JP2019515489A - 狭ピッチ直視型ディスプレイおよびその製造方法 - Google Patents
狭ピッチ直視型ディスプレイおよびその製造方法 Download PDFInfo
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/04—Structural and physical details of display devices
- G09G2300/0404—Matrix technologies
- G09G2300/0408—Integration of the drivers onto the display substrate
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/04—Structural and physical details of display devices
- G09G2300/0439—Pixel structures
- G09G2300/0452—Details of colour pixel setup, e.g. pixel composed of a red, a blue and two green components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10522—Adjacent components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
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- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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- Led Device Packages (AREA)
Abstract
Description
Claims (20)
- プリント回路基板と、
前記プリント回路基板の第1側上に配された画素であって、各画素が複数の発光ダイオード(LED)を含む画素のアレイと、
前記画素のアレイ中の前記画素間に配された光吸収材料を含む分離グリッドと、
を含むことを特徴とする直視型ディスプレイデバイス。 - 各画素が、赤色発光LED、青色発光LEDおよび緑色発光LEDを含むことを特徴とする請求項1に記載の直視型ディスプレイデバイス。
- 前記分離グリッドが、少なくとも前記画素のアレイの最上面の高さに至るまで延在することを特徴とする請求項1に記載の直視型ディスプレイデバイス。
- 前記分離グリッドが、プラスチックの光吸収材料で作られた自立するグリッドを含むことを特徴とする請求項1に記載の直視型ディスプレイデバイス。
- 前記光吸収材料が、黒色のポリカーボネートプラスチック材料を含むことを特徴とする請求項4に記載の直視型ディスプレイデバイス。
- 前記分離グリッドが、印刷された、UV硬化性または熱が適用される材料を含むことを特徴とする請求項1に記載の直視型ディスプレイデバイス。
- 前記光吸収材料が、印刷されUV硬化された黒色インクを含むことを特徴とする請求項6に記載の直視型ディスプレイデバイス。
- 前記分離グリッドおよび前記画素のアレイを覆うように配された第1透明封止材料層をさらに含むことを特徴とする請求項1に記載の直視型ディスプレイデバイス。
- 前記第1透明封止材料上に配された耐汚染透明コーティング層であって、前記透明封止材料層よりも汚染物質のピックアップに対してより耐性がある材料を含む前記耐汚染透明コーティング層をさらに含むことを特徴とする請求項8に記載の直視型ディスプレイデバイス。
- 前記プリント回路基板の第2側上に取り付けられたドライバ電子部品と、
前記ドライバ電子部品を覆うように配された第2封止材料層と、
をさらに含むことを特徴とする請求項8に記載の直視型ディスプレイデバイス。 - プリント回路基板を提供することと、
画素のアレイを形成するために、前記プリント回路基板の第1側に発光ダイオード(LED)を取り付けけることであって、各画素が複数の前記LEDを含む、ことと、
前記画素のアレイ中の前記画素間に光吸収材料を含む分離グリッドを提供することと、
を含むことを特徴とする直視型ディスプレイデバイスを形成する方法。 - 各画素が、赤色発光LED、青色発光LEDおよび緑色発光LEDを含むことを特徴とする請求項11に記載の方法。
- 前記分離グリッドが、少なくとも前記画素のアレイの最上面の高さに至るまで延在することを特徴とする請求項11に記載の方法。
- 前記分離グリッドを提供することが、プラスチックの光吸収材料で作られた自立する分離グリッドを形成することと、前記プリント回路基板の前記第1側に前記自立する分離グリッドを取り付けることと、を含むことを特徴とする請求項11に記載の方法。
- 前記光吸収材料が、射出成型された黒色のポリカーボネートプラスチック材料を含むことを特徴とする請求項14に記載の方法。
- 前記分離グリッドを提供することが、前記プリント回路基板の前記第1側上の前記画素間に、UV硬化性または熱が適用される材料を印刷することを含むことを特徴とする請求項11に記載の方法。
- 前記光吸収材料が、印刷された後にUV硬化された、印刷されたUV硬化性黒色インクを含むことを特徴とする請求項16に記載の方法。
- 前記分離グリッドおよび前記画素のアレイを覆うように、第1透明封止材料層を形成することをさらに含むことを特徴とする請求項11に記載の方法。
- 前記第1透明封止材料上に耐汚染透明コーティング層を形成することをさらに含み、前記耐汚染透明コーティング層が前記透明封止材料層よりも汚染物質のピックアップに対してより耐性がある材料を含むことを特徴とする請求項8に記載の方法。
- 前記プリント回路基板の第2側上にドライバ電子部品を取り付けることと、
前記プリント回路基板の前記第1側に前記発光ダイオードを取り付ける前に、前記ドライバ電子部品を覆うように第2封止材料層を形成することと、
をさらに含むことを特徴とする請求項18に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US201662326255P | 2016-04-22 | 2016-04-22 | |
US62/326,255 | 2016-04-22 | ||
PCT/US2017/028771 WO2017184941A1 (en) | 2016-04-22 | 2017-04-21 | Small pitch direct view display and method of making thereof |
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JP2019515489A true JP2019515489A (ja) | 2019-06-06 |
JP2019515489A5 JP2019515489A5 (ja) | 2020-05-28 |
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US (1) | US10600354B2 (ja) |
EP (1) | EP3446330A4 (ja) |
JP (1) | JP2019515489A (ja) |
KR (1) | KR20180128464A (ja) |
WO (1) | WO2017184941A1 (ja) |
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US10878742B2 (en) * | 2017-01-24 | 2020-12-29 | Planar Systems, Inc. | Protective cover for direct view light emitting diode displays |
US20180210195A1 (en) * | 2017-01-24 | 2018-07-26 | Microsoft Technology Licensing, Llc | Avoiding ghost images |
KR102532307B1 (ko) | 2017-11-02 | 2023-05-15 | 삼성디스플레이 주식회사 | 표시장치 |
US10269711B1 (en) * | 2018-03-16 | 2019-04-23 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor device and method for manufacturing the same |
US10627673B2 (en) | 2018-04-06 | 2020-04-21 | Glo Ab | Light emitting diode array containing a multilayer bus electrode and method of making the same |
US20200357776A1 (en) * | 2019-05-09 | 2020-11-12 | Daktronics, Inc. | Molded contrast mask for display module |
FR3097981B1 (fr) * | 2019-06-28 | 2021-07-02 | Valeo Vision | Dispositif lumineux pour véhicule automobile |
US20220100000A1 (en) * | 2019-10-07 | 2022-03-31 | Essilor International | Characterizing an optical element |
US11594663B2 (en) | 2019-12-20 | 2023-02-28 | Nanosys, Inc. | Light emitting diode device containing a micro lens array and method of making the same |
TWI719775B (zh) * | 2019-12-25 | 2021-02-21 | 錼創顯示科技股份有限公司 | 顯示裝置 |
CN111464803B (zh) * | 2020-04-16 | 2022-04-12 | 中国长城科技集团股份有限公司 | 一种显示控制系统 |
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US20170309223A1 (en) | 2017-10-26 |
EP3446330A1 (en) | 2019-02-27 |
US10600354B2 (en) | 2020-03-24 |
EP3446330A4 (en) | 2019-12-18 |
KR20180128464A (ko) | 2018-12-03 |
WO2017184941A1 (en) | 2017-10-26 |
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