WO2019198869A1 - Appareil et procédé d'inspection de zone de bord d'une tranche - Google Patents

Appareil et procédé d'inspection de zone de bord d'une tranche Download PDF

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Publication number
WO2019198869A1
WO2019198869A1 PCT/KR2018/005663 KR2018005663W WO2019198869A1 WO 2019198869 A1 WO2019198869 A1 WO 2019198869A1 KR 2018005663 W KR2018005663 W KR 2018005663W WO 2019198869 A1 WO2019198869 A1 WO 2019198869A1
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WO
WIPO (PCT)
Prior art keywords
wafer
vacuum chuck
unit
inspection
edge
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PCT/KR2018/005663
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English (en)
Korean (ko)
Inventor
황병문
Original Assignee
(주)넥서스원
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Publication date
Application filed by (주)넥서스원 filed Critical (주)넥서스원
Priority to CN201880092352.0A priority Critical patent/CN111971782A/zh
Publication of WO2019198869A1 publication Critical patent/WO2019198869A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Definitions

  • the present invention is a wafer edge area inspection apparatus capable of inspecting the notch alignment of the wafer and the edge area including the bevel and apex of the wafer without damaging the front or back side of the wafer. And an inspection method.
  • semiconductor devices are manufactured by selectively or sequentially performing various processes such as diffusion, etching, exposure, and ion implantation processes on a wafer.
  • the manufacturing process of the semiconductor device may be a process of implementing a semiconductor integrated circuit designed by patterning a material layer constituting each layer while depositing a conductive layer and an insulating layer on the entire surface of the semiconductor wafer in multiple layers.
  • a semiconductor integrated circuit is typically configured in units of semiconductor chips, and a plurality of semiconductor chips are completed through the same process in the same step throughout the wafer. Therefore, after the uppermost material layer of each semiconductor chip is formed, the semiconductor wafer is diced on a chip basis, and the edge (wafer edge) portion of the wafer is discarded as an unnecessary portion.
  • a wafer edge becomes a shape which inclines (chamfers) and cuts out gradually from the surface of a wafer.
  • the chamfered portion of the wafer edge is called the bevel and the vertical portion is called the apex.
  • the wafer edge has a shape as shown in FIG. 1A as a bullet type, and a shape as shown in FIG. 1B as a round shape.
  • Defects in the edge region may be formed around the wafer boundary, for example during spin coating of the wafer with photoresist material, and excess fabric
  • Tores may diffuse down over the edge of the wafer. Such excess edge photoresist may peel off and diffuse into the device region of the wafer or to the chuck or other surface of the lithographic tool. Etch chemistry or deposited material may also remain at the wafer edge and diffuse into the device region. Any number of such edge defects may cause yield loss. When a plurality of wafers are bonded together, the bonding between the wafers may have a defect.
  • an inspection apparatus may be used to inspect whether or not end defects such as cracks, defects or damages occur in the wafer edge region, and whether fine foreign matter adheres to the wafer edge region.
  • the inspection method which detects the scattered light from there by a photodetector is typical.
  • the inspection apparatus of the wafer edge which installs the guide rail in arc shape centering on the wafer edge imaged by a camera, and moves an imaging camera along the guide rail extended in this arc shape to image a wafer edge is disclosed.
  • a conveying member having a Bernoulli chuck or the like sucks the wafer from the upper side in a non-contact manner, maintains flatness, and conveys it to a wafer holder.
  • Korean Patent Publication No. 10-1440622 (registered on September 4, 2014) is a conveying system for conveying a plate-shaped object to an object arranging member provided with an object arranging unit, and having an opposing part facing the object, between the opposing part and the object.
  • a suction member for forming a gas flow in the air to generate a suction force on the object, a measuring device for obtaining information about the shape of the object being sucked by the suction member, and a vertical direction of the suction member approaching or spaced apart from the object arranging unit
  • a conveying system comprising a drive device for relatively moving in the direction and a control device for controlling at least one of the suction member and the drive device such that an object is disposed in the object placement unit in a predetermined shape by using the information obtained by the measurement device.
  • the Republic of Korea Patent Publication No. 10-1440622 (registered on September 04, 2014) is provided with a base on which a light meter and a light receiver are fixed, irradiate light to the wafer peripheral end by a light meter, and a wafer peripheral end by a light receiver.
  • the light is emitted by a light meter with a bevel of the wafer peripheral end.
  • a foreign material inspection method at the peripheral edge of a wafer that inspects at least one of foreign matter and defects attached to the bevel from the intensity of scattered light received from the light.
  • Korean Patent Laid-Open No. 10-2007-0000924 sets a width of a wafer edge region in which a material layer should be stripped, and the wafer on which the material layer on the edge region is stripped is placed on the upper surface of the rotary chuck.
  • a step of seating rotating the rotary chuck by the rotation angle, acquiring an image of the edge region of the wafer by the rotation angle of the rotation chuck, and measuring the width of the edge region where the material layer is stripped from the image of the acquired edge region. Comparing the width of the set edge area with the width of the measured edge area, and controlling an additional stripping process for the material layer of the edge area if the width of the measured edge area is less than the width of the set edge area.
  • a wafer edge inspection method is disclosed.
  • the wafer is mounted on the wafer mounting table, the wafer mounting table is rotated at a predetermined speed by a rotation mechanism provided on the support with the wafer, the rotation, Since the laser beam is irradiated by the light meter while rotating the wafer by the mechanism, there is a problem that damage may occur on the back surface of the wafer loaded on the mounting table during inspection of the edge region of the wafer.
  • the Republic of Korea Patent Publication No. 10-1440622 has a problem that the inspection device is enlarged because the base provided with the light transmitter and the light receiver is rotated by a rotating arm.
  • An object of the present invention is to solve the problems described above.
  • an edge region inspection apparatus of a wafer is an apparatus for inspecting an edge region of a wafer for inspecting defects such as cracks, defects or damage in the edge region of the wafer and aligning the notches
  • a wafer loading and unloading unit for loading and unloading a wafer onto a support
  • a vacuum suction unit including a vacuum chuck for vacuum-adsorbing a wafer located on the support by a non-contact state by the wafer loading and unloading unit, the wafer Rotating part for rotating the vacuum chuck that vacuum-adsorbed the wafer to continuously inspect the edge area of the wafer, for edge inspection for inspecting the edge area and the notch position of the wafer which is provided on the same plane as the wafer and rotated by the rotating part
  • a control unit for controlling a position of the line scan unit and the vacuum chuck.
  • the edge inspection line scan portion inspects an edge region portion of the entire circumference of the wafer according to the rotation of the wafer while the wafer is not in contact with the vacuum chuck, and the notched position. It is characterized by grasping.
  • the edge inspection line scan portion includes an insertion portion for inserting an edge region portion of the wafer and performing an optical function of light emission and light reception for inspecting the edge region.
  • the inspection of the edge region portion of the wafer and the alignment of the notch positions are performed in the state where the wafer is inserted with the insertion portion of the line scan portion for edge inspection.
  • the wafer mounting position inspection unit further comprises a wafer mounting position inspection unit having a camera for recognizing the mounting position of the wafer, wherein the wafer loading position inspection unit is formed by the wafer loading and unloading unit. Photographing the position state of the wafer seated on the support, outputting position information on the seating position of the photographed wafer, and the controller controls the position of the vacuum chuck according to the position information to concentric position of the wafer and the vacuum chuck. It characterized in that for controlling the movement of the vacuum chuck to match.
  • the controller performs inspection of the edge region portion of the wafer and alignment of the notch positions corresponding to respective sizes of the plurality of wafers.
  • the air supply unit for discharging and suctioning the air to suck the vacuum to the vacuum chuck
  • the X-axis drive unit for moving the vacuum chuck in the X direction
  • the vacuum A Y-axis driving unit for moving the chuck in the Y direction
  • a Z-axis driving unit for moving the vacuum chuck in the Z direction
  • the control unit is configured according to an inspection result in the wafer mounting position inspection unit and the edge inspection line scanning unit. And controlling the air supply unit, the X axis driver, the Y axis driver, the Z axis driver, and the rotating part.
  • an edge area inspection method of a wafer includes (a) loading a wafer to be inspected on a support, (b) loading the wafer on a support by the step (a). Raising the vacuum chuck in a state to vacuum suction the wafer in a non-contact state, (c) rotating the vacuum chuck in which the wafer is vacuum sucked in the step (b) to confirm that the wafer is loaded at a predetermined position Performing a concentric check of the wafer and the vacuum chuck by the camera of the position inspection unit, and (d) the vacuum chuck to match the position of the wafer recognized by the position inspection unit in step (c) with the normal position stored in the memory.
  • step (e) in step (d) the concentricity of the vacuum chuck and the concentricity of the wafer Moving the vacuum chuck in which the wafer is vacuum-adsorbed in a non-contact state to the insertion portion of the edge inspection line scan portion in order to inspect the edge region of the wafer, (f) the insertion portion of the edge inspection line scan portion, which is the inspection position of the wafer Rotating the vacuum chuck in the state in which the vacuum-adsorbed wafer in the non-contact state is inserted, to determine the edge inspection and the notch position in the edge region of the entire circumference of the wafer.
  • the vacuum adsorption is performed in a cyclone type or a Bernoulli type.
  • the vacuum chuck in which the wafer is vacuum-adsorbed in a non-contact state is further include the steps of withdrawing from the insert and placing and unloading a wafer on a support, wherein steps (a) to (g) are performed sequentially for each of the plurality of wafers.
  • the edge region inspection apparatus and inspection method of the wafer according to the present invention since the vacuum chuck for vacuum suction of the wafer in a non-contact state is inspected by the rotating portion, the edge region and notch position of the wafer are inspected.
  • the effect is that the inspection of the edge area and the notch position can be carried out without damaging the front or back side.
  • the effect that a high speed inspection can be performed automatically is carried out by vacuum-absorbing a wafer in a non-contact state automatically.
  • the edge area and notch position of a wafer are automatically performed uniformly, and the effect which can contribute to productivity improvement, ensuring excellent product quality control is also acquired.
  • 1 is a view for explaining the shape of the wafer edge applied to the present invention.
  • Figure 2 is a perspective view of the edge region inspection device of the wafer according to the present invention.
  • Figure 3 is an exploded perspective view of the main part of the edge region inspection apparatus of the wafer according to the present invention.
  • FIG. 4 is a block diagram of an apparatus for inspecting an edge region of a wafer according to the present invention.
  • 5 to 16 are perspective views of the operation state of the edge region inspection apparatus for explaining the edge region inspection process of the wafer according to the present invention.
  • vacuum adsorption means that the semiconductor wafer is left floating on the vacuum chuck without physical contact with the vacuum chuck.
  • Cyclone type or Bernoulli type may be applied to the vacuum adsorption.
  • the air introduced from the supply port is ejected from the nozzle on the side of the recessed side of the suction surface, and becomes a swirl flow, and the swirl flow is discharged to the atmosphere from the gap between the non-contact vacuum chuck and the semiconductor wafer, and thus the swirl flow is caused by the cyclone effect.
  • a vacuum area is generated inside, lift (raising and moving) of the semiconductor wafer in non-contact becomes possible, and a stronger lift force can be generated by the action of the centrifugal force of the turning flow.
  • air introduced from the supply port is ejected radially from the nozzle on the side of the convex side of the suction surface, and the radiation flow is released into the atmosphere from the gap between the non-contact vacuum chuck and the semiconductor wafer, and the air between the non-contact vacuum chuck and the semiconductor wafer is Tension in the circumferential direction to generate a vacuum region at the center, and to lift the semiconductor wafer in a non-contact manner, and to discharge the air radially, to suppress the pulsation and the fluctuations caused by the turning flow, and to suppress the workpiece amplitude.
  • wafers are substrates that are generally formed of semiconductor or non-semiconductor materials, non-limiting examples of semiconductor materials include single crystal silicon, gallium arsenide, and indium phosphide, which substrates can typically be processed in semiconductor fabrication equipment and The substrate may be made of glass, sapphire or other insulator material.
  • Notch means a cutout portion whose direction is specified to indicate the direction of a crystal in the semiconductor wafer, and an "edge area” means a bevel portion and a circumferential edge portion of the semiconductor wafer, as shown in FIG. It means the area including the apex part.
  • FIG. 2 is a perspective view of the edge region inspection apparatus of the wafer according to the present invention
  • Figure 3 is an exploded perspective view of the main part of the edge region inspection apparatus of the wafer according to the present invention
  • Figure 4 is an edge region inspection apparatus of the wafer according to the present invention Is a block diagram of.
  • the edge area inspection apparatus of the wafer according to the present invention as shown in Figures 2 to 4, the edge of the wafer for inspecting defects such as cracks, defects or damage in the edge region of the semiconductor wafer (W) and to align the notches
  • An apparatus for inspecting an area comprising: a wafer loading and unloading unit 200 for loading and unloading a wafer to be examined onto a support 150, and on the support 150 by the wafer loading and unloading unit 200.
  • a vacuum suction unit (100) having a vacuum chuck (101) for vacuum suction of a wafer located in a non-contact state, and a rotating unit for rotating the vacuum chuck (150) for vacuum suction of the wafer to continuously inspect the edge region of the wafer.
  • a wafer mounting position inspecting unit 300 having a camera for recognizing a mounting position of the wafer, a wafer provided on the same plane as the wafer and rotating by the rotating unit 140
  • Edge line scanning unit 400 for the inspection to check the spread of the edge region and the notch position
  • a control unit 500 for controlling the position of the vacuum chuck (101).
  • the wafer edge area inspection apparatus as shown in FIG. 2 is provided in an enclosure made of a clean room, for example, a temperature of 15 ° C. to 30 ° C., a humidity of 40 to 70% (without dewing), and a cleanness of class 1000 Hereinafter, it is prepared to meet the use environment of vibration 1 ⁇ 50Hz 1 X 10 -2 m / s 2 .
  • the vacuum adsorption unit 100 may be exposed at the upper portion of the enclosure to vacuum-sorp the semiconductor wafer with respect to the vacuum chuck 101 and the vacuum chuck 101 for vacuum-sorption of the semiconductor wafer.
  • Air supply 102 to exhaust and suck air so as to
  • the vacuum chuck 101 is provided with a plurality of openings communicating with the air supply unit 102 as shown in FIGS. 2 and 3, and the air introduced from the air supply unit 102 is located at the side of the recessed side of the suction surface. It is ejected from the nozzle and becomes a turning flow, and the air between the cyclone type or the vacuum chuck 101 and the semiconductor wafer, which is released into the atmosphere from the gap between the vacuum chuck 101 and the semiconductor wafer, is tensioned in the circumferential direction to the center. Bernoulli type with vacuum area can be applied.
  • the air supply unit 102 has a pipe passing through the central portion of the rotating unit 140, the lower end of the pipe is guided to the outside of the edge area inspection device of the wafer is branched into two, one branch pipe is a valve It is connected to the air supply member which performs pressure adjustment and air supply via the other branch pipe, and the other branch pipe
  • tube is connected to the suction member comprised of a pressure adjustment and a suction pump via a valve. That is, the air supply unit 102 applied to the present invention is provided to perform supply and suction of air for the operation of the vacuum chuck 101.
  • the vacuum suction state can be released by controlling the valve provided in the branch pipe.
  • the X-axis driving unit 110 for moving the vacuum chuck 101 in the X direction to the base provided in the lower portion of the enclosure including the clean room, and the vacuum chuck 101 in the Y direction.
  • Y-axis drive unit 120 for moving to the Z-axis driving unit 130 for moving the vacuum chuck 101 in the Z direction is provided in a sequentially stacked structure
  • the rotating unit 140 is Z-axis drive unit 130 Is provided at the top of the.
  • Each of the X-axis driving unit 110, the Y-axis driving unit 120, and the Z-axis driving unit 130 is provided with a guide rail and a driving motor, and operate under the control of the control unit 500 like a normal driving unit.
  • the control unit 500 is the air supply unit 102, the X-axis drive unit 110, the Y-axis drive unit 120 in accordance with the inspection results in the wafer mounting position inspection unit 300 and the edge inspection line scan unit 400 ,
  • the Z-axis driving unit 130 and the rotating unit 140 is controlled.
  • a through hole through which the pipe of the air supply unit 102 passes is provided at the center portion of the rotating unit 140, so that the vacuum chuck 1010 is connected to the wafer regardless of the rotation of the rotating unit 140. Vacuum adsorption can be maintained.
  • the support 150 is provided to temporarily hold a semiconductor wafer loaded and unloaded by the wafer loading and unloading unit 200 corresponding to the diameter of the wafer on the upper flat portion of the enclosure. That is, the support 150 is formed of three support members provided at intervals of 120 degrees and having an approximately "C" shape as shown in FIG. 2, and the edge portion of the wafer is formed at the upper edge portion of the three support members. It will settle down.
  • the support 150 With three "C" shaped support members, the arm of the wafer loading and unloading unit 200 can easily enter and exit on the vacuum chuck 101 without any obstacle of the support member. Therefore, the wafer can be stably held only at the edge portion of the wafer.
  • the wafer loading and unloading unit 200 extracts the wafer from the inspection wafer cassette for holding each of the plurality of wafers to be inspected by the edge region inspection apparatus of the wafer according to the present invention, and seats the wafer on the support 150.
  • a robot arm is provided for withdrawing the wafer on the inspected support 150 to a wafer cassette for storage.
  • Such a robot arm may be provided with an edge grip for holding a wafer or have a vacuum suction unit as in the present invention.
  • the wafer mounting position inspecting unit 300 photographs the position of the wafer seated on the support 150 by the wafer loading and unloading unit 200, and controls the position information on the seating position of the photographed wafer. 500). To this end, as shown in FIG. 2, the wafer mounting position inspecting unit 300 is provided with a cutout formed in a “c” shape so that a portion of the wafer is inserted, and a photographing camera is mounted on the top.
  • the wafer W is not in contact with the vacuum chuck 101, and the edge area of the entire circumference of the wafer is inspected according to the rotation of the wafer to determine the notch position.
  • an edge region portion of the wafer is inserted, and an insertion portion 410 is provided for performing optical functions of light emission and light reception for inspecting the edge region. That is, the inspection of the edge region portion of the wafer and the alignment of the notch positions are performed while the wafer is inserted with the insertion portion 410 of the line scanning portion for edge inspection. For this purpose, light is emitted from the upper and lower portions of the insertion portion 410. And a light receiving system are provided.
  • an infrared semiconductor laser emission wavelength 785 nm, low threshold current 30 mA
  • a silicon PIN photodiode sensitivity wavelength range: 320 nm to 1060 nm
  • the light emitting system may include a plurality of lenses therein and control the distance between the laser light and the lens and the distance between the lens and the wafer to form the laser light in a desired spot shape.
  • the light receiver performs photoelectric conversion of the scattered light, outputs a scattered light signal corresponding to the intensity of the scattered light, amplifies the scattered light signal by an amplifier, and uses a comparator.
  • the size of the foreign matter in the edge region of the wafer is specified.
  • the result of the conversion into a digital signal for each foreign matter size, the rotational speed of the wafer, the scattered light intensity, and the like can be obtained from the edge region inspection apparatus of the wafer according to the present invention. It outputs to the analyzer provided separately, and the position of a foreign material, a defect, etc. adhering to the wafer edge area is specified by this analyzer.
  • the wafer edge area inspection apparatus since the wafer is rotated by the rotating unit 140 in a state where the wafer is vacuum-adsorbed in a non-contact state by the vacuum chuck 101, the notch position of the wafer and the wafer as shown in FIG. The foreign matter adhering to the surface, the surface side bevel, the apex, the back side bevel, and the back surface of the wafer can be detected.
  • the control unit 500 controls the position of the vacuum chuck 101 according to the position information stored in the wafer mounting position inspecting unit 300 and the position information stored in the memory 510 to control the wafer W and the vacuum chuck 101.
  • the movement of the vacuum chuck 101 is controlled to coincide with the concentric positions, and such control can perform inspection of the edge region portion of the wafer and alignment of the notch positions corresponding to respective sizes of the plurality of wafers.
  • the memory 510 includes information on the size of the wafer to inspect the edge region, information on the initial position of the vacuum chuck 101, the X-axis driver 110, the Y-axis driver 120, and the Z-axis driver 130. ) X-direction movement, Y-direction movement, Z-direction movement of the vacuum chuck 101 by using, information on the rotational speed of the rotating unit 140 is stored.
  • 5 to 16 are perspective views of an operation state of the edge region inspection apparatus for explaining the edge region inspection process of the wafer according to the present invention.
  • the wafer loading and unloading unit 200 draws a wafer from the inspection wafer cassette for holding the plurality of wafers to be inspected to the robot arm and mounts on the support 150. Let's do it.
  • the loading of the wafer W to be inspected is carried out on three support members having a "C" shape as shown in FIG. 6, with a portion of the wafer W inserted in the cutout of the position inspection unit 300. In the robot loading and unloading unit 200 of the robot arm is separated.
  • the vacuum chuck 101 is raised by the Z-axis driving unit 130 (the Z-axis is raised) to vacuum the wafer W.
  • Adsorb That is, the wafer and the vacuum chuck are held in a non-contact state on the vacuum chuck while maintaining a constant interval.
  • Such Z-axis raising and vacuum adsorption of the wafer W are performed within 1 second. Accordingly, as shown in FIG. 7, the edge region portion of the wafer W is separated from the support 150.
  • the wafer W is vacuum-adsorbed to the vacuum chuck 100 as shown in FIG. 7 to confirm whether the wafer W is loaded at a predetermined position.
  • the chuck 101 is rotated, the camera provided in the position inspection unit 300 photographs, and the concentric check of the wafer W and the vacuum chuck 101 is performed.
  • the camera photographs the loaded wafer W to extract the position information of the wafer W
  • the controller 500 extracts the position information of the wafer previously stored in the memory 510.
  • the loading position information is compared to recognize the correct loading information of the wafer.
  • the above-mentioned concentric check of the wafer W and the vacuum chuck 101 is performed within 4 seconds.
  • the vacuum chuck 101 is lowered (Z-axis lowering) by the Z-axis driving unit 130 to release the vacuum state.
  • the wafer W is seated on the support 150. That is, it becomes the same state as the state shown in FIG.
  • Such Z-axis lowering and the release of the vacuum state are executed within 1 second.
  • the X-axis driver 110 and the Y-axis driver 120 Moves the vacuum chuck 101 in the X direction or the Y direction so that the concentricity of the vacuum chuck 101 and the concentricity of the wafer W coincide.
  • Such movement in the X direction or the Y direction to coincide the concentricity of the vacuum chuck 101 with the concentricity of the wafer W is performed within 1 second.
  • the vacuum chuck 101 is driven by the Z-axis drive unit 130.
  • the movement of the vacuum chuck 101 for the edge inspection described above is performed within 1 second. If necessary, the vacuum chuck 101 can move simultaneously in the X and Y directions while the wafer W is vacuum-adsorbed. In addition, the movement in the Y-axis direction can be performed within, for example, about 40 mm.
  • the vacuum is rotated by the rotating part 140 in a state where the wafer W, which is vacuum-adsorbed in a non-contact state, is inserted into the insertion part 410 of the edge inspection line scan part, which is an inspection position of the wafer W.
  • the chuck 101 is rotated to grasp the edge inspection and the notch position in the edge region of the entire circumference of the wafer W. That is, the notch position of the wafer W and the surface of the wafer W, the surface side bevel, the apex, the back side bevel, and the foreign matter adhered to the back surface of the wafer by the light emitting and light receiving systems provided on the upper and lower portions of the insertion part 410. Is detected, and the detection information is output to the analysis device.
  • the edge inspection and grasp of the notch position in the edge region around the entirety of the wafer W is performed within 10 seconds.
  • the vacuum chuck 101 in which the wafer W is vacuum-adsorbed in a non-contact state is opened.
  • a position where the vacuum chuck 101 is rotated by the rotating unit 140 to be pulled out from the insertion unit 410 and the notch position of the wafer W is rotated, and the wafer W can be seated on the support 150.
  • the vacuum chuck 101 is moved in the X-axis direction by the X-axis drive unit 110 or in the Y-axis direction by the Y-axis drive unit 120 so as to move to.
  • Such movement of the wafer W to the unloaded state is performed within 1 second.
  • the vacuum chuck 101 is lowered (Z-axis lowered) by the Z-axis driving unit 130, and is illustrated in FIG. 15.
  • the vacuum state for the wafer W is released, and the wafer W is seated on the support 150.
  • the Z-axis lowering and the release of the vacuum state to the wafer W are performed within 1 second.
  • the edge inspection and the alignment of the notch positions in the edge region of the wafer W according to the present invention are performed within 21 seconds, and therefore proceed at a higher speed than in the prior art.
  • the wafer loading and unloading unit 200 unloads the wafer W, and the robot arm pulls out the inspected wafer W into the storage wafer cassette.
  • the robot arm pulls out the support 150 from the support 150 to the storage wafer cassette, and the robot arm pulls out the wafer for inspection of a new wafer from the inspection wafer cassette.
  • edge region inspection apparatus and inspection method of the wafer according to the present invention inspection of the edge region and the notch position can be performed without damaging the front or rear surface of the wafer.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

La présente invention concerne un appareil et un procédé d'inspection d'une zone de bord d'une tranche capable d'alignement d'encoche d'une tranche et d'inspection d'une zone de bord d'une tranche comprenant la surface avant, la surface arrière, un biseau et un sommet de la tranche, sans endommager la surface avant ou la surface arrière de la tranche. L'appareil pour inspecter une zone de bord d'une tranche comprend : une unité de chargement et de déchargement de tranche pour charger et décharger une tranche à inspecter sur un support ; une unité de mandrin sous vide ayant un mandrin sous vide pour serrer sous vide la tranche placée sur le support dans un état sans contact au moyen de l'unité de chargement et de déchargement de tranche ; une unité de rotation pour faire tourner le mandrin sous vide qui serre sous vide la tranche pour inspecter la zone de bord de la tranche de façon continue ; une unité de balayage de ligne d'inspection de bord, disposée sur le même plan que la tranche, pour inspecter la zone de bord et les positions d'encoches de la tranche qui est tournée par l'unité de rotation ; et une unité de commande pour commander la position du mandrin sous vide. Par conséquent, il est possible d'inspecter la zone de bord et les positions d'encoche d'une tranche sans endommager la surface avant ou la surface arrière de la tranche.
PCT/KR2018/005663 2018-04-13 2018-05-17 Appareil et procédé d'inspection de zone de bord d'une tranche WO2019198869A1 (fr)

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CN201880092352.0A CN111971782A (zh) 2018-04-13 2018-05-17 晶片的边缘区域检查装置及检查方法

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KR1020180043223A KR20190119803A (ko) 2018-04-13 2018-04-13 웨이퍼의 에지 영역 검사장치 및 검사방법

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Cited By (1)

* Cited by examiner, † Cited by third party
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CN110620069A (zh) * 2019-10-21 2019-12-27 深圳市思坦科技有限公司 晶圆的湿处理系统及方法

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