KR20190119803A - 웨이퍼의 에지 영역 검사장치 및 검사방법 - Google Patents

웨이퍼의 에지 영역 검사장치 및 검사방법 Download PDF

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Publication number
KR20190119803A
KR20190119803A KR1020180043223A KR20180043223A KR20190119803A KR 20190119803 A KR20190119803 A KR 20190119803A KR 1020180043223 A KR1020180043223 A KR 1020180043223A KR 20180043223 A KR20180043223 A KR 20180043223A KR 20190119803 A KR20190119803 A KR 20190119803A
Authority
KR
South Korea
Prior art keywords
wafer
vacuum chuck
inspection
vacuum
edge
Prior art date
Application number
KR1020180043223A
Other languages
English (en)
Korean (ko)
Inventor
황병문
Original Assignee
주식회사 넥서스원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 넥서스원 filed Critical 주식회사 넥서스원
Priority to KR1020180043223A priority Critical patent/KR20190119803A/ko
Priority to CN201880092352.0A priority patent/CN111971782A/zh
Priority to PCT/KR2018/005663 priority patent/WO2019198869A1/fr
Publication of KR20190119803A publication Critical patent/KR20190119803A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020180043223A 2018-04-13 2018-04-13 웨이퍼의 에지 영역 검사장치 및 검사방법 KR20190119803A (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020180043223A KR20190119803A (ko) 2018-04-13 2018-04-13 웨이퍼의 에지 영역 검사장치 및 검사방법
CN201880092352.0A CN111971782A (zh) 2018-04-13 2018-05-17 晶片的边缘区域检查装置及检查方法
PCT/KR2018/005663 WO2019198869A1 (fr) 2018-04-13 2018-05-17 Appareil et procédé d'inspection de zone de bord d'une tranche

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020180043223A KR20190119803A (ko) 2018-04-13 2018-04-13 웨이퍼의 에지 영역 검사장치 및 검사방법

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020200072893A Division KR102136085B1 (ko) 2020-06-16 2020-06-16 웨이퍼의 에지 영역 검사장치

Publications (1)

Publication Number Publication Date
KR20190119803A true KR20190119803A (ko) 2019-10-23

Family

ID=68164407

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180043223A KR20190119803A (ko) 2018-04-13 2018-04-13 웨이퍼의 에지 영역 검사장치 및 검사방법

Country Status (3)

Country Link
KR (1) KR20190119803A (fr)
CN (1) CN111971782A (fr)
WO (1) WO2019198869A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110620069A (zh) * 2019-10-21 2019-12-27 深圳市思坦科技有限公司 晶圆的湿处理系统及方法
CN112707130A (zh) * 2020-12-30 2021-04-27 无锡奇众电子科技有限公司 晶圆纠偏中转台

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070000924A (ko) 2005-06-28 2007-01-03 삼성전자주식회사 반도체 웨이퍼 에지 검사장치 및 웨이퍼 에지 검사방법
KR101440622B1 (ko) 2007-06-01 2014-09-15 가부시끼가이샤 야마나시 기쥬쯔 고오보오 웨이퍼 주연 단부의 이물질 검사 방법 및 이물질 검사 장치

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000018618A (ko) * 1998-09-03 2000-04-06 윤종용 반도체장치 제조용 웨이퍼 에지파손 디텍터 및 이를 포함하는웨이퍼 검사장치
US7109511B2 (en) * 2000-11-02 2006-09-19 Kabushiki Kaisha Yaskawa Denki Techniques for wafer prealignment and sensing edge positions
KR20040094967A (ko) * 2003-05-06 2004-11-12 지에스인더스트리(주) 웨이퍼 에지 검사 장치
KR20050011334A (ko) * 2003-07-22 2005-01-29 삼성전자주식회사 반도체 웨이퍼 에지부 검사장치
KR20050020012A (ko) * 2003-08-20 2005-03-04 삼성전자주식회사 웨이퍼 검사 장치 및 검사 방법
CN100583407C (zh) * 2005-04-27 2010-01-20 奥林巴斯株式会社 外观检查装置、外观检查方法以及可安装在外观检查装置上的边缘部检查单元
JP2010107195A (ja) * 2007-07-18 2010-05-13 Nikon Corp 検査装置および検査方法
KR100914724B1 (ko) * 2007-11-30 2009-08-31 주식회사 와코 웨이퍼 에지 노광장치 및 노광방법
US9653338B2 (en) * 2013-12-23 2017-05-16 Kla-Tencor Corporation System and method for non-contact wafer chucking
CN104681475A (zh) * 2014-12-31 2015-06-03 上海新阳半导体材料股份有限公司 晶圆位置校准装置
CN204857695U (zh) * 2015-07-16 2015-12-09 上海微松工业自动化有限公司 一种高效晶圆预对准控制装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070000924A (ko) 2005-06-28 2007-01-03 삼성전자주식회사 반도체 웨이퍼 에지 검사장치 및 웨이퍼 에지 검사방법
KR101440622B1 (ko) 2007-06-01 2014-09-15 가부시끼가이샤 야마나시 기쥬쯔 고오보오 웨이퍼 주연 단부의 이물질 검사 방법 및 이물질 검사 장치

Also Published As

Publication number Publication date
WO2019198869A1 (fr) 2019-10-17
CN111971782A (zh) 2020-11-20

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