WO2020105457A1 - Matériau de transfert, procédé de production de motif de résine, procédé de production de câblage de circuit et procédé de production d'écran tactile - Google Patents

Matériau de transfert, procédé de production de motif de résine, procédé de production de câblage de circuit et procédé de production d'écran tactile

Info

Publication number
WO2020105457A1
WO2020105457A1 PCT/JP2019/043695 JP2019043695W WO2020105457A1 WO 2020105457 A1 WO2020105457 A1 WO 2020105457A1 JP 2019043695 W JP2019043695 W JP 2019043695W WO 2020105457 A1 WO2020105457 A1 WO 2020105457A1
Authority
WO
WIPO (PCT)
Prior art keywords
group
photosensitive resin
resin layer
transfer material
pattern
Prior art date
Application number
PCT/JP2019/043695
Other languages
English (en)
Japanese (ja)
Inventor
洋行 海鉾
藤本　進二
一真 両角
Original Assignee
富士フイルム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士フイルム株式会社 filed Critical 富士フイルム株式会社
Priority to CN201980075793.4A priority Critical patent/CN113056373A/zh
Priority to JP2020558258A priority patent/JPWO2020105457A1/ja
Publication of WO2020105457A1 publication Critical patent/WO2020105457A1/fr

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/02—Halogenated hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C08L101/14—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity the macromolecular compounds being water soluble or water swellable, e.g. aqueous gels
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means

Definitions

  • the present disclosure relates to a transfer material, a resin pattern manufacturing method, a circuit wiring manufacturing method, and a touch panel manufacturing method.
  • a display device organic electroluminescence (EL) display device, liquid crystal display device, etc.
  • a touch panel such as a capacitance type input device
  • an electrode pattern corresponding to a sensor of a visual recognition part a wiring of a peripheral wiring part and an extraction wiring part
  • a conductive layer pattern such as is provided inside the touch panel.
  • a patterned layer is formed by a small number of steps for obtaining a required pattern shape. Therefore, a layer of a photosensitive resin composition provided on an arbitrary substrate using a photosensitive transfer material.
  • a method of developing after exposing through a mask having a desired pattern is widely used.
  • Patent Document 1 has a temporary support, an intermediate layer, and a photosensitive resin composition layer in this order, and the photosensitive resin composition layer has an acid group protected by an acid-decomposable group. Containing a polymer having a structural unit, and a photoacid generator, the intermediate layer is water-soluble or alkali-soluble, and a structural unit having a phenolic hydroxyl group or an alcoholic hydroxyl group not directly linked to the main chain Photosensitive transfer materials containing Resin C containing are described.
  • Patent Document 2 At least one transfer layer is provided on a temporary support, and the maximum peeling force when peeling the temporary support is 0.98 to 5.39 mN / cm in a 180 ° peel method. Certain transfer laminates are described.
  • Patent Document 1 International Publication No. 2018/179640
  • Patent Document 2 Japanese Patent Application Laid-Open No. 2009-73022
  • the problem to be solved by one embodiment of the present invention is to provide a transfer material having less streaks on the surface to be transferred. Further, another problem to be solved by another embodiment of the present invention is to provide a method for manufacturing a resin pattern using the above transfer material, a method for manufacturing circuit wiring, and a method for manufacturing a touch panel.
  • Means for solving the above problems include the following aspects.
  • the surfactant contains a compound having a molecular weight of 700 or more.
  • the surfactant has a solubility of 1 g or more in 100 g of water at 25 ° C.
  • ⁇ 4> The content of the surfactant according to any one of ⁇ 1> to ⁇ 3>, which is 0.1% by mass to 1.0% by mass with respect to the total mass of the intermediate layer.
  • ⁇ 5> The transfer material according to any one of ⁇ 1> to ⁇ 4>, wherein the surfactant is a surfactant having a fluoroalkyl group and an alkyleneoxy group.
  • ⁇ 6> The transfer material according to any one of ⁇ 1> to ⁇ 5>, wherein the surfactant is a surfactant having a perfluoroalkyl group and a polyalkyleneoxy group.
  • ⁇ 7> Any one of ⁇ 1> to ⁇ 6>, wherein the content of the polymer component in the positive photosensitive resin layer is 75% by mass or more based on the total mass of the positive photosensitive resin layer.
  • the transfer material described in 1. ⁇ 8> Any one of ⁇ 1> to ⁇ 7>, in which the positive photosensitive resin layer contains a polymer containing a structural unit having an acid group protected by an acid-decomposable group, and a photo-acid generator.
  • the transfer material according to one. ⁇ 9> The transfer material according to ⁇ 8>, wherein the structural unit having an acid group protected by an acid-decomposable group is a structural unit represented by any one of the following formulas A1 to A3.
  • R 11 and R 12 each independently represent a hydrogen atom, an alkyl group or an aryl group, at least one of R 11 and R 12 is an alkyl group or an aryl group, and R 13 is an alkyl group or It represents an aryl group, R 11 or R 12 and R 13 may be linked to form a cyclic ether, R 14 is a hydrogen atom or a methyl group, and X 1 is a single bond or a divalent linking group.
  • R 15 represents a substituent, and n represents an integer of 0 to 4.
  • R 21 and R 22 each independently represent a hydrogen atom, an alkyl group or an aryl group, at least one of R 21 and R 22 is an alkyl group or an aryl group, and R 23 is an alkyl group or It represents an aryl group, and R 21 or R 22 and R 23 may be linked to form a cyclic ether, and R 24 is independently a hydroxy group, a halogen atom, an alkyl group, an alkoxy group, an alkenyl group, It represents an aryl group, an aralkyl group, an alkoxycarbonyl group, a hydroxyalkyl group, an arylcarbonyl group, an aryloxycarbonyl group or a cycloalkyl group, and m represents an integer of 0 to 3.
  • R 31 and R 32 each independently represent a hydrogen atom, an alkyl group or an aryl group, at least one of R 31 and R 32 is an alkyl group or an aryl group, and R 33 is an alkyl group or It represents an aryl group, R 31 or R 32 and R 33 may be linked to form a cyclic ether, R 34 represents a hydrogen atom or a methyl group, and X 0 represents a single bond or a divalent linking group. Represents.
  • a method of manufacturing a resin pattern comprising: a step of pattern-exposing the positive photosensitive resin layer, and a step of developing the exposed positive photosensitive resin layer to form a resin pattern, in this order.
  • the outermost layer on the side having the positive photosensitive resin layer with respect to the temporary support in the transfer material according to any one of ⁇ 1> to ⁇ 9> is brought into contact with a substrate having a conductive layer.
  • a step of patterning the positive photosensitive resin layer, a step of developing the exposed positive photosensitive resin layer to form a resin pattern, and the resin pattern are arranged. And a step of etching the conductive layer in a non-existing region in this order.
  • the outermost layer on the side having the positive photosensitive resin layer with respect to the temporary support in the transfer material according to any one of ⁇ 1> to ⁇ 9> is brought into contact with a substrate having a conductive layer.
  • a step of patterning the positive photosensitive resin layer, a step of developing the exposed positive photosensitive resin layer to form a resin pattern, and the resin pattern are arranged. And a step of etching the conductive layer in a non-existing region in this order.
  • the numerical range represented by “to” means a range including the numerical values before and after “to” as the lower limit value and the upper limit value.
  • “(meth) acryl” represents both acryl and methacryl, or either, and "(meth) acrylate” represents both an acrylate and a methacrylate.
  • the amount of each component in the composition is the sum of the corresponding plurality of substances present in the composition, unless a plurality of substances corresponding to each component are present in the composition. Means quantity.
  • the term “process” is included not only in an independent process but also in the case where the intended purpose of the process is achieved even when it cannot be clearly distinguished from other processes.
  • the notation in which substitution and non-substitution are not included includes not only those having no substituent but also those having a substituent.
  • the “alkyl group” includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
  • exposure as used herein includes not only exposure using light but also drawing using particle beams such as electron beams and ion beams.
  • the light used for the exposure generally, the bright line spectrum of a mercury lamp, far ultraviolet rays represented by an excimer laser, extreme ultraviolet rays (EUV light), active rays (active energy rays) such as X-rays and electron rays are used.
  • far ultraviolet rays represented by an excimer laser
  • EUV light extreme ultraviolet rays
  • active energy rays active energy rays
  • the chemical structural formula in the present specification may be described as a simplified structural formula in which a hydrogen atom is omitted.
  • “mass%” and “weight%” have the same meaning
  • “mass part” and “weight part” have the same meaning.
  • a combination of two or more preferable aspects is a more preferable aspect.
  • the weight average molecular weight (Mw) and the number average molecular weight (Mn) in the present disclosure use columns of TSKgel GMHxL, TSKgel G4000HxL, and TSKgel G2000HxL (both manufactured by Tosoh Corporation) unless otherwise specified.
  • the gel permeation chromatography (GPC) analyzer was used to detect the solvent THF (tetrahydrofuran) with a differential refractometer, and the molecular weight was calculated using polystyrene as a standard substance.
  • the transfer material (also referred to as “photosensitive transfer material”) according to the present disclosure includes a temporary support, an intermediate layer containing a water-soluble resin, and a positive photosensitive resin layer (hereinafter, also simply referred to as “photosensitive resin layer”). And) in this order, and the intermediate layer contains a surfactant having a fluorine atom.
  • the transfer material according to the present disclosure is a positive photosensitive transfer material.
  • the positive type photosensitive resin layer is a hard layer containing a resin as a main component and has low fluidity.
  • Shape defects such as stripes which are influenced by the shape of the intermediate layer when the intermediate layer is formed reflect similar shape defects to the positive photosensitive resin layer, and further When the layer of No. 1 is further formed, similar shape defects may be reflected up to that layer.
  • the surface to be transferred is The present inventors have found that there is a problem that streaks occur in the above.
  • the negative photosensitive resin layer described in Patent Document 2 and the like is a layer containing a polymerizable compound and has high fluidity, and thus streaks and the like generated during the formation of the intermediate layer during the formation of the negative photosensitive resin layer.
  • the influence of the shape defect is not reflected, and the negative photosensitive resin layer is flattened, so that the problem of streaks on the transferred surface does not occur as described above. Therefore, the problem of reducing streaks on the transferred surface is a problem peculiar to the positive photosensitive resin layer.
  • the “transfer surface” is also referred to as a “transfer surface”, and for example, if the transfer material has a temporary support, an intermediate layer, and a positive photosensitive resin layer in this order, This is the surface on the positive photosensitive resin layer side.
  • the transfer material having the above-mentioned structure can provide a transfer material having few streaks on the surface to be transferred.
  • the intermediate layer contains a surfactant having a fluorine atom
  • Generation of streaks on the surface of the intermediate layer is suppressed
  • deterioration of the surface shape of the positive photosensitive resin layer due to the generation of streaks is suppressed
  • a transfer material having few streaks on the surface to be transferred is obtained. It is estimated to be. It is presumed that the above-mentioned generation of streaks is caused by convection of the intermediate layer forming layer composition during the formation of the intermediate layer and uneven volatilization of the solvent contained in the intermediate layer forming layer composition.
  • the positive photosensitive resin layer is a hard layer containing a resin as a main component and has low fluidity, so that the influence of the stripes generated in the intermediate layer is reflected on the transfer surface, and Occurs.
  • Generation of the streak can be suppressed by including the surfactant having a fluorine atom in the intermediate layer. Since the generation of the streaks is suppressed, at the time of transfer, at the bonded portion on the transfer surface, it is possible to suppress bubbles from entering the streaks, excellent adhesion on the transfer surface, and a transfer material as an etching resist.
  • the transfer material according to the present disclosure has excellent adhesiveness in transfer due to the above-described configuration, and has few wiring defects when the transfer material is used as the etching resist.
  • the transfer material according to the present disclosure has an intermediate layer.
  • the intermediate layer contains a fluorine atom-containing surfactant and a water-soluble resin, and preferably contains a fluorine atom-containing surfactant, a water-soluble resin, and a dye described below.
  • the intermediate layer contains a surfactant having a fluorine atom.
  • the surfactant having a fluorine atom include compounds having a group having a fluorine atom and a hydrophilic group.
  • the surfactant having a fluorine atom may have only one group having a fluorine atom or may have two or more groups.
  • the surfactant having a fluorine atom may have only one hydrophilic group or two or more hydrophilic groups.
  • the surfactant having a fluorine atom preferably has a fluoroalkyl group or a fluoroaryl group as a group having a fluorine atom, more preferably a fluoroalkyl group, and a perfluoroalkyl group. It is particularly preferable to have a group.
  • the perfluoroalkyl group is preferably a perfluoroalkyl group having 4 or more carbon atoms, more preferably a perfluoroalkyl group having 4 to 18 carbon atoms, A perfluoroalkyl group having 4 to 12 carbon atoms is more preferable, and a perfluoroalkyl group having 4 to 6 carbon atoms is particularly preferable.
  • the surfactant having a fluorine atom is an ionic surfactant having a fluorine atom or a nonionic surfactant having a fluorine atom, from the viewpoints of suppressing the generation of streaks and the adhesion on the transfer surface during transfer. Is more preferable, an anionic surfactant having a fluorine atom or a nonionic surfactant having a fluorine atom is more preferable, and a nonionic surfactant having a fluorine atom is particularly preferable.
  • the ionic hydrophilic group, hydrophilicity, suppression of streak generation, and from the viewpoint of adhesion on the transfer surface at the time of transfer preferably an acid group, a carboxy group, a sulfo group, a phosphonic acid group, Alternatively, a phosphoric acid group is more preferable, and a phosphoric acid group is particularly preferable.
  • an alkyleneoxy group or a hydroxy group is preferable, and an alkyleneoxy group is More preferably, a polyalkyleneoxy group is particularly preferable.
  • the surfactant having a fluorine atom is at least selected from the group consisting of an acid group and an alkyleneoxy group as the hydrophilic group, from the viewpoint of suppressing the generation of streaks, and the adhesion on the transfer surface at the time of transfer. It preferably has one group, more preferably has an alkyleneoxy group, and particularly preferably has a polyalkyleneoxy group.
  • the alkyleneoxy group is preferably an ethyleneoxy group or a propyleneoxy group.
  • the polyalkyleneoxy group is preferably a polyethyleneoxy group, a polypropyleneoxy group, or a group formed by bonding one or more ethyleneoxy groups and one or more propyleneoxy groups.
  • the surfactant having a fluorine atom is preferably a surfactant having a fluoroalkyl group and an alkyleneoxy group, from the viewpoint of suppressing the generation of streaks and the adhesion on the transfer surface at the time of transfer, and perfluoro
  • a surfactant having an alkyl group and a polyalkyleneoxy group is more preferable, and a surfactant having a perfluoroalkyl group having 4 or more carbon atoms and a polyalkyleneoxy group is particularly preferable.
  • the intermediate layer may contain one type of surfactant having a fluorine atom, or two or more types thereof.
  • the surfactant having a fluorine atom in the intermediate layer preferably contains a compound having a molecular weight of 500 or more, and a compound having a molecular weight of 700 or more, from the viewpoint of suppressing the generation of streaks and the adhesion between the photosensitive resin layer and the intermediate layer. Is more preferable, and it is particularly preferable to include a compound having a molecular weight of 1,000 or more and 10,000 or less.
  • the surfactant having a fluorine atom is preferably a compound having a weight average molecular weight (Mw) of 20,000 or less, and a weight average molecular weight of 10,000 or less, from the viewpoint of adhesion on the transfer surface during transfer. More preferably, it is a compound.
  • the solubility of the fluorine atom-containing surfactant in 100 g of water at 25 ° C. is preferably 0.5 g or more, from the viewpoint of suppressing streak generation and suppressing the precipitation of the fluorine atom-containing surfactant, 1 g or more Is more preferable.
  • the surfactant having a fluorine atom each series of Megafac (manufactured by DIC Corporation) can be preferably mentioned.
  • the content of the fluorine atom-containing surfactant is from 0.05% by mass to 2% with respect to the total mass of the intermediate layer from the viewpoints of suppressing the generation of streaks and the adhesiveness between the photosensitive resin layer and the intermediate layer.
  • the content is preferably 0.0% by mass, more preferably 0.1% by mass to 1.0% by mass, and particularly preferably 0.2% by mass to 0.4% by mass.
  • the intermediate layer contains a water-soluble resin.
  • the water-soluble resin include cellulose resins, polyvinyl alcohol resins, polyvinylpyrrolidone resins, acrylamide resins, polyethylene oxide resins, gelatin, vinyl ether resins, polyamide resins, and resins such as copolymers thereof. Is mentioned. Of these, a cellulose resin is preferable, and at least one resin selected from the group consisting of hydroxypropyl cellulose and hydroxypropylmethyl cellulose is more preferable.
  • water-soluble resin a water-soluble or alkali-soluble acrylic resin is preferably mentioned.
  • water-soluble means that the solubility in 100 g of water having a pH of 7.0 at 22 ° C. is 0.1 g or more
  • alkali-soluble means sodium carbonate at 22 ° C. It means that the solubility in 100 g of a 1 mass% aqueous solution is 0.1 g or more.
  • water-soluble or alkali-soluble may be either water-soluble or alkali-soluble, or water-soluble and alkali-soluble. The solubility of the water-soluble resin in 100 g of water having a pH of 7.0 at 22 ° C.
  • the water-soluble or alkali-soluble acrylic resin preferably has a hydrophilic group, and more preferably has a structural unit having a hydrophilic group.
  • the hydrophilic group include an acid group which may form a salt, a hydroxy group, a polyalkyleneoxy group, an amide group, and a basic group which may form a salt, and the like, and from the viewpoint of adhesion, It is preferable to have at least an acid group or a hydroxy group that may form a salt.
  • the intermediate layer may contain one type of water-soluble resin or two or more types.
  • the content of the water-soluble resin, the shape of the obtained pattern, the adhesion on the transfer surface at the time of transfer, and from the viewpoint of the adhesion between the photosensitive resin layer and the intermediate layer, relative to the total mass of the intermediate layer It is preferably 20% by mass to 100% by mass, and more preferably 50% by mass to 100% by mass.
  • the intermediate layer has a maximum absorption wavelength of 450 nm or more in the wavelength range of 400 nm to 780 nm at the time of color development, and a dye (simply referred to as “dye It is also referred to as ".”
  • Dyes "maximum absorption wavelength is changed by acid, base or radical” means that the dye in the colored state is decolored by acid, base or radical, the dye in the decolored state is colored by acid, base or radical. And the aspect in which the dye in the coloring state changes to the coloring state of another hue.
  • the dye may be a compound that changes from the decolored state to a color upon exposure to light, or a compound that changes from the decolored state to a color upon exposure to light.
  • a dye whose color development or decolorization state is changed by introducing an acid, a base or a radical into the intermediate layer by exposure may be used, and a property in the system by introducing an acid, a base or a radical (
  • it may be a dye whose color-developed or decolored state changes when pH) changes.
  • it may be a dye in which an acid, a base, or a radical is directly given as a stimulus to directly change the state of color development or decolorization without exposure.
  • the dye may be a compound that develops color upon exposure to light or a compound that disappears upon exposure to light, but from the viewpoint of visibility, it is preferable that it is a compound that disappears upon exposure to light. It is more preferable to use a latent dye that is decolorized by the acid generated from the dye, that is, a pH-sensitive dye that is decolorized by changing the pH due to the generation of acid.
  • the maximum absorption wavelength in the wavelength range of 400 nm to 780 nm during color development of the dye is preferably 550 nm or more, more preferably 550 nm or more and 700 nm or less, and further preferably 550 nm or more and 650 nm or less from the viewpoint of visibility. preferable. Further, the dye may have only one maximum absorption wavelength in the wavelength range of 400 nm to 780 nm at the time of color development, or may have two or more maximum absorption wavelengths.
  • the maximum absorption wavelength having the largest absorbance among the two or more maximum absorption wavelengths may be 450 nm or more.
  • the method for measuring the maximum absorption wavelength in the present disclosure is to measure a transmission spectrum in the wavelength range of 400 nm to 780 nm using a spectrophotometer: UV3100 (manufactured by Shimadzu Corporation) at 25 ° C. in an atmosphere of air. , The wavelength at which the light intensity becomes minimum (maximum absorption wavelength) shall be measured.
  • Examples of dyes that develop color upon exposure include leuco compounds.
  • Examples of dyes that are decolorized by exposure include leuco compounds, diphenylmethane dyes, oxazine dyes, xanthene dyes, iminonaphthoquinone dyes, azomethine dyes, and anthraquinone dyes.
  • leuco compounds are preferable as the dye from the viewpoint of visibility.
  • leuco compound examples include triarylmethane-based (eg, triphenylmethane-based), spiropyran-based, fluoran-based, diphenylmethane-based, rhodamine lactam-based, indolylphthalide-based, leucoauramine-based leuco compounds.
  • triarylmethane-based eg, triphenylmethane-based
  • spiropyran-based fluoran-based
  • diphenylmethane-based rhodamine lactam-based
  • indolylphthalide-based examples of the leuco compounds
  • leuco compounds having a triarylmethane skeleton are preferable, and triphenylmethane dyes are more preferable.
  • a lactone ring, a sultin ring, or a sultone ring is preferable, and a lactone ring, a sultin ring, or a sultone ring that is opened or closed is preferable, and a sultone ring is used. It is more preferable to use a leuco compound having a sultone ring that is closed and decolorized.
  • the dye is preferably a water-soluble compound for the purpose of preventing defects due to the precipitation of the dye.
  • the solubility of the dye in 100 g of water having a pH of 7.0 at 22 ° C. is preferably 1 g or more, more preferably 5 g or more.
  • the intermediate layer may contain one kind of dye or two or more kinds of dye.
  • the content of the dye in the intermediate layer is preferably 0.01% by mass to 10% by mass, and is 0.1% by mass to 8% by mass, based on the total mass of the intermediate layer. It is more preferably 0.5% by mass to 5% by mass, further preferably 1.0% by mass to 3.0% by mass.
  • the intermediate layer may contain a surfactant other than the surfactant having a fluorine atom.
  • a surfactant any of anionic, cationic, nonionic (nonionic) and amphoteric surfactants can be used, and known surfactants can be used.
  • the content of the other surfactant in the intermediate layer is preferably smaller than the content of the fluorine atom-containing surfactant from the viewpoint of suppressing the generation of streaks. In the case of containing other surfactant, the content of the other surfactant is 0 relative to the total mass of the intermediate layer from the viewpoint of suppressing the generation of streaks and the adhesion on the transfer surface at the time of transfer. It is preferably 0.01% by mass or more and less than 2.0% by mass.
  • the intermediate layer can include an inorganic filler.
  • the inorganic filler in the present disclosure is not particularly limited. Examples thereof include silica particles, aluminum oxide particles and zirconium oxide particles, and silica particles are more preferable. From the viewpoint of transparency, particles having a small particle size are preferable, and particles having an average particle size of 100 nm or less are more preferable. For example, if it is a commercially available product, Snowtex (registered trademark) is preferably used.
  • the volume fraction of the particles in the intermediate layer is 5% to 90% with respect to the total volume of the intermediate layer from the viewpoint of adhesion between the intermediate layer and the photosensitive layer. It is preferably 10% to 80%, more preferably 15% to 70%, particularly preferably 20% to 60%. As will be described later, when the number of intermediate layers is two, the volume fraction of the particles in all the intermediate layers (volume ratio of particles in the intermediate layer) is from the viewpoint of adhesion between the intermediate layer and the photosensitive layer.
  • the total volume of the intermediate layer is preferably 2% to 90%, more preferably 3% to 80%, further preferably 5% to 20%, and 10% to 20%. It is particularly preferable that
  • the intermediate layer can include a pH adjuster.
  • the pH adjusting agent in the present disclosure is not particularly limited. Examples thereof include sodium hydroxide, potassium hydroxide, lithium hydroxide, organic amines, organic ammonium salts and the like. Sodium hydroxide is preferred from the viewpoint of water solubility. From the viewpoint of the adhesiveness between the photosensitive resin layer and the intermediate layer, organic ammonium salts are preferable.
  • organic ammonium salt examples include a primary ammonium salt, a secondary ammonium salt, a tertiary ammonium salt, and a quaternary ammonium salt, and a quaternary ammonium salt is preferable.
  • Examples of the quaternary ammonium salt include tetraalkylammonium hydroxide which may have a substituent, and specific examples thereof include tetramethylammonium hydroxide, triethylmethylammonium hydroxide, tetraethylammonium hydroxide, Examples include tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, tetrahexylammonium hydroxide, hexadecyltrimethylammonium hydroxide, choline, benzyltrimethylammonium, benzyltriethylammonium, tris (2-hydroxyethyl) methylammonium hydroxide, etc. .
  • tetraalkylammonium hydroxide having an alkyl group having 1 to 30 carbon atoms preferably 10 to 30 carbon atoms, more preferably 10 to 25 carbon atoms
  • substituent include an aryl group having 6 to 12 carbon atoms (for example, a phenyl group), a hydroxy group and the like.
  • the average thickness of the intermediate layer is preferably 0.3 ⁇ m to 10 ⁇ m, more preferably 0.3 ⁇ m to 5 ⁇ m, and more preferably 0.3 ⁇ m, from the viewpoint of adhesion between the photosensitive resin layer and the intermediate layer and pattern formability. ⁇ 2 ⁇ m is particularly preferred.
  • the average thickness of the intermediate layer is preferably thinner than the average thickness of the photosensitive resin layer.
  • the intermediate layer may have two or more layers.
  • the average thickness of each layer is not particularly limited as long as it is within the above range, but of the two or more layers in the intermediate layer, the layer closest to the photosensitive resin layer.
  • the average thickness of is preferably 0.3 ⁇ m to 10 ⁇ m, more preferably 0.3 ⁇ m to 5 ⁇ m, and more preferably 0.3 ⁇ m to 2 ⁇ m from the viewpoints of adhesion between the intermediate layer and the photosensitive resin layer and pattern formability. Particularly preferred.
  • the cross section in the direction perpendicular to the surface direction of the transfer material is observed and measured by a scanning electron microscope (SEM).
  • SEM scanning electron microscope
  • the intermediate layer in the present disclosure can be formed by adjusting, coating and drying an intermediate layer-forming composition containing components necessary for forming the intermediate layer and a water-soluble solvent. It is possible to prepare a composition for forming an intermediate layer for forming an intermediate layer by mixing the respective components and a water-soluble solvent in a predetermined ratio and by an arbitrary method and stirring and dissolving. For example, it is possible to prepare a composition by dissolving each component in a solvent in advance and then mixing the obtained solutions in a predetermined ratio. The composition prepared as described above can also be used after being filtered using a filter having a pore size of 3.0 ⁇ m or the like.
  • the intermediate layer can be formed on the temporary support by applying the intermediate layer forming composition to the temporary support and drying the composition.
  • the coating method is not particularly limited, and the coating can be performed by a known method such as slit coating, spin coating, curtain coating, inkjet coating and the like.
  • the intermediate layer forming composition preferably contains a component contained in the intermediate layer and a water-soluble solvent.
  • a water-soluble solvent is contained in each component to adjust the viscosity, and the intermediate layer can be suitably formed by coating and drying.
  • the water-soluble solvent include water and alcohol compounds having 1 to 6 carbon atoms, and water is preferable.
  • the alcohol compound having 1 to 6 carbon atoms include methanol, ethanol, n-propanol, isopropanol, n-butanol, n-pentanol and n-hexanol, which are composed of methanol, ethanol, n-propanol and isopropanol. At least one selected from the group is preferable.
  • the transfer material according to the present disclosure has a photosensitive resin layer.
  • the photosensitive resin layer in the present disclosure is a positive photosensitive resin layer, and a known positive photosensitive resin layer can be used.
  • the photosensitive resin layer used in the present disclosure is, from the viewpoint of sensitivity and resolution, an acid-decomposable resin, that is, a polymer having a structural unit having an acid group protected by an acid-decomposable group, and a photoacid generator. It is preferable that the chemical amplification positive type photosensitive resin layer contains a photo-acid generator and a polymer having a structural unit having an acid group protected by an acid-decomposable group.
  • the photo-acid generators such as onium salts and oxime sulfonate compounds described below have an acid generated in response to actinic radiation (actinic rays) as a catalyst for deprotection of the protected acid group in the polymer. Since it acts, the acid generated by the action of one photon contributes to many deprotection reactions, and the quantum yield exceeds 1, which is a large value such as 10 to the power of so-called chemical amplification. As a result, high sensitivity is obtained.
  • actinic radiation actinic rays
  • the positive photosensitive resin layer contains a polymer (also simply referred to as "polymer A1") having a structural unit (also referred to as "structural unit A”) having an acid group protected by an acid-decomposable group. Is preferred.
  • the positive photosensitive resin layer may contain another polymer.
  • the polymer A1 having the structural unit A and other polymers are collectively referred to as a “polymer component”.
  • the acid group protected by the acid-decomposable group in the polymer A1 undergoes a deprotection reaction to become an acid group by the action of a catalytic amount of an acid substance such as an acid generated by exposure.
  • This acid group enables dissolution in the developer.
  • the polymer A1 is preferably an addition polymerization type resin, and more preferably a polymer having a structural unit derived from (meth) acrylic acid or its ester.
  • a structural unit other than the structural unit derived from (meth) acrylic acid or its ester for example, the structural unit derived from a styrene compound, the structural unit derived from a vinyl compound, etc.
  • preferred embodiments of the structural unit A will be described.
  • the polymer component preferably contains a polymer A1 having a structural unit A having an acid group protected by an acid-decomposable group.
  • the photosensitive resin layer contains the polymer A1 having the structural unit A, it is possible to obtain a chemically amplified positive photosensitive resin layer having extremely high sensitivity.
  • the polymer A1 contained in the positive photosensitive resin layer may be only one kind or two or more kinds.
  • known groups can be used and are not particularly limited. Preferred specific acid groups include a carboxy group and a phenolic hydroxyl group (also referred to as "phenolic hydroxy group").
  • the acid-decomposable group is a group that is relatively easily decomposed by an acid (for example, an acetal-type functional group such as a 1-alkoxyalkyl group, a tetrahydropyranyl group, or a tetrahydrofuranyl group) or an acid-decomposable group.
  • a difficult group for example, a tertiary alkyl group such as a tert-butyl group, a tertiary alkyloxycarbonyl group such as a tert-butyloxycarbonyl group
  • the acid-decomposable group is preferably a group having a structure protected in the form of acetal.
  • the acid-decomposable group is preferably an acid-decomposable group having a molecular weight of 300 or less from the viewpoint of suppressing variation in the line width of the conductive wiring when applied to the formation of a conductive pattern.
  • the structural unit A having an acid group protected by an acid-decomposable group is preferably a structural unit represented by any of the following formulas A1 to A3 from the viewpoint of sensitivity and resolution.
  • R 11 and R 12 each independently represent a hydrogen atom, an alkyl group or an aryl group, at least one of R 11 and R 12 is an alkyl group or an aryl group, and R 13 is an alkyl group or an aryl group.
  • R 11 or R 12 and R 13 may combine to form a cyclic ether
  • R 14 represents a hydrogen atom or a methyl group
  • X 1 represents a single bond or a divalent linking group.
  • R 15 represents a substituent
  • n represents an integer of 0 to 4.
  • R 21 and R 22 each independently represent a hydrogen atom, an alkyl group or an aryl group, at least one of R 21 and R 22 is an alkyl group or an aryl group, and R 23 is an alkyl group or an aryl group. And R 21 or R 22 and R 23 may be linked to each other to form a cyclic ether, and R 24 is independently a hydroxy group, a halogen atom, an alkyl group, an alkoxy group, an alkenyl group or an aryl group.
  • R 31 and R 32 each independently represent a hydrogen atom, an alkyl group or an aryl group, at least one of R 31 and R 32 is an alkyl group or an aryl group, and R 33 is an alkyl group or an aryl group.
  • R 31 or R 32 and R 33 may be linked to form a cyclic ether
  • R 34 represents a hydrogen atom or a methyl group
  • X 0 represents a single bond or a divalent linking group. ..
  • the acid group protected by the acid-decomposable group is preferably a carboxy group protected by an acid-decomposable group, which is a structure that protects in the form of acetal, from the viewpoint of acid decomposition rate and sensitivity.
  • R 31 or R 32 when R 31 or R 32 is an alkyl group, an alkyl group having 1 to 10 carbon atoms is preferable. When R 31 or R 32 is an aryl group, a phenyl group is preferred. Each of R 31 and R 32 is preferably a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
  • R 33 represents an alkyl group or an aryl group, preferably an alkyl group having 1 to 10 carbon atoms, and more preferably an alkyl group having 1 to 6 carbon atoms. Further, the alkyl group and aryl group in R 31 to R 33 may have a substituent.
  • R 31 or R 32 and R 33 may be linked to each other to form a cyclic ether, and it is preferable that R 31 or R 32 and R 33 are linked to each other to form a cyclic ether.
  • the number of ring members of the cyclic ether is not particularly limited, but is preferably 5 or 6, and more preferably 5.
  • X 0 represents a single bond or an arylene group, and a single bond is preferable.
  • the arylene group may have a substituent.
  • the structural unit A represented by the above formula A3 is a structural unit having a carboxy group protected by an acid-decomposable group. When the polymer A1 contains the structural unit A represented by the formula A3, the sensitivity during pattern formation is excellent, and the resolution is further excellent.
  • R 34 represents a hydrogen atom or a methyl group, and is preferably a hydrogen atom from the viewpoint that the glass transition temperature (Tg) of the polymer A1 can be further lowered. More specifically, with respect to the total amount of the structural unit A contained in the polymer A1, the structural unit in which R 34 in the formula A3 is a hydrogen atom is preferably 20% by mass or more.
  • the content (content ratio: mass ratio) of the structural unit in which R 34 in the formula A3 is a hydrogen atom in the structural unit A is calculated by a conventional method from 13 C-nuclear magnetic resonance spectrum (NMR) measurement. It can be confirmed by the intensity ratio of peak intensities.
  • the acid-decomposable group is preferably a group having a cyclic structure, more preferably a group having a tetrahydrofuran ring or a tetrahydropyran ring structure, and more preferably a tetrahydrofuran ring structure, from the viewpoint of sensitivity.
  • a group is more preferable, and a tetrahydrofuranyl group is particularly preferable.
  • the content of the structural unit A in the polymer component including the polymer A1 is preferably 10% by mass to 90% by mass, and 10% by mass to 70% by mass with respect to the total mass of the polymer component. Is more preferable, 15% by mass to 50% by mass is further preferable, and 20% by mass to 40% by mass is particularly preferable. Within the above range, the resolution is further improved.
  • the content (content ratio: mass ratio) of the structural unit A in the polymer component containing the polymer A1 can be confirmed by the intensity ratio of peak intensities calculated by a conventional method from 13 C-NMR measurement.
  • the polymer A1 may include a structural unit having an acid group (also referred to as “structural unit B”).
  • the structural unit B is a structural unit containing a protecting group, for example, an acid group not protected by an acid-decomposable group, that is, an acid group having no protecting group.
  • the acid group in the present specification means a proton dissociable group having a pKa of 12 or less.
  • the acid group is preferably incorporated in the polymer A1 as a structural unit containing an acid group (structural unit B) using a monomer capable of forming an acid group.
  • the pKa of the acid group is preferably 10 or less, more preferably 6 or less.
  • the pKa of the acid group is preferably ⁇ 5 or more.
  • the polymer A1 contains the structural unit A and a structural unit B having an acid group having no protective group as a copolymerization component, and has a glass transition temperature of 90 ° C. or lower, thereby containing the polymer A1.
  • the mold-type photosensitive resin layer has better resolution and sensitivity during pattern formation while maintaining good transferability and releasability from the temporary support.
  • the acid group examples include a carboxy group, a sulfonamide group, a phosphonic acid group, a sulfo group, a phenolic hydroxyl group, and a sulfonylimide group. Among them, at least one acid group selected from the group consisting of carboxy group and phenolic hydroxyl group is preferable.
  • Introduction of the structural unit having an acid group into the polymer A1 can be carried out by copolymerizing a monomer having an acid group.
  • the structural unit containing an acid group, which is the structural unit B is derived from a structural unit derived from a styrene compound or a structural unit derived from a vinyl compound with an acid group, or derived from (meth) acrylic acid. It is more preferably a structural unit.
  • the structural unit B a structural unit having a carboxy group or a structural unit having a phenolic hydroxyl group is preferable from the viewpoint that the sensitivity during pattern formation becomes better.
  • the monomer having an acid group capable of forming the structural unit B is not limited to the examples described above.
  • the structural unit B contained in the polymer A1 may be only one type or two or more types.
  • the polymer A1 preferably contains the structural unit having an acid group (structural unit B) in an amount of 0.01% by mass to 20% by mass, and 0.01% by mass to 15% by mass, based on the total mass of the polymer A1. It is more preferable that the content is 0.01 to 10% by mass. Within the above range, the pattern formability becomes better.
  • the content (content ratio: mass ratio) of the structural unit B in the polymer A1 can be confirmed by an intensity ratio of peak intensities calculated by a conventional method from 13 C-NMR measurement.
  • the polymer A1 contains other structural units (hereinafter sometimes referred to as the structural unit C) other than the structural units A and B described above within a range that does not impair the effects of the transfer material according to the present disclosure. May be included.
  • the monomer forming the structural unit C is not particularly limited, and examples thereof include styrenes, (meth) acrylic acid alkyl ester, (meth) acrylic acid cyclic alkyl ester, (meth) acrylic acid aryl ester, and unsaturated dicarboxylic acid diester.
  • Bicyclo unsaturated compounds maleimide compounds, unsaturated aromatic compounds, conjugated diene compounds, unsaturated monocarboxylic acids, unsaturated dicarboxylic acids, unsaturated dicarboxylic acid anhydrides, groups having an aliphatic cyclic skeleton, other Mention may be made of saturated compounds.
  • various properties of the polymer A1 can be adjusted.
  • the Tg of the polymer A1 can be easily adjusted.
  • the photosensitive resin layer containing the polymer A1 maintains the transferability and the removability from the temporary support at a good level, and the resolution and sensitivity during pattern formation. Will be better.
  • the polymer A1 may include only one type of the structural unit C or may include two or more types of the structural unit C.
  • the structural unit C is specifically styrene, methylstyrene, ⁇ -methylstyrene, acetoxystyrene, methoxystyrene, ethoxystyrene, chlorostyrene, methyl vinylbenzoate, ethyl vinylbenzoate, methyl (meth) acrylate, ( Ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-Hydroxypropyl (meth) acrylate, benzyl (meth) acrylate, cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, isobornyl (meth) acrylate, acrylonitrile
  • the structural unit C preferably contains a structural unit having a basic group.
  • the basic group is preferably a group having a nitrogen atom, more preferably an aliphatic amino group, an aromatic amino group, or a nitrogen-containing heteroaromatic ring group, An aliphatic amino group or a nitrogen-containing heteroaromatic ring group is more preferable, and an aliphatic amino group is particularly preferable.
  • the aliphatic amino group may be any of a primary amino group, a secondary amino group, or a tertiary amino group, but from the viewpoint of resolution, a secondary amino group, or, It is preferably a tertiary amino group.
  • the aromatic amino group is preferably an anilino group, a monoalkylanilino group, or a dialkylanilino group, and more preferably a monoalkylanilino group or a dialkylanilino group.
  • the nitrogen-containing heteroaromatic ring in the nitrogen-containing heteroaromatic ring group is preferably a pyridine ring, an imidazole ring or a triazole ring, more preferably a pyridine ring or an imidazole ring, and a pyridine ring Is particularly preferable.
  • the nitrogen-containing heteroaromatic ring group may further have a substituent on the nitrogen-containing heteroaromatic ring.
  • the substituent is not particularly limited, but an alkyl group is preferable, and a methyl group is more preferable.
  • the monomer forming the structural unit having a basic group include 1,2,2,6,6-pentamethyl-4-piperidyl methacrylate, 2- (dimethylamino) ethyl methacrylate, and acrylic acid 2 , 2,6,6-Tetramethyl-4-piperidyl, 2,2,6,6-tetramethyl-4-piperidyl methacrylate, 2,2,6,6-tetramethyl-4-piperidyl acrylate, methacrylic acid 2- (diethylamino) ethyl, 2- (dimethylamino) ethyl acrylate, 2- (diethylamino) ethyl acrylate, N- (3-dimethylamino) propyl methacrylate, N- (3-dimethylamino) propyl acrylate, N- (3-diethylamino) propyl methacrylate, N- (3-diethylamino) propyl acrylate, 2- (diisopropy
  • the structural unit C a structural unit having an aromatic ring or a structural unit having an aliphatic cyclic skeleton is preferable from the viewpoint of improving the electrical characteristics of the obtained transfer material.
  • the monomer that forms these structural units include styrene, methylstyrene, ⁇ -methylstyrene, dicyclopentanyl (meth) acrylate, cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, and isobornyl (meth) acrylate. , And benzyl (meth) acrylate and the like.
  • the structural unit C is preferably a structural unit derived from cyclohexyl (meth) acrylate.
  • (meth) acrylic acid alkyl ester is preferable from the viewpoint of adhesion.
  • alkyl (meth) acrylate having an alkyl group having 4 to 12 carbon atoms is more preferable from the viewpoint of adhesion.
  • Specific examples thereof include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, n-butyl (meth) acrylate, and 2-ethylhexyl (meth) acrylate.
  • the content of the structural unit C in the polymer component is preferably 90% by mass or less, more preferably 85% by mass or less, and further preferably 50% by mass or less, based on the total mass of the polymer component.
  • the lower limit may be 0% by mass, but is preferably 10% by mass or more, and more preferably 20% by mass or more. Within the above range, the resolution and adhesiveness are further improved.
  • the glass transition temperature (Tg) of the polymer A1 according to the present disclosure is preferably 20 ° C. or higher, and more preferably 20 ° C. or higher and 90 ° C. or lower, from the viewpoint of further enhancing the resolution and the effect of the present disclosure. Is more preferable, 20 ° C. or more and 60 ° C. or less is more preferable, and 30 ° C. or more and 50 ° C. or less is particularly preferable.
  • Tg of the polymer in the present disclosure As a method of adjusting the Tg of the polymer in the present disclosure to the preferable range described above, for example, from the Tg of the homopolymer of each constitutional unit of the target polymer and the mass ratio of each constitutional unit, a FOX formula is obtained. It is possible to control the Tg of the desired polymer using the guidelines.
  • Tg of the homopolymer of the first constitutional unit contained in the polymer is Tg1
  • the mass fraction of the copolymer of the first constitutional unit W1
  • Tg of the homopolymer of the second constitutional unit Tg of the homopolymer of the second constitutional unit.
  • Is Tg2 and the mass fraction of the copolymer of the second constitutional unit is W2, the Tg0 (K) of the copolymer containing the first constitutional unit and the second constitutional unit is It can be estimated according to the formula.
  • FOX formula: 1 / Tg0 (W1 / Tg1) + (W2 / Tg2)
  • a copolymer having a desired Tg can be obtained by adjusting the type and mass fraction of each structural unit contained in the copolymer using the above-mentioned FOX formula. It is also possible to adjust the Tg of the polymer by adjusting the weight average molecular weight of the polymer.
  • the acid value of the polymer A1 is preferably 0 mgKOH / g or more and 100 mgKOH / g or less, more preferably 0 mgKOH / g or more and 50 mgKOH / g or less, and 0 mgKOH / g or more 20 mgKOH / g. It is more preferably at most g, particularly preferably at least 0 mgKOH / g and at most 10 mgKOH / g.
  • the acid value of the polymer in the present disclosure represents the mass of potassium hydroxide required to neutralize the acidic component per 1 g of the polymer.
  • the solution is neutralized and titrated with a 0.1 mol / L sodium hydroxide aqueous solution at 25 ° C.
  • the acid value is calculated by the following formula.
  • A 56.11 ⁇ Vs ⁇ 0.1 ⁇ f / w
  • A Acid value (mgKOH / g)
  • Vs amount of 0.1 mol / L sodium hydroxide aqueous solution used for titration (mL)
  • f titer of 0.1 mol / L sodium hydroxide aqueous solution
  • w mass of measurement sample (g) (solid content conversion)
  • the molecular weight of the polymer A1 is a polystyrene-equivalent weight average molecular weight, and is preferably 10,000 or more and 60,000 or less, more preferably 15,000 or more and 60,000 or less, from the viewpoint of more exerting the effect in the present disclosure. It is more preferably 20,000 or more and 50,000 or less.
  • the weight average molecular weight of the polymer in the present disclosure can be measured by GPC (gel permeation chromatography), and various commercially available devices can be used as the measuring device. Measurement techniques are known to those skilled in the art.
  • the weight average molecular weight is measured by gel permeation chromatography (GPC) using HLC (registered trademark) -8220 GPC (manufactured by Tosoh Corporation) as a measuring device and TSKgel (registered trademark) Super HZM-M (4) as a column.
  • THF tetrahydrofuran
  • the measurement conditions are as follows: a sample concentration of 0.2 mass%, a flow rate of 0.35 ml / min, a sample injection amount of 10 ⁇ L, and a measurement temperature of 40 ° C., using a differential refractive index (RI) detector.
  • the calibration curve is “standard sample TSK standard, polystyrene” manufactured by Tosoh Corporation: “F-40”, “F-20”, “F-4”, “F-1”, “A-5000”, “A-5000”, It can be manufactured using any of the seven samples of "A-2500” and "A-1000".
  • the ratio (dispersion) of the number average molecular weight and the weight average molecular weight of the polymer A1 is preferably 1.0 to 5.0, and more preferably 1.05 to 3.5.
  • the production method (synthesis method) of the polymer A1 is not particularly limited, but an example thereof is a monomer for forming the structural unit A, and optionally a polymerizable monomer for forming the other structural unit C. It can be synthesized by polymerizing using a polymerization initiator in an organic solvent containing a monomer. It can also be synthesized by a so-called polymer reaction.
  • the content of the polymer component in the positive photosensitive resin layer in the present disclosure is 75% by mass with respect to the total mass of the photosensitive resin layer, from the viewpoint of suppressing the generation of streaks and the adhesion on the transfer surface during transfer. % Or more, more preferably 80% by mass or more, further preferably 90% by mass or more, and particularly preferably 90% by mass to 99.9% by mass.
  • the content of the polymer A1 in the positive photosensitive resin layer is 75% by mass to 99.9% by mass based on the total mass of the positive photosensitive resin layer from the viewpoint of suppressing wiring defects and resolution. %, More preferably 80% by mass to 99% by mass, and particularly preferably 90% by mass to 95% by mass.
  • the positive photosensitive resin layer does not include, as a polymer component, a structural unit having an acid group protected by an acid-decomposable group, in addition to the polymer A1, as long as the effect of the transfer material according to the present disclosure is not impaired. It may further contain a polymer (sometimes referred to as "other polymer"). Unless otherwise specified, the polymer component in the present disclosure is meant to include, in addition to the polymer A1, other polymers optionally added. The compounds corresponding to the cross-linking agent, the dispersant, and the surfactant, which will be described later, are not included in the polymer component even if they are polymer compounds. When the positive photosensitive resin layer contains another polymer, the content of the other polymer is preferably 50% by mass or less, and more preferably 30% by mass or less, based on all the polymer components. Is more preferably 20% by mass or less.
  • the positive photosensitive resin layer may contain only one type of other polymer in addition to the polymer A1, or may contain two or more types thereof.
  • polyhydroxystyrene can be used, and commercially available SMA 1000P, SMA 2000P, SMA 3000P, SMA 1440F, SMA 17352P, SMA 2625P, and SMA 3840F (above, manufactured by Sartomer).
  • SMA 1000P, SMA 2000P, SMA 3000P, SMA 1440F, SMA 17352P, SMA 2625P, and SMA 3840F above, manufactured by Sartomer.
  • ARUFON UC-3000, ARUFON UC-3510, ARUFON UC-3900, ARUFON UC-3910, ARUFON UC-3920, and ARUFON UC-3080 all produced by Toagosei Co., Ltd.
  • Joncryl 690, Joncr. , Joncryl 67, and Joncryl 586 can also be used.
  • the positive photosensitive resin layer preferably contains a photoacid generator.
  • the photo-acid generator used in the present disclosure is a compound capable of generating an acid when irradiated with an actinic ray such as an ultraviolet ray, a far ultraviolet ray, an X-ray or an electron beam.
  • the photo-acid generator used in the present disclosure is preferably a compound that reacts with an actinic ray having a wavelength of 300 nm or more, preferably 300 nm to 450 nm to generate an acid, but its chemical structure is not limited.
  • a photo-acid generator which is not directly sensitive to an actinic ray having a wavelength of 300 nm or more, when it is used in combination with a sensitizer, it is a compound which is sensitive to an actinic ray having a wavelength of 300 nm or more and generates an acid. It can be preferably used in combination.
  • the photoacid generator used in the present disclosure is preferably a photoacid generator that generates an acid having a pKa of 4 or less, more preferably a photoacid generator that generates an acid having a pKa of 3 or less, and a pKa of 2 or less. Particularly preferred are photoacid generators that generate the above acid.
  • the lower limit of pKa is not particularly limited, but is preferably -10.0 or more, for example.
  • Examples of the photoacid generator include an ionic photoacid generator and a nonionic photoacid generator.
  • Examples of the ionic photoacid generator include onium salt compounds such as diaryliodonium salts and triarylsulfonium salts, and quaternary ammonium salts. Of these, onium salt compounds are preferable, and triarylsulfonium salts and diaryliodonium salts are particularly preferable.
  • the ionic photoacid generator described in paragraphs 0114 to 0133 of JP-A-2014-85643 can also be preferably used.
  • nonionic photoacid generators examples include trichloromethyl-s-triazines, diazomethane compounds, imide sulfonate compounds, and oxime sulfonate compounds.
  • the photoacid generator is preferably an oxime sulfonate compound from the viewpoint of sensitivity, resolution, and adhesion.
  • Specific examples of trichloromethyl-s-triazines, diazomethane compounds, and imidosulfonate compounds include the compounds described in paragraphs 0083 to 0088 of JP 2011-221494A.
  • oxime sulfonate compound those described in paragraphs 0084 to 0088 of International Publication No. 2018/179640 can be preferably used.
  • the photoacid generator preferably contains at least one compound selected from the group consisting of onium salt compounds and oxime sulfonate compounds, and more preferably contains oxime sulfonate compounds. ..
  • examples of preferable photoacid generators include photoacid generators having the following structures.
  • the positive photosensitive resin layer may contain one type of photoacid generator alone, or may contain two or more types. From the viewpoint of sensitivity and resolution, the content of the photo-acid generator in the positive photosensitive resin layer is preferably 0.1% by mass to 10% by mass based on the total mass of the positive photosensitive resin layer. More preferably 0.5% by mass to 5% by mass.
  • the positive photosensitive resin layer in the present disclosure may contain other additives, if necessary, in addition to the polymer component containing the polymer A1, the photoacid generator and the solvent.
  • additives known ones can be used, and examples thereof include a plasticizer, a sensitizer, a heterocyclic compound, an alkoxysilane compound, a basic compound, a rust preventive, and a surfactant.
  • plasticizer, sensitizer, heterocyclic compound and alkoxysilane compound include those described in paragraphs 0097 to 0119 of WO2018 / 179640.
  • the positive photosensitive resin layer preferably further contains a basic compound.
  • a basic compound any of the basic compounds used in the chemically amplified resist can be selected and used. Examples thereof include aliphatic amines, aromatic amines, heterocyclic amines, quaternary ammonium hydroxides, and quaternary ammonium salts of carboxylic acids. Specific examples thereof include the compounds described in paragraphs 0204 to 0207 of JP 2011-221494A, the contents of which are incorporated herein.
  • examples of the aliphatic amine include di-n-propylamine, tri-n-propylamine, di-n-pentylamine, tri-n-pentylamine, dicyclohexylamine, dicyclohexylmethylamine and the like. Be done.
  • examples of aromatic amines include aniline, benzylamine, N, N-dimethylaniline, diphenylamine and the like.
  • heterocyclic amine examples include pyridine, 2-methylpyridine, 4-methylpyridine, 2-ethylpyridine, 4-ethylpyridine, 2-phenylpyridine, 4-phenylpyridine, N-methyl-4-phenylpyridine, 4-dimethylaminopyridine, imidazole, benzimidazole, 4-methylimidazole, 2-phenylbenzimidazole, 2,4,5-triphenylimidazole, nicotine, nicotinic acid, nicotinic acid amide, quinoline, 8-oxyquinoline, pyrazine, Pyrazole, pyridazine, purine, pyrrolidine, piperidine, piperazine, morpholine, 4-methylmorpholine, 1,5-diazabicyclo [4.3.0] -5-nonene, 1,8-diazabicyclo [5.3.0] -7 -For example, Undecen.
  • CMTU N-cyclohexyl-N '-[2- (4-morpholinyl) ethyl] thiourea
  • Commercial products of CMTU include those manufactured by Toyo Kasei Co., Ltd.
  • a benzotriazole compound is preferable from the viewpoint of the linearity of the conductive wiring when applied to the formation of a conductive pattern.
  • the benzotriazole compound is not limited as long as it has a benzotriazole skeleton, and a known benzotriazole compound can be used.
  • the benzotriazole compound include 1,2,3-benzotriazole, 1- [N, N-bis (2-ethylhexyl) aminomethyl] benzotriazole, 5-carboxybenzotriazole, 1- (hydroxymethyl) -1H -Benzotriazole, 1-acetyl-1H-benzotriazole, 1-aminobenzotriazole, 9- (1H-benzotriazol-1-ylmethyl) -9H-carbazole, 1-chloro-1H-benzotriazole, 1- (2- Pyridinyl) benzotriazole, 1-hydroxybenzotriazole, 1-methylbenzotriazole, 1-ethylbenzotriazole, 1- (1'-hydroxyethyl) benzotriazole, 1- (2'-hydroxyethyl) benzotriazole, 1-propyl
  • the positive photosensitive resin layer may contain one type of basic compound or two or more types of basic compounds.
  • the content of the basic compound is preferably 0.001% by mass to 5% by mass, and more preferably 0.005% by mass to 3% by mass, based on the total mass of the positive photosensitive resin layer. preferable.
  • the positive photosensitive resin layer preferably contains a surfactant from the viewpoint of thickness uniformity.
  • a surfactant any of anionic, cationic, nonionic (nonionic) or amphoteric surfactants can be used, but the preferred surfactant is a nonionic surfactant.
  • nonionic surfactants include polyoxyethylene higher alkyl ethers, polyoxyethylene higher alkyl phenyl ethers, higher fatty acid diesters of polyoxyethylene glycol, silicone-based and fluorine-based surfactants. ..
  • KP manufactured by Shin-Etsu Chemical Co., Ltd.
  • Polyflow manufactured by Kyoeisha Chemical Co., Ltd.
  • F-top manufactured by JEMCO
  • Megafac manufactured by DIC Co., Ltd.
  • Florard Suditomo 3M Co., Ltd.
  • Asahi Glass Surflon (manufactured by Asahi Glass Co., Ltd.)
  • PolyFox manufactured by OMNOVA
  • SH-8400 manufactured by Toray Dow Corning Co., Ltd.
  • the surfactant for example, the surfactants described in paragraphs 0120 to 0125 of International Publication No. 2018/179640 can be used.
  • a commercially available product of the surfactant for example, Megafac F-552 or F-554 (above, manufactured by DIC Corporation) can be used.
  • the surfactants described in Paragraph 0017 of Japanese Patent No. 4502784 and Paragraph 0060 to Paragraph 0071 of Japanese Patent Laid-Open No. 2009-237362 can be used.
  • the positive photosensitive resin layer may contain one type of surfactant alone, or may contain two or more types of surfactant.
  • the content of the surfactant is preferably 10% by mass or less, more preferably 0.001% by mass to 10% by mass, and 0.01% by mass or less with respect to the total mass of the positive photosensitive resin layer. More preferably, it is from 3% by mass to 3% by mass.
  • additives metal oxide particles, antioxidants, dispersants, acid proliferating agents, development accelerators, conductive fibers, colorants, thermal radical polymerization.
  • Known additives such as an initiator, a thermal acid generator, an ultraviolet absorber, a thickener, a cross-linking agent, and an organic or inorganic suspending agent can be further added. Preferred embodiments of these components are described in paragraphs 0165 to 0184 of JP-A-2014-85643, and the contents of this publication are incorporated herein.
  • the positive photosensitive resin layer in the transfer material according to the present disclosure may contain a solvent.
  • the solvent may remain.
  • the content of the solvent in the positive photosensitive resin layer is preferably 5% by mass or less, more preferably 2% by mass or less, and 1% by mass or less with respect to the total mass of the photosensitive resin layer. More preferably.
  • the average thickness of the positive photosensitive resin layer is preferably 0.5 ⁇ m to 20 ⁇ m. When the average thickness of the positive photosensitive resin layer is 20 ⁇ m or less, the pattern resolution is more excellent, and when it is 0.5 ⁇ m or more, it is preferable from the viewpoint of pattern linearity.
  • the average thickness of the positive photosensitive resin layer is more preferably 0.8 ⁇ m to 15 ⁇ m, particularly preferably 1.0 ⁇ m to 10 ⁇ m.
  • the positive photosensitive resin layer in the present disclosure may be formed by adjusting, coating and drying a photosensitive resin composition containing components necessary for forming the positive photosensitive resin layer and a solvent. it can. Specifically, each component and a solvent are mixed at an arbitrary ratio and in an arbitrary method, and dissolved by stirring to prepare a photosensitive resin composition for forming a positive photosensitive resin layer. . For example, it is possible to prepare a composition by dissolving each component in advance in a solvent and then mixing the obtained solutions at a predetermined ratio. The composition prepared as described above may be filtered using, for example, a filter having a pore size of 0.2 ⁇ m to 30 ⁇ m.
  • the positive photosensitive resin layer in the present disclosure can be formed by applying the photosensitive resin composition on a temporary support or a cover film and drying it.
  • the coating method is not particularly limited, and it can be coated by a known method such as slit coating, spin coating, curtain coating, inkjet coating and the like. Further, the photosensitive resin layer can be formed on the temporary support or the cover film on which other layers described below are formed.
  • the photosensitive resin composition preferably contains a component contained in the positive photosensitive resin layer and a solvent.
  • a photosensitive resin layer can be preferably formed by incorporating a solvent into each component to adjust the viscosity, and applying and drying.
  • solvent examples include propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol methyl-n-butyl ether, propylene glycol methyl-n-propyl ether, ethyl 3-ethoxypropionate, diethylene glycol methyl ethyl ether, propylene glycol monomethyl ether.
  • the solvent preferably contains a solvent having a vapor pressure at 20 ° C. of 1 kPa or more and 16 kPa or less, or a mixture thereof.
  • Solvents having a vapor pressure at 20 ° C. of 1 kPa or more and 16 kPa or less include ethyl acetate, propyl acetate, isopropyl acetate, isobutyl acetate, butyl acetate, tert-butyl acetate, cyclopentyl methyl ether, diisopropyl ether, propylene glycol monoethyl ether, methyl n.
  • -Butyl ketone methyl ethyl ketone, methyl isobutyl ketone, methyl n-propyl ketone, methyl isopropyl ketone, toluene, propylene glycol monomethyl ether acetate (PGMEA), propylene glycol monomethyl ether (PGME), cyclohexanone, 1,2-propanediol diacetate, Preferable examples include 1,3-butanediol diacetate, 1,6-hexanediol diacetate, triacetin, dipropylene glycol-n-butyl ether, and diethylene glycol monobutyl ether acetate.
  • the solvent that can be used in the present disclosure may be used alone or in combination of two.
  • the content of the solvent at the time of applying the photosensitive resin composition is preferably 50 parts by mass to 1,900 parts by mass, and 100 parts by mass with respect to 100 parts by mass of the total solid content in the photosensitive resin composition. It is more preferably from about 900 parts by mass.
  • the transfer material according to the present disclosure has a temporary support.
  • the temporary support is a support that supports the intermediate layer and the photosensitive resin layer and can be peeled off.
  • the temporary support used in the present disclosure may have light transmittance from the viewpoint of exposing the intermediate layer and the photosensitive resin layer through the temporary support when the intermediate layer and the photosensitive resin layer are subjected to pattern exposure.
  • Having light transmittance means that the transmittance of the main wavelength of the light used for pattern exposure is 50% or more, and the transmittance of the main wavelength of the light used for pattern exposure is from the viewpoint of improving the exposure sensitivity. Therefore, 60% or more is preferable, and 70% or more is more preferable.
  • the temporary support include a glass substrate, a resin film, paper and the like, and a resin film is particularly preferable from the viewpoint of strength and flexibility.
  • the resin film include polyethylene terephthalate film, cellulose triacetate film, polystyrene film, polycarbonate film and the like. Of these, a biaxially stretched polyethylene terephthalate film is particularly preferable.
  • the average thickness of the temporary support is not particularly limited, but is preferably in the range of 5 ⁇ m to 200 ⁇ m, more preferably in the range of 10 ⁇ m to 150 ⁇ m from the viewpoint of ease of handling and versatility.
  • the thickness of the temporary support depends on the material, from the viewpoint of strength as a support, flexibility required for bonding with a circuit wiring forming substrate, and light transmission required in the first exposure step. Just select it.
  • the transfer material according to the present disclosure preferably has a cover film on the surface of the transfer material opposite to the surface on which the temporary support is provided.
  • the cover film include a resin film and paper, and a resin film is particularly preferable from the viewpoint of strength and flexibility.
  • the resin film include polyethylene film, polypropylene film, polyethylene terephthalate film, cellulose triacetate film, polystyrene film and polycarbonate film. Among them, polyethylene film, polypropylene film and polyethylene terephthalate film are preferable.
  • the average thickness of the cover film is not particularly limited, and for example, one having a thickness of 1 ⁇ m to 2 mm is preferable.
  • the transfer material according to the present disclosure may have a layer other than those described above (hereinafter, also referred to as “other layer”).
  • other layers include a contrast enhancement layer and a thermoplastic resin layer.
  • a preferred embodiment of the contrast enhancement layer is paragraph 0134 of International Publication No. 2018/179640
  • a preferred embodiment of the thermoplastic resin layer is paragraph 0189 to paragraph 0193 of JP-A-2014-85643
  • further preferred are other layers.
  • FIG. 1 an example of a layer configuration of a transfer material according to the present disclosure is schematically illustrated.
  • a temporary support 10 an intermediate layer 12, a photosensitive resin layer 14, and a cover film 16 are laminated in this order.
  • the method for producing a resin pattern according to the present disclosure is not particularly limited as long as it is a method for producing a resin pattern using the transfer material according to the present disclosure. However, it is photosensitive to the temporary support in the transfer material according to the present disclosure. Of the outermost layer on the side having the photosensitive resin layer to the substrate for bonding (hereinafter, sometimes referred to as “bonding step”) and pattern exposing the photosensitive resin layer (hereinafter, “exposure step”). ”) And a step of developing the exposed photosensitive resin layer to form a pattern (hereinafter sometimes referred to as” developing step ").
  • the substrate in the method for producing a resin pattern according to the present disclosure is preferably a substrate having a conductive layer, and more preferably a substrate having a conductive layer on its surface.
  • the method for producing a circuit wiring according to the present disclosure is not particularly limited as long as it is a method for producing a circuit wiring using the transfer material according to the present disclosure, but is not limited to the temporary support in the transfer material according to the present disclosure.
  • the substrate in the method for manufacturing circuit wiring according to the present disclosure is preferably a substrate having the conductive layer on its surface.
  • a method for manufacturing a resin pattern according to the present disclosure, and a method for manufacturing a circuit wiring according to the present disclosure include a method of forming the temporary support after the step of bonding to the substrate and before the step of forming the pattern. It is preferable to include a step of peeling.
  • the above-mentioned photosensitive resin layer is of a positive type, which leaves as an image the portion not irradiated with actinic rays.
  • the solubility of the exposed areas is increased by using, for example, a photosensitizer which generates acid upon irradiation with the active rays. If none of the exposed parts are cured and the obtained pattern shape is defective, the substrate can be reused (reworked) by exposing the entire surface.
  • the technique of exposing the remaining photosensitive resin layer again to form a different pattern can be realized only by the positive type photosensitive resin layer, the method of manufacturing a resin pattern according to the present disclosure, or the present disclosure.
  • a mode in which the exposure is performed twice or more is preferably mentioned.
  • the circuit wiring manufacturing method according to the present disclosure preferably includes a mode in which four steps of the bonding step, the exposure step, the developing step, and the etching step are set as one set and repeated a plurality of times.
  • the exposure step is further performed on the pattern.
  • a preferred mode is one in which the developing step and the etching step are subsequently performed.
  • the patterned photosensitive resin layer after exposure and development can be suitably used as an etching resist when etching the conductive layer.
  • the method for press-bonding the substrate and the transfer material is not particularly limited, and known transfer methods and laminating methods can be used. Specifically, for example, the outermost layer side having the photosensitive resin layer with respect to the temporary support in the transfer material is overlaid on a substrate, and pressure is applied by a roll, or pressure and heat are applied. It is preferably carried out.
  • a known laminator such as a laminator, a vacuum laminator, and an auto-cut laminator capable of improving productivity can be used.
  • the pressure and temperature of the bonding step in the bonding step are not particularly limited, depending on the material of the surface of the substrate to be bonded, for example, the material of the conductive layer, the material of the outermost layer, the transport speed, and the pressure bonding machine to be used. It can be set appropriately.
  • the transfer material has a cover film
  • the cover film may be removed and then pressure-bonded.
  • the base material is a resin film
  • roll-to-roll pressure bonding may be performed.
  • the substrate used in the present disclosure is preferably a substrate having a conductive layer, and more preferably a substrate having a conductive layer on the surface of a base material. Wiring is formed by patterning the conductive layer.
  • a film base material such as polyethylene terephthalate is preferably provided with a plurality of conductive layers such as metal oxides and metals.
  • the substrate used in the present disclosure is preferably a substrate containing copper from the viewpoint of exerting the effect in the present disclosure more.
  • the conductive layer is preferably a layer containing copper.
  • the substrate is preferably a substrate in which a plurality of conductive layers are laminated on a support.
  • the support is preferably a glass base material or a film base material, and more preferably a film base material.
  • the support is a sheet-shaped resin composition.
  • the support is preferably transparent.
  • the refractive index of the support is preferably 1.50 to 1.52.
  • the support may be composed of a translucent base material such as a glass base material, and a tempered glass typified by Gorilla glass manufactured by Corning Incorporated can be used.
  • the materials used in JP 2010-86684 A, JP 2010-152809 A and JP 2010-257492 A can be preferably used.
  • a film base material is used as the base material, it is more preferable to use a base material having no optical distortion and a base material having high transparency, and specific materials include polyethylene terephthalate (PET), Examples thereof include polyethylene naphthalate, polycarbonate, triacetyl cellulose and cycloolefin polymer.
  • the conductive layer may be any conductive layer used for general wiring or touch panel wiring.
  • Examples of the material of the conductive layer include metals and metal oxides.
  • Examples of the metal oxide include ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), and SiO 2 .
  • Examples of the metal include Al, Zn, Cu, Fe, Ni, Cr and Mo.
  • At least one conductive layer of the plurality of conductive layers contains a metal oxide.
  • the conductive layer is preferably an electrode pattern corresponding to the sensor of the visual recognition part used in the capacitive touch panel or a wiring of the peripheral extraction part.
  • the method for producing a resin pattern according to the present disclosure or the method for producing a circuit wiring according to the present disclosure preferably includes a step (exposure step) of pattern-exposing the photosensitive resin layer after the attaching step.
  • the exposure step it is preferable that the photosensitive resin layer is irradiated with an actinic ray through a mask having a predetermined pattern.
  • the photo-acid generator decomposes to generate an acid.
  • the acid-decomposable group contained in the photosensitive resin layer is hydrolyzed to generate an acid group such as a carboxy group or a phenolic hydroxyl group.
  • the detailed arrangement and specific size of the pattern are not particularly limited.
  • the electrode pattern and the lead-out wiring are preferably 100 ⁇ m or less, and more preferably 70 ⁇ m or less.
  • the exposure in the exposure step may be exposure through a mask or digital exposure using a laser or the like, but exposure through a mask for exposure is preferable.
  • the method for manufacturing a resin pattern according to the present disclosure or the method for manufacturing a circuit wiring according to the present disclosure includes a step of bringing the transfer material into contact with an exposure mask between the bonding step and the exposure step. It is preferable. In the above aspect, the resolution of the obtained pattern is more excellent.
  • Examples of the actinic rays include visible rays, ultraviolet rays, and electron rays. Visible rays or ultraviolet rays are preferable, and ultraviolet rays are particularly preferable.
  • an exposure light source for actinic rays a low-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a chemical lamp, a light-emitting diode (LED) light source, an excimer laser generator, etc. can be used, and g-line (436 nm), i-line (365 nm) , Actinic rays having a wavelength of 300 nm or more and 450 nm or less such as h-line (405 nm) can be preferably used.
  • Irradiation light can be adjusted through a spectral filter such as a long wavelength cut filter, a short wavelength cut filter, and a bandpass filter, if necessary.
  • a spectral filter such as a long wavelength cut filter, a short wavelength cut filter, and a bandpass filter
  • various types of exposure devices such as a mirror projection aligner, a stepper, a scanner, a proximity, a contact, a microlens array, and a laser exposure can be used.
  • Exposure dose depending on the photosensitive resin layer to be used may be appropriately selected, but is preferably from 5mJ / cm 2 ⁇ 200mJ / cm 2, more preferably 10mJ / cm 2 ⁇ 100mJ / cm 2 .
  • PEB Post Exposure Bake
  • the pattern exposure may be exposure through a mask or digital exposure using a laser or the like.
  • a step of developing the exposed photosensitive resin layer to form a pattern (developing step) It is preferable to include
  • the transfer material has an intermediate layer
  • the developing step the exposed intermediate layer is also removed together with the exposed photosensitive resin layer.
  • the developing step the intermediate layer in the unexposed area may be removed in a form of being dissolved or dispersed in the developing solution.
  • Development of the exposed photosensitive resin layer in the developing step can be performed using a developer.
  • the developer is not particularly limited as long as it can remove the exposed portion of the photosensitive resin layer, and a known developer such as the developer described in JP-A-5-72724 can be used.
  • the developing solution is preferably a developing solution in which the exposed portion of the photosensitive resin layer has a dissolution type developing behavior.
  • an alkaline aqueous solution is preferable, and for example, an alkaline aqueous solution containing a compound having pKa of 7 to 13 at a concentration of 0.05 mol / L (liter) to 5 mol / L is more preferable.
  • the developer may further contain an organic solvent miscible with water, a surfactant and the like. Examples of the developer preferably used in the present disclosure include the developers described in paragraph 0194 of WO 2015/093271.
  • the developing system is not particularly limited, and may be paddle development, shower development, shower and spin development, dip development or the like.
  • shower development the exposed portion can be removed by spraying a developing solution onto the photosensitive resin layer after exposure with a shower. Further, after development, it is preferable to remove a development residue while spraying a cleaning agent or the like with a shower and rubbing with a brush or the like.
  • the liquid temperature of the developer is preferably 20 ° C to 40 ° C. Further, the longer the time from exposure to development is, the more the effect of suppressing the deformation of the pattern shape in the present disclosure is exhibited.
  • Development may be carried out immediately after exposure, but the time from exposure to development is preferably 0.5 hours or more, more preferably 1 hour or more, still more preferably 6 hours or more, after which the development is carried out.
  • the effect of suppressing the deformation of the pattern shape according to the present disclosure is more exerted.
  • the method of manufacturing a resin pattern according to the present disclosure, or the method of manufacturing a circuit wiring according to the present disclosure such as a step of washing with water or the like after development, a step of drying the substrate having the obtained pattern, etc. May be included.
  • the post-baking heating is preferably performed in an environment of 8.1 kPa to 121.6 kPa, more preferably 50.66 kPa or more. On the other hand, it is more preferably performed in an environment of 111.46 kPa or less, and particularly preferably in an environment of 101.3 kPa or less.
  • the post-baking temperature is preferably 80 ° C. to 250 ° C., more preferably 110 ° C. to 170 ° C., and particularly preferably 130 ° C. to 150 ° C.
  • the post-baking time is preferably 1 minute to 30 minutes, more preferably 2 minutes to 10 minutes, and particularly preferably 2 minutes to 4 minutes. Post bake may be performed in an air environment or a nitrogen substitution environment.
  • the transport speed of the support at each step in the method of manufacturing a resin pattern according to the present disclosure or the method of manufacturing a circuit wiring according to the present disclosure is not particularly limited, but 0.5 m / It is preferably from min to 10 m / min, and more preferably from 2.0 m / min to 8.0 m / min except during exposure.
  • a method of manufacturing a resin pattern according to the present disclosure, or a method of manufacturing a circuit wiring according to the present disclosure peels the temporary support after a step of bonding to the substrate and before a step of forming the pattern. It is preferable to include a step (temporary support peeling step).
  • the method for manufacturing a resin pattern according to the present disclosure or the method for manufacturing a circuit wiring according to the present disclosure uses the above transfer material, and therefore the temporary support is peeled off after the transfer material is bonded and at any timing before development. However, since the adhesiveness to the photosensitive resin layer is excellent, it is possible to suppress the occurrence of defective factors such as partial peeling, and it is possible to perform good pattern formation.
  • the method for producing a resin pattern according to the present disclosure or the method for producing a circuit wiring according to the present disclosure, from the viewpoint of pattern formability and resolution, after the step of bonding to the substrate, and the photosensitive resin layer It is more preferable to include a step of peeling the temporary support before the step of pattern exposure. Further, in the above aspect, when the mask is brought into contact with the substrate for pattern exposure, the photosensitive resin layer and the mask do not come into direct contact with each other, and therefore the pattern formability and the resolution are superior.
  • the method of peeling the temporary support in the peeling step is not particularly limited and may be a known method.
  • the method of manufacturing a resin pattern according to the present disclosure or the method of manufacturing a circuit wiring according to the present disclosure includes a step of peeling the cover film of the transfer material (“cover film”). It may be referred to as a "peeling step").
  • peeling step The method of peeling off the cover film is not limited, and a known method can be applied.
  • the circuit wiring manufacturing method preferably includes a step (etching step) of etching the conductive layer in a region where the pattern is not arranged.
  • the etching step the pattern formed from the photosensitive resin layer in the developing step is used as an etching resist, and the conductive layer is etched.
  • etching can be applied by a known method such as the method described in paragraphs 0048 to 0054 of JP 2010-152155 A, a method by dry etching such as a known plasma etching, or the like.
  • a known method such as the method described in paragraphs 0048 to 0054 of JP 2010-152155 A
  • a method by dry etching such as a known plasma etching, or the like.
  • a generally used wet etching method of immersing in an etching solution can be mentioned.
  • an acidic type or alkaline type etching solution may be appropriately selected according to the object of etching.
  • the acidic type etching solution includes hydrochloric acid, sulfuric acid, nitric acid, acetic acid, hydrofluoric acid, oxalic acid, or an aqueous solution containing only an acidic component such as phosphoric acid, an acidic component and ferric chloride, ammonium fluoride, or permanganese. Examples include mixed aqueous solutions of salts such as potassium acid.
  • the acidic component a component obtained by combining a plurality of acidic components may be used.
  • an aqueous solution containing only an alkali component such as sodium hydroxide, potassium hydroxide, ammonia, an organic amine, or a salt of an organic amine such as tetramethylammonium hydroxide, an alkali component and potassium permanganate.
  • alkali component such as sodium hydroxide, potassium hydroxide, ammonia, an organic amine, or a salt of an organic amine such as tetramethylammonium hydroxide, an alkali component and potassium permanganate.
  • Examples include mixed aqueous solutions of salts such as.
  • the alkaline component a component obtained by combining a plurality of alkaline components may be used.
  • the temperature of the etching solution is not particularly limited, but it is preferably 45 ° C or lower.
  • the pattern used as the etching mask preferably exhibits particularly excellent resistance to acidic and alkaline etching solutions in the temperature range of 45 ° C. or lower. Therefore, the pattern is prevented from peeling during the etching process, and the portion where the pattern does not exist is selectively etched.
  • a step of cleaning the etched substrate (washing step) and a step of drying the etched substrate (drying step) are performed as necessary.
  • the cleaning step include cleaning the substrate with pure water at room temperature (10 ° C. to 35 ° C.) for 10 seconds to 300 seconds.
  • air blow may be used, and the air blow pressure (about 0.1 kg / cm 2 to 5 kg / cm 2 ) may be appropriately adjusted to perform the drying.
  • the circuit wiring manufacturing method according to the present disclosure includes a step of removing the photosensitive resin layer with a release solution (etching resist removing step) after the etching step. After the completion of the etching step, the patterned photosensitive resin layer remains. If the photosensitive resin layer is unnecessary, all the remaining photosensitive resin layer may be removed.
  • a method of peeling using a peeling solution for example, a substrate having the above-mentioned photosensitive resin layer or the like in the peeling solution is stirred for 5 minutes at preferably 30 ° C. to 80 ° C., more preferably 50 ° C. to 80 ° C. Examples include a method of soaking for about 30 minutes.
  • an inorganic alkali component such as sodium hydroxide or potassium hydroxide, or an organic alkali component such as a tertiary amine or a quaternary ammonium salt, water, dimethyl sulfoxide, N-methylpyrrolidone, or A stripping solution dissolved in these mixed solutions can be used.
  • a stripping solution may be used and stripping may be performed by a spray method, a shower method, a paddle method, or the like.
  • the exposure step, the development step, and the etching step may be repeated twice or more as necessary.
  • the methods described in paragraphs 0035 to 0051 of JP-A-2006-23696 can be preferably used in the present disclosure.
  • the method for manufacturing a circuit wiring according to the present disclosure includes a step of exposing the entire surface of the positive type photosensitive resin layer after the etching step. (Hereinafter, it may be referred to as "entire surface exposure step”.) And a step of removing the positively exposed photosensitive resin layer that has been entirely exposed.
  • the etching mask removing solution when used for a long time, the etching mask removing property may gradually decrease.
  • a circuit wiring is manufactured by repeatedly applying the circuit wiring manufacturing method to a substrate having a base material and a plurality of conductive layers including a first conductive layer and a second conductive layer that are different in constituent materials from each other. You can also The step of removing the positive-type photosensitive resin layer exposed on the entire surface can be performed by the same method as the above-mentioned etching resist removing step.
  • the light source used for the exposure in the whole surface exposure process is not particularly limited, and a known exposure light source can be used. From the viewpoint of removability, it is preferable to use a light source containing light having the same wavelength as that in the exposure step.
  • the exposure amount in the overall exposure step is preferably 5mJ / cm 2 ⁇ 1,000mJ / cm 2, more preferably 10mJ / cm 2 ⁇ 800mJ / cm 2, 100mJ / Particularly preferably, it is cm 2 to 500 mJ / cm 2 .
  • the exposure amount in the whole surface exposure process is preferably equal to or more than the exposure amount in the above exposure process, and more preferably more than the exposure amount in the above exposure process.
  • a method for manufacturing a circuit wiring according to the present disclosure includes a step of heating the above-described whole-surface-exposed positive photosensitive resin layer during the whole-surface exposure step, after the exposure step, or both, and before a removing step described later. (Hereinafter, it may be called a "heating process.") By including the heating step, the reaction rate of the photo-acid generator and the reaction rate of the generated acid and the positive photosensitive resin can be further improved, and as a result, the removal performance is improved.
  • the method for manufacturing a resin pattern according to the present disclosure or the method for manufacturing a circuit wiring according to the present disclosure may include other arbitrary steps. For example, the following steps may be mentioned, but the present invention is not limited to these steps.
  • the circuit wiring manufacturing method can include a step of reducing the visible light reflectance of the surface of the conductive layer, for example, part or all of the surface of the conductive layer on the substrate. ..
  • the treatment for lowering the visible light reflectance include oxidation treatment.
  • the visible light reflectance can be reduced by blackening by oxidizing copper to copper oxide.
  • the treatment for reducing the visible light reflectance see paragraphs 0017 to 0025 of JP-A-2014-150118 and paragraphs 0041, 0042, 0048 and 0058 of JP-A-2013-206315. There is a description and the content of this publication is incorporated herein.
  • a method of manufacturing circuit wiring according to the present disclosure includes a step of forming an insulating film on the substrate, for example, the formed wiring (etched conductive layer), and a step of forming a new conductive layer on the insulating film. It is also preferable to include.
  • the step of forming the insulating film is not particularly limited, and a known method of forming a permanent film can be used.
  • an insulating film having a desired pattern may be formed by photolithography using a photosensitive material having an insulating property.
  • a new conductive layer having a desired pattern may be formed by photolithography using a photosensitive material having conductivity.
  • the new conductive layer may be etched by forming an etching resist by the same method as described above, or may be separately etched by a known method.
  • the substrate having circuit wiring obtained by the method for manufacturing circuit wiring according to the present disclosure may have wiring of only one layer or wiring of two or more layers on the substrate.
  • the substrate may have a plurality of conductive layers on both surfaces, and circuits may be sequentially or simultaneously formed on the conductive layers formed on both surfaces of the substrate.
  • a wiring in which a first conductive pattern (first wiring) is formed on one surface of the substrate and a second conductive pattern (second wiring) is formed on the other surface, preferably a touch panel wiring can be formed.
  • the resin pattern manufacturing method according to the present disclosure or the circuit wiring manufacturing method according to the present disclosure is preferably performed by a roll-to-roll method.
  • the roll-to-roll method uses a substrate that can be wound and unwound as a substrate, and unwinds the substrate or a structure including the substrate before any step included in the method for manufacturing circuit wiring ( Hereinafter, it may be referred to as a "winding step"), and a step of winding a structure including a base material or a substrate after any one of the steps (hereinafter, may be referred to as a "winding step").
  • the unwinding method in the unwinding step and the winding method in the winding step are not particularly limited, and known methods may be used in the manufacturing method to which the roll-to-roll method is applied.
  • the circuit wiring according to the present disclosure is a circuit wiring manufactured by the method for manufacturing a circuit wiring according to the present disclosure.
  • a substrate having circuit wiring according to the present disclosure is a substrate having circuit wiring manufactured by the method for manufacturing circuit wiring according to the present disclosure.
  • the application of the substrate having the circuit wiring according to the present disclosure is not limited, but it is preferably a circuit wiring board for a touch panel, for example.
  • An input device is an example of a device including circuit wiring manufactured by the method for manufacturing circuit wiring according to the present disclosure.
  • the input device according to the present disclosure may be any input device that has at least circuit wiring manufactured by the method for manufacturing circuit wiring according to the present disclosure, and is preferably a touch panel, and more preferably a capacitive touch panel. preferable.
  • the display device according to the present disclosure preferably includes the input device according to the present disclosure.
  • the display device according to the present disclosure is preferably an image display device such as an organic EL display device and a liquid crystal display device.
  • the method for manufacturing a touch panel according to the present disclosure is not particularly limited as long as it is a method for manufacturing a touch panel using the transfer material according to the present disclosure, but a positive photosensitive resin of the transfer material with respect to the temporary support is used.
  • a step of laminating the outermost layer on the side having a layer to a substrate having a conductive layer (hereinafter, also referred to as “laminating step"), and the positive photosensitive resin of the transfer material after the laminating step
  • a step of pattern-exposing the layer (hereinafter sometimes referred to as “exposure step”), and a step of developing the positive photosensitive resin layer after the step of pattern-exposing to form a resin pattern (hereinafter, "development” It may be referred to as “process”) and a process of etching the substrate in the region where the resin pattern is not arranged (hereinafter, may be referred to as “etching process”) in this order.
  • the touch panel manufacturing method according to the present disclosure preferably includes a step of peeling the temporary support (temporary support peeling step) after the bonding step and before the developing step.
  • the touch panel manufacturing method according to the present disclosure may include a step of peeling the cover film of the transfer material (cover film peeling step) before the bonding step.
  • the temporary support peeling step, the laminating step, the exposing step, the developing step, the etching step, and the cover film peeling step specific aspects of each step, the above-mentioned "circuit wiring As described in the section of “Production method”, the preferred embodiment is also the same.
  • a touch panel according to the present disclosure is a touch panel including at least circuit wiring manufactured by the method for manufacturing circuit wiring according to the present disclosure.
  • the touch panel according to the present disclosure preferably has at least a transparent substrate, an electrode, and an insulating layer or a protective layer.
  • the detection method in the touch panel according to the present disclosure may be any known method such as a resistance film method, a capacitance method, an ultrasonic method, an electromagnetic induction method, and an optical method. Of these, the capacitance method is preferable.
  • the touch panel type a so-called in-cell type (for example, those described in FIGS. 5, 6, 7, and 8 of Japanese Patent Publication No.
  • Polymer A-3 (PHS-EVE having the following structure, weight average molecular weight: 20,000) was obtained according to the method described in paragraph 0232 of JP-A-2014-85643.
  • the numerical value of each structural unit represents the content (mass%) of each structural unit.
  • Photosensitive resin composition 1 was obtained by blending with the following composition and filtering with a filter made of polytetrafluoroethylene having a pore size of 0.2 ⁇ m.
  • composition 1 for Forming Intermediate Layer Each component was mixed in the following composition to prepare a composition 1 for forming an intermediate layer.
  • composition of Composition 1 for Forming Intermediate Layer -Pure water: 33.7 parts by mass-Methanol: 61.2 parts by mass-Hydroxypropyl cellulose (HPC, HPC-SSL manufactured by Nippon Soda Co., Ltd.): 5.0 parts by mass-Megafuck F-569 (F-569) Manufactured by DIC Co., Ltd., including fluorine atom-containing nonionic surfactant (oligomer) having a molecular weight of 700 or more.): 0.1 part by mass
  • F-410 Megafac F-410, manufactured by DIC Corporation, does not include anionic surfactant having a perfluoroalkyl group and a carboxy group and having a molecular weight of 700 or more.
  • F-444 Megafac F-444, manufactured by DIC Corporation, does not include a nonionic surfactant having a perfluoroalkyl group and an alkyleneoxy group and having a molecular weight of 700 or more.
  • F-477 Megafac F-477, manufactured by DIC Corporation, including a nonionic surfactant (oligomer) having a fluorine atom and having a molecular weight of 700 or more.
  • F-510 Megafac F-510, manufactured by DIC Corporation, including an anionic surfactant (oligomer) having a perfluoroalkyl group and a phosphoric acid group, having a molecular weight of 700 or more.
  • F-553 Includes Megafac F-553, manufactured by DIC Corporation, a nonionic surfactant (oligomer) having a fluorine atom, and having a molecular weight of 700 or more.
  • F-556 Megafac F-556, manufactured by DIC Corporation, including a fluorine atom-containing nonionic surfactant (oligomer) having a molecular weight of 700 or more.
  • F-559 Megafac F-556, manufactured by DIC Corporation, including a nonionic surfactant (oligomer) having a fluorine atom and having a molecular weight of 700 or more.
  • R-94 Megafac R-94, manufactured by DIC Corporation, including a nonionic surfactant (oligomer) having a fluorine atom and having a molecular weight of 700 or more.
  • Example 1 ⁇ Preparation of transfer material> Onto a polyethylene terephthalate (PET) film (temporary support, thickness: 25 ⁇ m), the above composition 1 for forming an intermediate layer was applied in an amount such that the dry film thickness was 1.6 ⁇ m using a slit nozzle. After the composition 1 for forming an intermediate layer was dried, the composition 1 for forming an intermediate layer was further applied thereon by an amount of 0.4 ⁇ m using a slit nozzle. After drying the composition 1 for forming an intermediate layer, the photosensitive resin composition 1 was applied thereon in an amount such that the dry film thickness was 3.0 ⁇ m.
  • PET polyethylene terephthalate
  • Example 2 to 14 Transfer materials of Examples 2 to 14 were prepared in the same manner as in Example 1 except that the composition 1 for forming an intermediate layer was changed to the composition 2 for forming an intermediate layer to the composition 14 for forming an intermediate layer.
  • Example 15 The composition 4 for forming an intermediate layer was applied onto a PET film (temporary support, thickness: 25 ⁇ m) using a slit-shaped nozzle in an amount such that the dry film thickness was 1.6 ⁇ m. After the composition 4 for forming an intermediate layer was dried, the composition 15 for forming an intermediate layer was further applied thereon by an amount of 0.4 ⁇ m using a slit nozzle. After drying the composition 15 for forming the intermediate layer, the photosensitive resin composition 1 was applied thereon in an amount such that the dry film thickness was 3.0 ⁇ m. Then, it was dried with warm air of 100 ° C., and finally a polyethylene film (OSM-N, manufactured by Tredegar Co., Ltd.) was pressure-bonded as a cover film to prepare a transfer material of Example 15.
  • OSM-N polyethylene film
  • Example 16 A transfer material of Example 16 was produced in the same manner as in Example 1 except that the dry film thickness of the photosensitive resin composition 1 was applied in an amount of 5.0 ⁇ m.
  • Example 17 or Example 18 A transfer material of Example 17 or Example 18 was produced in the same manner as in Example 1 except that the photosensitive resin composition 1 was changed to the photosensitive resin composition 2 or the photosensitive resin composition 3.
  • Photosensitive resin compositions 2 and 3 were obtained by blending with the following composition and filtering with a filter made of polytetrafluoroethylene having a pore size of 0.2 ⁇ m.
  • Example 19 ⁇ Preparation of transfer material>
  • the composition 1 for forming an intermediate layer was applied onto PET using a slit-shaped nozzle in an amount such that the dry film thickness was 1.6 ⁇ m.
  • the photosensitive resin composition 1 was applied thereon in an amount such that the dry film thickness was 3.0 ⁇ m. Then, it was dried with warm air of 100 ° C., and finally a polyethylene film (OSM-N, manufactured by Tredegar Co., Ltd.) was pressure-bonded as a cover film to prepare a transfer material of Example 19.
  • OSM-N polyethylene film
  • Comparative Example 1 A transfer material of Comparative Example 1 was produced in the same manner as in Example 1 except that the composition 1 for forming an intermediate layer was changed to the composition 16 for forming an intermediate layer.
  • ⁇ Strip evaluation> The cover film was peeled off from the produced transfer material, the light of a fluorescent lamp was applied to the transfer material, and the appearance of the streaks was evaluated visually at an angle of 45 °.
  • the “streaks” in the transfer material according to the present disclosure are stripes on the surface to be transferred in the transfer material (transfer surface, in the above-described Examples and Comparative Examples, the surface of the photosensitive resin layer from which the cover film has been peeled off). Indicates a failure that causes unevenness. In many cases, the streaks are generated in parallel with the conveying direction when the transfer material is manufactured.
  • a roll-shaped substrate (PET substrate with a copper layer) was prepared by forming a copper layer on a polyethylene terephthalate (PET) film having a thickness of 200 ⁇ m with a thickness of 250 nm by a sputtering method.
  • PET polyethylene terephthalate
  • the cover film was peeled from the produced transfer material, and laminated on a PET substrate with a copper layer under laminating conditions of a laminating roll temperature of 100 ° C., a linear pressure of 0.6 MPa, and a linear velocity (laminating speed) of 4.0 m / min.
  • a line-and-space pattern (Duty ratio 1: 1) mask having a line width of 6 ⁇ m was brought into contact with a temporary support, exposed by an ultra-high pressure mercury lamp, left at 23 ° C. for 3 hours, and then developed. The development was carried out for 40 seconds by shower development using a 1.0% by mass sodium carbonate aqueous solution at 28 ° C.
  • a line-and-space pattern having a line width of 6 ⁇ m was formed by the above method, and the exposure amount at which the ratio of the line width to the space width was 1: 1 was determined.
  • a line-and-space pattern having a line width of 6 ⁇ m at the exposure amount was formed by the above method, and etching was performed by immersing in a copper etching solution (Cu-02, manufactured by Kanto Kagaku Co., Ltd.) at 25 ° C. for 5 minutes to form a square shape.
  • the copper pattern wiring of was produced.
  • the obtained copper pattern wiring was observed with an optical microscope.
  • the observation area of 0.26 mm ⁇ 0.20 mm in the copper pattern wiring was taken as one shot, and the number of wiring defects of the copper pattern wiring was measured in a total of 5 shots at the central portion of the copper pattern wiring and the four corners of the square shape.
  • the following evaluation was performed by the maximum number of the total number of wiring defects of disconnection (open) of wiring and coupling (short) of wiring in one shot. It is preferably A or B.
  • B The number of defects in the copper pattern is 1 or more and 4 or less.
  • C The number of defects in the copper pattern is 5 or more.
  • ⁇ Adhesion evaluation> The cover film was peeled off from the produced transfer material, and laminated on the PET substrate with a copper layer under the laminating conditions of a laminating roll temperature of 100 ° C., a linear pressure of 0.6 MPa, and a linear velocity (laminating speed) of 4.0 m / min.
  • a sample was prepared by cutting into 4.5 cm ⁇ 10 cm, and the PET substrate side with the copper layer was fixed on a sample table.
  • a tensile compression tester SV-55 manufactured by Imada Seisakusho Co., Ltd.
  • Adhesion exceeds 0.098 N / cm.
  • B The adhesion is 0.069 N / cm to 0.098 N / cm.
  • C Adhesion is less than 0.069 N / cm.
  • the transfer materials of Examples 1 to 19 have less streaks on the surface to be transferred than the transfer materials of Comparative Example 1. Further, from Table 2 above, the transfer materials of Examples 1 to 19 are excellent in adhesion in transfer, and there are few wiring defects when the transfer material is used as an etching resist.
  • Example 101 On a PET substrate having a thickness of 100 ⁇ m, ITO was deposited as a second conductive layer to a thickness of 150 nm by sputtering, and copper was deposited thereon as a first conductive layer to a thickness of 200 nm by a vacuum deposition method. And used as a circuit forming substrate.
  • the transfer material obtained in Example 1 was attached to the substrate on the copper layer (laminating roll temperature 100 ° C., linear pressure 0.8 MPa, linear velocity 3.0 m / min.) To obtain a laminate.
  • a photomask provided with a pattern hereinafter, also referred to as “pattern A”) shown in FIG.
  • the solid line portion SL and the gray portion G are light-shielding portions, and the dotted line portion DL virtually shows a frame for alignment alignment. Thereafter, the temporary support was peeled off, and development and washing were carried out to obtain pattern A. Then, after etching the copper layer using a copper etching solution (Cu-02 manufactured by Kanto Chemical Co., Inc.), the ITO layer is etched using an ITO etching solution (ITO-02 manufactured by Kanto Chemical Co., Ltd.). A substrate in which both copper and ITO were drawn in the pattern A was obtained.
  • Cu-02 copper etching solution
  • ITO-02 ITO etching solution
  • pattern B a photomask provided with openings of the pattern shown in FIG. 3 (hereinafter, also referred to as “pattern B”), and development and washing were performed.
  • the gray part G is a light-shielding part
  • the dotted line part DL is a virtual frame for alignment.
  • the copper layer was etched using Cu-02, and the remaining photosensitive resin layer was stripped using a stripping solution (KP-301 manufactured by Kanto Chemical Co., Inc.) to obtain a circuit wiring board.
  • KP-301 manufactured by Kanto Chemical Co., Inc.
  • Example 102 On a PET substrate having a thickness of 100 ⁇ m, ITO was deposited as a second conductive layer to a thickness of 150 nm by sputtering, and copper was deposited thereon as a first conductive layer to a thickness of 200 nm by a vacuum deposition method. And used as a circuit formation substrate.
  • the transfer material obtained in Example 1 was attached to the substrate on the copper layer (laminating roll temperature 100 ° C., linear pressure 0.8 MPa, linear velocity 3.0 m / min.) To obtain a laminate.
  • the obtained laminated body was pattern-exposed using a photomask provided with a pattern A having a configuration in which conductive layer pads were connected in one direction without peeling off the temporary support.
  • the temporary support was peeled off, and development and washing were carried out to obtain pattern A.
  • the ITO layer is etched using an ITO etching solution (ITO-02 manufactured by Kanto Chemical Co., Ltd.).
  • ITO-02 manufactured by Kanto Chemical Co., Ltd.
  • a substrate in which both copper and ITO were drawn in the pattern A was obtained.
  • PET (A) was laminated as a protective layer on the remaining resist. In this state, pattern exposure was performed using a photomask provided with openings for the pattern B in alignment with each other, and the PET (A) was peeled off, followed by development and washing with water.
  • the copper wiring was etched using Cu-02, and the remaining photosensitive resin layer was peeled off using a peeling solution (KP-301 manufactured by Kanto Chemical Co., Inc.) to obtain a circuit wiring board.
  • a peeling solution KP-301 manufactured by Kanto Chemical Co., Inc.
  • Example 103 On a 100 ⁇ m-thick cycloolefin polymer (COP) substrate, ITO was deposited as a second conductive layer to a thickness of 150 nm by sputtering, and copper was deposited thereon as a first conductive layer to a thickness of 200 nm by a vacuum deposition method. To form a substrate for forming a conductive pattern.
  • the transfer material obtained in Example 1 was attached to the substrate on the copper layer (laminating roll temperature 100 ° C., linear pressure 0.8 MPa, linear velocity 3.0 m / min.) To obtain a laminate.
  • the obtained laminated body was pattern-exposed using a photomask provided with a pattern A having a configuration in which conductive layer pads were connected in one direction without peeling off the temporary support.
  • the temporary support was peeled off, developed and washed with water to obtain a resin pattern drawn with pattern A.
  • the ITO layer is etched using an ITO etching solution (ITO-02 manufactured by Kanto Chemical Co., Ltd.) By peeling using (KP-301 manufactured by Kanto Chemical Co., Inc.), a substrate in which both copper and ITO were drawn in the pattern A was obtained.
  • Example 1 the transfer material obtained in Example 1 was bonded onto the remaining resist (roll temperature 100 ° C., linear pressure 0.8 MPa, linear velocity 3.0 m / min.).
  • pattern alignment was performed using a photomask provided with an opening for the pattern B, and the temporary support of the transfer material was peeled off, followed by development and washing with water.
  • the copper wiring was etched using Cu-02, and the remaining photosensitive resin layer was peeled off using a stripping solution (KP-301 manufactured by Kanto Chemical Co., Inc.) to obtain a circuit wiring board having a conductive pattern. ..
  • KP-301 manufactured by Kanto Chemical Co., Inc.
  • 10 temporary support
  • 12 intermediate layer
  • 14 photosensitive resin layer
  • 16 cover film
  • 100 transfer material
  • SL solid line part
  • G gray part
  • DL dotted line part

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

L'invention concerne un matériau de transfert comprenant, dans cet ordre, un support temporaire, une couche intermédiaire contenant une résine soluble dans l'eau, ainsi qu'une couche de résine photosensible de type positif, la couche intermédiaire contenant un tensioactif avec un atome de fluor. L'invention concerne également un procédé de production de motif de résine, un procédé de production de câblage de circuit et un procédé de production de panneau tactile qui utilisent le matériau de transfert.
PCT/JP2019/043695 2018-11-20 2019-11-07 Matériau de transfert, procédé de production de motif de résine, procédé de production de câblage de circuit et procédé de production d'écran tactile WO2020105457A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201980075793.4A CN113056373A (zh) 2018-11-20 2019-11-07 转印材料、树脂图案的制造方法、电路配线的制造方法及触摸面板的制造方法
JP2020558258A JPWO2020105457A1 (ja) 2018-11-20 2019-11-07 転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び、タッチパネルの製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-217753 2018-11-20
JP2018217753 2018-11-20

Publications (1)

Publication Number Publication Date
WO2020105457A1 true WO2020105457A1 (fr) 2020-05-28

Family

ID=70773604

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2019/043695 WO2020105457A1 (fr) 2018-11-20 2019-11-07 Matériau de transfert, procédé de production de motif de résine, procédé de production de câblage de circuit et procédé de production d'écran tactile

Country Status (3)

Country Link
JP (1) JPWO2020105457A1 (fr)
CN (1) CN113056373A (fr)
WO (1) WO2020105457A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111816808A (zh) * 2020-07-10 2020-10-23 RealMe重庆移动通信有限公司 电池盖、壳体组件及电子设备
WO2021246251A1 (fr) * 2020-06-02 2021-12-09 富士フイルム株式会社 Film de transfert et procédé de production de corps multicouche
WO2022019046A1 (fr) * 2020-07-20 2022-01-27 昭和電工マテリアルズ株式会社 Élément photosensible, procédé de formation de motif de réserve et procédé de fabrication de carte de circuit imprimé
WO2022044963A1 (fr) * 2020-08-24 2022-03-03 富士フイルム株式会社 Film de transfert, procédé de fabrication de stratifié, procédé de fabrication de câblage de circuit et procédé de fabrication de dispositif électronique

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005215137A (ja) * 2004-01-28 2005-08-11 Fuji Photo Film Co Ltd 感光性樹脂組成物、感光性転写材料、液晶配向制御用突起及びその製造方法、並びに液晶表示装置
WO2011040083A1 (fr) * 2009-09-29 2011-04-07 富士フイルム株式会社 Composition de résine photosensible colorée, filtre coloré et dispositif d'affichage à cristaux liquides
WO2016175220A1 (fr) * 2015-04-28 2016-11-03 富士フイルム株式会社 Stratifié et nécessaire
JP2017078852A (ja) * 2015-10-21 2017-04-27 富士フイルム株式会社 ドライフィルムレジスト、回路配線の製造方法、回路配線、入力装置および表示装置
WO2018012635A1 (fr) * 2016-07-15 2018-01-18 富士フイルム株式会社 Film de transfert, capteur de film et procédé de fabrication de capteur de film

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6267951B2 (ja) * 2013-12-18 2018-01-24 富士フイルム株式会社 感光性転写材料、パターン形成方法およびエッチング方法
JP6573545B2 (ja) * 2015-12-21 2019-09-11 富士フイルム株式会社 ポジ型感光性転写材料及び回路配線の製造方法
CN107132731B (zh) * 2016-02-26 2021-10-15 富士胶片株式会社 感光性转印材料及电路布线的制造方法
WO2018179640A1 (fr) * 2017-03-30 2018-10-04 富士フイルム株式会社 Matériau de transfert photosensible et procédé de production de câblage de circuit

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005215137A (ja) * 2004-01-28 2005-08-11 Fuji Photo Film Co Ltd 感光性樹脂組成物、感光性転写材料、液晶配向制御用突起及びその製造方法、並びに液晶表示装置
WO2011040083A1 (fr) * 2009-09-29 2011-04-07 富士フイルム株式会社 Composition de résine photosensible colorée, filtre coloré et dispositif d'affichage à cristaux liquides
WO2016175220A1 (fr) * 2015-04-28 2016-11-03 富士フイルム株式会社 Stratifié et nécessaire
JP2017078852A (ja) * 2015-10-21 2017-04-27 富士フイルム株式会社 ドライフィルムレジスト、回路配線の製造方法、回路配線、入力装置および表示装置
WO2018012635A1 (fr) * 2016-07-15 2018-01-18 富士フイルム株式会社 Film de transfert, capteur de film et procédé de fabrication de capteur de film

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021246251A1 (fr) * 2020-06-02 2021-12-09 富士フイルム株式会社 Film de transfert et procédé de production de corps multicouche
CN111816808A (zh) * 2020-07-10 2020-10-23 RealMe重庆移动通信有限公司 电池盖、壳体组件及电子设备
CN111816808B (zh) * 2020-07-10 2022-08-05 RealMe重庆移动通信有限公司 电池盖、壳体组件及电子设备
WO2022019046A1 (fr) * 2020-07-20 2022-01-27 昭和電工マテリアルズ株式会社 Élément photosensible, procédé de formation de motif de réserve et procédé de fabrication de carte de circuit imprimé
WO2022044963A1 (fr) * 2020-08-24 2022-03-03 富士フイルム株式会社 Film de transfert, procédé de fabrication de stratifié, procédé de fabrication de câblage de circuit et procédé de fabrication de dispositif électronique

Also Published As

Publication number Publication date
JPWO2020105457A1 (ja) 2021-10-14
CN113056373A (zh) 2021-06-29

Similar Documents

Publication Publication Date Title
WO2020105457A1 (fr) Matériau de transfert, procédé de production de motif de résine, procédé de production de câblage de circuit et procédé de production d'écran tactile
JP6683890B2 (ja) 感光性転写材料、及び、回路配線の製造方法
JP6999693B2 (ja) 感光性転写材料、樹脂パターン製造方法、及び、配線製造方法
JP6574846B2 (ja) ドライフィルムレジスト、回路配線の製造方法、回路配線、入力装置および表示装置
JP2022069472A (ja) 感光性転写材料及びその製造方法、樹脂パターンの製造方法、並びに、回路配線の製造方法
JPWO2019044138A1 (ja) 感光性転写材料及びその製造方法、並びに、回路配線の製造方法
WO2020158316A1 (fr) Matériau de transfert photosensible, procédé de production de motif en résine, procédé de production de câblage de circuit, procédé de production d'écran tactile, et film et procédé de production associés
JP7007308B2 (ja) 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び、タッチパネルの製造方法
JP6812556B2 (ja) 感光性樹脂組成物、感光性転写材料、回路配線の製造方法、及び、タッチパネルの製造方法
WO2022019321A1 (fr) Composition, film de transfert, procédé de production de stratifié, procédé de production de câblage de circuit et procédé de production de dispositif électronique
WO2022044963A1 (fr) Film de transfert, procédé de fabrication de stratifié, procédé de fabrication de câblage de circuit et procédé de fabrication de dispositif électronique
WO2021261469A1 (fr) Composition, film de transfert, procédé de production de stratifié, procédé de production de câblage de circuit et procédé de production de dispositif électronique
WO2022045002A1 (fr) Film de transfert, procédé de fabrication d'un corps stratifié, procédé de fabrication d'un câblage de circuit, et procédé de fabrication de dispositif électronique
JP6968273B2 (ja) 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び、タッチパネルの製造方法
JP6832899B2 (ja) 感光性転写材料、回路配線の製造方法、及び、タッチパネルの製造方法
WO2019151534A1 (fr) Matériau de transfert photosensible, procédé de fabrication de câblage de circuit, et procédé de fabrication d'écran tactile
TW201942680A (zh) 感光性轉印材料、感光性轉印材料的製造方法、抗蝕劑圖案的製造方法、電路配線的製造方法、觸控面板及觸控面板顯示裝置
JP7102517B2 (ja) 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び、タッチパネルの製造方法
WO2024024864A1 (fr) Matériau de transfert photosensible, procédé de fabrication associé, procédé de fabrication de motif de résine et procédé de fabrication de câblage de circuit
JP6808045B2 (ja) 感光性樹脂組成物、感光性転写材料、回路配線の製造方法、及び、タッチパネルの製造方法
TW202112856A (zh) 感光性轉印構件、樹脂圖案之製造方法、電路配線之製造方法、觸控面板之製造方法
JPWO2020174767A1 (ja) パターンつき基板の製造方法、回路基板の製造方法、タッチパネルの製造方法、及び積層体
WO2019225363A1 (fr) Matériau de transfert photosensible, procédé de production de motif de résine, procédé de fabrication de câblage de circuit, et procédé de fabrication de panneau tactile
TW201938384A (zh) 感光性轉印材料、電路配線之製造方法及觸控面板之製造方法
TW202413096A (zh) 感光性轉印材料及其製造方法、樹脂圖案之製造方法、以及電路配線之製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19887422

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2020558258

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19887422

Country of ref document: EP

Kind code of ref document: A1