/419,813 US11818840B2 (en) | 2019-03-25 | 2019-03-25 | Printed wiring board and electronic device |
JP2021508415A JP7069404B2 (ja) | 2019-03-25 | 2019-03-25 | プリント配線板および電子機器 |
CN201980092715.5A CN113574657A (zh) | 2019-03-25 | 2019-03-25 | 印刷布线板以及电子设备 |
AU2019436797A AU2019436797B2 (en) | 2019-03-25 | 2019-03-25 | Printed wiring board and electronic device |
PCT/JP2019/012459 WO2020194440A1 (ja) | 2019-03-25 | 2019-03-25 | プリント配線板および電子機器 |
DE112019007091.6T DE112019007091T5 (de) | 2019-03-25 | 2019-03-25 | Platine und elektronisches Gerät |
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PCT/JP2019/012459 WO2020194440A1 (ja) | 2019-03-25 | 2019-03-25 | プリント配線板および電子機器 |
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WO2020194440A1 true WO2020194440A1 (ja) | 2020-10-01 |
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PCT/JP2019/012459 WO2020194440A1 (ja) | 2019-03-25 | 2019-03-25 | プリント配線板および電子機器 |
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US (1) | US11818840B2 (ja) |
JP (1) | JP7069404B2 (ja) |
CN (1) | CN113574657A (ja) |
AU (1) | AU2019436797B2 (ja) |
DE (1) | DE112019007091T5 (ja) |
WO (1) | WO2020194440A1 (ja) |
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JPH07201634A (ja) * | 1993-12-28 | 1995-08-04 | Tdk Corp | セラミックチップ部品 |
JP2007305904A (ja) * | 2006-05-15 | 2007-11-22 | Fdk Corp | 電極端子の固定構造およびその固定方法 |
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JPS58175668A (ja) | 1982-04-08 | 1983-10-14 | Masayuki Sato | 交流電界による均一液滴の同期生成方式 |
JPS58175668U (ja) | 1982-05-19 | 1983-11-24 | 松下電器産業株式会社 | 印刷配線板 |
JPS59127267U (ja) | 1983-02-17 | 1984-08-27 | 沖電気工業株式会社 | プリント基板 |
JPH0837365A (ja) | 1994-07-25 | 1996-02-06 | Hitachi Telecom Technol Ltd | 表面実装プリント配線板の部品取付け構造 |
US6566611B2 (en) * | 2001-09-26 | 2003-05-20 | Intel Corporation | Anti-tombstoning structures and methods of manufacture |
US7645940B2 (en) * | 2004-02-06 | 2010-01-12 | Solectron Corporation | Substrate with via and pad structures |
TWI243462B (en) * | 2004-05-14 | 2005-11-11 | Advanced Semiconductor Eng | Semiconductor package including passive component |
US20070007323A1 (en) * | 2005-07-06 | 2007-01-11 | International Business Machines Corporation | Standoff structures for surface mount components |
JP2008227183A (ja) * | 2007-03-13 | 2008-09-25 | Fujitsu Ltd | プリント基板ユニットおよびプリント配線板 |
JP2012209594A (ja) * | 2012-07-19 | 2012-10-25 | Toshiba Corp | プリント配線板 |
US11162708B2 (en) * | 2015-11-16 | 2021-11-02 | Genie Enterprise Ltd. | Apparatus for rapid heating of liquids |
US20170280565A1 (en) * | 2016-03-24 | 2017-09-28 | BOT Home Automation, Inc. | Jumpers for pcb design and assembly |
JP7041477B2 (ja) * | 2017-07-05 | 2022-03-24 | 新光電気工業株式会社 | 導電性ボール及び電子装置とそれらの製造方法 |
-
2019
- 2019-03-25 CN CN201980092715.5A patent/CN113574657A/zh active Pending
- 2019-03-25 WO PCT/JP2019/012459 patent/WO2020194440A1/ja active Application Filing
- 2019-03-25 JP JP2021508415A patent/JP7069404B2/ja active Active
- 2019-03-25 US US17/419,813 patent/US11818840B2/en active Active
- 2019-03-25 AU AU2019436797A patent/AU2019436797B2/en active Active
- 2019-03-25 DE DE112019007091.6T patent/DE112019007091T5/de active Pending
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JPS63127171U (ja) * | 1987-02-10 | 1988-08-19 | ||
JPH07201634A (ja) * | 1993-12-28 | 1995-08-04 | Tdk Corp | セラミックチップ部品 |
JP2007305904A (ja) * | 2006-05-15 | 2007-11-22 | Fdk Corp | 電極端子の固定構造およびその固定方法 |
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US20220087018A1 (en) | 2022-03-17 |
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AU2019436797A1 (en) | 2021-07-22 |
DE112019007091T5 (de) | 2021-12-16 |
US11818840B2 (en) | 2023-11-14 |
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JPWO2020194440A1 (ja) | 2021-11-18 |
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