WO2020021657A1 - 表面実装機 - Google Patents

表面実装機 Download PDF

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Publication number
WO2020021657A1
WO2020021657A1 PCT/JP2018/027903 JP2018027903W WO2020021657A1 WO 2020021657 A1 WO2020021657 A1 WO 2020021657A1 JP 2018027903 W JP2018027903 W JP 2018027903W WO 2020021657 A1 WO2020021657 A1 WO 2020021657A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
component
correction
mark
imaging camera
Prior art date
Application number
PCT/JP2018/027903
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
洋平 岸本
Original Assignee
ヤマハ発動機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ヤマハ発動機株式会社 filed Critical ヤマハ発動機株式会社
Priority to JP2020531894A priority Critical patent/JP6990309B2/ja
Priority to PCT/JP2018/027903 priority patent/WO2020021657A1/ja
Priority to CN201880095504.2A priority patent/CN112514553B/zh
Priority to KR1020207034372A priority patent/KR102432607B1/ko
Publication of WO2020021657A1 publication Critical patent/WO2020021657A1/ja

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing

Definitions

  • the correction mark in a state where the light transmitting members are not overlapped is imaged by the board imaging camera, the position of the correction mark is detected as the first position, and the light transmitting member is
  • the overlapping correction mark is imaged by the substrate imaging camera and the position of the correction mark is detected as the second position, a difference occurs between the first position and the second position according to the inclination of the optical axis. Since the displacement of the component is proportional to the inclination of the optical axis of the board imaging camera, the displacement of the component is corrected based on the difference between the first position and the second position, whereby the inclination of the optical axis of the board imaging camera is corrected. Can be corrected.
  • the component displacement is corrected based on the difference between the first position and the second position. Can be corrected.
  • the correction unit may be attached to the surface mounter.
  • the correction unit is loaded into the surface mounter by the substrate transfer device that transfers the substrate, and the first position and the second position are detected using the loaded correction unit.
  • the production of the substrate must be stopped, and the productivity is reduced.
  • the correction unit since the correction unit is attached to the surface mounter, the first position and the second position can be detected without stopping the production of the substrate during the production of the substrate by the surface mounter. it can. As a result, it is possible to correct the positional deviation of the parts while suppressing a decrease in productivity.
  • the invention disclosed in this specification can be realized in various forms such as an apparatus, a method, a computer program for realizing the functions of the apparatus or the method, and a recording medium on which the computer program is recorded.
  • Embodiment 1 will be described with reference to FIGS.
  • the left-right direction shown in FIG. 1 is referred to as an X direction
  • the front-rear direction is referred to as a Y direction
  • the right side shown in FIG. 1 is referred to as an upstream side
  • the left side is referred to as a downstream side.
  • the same constituent members may be omitted from the drawings except for some parts.
  • the head unit 16 will be described with reference to FIG.
  • the head unit 16 according to the first embodiment is a so-called in-line type, and a plurality of mounting heads 25 are provided side by side in the X direction. Further, the head unit 16 is provided with a Z-axis servomotor 26 for individually moving the mounting heads 25 up and down, an R-axis servomotor 27 for rotating the mounting heads 25 around their axes, and the like.
  • the motor control unit 41 rotates each motor such as the X-axis servomotor 23, the Y-axis servomotor 24, the Z-axis servomotor 26, the R-axis servomotor 27, and the conveyor drive motor 46 under the control of the arithmetic processing unit 40.
  • the storage unit 42 stores various data. Various types of data include information on the type and the number of boards P to be produced, information on the mounting coordinates 63 of the component E (see FIG. 14), information on the mounting angle of the component E, information on the mounting order of the component E, The XY coordinates of the recognition mark F attached to P, relative position information of the mounting head 25 with respect to the board imaging camera 19, and the like are included. The XY coordinates of the recognition mark F and the relative position information of the mounting head 25 with respect to the board imaging camera 19 will be described later.
  • the control unit 38 captures an image of each reference mark Fa by the board imaging camera 19, and the XY coordinates (Xf1 ′, Yf1 ′) and (Xf2) of the center point of each reference mark Fa in the XY coordinate system whose origin is the board origin S2. ', Yf2').
  • the control unit 38 determines the XY coordinates (Xf1, Yf1) of the reference mark Fa1 stored in the storage unit 42 and the reference mark recognized by the board imaging camera 19.
  • the difference ( ⁇ X, ⁇ Y) between the XY coordinates (Xf1 ′, Xy1 ′) of Fa1 is defined as the position error of the substrate P.
  • the control unit 38 temporarily corrects the mounting coordinates of each component according to the position error ( ⁇ X, ⁇ Y).
  • the relative position information is the XY coordinates of each mounting head 25 with the origin of the board imaging camera 19.
  • the control unit 38 images the recognition mark F with the board imaging camera 19 to recognize the position of the board imaging camera 19 with respect to the board P, and determines the position of each mounting head 25 with respect to the board P from the relative position of each mounting head 25 with respect to the board P camera. Judge the position.
  • the control unit 38 recognizes that the position of the reference mark Fa1 is the position P2 because the center point of the reference mark Fa1 matches the center point of the image. I do. However, since the actual position of the reference mark Fa1 is the position P1, a deviation occurs between the position of the reference mark Fa1 recognized by the control unit 38 and the actual position of the reference mark Fa1.
  • DdX_c shown in FIG. 12 indicates the amount of the positional deviation. Although described in detail later, when the position P2 of the reference mark Fa1 recognized by the control unit 38 is shifted to the right from the position P1 of the actual reference mark Fa1, dX_c is a negative value.
  • the mounting coordinates are corrected by subtracting the positional deviation amount dX_c from the mounting coordinates before correction.
  • the positional deviation amount dX_c is added to the mounting coordinate of the component E. May be added to correct the mounting coordinates.
  • the positive / negative definition of the displacement amount dX_c will be described later. The same applies to the displacement amount dY_c.
  • the position of the board imaging camera 19 shown in FIG. 15 is set when the correction mark 35 is imaged by the board imaging camera 19 to generate image data in a state where the glass jig 36 does not overlap the correction mark 35. Is a position adjusted so that the center point of the correction mark 35 on the image represented by the symbol coincides with the center point of the image. This adjustment is performed by the processing of S101 to S105 described later.
  • the dotted line 19A_1 indicates the optical axis 19A of the board imaging camera 19 at that time.
  • the positional displacement of the component E is determined based on the difference between the first position M1 and the second position M2. Since the correction is performed, the positional deviation of the component E can be corrected.
  • the difference (dX_g, dY_g) between the first position M1 and the second position M2 can be converted into the displacement amount (dX_c, dY_c) by using the data representing the graph shown in FIG.
  • the glass jig 36 is moved to a position overlapping the correction mark 35 while the position of the substrate imaging camera 19 is fixed.
  • the case where the difference is detected between the first position M ⁇ b> 1 and the second position M ⁇ b> 2 by moving the glass jig 36 and capturing the correction mark 35 in the state where the glass jig 36 overlaps has been described as an example.
  • the substrate imaging camera 19 images the correction mark 35 while the glass jig 36 overlaps the correction mark 35.
  • dX_g Difference between first position and second position (X direction)
  • dY_g Difference between first position and second position (Y direction)
  • dX_c Displacement amount (X direction)
  • dY_c Displacement amount (Y direction)
  • P ... substrate

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
PCT/JP2018/027903 2018-07-25 2018-07-25 表面実装機 WO2020021657A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020531894A JP6990309B2 (ja) 2018-07-25 2018-07-25 表面実装機
PCT/JP2018/027903 WO2020021657A1 (ja) 2018-07-25 2018-07-25 表面実装機
CN201880095504.2A CN112514553B (zh) 2018-07-25 2018-07-25 表面安装机
KR1020207034372A KR102432607B1 (ko) 2018-07-25 2018-07-25 표면 실장기

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/027903 WO2020021657A1 (ja) 2018-07-25 2018-07-25 表面実装機

Publications (1)

Publication Number Publication Date
WO2020021657A1 true WO2020021657A1 (ja) 2020-01-30

Family

ID=69180419

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/027903 WO2020021657A1 (ja) 2018-07-25 2018-07-25 表面実装機

Country Status (4)

Country Link
JP (1) JP6990309B2 (zh)
KR (1) KR102432607B1 (zh)
CN (1) CN112514553B (zh)
WO (1) WO2020021657A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022029879A1 (ja) * 2020-08-04 2022-02-10 株式会社Fuji テープフィーダ検査装置及びテープフィーダ検査装置における補正方法

Citations (5)

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JP2008070135A (ja) * 2006-09-12 2008-03-27 Juki Corp 撮像装置の光軸ずれ検出方法、及び部品位置検出方法と装置
JP2012146907A (ja) * 2011-01-14 2012-08-02 Panasonic Corp 電子部品実装方法
JP2014041910A (ja) * 2012-08-22 2014-03-06 Sony Corp 部品実装装置、位置補正方法、基板の製造方法及び情報処理装置
WO2014147701A1 (ja) * 2013-03-18 2014-09-25 富士機械製造株式会社 部品実装装置および部品実装装置における校正方法
JP2017045913A (ja) * 2015-08-28 2017-03-02 パナソニックＩｐマネジメント株式会社 部品実装装置および部品実装方法

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JP2876962B2 (ja) * 1993-01-07 1999-03-31 松下電器産業株式会社 基板外観検査装置
US5854745A (en) * 1994-03-30 1998-12-29 Matsushita Electric Industrial Co., Ltd. Method and apparatus for mounting electronic component
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JP2006059954A (ja) 2004-08-19 2006-03-02 Yamagata Casio Co Ltd 部品搭載装置及び部品搭載方法
JP4541095B2 (ja) * 2004-10-15 2010-09-08 富士機械製造株式会社 位置関連データ変換装置および対部品装着基板作業システム
JP4901451B2 (ja) * 2006-12-19 2012-03-21 Ｊｕｋｉ株式会社 部品実装装置
JP5169981B2 (ja) * 2009-04-27 2013-03-27 ソニー株式会社 光ピックアップ、光ディスク装置、光ピックアップ製造方法及び光ピックアップ制御方法
US9628676B2 (en) * 2012-06-07 2017-04-18 Complete Genomics, Inc. Imaging systems with movable scan mirrors
US20140111644A1 (en) * 2012-10-24 2014-04-24 GM Global Technology Operations LLC Vehicle assembly with display and corrective lens
JP6307278B2 (ja) * 2014-01-09 2018-04-04 ヤマハ発動機株式会社 表面実装機および位置ズレ検出方法
JP6708920B2 (ja) * 2015-11-16 2020-06-10 ミツミ電機株式会社 レンズ駆動装置、カメラモジュール及びカメラ搭載装置
JP2017217682A (ja) * 2016-06-10 2017-12-14 パナソニックＩｐマネジメント株式会社 レーザ加工装置およびレーザ加工方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008070135A (ja) * 2006-09-12 2008-03-27 Juki Corp 撮像装置の光軸ずれ検出方法、及び部品位置検出方法と装置
JP2012146907A (ja) * 2011-01-14 2012-08-02 Panasonic Corp 電子部品実装方法
JP2014041910A (ja) * 2012-08-22 2014-03-06 Sony Corp 部品実装装置、位置補正方法、基板の製造方法及び情報処理装置
WO2014147701A1 (ja) * 2013-03-18 2014-09-25 富士機械製造株式会社 部品実装装置および部品実装装置における校正方法
JP2017045913A (ja) * 2015-08-28 2017-03-02 パナソニックＩｐマネジメント株式会社 部品実装装置および部品実装方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022029879A1 (ja) * 2020-08-04 2022-02-10 株式会社Fuji テープフィーダ検査装置及びテープフィーダ検査装置における補正方法
JP7428807B2 (ja) 2020-08-04 2024-02-06 株式会社Fuji テープフィーダ検査装置及びテープフィーダ検査装置における補正方法

Also Published As

Publication number Publication date
CN112514553A (zh) 2021-03-16
JPWO2020021657A1 (ja) 2021-06-03
KR20210003241A (ko) 2021-01-11
JP6990309B2 (ja) 2022-01-12
CN112514553B (zh) 2022-04-12
KR102432607B1 (ko) 2022-08-16

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