WO2020042600A1 - 绑定机台水平对系统及方法 - Google Patents

绑定机台水平对系统及方法 Download PDF

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Publication number
WO2020042600A1
WO2020042600A1 PCT/CN2019/078952 CN2019078952W WO2020042600A1 WO 2020042600 A1 WO2020042600 A1 WO 2020042600A1 CN 2019078952 W CN2019078952 W CN 2019078952W WO 2020042600 A1 WO2020042600 A1 WO 2020042600A1
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WIPO (PCT)
Prior art keywords
substrate
laser
horizontal alignment
platform
binding machine
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Application number
PCT/CN2019/078952
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English (en)
French (fr)
Inventor
郑俊丰
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武汉华星光电技术有限公司
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Publication of WO2020042600A1 publication Critical patent/WO2020042600A1/zh

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Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Definitions

  • the present application relates to the technical field of display device manufacturing, and in particular, to a horizontal alignment system and method for a binding machine.
  • the horizontal alignment accuracy between the glass substrate bonding machine and the crimping equipment lacks an effective monitoring method, which leads to binding at the bonding machine. Due to the difference in level between the bonding platform and the laminating equipment during the process of fixing, defective or even broken pieces are formed on the glass substrate.
  • this application proposes a horizontal alignment system and method for a binding machine to solve the above problems.
  • the application provides a horizontal alignment system and method for a binding machine to solve the insufficient horizontal alignment accuracy between an existing binding platform and a crimping device, resulting in a horizontal height between the binding platform and the crimping device.
  • the difference leads to the problem of defective or even broken pieces formed on the glass substrate.
  • a horizontal alignment system for a binding machine which is used for horizontal alignment during the binding process of a substrate and a board to be bound, the substrate includes a phase alignment with the board to be bound.
  • a matching binding area, the binding machine horizontal alignment system includes:
  • a pressing module comprising a lower knife portion and a thermal pressing head for pressing the substrate and the plate to be bound;
  • the laser alignment module includes a laser calibration unit and a laser receiving unit, the laser receiving unit is respectively fixed on the bearing module and the surface of the lower knife portion, and the laser receiving unit is configured to receive laser light emitted by the laser calibration unit signal;
  • a control module configured to adjust the positions of the carrying module and the lower knife part according to the laser signal until the carrying platform and the carrying module reach a specified position.
  • the carrier module includes a carrier platform
  • the carrying platform and the laser calibration unit are fixed on a machine platform, the carrying platform is used to carry the substrate, and the laser calibration unit is fixed at a predetermined horizontal height by the machine platform as the carrying platform. A reference point for the horizontal position of the module and the lower knife part.
  • the lower knife portion and the carrying platform are located on one side of the substrate, and the thermal head is located on the substrate. The other side of the substrate.
  • the carrying platform includes a supporting plate for carrying the substrate
  • the laser receiving unit includes a first laser receiver and a second laser receiver
  • the first laser receiver is located on a side of the support plate near the laser calibration unit, and the second laser receiver is located on a side of the lower knife portion near the laser calibration unit.
  • the laser receiving unit includes a light source receiving template with at least two scales.
  • the substrate includes:
  • a color filter substrate on the array substrate is A color filter substrate on the array substrate
  • a second polarizing plate located on the color filter substrate
  • the first polarizing plate is in contact with the carrier template.
  • the spot of the laser light source in the laser calibration unit is less than 50 microns.
  • the positions of the lower knife portion and the thermal head are matched with the binding region of the substrate.
  • a method for horizontal alignment of a binding machine which uses the horizontal alignment system of the binding machine of claim 1 for horizontal alignment, and the binding machine
  • the methods of horizontal alignment include:
  • Step S10 The substrate is placed on the carrier platform, a board to be bound is provided, and the board to be bound is placed in a region to be bound of the substrate;
  • Step S20 Adjust the horizontal height of the loading platform, receive the laser signal of the first laser receiver, perform the first horizontal alignment, adjust the loading platform to a predetermined horizontal height position, obtain first data, and upload First data to the control module;
  • Step S30 Adjust the horizontal height of the lower blade portion, receive the laser signal of the second laser receiver, perform second horizontal alignment, adjust the lower blade portion to a predetermined horizontal height position, and obtain second data Uploading the second data to the control module;
  • Step S40 The first data is compared with the second data. If the loading platform and the lower knife part are at the same level, then pressing can be performed; if the loading platform and the If the lower blades are at different levels, the system will display an abnormality and adjust again.
  • the first data is a horizontal position of a surface of the bearing platform near one side of the substrate.
  • the second data is a horizontal position of a surface of the lower head near the substrate.
  • a horizontal alignment system for a binding machine which is used for horizontal alignment during a process of binding a substrate to a board to be bound, wherein the substrate includes a The binding area matching the binding board.
  • the horizontal alignment system of the binding machine includes:
  • a pressing module comprising a lower knife portion and a thermal pressing head for pressing the substrate and the plate to be bound;
  • the laser alignment module includes a laser calibration unit and a laser receiving unit, the laser receiving unit is respectively fixed on the bearing module and the surface of the lower knife portion, and the laser receiving unit is configured to receive laser light emitted by the laser calibration unit signal;
  • a control module configured to adjust the positions of the carrier module and the lower knife part according to the laser signal until the carrier platform and the carrier module reach a specified position
  • the board to be bound is an integrated circuit board.
  • the carrier module includes a carrier platform
  • the carrying platform and the laser calibration unit are fixed on a machine platform, the carrying platform is used to carry the substrate, and the laser calibration unit is fixed at a predetermined horizontal height through the machine platform.
  • the lower knife portion and the carrying platform are located on one side of the substrate, and the thermal head is located on the substrate. The other side of the substrate.
  • the carrying platform includes a supporting plate for carrying the substrate
  • the laser receiving unit includes a first laser receiver and a second laser receiver
  • the first laser receiver is located on a side of the support plate near the laser calibration unit, and the second laser receiver is located on a side of the lower knife portion near the laser calibration unit.
  • the laser receiving unit includes a light source receiving template with at least two scales.
  • the substrate includes:
  • a color filter substrate on the array substrate is A color filter substrate on the array substrate
  • a second polarizing plate located on the color filter substrate
  • the first polarizing plate is in contact with the carrier template.
  • the spot of the laser light source in the laser calibration unit is less than 50 microns.
  • the positions of the lower knife portion and the thermal head are matched with the binding region of the substrate.
  • the bearing platform and the lower knife portion are accurately aligned respectively, so as to improve the level height accuracy of the bearing platform and the lower knife portion, thereby preventing the formation of defects on the substrate. Even broken pieces improve the quality of the product.
  • FIG. 1 is a schematic structural diagram of a horizontal alignment system of a binding machine according to an embodiment of the present application
  • FIG. 2 is a schematic flowchart of a horizontal alignment method for a binding machine according to an embodiment of the present application.
  • This application provides a horizontal alignment system and method for a binding machine.
  • the horizontal alignment accuracy between the existing binding platform and the crimping equipment is insufficient, resulting in a high level difference between the binding platform and the crimping equipment. This leads to the problem of defective or even broken pieces formed on the glass substrate.
  • This embodiment can improve the defect.
  • FIG. 1 is a schematic structural diagram of a horizontal alignment system of a binding machine according to an embodiment of the present application
  • Horizontal alignment refers to: setting the load-bearing surface of the load-bearing module and the pressing surface of the lower blade part at the same horizontal height.
  • the substrate includes:
  • the first polarizing plate is in contact with the carrier template.
  • the board to be bound is an integrated circuit board.
  • the substrate includes a binding area matching the board 4 to be bound, and the horizontal alignment system of the binding machine includes:
  • a carrying module is used to carry the substrate.
  • the carrying module includes a carrying platform, and the carrying platform includes a platform 21 and a support plate 22 carrying the substrate.
  • an area of the supporting surface of the supporting plate 22 is larger than an area of the first polarizing plate.
  • a pressing module comprising a lower blade portion 52 and a thermal head 51 for pressing the substrate and the plate to be bound;
  • the lower knife portion 52 and the supporting platform are located on the substrate.
  • the thermal head 51 is located on the other side of the substrate.
  • the positions of the lower knife portion 52 and the thermal head 51 are matched with the binding region of the substrate.
  • the laser alignment module includes a laser calibration unit 32 and a laser receiving unit (including a first receiver 311 and a second receiver 312).
  • the laser receiving units are respectively fixed on the surface of the carrier module and the lower knife portion 52.
  • the laser receiving unit is configured to receive a laser signal from the laser calibration unit 32.
  • the spot of the laser light source in the laser calibration unit 32 is less than 50 microns.
  • the carrying platform and the laser calibration unit 32 are fixed on a machine platform, the carrying platform is used to carry the substrate, and the laser calibration unit is fixed at a predetermined horizontal height through the machine platform.
  • the laser calibration unit 32 is preset to determine the level of the load platform through the first horizontal alignment
  • the height of the lower knife portion 52 is determined by the second horizontal alignment to ensure that the load platform and the lower knife portion are at the same horizontal height.
  • a control module is configured to adjust the positions of the bearing module and the lower knife portion 52 according to the laser signal until the bearing platform and the bearing module reach a specified position.
  • the laser receiving unit includes a first laser receiver 311 and a second laser receiver 312;
  • the first laser receiver 311 is located on a side of the support plate 22 near the laser calibration unit, and the second laser receiver 312 is located on a side of the lower knife portion 52 near the laser calibration unit. In order to ensure that the laser calibration unit 32 can receive the laser signal received by the laser receiving unit 32.
  • the laser receiving unit includes at least two scale light source receiving templates, so as to feedback different alignment accuracy and upload it to the system, thereby reducing the cost of the product.
  • FIG. 2 is a schematic flowchart of a horizontal alignment method for a binding machine according to an embodiment of the present application.
  • the application also provides a method for horizontal alignment of a binding machine, which uses the horizontal alignment system of the binding machine of claim 1 for horizontal alignment, and a method for horizontal alignment of a binding machine.
  • a method for horizontal alignment of a binding machine which uses the horizontal alignment system of the binding machine of claim 1 for horizontal alignment, and a method for horizontal alignment of a binding machine.
  • Step S10 placing the substrate on the carrier platform, providing a board 4 to be bound, and placing the board to be bound on a region to be bound of the substrate;
  • Step S20 Adjust the horizontal height of the loading platform, receive the laser signal of the first laser receiver 311, perform the first horizontal alignment, adjust the loading platform to a predetermined horizontal height position, and obtain first data, Uploading first data to the control module;
  • Step S30 Adjust the horizontal height of the lower blade portion 52, receive the laser signal of the second laser receiver 312, perform the second horizontal alignment, and adjust the lower blade portion 52 to a predetermined horizontal height position to obtain Second data, uploading the second data to the control module;
  • Step S40 The first data is compared with the second data. If the loading platform and the lower knife portion 52 are at the same level, then pressing can be performed. If the lower blade portion 52 is at a different level, the system displays an abnormality and the adjustment is performed again.
  • load-bearing platform and the lower knife portion 52 are at the same horizontal height position means that the upper surface of the load-bearing platform and the upper surface of the lower knife portion 52 are at the same level Horizontal height position.
  • the first data is a horizontal position of a surface of the supporting platform near one side of the substrate.
  • the second data is a horizontal position of a surface of the lower head near the substrate.
  • the working principle of the horizontal alignment method of the binding machine is similar to the working principle of the horizontal alignment system of the binding machine.
  • the working principle of the horizontal alignment method of the binding machine please refer to the binding
  • the working principle of the horizontal alignment system of the fixed machine is not repeated here.
  • This application aims to improve the accuracy of the level of the loading platform and the lower knife portion by respectively accurately positioning the loading platform and the lower knife portion before pressing the substrate and the plate to be bound together, thereby preventing Defects and even broken pieces are formed on the substrate, which improves the quality of the product.

Abstract

一种绑定机台水平对位系统及方法，绑定机台水平对位系统包括承载模块，用于承载基板；压合模块，包括下刀部（52）和热压头（51）；激光对位模块，包括激光校准单元（32）和激光接收单元；控制模块，用于根据激光信号调整承载模块和下刀部（52）的位置。

Description

绑定机台水平对系统及方法 技术领域
本申请涉及显示装置制备技术领域，具体涉及一种绑定机台水平对位系统及方法。
 背景技术
随着显示面板技术的发展，集成电路与玻璃基板的绑定技术在小尺寸面板显示行业非常重要，直接涉及到产品良率及成本。
显示面板行业及其它半导体行业中，在集成电路绑定技术的制程中，玻璃基板绑定机台与压合设备之间的水平对位精度缺乏有效的监控手段，导致在绑定机台进行绑定工艺过程中因绑定平台与压合设备之间存在水平高度差异，进而在玻璃基板上形成不良甚至破片。
因此，为了降低玻璃基板与集成电路之间的绑定不良，本申请提出了一种绑定机台水平对位系统及方法以解决上述问题。
 技术问题
本申请提供了一种绑定机台水平对位系统及方法，以解决现有绑定平台与压合设备之间的水平对位精度不够，致使绑定平台与压合设备之间存在水平高度差异，导致玻璃基板上形成不良甚至破片的问题。
 技术解决方案
根据本申请的一个方面，提供了一种绑定机台水平对位系统，用于在基板与待绑定板绑定过程中进行水平对位，所述基板包括与所述待绑定板相匹配的绑定区域，所述绑定机台水平对位系统包括：
承载模块，用于承载所述基板；
压合模块，包括用于压合所述基板与所述待绑定板的下刀部和热压头；
激光对位模块，包括激光校准单元和激光接收单元，所述激光接收单元分别固定于所述承载模块和所述下刀部表面，所述激光接收单元用于接收所述激光校准单元发出的激光信号；
控制模块，用于根据所述激光信号调整所述承载模块和所述下刀部的位置，直至所述承载平台和所述承载模块达到指定位置。
根据本申请一实施例，所述承载模块包括承载平台；
其中，所述承载平台和所述激光校准单元固定于机台上，所述承载平台用于承载所述基板，所述激光校准单元通过所述机台固定在预定水平高度，以作为所述承载模块和所述下刀部的水平位置参照点。
根据本申请一实施例，在对所述基板和所述待绑定板进行绑定时，所述下刀部和所述承载平台位于所述基板的一侧，所述热压头位于所述基板的另一侧。
根据本申请一实施例，所述承载平台包括承载所述基板的支撑板；
所述激光接收单元包括第一激光接收器和第二激光接收器；
其中，所述第一激光接收器位于所述支撑板靠近所述激光校准单元的一侧，所述第二激光接收器位于所述下刀部靠近所述激光校准单元的一侧。
根据本申请一实施例，所述激光接收单元包括至少两种刻度的光源接收模板。
根据本申请一实施例，所述基板包括：
第一偏光板；
位于所述第一偏光板上的阵列基板；
位于所述阵列基板上的彩膜基板；
位于所述彩膜基板上的第二偏光板；
其中，在对所述基板进行压合时，所述第一偏光板与所述承载模板接触。
根据本申请一实施例，所述激光校准单元中激光光源的光斑小于50微米。
根据本申请一实施例，所述下刀部和热压头的位置与所述基板的绑定区域相匹配。
根据本申请的另一方面，还提供了一种绑定机台水平对位的方法，采用所述权利要求1所述的绑定机台水平对位系统进行水平对位，所述绑定机台水平对位的方法包括：
步骤S10、将所述基板放置在所述承载平台上，提供一待绑定板，将所述待绑定板放置在所述基板的待绑定区域；
步骤S20、调整所述承载平台的水平高度，接收所述第一激光接收器的激光信号，进行第一次水平对位，将所述承载平台调至预定水平高度位置，获得第一数据，上传第一数据至所述控制模块；
步骤S30、调整所述下刀部的水平高度，接收所述第二激光接收器的激光信号，进行第二次水平对位，将所述下刀部调整至预定水平高度位置，获得第二数据，上传所述第二数据至所述控制模块；
步骤S40、将所述第一数据与所述第二数据进行对比，若所述承载平台和所述下刀部处在同一水平高度位置，方可执行压合；若所述承载平台和所述下刀部处在不同水平高度位置，则系统显示异常，再次进行调整。
根据本申请一实施例，所述第一数据为所述承载平台靠近所述基板一侧的表面的水平位置。
根据本申请一实施例，所述第二数据为所述下头部靠近所述基板一侧的表面的水平位置。
根据本申请的又一个方面，还提供了一种绑定机台水平对位系统，用于在基板与待绑定板绑定过程中进行水平对位，其中，所述基板包括与所述待绑定板相匹配的绑定区域，所述绑定机台水平对位系统包括：
承载模块，用于承载所述基板；
压合模块，包括用于压合所述基板与所述待绑定板的下刀部和热压头；
激光对位模块，包括激光校准单元和激光接收单元，所述激光接收单元分别固定于所述承载模块和所述下刀部表面，所述激光接收单元用于接收所述激光校准单元发出的激光信号；
控制模块，用于根据所述激光信号调整所述承载模块和所述下刀部的位置，直至所述承载平台和所述承载模块达到指定位置；
其中，所述待绑定板为集成电路板。
根据本申请一实施例，所述承载模块包括承载平台；
其中，所述承载平台和所述激光校准单元固定于机台上，所述承载平台用于承载所述基板，所述激光校准单元通过所述机台固定在预定水平高度。
根据本申请一实施例，在对所述基板和所述待绑定板进行绑定时，所述下刀部和所述承载平台位于所述基板的一侧，所述热压头位于所述基板的另一侧。
根据本申请一实施例，所述承载平台包括承载所述基板的支撑板；
所述激光接收单元包括第一激光接收器和第二激光接收器；
其中，所述第一激光接收器位于所述支撑板靠近所述激光校准单元的一侧，所述第二激光接收器位于所述下刀部靠近所述激光校准单元的一侧。
根据本申请一实施例，所述激光接收单元包括至少两种刻度的光源接收模板。
根据本申请一实施例，所述基板包括：
第一偏光板；
位于所述第一偏光板上的阵列基板；
位于所述阵列基板上的彩膜基板；
位于所述彩膜基板上的第二偏光板；
其中，在对所述基板进行压合时，所述第一偏光板与所述承载模板接触。
根据本申请一实施例，所述激光校准单元中激光光源的光斑小于50微米。
根据本申请一实施例，所述下刀部和热压头的位置与所述基板的绑定区域相匹配。
 有益效果
本申请通过在基板与待绑定板压合之前，对所述承载平台和下刀部分别进行精准对位，以提高所述承载平台和下刀部的水平高度精度，进而防止基板上形成不良甚至破片，提高了产品的品质。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的一种绑定机台水平对位系统的结构示意图；
图2为本申请实施例提供的一种绑定机台水平对位方法的流程示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本申请可用以实施的特定实施例。本申请所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本申请，而非用以限制本申请。在图中，结构相似的单元是用以相同标号表示。
本申请提供了一种绑定机台水平对位系统及方法，现有绑定平台与压合设备之间的水平对位精度不够，致使绑定平台与压合设备之间存在水平高度差异，导致玻璃基板上形成不良甚至破片的问题，本实施例能够改善该缺陷。
下面接合附图和具体实施例对本申请做进一步的说明：
请参阅图1，图1为本申请实施例提供的一种绑定机台水平对位系统的结构示意图；
本申请提供了一种绑定机台水平对位系统，用于在基板（包括阵列基板11和彩膜基板12）与待绑定板4绑定过程中进行水平对位，具体的，所述水平对位指的是：将承载模块的承载面与下刀部的压合面设置在同一水平高度。
在一种实施例中，所述基板包括：
第一偏光板；
位于所述第一偏光板上的阵列基板11；
位于所述阵列基板11上的彩膜基板12；
位于所述彩膜基板12上的第二偏光板；
其中，在对所述基板进行压合时，所述第一偏光板与所述承载模板接触。
在一种实施例中，所述待绑定板为集成电路板。
所述基板包括与所述待绑定板4相匹配的绑定区域，所述绑定机台水平对位系统包括：
承载模块，用于承载所述基板。
在一种实施例中，所述承载模块包括承载平台，所述承载平台包括平台21和承载所述基板的支撑板22。
在一种实施例中，所述支撑板22的支撑面面积大于所述第一偏光板的面积。
压合模块，包括用于压合所述基板与所述待绑定板的下刀部52和热压头51；
在一种实施例中，在对所述基板和所述待绑定板4进行绑定时，所述下刀部52和所述承载平台（包括平台21和支撑板22）位于所述基板的一侧，所述热压头51位于所述基板的另一侧。
在一种实施例中，所述下刀部52和热压头51的位置与所述基板的绑定区域相匹配。
激光对位模块，包括激光校准单元32和激光接收单元（包括第一接收器311和第二接收器312），所述激光接收单元分别固定在所述承载模块和所述下刀部52表面，所述激光接收单元用于接收所述激光校准单元32发出的激光信号。
在一种实施例中，所述激光校准单元32中的激光光源的光斑小于50微米。
在一种实施例中，所述承载平台和所述激光校准单元32固定于机台上，所述承载平台用于承载所述基板，所述激光校准单元通过所述机台固定在预定水平高度，以作为所述承载模块和所述下刀部52的水平位置参照点；在本申请中，通过预定设定所述激光校准单元32，进而分别通过第一次水平对位确定承载平台的水平高度，再通过第二次水平对位确定下刀部52的水平高度，以确保所述承载平台和所述下刀部位于同一水平高度。
控制模块，用于根据所述激光信号调整所述承载模块和所述下刀部52的位置，直至所述承载平台和所述承载模块达到指定位置。
在一种实施例中，所述激光接收单元包括第一激光接收器311和第二激光接收器312；
其中，所述第一激光接收器311位于所述支撑板22靠近所述激光校准单元的一侧，所述第二激光接收器312位于所述下刀部52靠近所述激光校准单元的一侧，以保证所述激光校准单元32能接收到所述激光接收单元32接收到所述激光信号。
在一种实施例中，所述激光接收单元包括至少两种刻度的光源接收模板，以便于反馈不同的对位精度，并上传至系统，进而降低了产品的成本。
请参阅图2，图2为本申请实施例提供的一种绑定机台水平对位方法的流程示意图。
本申请还提供了一种绑定机台水平对位的方法，采用所述权利要求1所述的绑定机台水平对位系统进行水平对位，所述绑定机台水平对位的方法包括：
步骤S10、将所述基板放置在所述承载平台上，提供一待绑定板4，将所述待绑定板放置在所述基板的待绑定区域；
步骤S20、调整所述承载平台的水平高度，接收所述第一激光接收器311的激光信号，进行第一次水平对位，将所述承载平台调至预定水平高度位置，获得第一数据，上传第一数据至所述控制模块；
步骤S30、调整所述下刀部52的水平高度，接收所述第二激光接收器312的激光信号，进行第二次水平对位，将所述下刀部52调整至预定水平高度位置，获得第二数据，上传所述第二数据至所述控制模块；
步骤S40、将所述第一数据与所述第二数据进行对比，若所述承载平台和所述下刀部52处在同一水平高度位置，方可执行压合；若所述承载平台和所述下刀部52处在不同水平高度位置，则系统显示异常，再次进行调整。
在一种实施例中，这里说的所述承载平台和所述下刀部52处在同一水平高度位置指的是：所述承载平台上表面和所述下刀部52的上表面处在同一水平高度位置。
在一种实施例中，所述第一数据为所述承载平台靠近所述基板一侧的表面的水平位置。
所述第二数据为所述下头部靠近所述基板一侧的表面的水平位置。
所述绑定机台水平对位的方法的工作原理与所述绑定机台水平对位系统的工作原理相似，所述绑定机台水平对位的方法的工作原理具体请参考所述绑定机台水平对位系统的工作原理，这里不再赘述。
有益效果：本申请通过在对基板与待绑定板压合之前，对所述承载平台和下刀部分别进行精准对位，以提高所述承载平台和下刀部的水平高度精度，进而防止基板上形成不良甚至破片，提高了产品的品质。
综上所述，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (19)

  1. 一种绑定机台水平对位系统，用于在基板与待绑定板绑定过程中进行水平对位，其中，所述基板包括与所述待绑定板相匹配的绑定区域，所述绑定机台水平对位系统包括：
    承载模块，用于承载所述基板；
    压合模块，包括用于压合所述基板与所述待绑定板的下刀部和热压头；
    激光对位模块，包括激光校准单元和激光接收单元，所述激光接收单元分别固定于所述承载模块和所述下刀部表面，所述激光接收单元用于接收所述激光校准单元发出的激光信号；
    控制模块，用于根据所述激光信号调整所述承载模块和所述下刀部的位置，直至所述承载平台和所述承载模块达到指定位置。
  2. 根据权利要求1所述的绑定机台水平对位系统，其中，所述承载模块包括承载平台；
    其中，所述承载平台和所述激光校准单元固定于机台上，所述承载平台用于承载所述基板，所述激光校准单元通过所述机台固定在预定水平高度。
  3. 根据权利要求2所述的绑定机台水平对位系统，其中，在对所述基板和所述待绑定板进行绑定时，所述下刀部和所述承载平台位于所述基板的一侧，所述热压头位于所述基板的另一侧。
  4. 根据权利要求3所述的绑定机台水平对位系统，其中，所述承载平台包括承载所述基板的支撑板；
    所述激光接收单元包括第一激光接收器和第二激光接收器；
    其中，所述第一激光接收器位于所述支撑板靠近所述激光校准单元的一侧，所述第二激光接收器位于所述下刀部靠近所述激光校准单元的一侧。
  5. 根据权利要求4所述的绑定机台水平对位系统，其中，所述激光接收单元包括至少两种刻度的光源接收模板。
  6. 根据权利要求1所述的绑定机台水平对位系统，其中，所述基板包括：
    第一偏光板；
    位于所述第一偏光板上的阵列基板；
    位于所述阵列基板上的彩膜基板；
    位于所述彩膜基板上的第二偏光板；
    其中，在对所述基板进行压合时，所述第一偏光板与所述承载模板接触。
  7. 根据权利要求1所述的绑定机台水平对位系统，其中，所述激光校准单元中激光光源的光斑小于50微米。
  8. 根据权利要求1所述的绑定机台水平对位系统，其中，所述下刀部和热压头的位置与所述基板的绑定区域相匹配。
  9. 一种绑定机台水平对位的方法，其采用所述权利要求1所述的绑定机台水平对位系统进行水平对位，所述绑定机台水平对位的方法包括：
    步骤S10、将所述基板放置在所述承载平台上，提供一待绑定板，将所述待绑定板放置在所述基板的待绑定区域；
    步骤S20、调整所述承载平台的水平高度，接收所述第一激光接收器的激光信号，进行第一次水平对位，将所述承载平台调至预定水平高度位置，获得第一数据，上传第一数据至所述控制模块；
    步骤S30、调整所述下刀部的水平高度，接收所述第二激光接收器的激光信号，进行第二次水平对位，将所述下刀部调整至预定水平高度位置，获得第二数据，上传所述第二数据至所述控制模块；
    步骤S40、将所述第一数据与所述第二数据进行对比，若所述承载平台和所述下刀部处在同一水平高度位置，方可执行压合；若所述承载平台和所述下刀部处在不同水平高度位置，则系统显示异常，再次进行调整。
  10. 根据权利要求9所述的绑定机台水平对位的方法，其中，所述第一数据为所述承载平台靠近所述基板一侧的表面的水平位置。
  11. 根据权利要求9所述的绑定机台水平对位的方法，其中，所述第二数据为所述下头部靠近所述基板一侧的表面的水平位置。
  12. 一种绑定机台水平对位系统，用于在基板与待绑定板绑定过程中进行水平对位，其中，所述基板包括与所述待绑定板相匹配的绑定区域，所述绑定机台水平对位系统包括：
    承载模块，用于承载所述基板；
    压合模块，包括用于压合所述基板与所述待绑定板的下刀部和热压头；
    激光对位模块，包括激光校准单元和激光接收单元，所述激光接收单元分别固定于所述承载模块和所述下刀部表面，所述激光接收单元用于接收所述激光校准单元发出的激光信号；
    控制模块，用于根据所述激光信号调整所述承载模块和所述下刀部的位置，直至所述承载平台和所述承载模块达到指定位置；
    其中，所述待绑定板为集成电路板。
  13. 根据权利要求12所述的绑定机台水平对位系统，其中，所述承载模块包括承载平台；
    其中，所述承载平台和所述激光校准单元固定于机台上，所述承载平台用于承载所述基板，所述激光校准单元通过所述机台固定在预定水平高度。
  14. 根据权利要求13所述的绑定机台水平对位系统，其中，在对所述基板和所述待绑定板进行绑定时，所述下刀部和所述承载平台位于所述基板的一侧，所述热压头位于所述基板的另一侧。
  15. 根据权利要求14所述的绑定机台水平对位系统，其中，所述承载平台包括承载所述基板的支撑板；
    所述激光接收单元包括第一激光接收器和第二激光接收器；
    其中，所述第一激光接收器位于所述支撑板靠近所述激光校准单元的一侧，所述第二激光接收器位于所述下刀部靠近所述激光校准单元的一侧。
  16. 根据权利要求15所述的绑定机台水平对位系统，其中，所述激光接收单元包括至少两种刻度的光源接收模板。
  17. 根据权利要求12所述的绑定机台水平对位系统，其中，所述基板包括：
    第一偏光板；
    位于所述第一偏光板上的阵列基板；
    位于所述阵列基板上的彩膜基板；
    位于所述彩膜基板上的第二偏光板；
    其中，在对所述基板进行压合时，所述第一偏光板与所述承载模板接触。
  18. 根据权利要求12所述的绑定机台水平对位系统，其中，所述激光校准单元中激光光源的光斑小于50微米。
  19. 根据权利要求12所述的绑定机台水平对位系统，其中，所述下刀部和热压头的位置与所述基板的绑定区域相匹配。
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CN106707573A (zh) * 2017-02-17 2017-05-24 福州京东方光电科技有限公司 绑定装置、显示面板、绑定系统及其操作方法
CN109064886A (zh) * 2018-08-29 2018-12-21 武汉华星光电技术有限公司 一种绑定机台水平对位系统及方法
CN109405743A (zh) * 2018-11-29 2019-03-01 武汉华星光电技术有限公司 显示模组的定位方法及定位装置、控制器及存储介质

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