WO2019194322A1 - 電気・電子機器用のPd合金、Pd合金材、プローブピン及び製造方法 - Google Patents
電気・電子機器用のPd合金、Pd合金材、プローブピン及び製造方法 Download PDFInfo
- Publication number
- WO2019194322A1 WO2019194322A1 PCT/JP2019/018587 JP2019018587W WO2019194322A1 WO 2019194322 A1 WO2019194322 A1 WO 2019194322A1 JP 2019018587 W JP2019018587 W JP 2019018587W WO 2019194322 A1 WO2019194322 A1 WO 2019194322A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- mass
- alloy
- less
- electronic equipment
- probe pin
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/04—Alloys based on a platinum group metal
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
Definitions
- the present invention mainly relates to a Pd alloy used in electrical / electronic equipment typified by a probe pin for inspection of a semiconductor integrated circuit or the like.
- a probe card in which a plurality of probe pins are arranged has been used when inspecting electrical characteristics of electrical equipment such as a semiconductor integrated circuit.
- the electrical characteristics are inspected by bringing the tip of the probe pin attached to the probe card into contact with the inspection target portion of the electrical equipment. Therefore, the probe pin is required to have a low specific resistance and a good conductive material.
- the probe pin is used after being repeatedly contacted thousands of times or tens of thousands of times, it is required to have sufficient hardness so as not to be worn.
- the probe pin becomes too hard, the inspection object is damaged when the inspection object is an electrode plated with gold, copper wiring, or the like. Therefore, the probe pin is required to hardly damage the inspection object while suppressing wear.
- the probe pin may be used after being processed into various shapes, and is required to have excellent workability.
- an Ag—Pd—Cu alloy is widely used as a material for the probe pin.
- Pd 33 to 42 mass%, Cu 18 to 32 mass%, In0 is used for the purpose of providing an alloy material for probe pins that is excellent in plastic workability and has a sufficient effect of improving hardness by precipitation hardening. .5 to 2% by mass and Re 0.05 to 2% by mass, the balance contains Ag and inevitable impurities, swaging is applied to refine the crystal, and solution treatment, plastic working and precipitation hardening are applied to hardness
- Patent Document 2 discloses a 50.2 to 85 mass% Ag-based alloy having In or / and Sn of 0.2 to 3.3 for the purpose of providing a probe pin that can be used stably for a long period of time.
- 0 mass%, 8 to 35 mass% Pd, and 6 to 40 mass% Cu are made of an alloy consisting of a total of 100 mass% together with inevitable impurities, and the rolling rate or the cross-sectional reduction rate is 40% or higher.
- aging treatment is performed at 250 to 500 ° C. to obtain a Vickers hardness of 200 to 400, a difference in Vickers hardness before and after aging treatment of 10 or more, and a specific resistance of 15 ⁇ ⁇ cm or less.
- a probe pin is disclosed.
- the present invention has been made against the background of the above circumstances, and is a Pd alloy, Pd alloy material for electric and electronic equipment, which has a higher level than conventional and has balanced specific resistance, hardness, and workability, It is an object to provide a probe pin and a manufacturing method.
- the present inventors have provided the following Pd alloys, Pd alloy materials, probe pins, and manufacturing methods for electric and electronic devices.
- the Pd alloy for electric / electronic devices according to the present invention contains Pd as a main component and has the following composition.
- Pd alloy composition Pd is 50.1 mass% or more and 55.5 mass% or less. Ag is 6.3 mass% or more and 16.1 mass% or less. Cu is 30.0 mass% or more and 38.0 mass% or less. In is 0.5 mass% or more. 2.0% by mass or less
- the Pd alloy material for electrical / electronic equipment according to the present invention has a cross-sectional reduction rate of 50% or more and 95% or less compared to the above-described Pd alloy for electrical / electronic equipment. It is obtained by performing plastic working to form a plate or wire.
- Probe pin according to the present invention The probe pin according to the present invention is obtained by using the above-described Pd alloy material for electrical and electronic equipment.
- the Vickers hardness after heat treatment at a temperature of 350 ° C. or higher and 550 ° C. or lower is preferably 300 HV or higher and 480 HV or lower.
- the probe pin according to the present invention preferably has a specific resistance of 6.0 ⁇ ⁇ cm or more and 8.0 ⁇ ⁇ cm or less.
- the method for producing Pd alloy material for electric / electronic device according to the present invention is obtained by plasticizing Pd alloy for electric / electronic device having the above-mentioned Pd alloy composition. At the time of processing, it is processed into a plate shape or a line shape so that the cross-sectional reduction rate is 50% or more and 95% or less in the final plastic processing.
- the probe pin manufacturing method according to the present invention is a method of reducing the cross-section in the final plastic processing when plastic processing a Pd alloy for electrical and electronic equipment having the above-described Pd alloy composition.
- a Pd alloy material for electric and electronic equipment that is processed into a linear shape by processing so that the rate is 50% or more and 95% or less is used as a probe pin shape body, and the probe pin shape body is 350 ° C. or more and 550 ° C. or less.
- Heat treatment is performed at a temperature to adjust the Vickers hardness to 300 HV or more and 480 HV or less.
- the Pd alloy for electrical and electronic equipment according to the present invention has good workability, and is easy to refine crystal grains and toughen by plastic working. Therefore, when Pd alloy for electric / electronic equipment is subjected to certain strong processing and plastically deformed to form a plate material / wire material, etc., it becomes a Pd alloy material for electric / electronic equipment with good strength.
- this Pd alloy material for electric / electronic devices has sufficient hardness to be used as a probe pin.
- this Pd alloy material for electric / electronic devices can suppress the specific resistance as a property inherent to the Pd alloy for electric / electronic devices according to the present invention. Therefore, when used as a probe pin, the thermal load on the inspection object can be reduced. Therefore, even when the probe pin using the Pd alloy material for electric / electronic equipment according to the present invention is miniaturized, the reliability of the inspection can be improved and the life of the probe pin itself can be extended. it can.
- the Pd alloy for electrical / electronic equipment according to the present invention is characterized by having the following composition.
- Pd alloy composition Pd is 50.1 mass% or more and 55.5 mass% or less. Ag is 6.3 mass% or more and 16.1 mass% or less. Cu is 30.0 mass% or more and 38.0 mass% or less. In is 0.5 mass% or more. 2.0% by mass or less
- the present invention controls the amount of these alloy components in the Pd alloy, thereby increasing the hardness, the specific resistance, and the workability of the probe pin for inspection of an electrical device such as a semiconductor integrated circuit.
- Pd alloy suitable for electric and electronic equipment.
- these alloy components contained in the Pd alloy according to the present invention will be described separately for each element.
- the Pd alloy for electrical / electronic equipment according to the present invention is a Pd-based alloy. Therefore, Pd is an essential component and has the effect of reducing the specific resistance even when the hardness of the alloy is increased.
- the content of Pd in the Pd alloy for electric / electronic devices according to the present invention is preferably 50.1 mass% (40.0 atomic%) or more and 55.5 mass% (45.0 atomic%) or less.
- the specific resistance increases, which causes a decrease in inspection reliability when used for a probe pin.
- the Pd content exceeds 55.5% by mass (45.0 atomic%), the specific resistance decreases but the hardness also decreases. Therefore, when used as a probe pin, This is not preferable because of severe wear.
- the content of Ag as an alloy element has the effect of improving the corrosion resistance and decreasing the specific resistance as the hardness of the alloy increases.
- the content of Ag as the alloy element is preferably 6.3 mass% (5.0 atomic%) or more and 16.1 mass% (13.0 atomic%) or less.
- the corrosion resistance and the hardness are reduced, which is not preferable.
- the Vickers hardness becomes less than 300 HV. Therefore, there is a problem that hardness is insufficient for probe pin use and wear resistance is lowered.
- the specific resistance of the Pd alloy can be suppressed to 8.0 ⁇ ⁇ cm or less, which is preferable.
- Cu as an alloy element is a component necessary for precipitation hardening, and has the effect of decreasing the specific resistance as the hardness of the alloy increases.
- the content of Cu as the alloy element is preferably 30.0% by mass (45.0 atomic%) or more and 38.0% by mass (50.0 atomic%) or less.
- the specific resistance increases, which is not preferable because the reliability of inspection is lowered as a probe pin application.
- the content of Cu as an alloy element exceeds 38.0 mass% (50.0 atomic%), the specific resistance decreases but the hardness also decreases. This is not preferable because the wear at the place where it is used becomes violent and it tends to oxidize, leading to a decrease in corrosion resistance.
- In is dissolved in the matrix of Pd, and has the effect of improving the hardness after plastic working and improving the wear resistance of the alloy.
- the content of In as an alloy element is preferably 0.5% by mass (0.35 atomic%) or more and 2.0% by mass (1.55 atomic%) or less.
- the content of In as the alloy element is less than 0.5 mass% (0.35 atomic%), the hardness is reduced, which is not preferable. In this case, even if the amount of the additive element is adjusted, it is difficult to obtain a Vickers hardness of 300 HV or higher even if the obtained Pd alloy is processed to a final cross-section reduction rate of about 50%.
- a melting method As a method for preparing the Pd alloy for electric / electronic equipment described above, it is preferable to employ a melting method.
- This melting method is not particularly limited as long as it is at least in the state of an alloy ingot. Therefore, any melting method established now and in the future such as vacuum melting method, gas melting method, electric furnace melting method, high frequency melting method, continuous casting method, zone melting method, etc. can be adopted.
- the Pd alloy for electrical / electronic devices according to the present invention contains at least one selected from the group of Ir, Rh, Co, Ni, Zn, Sn, Au, and Pt as an additive element and unavoidable impurities in total of 0. .1% by mass or more and 2.0% by mass or less may be included.
- the unavoidable impurity means an impurity element that is inevitably mixed in the manufacturing process, and refers to an element of 0.01% by mass or less.
- the Pd alloy for electrical / electronic equipment according to the present invention having the composition described above may be made into a plate-like or linear Pd alloy material for electrical / electronic equipment after being melted at a predetermined composition and then subjected to plastic working. preferable. By setting it as such a shape, it can adjust and use for the intensity
- a method for manufacturing Pd alloy materials for electrical and electronic equipment will be described.
- a Pd alloy for electrical / electronic equipment having the above-mentioned composition is plastically processed, it is processed so that the cross-section reduction rate is 50% or more and 95% or less in the final plastic processing, and is formed into a plate or wire It is characterized by the shape.
- the cross-section reduction rate is the cross-section reduction rate in the final stage of processing when there are a plurality of plastic processing stages.
- the higher the cross-section reduction rate the more the hardness can be improved.
- the electrical resistance is low and the total balance is excellent in both hardness and workability.
- the probe pin according to the present invention is obtained by using the above-described Pd alloy material for electrical / electronic equipment. That is, it is characterized by using a Pd alloy material for electric / electronic devices obtained by performing plastic working on the Pd alloy for electric / electronic devices so that the cross-sectional reduction rate is 50% or more and 95% or less.
- a probe pin having a low specific resistance and good hardness can be obtained.
- the probe pin according to the present invention preferably has a Vickers hardness of 300 HV or more and 480 HV or less.
- the probe pin manufacturing method uses a Pd alloy for electric / electronic devices as a probe pin-shaped body using a Pd alloy material for electric / electronic devices obtained by plastic processing as described above.
- the shaped body is heat-treated at a temperature of 350 ° C. or higher and 550 ° C. or lower to adjust the Vickers hardness to 300 HV or higher and 480 HV or lower.
- the Vickers hardness is set to 300 HV or more and 480 HV” is because the hardness is required for the probe pin in the market. If the probe pin has a hardness in this range, a change in resistance value due to wear can be reduced, and inspection accuracy can be improved and inspection yield can be improved.
- the heat treatment is performed at a temperature of 350 ° C. or higher and 550 ° C. or lower in order to improve hardness by precipitation strengthening.
- the precipitation heat treatment temperature is less than 350 ° C., the hardness cannot be sufficiently improved, and if it exceeds 550 ° C., a tendency to soften appears.
- the precipitation heat treatment time can be appropriately set to a time during which precipitation hardening is sufficiently caused in the material.
- the probe pin which concerns on this invention can exhibit the performance whose specific resistance is 6.0 microhm * cm or more and 8.0 microohm * cm or less by employ
- the specific resistance is 6.0 ⁇ ⁇ cm or more and 8.0 ⁇ ⁇ cm or less, it can be suitably used as a material for a probe pin used for inspection of electrical equipment such as a semiconductor integrated circuit.
- Example 1 Preparation of Pd alloy for electrical / electronic equipment: In Example 1, an Ag—Pd—Cu—In based alloy ingot ( ⁇ 20 mm) composed of four elements of Ag, Pd, Cu, and In was produced by vacuum melting.
- Preparation of Pd alloy material for electrical / electronic equipment After removing melted defects such as hot water from the ingot and solution treatment (800 ° C), plastic working (swaging, grooving, wire drawing) Processing) and solution treatment (800 ° C.) are repeated, and the final cross-section reduction rate (the cross-section reduction rate at the end of the subsequent wire drawing processing based on immediately after the final solution treatment) is set to 50% to 95%, A Pd alloy wire was obtained.
- Table 1 shows the compositions of the samples of Examples 1 (Examples 1-1 to 1-4).
- Example 1 the obtained Pd alloy wire was subjected to Vickers hardness measurement after precipitation hardening.
- the conditions for precipitation hardening were 350 ° C. or higher and 550 ° C. or lower in an H 2 + N 2 mixed atmosphere.
- the Vickers hardness was measured by cutting the Pd alloy wire into a length of 10 mm. And after grind
- Table 1 shows the average value of the results of measuring five Vickers hardnesses for each sample.
- the specific resistance measurement was performed about the obtained Pd alloy wire after precipitation hardening.
- the conditions for precipitation hardening were 350 ° C. or higher and 550 ° C. or lower in an H 2 + N 2 mixed atmosphere.
- the Pd alloy wire was cut into a length of 1000 mm to prepare a sample.
- the specific resistance was measured by the 4 terminal method using the resistance meter (RM3544 by Hioki Electric Co., Ltd.). Table 1 shows the average value of the results of measuring the specific resistance at three locations for each sample.
- the Pd alloy wire was cut into a length of 1000 mm to prepare a sample. And about this sample, the presence or absence of the crack in the case of performing plastic working at 50% or more and 95% or less was confirmed. Table 1 shows a case where cracks cannot be confirmed as a pass “ ⁇ ” and a case where cracks can be confirmed as a fail “x”.
- Example 2 Preparation of Pd alloy for electric / electronic equipment: In Example 2, an ingot of Ag—Pd—Cu—In alloy composed of four elements of Ag, Pd, Cu and In (thickness 10 mm ⁇ length 50 mm) is obtained by vacuum melting. X width 20 mm).
- Preparation of Pd alloy material for electrical / electronic equipment After removing melt defects such as hot water from the ingot and performing solution treatment (800 ° C.), the cross-sectional reduction rate is 50% or more with respect to the ingot. Rolling was performed until it became 95% or less to obtain a Pd alloy sheet. Table 2 shows the compositions of the samples of Examples 2 (Examples 2-1 to 2-4).
- Example 2 the obtained Pd alloy sheet was checked for Vickers hardness, specific resistance, and workability in the same manner as in Example 1. Since the conditions for implementing these are the same as those in the first embodiment, the description thereof is omitted here. Table 2 shows the measurement results of the samples of Examples 2 (Examples 2-1 to 2-4).
- Comparative Example 1 This Comparative Example 1 is shown for comparison with Example 1 described above.
- Comparative Example 1 the same confirmation as in Example 1 was performed for a Pd alloy having a composition not satisfying the conditions defined in the present invention.
- the conditions for confirming the first comparative example are the same as those in the first example, and thus the description thereof is omitted here.
- Table 1 shows the measurement results of the samples of Comparative Example 1 (Comparative 1-1 to 1-4) together with Examples (in Table 1, the portions that do not satisfy the composition conditions defined in the present invention are surrounded by bold lines). ).
- Comparative Example 2 This Comparative Example 2 is shown for comparison with Example 2 described above.
- Comparative Example 2 the same confirmation as in Example 2 was performed for a Pd alloy having a composition not satisfying the conditions defined in the present invention.
- the conditions for confirming this comparative example 2 are the same as those in the second embodiment, and the description thereof is omitted here.
- Table 2 shows the measurement results of the sample of Comparative Example 2 (Comparative 2-1 to 2-4) together with the examples (in Table 2, the portions that do not satisfy the composition conditions defined in the present invention are surrounded by bold lines). ).
- Example 1 [Contrast between Example 1 and Comparative Example 1]
- Example 1 and Comparative Example 1 are compared.
- the samples of Comparative 1-1 and 1-2 in Vickers hardness have a Vickers hardness after plastic working of less than 300 HV. It became less than 300HV.
- the samples of Comparative 1-3 and 1-4 were over 500 HV by the precipitation heat treatment. Further, in the specific resistance, the sample of Comparative 1-1 is less than 6.0 ⁇ ⁇ cm by the precipitation heat treatment, and the samples of Comparative 1-2 to 1-4 are more than 8.0 ⁇ ⁇ cm by the precipitation heat treatment. It became. In terms of workability, cracks were confirmed for the samples of Comparative 1-3.
- Example 2 and Comparative Example 2 are compared.
- Example 2-2 has a Vickers hardness after plastic working of less than 300 HV, but all of the samples of Examples 2-1 to 2-4 were subjected to precipitation heat treatment. It exceeded 380 HV and met the conditions (300 HV or more and 480 HV or less) required for probe pins. Further, in the specific resistance, all of the samples of Examples 2-1 to 2-4 became 8.0 ⁇ ⁇ cm or less by the precipitation heat treatment, and the conditions required for the probe pin (6.0 ⁇ ⁇ cm or more and 8.0 ⁇ ⁇ cm or less) ). In terms of workability, no cracks could be confirmed for the samples of Examples 2-1 to 2-4.
- the samples of Comparatives 2-1 and 2-2 in the Vickers hardness have Vickers hardness after plastic working of less than 300 HV. It became less than 300HV. Furthermore, the samples of Comparative 2-3 and 2-4 exceeded 500 HV by the precipitation heat treatment. Further, in the specific resistance, the sample of Comparative 2-1 is less than 6.0 ⁇ ⁇ cm by the precipitation heat treatment, and the sample of Comparative 2-2 and 2-3 is more than 8.0 ⁇ ⁇ cm by the precipitation heat treatment. It became. In terms of workability, cracks were confirmed for the sample of Comparative 2-3.
- the Pd alloy for electrical and electronic equipment according to the present invention has high hardness, low specific resistance, excellent workability, and excellent total balance, and is therefore used as a probe pin for testing semiconductor integrated circuits and the like. It is particularly useful in cases.
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
Pdが50.1質量%以上55.5質量%以下
Agが6.3質量%以上16.1質量%以下
Cuが30.0質量%以上38.0質量%以下
Inが0.5質量%以上2.0質量%以下
本発明に係る電気・電子機器用Pd合金は、以下の組成を備えることを特徴とする。
Pdが50.1質量%以上55.5質量%以下
Agが6.3質量%以上16.1質量%以下
Cuが30.0質量%以上38.0質量%以下
Inが0.5質量%以上2.0質量%以下
以上に述べた組成の本発明に係る電気・電子機器用Pd合金は、所定組成にて溶解後、塑性加工を施して、板状又は線状の電気・電子機器用Pd合金材とすることが好ましい。このような形状とすることで、電気・電子機器の種類に応じた強度に調整して用いることができる。そのため、加工材として、比抵抗、硬さ、加工性のトータルバランスに優れた状態にすることができ、電気・電子機器用途として適したものとなる。
本発明に係るプローブピンは、上述の電気・電子機器用Pd合金材を用いて得られるものである。即ち、電気・電子機器用Pd合金に対し、断面減少率が50%以上95%以下となるように塑性加工を施して得られる電気・電子機器用Pd合金材を用いることを特徴とする。本発明に係るプローブピンの製造に、この電気・電子機器用Pd合金材を用いることで、比抵抗が低く、良好な硬さを備えるプローブピンを得ることができる。
本比較例1は、上述した実施例1との対比用として示す。本比較例1では、本発明に規定する条件を満たしていない組成のPd合金について、実施例1と同じ確認を行った。本比較例1の確認を行う際の条件に関しても、実施例1と同じ条件としたため、ここでの説明は省略する。表1には、本比較例1の試料(比較1-1~1-4)の測定結果を実施例と併せて示す(表1中本発明に規定する組成条件を満たさない箇所を太線で囲んで示す)。
本比較例2は、上述した実施例2との対比用として示す。本比較例2では、本発明に規定する条件を満たしていない組成のPd合金について、実施例2と同じ確認を行った。本比較例2の確認を行う際の条件に関しても、実施例2と同じ条件としたため、ここでの説明は省略する。表2には、本比較例2の試料(比較2-1~2-4)の測定結果を実施例と併せて示す(表2中本発明に規定する組成条件を満たさない箇所を太線で囲んで示す)。
以下、表1を参照しつつ、実施例1と比較例1との対比を行う。
以下、表2を参照しつつ、実施例2と比較例2との対比を行う。
表1,2に示す結果より、比較試料に比べ実施試料の方が総じて優れた結果が得られた。これら結果より、本発明で規定する条件の組成を備えたPd合金によれば、高いレベルで比抵抗、硬さ、加工性をバランスさせたPd合金を得られることが分かった。
Claims (7)
- Pdを主要成分として含む電気・電子機器用Pd合金であって、
Pdが50.1質量%以上55.5質量%以下、
Agが6.3質量%以上16.1質量%以下、
Cuが30.0質量%以上38.0質量%以下、
Inが0.5質量%以上2.0質量%以下の組成を備えることを特徴とする電気・電子機器用Pd合金。 - 請求項1に記載の電気・電子機器用Pd合金を、断面減少率が50%以上95%以下の塑性加工により板状又は線状としたことを特徴とする電気・電子機器用Pd合金材。
- 請求項2に記載の電気・電子機器用Pd合金材を用いて得られることを特徴とするプローブピン。
- 350℃以上550℃以下の温度で熱処理を行った後のビッカース硬さが300HV以上480HV以下である請求項3に記載のプローブピン。
- 比抵抗が6.0μΩ・cm以上8.0μΩ・cm以下である請求項3又は請求項4に記載のプローブピン。
- 電気・電子機器用Pd合金材の製造方法であって、
Pdが50.1質量%以上55.5質量%以下、
Agが6.3質量%以上16.1質量%以下、
Cuが30.0質量%以上38.0質量%以下、
Inが0.5質量%以上2.0質量%以下の組成を備える電気・電子機器用Pd合金を、塑性加工する際に、最終の塑性加工において断面減少率が50%以上95%以下となるように加工して板状又は線状とすることを特徴とする電気・電子機器用Pd合金材の製造方法。 - 電気・電子機器用Pd合金を用いたプローブピンの製造方法であって、
Pdが50.1質量%以上55.5質量%以下、
Agが6.3質量%以上16.1質量%以下、
Cuが30.0質量%以上38.0質量%以下、
Inが0.5質量%以上2.0質量%以下の組成を備える電気・電子機器用Pd合金を、塑性加工する際に、最終の塑性加工において断面減少率が50%以上95%以下となるように加工して線状とした電気・電子機器用Pd合金材を用いてプローブピン形状体とし、
当該プローブピン形状体を、350℃以上550℃以下の温度で熱処理を行って、ビッカース硬さが300HV以上480HV以下に調整することを特徴とするプローブピンの製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201980060676.0A CN112739836A (zh) | 2018-11-06 | 2019-05-09 | 电气电子设备用的Pd合金、Pd合金材料、探针和制造方法 |
US17/291,023 US11920227B2 (en) | 2018-11-06 | 2019-05-09 | PD alloy, PD alloy material and probe pin for electric and electronic devices, and methods for manufacturing the same |
KR1020217013195A KR102349939B1 (ko) | 2018-11-06 | 2019-05-09 | 전기·전자 기기용 Pd 합금, Pd 합금재, 프로브 핀 및 제조 방법 |
JP2019556286A JP6734486B2 (ja) | 2018-11-06 | 2019-05-09 | 電気・電子機器用のPd合金、Pd合金材、プローブピン及び製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018208822 | 2018-11-06 | ||
JP2018-208822 | 2018-11-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2019194322A1 true WO2019194322A1 (ja) | 2019-10-10 |
Family
ID=68100749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2019/018587 WO2019194322A1 (ja) | 2018-11-06 | 2019-05-09 | 電気・電子機器用のPd合金、Pd合金材、プローブピン及び製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11920227B2 (ja) |
JP (1) | JP6734486B2 (ja) |
KR (1) | KR102349939B1 (ja) |
CN (1) | CN112739836A (ja) |
TW (1) | TWI722435B (ja) |
WO (1) | WO2019194322A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114107721A (zh) * | 2020-09-01 | 2022-03-01 | 贺利氏德国有限两合公司 | 钯-铜-银-钌合金 |
JP7072126B1 (ja) | 2022-02-10 | 2022-05-19 | 田中貴金属工業株式会社 | Ag-Pd-Cu系合金からなるプローブピン用材料 |
CN117026055A (zh) * | 2023-10-09 | 2023-11-10 | 浙江金连接科技股份有限公司 | 一种半导体芯片测试探针用钯合金及其制备方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP4234733A1 (de) * | 2022-02-28 | 2023-08-30 | Heraeus Deutschland GmbH & Co. KG | Palladium-kupfer-silber-legeriung |
TWI797023B (zh) * | 2022-06-14 | 2023-03-21 | 大亞電線電纜股份有限公司 | 鈀銀銅合金線材及其製法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012242184A (ja) * | 2011-05-17 | 2012-12-10 | Ishifuku Metal Ind Co Ltd | プローブピン用材料、プローブピン及びその製造方法 |
WO2013099682A1 (ja) * | 2011-12-27 | 2013-07-04 | 株式会社徳力本店 | 電気・電子機器用のPd合金 |
US20170218481A1 (en) * | 2016-01-29 | 2017-08-03 | Deringer-Ney, Inc. | Palladium-Based Alloys |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1168130A (en) * | 1965-10-26 | 1969-10-22 | Int Nickel Ltd | Metallic Articles Formed from Cores and Coatings Separated by Alloy Barrier Layers |
US7558519B2 (en) * | 2006-03-22 | 2009-07-07 | Canon Kabushiki Kaisha | Endless metallic belt and fixing belt and heat fixing assembly making use of the same |
JP5657881B2 (ja) * | 2009-12-09 | 2015-01-21 | 株式会社徳力本店 | プローブピン用材料 |
WO2014021465A1 (ja) * | 2012-08-03 | 2014-02-06 | 山本貴金属地金株式会社 | 合金材料、コンタクトプローブおよび接続端子 |
JP6074244B2 (ja) | 2012-12-06 | 2017-02-01 | 石福金属興業株式会社 | Ag基合金からなるプローブピン用材料、プローブピン、プローブピンの製造方法 |
JP2017025354A (ja) | 2015-07-16 | 2017-02-02 | 株式会社徳力本店 | プローブピン用合金材およびその製造方法 |
JP6647075B2 (ja) * | 2016-02-19 | 2020-02-14 | 日本発條株式会社 | 合金材料、コンタクトプローブおよび接続端子 |
-
2019
- 2019-05-09 US US17/291,023 patent/US11920227B2/en active Active
- 2019-05-09 WO PCT/JP2019/018587 patent/WO2019194322A1/ja active Application Filing
- 2019-05-09 JP JP2019556286A patent/JP6734486B2/ja active Active
- 2019-05-09 KR KR1020217013195A patent/KR102349939B1/ko active IP Right Grant
- 2019-05-09 CN CN201980060676.0A patent/CN112739836A/zh active Pending
- 2019-05-20 TW TW108117319A patent/TWI722435B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012242184A (ja) * | 2011-05-17 | 2012-12-10 | Ishifuku Metal Ind Co Ltd | プローブピン用材料、プローブピン及びその製造方法 |
WO2013099682A1 (ja) * | 2011-12-27 | 2013-07-04 | 株式会社徳力本店 | 電気・電子機器用のPd合金 |
US20170218481A1 (en) * | 2016-01-29 | 2017-08-03 | Deringer-Ney, Inc. | Palladium-Based Alloys |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102565561B1 (ko) | 2020-09-01 | 2023-08-09 | 헤레우스 도이칠란트 게엠베하 운트 코. 카게 | 팔라듐-구리-은-루테늄 합금 |
EP3960890A1 (de) * | 2020-09-01 | 2022-03-02 | Heraeus Deutschland GmbH & Co. KG | Palladium-kupfer-silber-ruthenium-legierung |
KR20220029533A (ko) * | 2020-09-01 | 2022-03-08 | 헤레우스 도이칠란트 게엠베하 운트 코. 카게 | 팔라듐-구리-은-루테늄 합금 |
JP2022041921A (ja) * | 2020-09-01 | 2022-03-11 | ヘレウス ドイチェラント ゲーエムベーハー ウント カンパニー カーゲー | パラジウム-銅-銀-ルテニウム合金 |
US11746397B2 (en) | 2020-09-01 | 2023-09-05 | Heraeus Deutschland GmbH & Co. KG | Palladium-copper-silver-ruthenium alloy |
CN114107721A (zh) * | 2020-09-01 | 2022-03-01 | 贺利氏德国有限两合公司 | 钯-铜-银-钌合金 |
JP7072126B1 (ja) | 2022-02-10 | 2022-05-19 | 田中貴金属工業株式会社 | Ag-Pd-Cu系合金からなるプローブピン用材料 |
KR102536235B1 (ko) | 2022-02-10 | 2023-05-26 | 다나카 기킨조쿠 고교 가부시키가이샤 | Ag-Pd-Cu계 합금으로 이루어지는 프로브 핀용 재료 |
CN116577532A (zh) * | 2022-02-10 | 2023-08-11 | 田中贵金属工业株式会社 | 由Ag-Pd-Cu系合金构成的探针针用材料 |
JP2023116833A (ja) * | 2022-02-10 | 2023-08-23 | 田中貴金属工業株式会社 | Ag-Pd-Cu系合金からなるプローブピン用材料 |
EP4227426A1 (en) | 2022-02-10 | 2023-08-16 | Tanaka Kikinzoku Kogyo K.K. | Probe pin material including ag-pd-cu-based alloy |
US11807925B2 (en) | 2022-02-10 | 2023-11-07 | Tanaka Kikinzoku Kogyo K.K. | Probe pin material including Ag—Pd—Cu-based alloy |
CN117026055A (zh) * | 2023-10-09 | 2023-11-10 | 浙江金连接科技股份有限公司 | 一种半导体芯片测试探针用钯合金及其制备方法 |
CN117026055B (zh) * | 2023-10-09 | 2024-01-12 | 浙江金连接科技股份有限公司 | 一种半导体芯片测试探针用钯合金及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI722435B (zh) | 2021-03-21 |
KR20210055099A (ko) | 2021-05-14 |
JP6734486B2 (ja) | 2020-08-05 |
JPWO2019194322A1 (ja) | 2020-04-30 |
CN112739836A (zh) | 2021-04-30 |
US20210310103A1 (en) | 2021-10-07 |
US11920227B2 (en) | 2024-03-05 |
KR102349939B1 (ko) | 2022-01-11 |
TW201940708A (zh) | 2019-10-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2019194322A1 (ja) | 電気・電子機器用のPd合金、Pd合金材、プローブピン及び製造方法 | |
TWI425101B (zh) | Cu-Ni-Si alloy excellent in bending workability | |
KR101207250B1 (ko) | 도전성과 굽힘성을 개선한 Cu-Ni-Si-Mg계 합금 | |
JP4213761B1 (ja) | 硬度、加工性、並びに、防汚特性に優れたイリジウム合金 | |
KR101573163B1 (ko) | Cu-Zn-Sn-Ni-P 계 합금 | |
JP2017025354A (ja) | プローブピン用合金材およびその製造方法 | |
JP2004307905A (ja) | Cu合金およびその製造方法 | |
JP2001049369A (ja) | 電子材料用銅合金及びその製造方法 | |
JP6074244B2 (ja) | Ag基合金からなるプローブピン用材料、プローブピン、プローブピンの製造方法 | |
JP7141098B2 (ja) | プローブピン用材料およびプローブピン | |
JP6228725B2 (ja) | Cu−Co−Si系合金及びその製造方法 | |
JP2016069713A (ja) | 銅合金材、コネクタ端子、及び銅合金材の製造方法 | |
JP2013231224A (ja) | 曲げ加工性に優れた電気・電子部品用銅合金材 | |
JP7260910B2 (ja) | プローブピン用材料およびプローブピン | |
JP2009108392A (ja) | 曲げ加工性に優れる高強度洋白およびその製造方法 | |
JP4175920B2 (ja) | 高力銅合金 | |
JP6654608B2 (ja) | 電気・電子機器用Cu合金及びそれを用いたプローブピン | |
JP6850365B2 (ja) | 析出硬化型Ag−Pd−Cu−In−B系合金 | |
JP2012246530A (ja) | 銅合金展伸材 | |
JP7429011B2 (ja) | プローブピン用材料およびプローブピン | |
JP4447300B2 (ja) | 曲げ性に優れるりん青銅条 | |
JP2006188722A (ja) | 黄銅材料の製造法および黄銅材料 | |
JP2020002404A (ja) | プローブピン用材料およびプローブピン | |
JP6372952B2 (ja) | Pt基合金で構成されるプローブピン用材料、プローブピンの製造方法 | |
JP2005187885A (ja) | 疲労特性に優れたチタン銅条 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ENP | Entry into the national phase |
Ref document number: 2019556286 Country of ref document: JP Kind code of ref document: A |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 19780657 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 20217013195 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 19780657 Country of ref document: EP Kind code of ref document: A1 |