WO2020140816A1 - 基板及对位方法、设备 - Google Patents

基板及对位方法、设备 Download PDF

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Publication number
WO2020140816A1
WO2020140816A1 PCT/CN2019/128539 CN2019128539W WO2020140816A1 WO 2020140816 A1 WO2020140816 A1 WO 2020140816A1 CN 2019128539 W CN2019128539 W CN 2019128539W WO 2020140816 A1 WO2020140816 A1 WO 2020140816A1
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WIPO (PCT)
Prior art keywords
substrate
alignment
alignment mark
aligned
alignment marks
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PCT/CN2019/128539
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English (en)
French (fr)
Inventor
唐润民
王军
王战涛
王君龙
任星
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/767,445 priority Critical patent/US11398435B2/en
Publication of WO2020140816A1 publication Critical patent/WO2020140816A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/30—Determination of transform parameters for the alignment of images, i.e. image registration
    • G06T7/33—Determination of transform parameters for the alignment of images, i.e. image registration using feature-based methods
    • G06T7/337—Determination of transform parameters for the alignment of images, i.e. image registration using feature-based methods involving reference images or patches
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • G06T7/74—Determining position or orientation of objects or cameras using feature-based methods involving reference images or patches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30204—Marker
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate

Definitions

  • the present disclosure relates to the field of display technology, and in particular, to a substrate and alignment method and equipment.
  • OLED organic electroluminescence diode
  • an embodiment of the present disclosure provides a substrate provided with a substrate alignment mark, wherein the substrate is also provided with an additional alignment mark having a shape different from that of the substrate alignment mark.
  • the substrate alignment mark is located in a wiring area of the substrate, and the substrate alignment mark includes a first substrate alignment mark and a second substrate alignment mark that are axially symmetrical about a center line of the wiring area, Each substrate alignment mark corresponds to at least one additional alignment mark.
  • each alignment mark and the additional alignment mark corresponding to each alignment mark is fixed.
  • each alignment mark and the additional alignment mark corresponding to each alignment mark is fixed.
  • An embodiment of the present disclosure also provides a positioning method for aligning the substrate as described above with the substrate to be aligned, the substrate to be aligned is provided with an alignment mark of the substrate to be aligned, the alignment Methods include:
  • an image acquisition device to grab the alignment marks of the substrate to be aligned, and establish a coordinate system based on a plane on which at least two alignment marks of the substrate to be aligned are located;
  • the substrate to be aligned is a substrate as described above, and the substrate to be aligned further includes an additional alignment mark having a shape different from that of the alignment mark of the substrate to be aligned, which is captured by an image acquisition device Taking the alignment mark of the substrate to be aligned includes:
  • the grab fails, use the image acquisition device to grab the additional alignment mark of the substrate to be aligned, according to the additional alignment mark of the substrate to be aligned and the alignment mark of the substrate to be aligned The positional relationship between them determines the position of the alignment mark of the substrate to be aligned.
  • the substrate to be aligned is a substrate as described above, and the substrate to be aligned further includes an additional alignment mark having a shape different from that of the alignment mark of the substrate to be aligned, which is captured by an image acquisition device Taking the alignment mark of the substrate to be aligned includes:
  • the image acquisition device is used to grab the additional alignment mark of the substrate to be aligned, and according to the additional alignment mark of the substrate to be aligned and the substrate to be aligned
  • the positional relationship between the alignment marks of determines the position of the alignment marks of the substrate to be aligned.
  • the use of the image acquisition device to grab the alignment marks and/or additional alignment marks of the substrate to determine the coordinates of the alignment marks of the substrate in the coordinate system includes:
  • the grab fails, use the image acquisition device to grab at least two of the additional alignment marks and other alignment marks of the substrate, according to at least two of the additional alignment marks and other alignment marks of the substrate.
  • the positional relationship between the two and the alignment mark determines the coordinates of the alignment mark in the coordinate system.
  • the use of the image acquisition device to grab the alignment marks and/or additional alignment marks of the substrate to determine the coordinates of the alignment marks of the substrate in the coordinate system includes:
  • the image acquisition device is used to grab the additional alignment mark of the substrate, according to at least two of the additional alignment mark of the substrate and the correct alignment mark grasped
  • the positional relationship with the alignment mark of the substrate determines the coordinates of the alignment mark of the substrate in the coordinate system.
  • the alignment mark of the substrate includes a first substrate alignment mark and a second substrate alignment mark that are axially symmetric with respect to the center line of the routing area of the substrate, and the alignment mark of the substrate to be aligned includes the corresponding The first substrate alignment mark of the first substrate alignment mark and the second substrate alignment mark of the second substrate alignment mark corresponding to the second substrate alignment mark, at least The coordinate system established by the plane where the two alignment marks are located includes:
  • the determination of the coordinates of the alignment mark of the substrate in the coordinate system includes:
  • the aligning the substrate with the substrate to be aligned according to the coordinates includes:
  • the positioning the substrate to be aligned with the substrate according to the first coordinate, the second coordinate, the third coordinate, and the fourth coordinate includes:
  • the first coordinate is (X5, Y5)
  • the second coordinate is (X6, Y6)
  • the third coordinate is (X1, Y1)
  • the fourth coordinate is (X2, Y2).
  • An embodiment of the present disclosure also provides an alignment device for performing the alignment method described above.
  • the alignment device includes:
  • a processing module configured to capture the alignment marks of the substrate to be aligned by using an image acquisition device, and establish a coordinate system based on a plane on which at least two alignment marks of the substrate to be aligned are located;
  • a calculation module configured to use the image acquisition device to grab the alignment marks of the substrate and/or additional alignment marks to determine the coordinates of the alignment marks of the substrate in the coordinate system;
  • the alignment module is used to align the substrate with the substrate to be aligned according to the coordinates.
  • An embodiment of the present disclosure also provides an alignment device, including: a memory, a processor, and a computer program stored on the memory and executable on the processor, when the computer program is executed by the processor Implement the steps in the alignment method described above.
  • Embodiments of the present disclosure also provide a computer-readable storage medium that stores a computer program on the computer-readable storage medium, and when the computer program is executed by a processor, implements the steps in the alignment method described above.
  • FIG. 1 is a schematic flowchart of an alignment method according to an embodiment of the present disclosure
  • FIG. 2 is a schematic diagram of setting additional alignment marks in a wiring area of an embodiment of the present disclosure
  • FIG. 3 is a structural block diagram of an alignment device according to an embodiment of the present disclosure.
  • the embodiments of the present disclosure provide a substrate and a positioning method and equipment, which can ensure that the substrate is correctly aligned with the substrate to be aligned.
  • An embodiment of the present disclosure provides a substrate provided with a substrate alignment mark, and the substrate is also provided with an additional alignment mark having a shape different from that of the substrate alignment mark.
  • an additional alignment mark with a shape different from that of the substrate alignment mark is added to the substrate, so that after the substrate alignment mark is contaminated, resulting in failure or error in grasping the substrate alignment mark, the additional alignment mark can be grasped.
  • the position of the substrate alignment mark is calculated according to the positional relationship between the additional alignment mark and the substrate alignment mark to ensure the correct alignment of the substrate and the substrate to be aligned.
  • the substrate alignment mark may be located in the wiring area of the substrate.
  • the substrate alignment mark includes a first substrate alignment mark and a second substrate alignment mark that are symmetrical about the centerline of the wiring area, and each substrate alignment mark corresponds to At least one additional alignment mark.
  • the first substrate alignment mark and the second substrate alignment mark are symmetrical about the centerline of the wiring area.
  • the additional alignment mark includes a first additional alignment mark and a second additional alignment mark that are axially symmetrical about the center line of the routing area.
  • the additional alignment mark includes a first additional alignment mark and a second additional alignment mark that are axially symmetrical about the centerline of the routing area.
  • the positional relationship between the first additional alignment mark and the second additional alignment mark and the substrate alignment mark is fixed. The position of the substrate alignment mark can be determined by the position of the first additional alignment mark or the second additional alignment mark.
  • An embodiment of the present disclosure also provides a positioning method for aligning the above substrate with the substrate to be aligned, and the substrate to be aligned is provided with the alignment mark of the substrate to be aligned, as shown in FIG. Methods include:
  • Step 101 Use an image acquisition device to grab the alignment marks of the substrate to be aligned, and establish a coordinate system with a plane on which at least two alignment marks of the substrate to be aligned are located;
  • Step 102 Use the image acquisition device to grab the alignment mark and/or additional alignment mark of the substrate to determine the coordinates of the alignment mark of the substrate in the coordinate system;
  • Step 103 Align the substrate with the substrate to be aligned according to the coordinates.
  • an additional alignment mark with a shape different from that of the substrate alignment mark is added to the substrate, so that after the substrate alignment mark is contaminated, resulting in failure or error in grasping the substrate alignment mark, the additional alignment mark can be grasped.
  • the position of the substrate alignment mark is calculated according to the positional relationship between the additional alignment mark and the substrate alignment mark to ensure the correct alignment of the substrate and the substrate to be aligned.
  • an additional alignment mark may also be provided on the fixed substrate to be aligned, the substrate to be aligned further includes an additional alignment mark having a shape different from the alignment mark of the substrate to be aligned, so that When establishing the coordinate system of the alignment mark of the positioning substrate, if the grasping of the alignment mark of the substrate to be aligned fails or is wrong, the additional alignment mark of the substrate to be aligned can be grabbed, and the additional alignment mark can be used to determine the position of the substrate to be aligned Position of the alignment mark.
  • using the image acquisition device to grab the alignment mark of the substrate to be aligned includes:
  • the grab When the grab fails, use the image acquisition device to grab the additional alignment mark of the substrate to be aligned, and determine the alignment position according to the positional relationship between the additional alignment mark of the substrate to be aligned and the alignment mark of the substrate to be aligned The position of the alignment mark of the substrate.
  • the substrate to be aligned is provided with at least one additional alignment mark corresponding to each alignment mark.
  • the positional relationship between each alignment mark and the corresponding additional alignment mark is Determined, for example, the distance between the alignment mark and its corresponding additional alignment mark is fixed.
  • the alignment mark and its corresponding The distance between the additional alignment marks on the x-axis and y-axis is also fixed. Therefore, when any of the alignment marks fails to be grabbed, any additional alignment marks corresponding to the alignment marks can be grabbed.
  • the position of the registration mark determines the position of the registration mark.
  • the grabbed alignment marks are correct. Specifically, it is possible to determine whether the grabbed alignment marks are correct according to the positional relationship between the alignment marks. After the alignment substrate is manufactured, the positional relationship between any two alignment marks is determined. For example, the distance between any two alignment marks is determined. The distance determines whether the captured alignment mark is correct.
  • using the image acquisition device to grab the alignment mark of the substrate to be aligned includes:
  • the additional alignment mark of the substrate to be aligned is grabbed by the image acquisition device, and the position between the additional alignment mark of the substrate to be aligned and the alignment mark of the substrate to be aligned The relationship determines the position of the alignment mark of the substrate to be aligned.
  • the distance between the alignment mark and the alignment mark determines which of the two alignment marks previously captured has an error. If only one alignment mark has an error, then use this The position of the additional alignment mark can be re-determined. If both of the alignment marks are captured incorrectly, the positions of the additional alignment marks need to be used to re-determine the positions of the two alignment marks. .
  • the substrate to be aligned In the process of aligning the substrate, the substrate to be aligned is fixed, and the substrate is moving. Therefore, when the grasping of an alignment mark of the substrate fails, at least two known position points and positions need to be used
  • the positional relationship (such as distance) between the point and the alignment mark can determine the position of the alignment mark that failed to grab. Specifically, at least two of the additional alignment mark and other alignment marks that were successfully grasped can be used.
  • the location information determines the location information of the failed alignment mark.
  • using the image acquisition device to grab the alignment marks of the substrate and/or additional alignment marks to determine the coordinates of the alignment marks of the substrate in the coordinate system includes:
  • the grab fails, use an image acquisition device to grab at least two of the additional alignment marks and other alignment marks of the substrate, according to at least two of the additional alignment marks and other alignment marks of the substrate and the alignment position
  • the positional relationship between the marks determines the coordinates of the alignment mark in the coordinate system.
  • the additional alignment marks and other alignment marks may be two additional alignment marks, or two other alignment marks, or one additional alignment mark and one alignment mark. It is worth noting that the above additional alignment marks and other alignment marks are all alignment marks that have been successfully fetched.
  • the grasped alignment marks of the substrate After grasping the alignment marks of the substrate, it is also necessary to determine whether the grasped alignment marks are correct. Specifically, it is possible to determine whether the grasped alignment marks are correct according to the positional relationship between the alignment marks. After the substrate is manufactured, the positional relationship between any two alignment marks is determined, for example, the distance between any two alignment marks is determined, and the grip can be determined according to the distance between any two alignment marks Whether the registration mark is correct.
  • using the image acquisition device to grab the alignment marks of the substrate and/or additional alignment marks to determine the coordinates of the alignment marks of the substrate in the coordinate system includes:
  • At least two alignment marks of the substrate are captured by the image acquisition device
  • the additional alignment mark of the substrate is grabbed by the image acquisition device, and at least two of the additional alignment mark of the substrate and the correct alignment mark grabbed are aligned with the substrate The positional relationship between them determines the coordinates of the substrate alignment marks in the coordinate system.
  • At least two additional alignment marks can be grabbed, and the positions of the two alignment marks of the substrate can be directly determined according to the position information of the at least two additional alignment marks and the positional relationship between the additional alignment marks and the alignment marks of the substrate; Since the distance between the alignment mark and the additional alignment mark is also fixed after the substrate is manufactured, you can also use the additional alignment mark and the alignment mark after grabbing at least two additional alignment marks The distance determines which of the two alignment marks previously captured has an error, and if there is an error in the capture of only one alignment mark, the position of at least two additional alignment marks is re-determined The position of the alignment mark is sufficient; if both of the alignment marks are captured incorrectly, the positions of the two alignment marks need to be re-determined using at least two additional alignment marks.
  • the substrate alignment mark includes a first substrate alignment mark and a second substrate alignment mark that are axially symmetrical about a centerline of the routing area, and the substrate alignment mark to be aligned includes a corresponding one of the first substrate alignment mark
  • the first alignment mark of the substrate to be aligned and the second alignment mark of the substrate to be aligned corresponding to the alignment mark of the second substrate include:
  • the alignment mark of the substrate includes a first substrate alignment mark and a second substrate alignment mark that are axially symmetrical about the centerline of the routing area of the substrate, and the alignment mark of the substrate to be aligned includes the corresponding first substrate Aligning the first alignment mark of the substrate to be aligned and the second alignment mark of the second substrate to be aligned corresponding to the alignment mark of the second substrate, establishing a coordinate system based on a plane on which at least two alignment marks of the substrate to be aligned include :
  • the coordinates of the substrate alignment marks in the coordinate system include:
  • Aligning the substrate with the substrate to be aligned according to the coordinates includes:
  • positioning the substrate to be aligned with the substrate according to the first coordinate, the second coordinate, the third coordinate, and the fourth coordinate includes:
  • the first coordinate is (X5, Y5)
  • the second coordinate is (X6, Y6)
  • the third coordinate is (X1, Y1)
  • the fourth coordinate is (X2, Y2).
  • the substrate to be aligned is an electrical detection circuit board
  • an accessory alignment mark is provided on the display substrate
  • an additional alignment mark is not provided on the electrical detection circuit board as an example.
  • the public alignment method is further introduced:
  • a pair of circuit board alignment marks 3 are provided on the electrical detection circuit board 1, and the pair of circuit board alignment marks 3 are symmetrical about the centerline axis of the electrical detection circuit board 1, and may be specifically T-shaped;
  • the wiring area 2 of the pair is provided with a pair of display substrate alignment marks 4, the pair of display substrate alignment marks 4 are symmetrical about the axis of the center area of the wiring area 2, which can be specifically T-shaped;
  • a pair of additional In order to distinguish the alignment mark 5 from the display substrate alignment mark 4, the shape of the additional alignment mark 5 is different from that of the display substrate alignment mark 4, and may specifically be a triangle.
  • the image acquisition device A grabs one of the circuit board alignment marks 3 to establish the coordinate system A, and grabs the display substrate alignment mark 4 corresponding to the circuit board alignment mark 3 , Calculate the coordinates (X1, Y1) of the display substrate alignment mark 4 in the coordinate system A; the image acquisition device B grabs another circuit board alignment mark 3, thereby establishing the coordinate system B, grabbing the circuit board
  • the display substrate alignment mark 4 corresponding to the alignment mark 3 calculates the coordinates (X2, Y2) of the display substrate alignment mark 4 in the coordinate system B.
  • the circuit board alignment mark 3 when the coordinate system is established by the position of the circuit board alignment mark 3, the circuit board alignment mark 3 is located on the plane where the coordinate system is located, and the plane where the coordinate system is located is parallel to the plane where the routing area is located, showing that the substrate alignment mark 4 is on
  • the coordinates in the coordinate system are the coordinates of the center point of the orthographic projection of the substrate registration mark 4 on the plane where the coordinate system is located in the coordinate system.
  • an image acquisition device is used to grab two circuit board alignment marks 3, and a coordinate system C is established with the positions of the two circuit board alignment marks 3, wherein both circuit board alignment marks 3 are located at the coordinates Is the plane where system C is located, and the plane where coordinate system C is located is parallel to the plane where the routing area is located, showing that the coordinates of substrate alignment mark 4 in coordinate system C is the orthographic projection of substrate alignment mark 4 on the plane where coordinate system C is The coordinates of the center point in this coordinate system C.
  • the coordinates of the center points of the two circuit board alignment marks 3 in the coordinate system C are calculated as (X5, Y5) and (X6, Y6), respectively.
  • the image acquisition device grabs a pair of display substrate alignment marks 4 corresponding to the circuit board alignment marks 3, and calculates the coordinates of the pair of display substrate alignment marks 4 in the coordinate system C as (X1, Y1), (X2 , Y2), to determine whether the positional relationship between (X1, Y1), (X2, Y2) satisfies the preset positional relationship between the two display substrate alignment marks 4, if it meets, it means to grab the display substrate pair Bit mark 4 is successful. If it is not satisfied, it means that the grabbed display substrate alignment mark 4 is wrong. For example, according to (X1, Y1), (X2, Y2), the distance between the preset two display substrate alignment marks 4 is calculated. If the preset distance is satisfied, it means that the grab is successful. If the preset distance is not satisfied, , It means that the crawl failed.
  • the positional relationship between the additional alignment mark 5 and the display substrate alignment mark 4 is fixed, and the positional relationship may include the distance between the additional alignment mark 5 and the display substrate alignment mark 4 ,
  • the display substrate alignment can be determined according to the positional relationship and the coordinates of the additional alignment mark 5 and the positional relationship between another display substrate alignment mark 4 (X2, Y2) and the display substrate alignment mark 4 (X1, Y1) The coordinates of marker 4 (X1, Y1).
  • the coordinates of at least two additional alignment marks 5 and at least two additional alignment marks 5 and both The positional relationship between the display substrate alignment marks 4 is determined based on the coordinates of at least two additional alignment marks 5 and the positional relationship between the at least two additional alignment marks 5 and the two display substrate alignment marks 4
  • an additional alignment mark may also be provided on the electrical detection circuit board.
  • the electrical detection circuit board further includes an additional alignment mark having a shape different from the alignment mark of the electrical detection circuit board.
  • An embodiment of the present disclosure also provides an electrical detection method. After aligning the substrate with the substrate to be aligned using the above alignment method, the electrical detection circuit board is crimped on the lead area of the substrate to electrically conduct the substrate Sex testing.
  • An embodiment of the present disclosure also provides an alignment device for aligning the above substrate with the substrate to be aligned, and the substrate to be aligned is provided with the alignment mark of the substrate to be aligned, as shown in FIG. 3
  • the device includes:
  • the processing module 21 is configured to capture the alignment marks of the substrate to be aligned using an image acquisition device, and establish a coordinate system based on a plane on which at least two alignment marks of the substrate to be aligned are located;
  • the calculation module 22 is configured to use the image acquisition device to grab the alignment marks and/or additional alignment marks of the substrate to determine the coordinates of the alignment marks of the substrate in the coordinate system;
  • the alignment module 23 is configured to align the substrate with the substrate to be aligned according to the coordinates.
  • an additional alignment mark with a shape different from that of the substrate alignment mark is added to the substrate, so that after the substrate alignment mark is contaminated, resulting in failure or error in grasping the substrate alignment mark, the additional alignment mark can be grasped.
  • the position of the substrate alignment mark is calculated according to the positional relationship between the additional alignment mark and the substrate alignment mark to ensure the correct alignment of the substrate and the substrate to be aligned.
  • the substrate to be aligned further includes an additional alignment mark having a shape different from the alignment mark of the substrate to be aligned
  • the processing module 21 is specifically configured to use the image acquisition device to grab the substrate The alignment mark of the alignment substrate; when the grab fails, use the image acquisition device to grab the additional alignment mark of the substrate to be aligned, according to the additional alignment mark of the substrate to be aligned and the The positional relationship between the alignment marks of the alignment substrate determines the position of the alignment marks of the substrate to be aligned.
  • the substrate to be aligned further includes an additional alignment mark having a shape different from the alignment mark of the substrate to be aligned
  • the processing module 21 is specifically configured to use the image acquisition device to grab the substrate At least two alignment marks of the alignment substrate; judging whether the grabbed at least two alignment marks of the substrate to be aligned satisfy the preset positional relationship between the at least two alignment marks; When it is judged that there is a grasping error, use the image acquisition device to grab the additional alignment mark of the substrate to be aligned, according to the alignment of the additional alignment mark of the substrate to be aligned with the substrate to be aligned The positional relationship between the marks determines the position of the alignment mark of the substrate to be aligned.
  • the calculation module 22 is specifically configured to use the image acquisition device to capture the alignment mark of the substrate; when the capture fails, use the image acquisition device to capture the additional alignment mark of the substrate And at least two of the other alignment marks, determining the alignment mark in the coordinate system according to the positional relationship between at least two of the additional alignment marks of the substrate and the other alignment marks and the alignment mark Coordinates.
  • the calculation module 22 is specifically configured to use the image acquisition device to capture at least two alignment marks of the substrate; to determine whether the captured at least two alignment marks of the substrate satisfy the preset The positional relationship between the at least two alignment marks; when it is not satisfied, it is judged that a grasping error occurs, and the additional alignment mark of the substrate is grasped by the image acquisition device, according to the additional alignment of the substrate.
  • the positional relationship between at least two of the mark and the correct alignment mark and the alignment mark of the substrate determines the coordinates of the alignment mark of the substrate in the coordinate system.
  • the alignment marks of the substrate include a first substrate alignment mark and a second substrate alignment mark that are axially symmetrical about a centerline of the routing area of the substrate, and the alignment of the substrate to be aligned
  • the mark includes a first substrate alignment mark to be aligned corresponding to the first substrate alignment mark and a second substrate alignment mark to be aligned corresponding to the second substrate alignment mark,
  • the processing module 21 is specifically used to capture the positions of the first substrate alignment mark and the second substrate alignment mark by the image acquisition device, and use the first substrate alignment mark and the second substrate alignment to be aligned Establish a coordinate system on the plane where the substrate alignment mark is located, and calculate the first coordinate and the second coordinate of the first alignment substrate alignment mark and the second alignment substrate alignment mark in the coordinate system;
  • the calculation module 22 is specifically used to capture the first substrate alignment mark and the second substrate alignment mark on the substrate by using the image acquisition device to determine the third position of the first substrate alignment mark and the second substrate alignment mark in the coordinate system Coordinates and fourth coordinates;
  • the alignment module 23 is specifically configured to align the substrate to be aligned with the substrate according to the first coordinate, the second coordinate, the third coordinate, and the fourth coordinate.
  • the alignment module 23 includes:
  • the second moving unit is used to move the substrate in the X-axis direction by a distance of (X1+X2-X5-X6)/2; where, according to the different values of X1, X2, X5, X6, (X1+X2- The calculation result of X5-X6)/2 is a positive value or a negative value.
  • the first coordinate is (X5, Y5)
  • the second coordinate is (X6, Y6)
  • the third coordinate is (X1, Y1)
  • the fourth coordinate is (X2, Y2).
  • Embodiments of the present disclosure also provide an alignment device, including: a memory, a processor, and a computer program stored on the memory and executable on the processor. When the computer program is executed by the processor, the above alignment method is implemented. step.
  • Embodiments of the present disclosure also provide a computer-readable storage medium that stores a computer program on the computer-readable storage medium.
  • the steps in the above alignment method are implemented, or the computer program is processed by the processor
  • the steps in the above electrical detection method are realized.
  • the embodiments described herein may be implemented in hardware, software, firmware, middleware, microcode, or a combination thereof.
  • the processing unit can be implemented in one or more application specific integrated circuits (Application Specific Integrated Circuits, ASIC), digital signal processor (Digital Signal Processing, DSP), digital signal processing device (DSP Device, DSPD), programmable Logic device (Programmable Logic Device, PLD), field-programmable gate array (Field-Programmable Gate Array, FPGA), general-purpose processor, controller, microcontroller, microprocessor, others used to perform the functions described in this application Electronic unit or its combination.
  • ASIC Application Specific Integrated Circuits
  • DSP Digital Signal Processing
  • DSP Device digital signal processing device
  • DSPD digital signal processing device
  • PLD programmable Logic Device
  • FPGA field-programmable gate array
  • controller microcontroller, microprocessor, others used to perform the functions described in this application Electronic unit or its combination.
  • the techniques described herein may be implemented through modules (eg, procedures, functions, etc.) that perform the functions described herein.
  • the software codes can be stored in the memory and executed by the processor.
  • the memory may be implemented in the processor or external to the processor.
  • embodiments of the embodiments of the present disclosure may be provided as methods, devices, or computer program products. Therefore, the embodiments of the present disclosure may take the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment combining software and hardware. Moreover, embodiments of the present disclosure may take the form of computer program products implemented on one or more computer usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer usable program code.
  • computer usable storage media including but not limited to disk storage, CD-ROM, optical storage, etc.
  • each flow and/or block in the flowchart and/or block diagram and a combination of the flow and/or block in the flowchart and/or block diagram may be implemented by computer program instructions.
  • These computer program instructions can be provided to a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing user equipment processor to produce a machine that causes instructions executed by the computer or other programmable data processing user equipment processor Means for generating the functions specified in a block or blocks of a flowchart or a flow and/or a block diagram.
  • These computer program instructions may also be stored in a computer readable memory that can guide a computer or other programmable data processing user equipment to work in a specific manner, so that the instructions stored in the computer readable memory produce an article of manufacture including instruction means, which The instruction device implements the functions specified in one block or multiple blocks in the flowchart one flow or multiple flows and/or block diagrams.

Abstract

一种基板及对位方法、设备。所述基板设置有基板对位标记（4）。所述基板还设置有与所述基板对位标记（4）形状不同的附加对位标记（5）。

Description

基板及对位方法、设备
相关申请的交叉引用
本申请主张在2019年1月3日在中国提交的中国专利申请号No.201910004229.5的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及显示技术领域，特别是指一种基板及对位方法、设备。
背景技术
OLED(有机电致发光二极管)显示产品的生产过程中，在将基板母板切割成多个基板后，需要利用电学性检测设备对基板进行电学性检测，在进行电学性检测时，利用待对位基板上的对位标记和基板走线区的对位标记对待对位基板和基板进行对位，进而使得待对位基板上的引脚与走线区的引脚自动压接在一起。但是在基板的制程中，基板走线区的对位标记往往会受到污染，导致自动压接准确率不高。
发明内容
一方面，本公开实施例提供一种基板，所述基板设置有基板对位标记，其中，所述基板还设置有与所述基板对位标记形状不同的附加对位标记。
进一步地，所述基板对位标记位于所述基板的走线区，所述基板对位标记包括关于所述走线区的中心线轴对称的第一基板对位标记和第二基板对位标记，每一基板对位标记对应至少一个附加对位标记。
进一步地，每一对位标记和与所述每一对位标记对应的附加对位标记之间的位置关系固定。
进一步地，每一对位标记和与所述每一对位标记对应的附加对位标记之间的距离固定。
本公开实施例还提供了一种对位方法，用于将如上所述的基板与待对位基板进行对位，所述待对位基板上设置有待对位基板对位标记，所述对位方 法包括：
利用图像采集设备抓取所述待对位基板的对位标记，以所述待对位基板的至少两个对位标记所在平面建立坐标系；
利用所述图像采集设备抓取所述基板的对位标记和/或附加对位标记，确定所述基板的对位标记在所述坐标系中的坐标；
根据所述坐标将所述基板与所述待对位基板进行对位。
进一步地，所述待对位基板为如上所述的基板，所述待对位基板还包括与所述待对位基板的对位标记形状不同的附加对位标记，所述利用图像采集设备抓取所述待对位基板的对位标记包括：
利用所述图像采集设备抓取所述待对位基板的对位标记；
在抓取失败时，利用所述图像采集设备抓取所述待对位基板的附加对位标记，根据所述待对位基板的附加对位标记与所述待对位基板的对位标记之间的位置关系确定所述待对位基板的对位标记的位置。
进一步地，所述待对位基板为如上所述的基板，所述待对位基板还包括与所述待对位基板的对位标记形状不同的附加对位标记，所述利用图像采集设备抓取所述待对位基板的对位标记包括：
利用所述图像采集设备抓取所述待对位基板的至少两个对位标记；
判断抓取的所述待对位基板的至少两个对位标记是否满足预设的所述至少两个对位标记之间的位置关系；
在不满足时，判断出现抓取错误，利用所述图像采集设备抓取所述待对位基板的附加对位标记，根据所述待对位基板的附加对位标记与所述待对位基板的对位标记之间的位置关系确定所述待对位基板的对位标记的位置。
进一步地，所述利用所述图像采集设备抓取所述基板的对位标记和/或附加对位标记，确定所述基板的对位标记在所述坐标系中的坐标包括：
利用所述图像采集设备抓取所述基板的对位标记；
在抓取失败时，利用所述图像采集设备抓取所述基板的附加对位标记和其他对位标记中的至少两个，根据所述基板的附加对位标记和其他对位标记中的至少两个与该对位标记之间的位置关系确定该对位标记在所述坐标系中 的坐标。
进一步地，所述利用所述图像采集设备抓取所述基板的对位标记和/或附加对位标记，确定所述基板的对位标记在所述坐标系中的坐标包括：
利用所述图像采集设备抓取所述基板的至少两个对位标记；
判断抓取的所述基板的至少两个对位标记是否满足预设的所述至少两个对位标记之间的位置关系；
在不满足时，判断出现抓取错误，利用所述图像采集设备抓取所述基板的附加对位标记，根据所述基板的附加对位标记和抓取正确的对位标记中的至少两个与所述基板的对位标记之间的位置关系确定所述基板的对位标记在所述坐标系中的坐标。
进一步地，所述基板的对位标记包括关于所述基板的走线区的中心线轴对称的第一基板对位标记和第二基板对位标记，所述待对位基板的对位标记包括对应所述第一基板对位标记的第一待对位基板对位标记和对应所述第二基板对位标记的第二待对位基板对位标记，所述以所述待对位基板的至少两个对位标记所在平面建立坐标系包括：
以所述第一待对位基板对位标记和所述第二待对位基板对位标记所在平面建立坐标系，并分别计算所述第一待对位基板对位标记和第二待对位基板对位标记在所述坐标系中的第一坐标和第二坐标；
所述确定所述基板的对位标记在所述坐标系中的坐标包括：
确定所述第一基板对位标记和第二基板对位标记在所述坐标系中的第三坐标和第四坐标；
所述根据所述坐标将所述基板与所述待对位基板进行对位包括：
根据所述第一坐标、第二坐标、第三坐标和第四坐标将所述待对位基板与所述基板进行对位。
进一步地，所述根据所述第一坐标、第二坐标、第三坐标和第四坐标将所述待对位基板与所述基板进行对位包括：
对所述基板进行旋转，使得(Y1-Y5)＝(Y2-Y6)；
在Y轴方向上将所述基板移动(Y1-Y5)的距离，使得(Y1-Y5)＝(Y2-Y6)＝0；
在X轴方向上将所述基板移动(X1+X2-X5-X6)/2的距离，在(X1+X2-X5-X6)/2的计算结果为正值时，将基板向X轴正向移动(X1+X2-X5-X6)/2的绝对值的距离，在(X1+X2-X5-X6)/2的计算结果为负值时，将基板向X轴负向移动(X1+X2-X5-X6)/2的绝对值的距离；
其中，第一坐标为(X5，Y5)，第二坐标为(X6，Y6)，第三坐标为(X1,Y1)，第四坐标为(X2，Y2)。
本公开实施例还提供了一种对位装置，用于执行如上所述的对位方法，所述对位装置包括：
处理模块，用于利用图像采集设备抓取所述待对位基板的对位标记，以所述待对位基板的至少两个对位标记所在平面建立坐标系；
计算模块，用于利用所述图像采集设备抓取所述基板的对位标记和/或附加对位标记，确定所述基板的对位标记在所述坐标系中的坐标；
对位模块，用于根据所述坐标将所述基板与所述待对位基板进行对位。
本公开实施例还提供了一种对位设备，包括：存储器、处理器及存储在所述存储器上并可在所述处理器上运行的计算机程序，所述计算机程序被所述处理器执行时实现如上所述的对位方法中的步骤。
本公开实施例还提供了一种计算机可读存储介质，所述计算机可读存储介质上存储有计算机程序，所述计算机程序被处理器执行时实现如上所述的对位方法中的步骤。
附图说明
图1为本公开实施例对位方法的流程示意图；
图2为本公开实施例走线区设置附加对位标记的示意图；
图3为本公开实施例对位装置的结构框图。
附图标记
1 电学检测电路板
2 走线区
3 电路板对位标记
4 显示基板对位标记
5 附加对位标记
具体实施方式
为使本公开的实施例要解决的技术问题、技术方案和优点更加清楚，下面将结合附图及具体实施例进行详细描述。
本公开的实施例提供一种基板及对位方法、设备，能够确保基板与待对位基板正确对位。
本公开的实施例提供一种基板，基板设置有基板对位标记，基板还设置有与基板对位标记形状不同的附加对位标记。
本实施例中，在基板增加与基板对位标记形状不同的附加对位标记，这样在基板对位标记受到污染，导致抓取基板对位标记失败或错误后，可以抓取附加对位标记，根据附加对位标记与基板对位标记之间的位置关系计算出基板对位标记的位置，确保基板与待对位基板正确对位。
进一步地，基板对位标记可以位于基板的走线区，基板对位标记包括关于走线区的中心线轴对称的第一基板对位标记和第二基板对位标记，每一基板对位标记对应至少一个附加对位标记。为了对位方便，第一基板对位标记与第二基板对位标记关于走线区的中心线轴对称。
进一步地，附加对位标记包括关于走线区的中心线轴对称的第一附加对位标记和第二附加对位标记。为了对位方便，附加对位标记包括关于走线区的中心线轴对称的第一附加对位标记和第二附加对位标记。其中，第一附加对位标记和第二附加对位标记与基板对位标记的位置关系是固定的。利用第一附加对位标记或第二附加对位标记的位置可以确定基板对位标记的位置。
本公开实施例还提供了一种对位方法，用于将如上的基板与待对位基板进行对位，待对位基板上设置有待对位基板对位标记，如图1所示，对位方法包括：
步骤101：利用图像采集设备抓取所述待对位基板的对位标记，以所述待对位基板的至少两个对位标记所在平面建立坐标系；
步骤102：利用所述图像采集设备抓取所述基板的对位标记和/或附加对位标记，确定所述基板的对位标记在所述坐标系中的坐标；
步骤103：根据所述坐标将所述基板与所述待对位基板进行对位。
本实施例中，在基板增加与基板对位标记形状不同的附加对位标记，这样在基板对位标记受到污染，导致抓取基板对位标记失败或错误后，可以抓取附加对位标记，根据附加对位标记与基板对位标记之间的位置关系计算出基板对位标记的位置，确保基板与待对位基板正确对位。
一些实施例中，还可以在固定的待对位基板上设置附加对位标记，待对位基板还包括与待对位基板的对位标记形状不同的附加对位标记，这样在抓取待对位基板的对位标记建立坐标系时，如果抓取待对位基板的对位标记失败或者错误，可以抓取待对位基板的附加对位标记，利用附加对位标记确定待对位基板的对位标记的位置。
一具体实施例中，利用图像采集设备抓取待对位基板的对位标记包括：
利用图像采集设备抓取待对位基板的对位标记；
在抓取失败时，利用图像采集设备抓取待对位基板的附加对位标记，根据待对位基板的附加对位标记与待对位基板的对位标记之间的位置关系确定待对位基板的对位标记的位置。
其中，待对位基板上设置有对应每一对位标记的至少一个附加对位标记，在待对位基板制作完成后，每一对位标记与其对应的附加对位标记之间的位置关系是确定的，比如，对位标记与其对应的附加对位标记之间的距离是固定的，在以待对位基板的至少两个对位标记为基准建立的坐标系中，对位标记与其对应的附加对位标记在x轴和y轴上的距离也是固定的，因此，在抓取其中任一个对位标记失败时，可以抓取与该对位标记对应的任一个附加对位标记，利用附加对位标记的位置确定对位标记的位置。
另外，在抓取对位标记后，还需要判断抓取的对位标记是否正确，具体可以根据对位标记之间的位置关系判断抓取的对位标记是否正确。在待对位基板制作完成后，任两个对位标记之间的位置关系是确定的，比如任两个对位标记之间的距离是确定的，可以根据任两个对位标记之间的距离判断抓取 的对位标记是否正确。
一具体实施例中，利用图像采集设备抓取待对位基板的对位标记包括：
利用图像采集设备抓取待对位基板的至少两个对位标记；
判断抓取的待对位基板的至少两个对位标记是否满足预设的至少两个对位标记之间的位置关系；
在不满足时，判断出现抓取错误，利用图像采集设备抓取待对位基板的附加对位标记，根据待对位基板的附加对位标记与待对位基板的对位标记之间的位置关系确定待对位基板的对位标记的位置。
具体地，在抓取待对位基板的两个对位标记后，判断两个对位标记之间的距离是否满足预先已获取的两个对位标记之间的距离，若不满足，则判断出现抓取错误，需要抓取附加对位标记。可以抓取一个或多个附加对位标记，根据一个或多个附加对位标记的位置信息以及附加对位标记与待对位基板的对位标记之间的位置关系直接确定待对位基板的两个对位标记的位置；由于在待对位基板制作完成后，对位标记与附加对位标记之间的距离也是固定的，因此也可以在抓取一个附加对位标记后，利用该附加对位标记与对位标记之间的距离判断出先前抓取的两个对位标记中的哪一个对位标记出现了错误，如果仅有一个对位标记的抓取出现了错误，则利用该附加对位标记的位置重新确定该对位标记的位置即可；如果两个对位标记的抓取都出现了错误，则需要利用附加对位标记的位置重新确定这两个对位标记的位置。
在对基板进行对位的过程中，待对位基板是固定的，而基板是移动的，因此，在基板的一个对位标记抓取失败时，需要利用至少两个已知的位置点以及位置点与该对位标记之间的位置关系(比如距离)才能确定抓取失败的对位标记的位置，具体地，可以利用附加对位标记和其他抓取成功的对位标记中的至少两个的位置信息确定抓取失败的对位标记的位置信息。
一具体实施例中，利用图像采集设备抓取基板的对位标记和/或附加对位标记，确定基板的对位标记在坐标系中的坐标包括：
利用图像采集设备抓取基板的对位标记；
在抓取失败时，利用图像采集设备抓取基板的附加对位标记和其他对位 标记中的至少两个，根据基板的附加对位标记和其他对位标记中的至少两个与该对位标记之间的位置关系确定该对位标记在坐标系中的坐标。
其中，附加对位标记和其他对位标记中的至少两个可以为两个附加对位标记，也可以为其他两个对位标记，也可以为一个附加对位标记和一个对位标记。值得注意的是，上述附加对位标记和其他对位标记均为抓取成功的对位标记。
另外，在抓取基板的对位标记后，还需要判断抓取的对位标记是否正确，具体可以根据对位标记之间的位置关系判断抓取的对位标记是否正确。在基板制作完成后，任两个对位标记之间的位置关系是确定的，比如任两个对位标记之间的距离是确定的，可以根据任两个对位标记之间的距离判断抓取的对位标记是否正确。
一具体实施例中，利用图像采集设备抓取基板的对位标记和/或附加对位标记，确定基板的对位标记在坐标系中的坐标包括：
利用图像采集设备抓取基板的至少两个对位标记；
判断抓取的基板的至少两个对位标记是否满足预设的至少两个对位标记之间的位置关系；
在不满足时，判断出现抓取错误，利用图像采集设备抓取基板的附加对位标记，根据基板的附加对位标记和抓取正确的对位标记中的至少两个与基板的对位标记之间的位置关系确定基板的对位标记在坐标系中的坐标。
具体地，在抓取基板的两个对位标记后，判断两个对位标记之间的距离是否满足预先已获取的两个对位标记之间的距离，若不满足，则判断出现抓取错误，需要抓取附加对位标记。
可以抓取至少两个附加对位标记，根据至少两个附加对位标记的位置信息以及附加对位标记与基板的对位标记之间的位置关系直接确定基板的两个对位标记的位置；由于在基板制作完成后，对位标记与附加对位标记之间的距离也是固定的，因此也可以在抓取至少两个附加对位标记后，利用附加对位标记与对位标记之间的距离判断出先前抓取的两个对位标记中的哪一个对位标记出现了错误，如果仅有一个对位标记的抓取出现了错误，则利用至少 两个附加对位标记的位置重新确定该对位标记的位置即可；如果两个对位标记的抓取都出现了错误，则需要利用至少两个附加对位标记的位置重新确定这两个对位标记的位置。另外，如果事先已成功抓取至少一个对位标记，也可以只抓取一个附加对位标记，根据附加对位标记的位置信息和附加对位标记与基板的对位标记之间的位置关系、以及成功抓取的至少一个对位标记的位置信息与抓取错误的对位标记之间的位置关系确定抓取错误的对位标记的位置。
一具体实施例中，基板对位标记包括关于走线区的中心线轴对称的第一基板对位标记和第二基板对位标记，待对位基板对位标记包括对应第一基板对位标记的第一待对位基板对位标记和对应第二基板对位标记的第二待对位基板对位标记，在未出现抓取失败或抓取错误时，不需要利用附加对位标记时，对位方法具体包括：
利用图像采集设备抓取第一待对位基板对位标记，以第一待对位基板对位标记所在平面建立第一坐标系；
利用图像采集设备抓取第一基板对位标记，确定第一基板对位标记在第一坐标系中的第一坐标；
利用图像采集设备抓取第二待对位基板对位标记，以第二待对位基板对位标记所在平面建立第二坐标系；
利用图像采集设备抓取第二基板对位标记，确定第二基板对位标记在第二坐标系中的第二坐标；
根据第一坐标和第二坐标将基板与待对位基板进行对位。
在进行对位时，首先将基板进行旋转，使Y1＝Y2；再在Y方向上将基板移动Y1的距离，使Y1＝Y2＝0；接着在X方向上将基板移动(X1+X2)/2的距离，即可完成对位，最后可以进行压接点灯，其中，第一坐标为(X1，Y1)，第二坐标为(X2，Y2)。
一具体实施例中，基板的对位标记包括关于基板的走线区的中心线轴对称的第一基板对位标记和第二基板对位标记，待对位基板的对位标记包括对应第一基板对位标记的第一待对位基板对位标记和对应第二基板对位标记的 第二待对位基板对位标记，以待对位基板的至少两个对位标记所在平面建立坐标系包括：
以第一待对位基板对位标记和第二待对位基板对位标记所在平面建立坐标系，并分别计算第一待对位基板对位标记和第二待对位基板对位标记在坐标系中的第一坐标和第二坐标；
确定基板的对位标记在坐标系中的坐标包括：
确定第一基板对位标记和第二基板对位标记在坐标系中的第三坐标和第四坐标；
根据坐标将基板与待对位基板进行对位包括：
根据第一坐标、第二坐标、第三坐标和第四坐标将待对位基板与基板进行对位。
进一步地，根据第一坐标、第二坐标、第三坐标和第四坐标将待对位基板与基板进行对位包括：
对基板进行旋转，使得(Y1-Y5)＝(Y2-Y6)；
在Y轴方向上将基板移动(Y1-Y5)的距离，使得(Y1-Y5)＝(Y2-Y6)＝0；
在X轴方向上将基板移动(X1+X2-X5-X6)/2的距离；其中，根据X1、X2、X5、X6的取值的不同，(X1+X2-X5-X6)/2的计算结果为正值或负值，在(X1+X2-X5-X6)/2的计算结果为正值时，是将基板向X轴正向移动(X1+X2-X5-X6)/2的绝对值的距离，在(X1+X2-X5-X6)/2的计算结果为负值时，是将基板向X轴负向移动(X1+X2-X5-X6)/2的绝对值的距离；
其中，第一坐标为(X5，Y5)，第二坐标为(X6，Y6)，第三坐标为(X1,Y1)，第四坐标为(X2，Y2)。
下面以基板为显示基板，待对位基板为电学检测电路板，显示基板上设置有附件对位标记，电学检测电路板上未设置附加对位标记为例，结合附图以及具体的实施例对本公开的对位方法进行进一步介绍：
本实施例中，电学检测电路板1上设置有一对电路板对位标记3，该对电路板对位标记3关于电学检测电路板1的中心线轴对称，具体可以为T字型；在显示基板的走线区2设置有一对显示基板对位标记4，该对显示基板 对位标记4关于走线区2的中心线轴对称，具体可以为T字型；在走线区2还设置有一对附加对位标记5，为了与显示基板对位标记4相区分，附加对位标记5的形状与显示基板对位标记4不同，具体可以为三角形。
在相关技术中的对位方法中，图像采集设备A抓取其中一个电路板对位标记3，以此建立坐标系A，抓取与该电路板对位标记3对应的显示基板对位标记4，计算该显示基板对位标记4在坐标系A中的坐标(X1，Y1)；图像采集设备B抓取另外一个电路板对位标记3，以此建立坐标系B，抓取与该电路板对位标记3对应的显示基板对位标记4，计算该显示基板对位标记4在坐标系B中的坐标(X2，Y2)。其中，以电路板对位标记3的位置建立坐标系时，电路板对位标记3位于该坐标系所在平面，且该坐标系所在平面与走线区所在平面平行，显示基板对位标记4在坐标系中的坐标为显示基板对位标记4在坐标系所在平面上正投影的中心点在该坐标系中的坐标。
在进行对位时，首先将显示基板进行旋转，使Y1＝Y2；再在Y方向上将显示基板移动Y1的距离，使Y1＝Y2＝0；接着在X方向上将显示基板移动(X1+X2)/2的距离，即可完成对位，最后可以进行压接点灯。
相关技术中，如果显示基板对位标记4被污染，抓取显示基板对位标记4失败，设备报警，需要人员去进行手动解除报警，将影响设备产能；如果显示基板对位标记4抓取错误，设备无法辨别，导致点灯时产品异常，将影响设备良率。
本实施例中，利用图像采集设备抓取两个电路板对位标记3，以两个电路板对位标记3的位置建立坐标系C，其中，两个电路板对位标记3均位于该坐标系C所在平面，且该坐标系C所在平面与走线区所在平面平行，显示基板对位标记4在坐标系C中的坐标为显示基板对位标记4在坐标系C所在平面上正投影的中心点在该坐标系C中的坐标。
计算出两个电路板对位标记3的中心点在坐标系C中的坐标分别为(X5，Y5)、(X6，Y6)。
然后图像采集设备抓取与电路板对位标记3对应的一对显示基板对位标记4，计算该对显示基板对位标记4在坐标系C中的坐标分别为(X1，Y1)、 (X2，Y2)，判断(X1，Y1)、(X2，Y2)之间的位置关系是否满足预设的两个显示基板对位标记4之间的位置关系，如果满足，则说明抓取显示基板对位标记4成功，如果不满足，则说明抓取显示基板对位标记4错误。比如根据(X1，Y1)、(X2，Y2)计算预设的两个显示基板对位标记4之间的距离，如果满足预设的距离，则说明抓取成功，如果不满足预设的距离，则说明抓取失败。
如果抓取显示基板对位标记4成功，在进行对位时，首先对显示基板进行旋转，使得(Y1-Y5)＝(Y2-Y6)；然后在Y轴方向上将显示基板移动(Y1-Y5)的距离，使得(Y1-Y5)＝(Y2-Y6)＝0；再在X轴方向上将显示基板移动(X1+X2-X5-X6)/2的距离，即可完成对位，最后可以进行压接点灯。
如图2所示，在其中一个显示基板对位标记4(X1，Y1)被污染时，如果抓取该显示基板对位标记4失败，则抓取其中一个附加对位标记5和另一个显示基板对位标记4(X2，Y2)，计算附加对位标记5的坐标，比如为(X4，Y4)，根据预设的附加对位标记5与显示基板对位标记4(X1，Y1)之间的位置关系、以及另一显示基板对位标记4(X2，Y2)与显示基板对位标记4(X1，Y1)之间的位置关系计算出正确的(X1，Y1)，此时设备无需报警。在显示基板制作完毕后，附加对位标记5与显示基板对位标记4之间的位置关系即是固定的，该位置关系可以包括附加对位标记5与显示基板对位标记4之间的距离，根据该位置关系和附加对位标记5的坐标以及另一显示基板对位标记4(X2，Y2)与显示基板对位标记4(X1，Y1)之间的位置关系可以确定显示基板对位标记4的坐标(X1，Y1)。
如果抓取两个显示基板对位标记4失败或者两个显示基板对位标记4都被污染时，可以获得至少两个附加对位标记5的坐标以及至少两个附加对位标记5与这两个显示基板对位标记4之间的位置关系，根据至少两个附加对位标记5的坐标以及至少两个附加对位标记5与这两个显示基板对位标记4之间的位置关系确定这两个显示基板对位标记4的坐标(X1，Y1)，(X2，Y2)。
为了避免抓取附加对位标记5失败，当抓取到附加对位标记5的坐标为 (X3，Y3)以及其中一个显示基板对位标记4的坐标为(X2，Y2)后，计算(X3,Y3)与(X2,Y2)的相对距离，若计算结果不满足预设的附加对位标记5与显示基板对位标记4之间的位置关系，说明可能出现了抓取附加对位标记5失败，则自动抓取另外一个附加对位标记5，比如坐标为(X4，Y4)的附加对位标记5，计算(X4，Y4)与(X2,Y2)的相对距离，若计算结果满足预设的附加对位标记5与显示基板对位标记4之间的位置关系，则说明抓取附加对位标记5成功，在验证(X4，Y4)为正确的附加对位标记5的坐标后，根据预设的附加对位标记5与显示基板对位标记4之间的位置关系计算出正确的(X1，Y1)；如果(X4，Y4)仍不是正确的附加对位标记5的坐标，则继续抓取另外一个附加对位标记5，依次类推。
在计算出正确的(X1，Y1)、(X2，Y2)后，即可根据(X1，Y1)、(X2，Y2)进行对位，首先对显示基板进行旋转，使得(Y1-Y5)＝(Y2-Y6)；然后在Y轴方向上将显示基板移动(Y1-Y5)的距离，使得(Y1-Y5)＝(Y2-Y6)＝0；再在X轴方向上将显示基板移动(X1+X2-X5-X6)/2的距离，即可完成对位，最后可以进行压接点灯。其中，(X1+X2-X5-X6)/2的计算结果为正值或负值，在(X1+X2-X5-X6)/2的计算结果为正值时，是将显示基板向X轴正向移动(X1+X2-X5-X6)/2的绝对值的距离，在(X1+X2-X5-X6)/2的计算结果为负值时，是将显示基板向X轴负向移动(X1+X2-X5-X6)/2的绝对值的距离。
本实施例的技术方案中，也可以在电学检测电路板上设置附加对位标记，电学检测电路板还包括与电学检测电路板的对位标记形状不同的附加对位标记，这样在抓取电学检测电路板的对位标记建立坐标系时，如果抓取电学检测电路板的对位标记失败或者错误，可以抓取电学检测电路板的附加对位标记，利用附加对位标记确定电学检测电路板的对位标记的位置。
本公开实施例还提供了一种电学性检测方法，采用如上的对位方法将基板与待对位基板进行对位后，将电学检测电路板压接在基板的引线区上，对基板进行电学性检测。
本公开实施例还提供了一种对位装置，用于将如上的基板与待对位基板进行对位，待对位基板上设置有待对位基板对位标记，如图3所示，对位装 置包括：
处理模块21，用于利用图像采集设备抓取所述待对位基板的对位标记，以所述待对位基板的至少两个对位标记所在平面建立坐标系；
计算模块22，用于利用所述图像采集设备抓取所述基板的对位标记和/或附加对位标记，确定所述基板的对位标记在所述坐标系中的坐标；
对位模块23，用于根据所述坐标将所述基板与所述待对位基板进行对位。本实施例中，在基板增加与基板对位标记形状不同的附加对位标记，这样在基板对位标记受到污染，导致抓取基板对位标记失败或错误后，可以抓取附加对位标记，根据附加对位标记与基板对位标记之间的位置关系计算出基板对位标记的位置，确保基板与待对位基板正确对位。
一具体实施例中，所述待对位基板还包括与所述待对位基板的对位标记形状不同的附加对位标记，处理模块21具体用于利用所述图像采集设备抓取所述待对位基板的对位标记；在抓取失败时，利用所述图像采集设备抓取所述待对位基板的附加对位标记，根据所述待对位基板的附加对位标记与所述待对位基板的对位标记之间的位置关系确定所述待对位基板的对位标记的位置。
一具体实施例中，所述待对位基板还包括与所述待对位基板的对位标记形状不同的附加对位标记，处理模块21具体用于利用所述图像采集设备抓取所述待对位基板的至少两个对位标记；判断抓取的所述待对位基板的至少两个对位标记是否满足预设的所述至少两个对位标记之间的位置关系；在不满足时，判断出现抓取错误，利用所述图像采集设备抓取所述待对位基板的附加对位标记，根据所述待对位基板的附加对位标记与所述待对位基板的对位标记之间的位置关系确定所述待对位基板的对位标记的位置。
一具体实施例中，计算模块22具体用于利用所述图像采集设备抓取所述基板的对位标记；在抓取失败时，利用所述图像采集设备抓取所述基板的附加对位标记和其他对位标记中的至少两个，根据所述基板的附加对位标记和其他对位标记中的至少两个与该对位标记之间的位置关系确定该对位标记在所述坐标系中的坐标。
一具体实施例中，计算模块22具体用于利用所述图像采集设备抓取所述基板的至少两个对位标记；判断抓取的所述基板的至少两个对位标记是否满足预设的所述至少两个对位标记之间的位置关系；在不满足时，判断出现抓取错误，利用所述图像采集设备抓取所述基板的附加对位标记，根据所述基板的附加对位标记和抓取正确的对位标记中的至少两个与所述基板的对位标记之间的位置关系确定所述基板的对位标记在所述坐标系中的坐标。
一具体实施例中，所述基板的对位标记包括关于所述基板的走线区的中心线轴对称的第一基板对位标记和第二基板对位标记，所述待对位基板的对位标记包括对应所述第一基板对位标记的第一待对位基板对位标记和对应所述第二基板对位标记的第二待对位基板对位标记，
处理模块21具体用于利用图像采集设备抓取第一待对位基板对位标记和第二待对位基板对位标记的位置，以第一待对位基板对位标记和第二待对位基板对位标记所在平面建立坐标系，计算第一待对位基板对位标记和第二待对位基板对位标记在坐标系中的第一坐标和第二坐标；
计算模块22具体用于利用图像采集设备抓取基板上的第一基板对位标记和第二基板对位标记，确定第一基板对位标记和第二基板对位标记在坐标系中的第三坐标和第四坐标；
对位模块23具体用于根据第一坐标、第二坐标、第三坐标和第四坐标将待对位基板与基板进行对位。
进一步地，对位模块23包括：
旋转单元，用于对基板进行旋转，使得(Y1-Y5)＝(Y2-Y6)；
第一移动单元，用于在Y轴方向上将基板移动(Y1-Y5)的距离，使得(Y1-Y5)＝(Y2-Y6)＝0；
第二移动单元，用于在X轴方向上将基板移动(X1+X2-X5-X6)/2的距离；其中，根据X1、X2、X5、X6的取值的不同，(X1+X2-X5-X6)/2的计算结果为正值或负值，在(X1+X2-X5-X6)/2的计算结果为正值时，是将基板向X轴正向移动(X1+X2-X5-X6)/2的绝对值的距离，在(X1+X2-X5-X6)/2的计算结果为负值时，是将基板向X轴负向移动(X1+X2-X5-X6)/2的绝对值的距离；
其中，第一坐标为(X5，Y5)，第二坐标为(X6，Y6)，第三坐标为(X1,Y1)，第四坐标为(X2，Y2)。
本公开实施例还提供了一种对位设备，包括：存储器、处理器及存储在存储器上并可在处理器上运行的计算机程序，计算机程序被处理器执行时实现如上的对位方法中的步骤。
本公开实施例还提供了一种计算机可读存储介质，计算机可读存储介质上存储有计算机程序，计算机程序被处理器执行时实现如上的对位方法中的步骤，或者，计算机程序被处理器执行时实现如上的电学性检测方法中的步骤。
可以理解的是，本文描述的这些实施例可以用硬件、软件、固件、中间件、微码或其组合来实现。对于硬件实现，处理单元可以实现在一个或多个专用集成电路(Application Specific Integrated Circuits，ASIC)、数字信号处理器(Digital Signal Processing，DSP)、数字信号处理设备(DSP Device，DSPD)、可编程逻辑设备(Programmable Logic Device，PLD)、现场可编程门阵列(Field-Programmable Gate Array，FPGA)、通用处理器、控制器、微控制器、微处理器、用于执行本申请所述功能的其它电子单元或其组合中。
对于软件实现，可通过执行本文所述功能的模块(例如过程、函数等)来实现本文所述的技术。软件代码可存储在存储器中并通过处理器执行。存储器可以在处理器中或在处理器外部实现。
本说明书中的各个实施例均采用递进的方式描述，每个实施例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似的部分互相参见即可。
本领域内的技术人员应明白，本公开实施例的实施例可提供为方法、装置、或计算机程序产品。因此，本公开实施例可采用完全硬件实施例、完全软件实施例、或结合软件和硬件方面的实施例的形式。而且，本公开实施例可采用在一个或多个其中包含有计算机可用程序代码的计算机可用存储介质(包括但不限于磁盘存储器、CD-ROM、光学存储器等)上实施的计算机程序产品的形式。
本公开实施例是参照根据本公开实施例的方法、用户设备(系统)、和计算机程序产品的流程图和/或方框图来描述的。应理解可由计算机程序指令实现流程图和/或方框图中的每一流程和/或方框、以及流程图和/或方框图中的流程和/或方框的结合。可提供这些计算机程序指令到通用计算机、专用计算机、嵌入式处理机或其他可编程数据处理用户设备的处理器以产生一个机器，使得通过计算机或其他可编程数据处理用户设备的处理器执行的指令产生用于实现在流程图一个流程或多个流程和/或方框图一个方框或多个方框中指定的功能的装置。
这些计算机程序指令也可存储在能引导计算机或其他可编程数据处理用户设备以特定方式工作的计算机可读存储器中，使得存储在该计算机可读存储器中的指令产生包括指令装置的制造品，该指令装置实现在流程图一个流程或多个流程和/或方框图一个方框或多个方框中指定的功能。
这些计算机程序指令也可装载到计算机或其他可编程数据处理用户设备上，使得在计算机或其他可编程用户设备上执行一系列操作步骤以产生计算机实现的处理，从而在计算机或其他可编程用户设备上执行的指令提供用于实现在流程图一个流程或多个流程和/或方框图一个方框或多个方框中指定的功能的步骤。
尽管已描述了本公开实施例的可选实施例，但本领域内的技术人员一旦得知了基本创造性概念，则可对这些实施例做出另外的变更和修改。所以，所附权利要求意欲解释为包括可选实施例以及落入本公开实施例范围的所有变更和修改。
还需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者用户设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者用户设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要 素，并不排除在包括所述要素的过程、方法、物品或者用户设备中还存在另外的相同要素。
以上所述的是本公开的可选实施方式，应当指出对于本技术领域的普通人员来说，在不脱离本公开所述的原理前提下还可以作出若干改进和润饰，这些改进和润饰也在本公开的保护范围内。

Claims (14)

  1. 一种基板，所述基板设置有对位标记，其中，所述基板还设置有与所述对位标记形状不同的附加对位标记。
  2. 根据权利要求1所述的基板，其中，所述对位标记位于所述基板的走线区，所述对位标记包括关于所述走线区的中心线轴对称的第一对位标记和第二对位标记，每一对位标记对应至少一个附加对位标记。
  3. 根据权利要求2所述的基板，其中，每一对位标记和与所述每一对位标记对应的附加对位标记之间的位置关系固定。
  4. 根据权利要求3所述的基板，其中，每一对位标记和与所述每一对位标记对应的附加对位标记之间的距离固定。
  5. 一种对位方法，用于将如权利要求1至4中任何一项所述的基板与固定的待对位基板进行对位，所述对位方法包括：
    利用图像采集设备抓取所述待对位基板的对位标记，以所述待对位基板的至少两个对位标记所在平面建立坐标系；
    利用所述图像采集设备抓取所述基板的对位标记和/或附加对位标记，确定所述基板的对位标记在所述坐标系中的坐标；
    根据所述坐标将所述基板与所述待对位基板进行对位。
  6. 根据权利要求5所述的对位方法，其中，所述待对位基板为如权利要求1至4中任何一项所述的基板，所述待对位基板还包括与所述待对位基板的对位标记形状不同的附加对位标记，所述利用图像采集设备抓取所述待对位基板的对位标记包括：
    利用所述图像采集设备抓取所述待对位基板的对位标记；
    在抓取失败时，利用所述图像采集设备抓取所述待对位基板的附加对位标记，根据所述待对位基板的附加对位标记与所述待对位基板的对位标记之间的位置关系确定所述待对位基板的对位标记的位置。
  7. 根据权利要求5所述的对位方法，其中，所述待对位基板为如权利要求1至4中任何一项所述的基板，所述待对位基板还包括与所述待对位基板 的对位标记形状不同的附加对位标记，所述利用图像采集设备抓取所述待对位基板的对位标记包括：
    利用所述图像采集设备抓取所述待对位基板的至少两个对位标记；
    判断抓取的所述待对位基板的至少两个对位标记是否满足预设的所述至少两个对位标记之间的位置关系；
    在不满足时，判断出现抓取错误，利用所述图像采集设备抓取所述待对位基板的附加对位标记，根据所述待对位基板的附加对位标记与所述待对位基板的对位标记之间的位置关系确定所述待对位基板的对位标记的位置。
  8. 根据权利要求5所述的对位方法，其中，所述利用所述图像采集设备抓取所述基板的对位标记和/或附加对位标记，确定所述基板的对位标记在所述坐标系中的坐标包括：
    利用所述图像采集设备抓取所述基板的对位标记；
    在抓取失败时，利用所述图像采集设备抓取所述基板的附加对位标记和其他对位标记中的至少两个，根据所述基板的附加对位标记和其他对位标记中的至少两个与该对位标记之间的位置关系确定该对位标记在所述坐标系中的坐标。
  9. 根据权利要求5所述的对位方法，其中，所述利用所述图像采集设备抓取所述基板的对位标记和/或附加对位标记，确定所述基板的对位标记在所述坐标系中的坐标包括：
    利用所述图像采集设备抓取所述基板的至少两个对位标记；
    判断抓取的所述基板的至少两个对位标记是否满足预设的所述至少两个对位标记之间的位置关系；
    在不满足时，判断出现抓取错误，利用所述图像采集设备抓取所述基板的附加对位标记，根据所述基板的附加对位标记和抓取正确的对位标记中的至少两个与所述基板的对位标记之间的位置关系确定所述基板的对位标记在所述坐标系中的坐标。
  10. 根据权利要求5所述的对位方法，其中，所述基板的对位标记包括关于所述基板的走线区的中心线轴对称的第一基板对位标记和第二基板对位 标记，所述待对位基板的对位标记包括对应所述第一基板对位标记的第一待对位基板对位标记和对应所述第二基板对位标记的第二待对位基板对位标记，所述以所述待对位基板的至少两个对位标记所在平面建立坐标系包括：
    以所述第一待对位基板对位标记和所述第二待对位基板对位标记所在平面建立坐标系，并分别计算所述第一待对位基板对位标记和第二待对位基板对位标记在所述坐标系中的第一坐标和第二坐标；
    所述确定所述基板的对位标记在所述坐标系中的坐标包括：
    确定所述第一基板对位标记和第二基板对位标记在所述坐标系中的第三坐标和第四坐标；
    所述根据所述坐标将所述基板与所述待对位基板进行对位包括：
    根据所述第一坐标、第二坐标、第三坐标和第四坐标将所述待对位基板与所述基板进行对位。
  11. 根据权利要求10所述的对位方法，其中，所述根据所述第一坐标、第二坐标、第三坐标和第四坐标将所述待对位基板与所述基板进行对位包括：
    对所述基板进行旋转，使得(Y1-Y5)＝(Y2-Y6)；
    在Y轴方向上将所述基板移动(Y1-Y5)的距离，使得(Y1-Y5)＝(Y2-Y6)＝0；
    在X轴方向上将所述基板移动(X1+X2-X5-X6)/2的距离，在(X1+X2-X5-X6)/2的计算结果为正值时，将基板向X轴正向移动(X1+X2-X5-X6)/2的绝对值的距离，在(X1+X2-X5-X6)/2的计算结果为负值时，将基板向X轴负向移动(X1+X2-X5-X6)/2的绝对值的距离；
    其中，第一坐标为(X5，Y5)，第二坐标为(X6，Y6)，第三坐标为(X1,Y1)，第四坐标为(X2，Y2)。
  12. 一种对位装置，用于执行如权利要求5-11中任一项所述的对位方法，所述对位装置包括：
    处理模块，用于利用图像采集设备抓取所述待对位基板的对位标记，以所述待对位基板的至少两个对位标记所在平面建立坐标系；
    计算模块，用于利用所述图像采集设备抓取所述基板的对位标记和/或附加对位标记，确定所述基板的对位标记在所述坐标系中的坐标；
    对位模块，用于根据所述坐标将所述基板与所述待对位基板进行对位。
  13. 一种对位设备，包括：存储器、处理器及存储在所述存储器上并可在所述处理器上运行的计算机程序，所述计算机程序被所述处理器执行时实现如权利要求5-11中任一项所述的对位方法中的步骤。
  14. 一种计算机可读存储介质，其中，所述计算机可读存储介质上存储有计算机程序，所述计算机程序被处理器执行时实现如权利要求5-11中任一项所述的对位方法中的步骤。
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