WO2020147589A8 - 一种新型led芯片封装制作方法 - Google Patents
一种新型led芯片封装制作方法 Download PDFInfo
- Publication number
- WO2020147589A8 WO2020147589A8 PCT/CN2020/070052 CN2020070052W WO2020147589A8 WO 2020147589 A8 WO2020147589 A8 WO 2020147589A8 CN 2020070052 W CN2020070052 W CN 2020070052W WO 2020147589 A8 WO2020147589 A8 WO 2020147589A8
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- led
- manufacturing
- chip array
- substrate
- chip
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 8
- 239000000758 substrate Substances 0.000 abstract 4
- 238000009413 insulation Methods 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 3
- 229920002120 photoresistant polymer Polymers 0.000 abstract 3
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- 238000005530 etching Methods 0.000 abstract 1
- 230000008020 evaporation Effects 0.000 abstract 1
- 238000001704 evaporation Methods 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 238000000206 photolithography Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- 238000004544 sputter deposition Methods 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
本发明提供一种新型LED芯片封装制作方法,将芯片再分布制作成阵列芯片、在阵列芯片电极面制作过渡隔离光刻胶层(或其他感光材料),采用金属作为基板或在远离阵列芯片过渡隔离光刻胶层面上制作金属层作为基板,通过金属基板对应芯片电极区域光刻,蚀刻制作通孔,通过基板通孔曝光、显影阵列芯片上的过渡隔离光刻胶层(或其他感光材料),然后采用锡膏、导电浆料或者溅射、蒸发镀膜、化学镀膜等焊接技术,对阵列分布的芯片进行电极焊接和封装,制作成带电路结构的封装器件,可以制作各类LED照明器件、模组、LED显示尤其是小间距显示屏、Mini LED、Micro LED显示面板或模组。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910035939.4A CN109817769B (zh) | 2019-01-15 | 2019-01-15 | 一种新型led芯片封装制作方法 |
CN201910035939.4 | 2019-01-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2020147589A1 WO2020147589A1 (zh) | 2020-07-23 |
WO2020147589A8 true WO2020147589A8 (zh) | 2021-09-16 |
Family
ID=66603814
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2020/070052 WO2020147589A1 (zh) | 2019-01-15 | 2020-01-02 | 一种新型led芯片封装制作方法 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN109817769B (zh) |
WO (1) | WO2020147589A1 (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109817769B (zh) * | 2019-01-15 | 2020-10-30 | 申广 | 一种新型led芯片封装制作方法 |
CN113054072A (zh) * | 2020-02-28 | 2021-06-29 | 深圳市聚飞光电股份有限公司 | Led芯片单元、led器件及其制作方法 |
CN113471347A (zh) * | 2021-05-14 | 2021-10-01 | 南通越亚半导体有限公司 | Led嵌埋封装基板及其制造方法 |
CN115472547A (zh) * | 2021-06-11 | 2022-12-13 | 京东方科技集团股份有限公司 | 载板及其制备方法、转移基板及其制备方法 |
CN113937126A (zh) * | 2021-10-15 | 2022-01-14 | 福州大学 | 基于Micro-LED芯片键合技术的车载透明显示器件及其制备方法 |
CN114627773B (zh) * | 2022-03-11 | 2024-02-20 | 武汉华星光电半导体显示技术有限公司 | 拼接显示面板 |
CN115172403B (zh) * | 2022-08-02 | 2024-05-17 | 江西兆驰半导体有限公司 | 一种Micro LED的封装方法 |
CN115891000B (zh) * | 2022-10-28 | 2023-08-25 | 宜兴曲荣光电科技有限公司 | Led芯片封装用的自动化机电加工装置及使用方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101521992A (zh) * | 2008-02-29 | 2009-09-02 | 富葵精密组件(深圳)有限公司 | 于电路基板的焊点形成预焊料的方法及覆晶封装方法 |
CN102117867A (zh) * | 2010-10-15 | 2011-07-06 | 陈林 | Led散热基板的制作方法 |
CN102740593A (zh) * | 2012-07-12 | 2012-10-17 | 惠州智科实业有限公司 | 一种led散热用线路板及其制造方法 |
CN103681371A (zh) * | 2013-12-26 | 2014-03-26 | 江阴长电先进封装有限公司 | 一种硅基圆片级扇出封装方法及其封装结构 |
CN103730431B (zh) * | 2014-01-07 | 2018-08-17 | 宝钢金属有限公司 | 一种大功率阵列led芯片表面散热结构及制作方法 |
JP6031059B2 (ja) * | 2014-03-31 | 2016-11-24 | 信越化学工業株式会社 | 半導体装置、積層型半導体装置、封止後積層型半導体装置、及びこれらの製造方法 |
CN105023900A (zh) * | 2015-08-11 | 2015-11-04 | 华天科技(昆山)电子有限公司 | 埋入硅基板扇出型封装结构及其制造方法 |
CN105161436B (zh) * | 2015-09-11 | 2018-05-22 | 柯全 | 倒装芯片的封装方法 |
CN105449071B (zh) * | 2015-12-31 | 2018-11-16 | 鸿利智汇集团股份有限公司 | 芯片级封装led成型方法及芯片级封装led |
CN105449080B (zh) * | 2015-12-31 | 2018-08-28 | 鸿利智汇集团股份有限公司 | 用正装芯片成型csp led的方法和成型倒装芯片的方法及csp led |
US9704907B1 (en) * | 2016-04-08 | 2017-07-11 | Raytheon Company | Direct read pixel alignment |
CN108807352B (zh) * | 2017-05-03 | 2020-07-14 | 申广 | 一种新型led灯丝制作方法 |
CN107275463A (zh) * | 2017-05-22 | 2017-10-20 | 申广 | 一种新型led封装制作技术 |
CN108008598B (zh) * | 2017-11-30 | 2021-07-02 | Tcl华星光电技术有限公司 | 压印模板的制造方法 |
CN109065459A (zh) * | 2018-07-27 | 2018-12-21 | 大连德豪光电科技有限公司 | 焊盘的制作方法 |
CN109817769B (zh) * | 2019-01-15 | 2020-10-30 | 申广 | 一种新型led芯片封装制作方法 |
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2019
- 2019-01-15 CN CN201910035939.4A patent/CN109817769B/zh active Active
-
2020
- 2020-01-02 WO PCT/CN2020/070052 patent/WO2020147589A1/zh active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN109817769B (zh) | 2020-10-30 |
WO2020147589A1 (zh) | 2020-07-23 |
CN109817769A (zh) | 2019-05-28 |
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