WO2022011780A1 - 显示模块及其制作方法、led显示模组和led显示屏 - Google Patents

显示模块及其制作方法、led显示模组和led显示屏 Download PDF

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Publication number
WO2022011780A1
WO2022011780A1 PCT/CN2020/110332 CN2020110332W WO2022011780A1 WO 2022011780 A1 WO2022011780 A1 WO 2022011780A1 CN 2020110332 W CN2020110332 W CN 2020110332W WO 2022011780 A1 WO2022011780 A1 WO 2022011780A1
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Prior art keywords
substrate
display module
slope
encapsulation layer
pixel unit
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PCT/CN2020/110332
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English (en)
French (fr)
Inventor
黄志强
潘吴文
庄文荣
孙明
卢敬权
Original Assignee
东莞市中麒光电技术有限公司
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Application filed by 东莞市中麒光电技术有限公司 filed Critical 东莞市中麒光电技术有限公司
Priority to EP20945425.5A priority Critical patent/EP4160688A4/en
Priority to US18/015,371 priority patent/US20230282623A1/en
Publication of WO2022011780A1 publication Critical patent/WO2022011780A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/18—Tiled displays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0025—Processes relating to coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

Definitions

  • the present disclosure relates to the field of display technology, for example, to a display module and a manufacturing method thereof, a light emitting diode (Light Emitting Diode, LED) display module and an LED display screen.
  • a light emitting diode Light Emitting Diode, LED
  • the LED industry has become one of the most active industries, and LED display products have gradually entered many fields of society and life.
  • the small-pitch LED display module with high resolution per unit area has become the mainstream product of LED display, which can display higher-definition graphic images and videos, and also It can display more video and image pictures, especially in the application of image splicing, which can achieve arbitrary large-area splicing.
  • the LED display screen is spliced by multiple LED display modules.
  • multiple LED display modules are spliced, there must be a seam, and light transmission is easy to occur at the seam, especially the light emitted by the LEDs in two rows or two columns adjacent to the seam is more likely to be spliced.
  • Seams show through. When viewed from the side, the light intensity at the splicing seam is relatively large, which directly leads to yellow, blue-blue, pink or white bright lines near the splicing seam when viewing from a large viewing angle behind the assembled screen.
  • the present disclosure provides a display module and a manufacturing method thereof, an LED display module and an LED display, which can improve the bright lines of yellow, cyan, pink or white caused by light leakage at the splicing seam of the display modules after splicing.
  • An embodiment of the present invention provides a display module, including:
  • the substrate has a front and a back;
  • the pixel unit array is arranged on the front surface of the substrate;
  • the encapsulation layer covers the area where the pixel unit array is located, and a side surface of the encapsulation layer forms a slope at the edge of the front surface of the substrate;
  • a black ink layer covering the encapsulation layer is A black ink layer covering the encapsulation layer.
  • Embodiments of the present invention also provide a method for manufacturing a display module, including:
  • the substrate has a front and a back;
  • a black ink layer is formed on the encapsulation layer.
  • An embodiment of the present invention also provides an LED display module, the LED display module includes a plurality of display modules arranged in an array.
  • the embodiment of the present invention also provides an LED display screen, the LED display screen includes a plurality of LED display modules arranged in an array.
  • FIG. 1 is a schematic cross-sectional structure diagram of a display module according to Embodiment 1 of the present invention
  • FIG. 2 is a schematic top-view structural diagram of a display module according to Embodiment 1 of the present invention.
  • FIG. 3 is a schematic cross-sectional structure diagram of a display module according to Embodiment 2 of the present invention.
  • FIG. 4 is a schematic top-view structure diagram of a display module according to Embodiment 2 of the present invention.
  • FIG. 5 is a schematic cross-sectional structure diagram of another display module provided in Embodiment 2 of the present invention.
  • FIG. 6 is a flowchart of a method for manufacturing a display module according to Embodiment 3 of the present invention.
  • FIG. 7 is a schematic diagram of an LED display module according to Embodiment 4 of the present invention.
  • FIG. 1 is a schematic cross-sectional structure diagram of a display module provided by Embodiment 1 of the present invention
  • FIG. 2 is a top-view structural schematic diagram of a display module provided by Embodiment 1 of the present invention.
  • the display module includes: a substrate 110 ,
  • the substrate 110 has a front side and a back side, a pixel unit array 120, the pixel unit array 120 is arranged on the front side of the substrate 110, an encapsulation layer 130, the encapsulation layer 130 covers the area where the pixel unit array 120 is located, and the encapsulation layer 130 is transparent or semi-transparent Transparent, the side surface of the encapsulation layer 130 forms a slope 131 at the edge of the front surface of the substrate 110; the black ink layer 140, the black ink layer 140 covers the encapsulation layer 130, wherein, when the black ink layer 140 covers the encapsulation layer 130, The slope 131 allows the black ink to more fully contact the encapsulation layer 130 .
  • the sloped surface 131 includes a first side 1311 in contact with the substrate 110 and a second side 1312 not in contact with the substrate. In a direction parallel to the surface of the substrate 110 , the second side 1312 is opposite to the first side 1312 .
  • the side edge 1311 is closer to the edge of the pixel unit array 120 ; the black ink layer 140 covers the encapsulation layer 130 .
  • the substrate 110 may be a printed circuit board (Printed Circuit Board, PCB) substrate (including FR4, FR4+ class BT, BT, class BT or flexible printed circuit board (Flexible Printed Circuit, FPC)) or a glass substrate.
  • the backside of the substrate 110 is provided with a driver chip and a connector, and the driver chip is connected to the substrate through a surface mount technology (Surface Mounted Technology, SMT) process, or the substrate includes a thin film transistor (Thin film transistor, TFT) array.
  • the pixel unit array 120 includes a plurality of pixel units, and each pixel unit includes three sub-pixels, such as red LEDs, green LEDs, and blue LEDs.
  • the first side edge 1311 is the boundary line where the slope surface 131 and the substrate 110 intersect.
  • the set angle a between the slope surface 131 and the substrate 110 is less than 90 degrees. Compared with when the slope surface 131 is perpendicular to the substrate 110 , the set angle a is set to be less than 90 degrees.
  • the ink layer 140 can also well cover the slope surface 131 at the seam. Since the black ink layer 140 has a certain effect of reducing light transmission, the black ink layer 140 covering the slope surface 131 can reduce the leakage at the seam. Translucent.
  • the slope surface 131 has a certain inclination angle, so that the black ink layer 140 and other film layers formed later can evenly cover the slope surface 131, so that the entire surface of the encapsulation layer 130 is covered with black ink layer material, so that the uniformity of the light output of the display module is improved.
  • the display module Due to the good uniformity of light emission of the display module, the display module itself has high dislocation compatibility, which facilitates the production of assembled screens and improves the efficiency and yield of assembled screens.
  • the slope surface 131 is formed by half-cutting or full-cutting chamfering of the encapsulation layer 130 .
  • the angle of the chamfer ranges from 1 degree to 89 degrees.
  • the vertical projection of the slope surface 131 on the substrate 110 does not overlap with the area where the pixel unit array 120 is located.
  • the LED display module further includes a memory paint layer 150 , the memory paint layer 150 covers the black ink layer 140 , and the memory paint layer 150 is configured to protect the black ink layer 140 .
  • the memory paint layer 150 is formed on the black ink layer 140 by spraying to protect the black ink layer, which can prevent the black ink layer from being scratched and remaining contact fingerprints.
  • the material of the encapsulation layer 130 is transparent epoxy resin or silicone resin mixed with diffusion powder.
  • the angle a between the slope 131 and the substrate 110 is set to be less than 90 degrees, on the one hand, the light emitting angle of the LEDs on the edge of the pixel unit array 120 is changed, so that a part of the light irradiated on the slope 131 is refracted.
  • the light emitted laterally is reduced, thereby reducing the light leakage at the seam after the display module is spliced. Transmittance at seams.
  • the slope surface 131 has a certain inclination angle, so that the black ink layer 140 and other film layers formed later can evenly cover the slope surface 131, so that the entire surface of the encapsulation layer 130 is covered with black ink layer material, so that the uniformity of the light output of the display module is improved.
  • the display module Due to the good uniformity of light emission of the display module, the display module itself has high dislocation compatibility, which facilitates the production of assembled screens and improves the efficiency and yield of assembled screens.
  • FIG. 3 is a schematic cross-sectional structure diagram of a display module provided in the second embodiment of the present invention
  • FIG. 4 is a top-view structural schematic diagram of a display module provided in the second embodiment of the present invention
  • FIG. 5 is another display module provided in the second embodiment of the present invention.
  • the slope 131 includes at least two sub-slopes, such as the first sub-slope 132 and the second sub-slope 133 in FIGS. 3 and 4 ; Pointing to the direction of the black ink layer 140 , at least two sub-slopes are arranged in sequence, and the angle between the at least two sub-slopes and the substrate 110 gradually decreases.
  • the slope surface 131 includes a first sub-slope surface 132 and a second sub-slope surface 133 .
  • the first sub-slope surface 132 and the second sub-slope surface 133 are directed along the direction of the substrate 110 to the black ink layer 140 .
  • the sub-slopes 132 and the second sub-slopes 133 are arranged in sequence, and the included angle between the first sub-slope 132 and the substrate 110 is b1, the included angle between the second sub-slope 133 and the substrate 110 is b2, and the second sub-slope is b2.
  • the included angle b2 between 133 and the substrate 110 is smaller than the included angle b1 between the first sub-slope 132 and the substrate 110 .
  • the slope surface 131 By setting the slope surface 131 to include at least two sub-slope surfaces (eg, the first sub-slope surface 132 and the second sub-slope surface 133 ), compared with the slope surface 131 shown in FIG. 1 and FIG.
  • the black ink layer 140 can cover the entire encapsulation layer 130, which can reduce the light transmission and ensure that the display module has a relatively high quality. small border.
  • the slope 131 may also include a plurality of sub-slopes, the first sub-slope is in contact with the substrate 110 , the other sub-slopes are not in contact with the substrate 110 , and are directed to the direction of the black ink layer 140 along the substrate 110 in sequence, and the other sub-slopes are in sequence It is getting closer and closer to the edge of the pixel unit array 120, and the angle between each sub-slope and the substrate 110 is less than 90 degrees.
  • the number and angle of the sub-slope can be set according to the actual display module requirements. This is not limited.
  • the sloped surface includes a circular arc surface 134 .
  • the angle between the slope surface 131 and the substrate 110 is the angle between the tangent of the arc surface 134 and the substrate 110 .
  • the angle between the arc surface 134 and the substrate 110 is c, and the angle c is less than 90 degrees. Therefore, the light-emitting angle of the LEDs at the edge of the pixel unit array 120 can be improved, the light transmission can be reduced, and the black ink layer 140 can be covered.
  • the entire encapsulation layer 130 can reduce the light transmission at the splicing place when the display modules are spliced.
  • the slope surface 131 may further include a side surface composed of at least two circular arc surfaces. Wherein, the included angle formed by each arc surface and the substrate is less than 90 degrees.
  • FIG. 5 only exemplarily shows that the slope surface 131 includes a circular arc surface concave toward the pixel unit array 120 , which is not a limitation of the present disclosure. In other embodiments, the slope surface 131 may also include a direction away from the pixel unit array 120 . A convex arc surface.
  • FIG. 6 is a flowchart of a method for manufacturing a display module provided in Embodiment 3 of the present invention. The method is applicable to the implementation process of the display module according to any embodiment of the present invention. Referring to FIG. 6 , the method for manufacturing a display module includes the following steps :
  • Step 210 providing a substrate, wherein the substrate has a front side and a back side.
  • the substrate may be a printed circuit board (PCB) substrate (including FR4, FR4+ class BT, BT, class BT or FPC) or a glass substrate.
  • PCB printed circuit board
  • Step 220 forming a pixel unit array on the front surface of the substrate.
  • the LEDs are mounted on the substrate to form a pixel unit array.
  • Step 230 forming an encapsulation layer on the area where the pixel unit array is located.
  • the encapsulation layer is transparent or translucent, and the surface of the encapsulation layer is flat after the surface of the pixel unit array is cured.
  • Step 240 forming a slope at the edge of the side surface of the encapsulation layer located on the front surface of the substrate.
  • Step 250 forming a black ink layer on the encapsulation layer.
  • the slope makes the black ink contact more fully with the encapsulation layer.
  • the black ink layer can be sprayed on the side of the encapsulation layer away from the substrate by spraying, and the uniform spraying of the black ink layer can improve the light output intensity and uniformity of the pixel unit array.
  • the slope and the substrate have a set angle, and the set angle is less than 90 degrees. Therefore, when multiple display modules are spliced, the spraying material of the subsequent black ink layer can evenly cover the package at the splicing seam. In this way, the entire surface of the encapsulation layer is covered with spray materials, so that the light intensity is uniform, avoiding the problem of excessive local luminescence, reducing side light leakage at the seam, and blurring the problem of bright lines at the seam.
  • forming a slope at the edge of the side surface of the encapsulation layer located on the front surface of the substrate including:
  • a milling cutter is used to cut the edge of the side surface of the encapsulation layer located on the front surface of the substrate to form a slope.
  • the edge of the side surface of the encapsulation layer located on the front surface of the substrate can also be cut to form a slope by using a wire cutting technology.
  • an encapsulation layer on the pixel unit array area including:
  • the encapsulation layer is formed by at least one of spray coating, spin coating, slot coating, compression molding, adhesive film placement, and dispensing.
  • a transparent liquid adhesive can be formed by spraying, spin coating, or slot die coating and then cured to form an encapsulation layer, or a lamination method can be used to form the encapsulation layer, or a mounting adhesive film can be used to form the encapsulation layer.
  • the encapsulation layer, or the encapsulation layer is formed by dispensing.
  • the technical solution of this embodiment provides a method for manufacturing a display module, which includes providing a substrate; forming a pixel unit array on the front side of the substrate; forming an encapsulation layer on the area where the pixel unit array is located; A slope is formed at the edge of the front surface of the substrate; a black ink layer is formed on the encapsulation layer, wherein when the black ink layer covers the encapsulation layer, the slope makes the black ink more fully contact with the encapsulation layer.
  • the light-emitting angle of the LEDs at the splicing part of the display module can be improved, the light transmission at the splicing part can be reduced, and at the same time, the black ink layer can well cover the encapsulation layer at the splicing part, thereby reducing the light transmission at the splicing part and improving the splicing part.
  • Color lines and bright lines appear.
  • the manufacturing method of the display module of this embodiment belongs to the same concept as the display module provided by any embodiment of the present invention, and has corresponding effects.
  • FIG. 7 is a schematic diagram of an LED display module according to Embodiment 4 of the present invention.
  • the LED display module includes a plurality of display modules according to any embodiment of the present invention arranged in an array.
  • the LED display module is a large display module formed by splicing a plurality of display modules, and the splicing seam 1 and the splicing seam 2 shown in FIG. 7 are formed during splicing.
  • the slope of the display module is perpendicular to the substrate, when splicing, when the LED pixels at the edges of the two spliced display modules are all arranged in the form of R pixel, G pixel, and B pixel, due to the splicing of the two modules.
  • the slope of the encapsulation layer is perpendicular to the substrate, that is, the slope has no inclination angle, and the encapsulation layer at the edge cannot be evenly covered by the subsequently formed black ink layer and other film layers, which will lead to high light transmission intensity at the edge splicing seam.
  • Bright lines will appear; when one of the LED pixels at the edge of the two spliced display modules is R pixel and the other is B pixel, yellow, pink and other color lines will be formed at the edge splicing seam.
  • the slope surface when splicing, due to the slope surface, on the one hand, part of the light irradiated on the slope surface is refracted to the substrate, reducing the light emitted laterally, thereby reducing the splicing seam after the display module is spliced.
  • the slope has a certain inclination angle so that the black ink layer can cover the entire packaging layer, that is, the black ink layer can also cover the slope at the seam well, because the black ink layer has a certain The effect of reducing light transmission, so that the black ink layer covering the slope can reduce the light transmission at the seam.
  • the slope has a certain inclination angle, so that the subsequently formed black ink layer and other film layers can evenly cover the slope, so that the entire surface of the encapsulation layer has black ink layer material, so that the uniformity of the light output of the display module is better, avoiding The problem of local luminescence is too strong. Due to the better uniformity of light emission of the module, the module itself has high dislocation compatibility, which facilitates the production of assembled screens and improves the efficiency and yield of assembled screens.
  • the fifth embodiment of the present invention further provides an LED display screen, and the LED display screen includes a plurality of display modules according to any embodiment of the present invention arranged in an array.

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Abstract

本文公开了一种显示模块及其制作方法、LED显示模组和LED显示屏。该显示模块包括：基板，基板具有正面和背面；像素单元阵列，像素单元阵列设置在基板的正面；封装层，封装层覆盖在像素单元阵列所在的区域上，封装层的侧面在基板的正面的边缘处形成坡面；黑色油墨层，黑色油墨层覆盖在封装层上。

Description

显示模块及其制作方法、LED显示模组和LED显示屏
本申请要求在2020年07月13日提交中国专利局、申请号为202010668892.8的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本公开涉及显示技术领域，例如涉及一种显示模块及其制作方法、发光二极管(Light Emitting Diode，LED)显示模组和LED显示屏。
背景技术
随着社会的不断发展，LED行业成为最为活跃的行业之一，LED显示屏产品逐渐走进社会、生活的多个领域。与此同时，随着LED显示屏技术的创新与发展，单位面积的分辨率高的小间距LED显示模块已经成为LED显示屏的主流产品，它可以显示更高清晰度的图形图像和视频，也可以显示更多的视频和图像画面，尤其是在图像拼接方面的运用，可以做到任意大面积拼接。
通常，LED显示屏是由多个LED显示模块拼接而成的。然而，多个LED显示模块在拼接时必然存在拼接缝，在拼接缝处容易出现透光，尤其是邻近拼接缝处的两行或两列的LED所发出的光更容易在拼接缝处透出。侧视时，拼接缝处出光强度较大，直接导致组屏后大视角观察时拼接缝附近容易产生黄色或青蓝色或粉红色或白色亮线。
发明内容
本公开提供一种显示模块及其制作方法、LED显示模组和LED显示屏，可以改善显示模块拼接后拼接缝处因漏光而产生的黄色或青蓝色或粉红色或白色亮线。
本发明实施例提供了一种显示模块，包括：
基板，所述基板具有正面和背面；
像素单元阵列，所述像素单元阵列设置在所述基板的正面；
封装层，所述封装层覆盖在所述像素单元阵列所在的区域上，所述封装层的侧面在所述基板的正面的边缘处形成坡面；
黑色油墨层，所述黑色油墨层覆盖在所述封装层上。
本发明实施例还提供了一种显示模块的制作方法，包括：
提供基板，其中，所述基板具有正面和背面；
在所述基板的正面形成像素单元阵列；
在所述像素单元阵列所在的区域上形成封装层；
在所述封装层的侧面位于所述基板的正面的边缘处形成坡面；
在所述封装层上形成黑色油墨层。
本发明实施例还提供了一种LED显示模组，该LED显示模组包括多个阵列排布的显示模块。
本发明实施例还提供了一种LED显示屏，该LED显示屏包括多个阵列排布的LED显示模组。
附图说明
图1是本发明实施例一提供的一种显示模块的剖面结构示意图；
图2是本发明实施例一提供的一种显示模块的俯视结构示意图；
图3是本发明实施例二提供的一种显示模块的剖面结构示意图；
图4是本发明实施例二提供的一种显示模块的俯视结构示意图；
图5是本发明实施例二提供的另一种显示模块的剖面结构示意图；
图6是本发明实施例三提供的一种显示模块制作方法的流程图；
图7是本发明实施例四提供的一种LED显示模组的示意图。
具体实施方式
下面结合附图和实施例对本公开作说明。此处所描述的具体实施例仅仅用于解释本公开，而非对本公开的限定。为了便于描述，附图中仅示出了与本公开相关的部分而非全部结构。
实施例一
图1是本发明实施例一提供的一种显示模块的剖面结构示意图，图2是本发明实施例一提供的一种显示模块的俯视结构示意图，参考图1，该显示模块包括：基板110，基板110具有正面和背面，像素单元阵列120，像素单元阵列120设置在基板110的正面，封装层130，封装层130覆盖在像素单元阵列120所在的区域上，所述封装层130为透明或半透明状，封装层130的侧面在基板110的正面的边缘处形成坡面131；黑色油墨层140，黑色油墨层140覆盖在封装层130上，其中，黑色油墨层140覆盖至封装层130时，坡面131使得黑色油墨与 封装层130接触更充分。
参考图2，坡面131包括与基板110接触的第一侧边1311，还包括不与基板接触的第二侧边1312，沿平行于基板110表面的方向，第二侧边1312相对于第一侧边1311更邻近像素单元阵列120的边缘；黑色油墨层140覆盖封装层130。
基板110可以为印制电路板(Printed Circuit Board，PCB)基板(包括FR4，FR4+类BT，BT，类BT或柔性电路板(Flexible Printed Circuit，FPC))或者玻璃基板。基板110的背面设置有驱动芯片和连接器，驱动芯片通过表面贴装技术(Surface Mounted Technology，SMT)工艺连接在基板上，或者基板包括薄膜晶体管(Thin film transistor，TFT)阵列。像素单元阵列120上包括多个像素单元，每个像素单元包括三个子像素，如红色LED、绿色LED、蓝色LED。第一侧边1311为坡面131与基板110相交的边界线。
坡面131与基板110的设定夹角a小于90度，与坡面131垂直于基板110时相比，设置设定夹角a小于90度，一方面使得照射到坡面131的光一部分折向基板110，减少侧向出射的光，从而减少显示模块拼接后拼接缝处的漏光，另一方面，坡面131具有一定的倾角使得黑色油墨层140能够覆盖住整个封装层130，即黑色油墨层140也可以很好地覆盖住拼接缝处的坡面131，由于黑色油墨层140具有一定的减小透光的作用，从而黑色油墨层140覆盖坡面131可以减少拼接缝处的透光。此外，坡面131具有一定的倾角使后续形成的黑色油墨层140等膜层能均匀覆盖到坡面131，从而使整个封装层130表面全部有黑色油墨层材料，使得显示模块的出光均匀性更好，避免局部发光过强的问题。由于显示模块发光均匀性较好，使显示模块本身具有较高的错位兼容性，便于组屏生产，提升组装屏的效率和良率。
可选地，坡面131通过对封装层130进行半切割或者全切割倒角形成。
可选地，倒角的角度范围为1度-89度。
可选地，坡面131于基板110的垂直投影与像素单元阵列120所在的区域不重叠。
可选地，参考图1，该LED显示模块还包括记忆涂料层150，记忆涂料层150覆盖黑色油墨层140，记忆涂料层150设置为保护黑色油墨层140。
采用喷涂的方式在黑色油墨层140上形成记忆涂料层150，以保护黑色油墨层，可以防止黑色油墨层被划伤，残留接触指印等。
可选地，封装层130的材料为掺有扩散粉的透明环氧树脂或硅树脂。
本实施例的技术方案通过设置坡面131与基板110的设定夹角a小于90度，一方面使得像素单元阵列120边缘的LED的出光角度发生改变，使得照射到坡 面131的光一部分折向基板110，减少侧向出射的光，从而减少显示模块拼接后拼接缝处的漏光，另一方面，使得黑色油墨层可以很好地覆盖住拼接缝处的坡面131，从而减少拼接缝处的透光。此外，坡面131具有一定的倾角使后续形成的黑色油墨层140等膜层能均匀覆盖到坡面131，从而使整个封装层130表面全部有黑色油墨层材料，使得显示模块的出光均匀性更好，避免局部发光过强的问题。由于显示模块发光均匀性较好，使显示模块本身具有较高的错位兼容性，便于组屏生产，提升组装屏的效率和良率。
实施例二
图3是本发明实施例二提供的一种显示模块的剖面结构示意图，图4是本发明实施例二提供的一种显示模块的俯视结构示意图，图5是本发明实施例二中提供的另一种显示模块的剖面结构示意图。在上述实施例的基础上，参考图3和图4，坡面131包括至少两个子坡面，例如图3和图4中的第一子坡面132和第二子坡面133；沿基板110指向黑色油墨层140的方向，至少两个子坡面依次排列，且至少两个子坡面与基板110的夹角逐渐减小。
参考图3，坡面131包括一个第一子坡面132和一个第二子坡面133，第一子坡面132和第二子坡面133沿基板110指向黑色油墨层140的方向，第一子坡面132和第二子坡面133依次排列，设第一子坡面132与基板110的夹角为b1，第二子坡面133与基板110的夹角为b2，第二子坡面133与基板110的夹角b2小于第一子坡面132与基板110的夹角b1。
坡面131与基板110的夹角越小，照射到坡面131上的光线折向基板110方向的越多，但坡面131与基板110的夹角过小时，为保证封装层130的厚度不变，保证封装效果，封装层130的边界与像素单元阵列(LED阵列层)120的边界之间的距离越大，即显示模块的边框越大。通过设置坡面131包括至少两个子坡面(如第一子坡面132和第二子坡面133)，与图1和图2所示的坡面131相比，可以在保证使较多的照射到坡面131的光线被折向基板110的情况下，较大程度的改善出光角度，以及可以使得黑色油墨层140能够覆盖住整个封装层130，减少透光的同时，保证显示模块具有较小的边框。
坡面131还可以包括多个子坡面，第一个子坡面与基板110接触，其他子坡面不与基板110接触，且沿基板110依次指向黑色油墨层140的方向，其他子坡面依次越来越邻近像素单元阵列120的边缘，且每个子坡面与基板110的夹角都小于90度，子坡面的个数和角度的设置可以根据实际的显示模块的需求进行设定，在此不做限定。
可选地，参考图5，坡面包括圆弧面134。
参考图5，当坡面包括圆弧面134时，坡面131与基板110的夹角为圆弧面134的切线与基板110的夹角。设圆弧面134与基板110的夹角为c，夹c小于90度，由此，可以改善像素单元阵列120边缘的LED的出光角度，减少透光，以及可以使得黑色油墨层140能够覆盖住整个封装层130，从而可以在显示模块拼接时减少拼接处的透光。此外，坡面131还可以包括由至少两个圆弧面组成的侧面。其中，每个圆弧面与基板形成的夹角小于90度。
图5仅示例性的示出了坡面131包括凹向像素单元阵列120的圆弧面，并非对本公开的限定，在其他实施方式中，坡面131还可以包括向远离像素单元阵列120的方向凸出的圆弧面。
实施例三
图6是本发明实施例三提供的一种显示模块的制作方法的流程图，该方法适用于本发明任意实施例的显示模块的实现过程，参考图6，该显示模块的制作方法包括如下步骤：
步骤210、提供基板，其中，基板具有正面和背面。
基板可以为印制电路板(Printed Circuit Board，PCB)基板(包括FR4，FR4+类BT，BT，类BT或FPC)或者玻璃基板。
步骤220、在基板的正面形成像素单元阵列。
将LED贴装在基板上形成像素单元阵列。
步骤230、在像素单元阵列所在的区域上形成封装层。
封装层为透明或半透明状，封装层在像素单元阵列表面固化后其表面平整。
步骤240、在封装层的侧面位于基板的正面的边缘处形成坡面。
步骤250、在封装层上形成黑色油墨层。
黑色油墨层覆盖至封装层时，坡面使得黑色油墨与封装层接触更充分。
可以采用喷涂的方式在在封装层远离基板的一侧喷涂黑色油墨层，均匀地喷涂黑色油墨层可以改善像素单元阵列的出光强度和均匀度。
坡面与基板具有设定夹角，设定夹角小于90度，由此，在多个显示模块拼接时，可以使得后续的黑色油墨层的喷涂材料能够均匀地覆盖到拼接缝处的封装层上，从而使整个封装层的表面全部有喷涂材料，使其出光强度均匀一致，避免局部发光过强的问题，减少拼接缝处的侧漏光，虚化拼接缝处的亮线问题。
可选地，在封装层的侧面位于基板的正面的边缘处形成坡面，包括：
采用铣刀在封装层的侧面位于基板的正面的边缘处进行切割形成坡面。
还可以采用线切割技术在封装层的侧面位于基板的正面的边缘处进行切割形成坡面。
可选地，在像素单元阵列区域上形成封装层，包括：
通过喷涂、旋涂、狭缝式涂布、压模、贴装胶膜和点胶中的至少一种形成封装层。
例如，可以采用喷涂、旋涂(spin coating)、狭缝式涂布(slot die coating)透明液态胶并固化形成封装层，或者，采用压膜方法形成封装层，或者，采用贴装胶膜形成封装层，或者，采用点胶方式形成封装层。
本实施例的技术方案，提供一种显示模块的制作方法，该制作方法包括提供基板；在基板的正面形成像素单元阵列；在像素单元阵列所在的区域上形成封装层；在封装层的侧面位于基板的正面的边缘处形成坡面；在封装层上形成黑色油墨层，其中，黑色油墨层覆盖至封装层时，坡面使得黑色油墨与封装层接触更充分。由此，可以改善显示模块拼接处的LED的出光角度，减少拼接处的透光，同时使得黑色油墨层可以很好地覆盖拼接处的封装层，由此可以减少拼接处的透光以及改善拼接处出现色线、亮线的现象。
本实施例的显示模块的制作方法与本发明任意实施例提供的显示模块属于相同的构思，具有相应的效果，未在本实施例详尽的技术细节详见本发明任意实施例提供的显示模块。
实施例四
图7是本发明实施例四提供的一种LED显示模组的示意图，参考图7，该LED显示模组包括多个阵列排布的本发明任意实施例所述的显示模块。
参考图7，LED显示模组是由多个显示模块拼接形成的大的显示模组，在拼接时会形成图7所示的拼接缝1和拼接缝2。通常，当显示模块的坡面垂直于基板时，在拼接时，当两个拼接的显示模块的边沿处的LED像素均为R像素、G像素、B像素方式排列时，由于两个模块拼接处的封装层的坡面垂直于基板，即坡面无倾角，其边沿处的封装层无法被后续形成的黑色油墨层等膜层均匀覆盖，因而会导致边沿拼接缝处的透光强度大，会出现亮线；当两个拼接的显示模块的边沿处的LED像素一个均为R像素，另一个均为B像素时，会在边沿拼接缝处形成黄色、粉色等色线。而通过本发明实施例提供的显示模块，在拼接 时，由于具有坡面，一方面使得照射到坡面的光一部分折向基板，减少侧向出射的光，从而减少显示模块拼接后拼接缝处的漏光，另一方面，坡面具有一定的倾角使得黑色油墨层能够覆盖住整个封装层，即黑色油墨层也可以很好地覆盖住拼接缝处的坡面，由于黑色油墨层具有一定的减小透光的作用，从而黑色油墨层覆盖坡面可以减少拼接缝处的透光。此外，坡面具有一定的倾角使后续的形成的黑色油墨层等膜层能均匀覆盖到坡面，从而使整个封装层表面全部有黑色油墨层材料，使得显示模块的出光均匀性更好，避免局部发光过强的问题。由于模块发光均匀性较好，使模块本身具有较高的错位兼容性，便于组屏生产，提升组装屏的效率和良率。
实施例五
本发明实施例五还提供了一种LED显示屏，该LED显示屏包括多个阵列排布的本发明任意实施例所述的显示模组。

Claims (12)

  1. 一种显示模块，包括：
    基板，所述基板具有正面和背面；
    像素单元阵列，所述像素单元阵列设置在所述基板的正面；
    封装层，所述封装层覆盖在所述像素单元阵列所在的区域上，所述封装层的侧面在所述基板的正面的边缘处形成坡面；
    黑色油墨层，所述黑色油墨层覆盖在所述封装层上。
  2. 根据权利要求1所述的显示模块，其中，所述坡面通过对所述封装层进行半切割或者全切割倒角形成。
  3. 根据权利要求2所述的显示模块，其中，所述倒角的角度范围为1度-89度。
  4. 根据权利要求1所述的显示模块，其中，所述坡面包括至少两个子坡面，所述至少两个子坡面依次排列。
  5. 根据权利要求1所述的显示模块，其中，所述坡面包括圆弧面。
  6. 根据权利要求1所述的显示模块，其中，所述坡面于所述基板的垂直投影与所述像素单元阵列所在的区域不重叠。
  7. 根据权利要求1所述的显示模块，还包括：
    记忆涂料层，所述记忆涂料层覆盖所述黑色油墨层，所述记忆涂料层设置为保护所述黑色油墨层。
  8. 一种显示模块的制作方法，包括：
    提供基板，其中，所述基板具有正面和背面；
    在所述基板的正面形成像素单元阵列；
    在所述像素单元阵列所在的区域上形成封装层；
    在所述封装层的侧面位于所述基板的正面的边缘处形成坡面；
    在所述封装层上形成黑色油墨层。
  9. 根据权利要求8所述的方法，其中，所述在所述封装层的侧面位于所述基板的正面的边缘处形成坡面，包括：
    采用铣刀在所述封装层的侧面位于所述基板的正面的边缘处进行切割形成所述坡面。
  10. 根据权利要求8所述的方法，其中，所述在所述像素单元阵列区域上形成封装层，包括：
    通过喷涂、旋涂、狭缝式涂布、压模、贴装胶膜和点胶中的至少一种形成所述封装层。
  11. 一种发光二极管LED显示模组，包括多个阵列排布的如权利要求1-7任一项所述的显示模块。
  12. 一种发光二极管LED显示屏，包括多个阵列排布的如权利要求11所述的LED显示模组。
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN206021820U (zh) * 2016-08-12 2017-03-15 比亚迪股份有限公司 用于显示屏的透镜和具有其的显示屏
CN108260361A (zh) * 2015-11-04 2018-07-06 Lg伊诺特有限公司 发光元件和具有发光元件的照明装置
CN108336204A (zh) * 2018-04-04 2018-07-27 上海恩弼科技有限公司 单面出光的led芯片及其制作方法
CN208045002U (zh) * 2017-10-30 2018-11-02 深圳市晶台股份有限公司 高对比度集成封装显示模组结构
CN110770920A (zh) * 2017-12-20 2020-02-07 首尔伟傲世有限公司 用于显示器的led单元和具有其的显示设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160090981A (ko) * 2015-01-22 2016-08-02 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 윈도우 보호 방법
JP6469260B2 (ja) * 2016-01-19 2019-02-13 三菱電機株式会社 Ｌｅｄ表示パネルの製造方法
KR102478223B1 (ko) * 2016-02-02 2022-12-19 삼성디스플레이 주식회사 유기 발광 표시 장치
KR102582059B1 (ko) * 2016-12-30 2023-09-21 엘지디스플레이 주식회사 표시 장치 및 이를 이용한 멀티 스크린 표시 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108260361A (zh) * 2015-11-04 2018-07-06 Lg伊诺特有限公司 发光元件和具有发光元件的照明装置
CN206021820U (zh) * 2016-08-12 2017-03-15 比亚迪股份有限公司 用于显示屏的透镜和具有其的显示屏
CN208045002U (zh) * 2017-10-30 2018-11-02 深圳市晶台股份有限公司 高对比度集成封装显示模组结构
CN110770920A (zh) * 2017-12-20 2020-02-07 首尔伟傲世有限公司 用于显示器的led单元和具有其的显示设备
CN108336204A (zh) * 2018-04-04 2018-07-27 上海恩弼科技有限公司 单面出光的led芯片及其制作方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4160688A4

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