WO2019111477A1 - 表示装置 - Google Patents

表示装置 Download PDF

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Publication number
WO2019111477A1
WO2019111477A1 PCT/JP2018/033639 JP2018033639W WO2019111477A1 WO 2019111477 A1 WO2019111477 A1 WO 2019111477A1 JP 2018033639 W JP2018033639 W JP 2018033639W WO 2019111477 A1 WO2019111477 A1 WO 2019111477A1
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WO
WIPO (PCT)
Prior art keywords
film
display
protective film
area
surface side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2018/033639
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
眞澄 西村
恵美 千田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Display Inc
Original Assignee
Japan Display Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Display Inc filed Critical Japan Display Inc
Priority to CN201880077938.XA priority Critical patent/CN111448604B/zh
Publication of WO2019111477A1 publication Critical patent/WO2019111477A1/ja
Priority to US16/891,094 priority patent/US11276840B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133528—Polarisers
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/06—Electrode terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/198—Contact-type image sensors [CIS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/868—Arrangements for polarized light emission
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present invention relates to a display device.
  • Patent Document 1 As an example for narrowing the frame, in Patent Document 1 below, in a bendable display panel using a resin film having flexibility as a base material, a narrow frame is obtained by bending the area outside the display area to the back side. It is disclosed to make
  • Such a protective film is formed by applying and curing a liquid resin material. At this time, the end of the protective film is formed to cover the end of the film provided on the display surface side of the display panel.
  • the present invention has been made in view of the above problems, and an object thereof is to provide a display device capable of securing the film thickness accuracy of a protective film.
  • the display device of the present invention includes a display area, a terminal area provided with a terminal, and a bendable bending area located between the display area and the terminal area.
  • a display panel in which a bent region is bent and the terminal region is located on the back side opposite to the display surface side with respect to the display region, and a display surface side film provided on the display surface side of the display region;
  • FIG. 2 is a cross-sectional view taken along the line II-II shown in FIG. It is a top view which shows the display panel before bending.
  • FIG. 4 is a cross-sectional view taken along the line IV-IV shown in FIG. 3; It is a block diagram which shows the electric constitution of a display apparatus. It is sectional drawing which shows the cross-section of a display apparatus. It is a figure which shows a 1st example. It is a figure which shows a 2nd example. It is a figure which shows a 3rd example. It is a figure which shows a 4th example.
  • FIG. 1 is a plan view of a display device 1 according to the embodiment.
  • FIG. 2 is a cross-sectional view taken along the line II-II shown in FIG.
  • FIG. 3 is a plan view showing the display panel 10 before bending.
  • FIG. 4 is a cross-sectional view taken along the line IV-IV shown in FIG.
  • the display device 1 is an organic EL display device including, for example, an organic light emitting diode as a display element.
  • the display device 1 includes a bendable display panel 10 using a flexible film as a substrate.
  • the flexible film is formed of, for example, a resin material such as polyimide.
  • the display panel 10 includes a display area A, a frame area B surrounding the display area A, a bending area C adjacent to one side of the frame area B, and a terminal area D adjacent to the bending area C.
  • the X direction in FIGS. 1 to 4 represents the direction in which the display area A, the bending area C, and the frame area B are arranged, and the Y direction represents the direction orthogonal to the X direction.
  • the F direction in FIGS. 2 and 4 represents the display surface side, and the R direction represents the back surface side.
  • full-color pixels P in which unit pixels (sub-pixels) of a plurality of colors of red, green and blue, for example, are combined are arranged in a matrix.
  • Peripheral circuits may be arranged in the frame area B.
  • a terminal (not shown) is provided in the terminal area D, and an IC chip (integrated circuit chip) 18 and an FPC (flexible printed circuit board) 19 are connected.
  • the IC chip 18 may be mounted on the FPC 19.
  • the pixel P in the display area A and the terminal in the terminal area D are electrically connected via a wiring (not shown) passing through the frame area B and the bending area C.
  • the display panel 10 is bent in the bending area C, and the terminal area D is located on the back side of the display area A. Thereby, narrowing of the frame is realized.
  • a display surface film 31 is provided on the display surface side of the display panel 10.
  • the display surface side film 31 is an optically transparent film formed of, for example, a resin material such as cycloolefin polymer (COP) or triacetyl cellulose (TAC), and is attached to the display panel 10 with a resin adhesive, for example.
  • the display surface side film 31 may include a touch sensor.
  • a polarizing plate 33 is provided on the display surface side of the display surface side film 31.
  • the polarizing plate 33 is an example of a light transmitting plate.
  • the polarizing plate 33 is attached to the display surface side film 31 by, for example, a resin adhesive.
  • a cover glass may be provided on the polarizing plate 33.
  • the cover glass may be an example of a light transmitting plate.
  • a back side film 2 is provided on the back side of the display panel 10.
  • the back surface side film 2 is formed, for example with resin materials, such as PET, and is stuck on the display panel 10 by resin-type adhesive agent, for example.
  • the back side film 2 includes a first film portion 21 attached to the back of the display area A and the frame area B, and a second film portion 22 attached to the back of the terminal area D.
  • the back side film 2 is not attached to the bending area C.
  • the bent region C is bent, and the terminal region D and the second film portion 22 are located on the back surface side of the display region A, the frame region B, and the first film portion 21. That is, the first film portion 21 and the second film portion 22 are located inside the bent display panel 10.
  • the back surface of the first film portion 21 and the back surface of the second film portion 22 face each other.
  • the laminated film 4 is attached to the back surface of the first film portion 21.
  • the laminated film 4 includes a buffer film, a heat radiation film, an adhesive tape, and the like.
  • the buffer film is also called a cushion tape, and is formed of, for example, a resin foam material.
  • the heat dissipation film is, for example, a film formed of a metal such as graphite or copper.
  • a spacer 6 for guiding the bending of the bending area C of the display panel 10 is disposed between the first film portion 21 and the second film portion 22 of the back side film 2.
  • the spacer 6 is sandwiched between the first film portion 21 and the second film portion 22 and is in contact with the back surface of the bending region C.
  • the spacer 6 suppresses excessive bending of the bending region C and maintains constant bending.
  • a protective film 5 is provided on the display surface side of the bending region C.
  • the protective film 5 is formed of, for example, a resin material such as an acrylic resin or an epoxy resin.
  • the protective film 5 is formed, for example, by applying a liquid resin material on the display surface side of the bending region C and curing it.
  • the thickness of the display panel 10 is, for example, several micrometers to several tens of micrometers, and the thickness of the protective film 5 is, for example, several tens of micrometers to several hundreds of micrometers. Details of the protective film 5 will be described later.
  • FIG. 5 is a block diagram showing the electrical configuration of the display device 1.
  • the display device 1 includes a pixel array unit 202 provided in a display area A (see FIG. 1 and the like). The figure shows the circuit configuration of one unit pixel included in the pixel array unit 202.
  • the unit pixel includes an organic light emitting diode (OLED) 204 and a pixel circuit 206.
  • the pixel circuit 206 includes a sampling TFT 208, a driving TFT 210 and a capacitor 212.
  • the drive TFT 210 is, for example, a p-type MOSFET.
  • the display device 1 includes a scanning line drive circuit 214 for driving the pixel array unit 202, a video line drive circuit 216, a drive power supply circuit 218, and a control device 220.
  • the scanning line drive circuit 214, the video line drive circuit 216, and the drive power supply circuit 218 are provided in the frame area B (see FIG. 1 and the like).
  • the scanning line driving circuit 214 is connected to a scanning signal line 222 provided for each row (pixel row) of unit pixels in the horizontal direction.
  • the scanning line driving circuit 214 sequentially applies a voltage for turning on the sampling TFT 208 to the scanning signal line 222 in response to the timing signal from the control device 220 (that is, selects the pixel rows in order).
  • the video line drive circuit 216 is connected to a video signal line 224 provided for each vertical row (pixel row) of unit pixels.
  • the video line drive circuit 216 applies a voltage according to the video signal from the control device 220 to each sampling TFT 208 included in the selected pixel row in accordance with the selection of the pixel row by the scanning line drive circuit 214.
  • a voltage corresponding to the video signal is written to each of the capacitors 212 included in the selected pixel row through the sampling TFT 208.
  • the drive power supply circuit 218 is connected to a drive power supply line 226 provided for each vertical row (pixel row) of unit pixels.
  • the drive power supply circuit 218 supplies current to the OLED 204 through the drive power supply line 226 and the drive TFT 210.
  • the drive TFT 210 supplies a current corresponding to the voltage written to the capacitor 212 to the OLED 204. Thereby, the OLED 204 emits light.
  • FIG. 6 is a cross-sectional view showing a cross-sectional structure of the pixel array unit 202. As shown in FIG. In the same figure, hatching of some layers is omitted in order to make the cross-sectional structure more visible. In the following description, the stacking direction is upward.
  • the substrate 300 is made of, for example, a flexible resin such as polyimide.
  • the top surface of the substrate 300 is covered by an undercoat layer 304.
  • the semiconductor layer 306 is formed on the undercoat layer 304, and the semiconductor layer 306 is covered with the gate insulating film 308.
  • a gate electrode 310 is formed on the gate insulating film 308, and the gate electrode 310 is covered with a passivation film 312.
  • the drain electrode 314 and the source electrode 316 are connected to the semiconductor layer 306 through the gate insulating film 308 and the passivation film 312.
  • the semiconductor layer 306, the gate electrode 310, the drain electrode 314, and the source electrode 316 form a thin film transistor 302.
  • the thin film transistor 302 is provided to correspond to each of the plurality of unit pixels.
  • the undercoat layer 304, the gate insulating film 308 and the passivation film 312 are formed of, for example, an inorganic insulating material such as SiO 2 or SiN.
  • the semiconductor layer 306 is made of, for example, a semiconductor such as low temperature poly-silicon (LTPS).
  • the drain electrode 314 and the source electrode 316 are covered by an interlayer insulating film 318, and the interlayer insulating film 318 is covered by a planarization film 322.
  • the drain electrode 314 and the source electrode 316 are formed of a conductive material containing, for example, Al, Ag, Cu, Ni, Ti, Mo or the like.
  • the interlayer insulating film 318 is formed of, for example, an inorganic insulating material such as SiO 2 or SiN.
  • the planarization film 322 is formed of, for example, an organic insulating material such as an acrylic resin, and has a flat upper surface.
  • the pixel electrode 324 is formed on the planarization film 322.
  • the pixel electrode 324 is connected to the connection electrode 320 connected to the source electrode 316 through the planarization film 322 and the interlayer insulating film 318.
  • the pixel electrodes 324 are individually provided to correspond to the plurality of unit pixels.
  • the display panel 10 is a top emission type, and the pixel electrode 324 is formed as a reflective electrode.
  • the pixel electrode 324 is formed to include, for example, a conductive material containing Al, Ag, Cu, Ni, Ti, Mo or the like, or a conductive oxide such as ITO, IZO or the like.
  • the pixel electrode 324 is covered by a pixel separation film 334.
  • the pixel separation film 334 is also called a rib or a bank.
  • the pixel separation film 334 is formed with an opening through which the pixel electrode 324 is exposed at the bottom.
  • the inner edge portion of the pixel separation film 334 forming the opening is on the peripheral portion of the pixel electrode 324, and the pixel separation film 334 has a forward tapered shape in which the width decreases in the upward direction from the bottom in cross sectional view .
  • the pixel separation film 334 is formed of, for example, an organic insulating material such as an acrylic resin or a polyimide resin.
  • a light emitting layer 326 is formed on the pixel electrode 324 exposed at the bottom of the opening of the pixel separation film 334.
  • a hole transport layer, a hole injection layer, an electron transport layer, and at least one electron injection layer may be formed together with the light emitting layer 326.
  • the light emitting layer 326 is formed by vapor deposition as a uniform film (so-called solid film) which spreads over the entire display region A continuously over the adjacent openings 55 a and the pixel separation film 334 therebetween. In this case, the light emitting layer 326 emits light of a single color, and components of plural colors of red, green and blue are extracted by the color filter and the color conversion layer. Alternatively, the light emitting layers 326 may be separately deposited separately from each other using a mask.
  • the light emitting layer 326 emits light in a plurality of colors, for example, red, green and blue, corresponding to each of the plurality of unit pixels.
  • the light emitting layer 326 is not limited to vapor deposition, and may be formed by coating.
  • the light emitting layer 326 and the pixel separation film 334 are covered by the counter electrode 328.
  • the counter electrode 328 is formed as a uniform film (so-called solid film) which spreads over the entire display area A.
  • the light emitting layer 326 and the pixel electrode 324 and the counter electrode 328 sandwiching the light emitting layer 326 constitute an organic light emitting diode (OLED), one of the pixel electrode 324 and the counter electrode 328 is an anode, the other is a cathode, and the light emitting layer 326 is a pixel electrode. Light is emitted by the current flowing between 324 and the counter electrode 328.
  • the counter electrode 328 is formed of, for example, a transparent conductive material such as ITO or IZO or a metal thin film such as MgAg.
  • the pixel separation film 334 and the counter electrode 328 are sealed by being covered with a sealing film (passivation film) 330, and are shielded from moisture.
  • the sealing film 330 is formed of, for example, an inorganic insulating material such as SiO 2 or SiN.
  • the sealing film 330 is covered by a protective film 336.
  • the protective film 336 is formed of, for example, an organic insulating material such as an acrylic resin, and secures mechanical resistance.
  • 7 to 10 are diagrams showing first to fourth specific examples.
  • the frame area B and its vicinity are enlarged.
  • the in-plane direction inside refers to the direction (X direction in the figure) of the display area A with respect to the frame area B
  • the in-plane direction outside refers to the direction of the bending area C with respect to the frame area B (X direction in the figure Points in the opposite direction).
  • the display surface side film 31 is mainly provided in the display region A, and the end surface 601 of the display surface side film 31 is located in the frame region B outside the display region A in the in-plane direction.
  • the end surface 601 of the display surface side film 31 is a surface formed at the end of the display surface side film 31 and directed outward in the in-plane direction.
  • the protective film 5 is mainly provided in the bending area C, and the end surface 501 of the protective film 5 is located inside the in-plane direction of the bending area C and in the frame area B. That is, the end surface 501 of the protective film 5 is located inward in the in-plane direction of the end surface 801 of the first film portion 21 of the back side film 2.
  • the end surface 501 of the protective film 5 is a surface formed at the end of the protective film 5 and directed inward in the in-plane direction.
  • the protective film 5 is located on the outer side in the in-plane direction of the display surface side film 31, and the end surface 501 of the protective film 5 is opposed to the end surface 601 of the display surface side film 31. For this reason, the end 505 of the protective film 5 is not formed on the display surface film 31.
  • the end 505 of the protective coating 5 is a portion of the end of the protective coating 5 including the end face 501.
  • the polarizing plate 33 is adhered to the upper surface 603 of the display surface-side film 31 by the adhesive 9.
  • the upper surface 603 of the display surface side film 31 is a surface on the display surface side of the display surface side film 31. Furthermore, the polarizing plate 33 covers the end 505 of the protective film 5 and is bonded to the end 505 of the protective film 5.
  • An adhesive 9 is interposed between the polarizing plate 33 and the end 505 of the protective film 5.
  • the display surface side film 31 is provided in the display area A of the display panel 10, and then the protective film 5 is provided in the bending region C of the display panel 10, and then the display surface side film 31 and the end of the protective film 5 This is realized by providing the polarizing plate 33 on the portion 505.
  • the polarizing plate 33 is mainly provided in the display area A, and the end face 701 of the polarizing plate 33 is located outside the in-plane direction of the display area A and in the frame area B.
  • the end face 701 of the polarizing plate 33 is a surface formed at the end of the polarizing plate 33 and directed outward in the in-plane direction.
  • the end face 701 of the polarizing plate 33 is located outside the end face 601 of the display surface-side film 31 in the in-plane direction. In other words, the end surface 601 of the display surface side film 31 is located inward in the in-plane direction from the end surface 701 of the polarizing plate 33.
  • the end face 701 of the polarizing plate 33 is located on the outer side in the in-plane direction than the end face 501 of the protective film 5.
  • the end surface 501 of the protective film 5 is located inward in the in-plane direction from the end surface 701 of the polarizing plate 33.
  • the end 505 of the protective film 5 is located between the polarizing plate 33 and the first film portion 21. That is, the first film portion 21, the protective film 5, and the polarizing plate 33 are vertically aligned, and overlap in a plan view. It can be said that the polarizing plate 33 and the first film portion 21 sandwich the display panel 10 and the end portion 505 of the protective film 5.
  • the end face 601 of the display surface side film 31 and the end face 501 of the protective film 5 are preferably in contact as in the first to third specific examples shown in FIGS. 7 to 9, but the fourth example shown in FIG. They may be separated as in the specific example. Even if the two are in contact at the beginning, they may be separated due to aging.
  • the end surface 501 of the protective film 5 is inclined downward as it approaches the display surface side film 31 as in the first and second examples shown in FIGS. 7-8 and 10 due to surface tension in the liquid state.
  • the upper surface 503 of the protective film 5 may be inclined upward as it approaches the display surface side film 31 as in the third specific example shown in FIG.
  • the height of the upper surface 503 of the protective film 5 is preferably the same as the upper surface 603 of the display surface side film 31 as in the first and fourth specific examples shown in FIGS. As in the second specific example shown in FIG. 9, it may be higher than the upper surface 603 of the display surface side film 31, or lower than the upper surface 603 of the display surface side film 31 as in the third specific example shown in FIG.
  • the protective coating 5 is not formed so that the end portion 505 of the protective coating 5 is formed on the display surface side film 31, and the end surface 501 of the protective coating 5 faces the end surface 601 of the display surface side film 31.
  • the film thickness accuracy of the protective film 5 can be secured by forming the Thereby, it becomes easy to make the protective film 5 into a desired film thickness, and it becomes possible to obtain desired flexibility.
  • the polarizing plate 33 is used to cover the end 505 of the protective film 5.
  • a cover glass provided on the polarizing plate 33 may be configured to cover the end 505 of the protective film 5 and be bonded to the end 505 of the protective film 5.
  • the display surface side film 31 made of an optical transparent film (which may include a touch sensor) as an example of the display surface side film, and the polarizing plate 33 as an example of a light transmitting plate Is not limited to this.
  • the display surface side film may be a polarizing plate (polarizing film), and the light transmitting plate may be a plate including a touch sensor.
  • the display surface side film may be a film including a touch sensor, and the light transmitting plate may be a cover glass.
  • the display surface side film may be a polarizing plate (polarizing film), and the light transmitting plate may be a cover glass.
  • the case of the organic EL display device has been exemplified as the disclosed example, but as another application example, an electronic paper type display device having a liquid crystal display device, another self-luminous display device, an electrophoretic element or the like And any flat panel type display device. Further, it is needless to say that the invention can be applied to medium to small size and large size without particular limitation.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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CN111448604A (zh) 2020-07-24
US11276840B2 (en) 2022-03-15
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US20200295303A1 (en) 2020-09-17
JP2019101262A (ja) 2019-06-24

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