WO2020147212A1 - Led显示屏模组及显示装置 - Google Patents

Led显示屏模组及显示装置 Download PDF

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Publication number
WO2020147212A1
WO2020147212A1 PCT/CN2019/083054 CN2019083054W WO2020147212A1 WO 2020147212 A1 WO2020147212 A1 WO 2020147212A1 CN 2019083054 W CN2019083054 W CN 2019083054W WO 2020147212 A1 WO2020147212 A1 WO 2020147212A1
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WIPO (PCT)
Prior art keywords
led display
metal layer
light
emitting diodes
display module
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Ceased
Application number
PCT/CN2019/083054
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English (en)
French (fr)
Inventor
王振岭
黄泰钧
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Application filed by Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Publication of WO2020147212A1 publication Critical patent/WO2020147212A1/zh
Anticipated expiration legal-status Critical
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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]

Definitions

  • This application relates to the field of display technology, and in particular to an LED display screen module and a display device.
  • LED Light-Emitting Diode
  • LED has the characteristics of long service life, low cost, high brightness, large viewing angle, and long viewing distance. It can meet the needs of various application scenarios and is recognized as having the most growth potential and development
  • the fastest display device especially the small-pitch LED display with a dot pitch of 3mm or less.
  • the smaller the pixel pitch means the higher the pixel density per unit area, the brighter the color, the higher the resolution, the inability to splice, and the super silent, etc.
  • the market demand is increasing.
  • the prior art LED display screen has the problem that it cannot be displayed transparently.
  • the LED display module and display device provided by the present application solve the problem that the prior art LED display cannot be transparently displayed by adding a light emitting layer in two layers of glass.
  • An embodiment of the present application provides an LED display screen module, which includes a connector and a first glass substrate disposed above the connector;
  • a plurality of driving chips are arranged above the first glass substrate at intervals, and the driving chips include scan line pins, data line pins, and control signal pins, and the control signal pins are connected to the ⁇ ;
  • An insulating layer is disposed above the first glass substrate and wraps the driving chip
  • a plurality of light-emitting diodes are arranged above the insulating layer at intervals, the light-emitting diodes include a cathode and an anode, the scan line pin is electrically connected to the cathode, and the data line pin is connected to the anode Electrically connected, the driving chip is used to control the light emitting diode;
  • the second glass substrate is arranged on the plurality of light emitting diodes.
  • the LED display screen module further includes a first metal layer and a second metal layer;
  • the first metal layer is disposed between the plurality of light emitting diodes and the insulating layer;
  • the second metal layer is disposed between the plurality of driving chips and the connector.
  • the scan line pin is led to the first metal layer, and is electrically connected to the cathode through the first metal layer;
  • the data line pin It is led to the first metal layer, and is electrically connected to the anode through the first metal layer.
  • control signal pin is led out to the second metal layer, and is electrically connected to the connector through the second metal layer.
  • the material of the insulating layer is a transparent material, and the transparent material includes phenylene polyimide or biphenyl polyimide.
  • the light-emitting diodes are three-primary-color, double-primary-color or single-primary-color light-emitting diodes, and the distance between the light-emitting diodes is less than or equal to 3 mm.
  • the connector is connected to the LED driving system and is used to realize the screen display effect of the LED display module.
  • the length or width of the connector is less than or equal to 3 mm.
  • the present application also provides an LED display screen module, which includes a connector and a first glass substrate arranged above the connector;
  • a plurality of driving chips are arranged above the first glass substrate at intervals, and the driving chips include scan line pins, data line pins, and control signal pins, and the control signal pins are connected to the ⁇ ;
  • An insulating layer arranged above the first glass substrate and wrapping the driving chip, wherein the material of the insulating layer is a transparent material;
  • a plurality of light-emitting diodes are arranged above the insulating layer at intervals, the light-emitting diodes include a cathode and an anode, the scan line pin is electrically connected to the cathode, and the data line pin is connected to the anode Electrically connected, the driving chip is used to control the light-emitting diode, wherein the light-emitting diode is a three-primary color or a dual-primary color or a single-primary color light-emitting diode;
  • the second glass substrate is arranged on the plurality of light emitting diodes.
  • the LED display module further includes a first metal layer and a second metal layer;
  • the first metal layer is disposed between the plurality of light emitting diodes and the insulating layer;
  • the second metal layer is disposed between the plurality of driving chips and the connector.
  • the scan line pins are led out to the first metal layer, and are electrically connected to the cathode through the first metal layer; the data line pins are led out to The first metal layer is electrically connected to the anode through the first metal layer.
  • control signal pin is led out to the second metal layer, and is electrically connected to the connector through the second metal layer.
  • the connector is connected to the LED driving system for realizing the screen display effect of the LED display module.
  • the length or width of the connector is less than or equal to 3 mm.
  • the transparent material includes phenylene polyimide or biphenyl polyimide.
  • the distance between the light-emitting diodes is less than or equal to 3 mm.
  • An embodiment of the application also provides a display device, the display device includes at least two LED display screen modules, the LED display screen modules are spliced to form a whole; the LED display screen module includes: a connector and A first glass substrate arranged above the connector;
  • a plurality of driving chips are arranged above the first glass substrate at intervals, and the driving chips include scan line pins, data line pins, and control signal pins, and the control signal pins are connected to the ⁇ ;
  • An insulating layer is disposed above the first glass substrate and wraps the driving chip
  • a plurality of light-emitting diodes are arranged above the insulating layer at intervals, the light-emitting diodes include a cathode and an anode, the scan line pin is electrically connected to the cathode, and the data line pin is connected to the anode Electrically connected, the driving chip is used to control the light emitting diode;
  • the second glass substrate is arranged on the plurality of light emitting diodes.
  • the connector is disposed in the top corner area of the lower surface of the first glass substrate. In two adjacent LED display modules, the connector is located The top corner areas are spliced with each other.
  • This application proposes a small-pitch LED display module, so that the light-emitting diodes of the LED display module are arranged between two glass substrates, so as to realize the transparent display effect of the LED display module and reduce the area of unrealistic areas.
  • Figure 1 is a cross-sectional structure diagram of an LED display module provided by the implementation of this application.
  • FIG. 2 is a schematic diagram of the pixel arrangement of the display area of the display device provided by this embodiment.
  • FIG. 3 is a schematic diagram of a non-display area arrangement of a display device provided by an embodiment of the application.
  • the LED display screen module includes: a connector 1 and a first glass substrate 21 disposed above the connector 1;
  • the insulating layer 4 is disposed above the first glass substrate 21 and wraps the driving chip 3;
  • a plurality of light emitting diodes 5 are arranged above the insulating layer 4, the light emitting diodes 5 are arranged above the insulating layer 4 at intervals, the light emitting diodes 5 include a cathode and an anode (not shown in the figure), and the scanning
  • the wire pin is electrically connected to the cathode, and the data wire pin is electrically connected to the anode, wherein the driving chip 3 is used to control the light emitting diode 5;
  • the second glass substrate 22 is arranged on the plurality of light emitting diodes 5.
  • first glass substrate 21 and the second glass substrate 22 together constitute a glass substrate 2 for packaging the LED display module provided by the embodiment of the present application.
  • first glass substrate 21 and the second glass substrate 22 generally select a polyimide film (Polyimide Film, PI for short) as a base.
  • Polyimide film is currently the world’s best-performing film insulating material. It has strong tensile strength. It consists of pyromellitic dianhydride and diaminodiphenyl ether in a strong polar solvent through polycondensation and co-current flow. The extended film is then formed by imidization.
  • the drive chip 3 is an unpackaged drive chip, that is, a wafer, which is arranged above the first glass substrate 21 and is electrically connected to the connector 1, and the drive chip 3 is electrically connected through a uniformly distributed wafer
  • the light emitting diode 5 is connected, wherein the driving chip is used to drive and control the plurality of light emitting diodes 5.
  • a connector 1 is provided at the lower end of the first glass substrate 21.
  • the LED display module provided in the present application is The distance between the light emitting diodes 5 is smaller, and the yield rate is high.
  • the LED display module further includes a first metal layer and a second metal layer (not shown in the figure), and the first metal layer is disposed between the plurality of light-emitting diodes and the insulating layer
  • the second metal layer is arranged between the plurality of driving chips and the connector; the arrangement of the first metal layer and the second metal layer makes the internal wiring of the LED display module tend to be regular
  • the scan line pins and the data line pins are arranged alternately, further reducing the thickness of the LED display module.
  • the driving chip includes scan line pins, data line pins, and control signal pins.
  • the number of scan lines and data line pins is three or more.
  • the scan line pins and data lines The line pins are arranged alternately; the scan line pins are led out to the first metal layer, and are electrically connected to the cathode of the light emitting diode through the first metal layer; the data line pins are led out to the first metal layer A metal layer is electrically connected to the anode of the light emitting diode through the first metal layer.
  • the control signal pin is led out to the second metal layer, and is electrically connected to the connector through the second metal layer.
  • the LED display module greatly shortens the product development cycle compared with the existing technology of the LED display module structure, and is convenient to maintain, and the maintenance cost of the LED display of the prior art is extremely large. Reduced. In this application, if the LED display module fails and needs to be repaired, only the faulty LED display module needs to be removed for repair. When the fault cannot be repaired and needs to be replaced, the theoretical cost is only for the existing technology. The maintenance cost is very small. section.
  • the small-pitch LED pixel wafers of the light-emitting diodes 5 are transferred to the first glass substrate 21 and the second glass substrate 22 by means of solid gold, and the solid gold method is a fixing method, which can reduce wiring problems. It is messy and convenient for future maintenance; at the same time, the connector is transferred to the glass substrate in the same way and connected to the drive system to achieve the screen display effect. Due to the small size of the LED display module, the glass substrate The free area is transparent, which facilitates the production of transparent display effects.
  • the light-emitting layer includes LED pixel wafers, and the distance between the light-emitting diodes is less than or equal to 3 mm; the light-emitting diodes are three-primary-color or double-primary-color or single-primary-color light-emitting diodes.
  • the driver chip is an unpackaged driver chip, that is, a wafer, which together constitute a driver chip.
  • the wafer is a silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a crystal. Round; can be processed into various circuit element structures on silicon wafers, and become IC products with specific electrical functions.
  • the original material of the wafer is silicon, and there is inexhaustible silicon dioxide on the surface of the earth's crust.
  • the silicon dioxide ore is refined by an electric arc furnace, chlorinated with hydrochloric acid, and distilled to produce high-purity polysilicon wafers with a purity of 99.999999999%.
  • the insulating layer is made of a transparent material, and the transparent material includes phenylene polyimide or biphenyl polyimide.
  • this figure is a schematic diagram of the pixel arrangement of the display surface of the display device provided by this embodiment.
  • the display device includes the LED display module provided by the embodiment of the present application, and the LED display The screen modules are spliced to form a whole.
  • the light emitting diode 5 is in the form of a pixel wafer.
  • the light emitting diode includes an R light emitting diode 51, a G light emitting diode 52, and a B light emitting diode 53.
  • the R light emitting diode 51, the G light emitting diode 52 and the B light emitting diode 53 together constitute an LED display
  • this figure is a schematic diagram of the arrangement of the non-display area driving chip 3 and the connector 1 of the display device provided by the embodiment of the application, and the connector 1 is arranged on the top of the lower surface of the first glass substrate 21.
  • the LED display screen modules are spliced to form the display device, and the top corner areas where the connector 1 is located are spliced with each other.
  • the top corner area includes at least one of the four corners of the LED display module, and the connector 1 is centrally arranged inside the entire display device.
  • the LED display screen modules are four or more even numbers, and the LED display screen modules are spliced to form the whole display device.
  • the connector 1 is placed as far as possible on the first glass substrate 21 and concentrated in the top corner area, so as to reduce the opaque area during splicing.
  • This embodiment also provides a drive architecture and method for an LED display screen module, the LED display screen module is connected to a drive system, and the drive system includes:
  • the system receives data from the Digital Visual Interface (DVI) interface;
  • DVI Digital Visual Interface
  • the data transmission signal is transmitted to a driving circuit, and the driving circuit drives the LED display screen module, and the LED display screen emits light.
  • the digital video interface data in the part of the differential signal that is to be transmitted, is transmitted to the LED module transmission system through the digital video decoding circuit; further, the transmission system includes two Data memory and field programmable gate array (Programmable Gate Array, FPGA) controller.
  • the sending system receives the digital video interface (Digital Visual Interface, referred to as DVI)
  • DVI Digital Visual Interface
  • the display system includes a pair of Ethernet transmitters and transformers.
  • the Ethernet transmitter receives DVI interface data from the sending system, the Ethernet transmitter transmits the DVI interface data to the transformer, Transmitted by the transformer, it becomes a differential signal, and then transmitted to the Ethernet transmitter through the transformer, and transmitted from the display system to the receiving circuit.
  • the receiving circuit includes a pair of data memories and an FPGA controller.
  • the differential signal When the receiving system receives a differential signal from the transmission part, the differential signal enters the FPGA controller for storage and processing, and transmits the data signal To the drive circuit.
  • the driving circuit drives the LED display module provided in the present application, and the light-emitting diode of the LED display module lights up.
  • the LED display module provided in the present application in conjunction with the LED driving method, requires a larger number of LED display modules due to the passive driving method.
  • All are made on the Print Circuit Board (PCB), which is convenient for splicing and cannot achieve the effect of transparent display;
  • the LED display module provided in this application is provided with multiple drive chips and connectors. Area, to achieve the transparent display effect of the LED display module, and reduce the area of the unrealistic area; the application proposes a driving method suitable for the LED display module provided in the embodiment of this application, and realizes the implementation of the transparent LED display module .
  • the beneficial effects are: a small-pitch LED display module is proposed, so that the light-emitting diodes of the LED display module are arranged between two glass substrates to realize the transparent display effect of the LED display module and reduce the area of unrealistic areas.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
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Abstract

一种LED显示屏模组，包括：连接器(1)以及设置于连接器(1)上方的第一玻璃基板(21)；多个驱动芯片(3)，驱动芯片(3)间隔设置于第一玻璃基板(21)上方；绝缘层(4)，设置于第一玻璃基板(21)上方并包裹驱动芯片(3)；多个发光二极管(5)，发光二极管(5)间隔设置于绝缘层(4)上方，驱动芯片(3)用于控制发光二极管(5)；第二玻璃基板(22)，设于多个发光二极管(5)上。

Description

LED显示屏模组及显示装置 技术领域
本申请涉及显示技术领域，尤其涉及一种LED显示屏模组及显示装置。
 背景技术
发光二极管（Light-Emitting Diode，简称LED）使用寿命长、成本低、亮度高、视角大、可视距离远等特点，可以满足各种不同应用场景的需求，被公认为最具有增长潜力也是发展最快的显示设备，特别是点间距为3mm以下的小间距LED显示屏。对于LED显示屏而言，其像素间距越小意味着单位面积内的像素密度越高，色彩越艳丽、分辨率越高、无法拼接和超强静音等优点，市场需求量日益增加。
现有市面上的LED显示屏，由于驱动方式为被动式，需要的驱动(Driver IC)数量较多，均为在印刷线路板(Print Circuit Board,简称PCB)板上进行制作，这样便于拼接，但无法实现透明显示的效果。
 技术问题
现有技术的LED显示屏存在无法透明显示的问题。
 技术解决方案
本申请提供的LED显示屏模组及显示装置，通过增加在两层玻璃中放置放光层，解决了现有技术的LED显示屏的无法透明显示的问题。
本申请提供的技术方案如下：
本申请实施例提供一种LED显示屏模组，所述LED显示屏模组包括：连接器以及设置于所述连接器上方的第一玻璃基板；
多个驱动芯片，所述驱动芯片间隔设置于所述第一玻璃基板上方，所述驱动芯片包括扫描线引脚、数据线引脚及控制信号引脚，所述控制信号引脚与所述连接器电连接；
绝缘层，设置于所述第一玻璃基板上方并包裹所述驱动芯片；
多个发光二极管，所述发光二极管间隔设置于所述绝缘层上方，所述发光二极管包括阴极与阳极，所述扫描线引脚与所述阴极电连接，所述数据线引脚与所述阳极电连接，所述驱动芯片用于控制所述发光二极管；
第二玻璃基板，设于所述多个发光二极管上。
在本申请实施例所提供的LED显示屏模组中，所述LED显示屏模组还包括第一金属层与第二金属层；
所述第一金属层设置于所述多个发光二极管与所述绝缘层之间；
所述第二金属层设置于所述多个驱动芯片与所述连接器之间。
在本申请实施例所提供的LED显示屏模组中，所述扫描线引脚引出至所述第一金属层，通过所述第一金属层与所述阴极电连接；所述数据线引脚引出至所述第一金属层，通过所述第一金属层与与阳极电连接。
在本申请实施例所提供的LED显示屏模组中，所述控制信号引脚引出至所述第二金属层，通过所述第二金属层与所述连接器电连接。
在本申请实施例所提供的LED显示屏模组中，所述绝缘层的材料为透明材料，所述透明材料包括均苯型聚酰亚胺或者联苯型聚酰亚胺。
在本申请实施例所提供的LED显示屏模组中，所述发光二极管为三基色或双基色或单基色发光二极管，所述发光二极管间距小于或等于3毫米。
在本申请实施例所提供的LED显示屏模组中，所述连接器连接LED驱动系统，用于实现所述LED显示屏模组屏幕显示效果。
本申请实施例所提供的LED显示屏模组中，所述连接器的长或宽小于或等于3毫米。
本申请还提供一种LED显示屏模组，所述LED显示屏模组包括：连接器以及设置于所述连接器上方的第一玻璃基板；
多个驱动芯片，所述驱动芯片间隔设置于所述第一玻璃基板上方，所述驱动芯片包括扫描线引脚、数据线引脚及控制信号引脚，所述控制信号引脚与所述连接器电连接；
绝缘层，设置于所述第一玻璃基板上方并包裹所述驱动芯片，其中，所述绝缘层的材料为透明材料；
多个发光二极管，所述发光二极管间隔设置于所述绝缘层上方，所述发光二极管包括阴极与阳极，所述扫描线引脚与所述阴极电连接，所述数据线引脚与所述阳极电连接，所述驱动芯片用于控制所述发光二极管，其中，所述发光二极管为三基色或双基色或单基色发光二极管；
第二玻璃基板，设于所述多个发光二极管上。
在本申请所提供的LED显示屏模组中，所述LED显示屏模组还包括第一金属层与第二金属层；
所述第一金属层设置于所述多个发光二极管与所述绝缘层之间；
所述第二金属层设置于所述多个驱动芯片与所述连接器之间。
在本申请所提供的LED显示屏模组中，所述扫描线引脚引出至所述第一金属层，通过所述第一金属层与所述阴极电连接；所述数据线引脚引出至所述第一金属层，通过所述第一金属层与阳极电连接。
在本申请所提供的LED显示屏模组中，所述控制信号引脚引出至所述第二金属层，通过所述第二金属层与所述连接器电连接。
在本申请所提供的LED显示屏模组中，所述连接器连接LED驱动系统，用于实现所述LED显示屏模组屏幕显示效果。
在本申请所提供的LED显示屏模组中，所述连接器的长或宽小于或等于3毫米。
在本申请所提供的LED显示屏模组中，所述透明材料包括均苯型聚酰亚胺或者联苯型聚酰亚胺。
在本申请所提供的LED显示屏模组中，所述发光二极管间距小于或等于3毫米。
本申请实施例还提供一种显示装置，所述显示装置包括至少2个的LED显示屏模组，所述LED显示屏模组拼接构成一整体；所述LED显示屏模组包括：连接器以及设置于所述连接器上方的第一玻璃基板；
多个驱动芯片，所述驱动芯片间隔设置于所述第一玻璃基板上方，所述驱动芯片包括扫描线引脚、数据线引脚及控制信号引脚，所述控制信号引脚与所述连接器电连接；
绝缘层，设置于所述第一玻璃基板上方并包裹所述驱动芯片；
多个发光二极管，所述发光二极管间隔设置于所述绝缘层上方，所述发光二极管包括阴极与阳极，所述扫描线引脚与所述阴极电连接，所述数据线引脚与所述阳极电连接，所述驱动芯片用于控制所述发光二极管；
第二玻璃基板，设于所述多个发光二极管上。
在本申请实施例所提供的显示装置中，所述连接器设置于所述第一玻璃基板下表面的顶角区域，相邻两个所述LED显示屏模组中，所述连接器所在的顶角区域相互拼接。
 有益效果
本申请提出一种小间距LED显示屏模组，使得LED显示屏模组的发光二极管设置于两层玻璃基板之间，实现LED显示屏模组的透明显示效果，减少非现实区域面积。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施提供的LED显示屏模组剖面结构图。
图2为本实施例提供的显示装置的显示区域像素排列示意图。
图3为本申请实施例提供的显示装置的非显示区域排列示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本申请可用以实施的特定实施例。本申请所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本申请，而非用以限制本申请。在图中，结构相似的单元是用以相同标号表示。
如图1所示，本申请实施提供的LED显示屏模组剖面结构图，所述LED显示屏模组包括：连接器1以及设置于所述连接器1上方的第一玻璃基板21；
多个驱动芯片3，所述驱动芯片3等间隔设置于所述第一玻璃基板21上方，所述驱动芯片3间隔设置于所述第一玻璃基板21上方，所述驱动芯片3包括扫描线引脚、数据线引脚及控制信号引脚（图中未示出），所述控制信号引脚与所述连接器1电连接；
绝缘层4，设置于所述第一玻璃基板21上方并包裹所述驱动芯片3；
多个发光二极管5，设置于所述绝缘层4上方，所述发光二极管5间隔设置于所述绝缘层4上方，所述发光二极管5包括阴极与阳极（图中未示出），所述扫描线引脚与所述阴极电连接，所述数据线引脚与所述阳极电连接，其中，所述驱动芯片3用于控制所述发光二极管5；
第二玻璃基板22，设于所述多个发光二极管5上。
进一步的，所述第一玻璃基板21和第二玻璃基板22共同构成玻璃基板2，用于封装本申请实施例所提供的LED显示屏模组。
进一步的，所述第一玻璃基板21与所述第二玻璃基板22一般选择聚酰亚胺薄膜（PolyimideFilm，简称PI）作为基底。聚酰亚胺薄膜是目前世界上性能最好的薄膜类绝缘材料，具有较强的拉伸强度，由均苯四甲酸二酐和二胺基二苯醚在强极性溶剂中经缩聚并流延成膜再经亚胺化而成。
进一步的，所述驱动芯片3为无封装驱动芯片，即晶圆，设置于所述第一玻璃基板21上方并与所述连接器1电连接，所述驱动芯片3通过均匀分布的晶圆电连接发光二极管5，其中，所述驱动芯片用于驱动及控制所述多个发光二极管5。
本申请实施例在所述第一玻璃基板21下端设置有连接器1，通过将连接器1设置于玻第一玻璃基板21下表面的顶角区域，使得本申请提供的LED显示屏模组中发光二级管5之间间距更小，良品率高。
进一步的，所述LED显示屏模组还包括第一金属层与第二金属层（图中未示出），所述第一金属层设置于所述多个发光二极管与所述绝缘层之间，所述第二金属层设置于所述多个驱动芯片与所述连接器之间；该第一金属层与该第二金属层的设置使得该LED显示屏模组内部排线趋于规整化，尤其使得扫描线引脚与数据线引脚交错设置，进一步的减薄该LED显示屏模组的厚度。
所述驱动芯片包括扫描线引脚与数据线引脚及控制信号引脚，所述扫描线与所述数据线的引脚的数量为三个及三个以上，所述扫描线引脚与数据线引脚交错设置；所述所述扫描线引脚引出至所述第一金属层，通过所述第一金属层与所述发光二极管阴极电连接；所述数据线引脚引出至所述第一金属层，通过所述第一金属层与所述发光二极管阳极电连接。
所述控制信号引脚引出至所述第二金属层，通过所述第二金属层与所述连接器电连接。
除此之外，该LED显示屏模组与现有技术的LED显示屏模组结构相比，极大地缩短了产品研发周期，并且维护方便、相对于现有技术的LED显示屏维护成本极大降低，本申请中如果LED显示屏模组故障需维修只需将有故障的LED显示屏模组卸下维修即可，当故障无法维修需要更换理论成本上成本只为现有技术维修成本很少部分。
进一步的，把发光二极管5的小间距LED像素晶圆通过固金的方式转移到第一玻璃基板21与第二玻璃基板22上，且该固金方式为一种固定方式，可减少走线的混乱、便于以后的维修；与此同时，所述连接器以同样方式转移到玻璃基板上，连接到驱动系统，可以实现屏幕显示效果，由于所述LED显示屏模组尺寸较小，玻璃基板的空余区域为透明的，由此方便制作透明的显示效果。
进一步的，所述发光层上包括LED像素晶圆，所述发光二极管间距小于或等于3毫米；所述发光二极管为三基色或双基色或单基色发光二极管。
进一步的，所述驱动芯片为无封装驱动芯片，即晶圆，晶圆共同构成驱动芯片，所述晶圆为硅半导体集成电路制作所用的硅晶片，由于其形状为圆形，故称为晶圆；在硅晶片上可加工制作成各种电路元件结构，而成为有特定电性功能之IC产品。晶圆的原始材料是硅，而地壳表面有用之不竭的二氧化硅。二氧化硅矿石经由电弧炉提炼，盐酸氯化，并经蒸馏后，制成了高纯度的多晶硅晶圆，其纯度高达99.999999999%。
进一步的，为提升所述LED显示屏的透明显示效果，所述绝缘层的材料为透明材料，所述透明材料包括均苯型聚酰亚胺或者联苯型聚酰亚胺。
如图2所示，该图为本实施例提供的显示装置的显示面像素排列示意图，在该图中，所述显示装置包括本申请实施例所提供的LED显示屏模组，所述LED显示屏模组拼接构成一个整体。
所述发光二极管5为像素晶圆形态，所述发光二极管包括R发光二极管51、G发光二极管52以及B发光二极管53，该R发光二极管51、G发光二极管52以及B发光二极管53共同构成LED显示屏模组的多个发光二极管5；进一步的，所述发光二极管间隔小于或等于3毫米。
如图3所述，该图为本申请实施例所提供的显示装置的非显示区域驱动芯片3与连接器1排列示意图，所述连接器1设置于所述第一玻璃基板21下表面的顶角区域，所述LED显示屏模组拼接构成所述显示装置，所述连接器1所在的顶角区域相互拼接。
进一步的，所述顶角区域包括至少一个所述LED显示屏模组四角，所述连接器1集中设置于该显示装置一整体内部。
进一步的，所述LED显示屏模组为四个及以上偶数，该LED显示屏模组之间拼接构成该显示装置整体。所述连接器1尽量放置在所述第一玻璃基板21集中放置于顶角区域，便于拼接时减少不透明的面积。
本实施例还提供一种LED显示屏模组驱动架构和方法，该LED显示屏模组连接驱动系统，所述驱动系统包括：
系统接收到来自数字视频（Digital Visual Interface，简称DVI）接口数据；
根据所述数字视频接口数据，向传输部分传输差分信号；
根据所述差分信号，向接收系统传输数据传输信号；
所述数据传输信号传输到驱动电路，所述驱动电路驱动所述LED显示屏模组，所述LED显示屏发光。
进一步的，所述根据所述数字视频接口数据，想传输部分传输差分信号中，所述数字视频接口数据经过数字视频解码电路，传达到LED模组的发送系统；进一步的，该发送系统包括两个数据存储器与现场可编程门阵列(Programmable Gate Array,FPGA)控制器。所述发送系统接收到由数字视频接口（Digital Visual Interface，简称DVI）解码电路传输的数字视频接口数据，由FPGA控制器进行处理并由数据存储器进行缓存存储，发送至显示系统。
进一步的，所述显示系统包括成对的以太网发送器和变压器，当以太网发送器接收到来自发送系统传来的DVI接口数据时，该以太网发送器将该DVI接口数据传输至变压器，经变压器传输变成差分信号，再经由变压器传输至以太网发送器，并由显示系统传输给接收电路。
进一步的，该接收电路包括成对的数据存储器以及FPGA控制器，当接收系统接收到来自传输部分传来的差分信号时，所述差分信号进入FPGA控制器进行存储处理，并将该数据信号传输至驱动电路。
所述驱动电路驱动本申请提供的LED显示屏模组，所述LED显示屏模组的发光二极管发亮。
本申请提供的LED显示屏模组，搭配该LED驱动方法，与现有技术提供的LED显示屏模组相比，现有技术的LED显示屏模组由于驱动方式为被动式，需要的数量较多，均为在印刷电路板（Print Circuit Board，简称PCB）上进行制作，这样便于拼接，单无法实现透明显示的效果；本申请提供的LED显示屏模组通过设置多个驱动芯片和连接器的区域，实现LED显示屏模组的透明显示效果，减少非现实区域面积；申请提出一种适用于本申请实施例所提供是LED显示器模组的驱动方法，实现了透明LED显示屏模组实现方式。
有益效果为：提出一种小间距LED显示屏模组，使得LED显示屏模组的发光二极管设置于两层玻璃基板之间，实现LED显示屏模组的透明显示效果，减少非现实区域面积。
除上述实施例外，本申请还可以有其他实施方式。凡采用等同替换或等效替换形成的技术方案，均落在本申请要求的保护范围。
综上所述，虽然本申请已将优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (18)

  1. 一种LED显示屏模组，其中，所述LED显示屏模组包括：连接器以及设置于所述连接器上方的第一玻璃基板；
    多个驱动芯片，所述驱动芯片间隔设置于所述第一玻璃基板上方，所述驱动芯片包括扫描线引脚、数据线引脚及控制信号引脚，所述控制信号引脚与所述连接器电连接；
    绝缘层，设置于所述第一玻璃基板上方并包裹所述驱动芯片，其中，所述绝缘层的材料为透明材料；
    多个发光二极管，所述发光二极管间隔设置于所述绝缘层上方，所述发光二极管包括阴极与阳极，所述扫描线引脚与所述阴极电连接，所述数据线引脚与所述阳极电连接，所述驱动芯片用于控制所述发光二极管，所述发光二极管为三基色或双基色或单基色发光二极管；
    第二玻璃基板，设于所述多个发光二极管上。
  2. 根据权利要求1所述的LED显示屏模组，其中，所述LED显示屏模组还包括第一金属层与第二金属层；
    所述第一金属层设置于所述多个发光二极管与所述绝缘层之间；
    所述第二金属层设置于所述多个驱动芯片与所述连接器之间。
  3. 根据权利要求2所述的LED显示屏模组，其中，所述扫描线引脚引出至所述第一金属层，通过所述第一金属层与所述阴极电连接；所述数据线引脚引出至所述第一金属层，通过所述第一金属层与阳极电连接。
  4. 根据权利要求2所述的LED显示屏模组，其中，所述控制信号引脚引出至所述第二金属层，通过所述第二金属层与所述连接器电连接。
  5. 根据权利要求1述的LED显示屏模组，其中，所述连接器连接LED驱动系统，用于实现所述LED显示屏模组屏幕显示效果。
  6. 根据权利要求1所述的LED显示屏模组，其中，所述连接器的长或宽小于或等于3毫米。
  7. 根据权利要求1述的LED显示屏模组，其中，所述透明材料包括均苯型聚酰亚胺或者联苯型聚酰亚胺。
  8. 根据权利要求1述的LED显示屏模组，其中，所述发光二极管间距小于或等于3毫米。
  9. 一种LED显示屏模组，其中，所述LED显示屏模组包括：连接器以及设置于所述连接器上方的第一玻璃基板；
    多个驱动芯片，所述驱动芯片间隔设置于所述第一玻璃基板上方，所述驱动芯片包括扫描线引脚、数据线引脚及控制信号引脚，所述控制信号引脚与所述连接器电连接；
    绝缘层，设置于所述第一玻璃基板上方并包裹所述驱动芯片；
    多个发光二极管，所述发光二极管间隔设置于所述绝缘层上方，所述发光二极管包括阴极与阳极，所述扫描线引脚与所述阴极电连接，所述数据线引脚与所述阳极电连接，所述驱动芯片用于控制所述发光二极管；
    第二玻璃基板，设于所述多个发光二极管上。
  10. 根据权利要求9所述的LED显示屏模组，其中，所述LED显示屏模组还包括第一金属层与第二金属层；
    所述第一金属层设置于所述多个发光二极管与所述绝缘层之间；
    所述第二金属层设置于所述多个驱动芯片与所述连接器之间。
  11. 根据权利要求10所述的LED显示屏模组，其中，所述扫描线引脚引出至所述第一金属层，通过所述第一金属层与所述阴极电连接；所述数据线引脚引出至所述第一金属层，通过所述第一金属层与阳极电连接。
  12. 根据权利要求10所述的LED显示屏模组，其中，所述控制信号引脚引出至所述第二金属层，通过所述第二金属层与所述连接器电连接。
  13. 根据权利要求9所述的LED显示屏模组，其中，所述绝缘层的材料为透明材料，所述透明材料包括均苯型聚酰亚胺或者联苯型聚酰亚胺。
  14. 根据权利要求9所述的LED显示屏模组，其中，所述发光二极管为三基色或双基色或单基色发光二极管，所述发光二极管间距小于或等于3毫米。
  15. 根据权利要求9所述的LED显示屏模组，其中，所述连接器连接LED驱动系统，用于实现所述LED显示屏模组屏幕显示效果。
  16. 根据权利要求9所述的LED显示屏模组，其中，所述连接器的长或宽小于或等于3毫米。
  17. 一种显示装置，其中，所述显示装置包括至少2个LED显示屏模组，所述LED显示屏模组拼接构成一整体；
    所述LED显示屏模组包括：连接器以及设置于所述连接器上方的第一玻璃基板；
    多个驱动芯片，所述驱动芯片间隔设置于所述第一玻璃基板上方，所述驱动芯片包括扫描线引脚、数据线引脚及控制信号引脚，所述控制信号引脚与所述连接器电连接；
    绝缘层，设置于所述第一玻璃基板上方并包裹所述驱动芯片；
    多个发光二极管，所述发光二极管间隔设置于所述绝缘层上方，所述发光二极管包括阴极与阳极，所述扫描线引脚与所述阴极电连接，所述数据线引脚与所述阳极电连接，所述驱动芯片用于控制所述发光二极管；
    第二玻璃基板，设于所述多个发光二极管上。
  18. 根据权利要求17所述的显示装置，其中，所述连接器设置于所述第一玻璃基板下表面的顶角区域，相邻两个所述LED显示屏模组中，所述连接器所在的顶角区域相互拼接。
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