WO2020103900A1 - Oled显示基板和显示面板 - Google Patents
Oled显示基板和显示面板Info
- Publication number
- WO2020103900A1 WO2020103900A1 PCT/CN2019/119919 CN2019119919W WO2020103900A1 WO 2020103900 A1 WO2020103900 A1 WO 2020103900A1 CN 2019119919 W CN2019119919 W CN 2019119919W WO 2020103900 A1 WO2020103900 A1 WO 2020103900A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- oled
- connection line
- display
- cathode connection
- display substrate
- Prior art date
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- 239000000758 substrate Substances 0.000 title claims abstract description 99
- 239000003086 colorant Substances 0.000 claims abstract description 6
- 239000010409 thin film Substances 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 19
- 238000005538 encapsulation Methods 0.000 claims description 18
- 238000005192 partition Methods 0.000 claims description 9
- 230000004888 barrier function Effects 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- -1 polydimethylsiloxane Polymers 0.000 claims description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 5
- 239000004642 Polyimide Substances 0.000 claims description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 4
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 64
- 230000000694 effects Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
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- 239000011521 glass Substances 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
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- 238000002360 preparation method Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
- H10K59/353—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels characterised by the geometrical arrangement of the RGB subpixels
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8052—Cathodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Definitions
- An aspect of the present disclosure provides an OLED display substrate, including:
- the axisymmetric figure includes a cross or regular polygon.
- the metal includes at least one of titanium, aluminum, silver, and copper.
- the bent shape includes at least one of an S shape, a zigzag shape, and a spiral shape.
- the substrate is made of at least one of polydimethylsiloxane, polyimide, and polyethylene terephthalate.
- the OLED display substrate further includes a barrier layer, and the barrier layer and the thin film encapsulation layer isolate each OLED device of the plurality of display regions from the external environment.
- the via hole is provided in a middle region of the insulating layer corresponding to the center of the display area where the first cathode connection line is provided.
- Another aspect of the present disclosure provides a display panel including the OLED display substrate according to any one of the above embodiments of the present disclosure.
- FIG. 3 is a schematic plan view of a part of another structure of a display substrate according to an embodiment of the present disclosure
- FIG. 4 is a schematic plan view of a part of another structure of a display substrate according to an embodiment of the present disclosure.
- FIG 5 is a schematic perspective view of a structure of one display area in a display substrate according to an embodiment of the present disclosure.
- the related stretchable display panel is divided into a plurality of display areas and a space area separating the plurality of display areas.
- a structure such as a thin film transistor (TFT), an insulating layer, an OLED device, a planarization layer, a thin film encapsulation layer, etc. is provided in each display area of the base of the display panel.
- a cathode connection area is provided at the edge of each display area, and a stretchable cathode connection line is provided in the space area.
- each display area 1A may be an axisymmetric figure.
- the symmetry axis of each display area 1A may be a horizontal line or a vertical line passing through the center (eg, geometric center) of the display area 1A.
- Straight line In each display area 1A, a plurality of pixel units can be evenly arranged around the center of the display area 1A.
- the shape of each display area 1A is a rectangle (for example, a square).
- FIG. 1 may be a cross-sectional view of each display area 1A taken along the line BB 'shown in FIG. 5.
- a plurality of pixel units may be uniformly arranged in a matrix, each pixel unit may include a plurality of sub-pixels, and each sub-pixel may include an OLED device and an OLED DEVICE THIN FILM TRANSISTOR 5.
- the emission colors of OLED devices in different sub-pixels may be different.
- the orthographic projection of the via 61 of the insulating layer 6 on the substrate 1 and the orthographic projection of the center of the display area 1A on the substrate 1 may overlap.
- the via 61 is provided in a middle region of the insulating layer 6 corresponding to the center of the display area 1A where the first cathode connection line 2 is provided.
- the cathode 33 of the OLED device is connected to the first cathode connection line 2 through the via 61; the first cathode connection line 2 is connected to the second cathode connection line 8 of the partition 1B.
- the first cathode connection line 2 may extend beyond the display area 1A where the first cathode connection line 2 is located to connect to the second cathode connection line 8 as shown in FIG. 5.
- the anode 31 of each OLED device is connected to the drain 53 of the thin film transistor 5 through a via penetrating the insulating layer 6 (for example, a via located on the left or right side of the via 61 in FIG. 1).
- the pixel defining layer 4 and the insulating layer 6 are located in the middle region of each display area 1A and are provided with a via 61, and the diameter of the via 61 may range from 50 ⁇ m to 90 ⁇ m.
- the cathode 33 of each OLED device is connected to the first cathode connection line 2 located under the insulating layer 6 through the via 61, and the first cathode connection line 2 extends to the partition area 1B and is connected to the second cathode connection line 8. In this way, a control electrical signal can be input to the cathode 33 of the OLED device of each display area 1A through the second cathode connection line 8.
- connection area of the cathode 33 provided at the edge of each display area for example, each display area 1A
- each display area 1A the connection area of the cathode 33 provided at the edge of each display area
- the via hole 61 of the cathode 33 and the first cathode connection line 2 is provided in the central area of the display area 1A (for example, the via hole may be provided between adjacent OLED devices located in the central area of each display area 1A), It is not necessary to additionally provide a connection area of the cathode 33 at the edge of each display area 1A.
- the size of the edge of each display area 1A can be reduced, that is, the area of the non-display area 1A (ie, the space area 1B) in the display substrate can be significantly reduced, thereby increasing the aperture ratio of the OLED display substrate and enhancing The display effect of the OLED display substrate.
- both the first cathode connection line 2 and the thin film transistor 5 may be located on the side of the insulating layer 6 close to the substrate 1.
- the first cathode connection line 2 can be arranged in the same layer as the source 52 and drain 53 of the thin film transistor 5 and have the same material, that is, the three can be formed by a patterning process to simplify the preparation process of the OLED display substrate and avoid increase The thickness of the OLED display substrate.
- first cathode connecting wire 2 can also be prepared separately.
- first cathode connecting wire 2 may also be provided in the same layer and the same material as the second cathode connecting wire 8, that is, the first cathode connecting wire 2 may be the same as the second cathode connecting wire 8 Formed using a patterning process.
- each of the first cathode connection line 2 and the second cathode connection line 8 may be made of a metal with better tensile properties such as titanium (Ti), aluminum (Al), silver (Ag), copper (Au), etc. It can also be made from stretchable conductive materials such as conductive rubber and graphene.
- the cathode 33 is connected to the connection electrode 7 so as to ensure the connection effect of the cathode 33 and the first cathode connection line 2. It should be immediately that the via 61 can penetrate the pixel defining layer 4 and the insulating layer 6.
- connection electrode 7 may be provided in the same layer and the same material as the anode 31 of each OLED device, that is, the connection electrode 7 may be formed at the same time as the anode 31 is formed, to simplify the manufacturing process of the OLED display substrate.
- the display substrate may also be provided with a barrier layer 9 whose shape corresponds to the shape of the orthographic projection of each display area 1A on the substrate 1 (for example, similar).
- the barrier layer 9 and the thin-film encapsulation layer 10 may jointly form a sealed space in which each display area 1A is accommodated to enhance the encapsulation effect of each OLED device.
- an embodiment of the present disclosure provides an OLED display substrate, which has substantially the same structure as the OLED display substrate provided by the embodiments corresponding to FIGS. 1 and 2. The difference is that in the OLED display substrate of this embodiment, the shape of each display area 1A is a cross shape.
- a via hole 61 is provided through which the cathode 33 passes Connected to the first cathode connection line 2.
- an embodiment of the present disclosure provides an OLED display substrate, which is substantially the same as the OLED display substrate provided by the embodiments corresponding to FIGS. 1 and 2.
- the difference is that in the OLED display substrate of this embodiment, the shape of each display area 1A is a regular polygon.
- the OLED display substrate of the present embodiment will be described by taking the shape of each display area 1A as a hexagon as an example.
- OLED devices in different sub-pixels have different emission colors (for example, different sub-pixels may include red sub-pixels, green sub-pixels, and blue There are three types of sub-pixels), and the cathodes 33 of multiple OLED devices located in the same display area 1A are of an integrated structure.
- the overall pattern formed by the cathodes 33 of a plurality of sub-pixels located in the same display area 1A may be a regular hexagonal pattern corresponding to the shape of the display area 1A.
- a via 61 is provided in the middle area of the pixel defining layer 4 and the insulating layer 6 corresponding to the center of each display area 1A of the regular hexagon (for example, the symmetric position of the center of the hexagon pattern), through which the cathode 33 passes
- the hole 61 is connected to the first cathode connection line 2.
- each display area 1A may be provided with a plurality of first cathode connecting wires 2 (only one end of each first cathode connecting wire 2 is seen in FIG. 4, and the rest of the first cathode connecting wire 2 is (The layers above it are blocked by).
- each first cathode connecting line 2 may be located directly below the line connecting the midpoint of one side of the corresponding display area 1A and the center of the corresponding display area 1A, and may be The orthographic projection of the center of the zone 1A on the plane where the first cathode connecting line 2 is located intersects.
- Each first cathode connection line 2 may be connected to the cathode 33 of each OLED device through the via 61 at the middle area of the regular hexagonal display area 1A.
- both ends of each first cathode connection line 2 are respectively connected to the adjacent second cathode connection line 8 in the partition 1B.
- the cathode 33 may be connected to the first cathode connection line 2 through the connection electrode 7 provided in the via 61.
- the second cathode connection line 8 may have a bent shape to provide cushioning for stretching and / or bending of the OLED display substrate.
- the bent shape may include at least one of an S shape, a zigzag shape, and a spiral shape.
- the base 1 of the OLED display substrate may be made of a stretchable material or a bendable material, so that the OLED display substrate is stretchable and / or bendable.
- the stretchable material or the bendable material may include polydimethylsiloxane (PDMS), polyimide (PI) and polyethylene terephthalate It is made of at least one of polyethylene (terephthalate, PET for short).
- each of the barrier layer 9 and the thin-film encapsulation layer 10 may be made of a transparent material (eg, glass).
- An embodiment of the present disclosure provides a display panel including any of the embodiments corresponding to FIGS. 1 and 2, the embodiments corresponding to FIGS. 1 and 3, and the embodiments corresponding to FIGS. 1 and 4.
- OLED display substrate The display panel in this embodiment is a stretchable OLED display panel.
- the OLED display panel can be applied to any product or component with a display function, such as a mobile phone, a tablet computer, a TV, a display, a notebook computer, an advertising screen, etc. .
- the display panel of this embodiment includes the OLED display substrate provided in the above embodiments of the present disclosure, the display panel has a higher aperture ratio and a better display effect.
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- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
本公开提供一种OLED显示基板和一种显示面板。所述OLED显示基板包括:多个显示区和将所述多个显示区分隔的间隔区,所述多个显示区中的每一个中设置有多个像素单元,每个所述像素单元包括分别发射不同颜色光的多个OLED器件;第一阴极连接线和绝缘层,它们设置在所述多个显示区中的至少一个中,并且依次设置在基底和所述多个OLED器件之间,其中位于同一所述显示区的全部OLED器件的阴极为一体结构;过孔,其设置在所述绝缘层中,其中位于同一所述显示区的全部OLED器件的阴极通过所述过孔与所述第一阴极连接线连接;以及第二阴极连接线,其设置在所述间隔区中,并且与所述第一阴极连接线连接。
Description
相关申请的交叉引用
本申请要求于2018年11月22日提交的中国专利申请No.201811398515.6的优先权,该专利申请的全部内容通过引用方式合并于此。
本公开属于显示技术领域,具体涉及一种OLED显示基板和一种显示面板。
近年来,随着OLED显示技术的快速发展及在显示领域的广泛应用,可弯曲、可折叠、可拉伸等的显示面板层出不穷。期望提供一种具有改善的显示效果的OLED显示基板和一种显示面板。
发明内容
本公开的一方面提供了一种OLED显示基板,包括:
多个显示区和将所述多个显示区分隔的间隔区,所述多个显示区中的每一个中设置有多个像素单元,每个所述像素单元包括分别发射不同颜色光的多个OLED器件;
第一阴极连接线和绝缘层,它们设置在所述多个显示区中的至少一个中,并且依次设置在基底和所述多个OLED器件之间,其中位于同一所述显示区的全部OLED器件的阴极为一体结构;
过孔,其设置在所述绝缘层中,其中位于同一所述显示区的全部OLED器件的阴极通过所述过孔与所述第一阴极连接线连接;以及
第二阴极连接线,其设置在所述间隔区中,并且与所述第一 阴极连接线连接。
在一些实施例中,所述绝缘层的所述过孔中设置有连接电极,所述连接电极的两端分别与所述第一阴极连接线和位于同一所述显示区的全部OLED器件的阴极连接。
在一些实施例中,每一个所述OLED器件的阳极相对所述阴极更靠近所述基底;所述连接电极与每一个所述OLED器件的阳极同层设置且材料相同。
在一些实施例中,所述OLED显示基板还包括设置于所述绝缘层靠近所述基底的一侧的薄膜晶体管。
在一些实施例中,所述第一阴极连接线与所述薄膜晶体管的源极、漏极同层设置且材料相同。
在一些实施例中,所述第一阴极连接线与所述第二阴极连接线同层设置且材料相同。
在一些实施例中,所述OLED显示基板还包括:薄膜封装层,所述多个显示区中的每一个在所述基底上的正投影都落入所述薄膜封装层在所述基底上的正投影之内。
在一些实施例中,每一个所述显示区的形状为轴对称图形,每个所述显示区中,所述多个像素单元环绕所述显示区的中心均匀排布;所述绝缘层的所述过孔在所述基底上的正投影与所述显示区的所述中心在所述基底上的正投影重叠。
在一些实施例中,所述轴对称图形包括十字型或者正多边形。
在一些实施例中,所述第一阴极连接线向该第一阴极连接线所在的显示区的外部延伸超出该显示区以连接至所述第二阴极连接线。
在一些实施例中,所述第一阴极连接线和所述第二阴极连接线中的每一个由可拉伸的导电材料制成。
在一些实施例中,所述可拉伸的导电材料包括金属、导电橡胶和石墨烯中的至少一种。
在一些实施例中,所述金属包括钛、铝、银和铜中的至少一种。
在一些实施例中,所述第二阴极连接线具有弯折形状。
在一些实施例中,所述弯折形状包括S形、锯齿形和螺旋形中的至少一种。
在一些实施例中,所述基底由可拉伸材料或可弯折材料制成。
在一些实施例中,所述基底由聚二甲基硅氧烷、聚酰亚胺和聚对苯二甲酸乙二醇酯中的至少一种制成。
在一些实施例中,所述OLED显示基板还包括阻隔层,所述阻隔层和所述薄膜封装层将所述多个显示区的每个OLED器件与外部环境隔离。
在一些实施例中,所述过孔设置在所述绝缘层的与设置有所述第一阴极连接线的所述显示区的中心相对应的中间区域中。
本公开的另一方面提供了一种显示面板,包括根据本公开的上述实施例中任意一个所述的OLED显示基板。
图1为根据本公开的实施例的一种显示基板的结构的示意截面图;
图2为根据本公开的实施例的一种显示基板的结构的一部分的示意平面图;
图3为根据本公开的实施例的另一种显示基板的结构的一部分的示意平面图;
图4为根据本公开的实施例的另一种显示基板的结构的一部分的示意平面图;以及
图5为根据本公开的实施例的一种显示基板中的一个显示区的结构的示意透视图。
为使本领域技术人员更好地理解本公开的技术方案,下面结合附图和示例性实施方式对本公开作进一步详细描述。
本发明构思的发明人发现,相关的可拉伸显示面板中分为多 个显示区和将所述多个显示区分隔的间隔区。在显示面板的基底的各显示区中设置有薄膜晶体管(TFT)、绝缘层、OLED器件、平坦化层、薄膜封装层等结构。在每一个显示区的边缘设置有阴极连接区,在间隔区中设置有可拉伸的阴极连接线,OLED器件的阴极通过阴极连接区中的过孔与间隔区中的阴极连接线连接,从而通过间隔区中的可拉伸的阴极连接线实现显示面板的可拉伸性。由于阴极连接区可见具有50um至90um的宽度,导致相关技术中的显示面板中两个显示区之间的间隙会大于100um,因此该显示面板的显示效果不佳。
如图1和图2所示,本公开的实施例提供一种OLED显示基板,该OLED显示基板可以是可拉伸的OLED显示基板。该OLED显示基板包括多个显示区1A(所述多个显示区1A可统称为“显示部分”)和将所述多个显示区1A分隔的间隔区1B。每一个显示区1A可以为刚性区域(即,不可拉伸的区域),其中设置有多个像素单元。间隔区1B可以为弹性区域(例如,为可拉伸并且可弯折的区域),其中设置有可拉伸的第二阴极连接线8,第二阴极连接线8将不同的显示区1A彼此连接。当对OLED显示基板进行拉伸时,OLED显示基板所受的拉伸力大部分释放于间隔区1B中,故各个显示区1A的结构不易产生裂纹。从而尽量减小或避免对各个显示区1A中的OLED器件的影响,进而提高OLED显示基板的抗拉伸能力。
例如,每一个显示区1A的形状可以为轴对称图形,例如,在图2中,每一个显示区1A的对称轴可以是通过该显示区1A的中心(例如,几何中心)的水平直线或竖直直线。每个显示区1A中,多个像素单元可以环绕该显示区1A的中心均匀排布。本实施例中以每一个显示区1A的形状为矩形(例如,正方形)为例进行说明。
应当理解的是,图1可以是每一个显示区1A沿着如图5所示的线BB’截取的截面图。如图1和图2所示,在矩形的每个显示区1A中,多个像素单元可以呈矩阵均匀排布,每个像素单元可 以包括多个子像素,每个子像素可以包括OLED器件和与OLED器件连接的薄膜晶体管5。同一像素单元中,不同子像素中的OLED器件的发光颜色可以不同。例如,同一像素单元可以包括红色子像素(R)、绿色子像素(G)和蓝色子像素(B),它们分别发出红光、绿光和蓝光,以实现彩色显示。例如,位于同一显示区1A中的多个OLED器件的阴极33可以为一体结构并且由同一种材料形成。例如,本实施例的OLED显示基板中,多个像素单元中的多个OLED器件可以沿同一方向排列,例如,各像素单元中的多个OLED器件可都沿行方向(例如,图2中的水平方向)排列。
本实施例中,OLED显示基板的至少一个显示区1A中,沿背离基底1的方向依次设置有第一阴极连接线2、绝缘层(或平坦化层)6、OLED器件。作为另一个实施例,OLED显示基板的每一个显示区1A中,沿背离基底1的方向依次设置有第一阴极连接线2、绝缘层(或平坦化层)6、OLED器件。绝缘层6的与该显示区1A的中心相对应的中间区域中设置有过孔61,即所述中间区域可以为该显示区1A的中心(例如,几何中心)在绝缘层6上的正投影的位置。换言之,绝缘层6的过孔61在所述基底1上的正投影与该显示区1A的所述中心在所述基底1上的正投影可以重叠。在另一个实施例中,所述过孔61设置在所述绝缘层6的与设置有所述第一阴极连接线2的所述显示区1A的中心相对应的中间区域中。
OLED器件的阴极33通过该过孔61与第一阴极连接线2连接;第一阴极连接线2与间隔区1B的第二阴极连接线8连接。例如,所述第一阴极连接线2可以向该第一阴极连接线2所在的显示区1A的外部延伸超出该显示区1A以连接至所述第二阴极连接线8,如图5所示。
在一个示例中,如图1所示,每个OLED器件可以由像素限定层4限制出。每个OLED器件设置于薄膜晶体管5背离基底1的一侧,包括自下而上依次设置的阳极31、有机发光层32和阴极 33。薄膜晶体管5与每个OLED器件之间可以设置有绝缘层6。薄膜晶体管5位于绝缘层6靠近基底1的一侧,每个OLED器件位于绝缘层6背离基底1的一侧。薄膜晶体管5可以包括栅极51、源极52和漏极53。每个OLED器件的阳极31通过贯穿绝缘层6的过孔(例如,图1中位于过孔61的左侧或右侧的过孔)与薄膜晶体管5的漏极53连接。此外,像素限定层4和绝缘层6位于每个显示区1A的中间区域中设置有过孔61,该过孔61的直径范围可以在50μm至90μm。每个OLED器件的阴极33通过该过孔61与位于绝缘层6下方的第一阴极连接线2连接,第一阴极连接线2延伸至间隔区1B与第二阴极连接线8连接。这样,可通过第二阴极连接线8向各显示区1A的OLED器件的阴极33输入控制电信号。
相对于相关技术中在每个显示区(例如,每个显示区1A)的边缘设置阴极33的连接区,本实施例中的显示基板中,通过将连接每个显示区1A的各个OLED器件的阴极33与第一阴极连接线2的过孔61设置于该显示区1A的中心区域中(例如,可以在位于每个显示区1A的中心区域的相邻OLED器件之间设置该过孔),无需在每个显示区1A边缘另外设置阴极33的连接区。因此,能够减小每个显示区1A的边缘的尺寸,即,可以明显减小显示基板中的非显示区1A(即,间隔区1B)的面积,从而增大OLED显示基板的开口率,增强OLED显示基板的显示效果。
如图1所示,第一阴极连接线2与薄膜晶体管5可以都位于绝缘层6靠近基底1的一侧。例如,第一阴极连接线2可以与薄膜晶体管5的源极52和漏极53同层设置且材料相同,即三者可采用一次构图工艺形成,以简化OLED显示基板的制备工艺,且避免增加OLED显示基板的厚度。
可替换地,第一阴极连接线2也可以单独制备而成。可替换地,作为另一示例性实施方式,第一阴极连接线2也可与第二阴极连接线8同层设置且材料相同,即,第一阴极连接线2可与第二阴极连接线8采用一次构图工艺形成。在此情况下,第一阴极 连接线2和第二阴极连接线8中的每一个可由钛(Ti)、铝(Al)、银(Ag)、铜(Au)等拉伸性能较佳的金属制作而成,也可以由导电橡胶、石墨烯等可拉伸的导电材料制作而成。
本实施例的OLED显示基板中,由于阴极33所在层与第一阴极连接线2所在层之间的距离较大,且薄膜晶体管5包括多层结构,并且绝缘层6的厚度也较大。因此,绝缘层6中的过孔61较深,而每个OLED器件的阴极33通常通过磁控溅射、气相沉积等工艺形成。如果将阴极33的材料填充在过孔61中以将阴极33连接至第一阴极连接线2,可能会导致OLED器件的阴极33通过过孔61与第一阴极连接线2连接的连接效果不佳。故例如,本实施例中在绝缘层6的过孔中单独设置连接电极7,连接电极7的两端分别与第一阴极连接线2和位于同一所述显示区1A的全部OLED器件的阴极连接。即如图1所示,在绝缘层6的与每个显示区1A的中心相对应的中心位置出形成过孔61,然后在过孔61中利用导电材料(例如,导电金属)来形成连接电极7,使连接电极7通过该过孔61与第一阴极连接线2连接。之后在形成阴极33时,使阴极33与连接电极7连接,从而保证阴极33与第一阴极连接线2的连接效果。应当立即的是,过孔61可以穿透像素限定层4和绝缘层6。
例如,连接电极7可与每个OLED器件的阳极31同层设置且材料相同,即连接电极7可在形成阳极31的同时形成,以简化OLED显示基板的制备工艺。
例如,OLED显示基板还包括:薄膜封装层10,其中所述多个显示区1A中的每一个在基底1上的正投影都落入薄膜封装层10在基底1上的正投影之内。即,如图1所示,通过薄膜封装层10和下文所述的阻隔层9实现对每一个显示区1A的单独封装,以尽量避免每一个显示区1A中的各个OLED器件受到外界水氧侵蚀。例如,薄膜封装层10可以为单层无机封装层或者由无机封装层和有机封装层的叠层,并且可以具有与每一个显示区1A的结构相匹配的结构以将该显示区1A容纳在薄膜封装层10中。
如上所述,显示基板上还可以设置有阻隔层9,阻隔层9的形状与每一个显示区1A在所述基底1上的正投影的形状相对应(例如,相似)。阻隔层9与薄膜封装层10可以共同形成将每一个显示区1A容纳在其中的密封空间,以加强对各个OLED器件的封装效果。
如图1和图3所示,本公开的实施例提供一种OLED显示基板,其与图1和图2所对应的实施例提供的OLED显示基板的结构基本相同。不同之处在于,本实施例的OLED显示基板中,每个显示区1A的形状为十字型。
例如,如图3所示,该OLED显示基板的显示部分可以为十字型,十字型的显示部分的四个凸出部分别为四个显示区1A,每个显示区1A中设置有一个或者多个像素单元。同一像素单元中,不同子像素中的OLED器件的发光颜色不同。例如,不同子像素可以包括红色子像素、绿色子像素和蓝色子像素三种),且位于同一显示区1A中的多个OLED器件的阴极33为一体结构。例如,位于同一显示区1A中的多个OLED器件的各个子像素的阴极33整体构成的图案可为与显示区1A对应的十字型图案。像素限定层4和绝缘层6的与十字型的每个显示区1A的中心(例如,十字型图案中心对称位置)相对应的中间区域处中设置有过孔61,阴极33通过该过孔61与第一阴极连接线2连接。
同时,本实施例的OLED显示基板中,多个像素单元中的多个OLED器件可以沿同一方向排列,例如图3所示,各像素单元中的多个OLED器件可都沿十字型图案的相对的两个凸出部的连线方向(图3中为与竖直方向成45°的方向,即,左上和右下的连接方向)排列。
例如,每个显示区1A中可以设置有两条垂直交叉的第一阴极连接线2(如图3所示),以将十字型的该显示区1A均匀分成四个部分。同时,两条第一阴极连接线2的交点与每个显示区1A中间区域处的过孔61对应(例如,两条第一阴极连接线2的交点在所述基底1上的正投影与每个显示区1A中间区域处的过孔61 在所述基底1上的正投影互相重叠),每条第一阴极连接线2的两端分别与邻近的间隔区1B中的第二阴极连接线8连接。例如,阴极33可通过设置于过孔中的连接电极7与第一阴极连接线2连接,具体可参见图1和图2所对应的实施例的以上描述,在此不再详述。
如图1和图4所示,本公开的实施例提供一种OLED显示基板,其与图1和图2所对应的实施例提供的OLED显示基板基本相同。不同之处在于,本实施例的OLED显示基板中,每一个显示区1A的形状为正多边形。在下文中,以每一个显示区1A的形状为六边形为例对本实施例的OLED显示基板进行说明。
如图4所示,OLED显示基板的每一个显示区1A为正六边形,以每一个显示区1A的每条边的中点与该显示区1A的中心的连线为界限,可以将每一个显示区1A划分为六个部分,其中任意相邻两个部分之间的边界的正下方可以设置有一条第一阴极连接线2,每一条第一阴极连接线2的两端可以分别连接至位于间隔区1B中的两条第一阴极连接线2。每个显示区1A中可以设置有一个或多个像素单元,同一像素单元中,不同子像素中的OLED器件的发光颜色不同(例如,不同子像素可以包括红色子像素、绿色子像素和蓝色子像素三种),且位于同一显示区1A中的多个OLED器件的阴极33为一体结构。例如,位于同一显示区1A中的多个子像素的阴极33构成的整体图案可为与该显示区1A的形状相对应的正六边形图案。像素限定层4和绝缘层6的与正六边形的每一个显示区1A的中心(例如,六边形图案中心对称位置)相对应的中间区域处中设置有过孔61,阴极33通过该过孔61与第一阴极连接线2连接。
此外,本实施例的OLED显示基板中,多个像素单元中的多个OLED器件可以沿同一方向排列,例如图4所示,各像素单元中的多个OLED器件可都沿正六边形图案的相对的两个顶点的连接方向(例如,图4中的水平方向)排列。
如上所述,每个显示区1A中可以设置有多条第一阴极连接 线2(图4中只看到每一条第一阴极连接线2的一端,该第一阴极连接线2的其余部分被位于其上的各层所遮挡)。如上所述,每条第一阴极连接线2可以位于相应的显示区1A的一条边的中点与所述相应的显示区1A的中心的连线的正下方,并可以与所述相应的显示区1A的中心在该第一阴极连接线2所在的平面上的正投影相交。每条第一阴极连接线2可以通过正六边形显示区1A的中间区域处的过孔61与各个OLED器件的阴极33连接。此外,每条第一阴极连接线2的两端分别与间隔区1B中的邻近的第二阴极连接线8连接。例如,阴极33可通过设置于过孔61中的连接电极7与第一阴极连接线2连接。其他结构特征可参见对图1和图2所对应的实施例的以上描述,在此不再详述。
在一些实施例中,如图2至图4所示,所述第二阴极连接线8可以具有弯折形状,以便为所述OLED显示基板的拉伸和/或弯折提供缓冲。例如,所述弯折形状可以包括S形、锯齿形和螺旋形中的至少一种。
在一些实施例中,所述OLED显示基板的所述基底1可以由可拉伸材料或可弯折材料制成,使得所述OLED显示基板是可拉伸和/或可弯折的。例如,所述可拉伸材料或可弯折材料可以包括聚二甲基硅氧烷(polydimethylsiloxane,简称为PDMS)、聚酰亚胺(polyimide,简称为PI)和聚对苯二甲酸乙二醇酯(polyethylene terephthalate,简称为PET)中的至少一种制成。
在一些实施例中,所述阻隔层9和所述薄膜封装层10中的每一个可以由透明材料(例如,玻璃)制成。
本公开的实施例提供一种显示面板,包括图1和图2所对应的实施例、图1和图3所对应的实施例和图1和图4所对应的实施例中的任一个所提供的OLED显示基板。本实施例中的显示面板为可拉伸的OLED显示面板,该OLED显示面板例如可以应用于:手机、平板电脑、电视机、显示器、笔记本电脑、广告屏等任何具有显示功能的产品或部件中。
由于本实施例的显示面板包括本公开的上述实施例中提供的 OLED显示基板,故该显示面板的开口率较高,显示效果较好。
应当理解的是,以上实施方式仅仅是为了说明本公开的原理而采用的示例性实施方式,然而本公开并不局限于此。对于本领域内的普通技术人员而言,在不脱离本公开的精神和实质的情况下,可以做出各种变型和改进,这些变型和改进也属于本公开的保护范围。
Claims (20)
- 一种OLED显示基板,包括:多个显示区和将所述多个显示区分隔的间隔区,所述多个显示区中的每一个中设置有多个像素单元,每个所述像素单元包括分别发射不同颜色光的多个OLED器件;第一阴极连接线和绝缘层,它们设置在所述多个显示区中的至少一个中,并且依次设置在基底和所述多个OLED器件之间,其中位于同一所述显示区的全部OLED器件的阴极为一体结构;过孔,其设置在所述绝缘层中,其中位于同一所述显示区的全部OLED器件的阴极通过所述过孔与所述第一阴极连接线连接;以及第二阴极连接线,其设置在所述间隔区中,并且与所述第一阴极连接线连接。
- 根据权利要求1所述的OLED显示基板,其中,所述绝缘层的所述过孔中设置有连接电极,所述连接电极的两端分别与所述第一阴极连接线和位于同一所述显示区的全部OLED器件的阴极连接。
- 根据权利要求2所述的OLED显示基板,其中,每一个所述OLED器件的阳极相对所述阴极更靠近所述基底;所述连接电极与每一个所述OLED器件的阳极同层设置且材料相同。
- 根据权利要求1至3中任意一项所述的OLED显示基板,还包括设置于所述绝缘层靠近所述基底的一侧的薄膜晶体管。
- 根据权利要求4所述的OLED显示基板,其中,所述第一阴极连接线与所述薄膜晶体管的源极、漏极同层设置且材料相同。
- 根据权利要求1至5中任意一项所述的OLED显示基板,其中,所述第一阴极连接线与所述第二阴极连接线同层设置且材料相同。
- 根据权利要求1至6中任意一项所述的OLED显示基板,还包括:薄膜封装层,所述多个显示区中的每一个在所述基底上的正投影都落入所述薄膜封装层在所述基底上的正投影之内。
- 根据权利要求1所述的OLED显示基板,其中,每一个所述显示区的形状为轴对称图形,每个所述显示区中,所述多个像素单元环绕所述显示区的中心均匀排布;所述绝缘层的所述过孔在所述基底上的正投影与所述显示区的所述中心在所述基底上的正投影重叠。
- 根据权利要求8所述的OLED显示基板,其中,所述轴对称图形包括十字型或者正多边形。
- 根据权利要求1至9中任意一项所述的OLED显示基板,其中,所述第一阴极连接线向该第一阴极连接线所在的显示区的外部延伸超出该显示区以连接至所述第二阴极连接线。
- 根据权利要求1至10中任意一项所述的OLED显示基板,其中,所述第一阴极连接线和所述第二阴极连接线中的每一个由可拉伸的导电材料制成。
- 根据权利要求11所述的OLED显示基板,其中,所述可拉伸的导电材料包括金属、导电橡胶和石墨烯中的至少一种。
- 根据权利要求12所述的OLED显示基板,其中,所述金属包括钛、铝、银和铜中的至少一种。
- 根据权利要求1至13中任意一项所述的OLED显示基板,其中,所述第二阴极连接线具有弯折形状。
- 根据权利要求14所述的OLED显示基板,其中,所述弯折形状包括S形、锯齿形和螺旋形中的至少一种。
- 根据权利要求1至15中任意一项所述的OLED显示基板,其中,所述基底由可拉伸材料或可弯折材料制成。
- 根据权利要求16所述的OLED显示基板,其中,所述基底由聚二甲基硅氧烷、聚酰亚胺和聚对苯二甲酸乙二醇酯中的至少一种制成。
- 根据权利要求7所述的OLED显示基板,还包括阻隔层,所述阻隔层和所述薄膜封装层将所述多个显示区的每一个OLED器件与外部环境隔离。
- 根据权利要求1至18中任意一项所述的OLED显示基板,其中,所述过孔设置在所述绝缘层的与设置有所述第一阴极连接线的所述显示区的中心相对应的中间区域中。
- 一种显示面板,包括根据权利要求1至19中任意一项所述的OLED显示基板。
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CN110189640B (zh) | 2019-07-02 | 2020-11-10 | 京东方科技集团股份有限公司 | 可拉伸显示基板及其制作方法、显示装置 |
KR20210053559A (ko) * | 2019-11-04 | 2021-05-12 | 엘지디스플레이 주식회사 | 스트레쳐블 표시 장치 |
CN110911468A (zh) * | 2019-12-11 | 2020-03-24 | 京东方科技集团股份有限公司 | 一种显示用基板及电致发光显示装置 |
KR20210085912A (ko) * | 2019-12-31 | 2021-07-08 | 엘지디스플레이 주식회사 | 터치 디스플레이 장치 |
CN111682049B (zh) * | 2020-06-19 | 2023-08-22 | 京东方科技集团股份有限公司 | 显示基板、显示装置及掩膜版 |
CN111933066A (zh) * | 2020-08-28 | 2020-11-13 | 京东方科技集团股份有限公司 | Oled显示基板、显示模组、显示面板 |
CN112071881B (zh) * | 2020-09-09 | 2022-04-26 | 武汉华星光电半导体显示技术有限公司 | 显示面板及显示装置 |
CN112289193B (zh) * | 2020-10-30 | 2022-08-19 | 合肥维信诺科技有限公司 | 显示面板和显示装置 |
WO2022133669A1 (zh) * | 2020-12-21 | 2022-06-30 | 京东方科技集团股份有限公司 | 显示面板及其制作方法和显示装置 |
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