WO2019104937A1 - 一种双层胶led显示屏及其加工方法 - Google Patents

一种双层胶led显示屏及其加工方法 Download PDF

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Publication number
WO2019104937A1
WO2019104937A1 PCT/CN2018/084694 CN2018084694W WO2019104937A1 WO 2019104937 A1 WO2019104937 A1 WO 2019104937A1 CN 2018084694 W CN2018084694 W CN 2018084694W WO 2019104937 A1 WO2019104937 A1 WO 2019104937A1
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led light
layer
black
double
display screen
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PCT/CN2018/084694
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English (en)
French (fr)
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张峰
蒋科政
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深圳市秀狐科技有限公司
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Publication of WO2019104937A1 publication Critical patent/WO2019104937A1/zh

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes

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  • the invention relates to the technical field of display screens, in particular to a double-layer glue LED display screen and a processing method thereof.
  • LED displays have been rapidly developed due to their high brightness, low power consumption, stable performance, etc., and are increasingly used in people's daily lives, for example, in leisure squares, commercial streets, Electronic display screens in hospitals, train stations, concerts, etc.
  • the existing LED display screens generally have LED light-emitting chips mounted on the circuit board, and the LED display lamps are protected by screwing the plastic masks.
  • the plastic masks are arranged according to the matrix arrangement of the LED light-emitting chips to form LED light-emitting chips.
  • the grid structure between the LED light-emitting chips can be protected inside the plastic mask.
  • thousands of LED light-emitting chips arranged in a matrix are arranged on the circuit board to form a background screen, and images can be played.
  • the plastic mask has the disadvantages of no waterproof, no anti-static, no fireproof, no pressure resistance, no oxidation resistance and short service life, and the bone structure is slightly higher than the height of the LED light-emitting chip, which causes the side light-emitting angle of the LED light-emitting chip. Small, that is, the viewing angle is narrow, a large number of LED light-emitting chips will form mutual interference, which will produce moiré phenomenon when displayed, affecting the display effect.
  • the front side of the plastic mask serves as the background color of the display screen, and the original color of the plastic mask is sprayed by the machine through the high temperature inkjet method, which is difficult to maintain.
  • the color is the same, especially when the large-area display is spliced, there will be chromatic aberration, so when the LED display is spliced together, there will be a large color inconsistency, which will affect the display effect, and the customer will not accept the product of the display. and service.
  • the process of fixing the plastic panel using screws is complicated, it is difficult to control the quality consistency of the product, and a large amount of manual operation is required.
  • the density of the LED light-emitting chip increases (the LED light-emitting chip becomes smaller, in order to increase the resolution of the entire screen, that is, the pixel becomes smaller and denser), the spacing between the LED light-emitting chips becomes smaller, and the plastic mask is processed more and more. The more difficult it is, the more difficult it is to assemble, which means that the plastic mask does not have the effect of protecting the LED display with small dot spacing.
  • the object of the present invention is to provide a double-layer adhesive LED display screen and a processing method thereof, which aim to solve the problem that the double-layer adhesive LED display screen in the prior art has poor display effect and narrow viewing angle. problem.
  • a double-layer adhesive LED display screen comprising a circuit board and an LED light-emitting chip mounted on the surface of the circuit board, wherein the LED light-emitting chip covering the surface of the circuit board further comprises a gap filled with the LED light-emitting chip The black rubber layer, and the upper surface of the LED light-emitting chip is flush with the black rubber layer to form a flat surface;
  • the double-layer glue LED display screen wherein the black glue layer is a black hot melt adhesive layer.
  • the double-layer adhesive LED display screen wherein the transparent adhesive layer is one of epoxy resin, PU glue and UV glue.
  • the double-layer adhesive LED display screen wherein the black rubber layer is formed by low temperature low pressure injection molding.
  • the double-layer glue LED display screen wherein the transparent glue layer is formed by a glue filling method.
  • the double-layer glue LED display screen wherein the glue filling method is inverted potting.
  • the double-layer adhesive LED display screen has a center-to-center spacing of adjacent LED light-emitting chips of 2.0-5.0 mm.
  • a double-layer adhesive LED display processing method which comprises:
  • the circuit board with the LED light-emitting chip is placed in the first cavity, and the black gel is injected at a low temperature and low pressure on the surface of the circuit board on which the LED light-emitting chip is attached until it is flush with the upper surface of the LED light-emitting chip to form a flat black rubber.
  • Floor
  • the transparent cavity is poured into a second cavity, and the circuit board with the LED light-emitting chip is placed upside down, and the second cavity is placed, and the side of the LED light-emitting chip is mounted.
  • a transparent rubber layer having a flat surface is formed.
  • the double-layer glue LED display processing method wherein the black colloid is a black hot melt adhesive.
  • the method for processing a double-layer adhesive LED display screen wherein the transparent colloid is one of epoxy resin, PU glue and UV glue.
  • the present invention provides a double-layer adhesive LED display screen, comprising a circuit board and an LED light-emitting chip mounted on the surface of the circuit board, and further comprising a black rubber layer covering the surface of the circuit board.
  • the LED light-emitting chip gap is filled with the black rubber layer, and the upper surface of the LED light-emitting chip is flush with the black rubber layer to form a flat surface; and the surface covered on the black rubber layer and the LED light-emitting chip is flat.
  • Transparent layer of glue
  • the double-layer glue LED display provided by the invention enables the LED light-emitting chip to be protected by the black rubber layer, thereby ensuring the consistency of the color of the surface after the display screen is spliced, and the black rubber layer is flush with the upper surface of the LED light-emitting chip, thereby expanding the viewing angle of the display screen. And avoid the moiré phenomenon, improve the display effect of the double-layer plastic LED display, and also have a transparent adhesive layer to protect, which can achieve waterproof, fireproof, dustproof, anti-static and anti-pressure effects. The problem that the display effect of the LED display screen in the prior art is poor and the viewing angle is narrow is effectively solved.
  • FIG. 1 is a schematic structural view of a preferred embodiment of a double-layer LED display screen of the present invention.
  • FIG. 2 is a front elevational view of a preferred embodiment of a double-layer LED display screen of the present invention.
  • FIG 3 is a side elevational view of a preferred embodiment of a double layer LED display screen of the present invention.
  • FIG. 4 is a flow chart of a preferred embodiment of a double-layer LED display screen processing method of the present invention.
  • the present invention provides a double-layered plastic LED display screen and a processing method thereof.
  • the present invention will be further described in detail below with reference to the accompanying drawings. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
  • FIG. 1 is a schematic structural view of a preferred embodiment of a double-layer LED display screen according to the present invention
  • FIG. 2 is a front view of a preferred embodiment of a double-layer LED display screen according to the present invention
  • the present invention provides a double-layer adhesive LED display screen comprising a circuit board 10, an LED light-emitting chip 20, a black glue layer 30 and a transparent glue layer 40.
  • the LED light-emitting chip 20 is mounted on the surface of the circuit board 10, and the size of the LED light-emitting chip used, and the row-column spacing thereof can be set according to actual needs.
  • the black glue layer 30 of the present invention covers the surface of the circuit board 10 on which the LED light-emitting chip 20 is mounted.
  • the LED light-emitting chip 20 is gap-filled with the black glue layer 30, and the upper surface of the LED light-emitting chip 20 and the black glue
  • the layer 30 is flush and forms a flat surface, that is, the black glue layer 30 covers only the gap between the LED light-emitting chips 20 to increase the light-emitting viewing angle of the LED light-emitting chip 20.
  • the transparent adhesive layer 40 covers the upper surface of the black rubber layer 30 and the LED light emitting chip 20, and the surface thereof is smooth and flat. That is to say, as shown in FIG. 3, the double-layer LED display screen of the present invention comprises three layers in total, and from bottom to top, the circuit board 10, the black glue layer 30 and the transparent glue layer 40, the LED light-emitting chip 20 and the black glue Layers 30 together form the middle layer.
  • the adjacent LED light-emitting chips 20 Adjacent to the center spacing of the LED light-emitting chips 20, a larger pitch display screen can be achieved, and a smaller pitch display screen can be achieved.
  • the adjacent LED light-emitting chips 20 have a center-to-center spacing of 2.0-5.0 mm. That is, the center distance of the LED light-emitting chip 20 which is most suitable for the present invention ranges from 2.0 to 5.0 mm. That is to say, the LED light-emitting chip 20 using the black rubber layer of the invention can achieve a small dot pitch, the pixel is high, and the display picture is clearer.
  • the black adhesive layer 30 is preferably a black hot melt adhesive layer formed on the surface of the circuit board 10 on which the LED light emitting chip 20 has been mounted by low temperature low pressure injection molding, that is, already mounted.
  • a black hot melt adhesive is injected into the gap between the LED light-emitting chips 20 by a low-temperature low-pressure injection molding process to form a black hot melt adhesive layer.
  • the black hot melt adhesive layer forms a flat surface with the upper surface of all the LED light emitting chips 20, and the purpose thereof is to protect the LED light emitting chip 20 from being damaged by external force and to make the light of the LED light emitting chip 20 Normally emitted, that is, the LED light-emitting chip 20 constitutes a pixel on the surface of the black hot melt adhesive layer.
  • the transparent adhesive layer 40 is one of an epoxy resin, a PU adhesive, and a UV adhesive.
  • the transparent adhesive layer 40 is formed by a potting method.
  • the filling method is an inverted potting.
  • the inverted potting is to first inject a transparent colloid into the second cavity, and then invert the LED board 20 and the circuit board 10 in which the black glue layer 30 is injected, and keep the side on which the LED light emitting chip is mounted facing downward. Slowly pressing down the circuit board 10, since the bottom of the cavity is flat and then cured, a transparent adhesive layer 30 having a flat surface is formed. It is necessary to understand that the surface of the LED display screen must be flat to enable the LED light-emitting chip.
  • the light of 20 is emitted in the normal direction to play a normal picture.
  • the inverted potting material forms a transparent adhesive layer 40 having a flat surface, the purpose of which is to protect the LED light-emitting chip 20 from being damaged by external force, and to enable the light of the LED light-emitting chip 20 to be normally emitted, and transparent.
  • the rubber layer 40 has the advantages of waterproof, dustproof, moisture proof, antistatic, fireproof, anti-collision, anti-pressure, anti-oxidation and long service life.
  • the surface of the LED display screen should avoid smooth reflection
  • the double-layered plastic LED display screen provided by the invention is a transparent adhesive layer 40, which is smooth and reflective, so the invention obtains an intermediate product, and the final finished double layer.
  • the surface of the plastic LED display is a matt surface, avoiding the problem of reflection.
  • the LED display screen protects the LED light-emitting chip 20 from damage by using a plastic mask.
  • the technical defects such as the background technology part of the explanation, the protective effect of the plastic mask will have a negative impact:
  • First, due to the plastic mask The height is slightly higher than the height of the LED light-emitting chip 20, which affects the divergence of light, so that the side light-emitting angle is small, that is, the angle of view is narrow. For example, when watching a concert in the field, the scene usually has a large number of people, watching the LED display screen. At the side angle, the viewer cannot clearly and completely view the LED display screen.
  • the height of the plastic mask is slightly higher than the height of the LED light-emitting chip 20, which brings another problem.
  • the existing LED display is a circuit
  • the original color of the board 10 and the plastic mask is a ground color, generally black (the color of the black color is such that the color of the light of the LED light emitting chip 20 is not changed), Therefore, the machine is sprayed by high-temperature inkjet, and the color is difficult to maintain completely consistent (there is chromatic aberration drift, it is difficult to control its balance), therefore, when several displays are spliced together, the difference is naked It can be seen that the image effect formed by the LED light emitting chip 20 is affected.
  • the plastic mask has the disadvantages of no waterproof, no fire, no dust, no anti-static, no pressure resistance, no oxidation resistance and short service life.
  • the double-layer LED display screen provided by the invention protects the LED light-emitting chip 20 by using the black glue layer 30, and then covers a layer of transparent glue 40 on the black glue layer 30. Since the transparent glue layer 40 is transparent, it is not The light emitted by the LED light-emitting chip 20 is blocked, so that the LED light-emitting chip 20 is more comprehensively protected and solves the above problems.
  • the black glue layer 30 is completed by low-temperature injection molding, which can control the consistency of the surface color stitching and improve the display effect.
  • the black glue layer 30 and the LED light-emitting chip 20 form a flat surface, and therefore, the light emission of the LED light-emitting chip 20 is not affected, and the light can be emitted from a small angle of the side of the display screen, and the viewing angle becomes large, and the viewing effect is improved. better.
  • the LED light-emitting chip 20 emits light, there is no obstruction, and no moiré phenomenon occurs.
  • the black hot melt adhesive can also be injected into the gap of the LED light emitting chip 20, and the production process has a wider adapting range.
  • the transparent adhesive layer 40 makes the double-layered plastic LED display of the invention have the advantages of waterproof, dustproof, moistureproof, antistatic, fireproof, anti-collision, anti-pressure, anti-oxidation and long service life.
  • the plurality of double-layer LED display screens of the present invention can be seamlessly connected after being spliced, and the large screen is not composed when viewed by a person, that is, the visually complete large screen. Therefore, the display is better.
  • the present invention also provides a double-layer glue LED display processing method, comprising the following steps:
  • the circuit board with the LED light-emitting chip is placed in the first cavity, and the black gel is injected at a low temperature and low pressure on the surface of the circuit board on which the LED light-emitting chip is attached until it is flush with the upper surface of the LED light-emitting chip to form a flat surface.
  • Black rubber layer
  • step S100 the LED light emitting chip 20 is mounted and fixed on the surface of the circuit board 10.
  • the center-to-center spacing of adjacent LED light-emitting chips 20 on the surface of the circuit board 10 can achieve a large-pitch display screen, and can also achieve a small-pitch pitch display.
  • the adjacent LED light-emitting chips 20 have a center-to-center spacing of 2.0-5.0 mm. . That is, the center distance of the LED light-emitting chip 20 which is most suitable for the vinyl LED display of the present invention ranges from 2.0 to 5.0 mm. The pixels are very high and the display is clearer.
  • the black colloid is preferably a black hot melt adhesive
  • the low temperature low pressure injection molded black hot melt adhesive has a temperature of 180-240 ° C and a pressure of 1.5-40 Bar.
  • the most suitable range for low-temperature low-pressure injection of black colloid is 2.0-5.0 mm.
  • the mold used in the present invention is a special large mold. After the circuit board 10 on which the LED light-emitting chip 20 is mounted is placed in the cavity, the black hot melt adhesive is introduced through the nine glue inlets until the black hot melt adhesive is filled with the LED.
  • the gap of the light-emitting chip 20 is preferably 1.7 mm in diameter.
  • the transparent colloid is one of epoxy resin, PU glue and UV glue.
  • the transparent cavity is filled into the cavity, and it is necessary to completely cover the LED light-emitting chip 20 and the black glue layer 30, and then the circuit board 10 is inverted, and the side on which the LED light-emitting chip is mounted is kept facing downward, that is, the circuit board is maintained. 10
  • the bottom case faces upward, and the circuit board 10 is slowly pressed down to the cavity. Since the bottom of the cavity is flat, a transparent adhesive layer 40 having a flat surface is formed.
  • the inverted potting material forms a transparent adhesive layer 30 having a flat surface, and the purpose thereof is to protect the LED light-emitting chip 20 from being damaged by external force and to cause the light of the LED light-emitting chip 20 to be normally emitted.
  • the circuit board 10 is gradually pressed down, so that the upper surface of the LED light emitting chip 20 and the black rubber layer 30 forms a transparent adhesive layer 40.
  • the thickness of the transparent adhesive layer 40 can be controlled at this time, for example, to make a certain thickness of transparency.
  • the glue layer 30, the circuit board 10 is pressed down to the same height from the bottom of the cavity, and naturally cooled, and then the circuit board 10 covered with the transparent colloid is placed in a curing oven for curing together with the mold.
  • the curing oven temperature is 80. °C, after curing for 4 hours, take out, use the CNC machine tool to clean out the excess transparent colloid, and then process a double-layer plastic LED display with black rubber layer 30 and transparent glue layer 40.
  • the surface of the LED display screen must be flat to enable the light of the LED light-emitting chip 20 to be emitted in a normal direction to play a normal picture.
  • the bottom of the cavity of the mold used is flat, and the circuit board 10 coated with the transparent colloid is placed in a curing oven for curing together with the mold, thereby ensuring the flatness of the transparent adhesive layer 40. Thereby ensuring the quality of the LED display.

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Abstract

一种双层胶LED显示屏及其加工方法，包括电路板(10)和贴装在电路板(10)表面的LED发光芯片(20)，还包括覆盖在电路板(10)表面的黑色胶层(30)，LED发光芯片(20)间隙填充有黑色胶层(30)，且LED发光芯片(20)的上表面与黑色胶层(30)平齐，形成平整的表面；以及覆盖在黑色胶层(30)及LED发光芯片(20)上面的表面平整的透明胶层(40)。双层胶LED显示屏使得LED发光芯片(20)被黑色胶层(30)保护，保证了显示屏拼接后表面颜色的一致性，黑色胶层(30)与LED发光芯片(20)上表面平齐，扩大了显示屏的视角并避免了摩尔纹现象，并且还有透明胶层(40)做保护，可达到防水、防火、防尘、防静电及抗压的效果。

Description

一种双层胶LED显示屏及其加工方法 技术领域
本发明涉及显示屏技术领域，尤其涉及的是一种双层胶LED显示屏及其加工方法。
背景技术
LED显示屏因其亮度高、功耗低、性能稳定等特点正受到广泛的重视而得到迅速发展，并且越来越多地应用于人们的日常生活中，例如，设置于休闲广场、商业街、医院、火车站、演唱会等场所的电子显示屏。
现有的LED显示屏一般都是将LED发光芯片贴装在电路板上，通过螺丝拴紧塑胶面罩来保护LED显示灯，塑胶面罩根据LED发光芯片的矩阵排列位置，形成能够落入LED发光芯片之间的网格结构，可以将LED发光芯片保护在塑胶面罩内。大的显示屏结构中，矩阵排列的LED发光芯片成千上万的设置在电路板上，形成背景屏幕，可以播放图像。
该塑胶面罩有不防水、不防静电、不防火、不抗压、不抗氧化及使用寿命短等缺点，其筋骨结构稍高于LED发光芯片的高度，就会导致LED发光芯片的侧面发光角度小，也就是视角较窄，大量LED发光芯片发光会形成相互干扰，在显示时会产生摩尔纹现象，影响显示效果。
而且，用塑胶面罩作为保护的LED显示屏电路板的前罩时，塑胶面罩的前侧面作为显示屏的底色，而塑胶面罩的原始颜色是机器通过高温喷墨方式喷上去的，很难保持颜色一致，尤其是大面积的显示屏拼接时，会存在色差，这样，当LED显示屏拼接在一起时，会出现大块颜色不一致的现象，影响显示效果，导致客户不接受该显示屏的产品和服务。
另外，使用螺丝加工固定塑胶面板的工艺复杂，很难控制产品的质量一致性，又需要大量的人工操作。而当LED发光芯片密度增大时(LED发光芯片变小，为使整个屏幕的分辨率提升，即像素变小变密)，LED发光芯片之间的间距变小，塑胶面罩加工起来就越来越困难，装配也更加困难，也就是说，塑胶面罩达不到保护小点间距的LED显示屏的效果。
因此，现有技术还有待于改进和发展。
发明内容
鉴于上述现有技术的不足，本发明的目的在于提供一种双层胶LED显示屏及其加工方法，旨在解决现有技术中的双层胶LED显示屏显示效果较差、视角较窄的问题。
本发明的技术方案如下：
一种双层胶LED显示屏，包括电路板和贴装在所述电路板表面的LED发光芯片，其中，还包括覆盖在所述电路板表面的黑色胶层，所述LED发光芯片间隙填充有所述黑色胶层，且LED发光芯片的上表面与黑色胶层平齐，形成平整的表面；
以及覆盖在所述黑色胶层及LED发光芯片上面的表面平整的透明胶层。
所述的双层胶LED显示屏，其中，所述黑色胶层为黑色热熔胶层。
所述的双层胶LED显示屏，其中，所述透明胶层为环氧树脂、PU胶及UV胶中的一种。
所述的双层胶LED显示屏，其中，所述黑色胶层通过低温低压注塑形成。
所述的双层胶LED显示屏，其中，所述透明胶层通过灌胶方式形成。
所述的双层胶LED显示屏，其中，所述灌胶方式为倒置灌胶。
所述的双层胶LED显示屏，其中，相邻的LED发光芯片中心间距为2.0-5.0mm。
一种双层胶LED显示屏加工方法，其中，包括：
将若干个LED发光芯片依照设计的需要贴装在电路板表面上；
将贴装有LED发光芯片的电路板放入第一模腔，向贴装有LED发光芯片的电路板表面低温低压注塑黑色胶体，直至与LED发光芯片上表面平齐，形成表面平整的黑色胶层；
待黑色胶层固化后，向一第二模腔中灌注透明胶体，倒置贴装有LED发光芯片的电路板，放入所述第二模腔，保持安装有所述LED发光芯片的一面朝下，在所述黑色胶层及所述LED发光芯片上面形成透明胶层；
待所述透明胶体固化后，形成表面平整的透明胶层。
所述的双层胶LED显示屏加工方法，其中，所述黑色胶体为黑色热熔胶。
所述的双层胶LED显示屏加工方法，其中，所述透明胶体为环氧树脂、PU胶及UV胶中的一种。
与现有技术相比，本发明提供的一种双层胶LED显示屏，包括电路板和贴装在所述电路板表面的LED发光芯片，还包括覆盖在所述电路板表面的黑色胶层，所述LED发光芯片间隙填充有所述黑色胶层，且LED发光芯片的上表面与黑色胶层平齐，形成平整的表面；以及覆盖在所述黑色胶层及LED发光芯片上面的表面平整的透明胶层。本发明提供的双层胶LED显示屏使得LED发光芯片被黑色胶层保护，保证了显示屏拼接后表面颜色的一致性，黑色胶层与LED发光芯片上表面平齐，扩大了显示屏的视角，并且避免了摩尔纹现象，提升了双层胶LED显示屏的显示效果，并且还有透明胶层做保护，可达到防水、防火、防尘、防静电及抗压的效果。有效地解决了现有技术中LED显示屏的显示效果较差、视角较窄的问题。
附图说明
图1是本发明双层胶LED显示屏较佳实施例的结构示意图。
图2为本发明双层胶LED显示屏较佳实施例的主视图。
图3为本发明双层胶LED显示屏较佳实施例的侧视图。
图4为本发明双层胶LED显示屏加工方法较佳实施例的流程图。
具体实施方式
本发明提供了一种双层胶LED显示屏及其加工方法，为使本发明的目的、技术方案及效果更加清楚、明确，以下参照附图并举实例对本发明进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
图1是本发明一种双层胶LED显示屏较佳实施例的结构示意图；图2为本发明双层胶LED显示屏较佳实施例的主视图；图3为本发明双层胶LED显示屏较佳实施例的侧视图。
如图1、图2及图3所示，本发明提供了一种双层胶LED显示屏，包括电路板10、LED发光芯片20、黑色胶层30和透明胶层40。
所述LED发光芯片20被贴装在所述电路板10的表面，可以根据实际的需要，设置采用的LED发光芯片尺寸，以及其行列间距。
本发明所述黑色胶层30覆盖在贴装有LED发光芯片20的电路板10表面，所述LED发光芯片20间隙填充有所述黑色胶层30，且LED发光芯片20的上 表面与黑色胶层30平齐，形成平整的表面，也即，所述黑色胶层30仅覆盖所述LED发光芯片20之间的空隙，以增加LED发光芯片20的发光视角。
所述透明胶层40覆盖在所述黑色胶层30及LED发光芯片20上表面，其表面光滑平整。也就是说，如图3所示，本发明的双层胶LED显示屏共包括三层，由下至上依次为电路板10、黑色胶层30和透明胶层40，LED发光芯片20与黑色胶层30共同组成了中间的一层。
相邻所述LED发光芯片20的中心间距可以做到较大间距显示屏，还可以做到较小间距显示屏，最优选的，相邻的LED发光芯片20中心间距为2.0-5.0mm。即，本发明最适用的LED发光芯片20的中心间距范围为2.0-5.0mm。也就是说，本发明采用黑色胶层的LED发光芯片20可达到小点间距，像素很高，显示画面更加清晰。
在本发明较佳实施例中，黑色胶层30优选为黑色热熔胶层，通过低温低压注塑的方式形成于已经安装有LED发光芯片20的电路板10表面上，即，在已经贴装好LED发光芯片20阵列的电路板10表面上，在低温低压的条件下，采用低温低压注塑工艺向LED发光芯片20之间的间隙中注塑黑色的热熔胶，使之形成黑色热熔胶层。所述黑色热熔胶层与所有的LED发光芯片20上表面形成平整的表面，其目的是既保护了LED发光芯片20，使之不容易遭受外力而损坏，又能够使LED发光芯片20的光线正常射出，也就是说，LED发光芯片20组成了黑色热熔胶层表面的像素点。
在本发明较佳实施例中，透明胶层40为环氧树脂、PU胶及UV胶中的一种。所述透明胶层40通过灌胶方式形成，优选的，所述灌胶方式为倒置灌胶。倒置灌胶是先向第二模腔中灌注透明胶体，再倒置贴装有LED发光芯片20、注塑有黑色胶层30的电路板10，保持安装有所述LED发光芯片的一面朝下，缓缓下压电路板10，由于模腔底部是平整的，再经过固化，就形成了具有平整表面的透明胶层30，需要了解的是，LED显示屏表面必须保证平整，才能使LED发光芯片20的光线沿正常的方向发射，才能播放出正常的画面。倒置灌胶形成了具有平整的表面的透明胶层40，其目的是既保护了LED发光芯片20，使之不容易遭受外力而损坏，又能够使LED发光芯片20的光线正常射出，并且，透明胶层40具有防水、防尘、防潮、防静电、防火、防碰撞、抗压、抗氧化及使用寿命 长等优点。
事实上，LED显示屏的表面应避免光滑反光，而本发明提供的双层胶LED显示屏表面是透明胶层40，是光滑反光的，因此本发明得到的是中间产品，最终的成品双层胶LED显示屏表面是亚光面的产品，避免了反光的问题。
在现有技术中，LED显示屏是利用塑胶面罩来保护LED发光芯片20不受损坏的，其技术缺陷如背景技术部分的交代，塑胶面罩的保护效果会带来负面影响：一、由于塑胶面罩的高度都稍高于LED发光芯片20的高度，影响了光的发散，使得侧面发光角度小，也就是视角较窄，例如，在现场看演唱会时，现场通常人数很多，在观看LED显示屏时，在侧面角度的观众就无法清晰完整地观看到LED显示屏的画面；二、塑胶面罩的高度稍高于LED发光芯片20的高度还带来了另一个问题，在显示画面时，会产生摩尔纹现象，摩尔纹现象肉眼无法看到，但是使用数码相机或手机拍摄LED显示屏时，会显示出一圈圈一条条的波纹，影响显示效果；三、现有的LED显示屏是以电路板10和塑料面罩的原始颜色为底色的，一般为黑色(以黑色为底色才能使得LED发光芯片20的光线颜色不被改变)，由于是用机器以高温喷墨的方式喷上去的，这样做出的颜色很难保持完全一致(存在色差漂移，很难控制其均衡性)，因此，若干显示屏拼接到一起时，其差异肉眼都可见，影响LED发光芯片20形成的图像效果。四、当LED发光芯片20密度较大、LED发光芯片20之间的间距很小时，塑胶面罩加工难度越来越大(塑胶面罩通过螺丝固定于电路板10上)，并且控制不了其平整度；而且塑胶面罩越小，保护作用也就越小。五、塑胶面罩有不防水、不防火、不防尘、不防静电、不抗压、不抗氧化及使用寿命短等缺点。
本发明提供的双层胶LED显示屏是利用黑色胶层30保护LED发光芯片20，再在黑色胶层30上面覆盖一层透明胶层40，由于透明胶层40是透明的，因此，并不会遮挡LED发光芯片20发出的光线，这样，将LED发光芯片20保护的更加全面，并且解决了以上问题。首先，黑色胶层30是利用低温注塑的方式完成的，可控制其表面颜色拼接后的一致性，提升了显示效果。第二、黑色胶层30与LED发光芯片20形成了平整的表面，因此，不会影响LED发光芯片20光线的发散，从显示屏的侧面偏小的角度也可以发光，视角变大，观看效果更好。第三、LED发光芯片20发射光线时没有了遮挡物，不会产生摩尔纹现象。第四、 LED发光芯片20之间的间距较小时，黑色热熔胶也可注塑进入LED发光芯片20的间隙中，生产工艺的适应范围更宽。第五、透明胶层40使得本发明的双层胶LED显示屏具有防水、防尘、防潮、防静电、防火、防碰撞、抗压、抗氧化及使用寿命长等优点。另外，本发明的若干个双层胶LED显示屏拼接后可实现无缝连接，人们在观看时看不出大屏幕是由若干个显示屏组成，也就是说，视觉上就是完整的大屏幕，因此，显示效果更好。
如图4所示，本发明还提供了一种双层胶LED显示屏加工方法，包括以下步骤：
S100、将若干个LED发光芯片依照设计的需要贴装在电路板表面上；
S200、将贴装有LED发光芯片的电路板放入第一模腔，向贴装有LED发光芯片的电路板表面低温低压注塑黑色胶体，直至与LED发光芯片上表面平齐，形成表面平整的黑色胶层；
S300、待黑色胶层固化后，向一第二模腔中灌注透明胶体，倒置贴装有LED发光芯片的电路板，放入所述第二模腔，保持安装有所述LED发光芯片的一面朝下，在所述黑色胶层及所述LED发光芯片上面形成透明胶层；
S400、待所述透明胶体固化后，形成表面平整的透明胶层。
在步骤S100中，LED发光芯片20贴装固定于所述电路板10表面上。电路板10表面的相邻LED发光芯片20的中心间距可以做到大间距显示屏，还可以做到小点间距显示屏，最优选的，相邻的LED发光芯片20中心间距为2.0-5.0mm。即，本发明的黑胶LED显示屏最适用的LED发光芯片20的中心间距范围为2.0-5.0mm。像素很高，显示画面更加清晰。
在步骤S200中，黑色胶体优选为黑色热熔胶，低温低压注塑黑色热熔胶的温度为180-240℃，压力为1.5-40Bar。相邻LED发光芯片20的中心间距较小时，低温低压注塑黑色胶体时最适用的范围是2.0-5.0mm。本发明中所使用的模具是特制的大型模具，将安装有LED发光芯片20的电路板10放入模腔后，通过9个进胶口将黑色热熔胶导入，直至黑色热熔胶充满LED发光芯片20的间隙,所述进胶口直径优选为1.7mm。
在步骤S300中，所述透明胶体为环氧树脂、PU胶及UV胶中的一种。先向模腔中灌注足够的透明胶体，需保证可完全覆盖LED发光芯片20及黑色胶层 30，再倒置电路板10，保持安装有所述LED发光芯片的一面朝下，即保持电路板10底壳朝上，缓缓下压电路板10至模腔，由于模腔底部是平整的，就形成了具有平整表面的透明胶层40。倒置灌胶形成了具有平整的表面的透明胶层30，其目的是既保护了LED发光芯片20，使之不容易遭受外力而损坏，又能够使LED发光芯片20的光线正常射出。
缓缓下压电路板10，使得LED发光芯片20以及黑色胶层30的上表面形成透明胶层40，当然的，透明胶层40的厚度在此时可以控制，例如需制作某一厚度的透明胶层30，则将电路板10下压至距离模腔底部相同的高度，自然冷却，然后连带模具一起将覆上透明胶体的电路板10放入固化炉进行固化，所述固化炉温度为80℃，固化4个小时后，取出，利用数控机床把多余的透明胶体清理掉，就加工出了具有黑色胶层30和透明胶层40的双层胶LED显示屏。需要了解的是，LED显示屏表面必须保证平整，才能使LED发光芯片20的光线沿正常的方向发射，才能播放出正常的画面。本发明利用的倒置灌胶技术，所用模具的模腔底部是平整的，并且，连带模具一起将覆上透明胶体的电路板10放入固化炉进行固化，保证了透明胶层40的平整度，从而保证了LED显示屏的质量。
应当理解的是，本发明的应用不限于上述的举例，对本领域普通技术人员来说，可以根据上述说明加以改进或变换，所有这些改进和变换都应属于本发明所附权利要求的保护范围。

Claims (10)

  1. 一种双层胶LED显示屏，包括电路板和贴装在所述电路板表面的LED发光芯片，其特征在于，还包括覆盖在所述电路板表面的黑色胶层，所述LED发光芯片间隙填充有所述黑色胶层，且LED发光芯片的上表面与黑色胶层平齐，形成平整的表面；
    以及覆盖在所述黑色胶层及LED发光芯片上面的表面平整的透明胶层。
  2. 根据权利要求1所述的双层胶LED显示屏，其特征在于，所述黑色胶层为黑色热熔胶层。
  3. 根据权利要求1所述的双层胶LED显示屏，其特征在于，所述透明胶层为环氧树脂、PU胶及UV胶中的一种。
  4. 根据权利要求1所述的双层胶LED显示屏，其特征在于，所述黑色胶层通过低温低压注塑形成。
  5. 根据权利要求1所述的双层胶LED显示屏，其特征在于，所述透明胶层通过灌胶方式形成。
  6. 根据权利要求5所述的双层胶LED显示屏，其特征在于，所述灌胶方式为倒置灌胶。
  7. 根据权利要求1所述的双层胶LED显示屏，其特征在于，相邻的LED发光芯片中心间距为2.0-5.0mm。
  8. 一种双层胶LED显示屏加工方法，其特征在于，包括：
    将若干个LED发光芯片依照设计的需要贴装在电路板表面上；
    将贴装有LED发光芯片的电路板放入第一模腔，向贴装有LED发光芯片的电路板表面低温低压注塑黑色胶体，直至与LED发光芯片上表面平齐，形成表面平整的黑色胶层；
    待黑色胶层固化后，向一第二模腔中灌注透明胶体，倒置贴装有LED发光芯片的电路板，放入所述第二模腔，保持安装有所述LED发光芯片的一面朝下，在所述黑色胶层及所述LED发光芯片上面形成透明胶层；
    待所述透明胶体固化后，形成表面平整的透明胶层。
  9. 根据权利要求8所述的双层胶LED显示屏加工方法，其特征在于，所述黑色胶体为黑色热熔胶。
  10. 根据权利要求8所述的双层胶LED显示屏加工方法，其特征在于，所 述透明胶体为环氧树脂、PU胶及UV胶中的一种。
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