CN221078431U - Wafer detection equipment - Google Patents

Wafer detection equipment Download PDF

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Publication number
CN221078431U
CN221078431U CN202322602124.4U CN202322602124U CN221078431U CN 221078431 U CN221078431 U CN 221078431U CN 202322602124 U CN202322602124 U CN 202322602124U CN 221078431 U CN221078431 U CN 221078431U
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wafer
carrier
detection device
piece
detection
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CN202322602124.4U
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Chinese (zh)
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吴坤
王志铭
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Shenzhen Zhuoguang Semiconductor Equipment Technology Co ltd
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Shenzhen Zhuoguang Semiconductor Equipment Technology Co ltd
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Abstract

The utility model relates to the technical field of wafer detection, in particular to wafer detection equipment. The wafer detection equipment comprises a wafer edge detection device, a wafer surface detection device and a manipulator; the wafer edge detection device and the wafer surface detection device are arranged at the side of the manipulator. The wafer edge detection device is used for detecting wafer edge flaws, the wafer surface detection device is used for detecting wafer surface flaws, and the manipulator is used for feeding wafers to the wafer edge detection device and the wafer surface detection device and discharging wafers on the wafer edge detection device and the wafer surface detection device. The wafer edge detection device detects whether the wafer edge has flaws or not, the wafer surface detection device detects whether the wafer surface has flaws or not, the detection of the wafer is divided into two times of detection, the detection is more precise and more targeted, and the detection is more accurate.

Description

Wafer detection equipment
Technical Field
The utility model relates to the technical field of wafer detection, in particular to wafer detection equipment.
Background
Wafers have an extremely important role in the semiconductor and electronics industries, which are the basis for the fabrication of various electronic devices such as microprocessors, memories, sensors, display screens, solar cells, and the like. The wafer fabrication process includes a number of critical steps such as silicon material preparation, cleaning, gumming, exposure, etching, ion implantation, annealing, testing, and the like. Eventually, the wafer will be diced into individual chips, each containing a complete circuit or device.
The manufactured wafers need to be inspected to ensure pass. In the current wafer detection, the whole wafer is directly subjected to one-time integrated detection, the detection is rough, and the detection result is not accurate enough.
Disclosure of utility model
The embodiment of the utility model aims to solve the technical problems of rough wafer detection and inaccurate detection result in the prior art by providing wafer detection equipment.
The utility model discloses wafer detection equipment, which comprises a wafer edge detection device, a wafer surface detection device and a manipulator, wherein the wafer edge detection device is used for detecting the edge of a wafer; the wafer edge detection device and the wafer surface detection device are arranged at the side of the manipulator;
The wafer edge detection device is used for detecting wafer edge flaws, the wafer surface detection device is used for detecting wafer surface flaws, and the manipulator is used for feeding wafers to the wafer edge detection device and the wafer surface detection device and discharging wafers on the wafer edge detection device and the wafer surface detection device.
Optionally, a wafer state detection sensor is disposed on the manipulator, and the wafer state detection sensor is used for detecting whether the wafers in the carrier overlap and/or tilt in the horizontal direction.
Optionally, the manipulator includes two groups of adsorption components, each group of adsorption components includes an adsorption arm and at least two rotating arms; the rotating arms can be connected in a self-driven rotating way, one rotating arm of the rotating arms is arranged on the lifting driving piece, the other rotating arm is connected with the adsorption arm, and the adsorption arm is flat and is provided with an adsorption opening at one end far away from the rotating arm connected with the adsorption arm.
Optionally, the wafer detecting device further includes a carrier fixing device, where the carrier fixing device is disposed at the side of the manipulator and is used for fixing a carrier for loading the wafer; the carrier fixing device comprises a bottom plate, a mounting frame and a pressing mechanism, wherein the pressing mechanism comprises a pressing piece; the bottom plate is used for placing a carrier to be fixed, the mounting frame is mounted on the bottom plate, and the pressing mechanism is rotatably mounted on the top of the mounting frame and can perform pitching rotation; when the carrier is fixed, the compressing mechanism rotates towards the area where the carrier is placed on the bottom plate, and the carrier placed on the bottom plate is compressed and fixed by the pressing piece.
Optionally, the pressing mechanism further comprises a rotary mounting piece, the top of the mounting frame is provided with a mounting base, and the rotary mounting piece is rotatably mounted on the mounting base and can perform pitching rotation; the pressing piece is arranged on one side, facing the bottom plate, of the rotating mounting piece when pressing the ballast;
The pressing piece is provided with a first positioning convex strip, and the first positioning convex strip is used for being embedded into a first groove at the top of the carrier to position the carrier when the pressing piece presses the fixed carrier;
The bottom plate is provided with a second positioning convex strip, and one side of the top edge of the mounting rack, which faces to the area of the bottom plate for placing the carrier, is provided with a positioning groove; the second positioning convex strips are used for clamping with the second grooves at the bottom of the carrier, and the positioning grooves are used for clamping with the first positioning protrusions on one side, facing the mounting frame, of the carrier;
The constant head tank is provided with a plurality of respectively at the top edge of the mounting bracket of installation base both sides.
Optionally, a first detection sensor is installed on one side, facing the bottom plate, when the mounting piece rotates to press the carrier, and the first detection sensor is used for detecting whether the carrier is on the bottom plate when the pressing mechanism rotates to a pressing state;
One of the mounting base and the bottom plate is provided with a transmitting sensor, and the other is provided with a receiving sensor; the transmitting sensor and the receiving sensor are correspondingly arranged in the vertical direction and are used for detecting whether a loading object in the carrier is exposed outside the carrier or not;
one of the mounting base and the rotary mounting piece is provided with a magnet, and the other is provided with a magnetic attraction structure; the magnet and the magnetic attraction structure are correspondingly arranged, so that the compressing mechanism is magnetically attracted and positioned in the propping state and the initial state.
Optionally, the wafer edge detection device comprises a rotary adsorption assembly, a lifting bearing assembly and an imaging detection assembly; the rotary adsorption assembly comprises a rotary driving piece and an adsorption head, and the adsorption head is in transmission connection with the rotary driving piece; the lifting bearing assembly comprises a first lifting driving piece and a bearing piece, the bearing piece is arranged on the first lifting driving piece, and the adsorption head is positioned in the bearing piece; the imaging detection component is arranged at the side of the adsorption head and is used for imaging the edge of the wafer adsorbed on the adsorption head for detection;
the bearing piece is hollow in the middle and is in a frame shape with one side being opened, and the adsorption head is positioned in the hollow of the bearing piece.
Optionally, the wafer surface detection device comprises a detection table, a main camera, an auxiliary camera and a laser focusing mechanism; the detection table is used for placing a wafer to be detected, and the main camera, the auxiliary camera and the laser focusing mechanism are arranged above the detection table; the detection precision of the auxiliary camera is larger than that of the main camera, the main camera is used for detecting the defects of the surface of the wafer, and the auxiliary camera is used for rechecking the defects of the surface of the wafer detected by the main camera; the laser focusing mechanism is used for detecting the relative heights of the main camera and the auxiliary camera and the wafer so as to focus the main camera and the auxiliary camera.
Optionally, a jacking component is installed in the detection platform, and the jacking component can lift and jack a wafer to be placed on the detection platform from the detection platform and can lower and reset the wafer to be placed on the detection platform;
The jacking assembly comprises a second lifting driving piece and a thimble, and the second lifting driving piece is connected with the thimble; the detection platform is provided with a first through hole corresponding to the thimble, and the second lifting driving piece drives the thimble to lift up from the first through hole or descend from the first through hole to reset.
Optionally, the top surface of detecting the platform is provided with the micropore panel, and detecting the platform and can be connected negative pressure generating device in order to make micropore panel produce negative pressure absorption wafer.
Compared with the prior art, the wafer detection equipment provided by the embodiment of the utility model has the beneficial effects that: the wafer detection equipment is provided with the wafer edge detection device and the wafer surface detection device, and when the wafer is detected, the wafer to be detected is respectively fed onto the wafer edge detection device and the wafer surface detection device through the mechanical arm, wherein the wafer edge detection device detects whether the wafer edge has flaws, the wafer surface detection device detects whether the wafer surface has flaws, the detection of the wafer is divided into two detection steps, and the detection is more precise and more targeted, and the detection is more accurate.
Drawings
The technical scheme of the utility model will be further described in detail below with reference to the accompanying drawings and examples, wherein:
FIG. 1 is a schematic diagram of a wafer inspection apparatus according to an embodiment of the present utility model;
FIG. 2 is another schematic diagram of a wafer inspection apparatus according to an embodiment of the present utility model;
FIG. 3 is an enlarged partial view of portion A of FIG. 2;
FIG. 4 is a schematic view of a carrier fixture according to an embodiment of the present utility model;
FIG. 5 is another schematic view of a carrier fixture according to an embodiment of the present utility model;
FIG. 6 is a schematic view of a carrier according to an embodiment of the present utility model placed on a carrier fixture;
FIG. 7 is a schematic diagram of a wafer edge inspection apparatus according to an embodiment of the present utility model;
FIG. 8 is another schematic diagram of a wafer edge inspection apparatus according to an embodiment of the present utility model;
FIG. 9 is a schematic diagram of a wafer surface inspection apparatus according to an embodiment of the present utility model;
FIG. 10 is a schematic diagram of a primary camera, a secondary camera, and a laser focusing mechanism according to an embodiment of the present utility model;
FIG. 11 is a schematic diagram of a detection stage, an X-axis drive assembly, and a Y-axis drive assembly according to an embodiment of the present utility model;
FIG. 12 is an exploded schematic view of a micro-porous panel of a test station according to an embodiment of the utility model;
FIG. 13 is a schematic view of a jacking assembly according to an embodiment of the present utility model;
FIG. 14 is a schematic diagram of a primary camera, secondary camera, laser focus mechanism, Z-axis drive assembly according to an embodiment of the present utility model;
Fig. 15 is a schematic view of a carrier according to an embodiment of the utility model.
The reference numerals in the drawings are as follows:
1. Wafer edge detection device; 11. rotating the adsorption assembly; 111. a rotary driving member; 112. an adsorption head; 12. lifting the bearing assembly; 121. a first lifting driving member; 122. a support; 13. an imaging detection assembly; 2. a wafer surface detection device; 21. a detection table; 211. a microporous panel; 2111. a first through hole; 22. a main camera; 23. an auxiliary camera; 24. a laser focusing mechanism; 25. a jacking assembly; 251. a second lifting driving member; 252. a thimble; 26. a portal frame; 27. an X-axis driving assembly; 28. a Y-axis drive assembly; 29. a Z-axis drive assembly; 3. a manipulator; 31. an adsorption assembly; 311. an adsorption arm; 312. a rotating arm; 4. a carrier fixing device; 41. a bottom plate; 411. second positioning convex strips; 42. a mounting frame; 421. a mounting base; 4211. a magnet; 422. a top edge; 4221. a positioning groove; 43. a compressing mechanism; 431. a pressing member; 4311. a first positioning convex strip; 432. rotating the mounting member; 4321a, magnetic attraction structure; 44. a first detection sensor; 45. an emission sensor; 46. a receiving sensor; 5. a carrier; 51. a first groove; 52. a second groove; 53. a first positioning protrusion; 6. and (3) a wafer.
Detailed Description
It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other. Preferred embodiments of the present utility model will now be described in detail with reference to the accompanying drawings.
As shown in fig. 1 to 14, an embodiment of the present utility model provides a wafer inspection apparatus. As shown in fig. 1 and 2, the wafer inspection apparatus includes a wafer edge inspection device 1, a wafer surface inspection device 2, and a robot arm 3; the wafer edge detection device 1 and the wafer surface detection device 2 are arranged beside the manipulator 3.
The wafer edge detection device 1 is used for detecting edge flaws of the wafer 6, the wafer surface detection device 2 is used for detecting surface flaws of the wafer 6, and the manipulator 3 is used for feeding the wafer 6 to the wafer edge detection device 1 and the wafer surface detection device 2 and discharging the wafer 6 on the wafer edge detection device 1 and the wafer surface detection device 2.
The wafer detection equipment is provided with the wafer edge detection device 1 and the wafer surface detection device 2, when the wafer 6 is detected, the wafer 6 to be detected is respectively fed to the wafer edge detection device 1 and the wafer surface detection device 2 through the manipulator 3, wherein the wafer edge detection device 1 detects whether the edge of the wafer 6 is defective or not, the wafer surface detection device 2 detects whether the surface of the wafer 6 is defective or not, the detection of the wafer 6 is divided into two detection steps, the detection is more refined and more targeted, and the detection is more accurate. Specifically, as shown in fig. 15, the wafer 6 is generally a circular or other shaped, sheet-like structure. In actual production, the edge of the wafer 6 may have flaws such as cracks and edge breakage, and the surface of the wafer 6 may have flaws such as cracks and scratches.
The robot 3 is provided with a wafer state detection sensor (not shown) for detecting whether or not the wafers 6 in the carrier 5 overlap and/or tilt in the horizontal direction. The carrier 5 is an apparatus for loading the wafer 6, and facilitates operations such as loading and unloading the wafer 6 and transferring the wafer. The manipulator 3 approaches the carrier 5 during feeding, firstly, a wafer state detection sensor detects whether the wafer 6 in the carrier 5 is overlapped and/or inclined in the horizontal direction, and if the overlapping or inclined condition exists, the wafer detection equipment sends out a prompt. Specifically, the wafer state detection sensor may be an infrared sensor. When two or more wafers 6 are stacked on the same layer of the carrier 5, the thickness becomes thicker, and the infrared sensor detects that the thickness of the current wafer 6 is greater than the preset thickness, so that the wafer 6 can be judged to be in the stacked state. When one side of the wafer 6 is placed on the current layer of the carrier 5 and the other side is placed on the upper layer or the lower layer of the current layer, the wafer 6 is in an inclined state, at this time, the width of the wafer 6 in the horizontal direction is reduced, and the infrared sensor detects that the horizontal width of the current wafer 6 is greater than the predetermined width, so that the wafer 6 can be determined to be in the inclined state.
As shown in fig. 3, the manipulator 3 includes two groups of suction assemblies 31, each group of suction assemblies 31 includes a suction arm 311 and at least two rotating arms 312; the rotating arms 312 are rotatably connected to each other in a self-driven manner, one rotating arm 312 is attached to a lifting drive member (not shown), the other rotating arm 312 is connected to the suction arm 311, and the suction arm 311 is flat and has a suction opening (not shown) provided at one end thereof remote from the rotating arm 312 connected thereto. The adsorption assembly 31 moves in the X-axis and Y-axis by rotation between the plurality of rotating arms 312, and moves up and down in the Z-axis direction by a lift driving member, which may be a cylinder or the like. The rotating arms 312 can be connected by a motor or the like, so as to realize self-driven rotation of the rotating arms 312, which is not described herein. Specifically, three rotating arms 312 are provided, the three rotating arms 312 are sequentially and automatically connected in a rotating manner, one rotating arm 312 is mounted on the lifting driving member, and the other rotating arm 312 is connected with the adsorbing arm 311. The adsorption arm 311 is flat, so that the wafer 6 can be conveniently inserted into the carrier 5, the adsorption arm 311 adsorbs the wafer 6 through the negative pressure of the adsorption opening, and the adsorption is firm and is not easy to damage the wafer 6. Adsorption open pore communication
As shown in fig. 4 to 7, the wafer inspection apparatus further includes a carrier fixing device 4, where the carrier fixing device 4 is disposed beside the robot arm 3 and is used for fixing a carrier 5 on which a wafer 6 is loaded; the carrier fixing device 4 comprises a bottom plate 41, a mounting frame 22 and a pressing mechanism 43, wherein the pressing mechanism 43 comprises a pressing piece 431; the bottom plate 41 is used for placing the carrier 5 to be fixed, the mounting frame 22 is mounted on the bottom plate 41, and the pressing mechanism 43 is rotatably mounted on the top of the mounting frame 22 and can perform pitching rotation; when the carrier 5 is fixed, the pressing mechanism 43 rotates toward the area of the bottom plate 41 where the carrier 5 is placed, and the pressing member 431 presses and fixes the carrier 5 placed on the bottom plate 41.
The carrier fixing device 4 can be used for fixing the carrier 5 for loading the wafer 6, the compressing mechanism 43 is arranged, the compressing mechanism 43 comprises a pressing piece 431, when the carrier 5 is fixed, the carrier 5 is firstly placed on the bottom plate 41, the compressing mechanism 43 is rotated, the compressing mechanism 43 compresses and fixes the carrier 5 from the top of the carrier 5, the carrier 5 can be wholly subjected to fixing force, and compared with the mode of fixing the bottom of the carrier 5, the fixing mode is firmer, is not easy to shake or loosen, and has good fixing effect. When the carrier 5 needs to be removed, the pressing mechanism 43 is turned to an initial position as shown in fig. 4, for example, and the carrier 5 is released and the carrier 5 can be removed.
The pressing mechanism 43 further comprises a rotary mounting piece 432, a mounting base 421 is arranged at the top of the mounting frame 22, and the rotary mounting piece 432 is rotatably mounted on the mounting base 421 and can perform pitching rotation; the pressing member 431 is mounted on a side facing the bottom plate 41 when the rotary mounting member 432 presses the load carrier 5. The pressing member 431 is provided with a first positioning protrusion 4311, and the first positioning protrusion 4311 is used for positioning the carrier 5 when the pressing member 431 presses the fixed carrier 5 and is embedded into the first groove 51 at the top of the carrier 5. Further referring to fig. 15, the carrier 5 can be further limited by the first positioning protruding strips 4311 and the first grooves 51 on the top of the carrier 5, so as to improve the fixing effect of the carrier 5.
The bottom plate 41 is provided with a second positioning convex strip 411, and one side of the top edge 422 of the mounting frame 22, which faces the area of the bottom plate 41 where the carrier 5 is placed, is provided with a positioning groove 4221; the second positioning protruding strip 411 is used for being locked with the second groove 52 at the bottom of the carrier 5, and the positioning groove 4221 is used for being locked with the first positioning protrusion 53 on the side of the carrier 5 facing the mounting frame 22. The carrier fixing device 4 is further provided with a second positioning convex strip 411 and a positioning groove 4221, and the second positioning convex strip 411 and the positioning groove 4221 are respectively clamped with the second groove 52 and the first positioning protrusion 53 of the carrier 5, so that the carrier 5 is limited in all directions. Therefore, under the compression and fixation of the compression mechanism 43, the limitation of the first positioning convex strip 4311, the second positioning convex strip 411 and the positioning groove 4221 is matched, so that the fixing effect of the carrier 5 is better. The positioning grooves 4221 are respectively arranged on the top edges 422 of the mounting frames 22 on two sides of the mounting base 421, so that the positioning grooves 4221 can be adapted to carriers 5 with different sizes.
The first detecting sensor 44 is mounted on a side facing the bottom plate 41 when the rotating mounting member 432 abuts against the carrier 5, and the first detecting sensor 44 is used for detecting whether the carrier 5 is present on the bottom plate 41 when the pressing mechanism 43 rotates to the abutting state. By the detection of the first detection sensor 44, it is known whether the carrier 5 is placed on the bottom plate 41. If the carrier 5 is placed, the wafer inspection apparatus normally performs the related operation, and if the carrier 5 is not placed, the wafer inspection apparatus stops the related operation, for example, the robot 3 for sucking the wafer 6 in the carrier 5 does not suck the wafer 6 at the carrier fixture 4. Specifically, the first detection sensor 44 may be an infrared sensor.
One of the mounting base 421 and the bottom plate 41 has the transmitting sensor 45 mounted thereon, and the other has the receiving sensor 46 mounted thereon; the transmitting sensor 45 and the receiving sensor 46 are correspondingly arranged in the vertical direction, and are used for detecting whether the loading object in the carrier 5 is exposed outside the carrier 5. When the loading object such as the wafer 6 in the carrier 5 is exposed to the outside of the carrier 5, the signal transmitted from the transmitting sensor 45 to the receiving sensor 46 is blocked, so that it is possible to detect whether the loading object in the carrier 5 is exposed to the outside of the carrier 5. When detecting that the loading object in the carrier 5 is exposed out of the carrier 5, a reminding signal is sent out for reminding. Specifically, the transmitting sensor 45 may be an infrared transmitting sensor 45, and the receiving sensor 46 may be an infrared receiving sensor 46.
One of the mounting base 421 and the rotary mounting member 432 is provided with a magnet 4211, and the other is provided with a magnetic attraction structure 4321a; the magnet 4211 and the magnetic attraction structure 4321a are disposed correspondingly, so that the pressing mechanism 43 is magnetically attracted and positioned in the pressing state and the initial state. The magnet 4211 and the magnetic attraction structure 4321a are arranged to realize magnetic attraction between the mounting base 421 and the rotary mounting piece 432, so that the positioning effect of the pressing mechanism 43 in the pressing state and the initial state is better, and thus, the pressing mechanism 43 is not easy to loosen when in the state of pressing the carrier 5, and is not easy to shake or unnecessarily rotate when in the initial state of being idle. The magnetic attraction structure 4321a may be a magnet or a metal member magnetically attracted to the magnet, or may be a part of the mounting base 421 or the rotary mounting member 432 itself. When the magnetic attraction structure 4321a is a part of the mounting base 421 or the rotary mounting piece 432, the mounting base 421 or the rotary mounting piece 432 is made of a metal that can magnetically attract the magnet.
As shown in fig. 7 and 8, the wafer edge inspection apparatus 1 includes a rotary suction assembly 11, a lifting support assembly 12, and an imaging inspection assembly 13; the rotary adsorption assembly 11 comprises a rotary driving piece 111 and an adsorption head 112, and the adsorption head 112 is in transmission connection with the rotary driving piece 111; the lifting support assembly 12 comprises a first lifting drive member 121 and a support member 122, the support member 122 being mounted on the first lifting drive member 121, the suction head 112 being located in the support member 122; the imaging detection assembly 13 is disposed beside the suction head 112, and is used for imaging the edge of the wafer 6 sucked on the suction head 112 for detection. The wafer edge detection device 1 is provided with the supporting piece 122, when the manipulator 3 transfers the wafer 6 to the position above the adsorption head 112, the first lifting driving piece 121 drives the supporting piece 122 to lift so as to support the wafer 6, the manipulator 3 is loosened, the supporting piece 122 is driven by the first lifting driving piece 121 to descend, the wafer 6 is placed on the adsorption head 112, and the problem that the wafer 6 is easy to damage when being directly placed is avoided through the active supporting of the supporting piece 122; at the same time, the wafer 6 is fixed by the adsorption head 112, and the wafer 6 is not easily damaged. After the wafer 6 is adsorbed, the rotary driving member 111 drives the adsorption head 112 to rotate, and in the process of rotating the wafer 6, the imaging detection assembly 13 performs imaging detection on one circle of the edge of the wafer 6, for example, detects whether the edge of the wafer 6 has cracks or edge breakage. The detection mode of the imaging detection component 13 may be visual detection, which may include an imaging module, a lens, a light source, and the like, and the imaging module may be a CCD camera. The adsorption head 112 may be externally connected to a vacuum pump for evacuating gas to create a negative pressure environment. So that the suction head 112 can suck the wafer 6. The first elevating driving member 121 may include a cylinder and a slider mounted thereon, and the supporter 122 is mounted on the slider to be elevated as the cylinder is extended and retracted. The rotation driving member 111 may be a motor, and the motor may be directly connected to the suction head 112 to drive the suction head 112 to rotate, or may realize rotation transmission through a transmission member such as a gear.
The supporting member 122 is in a frame shape with a hollow middle and an opening at one side, and the adsorption head 112 is located in the hollow of the supporting member 122. The bearing piece 122 is hollow in the middle and one side of the bearing piece is provided with an opening, the adsorption head 112 can be conveniently arranged in the bearing piece 122, assembly and matching between the bearing piece 122 and the adsorption head 112 are convenient, the bearing piece 122 cannot interfere with the adsorption head 112 in the lifting process, and meanwhile, the wafer 6 can be transferred to the adsorption head 112 for adsorption and fixation. Specifically, the support 122 may have a U shape or a V shape.
As shown in fig. 9 to 14, the wafer surface inspection apparatus 2 includes an inspection stage 21, a main camera 22, a sub camera 23, and a laser focusing mechanism 24; the detection table 21 is used for placing a wafer 6 to be detected, and the main camera 22, the auxiliary camera 23 and the laser focusing mechanism 24 are arranged above the detection table 21; the detection precision of the auxiliary camera 23 is larger than that of the main camera 22, the main camera 22 is used for detecting the surface flaws of the wafer 6, and the auxiliary camera 23 is used for rechecking the flaws of the surface of the wafer 6 detected by the main camera 22; the laser focusing mechanism 24 is used to detect the relative heights of the main camera 22 and the sub camera 23 and the wafer 6 so as to focus the main camera 22 and the sub camera 23.
The wafer surface detection device 2 is provided with a main camera 22 and an auxiliary camera 23, and a laser focusing mechanism 24 is used for assisting in detection, when the detection is carried out, the main camera 22 carries out primary detection firstly to determine flaws such as cracks and the like on the surface of the wafer 6, and then the auxiliary camera 23 further identifies the flaws detected by the main camera 22, such as amplification identification, so that further fine identification and accurate detection are realized; the main camera 22 and the auxiliary camera 23 realize distance measurement focusing through the laser focusing mechanism 24, the focusing is quick, and the imaging is clearer.
Because of the different thicknesses of the wafers 6, the main camera 22 and the auxiliary camera 23 need to be focused in order to ensure clear imaging and accurate detection. The laser focusing mechanism 24 determines the distance from the wafer 6 placed on the inspection stage 21 to the main camera 22 and the sub camera 23 by a laser beam. During the laser focusing process, the laser focusing mechanism 24 emits a focused beam, and after passing through the lens or the reflector, the beam forms a spot or light spot, and when the beam is focused on the surface of the wafer 6, the distance of the wafer 6 can be determined by detecting the definition of the light spot or the position change of the light spot, so that the elevation adjustment is performed on the Z axis, and the effect of accurate focusing can be achieved, for example, by adjusting the Z axis driving assembly 29 as described below.
The top support assembly 25 is mounted in the inspection stage 21, and the top support assembly 25 is capable of lifting up the wafer 6 to be placed on the inspection stage 21 from the inspection stage 21 and lowering and resetting to place the wafer 6 on the inspection stage 21. The jacking component 25 can jack up the wafer 6 to be detected, and place the wafer 6 to be detected on the detection table 21, after detection, the jacking component 25 can jack up the wafer 6 again, so that the manipulator 3 can take away the detected wafer 6. Specifically, when the surface of the wafer 6 is inspected, the wafer 6 to be inspected is sucked by the manipulator 3, the jacking component 25 is lifted, the wafer 6 is released after the wafer 6 to be inspected is placed on the jacking component 25 by the manipulator 3, the jacking component 25 is lowered and reset, and meanwhile, the wafer 6 is placed on the inspection table 21. The jacking component 25 can facilitate the manipulator 3 to put and take the wafer 6, and can avoid the wafer 6 from being damaged caused by directly placing the wafer 6 on the detection table 21.
The jacking assembly 25 comprises a second lifting driving piece 251 and a thimble 252, and the second lifting driving piece 251 is connected with the thimble 252; the detection table 21 is provided with a first through hole 2111 corresponding to the thimble 252, and the second elevating driving member 251 drives the thimble 252 to rise from the first through hole 2111 or to descend from the first through hole 2111 for resetting. The second lifting driving member 251 drives the thimble 252 to lift, thereby realizing the transfer of the wafer 6. Specifically, the second lifting driving member 251 is lifted to drive the ejector pins 252 to lift, and the ejector pins 252 extend out of the first through holes 2111, so as to support the wafer 6; the second elevating driving member 251 is lowered to drive the ejector pins 252 to descend and reset, and the ejector pins 252 are retracted from the first through holes 2111, thereby placing the wafer 6 on the inspection table 21. In this scheme, through setting up the cooperation of first through-hole 2111 and thimble 252, when realizing that jacking subassembly 25 jacking shifts wafer 6, simple structure, reasonable in design can be convenient for assemble in detecting the platform 21. The second elevating driving member 251 may be an air cylinder.
The top surface of the detection table 21 is provided with a micro-hole panel 211, and the detection table 21 can be connected with a negative pressure generating device so that the micro-hole panel 211 generates negative pressure to adsorb the wafer 6. The wafer 6 is fixed by attaching a micro-hole panel 211 to the top surface of the inspection table 21. Specifically, the wafer 6 to be detected is placed on the micro-hole panel 211 by the manipulator 3 or the jacking component 25, the wafer 6 can be firmly adsorbed by the adsorption force generated on the micro-hole panel 211, the adsorption area of the wafer 6 is large, and the fixation is firm. Specifically, the micro-porous panel 211 is a ceramic chuck. The ceramic sucker has smooth surface, is not easy to release particles, has excellent wear resistance and hardness, has excellent insulating property, and can better protect the wafer 6 from being damaged. When the jacking assembly 25 is provided on the inspection table 21, the first through holes 2111 may be opened on the micro-hole panel 211.
The wafer surface inspection apparatus 2 further includes a gantry 26, an X-axis drive assembly 27, a Y-axis drive assembly 28, and a Z-axis drive assembly 29. The X-axis driving assembly 27 is mounted on the Y-axis driving assembly 28, the detection table 21 is mounted on the X-axis driving assembly 27, the gantry frame 26 is located beside the detection table 21, the Z-axis driving assembly 29 is mounted on the gantry frame 26, and the main camera 22, the auxiliary camera 23 and the laser focusing mechanism 24 are mounted on the gantry frame 26. The X-axis driving assembly 27 may drive the inspection stage 21 to move in the X-axis direction, and the Y-axis driving assembly 28 may drive the inspection stage 21 to move in the Y-axis direction, thereby achieving adjustment of the position of the wafer 6. The Z-axis driving assembly 29 may drive the main camera 22, the sub-camera 23, and the laser focusing mechanism 24 to move in the Z-axis direction, thereby achieving focusing of the main camera 22, the sub-camera 23. Specifically, the X-axis driving assembly 27, the Y-axis driving assembly 28, and the Z-axis driving assembly 29 include cylinders, rails, and sliders, which are not described herein.
It should be understood that the foregoing embodiments are merely illustrative of the technical solutions of the present utility model, and not limiting thereof, and that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art; all such modifications and substitutions are intended to be included within the scope of this disclosure as defined in the following claims.

Claims (10)

1. A wafer inspection apparatus, comprising: wafer edge detection device, wafer surface detection device and manipulator; the wafer edge detection device and the wafer surface detection device are arranged at the side of the manipulator;
The wafer edge detection device is used for detecting wafer edge flaws, the wafer surface detection device is used for detecting wafer surface flaws, and the manipulator is used for feeding wafers to the wafer edge detection device and the wafer surface detection device and discharging the wafers on the wafer edge detection device and the wafer surface detection device.
2. Wafer inspection apparatus according to claim 1, wherein a wafer state inspection sensor is provided on the robot for inspecting whether wafers in the carrier overlap and/or tilt in a horizontal direction.
3. The wafer inspection apparatus of claim 1, wherein the robot includes two sets of suction assemblies, each set of suction assemblies including a suction arm and at least two rotating arms; the rotating arms can be connected in a self-driven rotating manner, one rotating arm is arranged on the lifting driving piece, the other rotating arm is connected with the adsorption arm, and the adsorption arm is flat and is far away from one end of the rotating arm connected with the adsorption arm, and an adsorption opening is formed in one end of the adsorption arm.
4. The wafer inspection apparatus according to any one of claims 1 to 3, further comprising a carrier fixing device provided at a side of the robot for fixing a carrier on which a wafer is loaded; the carrier fixing device comprises a bottom plate, a mounting frame and a pressing mechanism, wherein the pressing mechanism comprises a pressing piece; the bottom plate is used for placing a carrier to be fixed, the mounting frame is mounted on the bottom plate, and the pressing mechanism is rotatably mounted on the top of the mounting frame and can perform pitching rotation; when the carrier is fixed, the pressing mechanism rotates towards the area where the carrier is placed on the bottom plate, and the pressing piece presses and fixes the carrier placed on the bottom plate.
5. The wafer inspection apparatus of claim 4 wherein the hold down mechanism further comprises a rotational mount, the mount top being provided with a mounting base, the rotational mount being rotatably mounted on the mounting base and capable of undergoing a pitching rotation; the pressing piece is arranged on one side, facing the bottom plate, of the rotating mounting piece when pressing the load;
the pressing piece is provided with a first positioning convex strip which is used for being embedded into a first groove at the top of the carrier to position the carrier when the pressing piece presses the fixed carrier;
The bottom plate is provided with a second positioning convex strip, and one side of the top edge of the mounting frame, which faces to the area where the carrier is placed on the bottom plate, is provided with a positioning groove; the second positioning convex strips are used for being clamped with the second grooves at the bottom of the carrier, and the positioning grooves are used for being clamped with the first positioning protrusions on one side, facing the mounting frame, of the carrier;
The positioning grooves are formed in the top edges of the mounting frames on two sides of the mounting base respectively.
6. The wafer inspection apparatus according to claim 5, wherein a first inspection sensor is mounted on a side of the rotational mounting member facing the base plate when the pressing mechanism is pressed against the carrier, the first inspection sensor being configured to detect whether the carrier is present on the base plate when the pressing mechanism is rotated to the pressed state;
One of the mounting base and the bottom plate is provided with a transmitting sensor, and the other is provided with a receiving sensor; the transmitting sensor and the receiving sensor are correspondingly arranged in the vertical direction and are used for detecting whether a loading object in the carrier is exposed out of the carrier or not;
One of the mounting base and the rotary mounting piece is provided with a magnet, and the other is provided with a magnetic attraction structure; the magnet and the magnetic attraction structure are correspondingly arranged, so that the compressing mechanism is magnetically attracted and positioned in the pressing state and the initial state.
7. A wafer inspection apparatus according to any one of claims 1 to 3, wherein the wafer edge inspection device comprises a rotary suction assembly, a lifting support assembly and an imaging inspection assembly; the rotary adsorption assembly comprises a rotary driving piece and an adsorption head, and the adsorption head is in transmission connection with the rotary driving piece; the lifting bearing assembly comprises a first lifting driving piece and a bearing piece, the bearing piece is arranged on the first lifting driving piece, and the adsorption head is positioned in the bearing piece; the imaging detection assembly is arranged at the side of the adsorption head and is used for imaging the edge of the wafer adsorbed on the adsorption head for detection;
the bearing piece is hollow in the middle and is in a frame shape with one side being provided with an opening, and the adsorption head is positioned in the hollow of the bearing piece.
8. A wafer inspection apparatus according to any one of claims 1 to 3, wherein the wafer surface inspection device comprises an inspection stage, a primary camera, a secondary camera and a laser focusing mechanism; the detection table is used for placing a wafer to be detected, and the main camera, the auxiliary camera and the laser focusing mechanism are arranged above the detection table; the detection precision of the auxiliary camera is larger than that of the main camera, the main camera is used for detecting flaws on the surface of the wafer, and the auxiliary camera is used for rechecking the flaws on the surface of the wafer detected by the main camera; the laser focusing mechanism is used for detecting the relative heights of the main camera and the auxiliary camera and the wafer so as to focus the main camera and the auxiliary camera.
9. The wafer inspection apparatus of claim 8, wherein a jacking assembly is mounted in the inspection station, the jacking assembly being capable of lifting and jacking a wafer to be placed on the inspection station from the inspection station and being capable of lowering and resetting to place the wafer on the inspection station;
The jacking assembly comprises a second lifting driving piece and a thimble, and the second lifting driving piece is connected with the thimble; the detection platform is provided with a first through hole corresponding to the thimble, and the second lifting driving piece drives the thimble to lift up from the first through hole or descend from the first through hole to reset.
10. The wafer inspection apparatus according to claim 8, wherein the inspection stage is provided with a micro-porous panel on a top surface thereof, and the inspection stage is connectable to a negative pressure generating device to cause the micro-porous panel to generate negative pressure to adsorb a wafer.
CN202322602124.4U 2023-09-22 2023-09-22 Wafer detection equipment Active CN221078431U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202322602124.4U CN221078431U (en) 2023-09-22 2023-09-22 Wafer detection equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202322602124.4U CN221078431U (en) 2023-09-22 2023-09-22 Wafer detection equipment

Publications (1)

Publication Number Publication Date
CN221078431U true CN221078431U (en) 2024-06-04

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Family Applications (1)

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CN202322602124.4U Active CN221078431U (en) 2023-09-22 2023-09-22 Wafer detection equipment

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