WO2019137192A1 - 发声装置 - Google Patents

发声装置 Download PDF

Info

Publication number
WO2019137192A1
WO2019137192A1 PCT/CN2018/123195 CN2018123195W WO2019137192A1 WO 2019137192 A1 WO2019137192 A1 WO 2019137192A1 CN 2018123195 W CN2018123195 W CN 2018123195W WO 2019137192 A1 WO2019137192 A1 WO 2019137192A1
Authority
WO
WIPO (PCT)
Prior art keywords
magnetic circuit
sound
hole
lower cover
housing
Prior art date
Application number
PCT/CN2018/123195
Other languages
English (en)
French (fr)
Inventor
赵国栋
郑泽东
李培俊
姬雅倩
Original Assignee
歌尔股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 歌尔股份有限公司 filed Critical 歌尔股份有限公司
Priority to US16/961,357 priority Critical patent/US11178494B2/en
Publication of WO2019137192A1 publication Critical patent/WO2019137192A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2811—Enclosures comprising vibrating or resonating arrangements for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/025—Magnetic circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2838—Enclosures comprising vibrating or resonating arrangements of the bandpass type
    • H04R1/2846—Vents, i.e. ports, e.g. shape thereof or tuning thereof with damping material
    • H04R1/2849—Vents, i.e. ports, e.g. shape thereof or tuning thereof with damping material for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H04R1/2876—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding
    • H04R1/288—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/11—Aspects regarding the frame of loudspeaker transducers

Definitions

  • the invention belongs to the technical field of electroacoustic conversion devices, and in particular, the invention relates to a sounding device.
  • Sounding devices are important components in electronic products such as mobile phones, which are used to convert electrical signals into acoustic signals.
  • the development trend of electronic products such as mobile phones is getting thinner and thinner, and in order to realize more functions, more and more components in electronic products are bound to make space for sounding devices smaller and smaller, and electronic products are coming.
  • the more attention is paid to the user's music experience, the sounding device is required to have better sound quality.
  • the sounding device of the prior art installs the sounding unit in a module housing having a volume, and the sounding unit comprises a single housing and a magnetic circuit system housed in the single housing and The vibration system forms a rear cavity between the sounding unit and the module housing.
  • the volume of the sounding device of the existing structure is made small, the volume of the rear cavity of the sounding device is inevitably reduced. Therefore, it is necessary to provide a sounding device of a novel structure, which has a small volume and can have better performance to meet the development needs of electronic products.
  • a sounding device includes a casing in which a sounding unit is mounted, a sounding unit and the casing form a closed rear cavity, and the sounding unit is provided to communicate with the rear cavity.
  • a sound hole unit the sounding unit includes a magnetic circuit system, wherein the magnetic circuit system is provided with a expansion cavity from a bottom surface, and the expansion cavity serves as a part of the rear cavity to increase the volume of the rear cavity.
  • the rear sound hole is provided at least at a bottom position or a side position of the sounding unit.
  • the magnetic circuit system includes a magnetic yoke and a magnetic circuit portion mounted on an upper surface of the magnetic yoke; a central portion of the bottom surface of the magnetic yoke is upwardly provided with a first hole, and the magnetic circuit portion is opened And a recessed groove communicating with the first hole; the first hole and the recessed groove together form the expansion cavity.
  • the magnetic circuit portion includes a central magnetic circuit portion and a side magnetic circuit portion, the central magnetic circuit portion including a central magnet and a central magnetic conductive plate disposed above the central magnet;
  • the recessed groove is a blind hole formed in the center magnet, or the recessed groove is formed by a central hole of a magnet penetrating the central magnet.
  • the ratio of the opening volume of the center magnet to the volume of the central magnet before the opening is less than or equal to 35%.
  • the central magnetic conductive plate is provided with a central hole of a magnetic conductive plate communicating with the central hole of the magnet, and the central hole of the magnetic conductive plate communicates with the inner space of the rear cavity and the sounding unit as a The sound hole is described.
  • a ventilation barrier is disposed on the rear sound hole of the sounding unit
  • the rear cavity is filled with a sound absorbing material
  • the bottom surface of the central magnetic conductive plate is provided with a mounting groove recessed away from the guiding yoke, and the gas permeable spacer is installed in the mounting groove.
  • a gas permeable spacer is disposed on the rear sound hole of the sounding unit
  • the rear cavity is filled with a sound absorbing material.
  • the housing is a straight-type structure with open ends;
  • the sounding unit further includes a vibration system including a diaphragm and a voice coil fixed under the diaphragm, the diaphragm being fixed on an end surface of the first end of the housing;
  • the magnetic circuit system is located below the vibration system and is fixed in the housing;
  • the housing includes a first portion corresponding to the vibration system and the magnetic circuit system, and a second portion integrally extending downwardly from the first portion beyond the bottom surface of the magnetic circuit system;
  • a lower cover is mounted at the second end opening of the housing, and the rear chamber is formed between the second portion of the housing, the bottom surface of the magnetic circuit system and the lower cover.
  • an outer side of the magnetic circuit system is disposed adjacent to an inner wall of the housing.
  • the inner wall of the first end of the housing is provided with a convex edge extending toward a central direction of the housing, and an upper edge of the magnetic circuit system is abutted and fixed on a lower surface of the protruding edge.
  • the housing has a rectangular structure.
  • the lower cover is provided with a filling hole for filling the sound absorbing material, and the filling hole is covered with a cover sheet.
  • the cover sheet is provided with a venting microhole that allows air to pass through and does not allow the sound absorbing material to pass through;
  • the cover sheet is provided with a leak hole, and the leak hole is covered with a first damping net that allows air to pass through and does not allow the sound absorbing material to pass.
  • the lower cover is made of metal.
  • the lower cover is in a flat shape; or the lower cover is a bowl-shaped structure having a bottom wall and a side wall.
  • the lower cover plate is adhered to the end surface of the second end opening of the housing by a glue layer;
  • the inner side of the end surface of the second end opening of the housing has a recessed second step end surface, the second step end surface has a top surface and a side surface for mounting the lower cover;
  • the lower cover is a flat plate shape, an edge of the lower cover plate is provided with a recessed portion that is recessed toward the rear cavity direction, the recessed portion abutting a top surface of the second step end surface and a side surface of the second step end surface Forming a first adhesive tank, wherein the lower cover is fixed on the casing in the first adhesive tank; or the lower cover is a bowl having a bottom wall and a side wall a structure, the end of the side wall of the lower cover is bent outwardly to be provided with a mounting edge, the mounting edge abutting the top surface of the second step end surface and the side surface of the second step end surface Forming a second adhesive tank, wherein the lower cover is fixed on the casing by applying glue in the second adhesive tank;
  • the periphery of the lower cover is injection molded with a plastic edge that is ultrasonically welded to the second end opening of the housing.
  • the diaphragm comprises a central portion and a folding portion disposed around the central portion, a venting hole is formed in the central portion, and the venting hole is covered with a second damping net, the second The damping net is made of a waterproof and breathable material.
  • the second damping net is made of a sound-impermeable material.
  • the volume of the rear cavity can be effectively increased, which contributes to miniaturization of the product and can improve the acoustic performance of the sounding device;
  • the thickness of the magnet in the magnetic circuit system can be ensured to avoid the influence of high temperature on the magnetism of the magnet.
  • FIG. 1 is a schematic exploded view of a sound emitting device according to an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view of a sound emitting device according to an embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of a specific implementation of a yoke in a sound emitting device according to an embodiment of the present invention
  • FIG. 4 is a schematic cross-sectional view of a sound emitting device according to an embodiment of the present invention.
  • Figure 5 is a partial enlarged view of Figure 2;
  • FIG. 6 is a schematic diagram of a top surface angle of a sound emitting device according to an embodiment of the present invention.
  • FIG. 7 is a schematic diagram showing a bottom angle of a sound emitting device according to an embodiment of the present invention.
  • FIG. 8 is a schematic diagram of a connection structure of a lower cover and a casing in a sound emitting device according to an embodiment of the present invention.
  • FIG. 9 is a schematic view showing another connection structure of a lower cover and a casing in a sound emitting device according to an embodiment of the present invention.
  • Figure 10 is a partial enlarged view of Figure 9;
  • FIG. 11 is another schematic structural view of a lower cover and a casing of a sound emitting device according to an embodiment of the present invention.
  • FIG. 12 is still another schematic structural view of a lower cover and a casing of a sound emitting device according to an embodiment of the present invention.
  • FIG. 13 is a schematic structural view of a diaphragm system opening in a sound emitting device according to an embodiment of the present invention.
  • FIG. 14 is a schematic structural diagram of a diaphragm provided by an embodiment of the present invention.
  • FIG. 15 is a schematic structural view of a diaphragm and a reinforcing portion according to an embodiment of the present invention.
  • FIG. 1 , FIG. 2 and FIG. 3 are schematic diagrams showing the structure of a sound emitting device according to an embodiment of the present invention.
  • the sounding device includes a housing 10 in which a sounding unit is mounted, and a sounding unit 60 is formed between the sounding unit and the housing 10, The sounding unit is provided with a rear sound hole 40 that communicates with the rear chamber 60.
  • the sounding unit includes a magnetic circuit system 30.
  • the magnetic circuit system 30 is provided with a expansion chamber 200 from a bottom surface thereof, and the expansion chamber 200 is a part of the rear chamber 60. To increase the volume of the rear chamber 60.
  • the volume of the rear cavity can be effectively increased, and the acoustic performance of the sounding device can be improved; and, while increasing the volume of the rear cavity, the volume can be ensured.
  • the thickness of the magnet in the magnetic circuit system to avoid the influence of high temperature on the magnetism of the magnet.
  • a first rear acoustic aperture 401 is provided at least at a bottom position (as shown in FIG. 1) or a lateral position of the sounding unit.
  • the magnetic circuit system 30 includes a yoke 31 and a magnetic circuit portion mounted on an upper surface of the yoke 31; a bottom center position of the yoke 31 A first hole is opened upwardly, and the magnetic circuit portion is provided with a recessed groove communicating with the first hole; the first hole and the recessed groove jointly form the expansion cavity 200.
  • the magnetic circuit portion includes a central magnetic circuit portion 301 and a side magnetic circuit portion 302, the central magnetic circuit portion 301 including a center magnet 3012 and a central magnetic conductive plate 3011 above the central magnet 3012; the concave groove is a blind hole formed in the central magnet 3012, or the concave groove is penetrated through a central hole of the magnet opened on the central magnet 3012 Composition.
  • the central region of the central magnet 3012 contributes less to the boundary region of the BL of the sounding device (a parameter for measuring the strength of the driving system in the sounding device), and therefore, in the case where the volume of the rear cavity 60 is limited, the central magnet 3012 is used.
  • the central area is hollowed out to increase the volume of the rear cavity, which helps to improve the performance of the product. Although the area where the center magnet 3012 is hollowed out has little effect on the BL value of the magnetic circuit system, it still has some influence. If the hollowed out area of the center magnet 30122 is too large, its effect on the BL value of the magnetic circuit system 30 cannot be ignored.
  • the knockout area is too large, the smaller the BL value of the magnetic circuit system 30, the lower the performance of the product. Therefore, it is necessary to find a balance range, such that the volume of the rear cavity 60 increased by the hollowing out of the central magnet 3012 is greater than the amount of improvement of the performance of the magnetic circuit system, resulting in a reduction in the performance of the product, thereby optimizing the performance of the product. It is found by simulation that the product performance is improved when the volume of the center magnet 3012 is hollowed out within 35% of the original volume of the center magnet 3012. When the volume of the hollow of the center magnet 3012 exceeds this range, the BL value of the magnetic circuit system sharply decreases.
  • the opening volume of the central magnet 3012 should satisfy that the ratio of the opening volume of the central magnet 3012 to the volume of the central magnet 3012 before the opening is less than or equal to 35%, and further can be controlled. 5%-30% range.
  • the expansion chamber 200 Since the expansion chamber 200 is located at a central position of the magnetic circuit system 30, in general, the rear sound hole on the magnetic circuit system 30 is opened at the corner position of the magnetic circuit system 30, that is, the rear sound hole is away from the The expansion chamber 200 is far away, and the optimal expansion effect cannot be achieved. Especially when the rear cavity 60 is filled with the sound absorbing material, the sound absorbing material at the expansion chamber 200 is too far away from the rear sound hole, and the expansion effect of the sound absorbing material at the expansion chamber 200 cannot be optimal. status. Therefore, in a specific implementation, in a case where the recessed groove is formed by a central hole of a magnet penetrating the central magnet, a magnetic permeability communicating with the central hole of the magnet may be formed on the central magnetic conductive plate 3011.
  • the central hole of the magnetic conductive plate communicates with the inner space of the rear cavity 60 and the sounding unit as the second rear sound hole 402.
  • the first four corners of the magnetic yoke 31 are four.
  • the rear sound hole 401 and the second rear sound hole 402 together constitute a rear sound hole 40 disposed on the sounding unit.
  • the central hole of the magnetic conductive plate here can also solve the problem that the vibration system is weakened due to the small distance between the vibration system and the magnetic circuit system of the miniaturized device, and the stability of the vibration system is deteriorated.
  • the rear sound hole 40 of the sounding unit is provided with a gas permeable spacer 80; the rear chamber 60 is filled with a sound absorbing material.
  • the sound absorbing material may be a zeolitic material, an activated carbon material, or other materials having a expansion effect, which is not limited in this patent.
  • the air permeable spacer 80 is directly disposed on the rear sound hole 40, and the space of the rear cavity 60 can be used for filling the sound absorbing material, thereby increasing the filling amount of the sound absorbing material and achieving a better expansion effect.
  • the expansion cavity 200 is located at the center of the magnetic circuit system in the case of increasing the rear cavity 60 and filling the sound absorbing material for expansion.
  • the contact ratio between the sound absorbing material and the air at the position of the expansion chamber 200 can be increased to achieve an optimal expansion effect. Therefore, the actual size of the rear chamber 60 can be made as small as possible, contributing to thinning and miniaturization of the product.
  • a gas permeable spacer 80 covering the center hole of the magnetic conductive plate is provided on the bottom surface of the center magnetic conductive plate 3011 facing the yoke 31. More specifically, the bottom surface of the center magnetic conductive plate 3011 is provided with a mounting groove recessed away from the guiding yoke 31, and the gas permeable spacer 80 can be installed in the mounting groove. This prevents the installation of the venting spacer 80 from occupying the expansion chamber space.
  • the gas permeable spacer 80 includes, but is not limited to, a mesh to prevent the sound absorbing material at the expansion chamber 60 from entering the magnetic gap in the magnetic circuit system 30.
  • the magnetic circuit portion 30 includes a central magnetic circuit portion 301 and a side magnetic circuit portion 302, the central magnetic circuit portion 301 including a center magnet 3012 and a center guide disposed above the center magnet 3012. a magnetic plate 3011; a central hole of the magnet is disposed on the central magnet 3012; a center hole of the magnetic conductive plate is disposed on the central magnetic conductive plate 3011, and the gas permeable spacer may be attached to the central magnetic conductive plate 3011
  • One side of the yoke 31 covers the center hole of the magnetic conductive plate (not shown).
  • the yoke 31 has a polygonal structure in which four corner portions are provided with notches; the corner position of the yoke 31, and the first rear sound hole 401 is disposed on the yoke 31 near the gap The position of the edge is used to achieve the communication of the magnetic gap and the rear cavity 60.
  • the housing 10 is a straight-type structure with open ends; the sounding unit further includes a vibration system 20, and the vibration system 20 includes a diaphragm 21 and is fixed to a voice coil 22 under the diaphragm 21, the diaphragm 21 is fixed on an end surface of the first end of the casing 10; the magnetic circuit system 30 is located below the vibration system 20 and is fixed at the Inside the housing 10.
  • the housing 10 includes a first portion 1001 corresponding to the vibrating system 20 and the magnetic circuit system 30, and a second portion 1002 that extends integrally downwardly from the first portion 1001 beyond the bottom surface of the magnetic circuit system 30;
  • a lower cover 50 is mounted at the second end opening of the body 10, and the rear chamber 60 is formed between the second portion 1002 of the housing 10 and the bottom surface of the magnetic circuit system 30 and the lower cover 50.
  • the sounding device is provided with only one housing, and the lower end portion of the housing directly forms a sufficiently large rear cavity space, and does not need to additionally configure the module housing forming the rear cavity, so that it is not in the horizontal direction.
  • the additional space is occupied to help achieve miniaturization of the product, and the volume of the magnetic circuit system and the volume of the back cavity can be balanced on the basis of miniaturization to ensure acoustic performance.
  • the rear cavity is arranged, the shape of the rear cavity is regular, and the distance from the rear sound hole is close. Compared with the prior art, the same large cavity volume can achieve better acoustic effect; and in this embodiment, only one housing design is realized. It can simplify the manufacturing process and installation process and provide production efficiency.
  • the outer side of the magnetic circuit system 30 can be disposed adjacent to the inner wall of the casing 10, which can maximize the magnetic circuit system and realize miniaturization of the entire sounding device.
  • the inner wall of the first end of the housing 10 is provided with a convex edge 1003 extending toward the center of the housing 10.
  • the upper edge of the magnetic circuit system 30 is abutted and fixed.
  • the convex edge 1003 is on the lower surface.
  • the first end opening of the housing 10 has a recessed first step end surface 11 having a bottom surface for mounting the diaphragm 21. 111 and side 112.
  • the diaphragm is well fixed and sealed by the first step end face 11.
  • the fixing portion of the diaphragm 21 is coupled to the bottom surface 111 by a colloid, and the edge of the fixing portion of the diaphragm 21 may be combined with the side surface 112 by a colloid to further fix and seal the diaphragm 21.
  • an upper cover 70 mounted on the casing 10 is further disposed above the diaphragm 21, and the rim of the upper cover 70 is located inside the side surface 112 of the first step end surface 11.
  • FIG. 6 and FIG. 7 are schematic diagrams showing the outer contour of an implementation form of the sounding device provided by the embodiment of the present invention.
  • the housing 10 of the sounding device provided in this embodiment may have a rectangular structure.
  • the sounding device adopting the technical solution provided by the embodiment of the present invention can be prepared into a size of a plane size of (6-30) mm*(8-30) mm, and then a method of providing a cavity with a expansion cavity on the magnetic circuit system. The purpose of reducing the height dimension of the sounding device is achieved.
  • the rear cavity 60 is filled with a sound absorbing material
  • the lower cover 50 is provided with a filling hole 51 for filling the sound absorbing material
  • the filling hole 51 is covered with a cover sheet. 52.
  • the cover sheet 52 may be provided with a venting micropore that allows air to pass through and does not allow the sound absorbing material to pass through; or the cover sheet 52 is provided with a leakage hole 521, and the leakage hole 521 is covered with air allowing passage of air and not allowing sound absorption.
  • the first damper mesh 53 through which the material passes.
  • the lower cover 50 is installed at the opening of the second end of the housing 10.
  • the lower cover 50 of the embodiment can be made of a metal material, and the metal material can be made thinner and takes up less space.
  • the lower cover plate has a flat shape (the structure shown in FIGS. 8, 9, and 11); or, the lower cover 50 is a bowl structure having a bottom wall 501 and a side wall 502 (as shown in FIG. 13).
  • the metal under cover 50 of the bowl-shaped structure has high strength and takes up a small space, and the presence of the side wall 502 forms a part of Since the height of the casing 10 can be reduced, the height of the casing 10 can be reduced, and the problem that the excessively large plastic casing needs to increase the wall thickness to ensure the overall structural strength and thus the occupied space is more advantageous for miniaturization of the product.
  • the lower cover 50 can be connected to the second end opening of the housing 10 in the following three manners.
  • the embodiments of the present invention are not limited to the following connection manners.
  • the lower cover 50 is bonded to the end surface of the second end opening of the casing 10 through the adhesive layer 90. Specifically, the edge of the lower cover 50 extends to be flush with the outer side wall of the housing 10, and the surface of the lower cover 50 opposite to the open end surface of the second end of the housing 10 is provided with a backing. The lower cover 50 is bonded to the end surface of the second end of the housing 10 by its own adhesive backing to seal the rear chamber.
  • the inner side of the end surface of the second end opening of the casing 10 has a recessed second step end surface 12, and the second step end surface 12 has a top surface 121 for mounting the lower cover 50.
  • the side surface 122; the lower cover 50 has a flat shape, and the edge of the lower cover 50 is provided with a recess 51 which is recessed toward the rear cavity 60, and the recess 51 abuts against the top surface of the second step end surface 12 and
  • a first sol groove 52 is formed between the side surface of the second step end surface 12, and the lower cover plate 50 is fixed on the housing 10 by applying glue in the first glue receiving groove 52; or, as shown in FIG.
  • the lower cover 50 is a bowl structure having a bottom wall 501 and a side wall 502.
  • the end of the side wall 502 of the lower cover 50 is bent outwardly to be provided with a mounting edge 503.
  • the mounting edge 503 A second adhesive tank 504 is formed between the top surface 121 of the second step end surface 12 and the side surface 122 of the second step end surface 12, and the glue is applied to the second plastic tank 504.
  • the lower cover 50 is fixed to the casing 10.
  • the periphery of the lower cover 50 is injection molded with a plastic edge 100, and the plastic edge 100 is ultrasonically welded to the opening of the second end of the housing 10.
  • first end of the housing 10 may be open, and the second end of the housing 10 is integrally provided with a bottom wall of the housing, wherein the bottom wall of the housing may be made entirely of plastic material;
  • the bottom wall of the housing includes an integrally injection molded piece of metal for increased space.
  • the aperture can be opened in the diaphragm system, so that the airflow can be ventilated through the upper and lower directions when the diaphragm vibrates to balance the acoustic resistance to improve the vibration state of the product. Because it is a waterproof product, the vibration system cannot be waterproofed after opening. Therefore, adding a waterproof and breathable membrane at the opening can not only improve the vibration state of the product, but also meet the waterproof requirements. Specifically, as shown in FIG. 13 , FIG. 14 and FIG.
  • the diaphragm 21 includes a central portion and a folded ring portion disposed around the central portion, and the ventilation portion 300 is opened in the central portion, and the ventilation is
  • the hole 300 is covered with a second damping net 400, which is made of a waterproof gas permeable material.
  • the second damping net is made of a sound-impermeable material, which can effectively improve the acoustic characteristics of the sounding device. Opening the hole in the diaphragm can solve the problem that the vibration system has a small distance between the vibration system and the magnetic circuit system of the miniaturized device, and the vibration resistance of the vibration becomes large, so that the stability of the vibration system is deteriorated.
  • the vibration system may further include a reinforcing portion 23 which is attached to a side of the diaphragm center portion away from the magnetic circuit system 30, and the reinforcing portion 23 is opened at a position facing the vent hole 300.
  • a reinforcing portion 23 which is attached to a side of the diaphragm center portion away from the magnetic circuit system 30, and the reinforcing portion 23 is opened at a position facing the vent hole 300.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

本发明实施例提供了一种发声装置。该发声装置包括壳体，所述壳体内安装有发声单体，所述发声单体与所述壳体之间形成密闭的后腔，所述发声单体设有与所述后腔连通的后声孔，所述发声单体包括磁路系统，所述磁路系统上设有扩容腔，所述扩容腔作为所述后腔的一部分，以增大所述后腔的体积。本发明实施例提供的技术方案中，通过在磁路系统上开设扩容腔，可有效增大后腔的体积，提高发声装置的声学性能；并且，在增大后腔体积的同时，还能保证磁路系统中的磁铁厚度，以避免高温对磁铁磁性的影响。

Description

发声装置 技术领域
本发明属于电声转换装置技术领域，具体地，本发明涉及一种发声装置。
背景技术
发声装置是手机等电子产品中重要的元器件，用于将电信号转变成声信号。手机等电子产品的发展趋势是越来越薄，且为了实现更多的功能，电子产品中的元器件越来越多，势必给发声装置预留的空间越来越小，且电子产品越来越注重用户的音乐体验，因此要求发声装置具有更好的音质。
为了提升音乐体验效果，现有技术中的发声装置将发声单体安装在一个具有容积的模组壳体中，发声单体包括单体壳体和收容固定于单体壳体内的磁路系统和振动系统，发声单体与模组壳体之间形成后腔，后腔空间越大，则产品的低频谐振频率越低，因此产品的低频性能得到提升。
若将现有结构的发声装置体积变小，势必会减小发声装置后腔体积。因此，需要提供一种新型结构的发声装置，具有小体积的同时还能具有较好的性能，以满足电子产品的发展需求。
发明内容
本发明的一个目的是在发生装置小型化的同时，增大后腔以提高声学特性。
根据本发明的一个方面，提供了一种发声装置。该发声装置，包括壳 体，所述壳体内安装有发声单体，所述发声单体与所述壳体之间形成密闭的后腔，所述发声单体设有与所述后腔连通的后声孔；所述发声单体包括磁路系统，所述磁路系统上由底面向上开设有扩容腔，所述扩容腔作为所述后腔的一部分，以增大所述后腔的体积。
可选地，至少在所述发声单体的底部位置或侧面位置设有所述后声孔。
可选地，所述磁路系统包括导磁轭和安装于所述导磁轭上表面的磁路部分；所述导磁轭的底面中心位置向上开设有第一孔，所述磁路部分开设有与所述第一孔连通的凹陷槽；所述第一孔与所述凹陷槽共同形成所述扩容腔。
可选地，所述磁路部分包括中心磁路部分和边磁路部分，所述中心磁路部分包括中心磁铁和设于所述中心磁铁上方的中心导磁板；
所述凹陷槽为开设在所述中心磁铁上的盲孔，或者，所述凹陷槽由贯穿开设在所述中心磁铁上的磁铁中心孔构成。
可选地，所述中心磁铁的开孔体积相比于开孔前的中心磁铁体积的比例小于等于35％。
可选地，所述中心导磁板上开有与所述磁铁中心孔连通的导磁板中心孔，所述导磁板中心孔连通所述后腔与所述发声单体的内部空间作为所述后声孔。
可选地，所述发声单体的后声孔上设有透气隔离件；
所述后腔中填充有吸音材料；
所述中心导磁板的底面设有朝远离所述导磁轭的方向凹陷的安装槽，所述透气隔离件安装在所述安装槽内。
所述发声单体的后声孔上设有透气隔离件；
所述后腔中填充有吸音材料。
可选地，所述壳体为两端开口的、直筒型的结构；
所述发声单体还包括振动系统，所述振动系统包括振膜和固定于所述振膜下方的音圈，所述振膜固定于所述壳体的第一端开口的端面上；
所述磁路系统位于所述振动系统的下方且固定于所述壳体内；
所述壳体包括对应所述振动系统和磁路系统的第一部分，以及由所述第一部分一体向下延伸超出所述磁路系统底面的第二部分；
所述壳体的第二端开口处安装有下盖板，所述壳体的第二部分、所述磁路系统的底面与所述下盖板之间形成所述后腔。
可选地，所述磁路系统的外侧与所述壳体的内壁贴靠设置。
可选地，所述壳体的第一端的内壁上设有朝向壳体的中心方向延伸的凸沿，所述磁路系统的上边缘抵接固定在所述凸沿的下表面上。
可选地，所述壳体为矩形结构。
可选地，所述下盖板上开设有用于灌装所述吸音材料的灌装孔，所述灌装孔上封装有盖片。
可选地，所述盖片上设有允许空气通过且不允许所述吸音材料通过的透气微孔；或者，
所述盖片上设有泄漏孔，且在所述泄漏孔上覆盖有允许空气通过且不允许所述吸音材料通过的第一阻尼网。
可选地，所述下盖板为金属制成。
可选地，所述下盖板为平板状；或者，所述下盖板为具有底壁和侧壁的碗状结构。
可选地，所述下盖板通过胶层粘接在所述壳体的第二端开口的端面上；
或者，所述壳体的第二端开口的端面的内侧具有凹陷的第二台阶端面，所述第二台阶端面具有用于安装所述下盖板的顶面和侧面；所述下盖板为平板状，所述下盖板的边缘设有朝向所述后腔方向凹陷的凹陷部，所述凹陷部抵接在所述第二台阶端面的顶面并且与所述第二台阶端面的侧面之间形成第一容胶槽，在所述第一容胶槽内涂胶将所述下盖板固定在所述壳体上；或者，所述下盖板为具有底壁和侧壁的碗状结构，所述下盖板的侧壁的端部向外侧弯折设有安装边缘，所述安装边缘抵接在所述第二台阶端面的顶面并且与所述第二台阶端面的侧面之间形成第二容胶槽，在所述第二容胶槽内涂胶将所述下盖板固定在所述壳体上；
或者，所述下盖板的周边注塑有塑料边缘，所述塑料边缘与所述壳体 的第二端开口处超声焊接。
可选地，所述振膜包括中心部和围绕所述中心部设置的折环部，在所述中心部开设有透气孔，且所述透气孔处覆盖有第二阻尼网，所述第二阻尼网由防水透气材料制成。
可选地，所述第二阻尼网为不透声材料制成。
本发明实施例提供的技术方案中，通过在磁路系统上开设扩容腔，可有效增大后腔的体积，有助于实现产品小型化，并能提高发声装置的声学性能；并且，在增大后腔体积的同时，还能保证磁路系统中的磁铁厚度，以避免高温对磁铁磁性的影响。
通过以下参照附图对本发明的示例性实施例的详细描述，本发明的其它特征及其优点将会变得清楚。
附图说明
构成说明书的一部分的附图描述了本发明的实施例，并且连同说明书一起用于解释本发明的原理。
图1是本发明一实施例提供的发声装置的爆炸示意图；
图2是本发明一实施例提供的发声装置的剖面示意图；
图3是本发明一实施例提供的发声装置中导磁轭的一具体实现的结构示意图；
图4是本发明一实施例提供的发声装置的剖面示意图；
图5是图2的局部放大示意图；
图6是本发明一实施例提供的发声装置的顶面角度示意图；
图7是本发明一实施例提供的发声装置的底面角度示意图；
图8是本发明一实施例提供的发声装置中下盖板与壳体的一种连接结构示意图；
图9是本发明一实施例提供的发声装置中下盖板与壳体的另一种连接结构示意图；
图10是图9的局部放大示意图；
图11是本发明一实施例提供的发声装置的下盖板与壳体的又一结构示意图；
图12是本发明一实施例提供的发声装置的下盖板与壳体的又一结构示意图；
图13是本发明一实施例提供的发声装置中振膜系统开孔的结构示意图；
图14是本发明一实施例提供的振膜的结构示意图；
图15是本发明一实施例提供的振膜与补强部的结构示意图。
具体实施方式
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术和设备可能不作详细讨论，但在适当情况下，所述技术和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。
图1、图2和图3示出了本发明一实施例提供的一种用于发声装置的结构示意图。如图1和图2所示，该发声装置包括：壳体10，所述壳体10内安装有发声单体，所述发声单体与所述壳体10之间形成密闭的后腔60， 所述发声单体设有与所述后腔60连通的后声孔40。如图1和图2所示，所述发声单体包括磁路系统30，所述磁路系统30上由底面向上开设有扩容腔200，所述扩容腔200作为所述后腔60的一部分，以增大所述后腔60的体积。
本发明实施例提供的技术方案中，通过在磁路系统上开设扩容腔，可有效增大后腔的体积，提高发声装置的声学性能；并且，在增大后腔体积的同时，还能保证磁路系统中的磁铁厚度，以避免高温对磁铁磁性的影响。
在一具体实施例中，至少在所述发声单体的底部位置(如图1所示)或侧面位置设有第一后声孔401。
在一具体实施例中，如图2所示，所述磁路系统30包括导磁轭31和安装于所述导磁轭31上表面的磁路部分；所述导磁轭31的底面中心位置向上开设有第一孔，所述磁路部分开设有与所述第一孔连通的凹陷槽；所述第一孔与所述凹陷槽共同形成所述扩容腔200。
在一种可实现的方案中，如图1和图2所示，所述磁路部分包括中心磁路部分301和边磁路部分302，所述中心磁路部分301包括中心磁铁3012和设于所述中心磁铁3012上方的中心导磁板3011；所述凹陷槽为开设在所述中心磁铁3012上的盲孔，或者，所述凹陷槽由贯穿开设在所述中心磁铁3012上的磁铁中心孔构成。
这里需要补充的是：中心磁铁3012中心区域对发声装置的BL(衡量发声装置中驱动系统强度的一个参数)贡献小于边界区域，因此，在后腔60体积受限的情况下，将中心磁铁3012中心区域挖空，以增大后腔体积，有助于提升产品的性能。虽然中心磁铁3012挖空的区域对磁路系统的BL值的影响小，但多少还是存在影响的。如果，中心磁铁30122的挖空区域太大，其对磁路系统30的BL值的影响就不能被忽视了。挖空区域过大，磁路系统30的BL值就会越小，产品的性能就会越低。因此，需要找到一个平衡范围，使得中心磁铁3012挖空增加的后腔60体积对产品性能的提升量要大于磁路系统BL值减小致使产品性能降低的量，从而实现对产品性能的优化。通过仿真得知，当中心磁铁3012挖空的体积占中心磁铁3012原体积的35％以内时，产品性能得到提 升。当中心磁铁3012挖空的体积超过这个范围时，磁路系统的BL值急剧减小。此时后腔60空间增加对性能的提升效果不如磁路系统BL值减小造成的产品性能降低效果，综合表现为产品性能降低。因此，本发明提供的上述技术方案中，中心磁铁3012的开孔体积应满足：中心磁铁3012的开孔体积相对于开孔前的中心磁铁3012体积的比例小于等于35％，进一步的可以控制在5％-30％的范围内。
由于扩容腔200位于所述磁路系统30的中心位置处，而通常情况下，磁路系统30上的后声孔开设在磁路系统30的角部位置处，也即后声孔离所述扩容腔200较远，无法达到最佳扩容效果，尤其是在后腔60填充吸音材料时，扩容腔200处的吸音材料离后声孔太远，导致扩容腔200处吸音材料的扩容效果无法达到最佳状态。因此，在具体实施时，在所述凹陷槽由贯穿开设在中心磁铁上的磁铁中心孔构成的情况下，可在所述中心导磁板3011上开有与所述磁铁中心孔连通的导磁板中心孔；所述导磁板中心孔连通所述后腔60与所述发声单体的内部空间作为第二后声孔402，本实施例中，导磁轭31四角处的四个第一后声孔401和该第二后声孔402共同构成了设置在发声单体上的后声孔40。此处的导磁板中心孔还可解决因为小型化装置振动系统与磁路系统间距小，振动的声阻会变大使得振动系统稳定性变差的问题。
进一步的，如图1所示，所述发声单体的后声孔40上设有透气隔离件80；所述后腔60中填充有吸音材料。具体的，吸音材料可以是沸石材料、活性炭材料、或者其他的具有扩容效果的材料，本专利中不做限定。直接在后声孔40上设置透气隔离件80的方式，可以将后腔60空间全部用来灌装吸音材料，增大吸音材料灌装量，实现更好的扩容效果。并且，结合扩容腔200设计和第二后声孔402的设计，扩容腔200在增大后腔60并填充吸音材料进行扩容的情况下，第二后声孔402位于磁路系统的中心位置，可以增大该扩容腔200位置处的吸音材料与空气的接触率，实现最佳扩容效果，因此，后腔60实际尺寸可以尽可能做小，有助于实现产品的薄型化和微型化。
具体的，如图2所示，在中心导磁板3011的朝向导磁轭31的底面上 设有覆盖所述导磁板中心孔的透气隔离件80。更具体的，所述中心导磁板3011的底面设有朝远离所述导磁轭31的方向凹陷的安装槽，所述透气隔离件80可安装在所述安装槽内。这样可避免透气隔离件80的安装占用扩容腔空间。所述透气隔离件80包括但不限于网布，以避免扩容腔60处的吸音材料进入磁路系统30中的磁间隙。
在另一种可实现的方案中，所述磁路部分30包括中心磁路部分301和边磁路部分302，所述中心磁路部分301包括中心磁铁3012和设于中心磁铁3012上方的中心导磁板3011；所述中心磁铁3012上设有磁铁中心孔；所述中心导磁板3011上设有导磁板中心孔，所述透气隔离件还可贴设在所述中心导磁板3011远离所述导磁轭31的一侧并覆盖在所述导磁板中心孔上(未图示)。
进一步的，如图1所示，导磁轭31为四个角部均设有缺口的多边形结构；导磁轭31的角部位置，第一后声孔401设于导磁轭31的靠近缺口边缘的位置处，用于实现磁间隙和后腔60的连通。
如图1、图2和4所示，所述壳体10为两端开口的、直筒型的结构；所述发声单体还包括振动系统20，所述振动系统20包括振膜21和固定于所述振膜21下方的音圈22，所述振膜21固定于所述壳体10的第一端开口的端面上；所述磁路系统30位于所述振动系统20的下方且固定于所述壳体10内。所述壳体10包括对应所述振动系统20和磁路系统30的第一部分1001，以及由所述第一部分1001一体向下延伸超出所述磁路系统30底面的第二部分1002；所述壳体10的第二端开口处安装有下盖板50，所述壳体10的第二部分1002、所述磁路系统30的底面与所述下盖板50之间形成所述后腔60。该具体实施例中，发声装置只设置一个壳体，由该壳体的下端部分直接形成足够大的后腔空间，不需要额外配置形成后腔的模组壳体，因此不会在水平方向上额外增加占用空间，有助于实现产品的小型化，并且在小型化基础上能够兼顾磁路系统的体积以及后腔体积，进而保证声学性能；其次，在正对振动系统和磁路系统的下方设置后腔，后腔形状规则，与后声孔的距离近，相比于现有技术，同样大的后腔体积，能够实现更好 的声学效果；并且本实施方案，只有一个壳体的设计，可以简化制作工艺与安装工艺，提供生产效率。
进一步的，所述磁路系统30的外侧可与所述壳体10的内壁贴靠设置，可以实现磁路系统的最大化，并且实现整个发声装置的小型化。
再进一步的，如图4所示，所述壳体10的第一端的内壁上设有朝向壳体10的中心方向延伸的凸沿1003，所述磁路系统30的上边缘抵接固定在所述凸沿1003的下表面上。
具体地，如图2和图5所示，所述壳体10的第一端开口处具有凹陷的第一台阶端面11，所述第一台阶端面11具有用于安装所述振膜21的底面111和侧面112。通过第一台阶端面11可很好地固定且密封振膜。例如：振膜21的固定部通过胶体与所述底面111结合，振膜21的固定部的边沿也可通过胶体与所述侧面112结合以进一步固定和密封振膜21。参照图1和图3所示，振膜21的上方还设有安装在壳体10上的上盖板70，上盖板70的边沿位于第一台阶端面11的侧面112的内侧。
图6和图7示出了本发明实施例提供的发声装置的一种实现形式的外轮廓示意图。如图6和图7所示，本实施例提供的发声装置的壳体10可以为矩形结构。例如，采用本发明实施例提供的技术方案的发声装置，可制备成平面尺寸为(6-30)mm*(8-30)mm的尺寸，再通过在磁路系统上设置具有扩容腔的方式实现降低发声装置的高度尺寸的目的。
进一步的，如图2和图7所示，所述后腔60中填充有吸音材料，下盖板50上开设有用于灌装吸音材料的灌装孔51，灌装孔51上封装有盖片52。该盖片52上可设有允许空气通过且不允许吸音材料通过的透气微孔；或者，该盖片52上设有泄漏孔521，且在泄漏孔521上覆盖有允许空气通过且不允许吸音材料通过的第一阻尼网53。
在实际实施时，在壳体10的第二端开口处安装有下盖板50，本实施例中的下盖板50可采用金属材料制成，金属材料可以做的更薄，占用空间更小。进一步的，所述下盖板为平板状(如图8、9和11所示的结构)；或者，下盖板50为具有底壁501和侧壁502的碗装结构(如图13所示)，下盖板50为金 属材料且呈碗状结构的实施方式中，碗状结构的金属下盖板50具有较高的强度，且占用空间小，并且侧壁502的存在，形成了一部分的后腔空间，因此壳体10的高度可以减小，避免过高的塑料壳体需要将壁厚做大来保证整体结构强度、进而会增大占用空间的问题，更有利于实现产品小型化。
参见图8至图12所示，本实施例提供的所述发声装置中，下盖板50可采用如下三种方式实现与壳体10的第二端开口的连接。当然，本发明实施例不仅限于如下几种连接方式。
方式一，如图8所示，下盖板50通过胶层90粘接在壳体10的第二端开口的端面上。具体的，下盖板50的边沿延伸至与壳体10的外侧壁平齐，下盖板50的与壳体10的第二端开口端面相对的板面上带有背胶。下盖板50通过其自带的背胶粘接在壳体10的第二端开口的端面上，以密封后腔。
方式二，如图9和图10所示，壳体10的第二端开口的端面的内侧具有凹陷的第二台阶端面12，第二台阶端面12具有用于安装下盖板50的顶面121和侧面122；下盖板50为平板状，下盖板50的边缘设有朝向后腔60方向凹陷的凹陷部51，所述凹陷部51抵接在所述第二台阶端面12的顶面并且与所述第二台阶端面12的侧面之间形成第一溶胶槽52，在所述第一容胶槽52内涂胶将下盖板50固定在壳体10上；或者，如图12所示，所述下盖板50为具有底壁501和侧壁502的碗装结构，所述下盖板50的侧壁502的端部向外侧弯折设有安装边缘503，所述安装边缘503抵接在所述第二台阶端面12的顶面121并且与所述第二台阶端面12的侧面122之间形成第二容胶槽504，在所述第二容胶槽504内涂胶将所述下盖板50固定在所述壳体10上。
方式三，如图11所示，下盖板50的周边注塑有塑料边缘100，塑料边缘100与壳体10的第二端开口处超声焊接。
在另一具体实施方式中，可以是壳体10的第一端开口，壳体10的第二端端部一体设有壳体底壁，其中壳体底壁可以是全部为塑料材质制成；或者，壳体底壁包括一体注塑的金属片，用于增大空间。
进一步的，可在振膜系统上开孔，这样振膜振动时气流可通过上下两个方向透气，以平衡声阻改善产品振动状态。因是防水产品，振动系统开孔后，无 法达到防水要求。故在开孔处添加防水透气膜，既能改善产品振动状态，同时可以满足防水要求。具体地，如图13、图14和图15所示，所述振膜21包括中心部和围绕所述中心部设置的折环部，在所述中心部开设有透气孔300，且所述透气孔300处覆盖有第二阻尼网400，所述第二阻尼网400由防水透气材料制成。此外，所述第二阻尼网为不透声材料制成，可有效改善发声装置的声学特性。在振膜上开孔可解决因为小型化装置振动系统与磁路系统间距小，振动的声阻会变大使得振动系统稳定性变差的问题。
此外，振动系统还可包括补强部23，所述补强部贴设在振膜中心部远离磁路系统30的一侧，该补强部23上正对所述透气孔300的位置处开设有第四孔，所述第二阻尼网400可贴合在所述补强部23上，以覆盖所述第四孔。
虽然已经通过示例对本发明的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上示例仅是为了进行说明，而不是为了限制本发明的范围。本领域的技术人员应该理解，可在不脱离本发明的范围和精神的情况下，对以上实施例进行修改。本发明的范围由所附权利要求来限定。

Claims (19)

  1. 一种发声装置，包括壳体，所述壳体内安装有发声单体，所述发声单体与所述壳体之间形成密闭的后腔，所述发声单体设有与所述后腔连通的后声孔，其特征在于，
    所述发声单体包括磁路系统，所述磁路系统上由底面向上开设有扩容腔，所述扩容腔作为所述后腔的一部分，以增大所述后腔的体积。
  2. 根据权利要求1所述的发声装置，其特征在于，至少在所述发声单体的底部位置或侧面位置设有所述后声孔。
  3. 根据权利要求1所述的发声装置，其特征在于，所述磁路系统包括导磁轭和安装于所述导磁轭上表面的磁路部分；
    所述导磁轭的底面中心位置向上开设有第一孔，所述磁路部分开设有与所述第一孔连通的凹陷槽；
    所述第一孔与所述凹陷槽共同形成所述扩容腔。
  4. 根据权利要求3所述的发声装置，其特征在于，所述磁路部分包括中心磁路部分和边磁路部分，所述中心磁路部分包括中心磁铁和设于所述中心磁铁上方的中心导磁板；
    所述凹陷槽为开设在所述中心磁铁上的盲孔，或者，所述凹陷槽由贯穿开设在所述中心磁铁上的磁铁中心孔构成。
  5. 根据权利要求4所述的发声装置，其特征在于，所述中心磁铁的开孔体积相比于开孔前的中心磁铁体积的比例小于等于35％。
  6. 根据权利要求4所述的发声装置，其特征在于，所述中心导磁板上开有与所述磁铁中心孔连通的导磁板中心孔，所述导磁板中心孔连通所述后腔与所述发声单体的内部空间作为所述后声孔。
  7. 根据权利要求6所述的发声装置，其特征在于，所述发声单体的后声孔上设有透气隔离件；
    所述后腔中填充有吸音材料；
    所述中心导磁板的底面设有朝远离所述导磁轭的方向凹陷的安装槽，所述透气隔离件安装在所述安装槽内。
  8. 根据权利要求1至6中任一项所述的发声装置，其特征在于，所述发声单体的后声孔上设有透气隔离件；
    所述后腔中填充有吸音材料。
  9. 根据权利要求8所述的发声装置，其特征在于，所述壳体为两端开口的、直筒型的结构；
    所述发声单体还包括振动系统，所述振动系统包括振膜和固定于所述振膜下方的音圈，所述振膜固定于所述壳体的第一端开口的端面上；
    所述磁路系统位于所述振动系统的下方且固定于所述壳体内；
    所述壳体包括对应所述振动系统和磁路系统的第一部分，以及由所述第一部分一体向下延伸超出所述磁路系统底面的第二部分；
    所述壳体的第二端开口处安装有下盖板，所述壳体的第二部分、所述磁路系统的底面与所述下盖板之间形成所述后腔。
  10. 根据权利要求9所述的发声装置，其特征在于，所述磁路系统的外侧与所述壳体的内壁贴靠设置。
  11. 根据权利要求10所述的发声装置，其特征在于，所述壳体的第一端的内壁上设有朝向壳体的中心方向延伸的凸沿，所述磁路系统的上边缘抵接固定在所述凸沿的下表面上。
  12. 根据权利要求9所述的发声装置，其特征在于，所述壳体为矩形结构。
  13. 根据权利要求9所述的发声装置，其特征在于，所述下盖板上开设有用于灌装所述吸音材料的灌装孔，所述灌装孔上封装有盖片。
  14. 根据权利要求13所述的发声装置，其特征在于，所述盖片上设有允许空气通过且不允许所述吸音材料通过的透气微孔；或者，
    所述盖片上设有泄漏孔，且在所述泄漏孔上覆盖有允许空气通过且不允许所述吸音材料通过的第一阻尼网。
  15. 根据权利要求9所述的发声装置，其特征在于，所述下盖板为金 属制成。
  16. 根据权利要求15所述的发声装置，其特征在于，所述下盖板为平板状；
    或者，所述下盖板为具有底壁和侧壁的碗状结构。
  17. 根据权利求9所述的发声装置，其特征在于，所述下盖板通过胶层粘接在所述壳体的第二端开口的端面上；
    或者，所述壳体的第二端开口的端面的内侧具有凹陷的第二台阶端面，所述第二台阶端面具有用于安装所述下盖板的顶面和侧面；所述下盖板为平板状，所述下盖板的边缘设有朝向所述后腔方向凹陷的凹陷部，所述凹陷部抵接在所述第二台阶端面的顶面并且与所述第二台阶端面的侧面之间形成第一容胶槽，在所述第一容胶槽内涂胶将所述下盖板固定在所述壳体上；或者，所述下盖板为具有底壁和侧壁的碗状结构，所述下盖板的侧壁的端部向外侧弯折设有安装边缘，所述安装边缘抵接在所述第二台阶端面的顶面并且与所述第二台阶端面的侧面之间形成第二容胶槽，在所述第二容胶槽内涂胶将所述下盖板固定在所述壳体上；
    或者，所述下盖板的周边注塑有塑料边缘，所述塑料边缘与所述壳体的第二端开口处超声焊接。
  18. 根据权利要求9所述的发声装置，其特征在于，所述振膜包括中心部和围绕所述中心部设置的折环部，在所述中心部开设有透气孔，且所述透气孔处覆盖有第二阻尼网，所述第二阻尼网由防水透气材料制成。
  19. 根据权利要求18所述的发声装置，其特征在于，所述第二阻尼网为不透声材料制成。
PCT/CN2018/123195 2018-01-10 2018-12-24 发声装置 WO2019137192A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/961,357 US11178494B2 (en) 2018-01-10 2018-12-24 Sound generating device

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN201820043784.X 2018-01-10
CN201820043784 2018-01-10
CN201810146456.7 2018-02-12
CN201810146456.7A CN109218928B (zh) 2018-01-10 2018-02-12 发声装置

Publications (1)

Publication Number Publication Date
WO2019137192A1 true WO2019137192A1 (zh) 2019-07-18

Family

ID=63397975

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/123195 WO2019137192A1 (zh) 2018-01-10 2018-12-24 发声装置

Country Status (3)

Country Link
US (1) US11178494B2 (zh)
CN (3) CN207835800U (zh)
WO (1) WO2019137192A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021174574A1 (zh) * 2020-03-05 2021-09-10 瑞声声学科技(深圳)有限公司 发声器件
WO2022067988A1 (zh) * 2020-09-30 2022-04-07 瑞声声学科技(深圳)有限公司 发声器件
CN114567842A (zh) * 2022-02-28 2022-05-31 歌尔股份有限公司 发声装置和终端设备

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN207835800U (zh) 2018-01-10 2018-09-07 歌尔股份有限公司 发声装置
CN110753290B (zh) * 2019-09-30 2021-01-08 歌尔科技有限公司 发声装置及安装有该发声装置的声学模块及电子设备
CN110856082B (zh) * 2019-10-10 2021-06-15 瑞声科技(新加坡)有限公司 发声器件
CN111065021B (zh) * 2019-12-06 2021-09-10 瑞声科技(新加坡)有限公司 发声器件
CN111107468B (zh) * 2019-12-18 2021-02-19 歌尔股份有限公司 一种发声装置以及电子终端
CN212628397U (zh) * 2020-07-08 2021-02-26 瑞声科技(新加坡)有限公司 发声装置
CN214381362U (zh) * 2020-12-25 2021-10-08 瑞声光电科技(常州)有限公司 发声装置
CN113993043B (zh) * 2021-10-22 2024-03-12 歌尔股份有限公司 发声装置和电子设备
CN114866631B (zh) * 2022-04-02 2024-05-31 歌尔股份有限公司 电子设备
CN114866913A (zh) * 2022-04-02 2022-08-05 歌尔股份有限公司 发声模组和终端设备

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007096843A (ja) * 2005-09-29 2007-04-12 Kyocera Corp 携帯端末装置
CN202310077U (zh) * 2011-09-05 2012-07-04 瑞声声学科技(常州)有限公司 微型扬声器
CN203301737U (zh) * 2013-06-29 2013-11-20 歌尔声学股份有限公司 扬声器模组
CN103957487A (zh) * 2014-04-30 2014-07-30 歌尔声学股份有限公司 侧出声扬声器模组
CN104811857A (zh) * 2015-04-30 2015-07-29 歌尔声学股份有限公司 扬声器模组
CN106535068A (zh) * 2016-11-22 2017-03-22 歌尔股份有限公司 扬声器单体和扬声器模组
CN207835800U (zh) * 2018-01-10 2018-09-07 歌尔股份有限公司 发声装置

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0450718Y2 (zh) * 1986-02-28 1992-11-30
JP2003289595A (ja) * 2002-03-27 2003-10-10 Citizen Electronics Co Ltd スピーカ
US7831059B1 (en) * 2006-11-03 2010-11-09 Sahyoun Joseph Y Self-cooled electro-magnetic audio transducer
CN202759586U (zh) * 2012-07-16 2013-02-27 瑞声光电科技(常州)有限公司 发声器
WO2014101033A1 (en) * 2012-12-27 2014-07-03 Intel Corporation Electronic device having expandable speaker box
CN203301730U (zh) * 2013-06-03 2013-11-20 歌尔声学股份有限公司 微型扬声器
CN103750860B (zh) 2014-01-20 2016-01-06 华南理工大学 一种无线三维超声成像方法和装置
CN104202703B (zh) * 2014-09-01 2017-11-24 歌尔股份有限公司 扬声器模组
CN106031644A (zh) 2015-03-11 2016-10-19 青岛海信医疗设备股份有限公司 一种超声检测方法及主控制器
CN204598303U (zh) * 2015-04-30 2015-08-26 歌尔声学股份有限公司 扬声器模组
CN204598310U (zh) * 2015-05-06 2015-08-26 歌尔声学股份有限公司 扬声器模组
CN104983442B (zh) 2015-05-14 2017-11-14 常州迪正雅合电子科技有限公司 一种三维/四维超声成像系统中三维探头的驱动方法
CN204948336U (zh) * 2015-07-24 2016-01-06 歌尔声学股份有限公司 微型扬声器
CN105142046A (zh) * 2015-08-11 2015-12-09 瑞声光电科技(常州)有限公司 发声器件及制作该发声器件的方法
CN105249989B (zh) 2015-08-31 2018-10-26 深圳市红源资产管理有限公司 基于单总线通信的超声探头识别方法及超声医疗设备
CN205356670U (zh) * 2015-12-12 2016-06-29 歌尔声学股份有限公司 一种微型扬声器
KR101709078B1 (ko) * 2015-12-31 2017-02-23 주식회사 이엠텍 공기 흡착제를 구비한 마이크로 스피커
CN205596332U (zh) * 2016-03-28 2016-09-21 歌尔声学股份有限公司 扬声器模组
US10271133B2 (en) * 2016-04-14 2019-04-23 II Concordio C. Anacleto Acoustic lens system
CN106101945A (zh) * 2016-06-16 2016-11-09 歌尔股份有限公司 扬声器
CN106454654B (zh) * 2016-09-30 2020-11-20 歌尔股份有限公司 扬声器单体的外壳、扬声器单体和模组、及电子设备
EP3530000A1 (en) * 2016-10-19 2019-08-28 Zachary Pierce Bumpout motorized expansion system
CN107661121A (zh) 2017-10-23 2018-02-06 深圳开立生物医疗科技股份有限公司 一种超声探头自适应匹配方法及系统
CN109984773A (zh) 2019-03-26 2019-07-09 中国科学院苏州生物医学工程技术研究所 微小血管检查与识别系统与方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007096843A (ja) * 2005-09-29 2007-04-12 Kyocera Corp 携帯端末装置
CN202310077U (zh) * 2011-09-05 2012-07-04 瑞声声学科技(常州)有限公司 微型扬声器
CN203301737U (zh) * 2013-06-29 2013-11-20 歌尔声学股份有限公司 扬声器模组
CN103957487A (zh) * 2014-04-30 2014-07-30 歌尔声学股份有限公司 侧出声扬声器模组
CN104811857A (zh) * 2015-04-30 2015-07-29 歌尔声学股份有限公司 扬声器模组
CN106535068A (zh) * 2016-11-22 2017-03-22 歌尔股份有限公司 扬声器单体和扬声器模组
CN207835800U (zh) * 2018-01-10 2018-09-07 歌尔股份有限公司 发声装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021174574A1 (zh) * 2020-03-05 2021-09-10 瑞声声学科技(深圳)有限公司 发声器件
WO2022067988A1 (zh) * 2020-09-30 2022-04-07 瑞声声学科技(深圳)有限公司 发声器件
CN114567842A (zh) * 2022-02-28 2022-05-31 歌尔股份有限公司 发声装置和终端设备

Also Published As

Publication number Publication date
US20200351592A1 (en) 2020-11-05
US11178494B2 (en) 2021-11-16
CN109218928B (zh) 2024-01-30
CN109218927A (zh) 2019-01-15
CN109218927B (zh) 2021-12-28
CN109218928A (zh) 2019-01-15
CN207835800U (zh) 2018-09-07

Similar Documents

Publication Publication Date Title
WO2019137192A1 (zh) 发声装置
WO2019161703A1 (zh) 发声器及电子产品
WO2019161704A1 (zh) 发声器
US11395071B2 (en) Sound generator
WO2018214280A1 (zh) 扬声器模组及电子设备
CN209462592U (zh) 声学装置和电子设备
WO2016176996A1 (zh) 扬声器模组
TWI500333B (zh) 具有水平成形物之揚聲器
WO2019205720A1 (zh) 一种发声装置
WO2019227924A1 (zh) 微型扬声器模组
WO2006090558A1 (ja) スピーカ装置
US11638097B1 (en) Speaker
WO2021138953A1 (zh) 扬声器箱
WO2019205708A1 (zh) 一种发声装置及电子设备
WO2016086757A1 (zh) 微型扬声器
CN110572755B (zh) 声学装置及电子设备
CN113993043B (zh) 发声装置和电子设备
WO2021000100A1 (zh) 一种扬声器装置
WO2022006939A1 (zh) 扬声器模组
CN216122888U (zh) 发声装置和电子设备
CN218998264U (zh) 发声装置及电子设备
CN219981029U (zh) 扬声器箱
CN219421017U (zh) 发声装置和终端设备
CN216291335U (zh) 一种扬声器模组和电子设备
WO2022006913A1 (zh) 一种扬声器系统

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18900209

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18900209

Country of ref document: EP

Kind code of ref document: A1