WO2019192041A1 - 一种led显示屏及其封装方法 - Google Patents

一种led显示屏及其封装方法 Download PDF

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Publication number
WO2019192041A1
WO2019192041A1 PCT/CN2018/084673 CN2018084673W WO2019192041A1 WO 2019192041 A1 WO2019192041 A1 WO 2019192041A1 CN 2018084673 W CN2018084673 W CN 2018084673W WO 2019192041 A1 WO2019192041 A1 WO 2019192041A1
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WO
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Prior art keywords
led light
led display
circuit board
emitting chip
led
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PCT/CN2018/084673
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English (en)
French (fr)
Inventor
张峰
蒋科政
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深圳市秀狐科技有限公司
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Publication of WO2019192041A1 publication Critical patent/WO2019192041A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0083—Periodic patterns for optical field-shaping in or on the semiconductor body or semiconductor body package, e.g. photonic bandgap structures

Definitions

  • the present invention relates to the field of display technologies, and in particular, to an LED display screen and a packaging method thereof.
  • LED displays have been rapidly developed due to their high brightness, low power consumption, stable performance, etc., and are increasingly used in people's daily lives, for example, in leisure squares, commercial streets, Electronic display screens in hospitals, train stations, concerts, etc.
  • the all-color LED device patch of the integrally molded hidden LED is mounted on the PCB bottom plate, and the LED device and the PCB bottom plate are integrally injection-molded to form a solid structure of the gel panel and the outer casing.
  • the bottom surface of the unitary structure is coated with a coating conforming to the color of the PCB substrate and the LED device, and the remaining modules of the display are mounted on the bottom of the PCB substrate.
  • the LED display When the LED display is in use, it needs multiple LED display screens to form a large display wall. Each screen of the LED display screen is compared with a standard screen. Although the color difference is not much different, there is still a color difference, and the eyes look at the past. The color of the entire display wall is directly reflected in the vision. When multiple LED display screens are combined, the color is a single overall appearance, which leads to a special color difference. Multiple LED display screens can be seen together through visual contrast. The color of the overall display wall is obviously different; due to the chromatic aberration of the single display, the seam at the splicing can be clearly observed, and the display has obvious separation feeling, the seam is visually obvious, and the display effect is better. difference.
  • an object of the present invention is to provide an LED display screen and a packaging method thereof, which aim to solve the obvious difference in the overall color of the LED display screens in the prior art, and the seams are obviously visible. , showing poor results.
  • An LED display screen comprising a circuit board and an LED light-emitting chip mounted on the surface of the circuit board, further comprising an insulating layer covering the surface of the circuit board and filling a gap of the LED light-emitting chip, And a plurality of protrusions located between the LED light-emitting chip gaps and fixedly disposed on the surface of the insulating adhesive layer, the upper surface of the LED light-emitting chip is flush with the upper surface of the insulating rubber layer, and the upper surface height of the protruding body is higher than the above The height of the upper surface of the LED light-emitting chip, the discontinuous color composed of a plurality of protrusions can be displayed to weaken the chromatic aberration of the insulating layer.
  • protrusions are regularly arranged.
  • the protrusions are circular, triangular or polygonal in cross section, and the protrusions are arranged in a lattice in the lateral direction and the longitudinal direction.
  • the protrusions are arranged in 2 to 5 rows in the lateral gap of the connected LED light-emitting chips, and the longitudinal gaps are arranged in 2 to 5 columns.
  • the protrusions are linear, zigzag or wavy, and the protrusions are arranged side by side in the lateral direction or the longitudinal direction.
  • the color of the protrusion is the same as the color of the insulating layer.
  • a method for packaging an LED display screen comprising:
  • a plurality of protrusions are adhered to the gap on the surface of the insulating layer, and the protrusions are arranged in a gap.
  • the protrusions are formed by 3D printing.
  • the present invention provides an LED display screen and a packaging method thereof, including a circuit board and an LED light emitting chip mounted on the surface of the circuit board, covering the surface of the circuit board and filling the An insulating layer of the LED light-emitting chip gap, and a plurality of regularly arranged protrusions located between the LED light-emitting chip gaps and fixedly disposed on the surface of the insulating rubber layer.
  • the LED display screen provided by the invention has a regularly arranged convex body on the insulating rubber layer, so that the color of the convex body can be convexly displayed, and the color of the convex body is visually sensed first, so that the original insulating rubber is visually perceived.
  • the plane color of the layer becomes a single-point color composed of visually sensible protrusions, which weakens the color difference of the insulating layer of a single LED display screen, even if the color of the insulating layer of a single LED display differs,
  • the color of the protruding body will be convexly displayed, and the display wall forming the whole body can exhibit substantially the same color, and the gap between the protruding portions is between the protruding body and the protruding body, and the lattice forming body is visually observed.
  • the color makes the gap difficult to be perceived by the eyes, effectively solving the problem that the existing LED display screens are spliced together, the overall color is significantly different, the seams are visually obvious, and the display effect is poor.
  • FIG. 1 is a schematic structural view of an embodiment of an LED display screen according to the present invention.
  • Figure 2 is a partial cross-sectional view showing a first embodiment of the first embodiment of the present invention
  • Figure 3 is a partial cross-sectional view showing a second aspect of the first embodiment of the present invention.
  • Figure 4 is a partial cross-sectional view showing a third embodiment of the first embodiment of the present invention.
  • Figure 5 is a partial front elevational view of a first embodiment of a second embodiment of the LED display screen of the present invention.
  • Figure 6 is a partial front elevational view showing a second aspect of the second embodiment of the present invention.
  • Figure 7 is a partial front elevational view showing a third aspect of the second embodiment of the present invention.
  • FIG. 8 is a flow chart of a preferred embodiment of a method for packaging a black plastic LED display screen according to the present invention.
  • circuit board 20, LED light-emitting chip; 30, insulating layer; 40, protruding body.
  • the present invention provides an LED display screen and a method for packaging the same, and the present invention will be further described in detail below with reference to the accompanying drawings. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
  • FIG. 1 is a schematic structural view of an embodiment of an LED display screen according to the present invention
  • FIG. 2 is a partial cross-sectional view of a first embodiment of the LED display screen of the present invention
  • FIG. 3 is a partial view of a second embodiment of the first embodiment of the present invention
  • Cross-sectional view is a partial cross-sectional view of a third aspect of the first embodiment of the present invention.
  • the present invention provides an LED display screen comprising a circuit board 10, an LED light emitting chip 20 and an insulating glue layer 30; the LED light emitting chip 20 is mounted on the circuit board 10 Surface, according to the actual needs, set the size of the LED light-emitting chip used, as well as its row and column spacing.
  • the insulating adhesive layer 30 of the present invention covers the surface of the circuit board 10 on which the LED light emitting chip 20 is mounted.
  • the LED light emitting chip 20 is gap-filled with the insulating adhesive layer 30, and the upper surface of the LED light emitting chip 20 and the insulating rubber
  • the layer 30 is flush and forms a flat surface, that is, the insulating glue layer 30 covers only the gap between the LED light-emitting chips 20 to increase the light-emitting viewing angle of the LED light-emitting chip 20.
  • the adjacent LED light-emitting chips 20 Adjacent to the center spacing of the LED light-emitting chips 20, a larger pitch display screen can be achieved, and a smaller pitch display screen can be achieved.
  • the adjacent LED light-emitting chips 20 have a center-to-center spacing of 1.0-8.0 mm. That is, the center distance of the LED light-emitting chip 20 which is most suitable for the LED display panel of the present invention is in the range of 1.0 to 8.0 mm. That is to say, the LED light-emitting chip 20 using the insulating glue layer of the invention can achieve a small dot pitch, the pixel is high, and the display picture is clearer.
  • the insulating adhesive layer 30 is preferably a hot melt adhesive layer formed on the surface of the circuit board 10 on which the LED light emitting chip 20 has been mounted by low temperature low pressure injection molding, that is, the LED has been mounted.
  • a hot-melt adhesive is injected into the gap between the LED light-emitting chips 20 by a low-temperature low-pressure injection molding process to form a hot melt adhesive layer and a hot melt adhesive.
  • the color can be any color depending on the environment in which it is used.
  • the hot melt adhesive layer forms a flat surface with the upper surface of all the LED light emitting chips 20, and the purpose thereof is to protect the LED light emitting chip 20 from being damaged by external force and to make the light of the LED light emitting chip 20 normal.
  • the shot, that is, the LED light-emitting chip 20 constitutes a pixel point on the surface of the hot melt adhesive layer.
  • the protrusion 40 is printed on the surface of the insulating layer 30 by 3D, and the protrusion 40 can also be adhered to the insulating layer 30 by silk screen printing, and the protrusion 40 is protruded.
  • the color is the same as the color of the insulating adhesive layer 30.
  • the protruding body 40 can be randomly arranged on the insulating adhesive layer 30, or can be regularly arranged.
  • the protruding body 40 can visually sense the color of the protruding body 40 first, so that the original can pass.
  • the continuous planar color of the visually-sensitive insulating layer 30 becomes a discontinuous combined color composed of the arrangement of the protruding bodies 40.
  • the intermittent combined color of the plurality of protruding bodies 40 weakens the color difference of the insulating adhesive layer 30;
  • This embodiment is preferably arranged in a regular manner so that it is more convenient to program or plate during processing.
  • the preferred embodiment of the projection 40 is that the projection 30 has a circular cross section.
  • the second embodiment of the present embodiment has a triangular cross section.
  • the third embodiment of the present embodiment is a polygonal cross section.
  • the cross section of the body 40 may also be other shapes; the protruding body 40 is laid between the LED light emitting chips 20 in the lateral direction and the longitudinal direction, arranged in a dot matrix arrangement, and the lateral gap of the connected LED light emitting chips is generally set in 2 to 5 rows, and the longitudinal gap is generally arranged. Generally, 2 to 5 columns are provided. In order to improve production efficiency and facilitate production, in the embodiment, it is preferable to arrange 2 rows between the lateral gaps and 2 columns between the longitudinal gaps; thus, the color of the protrusions 40 can be displayed, visually first.
  • the color of the protrusion 40 is such that the continuous planar color of the insulating layer 30 is visually perceived as a single point color formed by the protrusion 40, which weakens the insulating layer of the single LED display during visual inspection.
  • the thickness of the protrusion 40 can be controlled by the number of 3D printing or silk screen printing. Generally, the thickness is set between 0.1 and 2.0 mm, and the thickness determines the color depth of the entire display wall.
  • FIG. 5 is a partial front view of a first embodiment of an LED display screen according to a second embodiment of the present invention
  • FIG. 7 is a partial front view of a second embodiment of the second embodiment of the present invention
  • Main view is a partial front view of a first embodiment of an LED display screen according to a second embodiment of the present invention.
  • the difference between the second embodiment and the first embodiment is that the structure of the protruding body 40 is different.
  • the protruding body 40 has a strip shape, and the protruding body 40 is printed by 3D or silk screen.
  • the method is adhered to the surface of the insulating layer 30, and the protrusions 40 are arranged side by side in the lateral direction or the longitudinal direction between the LED light-emitting chips 20.
  • the protruding body 40 of the first preferred embodiment in this embodiment has a linear shape.
  • the linear protrusion 40 has high processing efficiency and is convenient for production.
  • the outline of the protrusion 40 is zigzag, as shown in FIG. 7 , the third embodiment of the embodiment is convex.
  • the outline of the body 40 is wavy, and the outline of the protrusion 40 can also be other figures, which can be determined according to the actual production needs of the customer.
  • the color of the protrusion 40 can be displayed, and the color of the protrusion 40 can be visually sensed first, so that the continuous planar color of the insulating layer 30 is visually perceived as the linearity of the eye 40.
  • the color difference of the insulating layer 30 of the single LED display is weakened during the visual process, even if the color of the insulating layer 30 of the single LED display is different, the color of the protruding body 40 is convexly displayed, a single
  • the LED display screen constitutes an integral LED display wall which can exhibit substantially the same color, and the gap at the splicing portion is weakened under the color composed of the protruding body 40, so that the slit is not easily perceived by the eye; since the protruding body 40 is linearly highlighted, The dot matrix highlighting effect is less than that of the convex body 40.
  • the present invention also provides a LED display packaging method, comprising the following steps:
  • a plurality of LED light-emitting chips 20 are mounted on the surface of the circuit board 10 according to design requirements; a center-to-center spacing of adjacent LED light-emitting chips 20 on the surface of the circuit board 10 can achieve a large-pitch display screen, and can also be implemented.
  • the dot-pitch display screen most preferably, the adjacent LED light-emitting chip 20 has a center-to-center spacing of 1.0-8.0 mm, that is, the LED light-emitting chip 20 most suitable for the LED display of the present invention has a center-to-center spacing ranging from 1.0 to 8.0 mm. Very high, the display is clearer.
  • the circuit board 10 on which the LED light-emitting chip 20 is attached is placed in a cavity, and the insulating glue is injected at a low temperature and low pressure on the surface of the circuit board 10 on which the LED light-emitting chip 20 is attached until it is flush with the upper surface of the LED light-emitting chip 20.
  • the surface of the insulating adhesive layer 30, the insulating adhesive layer 30 can be used according to customer requirements of any color; the insulating colloid is preferably hot melt adhesive, the low temperature low pressure injection hot melt adhesive has a temperature of 180-240 ° C and a pressure of 1.5-40 Bar.
  • the most suitable range for low-temperature low-pressure injection molding of the insulating colloid is 1.0-8.0 mm.
  • the mold used in the present invention is a special large mold. After the circuit board 10 to which the LED light-emitting chip 20 is attached is placed in the cavity, the hot melt adhesive is introduced through the nine glue inlets until the hot melt adhesive is filled with the LED light.
  • the gap of the chip 20 is preferably 1.7 mm in diameter.
  • a plurality of protrusions 40 are adhered to the surface of the insulating layer 30, and the protrusions 40 are arranged in a gap; the protrusions 40 may be a single protrusion 40 or a protrusion 40.
  • the single protrusion 40 can be adhered to the surface of the insulating layer 30 by silk screen or 3D printing technology to form a regular lattice and covered with an insulating layer 30.
  • the protrusion 40 can be adhered by silk screen or 3D printing technology.
  • the surface of the insulating layer 30 is arranged in a lateral or longitudinal gap between the protrusions 40 and is covered with an insulating layer 30.
  • a single protrusion 40 is preferred; the screen printing method has the characteristics of high molding speed and high efficiency, but The 3D printing method makes the protruding body 40 more precise in size and better in shape control, and can be realized by any molding structure, and the product quality is higher than that of the silk screen printing. In this embodiment, 3D printing is preferred.
  • the color depth of the LED display screen is determined according to the height of the surface of the protruding body 40 protruding from the insulating adhesive layer 30, also referred to as the thickness of the protruding body 40, and the thickness is generally set between 0.1 and 2.0 mm, and the thicker the protruding body 40 is.
  • the step S300 can be repeated to increase the thickness of the protruding body 40 according to the customer's requirements for the color depth of the LED display in the production process, to meet the customer's demand for color depth.
  • step S200 After the step S200, the following steps are further included, after the insulating layer 30 is cooled, the circuit board bottom case is mounted.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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Abstract

一种LED显示屏及其封装方法，包括电路板（10）和贴装在电路板（10）表面的LED发光芯片（20），覆盖在电路板（10）表面并填充在LED发光芯片（20）间隙的绝缘胶层（30），以及位于LED发光芯片（20）间隙之间且固定设置在绝缘胶层（30）表面的若干凸出体（40），LED发光芯片（20）的上表面与绝缘胶层（30）平齐，形成平整的表面；凸出体（40）的颜色凸出显示，视觉上先感受到凸出体（40）的颜色，使原来通过视觉感受绝缘胶层（30）的平面颜色变成视觉感受凸出体（40）组成的单点颜色，目视过程中弱化了单个LED显示屏的绝缘胶层（30）的颜色差异，解决现有技术中的LED显示屏拼接在一起后整体颜色有明显差别，接缝目视明显，显示效果较差的问题。

Description

一种LED显示屏及其封装方法 技术领域
本发明涉及显示屏技术领域，尤其涉及的是一种LED显示屏及其封装方法。
背景技术
LED显示屏因其亮度高、功耗低、性能稳定等特点正受到广泛的重视而得到迅速发展，并且越来越多地应用于人们的日常生活中，例如，设置于休闲广场、商业街、医院、火车站、演唱会等场所的电子显示屏。
现有有技术中有一显示屏，该显示屏中的一体注塑隐藏式LED的全一色LED器件贴片在PCB底板上，LED器件与PCB底板整体被胶体注塑形成胶体面板及外壳包裹的一体结构，该一体结构底面喷涂有与PCB底板和LED器件的颜色相一致的涂层，PCB底板的底部安装有显示屏的其余模块。
LED显示屏在使用时，需要多块LED显示屏拼接成一块大的显示墙，该LED显示屏的每块屏与一种标准屏比较，色差虽然差别不大，但仍有色差，眼睛看过去，整个显示墙的颜色直接反应在视觉中，多个LED显示屏组合在一起时由于颜色都是单个整体呈现，导致颜色差别特别明显，多块LED显示屏拼接在一起就能通过视觉对比能看到整体显示墙面颜色有明显的不一样；由于单块显示屏的色差问题导致在拼接处的接缝能明显观察到，在显示时有明显的分割感，接缝目视明显，显示效果较差。
因此，现有技术还有待于改进和发展。
发明内容
鉴于上述现有技术的不足，本发明的目的在于提供一种LED显示屏及其封装方法，旨在解决现有技术中的LED显示屏拼接在一起后整体颜色有明显差别，接缝目视明显，显示效果较差的问题。
本发明的技术方案如下：
一种LED显示屏，包括电路板和贴装在所述电路板表面的LED发光芯片，其特征在于，还包括覆盖在所述电路板表面并填充在所述LED发光芯片间隙的绝缘胶层、以及，位于所述LED发光芯片间隙之间且固定设置在绝缘胶层表面的若干凸出体，LED发光芯片的上表面与绝缘胶层上表面平齐，凸出体上表面高度高于所述LED发光芯片的上表面高度，若干凸出体组成的间断颜色能凸出 显示而弱化所述绝缘胶层的色差。
进一步，所述凸出体规则排列。
进一步，所述凸出体横截面为圆形、三角形或多边形，所述凸出体沿横向和纵向呈点阵排列。
进一步，所述凸出体在相连LED发光芯片的横向间隙设置2～5排，纵向间隙设置2～5列。
进一步，所述凸出体呈直线形、锯齿形或波浪形，所述凸出体沿横向或纵向并排排列。
进一步，所述凸出体颜色与绝缘胶层颜色一样。
一种LED显示屏的封装方法，其特征在于，包括：
将若干个LED发光芯片依照设计的需要贴装在电路板表面上；
将贴装有LED发光芯片的电路板放入模腔，向贴装有LED发光芯片的电路板表面低温低压注塑绝缘胶体，直至与LED发光芯片上表面平齐，形成表面平整的绝缘胶层；
绝缘胶层冷却后，在绝缘胶层表面上间隙粘接若干凸出体，所述凸出体呈间隙排列。
进一步，所述凸出体采用3D打印成型。
与现有技术相比，本发明提供的一种LED显示屏及其封装方法，包括电路板和贴装在所述电路板表面的LED发光芯片、覆盖在所述电路板表面并填充在所述LED发光芯片间隙的绝缘胶层、以及，位于所述LED发光芯片间隙之间且固定设置在绝缘胶层表面的若干规则排列的凸出体。本发明提供的LED显示屏，在绝缘胶层上设置规则排列的凸出体，能使凸出体的颜色凸出显示，视觉上先感受到凸出体的颜色，使原来通过视觉感受绝缘胶层的平面颜色变成视觉感受凸出体组成的单点颜色，目视过程中弱化了单个LED显示屏的绝缘胶层的颜色差异，即使单个LED显示屏的绝缘胶层的颜色存在差异，但凸出体的颜色会凸出显示，组成整体的显示墙能呈现出基本相同的颜色，拼接处的缝隙在凸出体与凸出体之间，目视看到的是点阵凸出体组成的颜色，而使缝隙不易被眼睛察觉，有效地解决了现有的LED显示屏拼接在一起后整体颜色有明显差别，接缝目视明显，显示效果较差的问题。
附图说明
图1是本发明一种LED显示屏实施例的结构示意图；
图2为本发明实施例一的第一方案局部横截面视图；
图3为本发明实施例一的第二方案的局部横截面视图；
图4为本发明实施例一的第三方案的局部横截面视图；
图5为本发明LED显示屏第二实施例的第一方案局部主视图；
图6为本发明第二实施例的第二方案的局部主视图；
图7为本发明第二实施例的第三方案的局部主视图；
图8为本发明黑胶LED显示屏封装方法较佳实施例的流程图。
图中：10、电路板；20、LED发光芯片；30、绝缘胶层；40、凸出体。
具体实施方式
本发明提供了一种LED显示屏及其封装方法，为使本发明的目的、技术方案及效果更加清楚、明确，以下参照附图并举实例对本发明进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
实施例一
图1是本发明一种LED显示屏实施例的结构示意图；图2为本发明LED显示屏实施例一的第一方案局部横截面视图；图3为本发明实施例一的第二方案的局部横截面视图；图4为本发明的实施例一的第三方案的局部横截面视图。
如图1、图2所示，本发明提供了一种LED显示屏，包括电路板10、LED发光芯片20和绝缘胶层30；所述LED发光芯片20被贴装在所述电路板10的表面，可以根据实际的需要，设置采用的LED发光芯片尺寸，以及其行列间距。
本发明所述绝缘胶层30覆盖在贴装有LED发光芯片20的电路板10表面，所述LED发光芯片20间隙填充有所述绝缘胶层30，且LED发光芯片20的上表面与绝缘胶层30平齐，形成平整的表面，也即，所述绝缘胶层30仅覆盖所述LED发光芯片20之间的空隙，以增加LED发光芯片20的发光视角。
相邻所述LED发光芯片20的中心间距可以做到较大间距显示屏，还可以做到较小间距显示屏，最优选的，相邻的LED发光芯片20中心间距为1.0-8.0mm。即，本发明的LED显示屏最适用的LED发光芯片20的中心间距范围为1.0-8.0mm。也就是说，本发明采用绝缘胶层的LED发光芯片20可达到小点间 距，像素很高，显示画面更加清晰。
在本发明较佳实施例中，绝缘胶层30优选为热熔胶层，通过低温低压注塑的方式形成于已经安装有LED发光芯片20的电路板10表面上，即，在已经贴装好LED发光芯片20阵列的电路板10表面上，在低温低压的条件下，采用低温低压注塑工艺向LED发光芯片20之间的间隙中注塑热熔胶，使之形成热熔胶层，热熔胶的颜色可以根据使用环境来选用任意颜色。所述热熔胶层与所有的LED发光芯片20上表面形成平整的表面，其目的是既保护了LED发光芯片20，使之不容易遭受外力而损坏，又能够使LED发光芯片20的光线正常射出，也就是说，LED发光芯片20组成了热熔胶层表面的像素点。
如图1、图2所示，在绝缘胶层30的表面上通过3D打印出凸出体40，凸出体40也可以通过丝印方式粘接附着在绝缘胶层30上，凸出体40的颜色与绝缘胶层30的颜色一样，凸出体40在绝缘胶层30上可以随意排列，也可以规则排列，凸出体40可以使视觉上先感受到凸出体40的颜色，使原来通过视觉感受绝缘胶层30的连续平面颜色变成眼睛感受由凸出体40排列组成的间断组合颜色，在目视过程中，若干凸出体40组成的间断组合颜色弱化绝缘胶层30的色差；本实施例优选规则排列，这样在加工时编程或制板更方便，凸出体40本实施例中的最佳方案为凸出体30的横截面呈圆形。
如图3所示为本实施例的第二方案，凸出体30的横截面为三角形，如图4所示为本实施例的第三方案，凸出体20的横截面为多边形，凸出体40横截面还可以为其他形状；凸出体40沿横向和纵向铺满在LED发光芯片20之间，呈点阵式排列，相连LED发光芯片的横向间隙一般设置2～5排，纵向间隙一般设置2～5列，为提高生产效率，方便生产，实施例中优选横向间隙间设置2排，纵向间隙间设置2列；这样能使凸出体40的颜色凸出显示，视觉上先感受到凸出体40的颜色，使原来通过视觉感受绝缘胶层30的连续平面颜色变成眼睛感受到凸出体40组成的单点颜色，目视过程中弱化了单个LED显示屏的绝缘胶层30的颜色差异，即使单个LED显示屏的绝缘胶层30的颜色存在差异，但凸出体40的颜色会凸出显示，组成整体的LED显示墙能呈现出基本相同的颜色，拼接处的缝隙在凸出体40的间隙之间，目视看到的是点阵凸出体40组成的颜色，而使拼接处缝隙不易被眼睛察觉。
通过3D打印或丝印的次数可以控制凸出体40的厚度，一般厚度设置在0.1-2.0mm之间，厚度的大小决定了目视整个显示墙的颜色深浅。
实施例二
图5为本发明LED显示屏实施例二的第一方案局部主视图；图6为本发明实施例二的第二方案的局部主视图；图7为本发明实施例二的第三方案的局部主视图。
如图5所示，实施例二与实施例一的不同之处在于凸出体40的结构不同，本实施例中凸出体40的外形轮廓为条形，凸出体40通过3D打印或丝印方式粘接附着在绝缘胶层30的表面，凸出体40沿横向或纵向并排排列铺满在LED发光芯片20之间，本实施例中的优选第一方案的凸出体40呈直线形，直线形凸出体40加工效率高，方便生产，如图6所示的本实施例第二方案，凸出体40外形轮廓为锯齿形，如图7所示的本实施例第三方案，凸出体40外形轮廓为波浪形，凸出体40外形轮廓还可以为其他图形，可根据客户实际生产需要来确定。
这样能使凸出体40的颜色凸出显示，视觉上先感受到凸出体40的颜色，使原来通过视觉感受绝缘胶层30的连续平面颜色变成眼睛感受由凸出体40组成的线性组合颜色，目视过程中弱化了单个LED显示屏的绝缘胶层30的颜色差异，即使单个LED显示屏的绝缘胶层30的颜色存在差异，但凸出体40的颜色会凸出显示，单个LED显示屏组成整体的LED显示墙能呈现出基本相同的颜色，拼接处的缝隙在凸出体40组成的颜色下会弱化，而使缝隙不易被眼睛察觉；由于凸出体40是线性凸显，相比于凸出体40的点阵凸显效果要差些。
如图8所示，本发明还提供了一种LED显示屏封装方法，包括以下步骤：
S100、将若干个LED发光芯片20依照设计的需要贴装在电路板10表面上；所述电路板10表面的相邻LED发光芯片20的中心间距可以做到大间距显示屏，还可以做到小点间距显示屏，最优选的，相邻的LED发光芯片20中心间距为1.0-8.0mm，即本发明的LED显示屏最适用的LED发光芯片20的中心间距范围为1.0-8.0mm，像素很高，显示画面更加清晰。
S200、将贴装有LED发光芯片20的电路板10放入模腔，向贴装有LED发光芯片20的电路板10表面低温低压注塑绝缘胶体，直至与LED发光芯片20上表面平齐，形成表面平整的绝缘胶层30，绝缘胶层30可以根据客户的要求使用 任意颜色；绝缘胶体优选为热熔胶，低温低压注塑热熔胶的温度为180-240℃，压力为1.5-40Bar。相邻LED发光芯片20的中心间距较小时，低温低压注塑绝缘胶体时最适用的范围是1.0-8.0mm。本发明中所使用的模具是特制的大型模具，将贴装有LED发光芯片20的电路板10放入模腔后，通过9个进胶口将热熔胶导入，直至热熔胶充满LED发光芯片20的间隙，所述进胶口直径优选为1.7mm。
S300、绝缘胶层30冷却后，在绝缘胶层30表面上间隙粘接若干凸出体40，凸出体40呈间隙排列；凸出体40可以为单个凸出体40或凸出体40，单个凸出体40可通过丝印或3D打印技术粘接附着在绝缘胶层30的表面，形成规则点阵并铺满绝缘胶层30，凸出体40可通过丝印或3D打印技术粘接附着在绝缘胶层30的表面，凸出体40之间呈横向或纵向间隙排列并铺满绝缘胶层30，实施例中优选单个凸出体40；丝印方式具有成型速度快，效率高的特点，但3D打印方式使凸出体40尺寸更精准，外形更好控制，任何成型结构都可以实现，产品质量比丝印方式高，本实施例中优选3D打印。
LED显示屏颜色深浅是根据凸出体40凸出绝缘胶层30表面的高度决定，也称为凸出体40的厚度，一般厚度设置在0.1-2.0mm之间，当凸出体40越厚，LED显示屏的颜色越深，生产过程中根据客户对LED显示屏颜色深浅的要求，可以重复步骤S300用于增加凸出体40的厚度，满足客户对颜色深浅的需求。
在步骤S200之后还包括以下步骤，待绝缘胶层30冷却后，安装电路板底壳。
应当理解的是，本发明的应用不限于上述的举例，对本领域普通技术人员来说，可以根据上述说明加以改进或变换，所有这些改进和变换都应属于本发明所附权利要求的保护范围。

Claims (8)

  1. 一种LED显示屏，包括电路板和贴装在所述电路板表面的LED发光芯片，其特征在于，还包括覆盖在所述电路板表面并填充在所述LED发光芯片间隙的绝缘胶层、以及，位于所述LED发光芯片间隙之间且固定设置在绝缘胶层表面的若干凸出体，LED发光芯片的上表面与绝缘胶层上表面平齐，凸出体上表面高度高于所述LED发光芯片的上表面高度，所述若干凸出体组成的间断颜色能凸出显示而弱化所述绝缘胶层的色差。
  2. 根据权利要求1所述的LED显示屏，其特征在于，所述凸出体规则排列。
  3. 根据权利要求2所述的LED显示屏，其特征在于，所述凸出体横截面为圆形、三角形或多边形，所述凸出体沿横向和纵向呈点阵排列。
  4. 根据权利要求3所述的LED显示屏，其特征在于，所述凸出体在相连LED发光芯片的横向间隙设置2～5排，纵向间隙设置2～5列。
  5. 根据权利要求2所述的LED显示屏，其特征在于，所述凸出体呈直线形、锯齿形或波浪形，所述凸出体沿横向或纵向并排排列。
  6. 根据权利要求1所述的LED显示屏，其特征在于，所述凸出体颜色与绝缘胶层颜色一样。
  7. 一种LED显示屏的封装方法，其特征在于，包括：
    将若干个LED发光芯片贴装在电路板表面上；
    将贴装有LED发光芯片的电路板放入模腔，向贴装有LED发光芯片的电路板表面低温低压注塑绝缘胶体，直至与LED发光芯片上表面平齐，形成表面平整的绝缘胶层；
    绝缘胶层冷却后，在绝缘胶层表面上粘接若干凸出体，所述凸出体呈间隙排列。
  8. 根据权利要求7所述的LED显示屏的封装方法，其特征在于，所述凸出体采用3D打印成型。
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