WO2019104938A1 - 一种明胶led显示屏及其加工方法 - Google Patents

一种明胶led显示屏及其加工方法 Download PDF

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Publication number
WO2019104938A1
WO2019104938A1 PCT/CN2018/084696 CN2018084696W WO2019104938A1 WO 2019104938 A1 WO2019104938 A1 WO 2019104938A1 CN 2018084696 W CN2018084696 W CN 2018084696W WO 2019104938 A1 WO2019104938 A1 WO 2019104938A1
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Prior art keywords
led light
led display
gelatin
circuit board
display screen
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PCT/CN2018/084696
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English (en)
French (fr)
Inventor
张峰
蒋科政
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深圳市秀狐科技有限公司
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Publication of WO2019104938A1 publication Critical patent/WO2019104938A1/zh

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes

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  • the invention relates to the technical field of display screens, in particular to a gelatin LED display screen and a processing method thereof.
  • LED displays have been rapidly developed due to their high brightness, low power consumption, stable performance, etc., and are increasingly used in people's daily lives, for example, in leisure squares, commercial streets, Electronic display screens in hospitals, train stations, concerts, etc.
  • the existing LED display screens generally have LED light-emitting chips mounted on the circuit board, and the LED display lamps are protected by screwing the plastic masks.
  • the plastic masks are arranged according to the matrix arrangement of the LED light-emitting chips to form LED light-emitting chips.
  • the grid structure between the LED light-emitting chips can be protected inside the plastic mask.
  • thousands of LED light-emitting chips arranged in a matrix are arranged on the circuit board to form a background screen, and images can be played.
  • the plastic mask has the disadvantages of no waterproof, no anti-static, no fireproof, no pressure resistance, no oxidation resistance and short service life, and the bone structure is slightly higher than the height of the LED light-emitting chip, which causes the side light-emitting angle of the LED light-emitting chip. Small, that is, the viewing angle is narrow, a large number of LED light-emitting chips will form mutual interference, which will produce moiré phenomenon when displayed, affecting the display effect.
  • the process of fixing the plastic panel using screws is complicated, it is difficult to control the quality consistency of the product, and a large amount of manual operation is required.
  • the density of the LED light-emitting chip increases (the LED light-emitting chip becomes smaller, in order to increase the resolution of the entire screen, that is, the pixel becomes smaller and denser), the spacing between the LED light-emitting chips becomes smaller, and the plastic mask is processed more and more. The more difficult it is, the more difficult it is to assemble, which means that the plastic mask does not have the effect of protecting the LED display with small dot spacing.
  • an object of the present invention is to provide a gelatin LED display screen and a processing method thereof, which aim to solve the problem that the LED display screen of the prior art has a narrow viewing angle and a poor protection effect.
  • a gelatin LED display screen comprising a circuit board and an LED light emitting chip mounted on the surface of the circuit board, further comprising a transparent adhesive layer covering the surface of the circuit board, the transparent adhesive layer filling the LED light emitting The gap of the chip covers the surface of the LED light emitting chip to form a flat surface.
  • the gelatin LED display screen wherein the transparent adhesive layer is one of epoxy resin, PU glue and UV glue.
  • the gelatin LED display screen wherein the transparent adhesive layer is formed by a glue filling method.
  • gelatin LED display screen wherein the glue filling method is inverted potting.
  • gelatin LED display screen wherein adjacent LED light-emitting chips have a center-to-center spacing of less than 2.0 mm.
  • a gelatin LED display processing method which comprises:
  • a transparent rubber layer having a flat surface is formed.
  • the gelatin LED display processing method wherein the transparent colloid is one of epoxy resin, PU glue and UV glue.
  • the gelatin LED display processing method wherein the center spacing of adjacent LED light-emitting chips is less than 2.0 mm.
  • the present invention provides a gelatin LED display screen comprising a circuit board and an LED light emitting chip mounted on the surface of the circuit board, and further comprising a transparent adhesive layer covering the surface of the circuit board.
  • the transparent adhesive layer fills the gap of the LED light emitting chip and covers the surface of the LED light emitting chip to form a flat surface.
  • the gelatin LED display provided by the invention enables the LED light-emitting chip to be protected by the transparent adhesive layer, and can achieve the effects of waterproofing, fireproofing, anti-static, anti-pressure and long service life, and the upper surface of the transparent adhesive layer is a flat surface, which expands the display screen.
  • the viewing angle, and avoiding the moiré phenomenon enhances the display effect of the gelatin LED display.
  • the problem of narrow viewing angle and poor protection effect of the LED display screen in the prior art is effectively solved.
  • Figure 1 is a schematic view showing the structure of a preferred embodiment of the gelatin LED display panel of the present invention.
  • FIG. 2 is a front elevational view of a preferred embodiment of a gelatin LED display of the present invention.
  • FIG 3 is a side elevational view of a preferred embodiment of a gelatin LED display of the present invention.
  • FIG. 4 is a flow chart of a preferred embodiment of a gelatin LED display processing method of the present invention.
  • the present invention provides a gelatin LED display screen and a processing method thereof.
  • the present invention will be further described in detail below with reference to the accompanying drawings. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
  • FIG. 1 is a schematic structural view of a preferred embodiment of a gelatin LED display panel of the present invention
  • FIG. 2 is a front view of a preferred embodiment of the gelatin LED display panel of the present invention.
  • the present invention provides a gelatin LED display screen comprising a circuit board 10, an LED light emitting chip 20 and a transparent adhesive layer 30; the LED light emitting chip 20 is mounted on the circuit board 10
  • the surface can be set according to the actual needs, the size of the LED light-emitting chip used, as well as the row and column spacing.
  • the transparent adhesive layer 30 of the present invention covers the surface of the circuit board 10 on which the LED light-emitting chip 20 is attached, and the transparent adhesive layer 30 fills the gap of the LED light-emitting chip 20 and covers the surface of the LED light-emitting chip 20 to form a flat surface. s surface. As shown in FIG. 3, the gap of the LED light emitting chip 20 is filled with the transparent adhesive layer 30, and the LED light emitting chip 20 is completely covered by the transparent adhesive layer 30 to form a flat surface, that is, a transparent adhesive.
  • the layer 30 is higher than the height of the LED light-emitting chip 20, and the transparent adhesive layer 30 covers the LED light-emitting chip 20.
  • the transparent adhesive layer 30 is transparent, it does not block the light emitted by the LED light-emitting chip 20, thus The entire LED light-emitting chip 20 is buried in the transparent adhesive layer 30, so that the LED light-emitting chip 20 is more comprehensively protected.
  • the LED display screen Adjacent to the center spacing of the LED light-emitting chips 20, a larger pitch display screen can be achieved, and the center spacing of adjacent LED light-emitting chips 20 can be less than 2.0 mm.
  • the LED display screen has a small dot pitch. That is to say, the LED light-emitting chip 20 using the transparent adhesive layer of the present invention can achieve small dot pitch, and the pixel is high, and the display is high. The picture is clearer.
  • the transparent adhesive layer 30 is one of an epoxy resin, a PU adhesive, and a UV adhesive.
  • the transparent adhesive layer 30 is formed by a potting method.
  • the filling method is an inverted potting. The inverted potting is to inject a transparent colloid into a cavity, invert the circuit board on which the LED light emitting chip is mounted, and put it into the cavity, and keep the side on which the LED light emitting chip is mounted facing down, on the circuit board A transparent adhesive layer is formed on the upper layer.
  • the transparent cavity is first poured into the cavity, and then the circuit board 10 on which the LED light-emitting chip 20 is attached is inverted, and the bottom plate of the circuit board 10 is kept upward, and the circuit board 10 is slowly pressed down to the cavity, due to the bottom of the cavity. It is flat and then cured to form a transparent adhesive layer 30 having a flat surface. It is necessary to understand that the surface of the LED display screen must be flat to enable the light of the LED light-emitting chip 20 to be emitted in the normal direction to be played out. Normal picture.
  • the transparent adhesive layer 30 not only protects the LED light-emitting chip 20 from being damaged by external force, but also enables the light of the LED light-emitting chip 20 to be normally emitted, and the transparent adhesive layer 30 makes the gelatin LED display of the present invention waterproof. Dust, moisture, anti-static, fire, collision, pressure, oxidation and long life.
  • the surface of the LED display screen should avoid smooth reflection
  • the surface of the gelatin LED display screen provided by the invention is a transparent adhesive layer, which is smooth and reflective, so the invention obtains an intermediate product, and the final finished gelatin LED display surface. It is a matt surface product that avoids the problem of reflection.
  • the LED display screen protects the LED light-emitting chip 20 from damage by using a plastic mask.
  • the technical defects such as the background technology part of the explanation, the protective effect of the plastic mask will have a negative impact:
  • First, due to the plastic mask The height is slightly higher than the height of the LED light-emitting chip 20, which affects the divergence of light, so that the side light-emitting angle is small, that is, the angle of view is narrow. For example, when watching a concert in the field, the scene usually has a large number of people, watching the LED display screen. At the side angle, the viewer cannot clearly and completely view the LED display screen.
  • the height of the plastic mask is slightly higher than the height of the LED light-emitting chip 20, which brings another problem.
  • the screen When the screen is displayed, it will be generated. Moiré phenomenon, moiré phenomenon can not be seen by the naked eye, but when using a digital camera or mobile phone to shoot the LED display, it will show a circle of ripples, affecting the display effect; Third, when the LED light-emitting chip 20 has a high density, The spacing between the LED light-emitting chips 20 is small, and the plastic mask is more and more difficult to process (the plastic mask is fixed on the circuit board 10 by screws), and the control Not its flatness; plastic mask and the smaller, the smaller protective effect. Fourth, the plastic mask has the disadvantages of no waterproof, no moisture, no anti-static, no fire, no dust, no pressure resistance, no oxidation resistance and short service life.
  • the gelatin LED display provided by the present invention protects the LED light-emitting chip 20 by using the transparent adhesive layer 30, and solves the above problems.
  • the upper surface of the transparent adhesive layer 30 is a flat surface. Therefore, the light emission of the LED light-emitting chip 20 is not affected, and the light can be emitted from a small angle of the side surface of the display screen, and the viewing angle is increased, and the viewing effect is better.
  • the LED light-emitting chip 20 emits light, there is no obstruction and no moiré phenomenon occurs.
  • the spacing between the LED light-emitting chips 20 is small.
  • the transparent adhesive layer 30 Since the transparent adhesive layer 30 has a strong fluidity, it can still enter the gap of the LED light-emitting chip 20, and the production process has a wider adapting range. Fourth, the transparent adhesive layer 30 makes the gelatin LED display of the invention have the advantages of waterproof, dustproof, moistureproof, antistatic, fireproof, anti-collision, anti-pressure, anti-oxidation and long service life.
  • the present invention also provides a gelatin LED display processing method, comprising the following steps:
  • step S100 the LED light-emitting chip 20 is mounted and fixed on the surface of the circuit board 10, and the center-to-center spacing of the adjacent LED light-emitting chips 20 on the surface of the circuit board 10 can achieve a large-pitch display screen, because the transparent colloid is highly fluid. Therefore, it is still possible to enter the gap of the LED light-emitting chip 20 to form a transparent adhesive layer 30 to protect the LED display screen with small dots.
  • the dot pitch is that the center distance of adjacent LED light-emitting chips 20 is less than 2.0 mm, the pixels are high, and the display picture is clearer.
  • the transparent colloid is one of epoxy resin, PU glue and UV glue.
  • sufficient transparent colloid is poured into the cavity, and it is necessary to completely fill the gap of the LED light-emitting chip 20 and completely cover the LED light-emitting chip 20, and then invert the circuit board 10 on which the LED light-emitting chip 20 is mounted, and keep the bottom plate of the circuit board 10. Upward, the circuit board 10 is slowly pressed down to the cavity, and since the bottom of the cavity is flat, a transparent adhesive layer 30 having a flat surface is formed, and the inverted glue is formed into a transparent adhesive layer 30 having a flat surface. The purpose is to protect the LED light-emitting chip 20 from being damaged by external force and to cause the light of the LED light-emitting chip 20 to be emitted normally.
  • the circuit board 10 is gradually pressed down, so that the gap of the LED light emitting chip 20 on the surface of the circuit board 10 and the upper surface of the LED light emitting chip 20 form a transparent adhesive layer 30.
  • the thickness of the transparent adhesive layer 30 can be controlled at this time, for example, To make a transparent adhesive layer 30 of a certain thickness, the circuit board 10 is pressed down to the same height from the bottom of the cavity, and naturally cooled, and then the circuit board 10 covered with the transparent colloid is placed in a curing oven for curing together with the mold.
  • the curing oven temperature was 80 ° C.
  • the surface of the LED display screen must be flat to enable the light of the LED light-emitting chip 20 to be emitted in a normal direction to play a normal picture.
  • the bottom of the cavity of the mold used is flat, and the circuit board 10 coated with the transparent colloid is placed in the curing oven for curing together with the mold, thereby ensuring the flatness of the transparent adhesive layer 30, Thereby ensuring the quality of the LED display.

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Abstract

本发明公开了一种明胶 LED 显示屏及其加工方法，包括电路板和贴装在所述电路板表面的 LED 发光芯片，还包括覆盖在所述电路板表面的透明胶层，所述透明胶层填充所述 LED 发光芯片的间隙并覆盖所述 LED 发光芯片表面，形成平整的表面。本发明提供的明胶 LED 显示屏使得 LED 发光芯片被透明胶层保护，可达到防水、防火、防静电、抗压及使用寿命长的效果，透明胶层上表面为平整的表面，扩大了显示屏的视角，并且避免了摩尔纹现象，提升了LED 显示屏的显示效果。

Description

一种明胶LED显示屏及其加工方法 技术领域
本发明涉及显示屏技术领域，尤其涉及的是一种明胶LED显示屏及其加工方法。
背景技术
LED显示屏因其亮度高、功耗低、性能稳定等特点正受到广泛的重视而得到迅速发展，并且越来越多地应用于人们的日常生活中，例如，设置于休闲广场、商业街、医院、火车站、演唱会等场所的电子显示屏。
现有的LED显示屏一般都是将LED发光芯片贴装在电路板上，通过螺丝拴紧塑胶面罩来保护LED显示灯，塑胶面罩根据LED发光芯片的矩阵排列位置，形成能够落入LED发光芯片之间的网格结构，可以将LED发光芯片保护在塑胶面罩内。大的显示屏结构中，矩阵排列的LED发光芯片成千上万的设置在电路板上，形成背景屏幕，可以播放图像。
该塑胶面罩有不防水、不防静电、不防火、不抗压、不抗氧化及使用寿命短等缺点，其筋骨结构稍高于LED发光芯片的高度，就会导致LED发光芯片的侧面发光角度小，也就是视角较窄，大量LED发光芯片发光会形成相互干扰，在显示时会产生摩尔纹现象，影响显示效果。
另外，使用螺丝加工固定塑胶面板的工艺复杂，很难控制产品的质量一致性，又需要大量的人工操作。而当LED发光芯片密度增大时(LED发光芯片变小，为使整个屏幕的分辨率提升，即像素变小变密)，LED发光芯片之间的间距变小，塑胶面罩加工起来就越来越困难，装配也更加困难，也就是说，塑胶面罩达不到保护小点间距的LED显示屏的效果。
因此，现有技术还有待于改进和发展。
发明内容
鉴于上述现有技术的不足，本发明的目的在于提供一种明胶LED显示屏及其加工方法，旨在解决现有技术中的LED显示屏视角较窄、保护效果差的问题。
本发明的技术方案如下：
一种明胶LED显示屏，包括电路板和贴装在所述电路板表面的LED发光芯片，其中，还包括覆盖在所述电路板表面的透明胶层，所述透明胶层填充所述 LED发光芯片的间隙并覆盖所述LED发光芯片表面，形成平整的表面。
所述的明胶LED显示屏，其中，所述透明胶层为环氧树脂、PU胶及UV胶中的一种。
所述的明胶LED显示屏，其中，所述透明胶层通过灌胶方式形成。
所述的明胶LED显示屏，其中，所述灌胶方式为倒置灌胶。
所述的明胶LED显示屏，其中，相邻的LED发光芯片中心间距小于2.0mm。
一种明胶LED显示屏加工方法，其中，包括：
将若干个LED发光芯片依照设计的需要贴装在电路板表面上；
向一模腔中灌注透明胶体，倒置贴装有LED发光芯片的电路板，放入所述模腔，保持安装有所述LED发光芯片的一面朝下，在所述电路板上形成透明胶层；
待所述透明胶体固化后，形成表面平整的透明胶层。
所述的明胶LED显示屏加工方法，其中，所述透明胶体为环氧树脂、PU胶及UV胶中的一种。
所述的明胶LED显示屏加工方法，其中，相邻的LED发光芯片中心间距小于2.0mm。
与现有技术相比，本发明提供的一种明胶LED显示屏，包括电路板和贴装在所述电路板表面的LED发光芯片，还包括覆盖在所述电路板表面的透明胶层，所述透明胶层填充所述LED发光芯片的间隙并覆盖所述LED发光芯片表面，形成平整的表面。本发明提供的明胶LED显示屏使得LED发光芯片被透明胶层保护，可达到防水、防火、防静电、抗压及使用寿命长的效果，透明胶层上表面为平整的表面，扩大了显示屏的视角，并且避免了摩尔纹现象，提升了明胶LED显示屏的显示效果。有效地解决了现有技术中LED显示屏的视角较窄、保护效果差的问题。
附图说明
图1是本发明明胶LED显示屏较佳实施例的结构示意图。
图2为本发明明胶LED显示屏较佳实施例的主视图。
图3为本发明明胶LED显示屏较佳实施例的侧视图。
图4为本发明明胶LED显示屏加工方法较佳实施例的流程图。
具体实施方式
本发明提供了一种明胶LED显示屏及其加工方法，为使本发明的目的、技术方案及效果更加清楚、明确，以下参照附图并举实例对本发明进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
图1是本发明一种明胶LED显示屏较佳实施例的结构示意图；图2为本发明明胶LED显示屏较佳实施例的主视图。
如图1及图2所示，本发明提供了一种明胶LED显示屏，包括电路板10、LED发光芯片20和透明胶层30；所述LED发光芯片20被贴装在所述电路板10的表面，可以根据实际的需要，设置采用的LED发光芯片尺寸，以及其行列间距。
本发明所述透明胶层30覆盖在贴装有LED发光芯片20的电路板10表面，所述透明胶层30填充所述LED发光芯片20的间隙并覆盖所述LED发光芯片20表面，形成平整的表面。如图3所示，所述LED发光芯片20的间隙被透明胶层30填充，并且所述LED发光芯片20被所述透明胶层30完全包覆，形成平整的表面，也就是说，透明胶层30高于LED发光芯片20的高度，透明胶层30覆盖在LED发光芯片20之上，由于透明胶层30是透明的，因此，并不会遮挡LED发光芯片20发出的光线，这样，使得整个LED发光芯片20都埋在透明胶层30里面，因此，将LED发光芯片20保护的更加全面。
相邻所述LED发光芯片20的中心间距可以做到较大间距显示屏，还可以做到相邻的LED发光芯片20中心间距小于2.0mm。相邻的LED发光芯片20中心间距小于2.0mm时，已属于小点间距的LED显示屏，也就是说，本发明采用透明胶层的LED发光芯片20可达到小点间距，像素很高，显示画面更加清晰。
在本发明较佳实施例中，透明胶层30为环氧树脂、PU胶及UV胶中的一种。所述透明胶层30通过灌胶方式形成，优选的，所述灌胶方式为倒置灌胶。倒置灌胶是向一模腔中灌注透明胶体，倒置贴装有LED发光芯片的电路板，放入所述模腔，保持安装有所述LED发光芯片的一面朝下，在所述电路板上形成透明胶层。具体的，先向模腔中灌注透明胶体，再倒置贴装有LED发光芯片20的电路板10，保持电路板10底壳朝上，缓缓下压电路板10至模腔，由于模腔底部 是平整的，再经过固化，就形成了具有平整表面的透明胶层30，需要了解的是，LED显示屏表面必须保证平整，才能使LED发光芯片20的光线沿正常的方向发射，才能播放出正常的画面。透明胶层30既保护了LED发光芯片20，使之不容易遭受外力而损坏，又能够使LED发光芯片20的光线正常射出，并且，透明胶层30使得本发明的明胶LED显示屏具有防水、防尘、防潮、防静电、防火、防碰撞、抗压、抗氧化及使用寿命长等优点。
事实上，LED显示屏的表面应避免光滑反光，而本发明提供的明胶LED显示屏表面是透明胶层，是光滑反光的，因此本发明得到的是中间产品，最终的成品明胶LED显示屏表面是亚光面的产品，避免了反光的问题。
在现有技术中，LED显示屏是利用塑胶面罩来保护LED发光芯片20不受损坏的，其技术缺陷如背景技术部分的交代，塑胶面罩的保护效果会带来负面影响：一、由于塑胶面罩的高度都稍高于LED发光芯片20的高度，影响了光的发散，使得侧面发光角度小，也就是视角较窄，例如，在现场看演唱会时，现场通常人数很多，在观看LED显示屏时，在侧面角度的观众就无法清晰完整地观看到LED显示屏的画面；二、塑胶面罩的高度稍高于LED发光芯片20的高度还带来了另一个问题，在显示画面时，会产生摩尔纹现象，摩尔纹现象肉眼无法看到，但是使用数码相机或手机拍摄LED显示屏时，会显示出一圈圈一条条的波纹，影响显示效果；三、当LED发光芯片20密度较大、LED发光芯片20之间的间距很小时，塑胶面罩加工难度越来越大(塑胶面罩通过螺丝固定于电路板10上)，并且控制不了其平整度；而且塑胶面罩越小，保护作用也就越小。四、塑胶面罩有不防水、不防潮、不防静电、不防火、不防尘、不抗压、不抗氧化及使用寿命短的缺点。
本发明提供的明胶LED显示屏是利用透明胶层30保护LED发光芯片20，并且解决了以上问题。首先，透明胶层30上表面是平整的表面，因此，不会影响LED发光芯片20光线的发散，从显示屏的侧面偏小的角度也可以发光，视角变大，观看效果更好。第二、LED发光芯片20发射光线时没有了遮挡物，不会产生摩尔纹现象。第三、LED发光芯片20之间的间距很小时，由于透明胶层30流动性很强，因此，仍可进入LED发光芯片20的间隙中，生产工艺的适应范围更宽。第四、透明胶层30使得本发明的明胶LED显示屏具有防水、防尘、防潮、 防静电、防火、防碰撞、抗压、抗氧化及使用寿命长等优点。
如图4所示，本发明还提供了一种明胶LED显示屏加工方法，包括以下步骤：
S100、将若干个LED发光芯片依照设计的需要贴装在电路板10表面上；
S200、向一模腔中灌注透明胶体，倒置贴装有LED发光芯片的电路板，放入所述模腔，保持安装有所述LED发光芯片的一面朝下，在所述电路板上形成透明胶层；
S300、待所述透明胶体固化后，形成表面平整的透明胶层。
在步骤S100中，LED发光芯片20贴装固定于所述电路板10表面上，电路板10表面的相邻LED发光芯片20的中心间距可以做到大间距显示屏，由于透明胶体流动性很强，因此，仍可进入LED发光芯片20的间隙中，形成透明胶层30，来保护小点间距的LED显示屏。小点间距就是相邻的LED发光芯片20中心间距小于2.0mm，像素很高，显示画面更加清晰。
在步骤S200中，优选的，所述透明胶体为环氧树脂、PU胶及UV胶中的一种。先向模腔中灌注足够的透明胶体，需保证可完全充满LED发光芯片20的间隙以及完全覆盖LED发光芯片20，再倒置贴装有LED发光芯片20的电路板10，保持电路板10底壳朝上，缓缓下压电路板10至模腔，由于模腔底部是平整的，就形成了具有平整表面的透明胶层30，倒置灌胶形成了具有平整的表面的透明胶层30，其目的是既保护了LED发光芯片20，使之不容易遭受外力而损坏，又能够使LED发光芯片20的光线正常射出。
缓缓下压电路板10，使得电路板10表面的LED发光芯片20的间隙以及LED发光芯片20的上表面形成透明胶层30，当然的，透明胶层30的厚度在此时可以控制，例如需制作某一厚度的透明胶层30，则将电路板10下压至距离模腔底部相同的高度，自然冷却，然后连带模具一起将覆上透明胶体的电路板10放入固化炉进行固化，所述固化炉温度为80℃，固化4个小时后，取出，利用数控机床把多余的透明胶体清理掉，就加工出了具有透明胶层30的明胶LED显示屏。需要了解的是，LED显示屏表面必须保证平整，才能使LED发光芯片20的光线沿正常的方向发射，才能播放出正常的画面。本发明利用的倒置灌胶技术，所用模具的模腔底部是平整的，并且，连带模具一起将覆上透明胶体的电路板10 放入固化炉进行固化，保证了透明胶层30的平整度，从而保证了LED显示屏的质量。
应当理解的是，本发明的应用不限于上述的举例，对本领域普通技术人员来说，可以根据上述说明加以改进或变换，所有这些改进和变换都应属于本发明所附权利要求的保护范围。

Claims (8)

  1. 一种明胶LED显示屏，包括电路板和贴装在所述电路板表面的LED发光芯片，其特征在于，还包括覆盖在所述电路板表面的透明胶层，所述透明胶层填充所述LED发光芯片的间隙并覆盖所述LED发光芯片表面，形成平整的表面。
  2. 根据权利要求1所述的明胶LED显示屏，其特征在于，所述透明胶层为环氧树脂、PU胶及UV胶中的一种。
  3. 根据权利要求1所述的明胶LED显示屏，其特征在于，所述透明胶层通过灌胶方式形成。
  4. 根据权利要求3所述的明胶LED显示屏，其特征在于，所述灌胶方式为倒置灌胶。
  5. 根据权利要求1所述的明胶LED显示屏，其特征在于，相邻的LED发光芯片中心间距小于2.0mm。
  6. 一种明胶LED显示屏加工方法，其特征在于，包括：
    将若干个LED发光芯片依照设计的需要贴装在电路板表面上；
    向一模腔中灌注透明胶体，倒置贴装有LED发光芯片的电路板，放入所述模腔，保持安装有所述LED发光芯片的一面朝下，在所述电路板上形成透明胶层；
    待所述透明胶体固化后，形成表面平整的透明胶层。
  7. 根据权利要求6所述的明胶LED显示屏加工方法，其特征在于，所述透明胶体为环氧树脂、PU胶及UV胶中的一种。
  8. 根据权利要求6所述的明胶LED显示屏加工方法，其特征在于，相邻的LED发光芯片中心间距小于2.0mm。
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