WO2019100661A1 - 显示器件 - Google Patents

显示器件 Download PDF

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Publication number
WO2019100661A1
WO2019100661A1 PCT/CN2018/085177 CN2018085177W WO2019100661A1 WO 2019100661 A1 WO2019100661 A1 WO 2019100661A1 CN 2018085177 W CN2018085177 W CN 2018085177W WO 2019100661 A1 WO2019100661 A1 WO 2019100661A1
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WIPO (PCT)
Prior art keywords
layer
display device
display
plane
light
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PCT/CN2018/085177
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English (en)
French (fr)
Inventor
宋艳芹
张露
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昆山国显光电有限公司
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Application filed by 昆山国显光电有限公司 filed Critical 昆山国显光电有限公司
Priority to US16/342,196 priority Critical patent/US11289676B2/en
Priority to KR1020197038734A priority patent/KR102407515B1/ko
Priority to EP18881323.2A priority patent/EP3637470B1/en
Priority to JP2019567681A priority patent/JP6960476B2/ja
Publication of WO2019100661A1 publication Critical patent/WO2019100661A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers

Definitions

  • This invention relates to optoelectronic devices, and more particularly to display devices.
  • the existing thin film package is encapsulated by an inorganic layer and an organic layer, so that the display device has a good gas barrier effect.
  • the material of the planarization layer is mostly an organic material, and the water-oxygen barrier property of the organic material is poor, and flattening under the light-emitting display layer when the light-emitting display layer of the display device is packaged in the package layer
  • the layer easily affects the packaging effect of the entire display device, thereby affecting the service life of the display device. Therefore, it is very important to seek a display device with a good overall package effect.
  • a display device includes a light emitting display layer, a planarization layer, and an encapsulation layer which are sequentially stacked.
  • the planarization layer is provided with at least one closed recess, and the projection of the closed loop formed by the groove on the plane of the light-emitting display layer is completely outside the light-emitting display layer and surrounds the light-emitting display layer.
  • the encapsulation layer includes an inorganic layer, and a boundary of a boundary of the planarization layer on a plane of the luminescent display layer is located at a boundary of the inorganic layer on a plane of the luminescent display layer. The projections within the projection and the boundary with the inorganic layer on the plane of the luminescent display layer do not coincide.
  • the distance between the projection of the groove on the plane of the luminescent display layer and the projection of the boundary of the inorganic layer on the plane of the luminescent display layer is from 1 micrometer to 3000 micrometers.
  • an insulating layer is further included, and an edge of the inorganic layer is connected to the insulating layer.
  • the insulating layer isolates the planarization layer from a driving element of a display device.
  • the encapsulation layer includes an organic layer, and a projection of the organic layer on a plane of the luminescent display layer can completely cover the luminescent display layer and a closed loop formed in the recess is in the The projection on the plane of the luminescent display layer.
  • the projection of the groove on the plane of the luminescent display layer and the projection of the organic layer boundary on the plane of the luminescent display layer are from 1 micrometer to 1000 micrometers.
  • the encapsulation layer further includes a plurality of inorganic layers disposed alternately stacked with the organic layer, the edges of the organic layer not exceeding the edges of the inorganic layer.
  • the groove penetrates the planarization layer in a thickness direction of the planarization layer.
  • the recess does not completely penetrate the planarization layer, and an opening is formed on the planarization layer, the opening being toward the encapsulation layer.
  • the depth of the groove is 30% or more of the thickness of the planarization layer.
  • the grooves have a width of from 1 micron to 100 microns.
  • At least one closed groove is formed in the planarization layer to surround the light-emitting display layer, so as to prevent the planarization layer from continuously extending from the boundary of the package layer to the light-emitting display layer, thereby preventing water and oxygen from entering through the planarization layer.
  • Inside the package layer improve the packaging effect and service life of the display device.
  • FIG. 1 is a cross-sectional view of a display device according to a first embodiment of the present invention
  • FIG. 2 is a top plan view of a display device according to a first embodiment of the present invention.
  • FIG. 3 is a cross-sectional view of a display device according to a second embodiment of the present invention.
  • FIG. 4 is a cross-sectional view of a display device according to a third embodiment of the present invention.
  • FIG. 5 is a cross-sectional view showing a display device according to a fourth embodiment of the present invention.
  • an embodiment of the present invention provides a display device including a light emitting display layer 10, a planarization layer 20, and an encapsulation layer 30.
  • the planarization layer 20 is provided with at least one turn of the closed recess 40, and the projection of the closed loop formed by the recess 40 on the plane of the light-emitting display layer 10 is completely outside the light-emitting display layer 10 and surrounds the light-emitting display layer 10.
  • the closed recess 40 can effectively block external water vapor or oxygen from infiltrating from the contact surface of the encapsulation layer 30 and the planarization layer 20 to contact the light-emitting display layer 10, thereby improving the water-blocking and oxygen-blocking performance of the device and effectively improving the surface.
  • the packaging effect of the display device is improved, thereby improving the display life of the display device.
  • the experiment proves that the display device of the technical solution can illuminate for 1230 hours under high temperature and high humidity, far exceeding 480 hours of the display device without the groove 40.
  • the encapsulation layer 30 includes an inorganic layer 301.
  • the projection of the boundary of the planarization layer 20 on the plane of the luminescent display layer 10 is within the projection of the boundary of the inorganic layer 301 on the plane of the luminescent display layer 10, and the inorganic layer 301 The projections of the boundaries on the plane of the luminescent display layer 10 do not coincide.
  • the inorganic layer 301 has good gas barrier properties, and is used for blocking external water vapor or oxygen from contacting the luminescent display layer 10 to protect the luminescent display layer 10. By completely covering the planarization layer 20 by the inorganic layer 301, water oxygen is more prevented from entering the inside of the encapsulation layer 30 through the planarization layer 20.
  • the projection D of the groove 40 on the plane of the light-emitting display layer 10 and the projection of the boundary of the inorganic layer 301 on the plane of the light-emitting display layer 10 are 1 micrometer to 3000 micrometers, ensuring that the inorganic layer 301 is completely covered and flat.
  • the layer 20 is simultaneously minimized in the non-display area of the display device, and the effective display area of the display device is sufficiently enlarged.
  • an insulating layer 50 is further included, and an edge of the inorganic layer 301 is connected to the insulating layer 50 for isolating the planarizing layer 20 from the driving elements of the display device to protect the driving element. .
  • the planarization layer 20 can be more completely encapsulated, and on the other hand, the inorganic layer 301 and the insulating layer 50 have better bonding performance and are easier to realize. For reliable packaging results.
  • the encapsulation layer 30 further includes an organic layer 302 disposed adjacent to the inorganic layer 301, and the organic layer 302 has good flexibility for preventing the inorganic layer 301 from cracking during the bending process.
  • the projection of the organic layer 302 on the plane of the light-emitting display layer 10 can completely cover the light-emitting display layer 10 and is located in the projection of the closed circle formed by the groove 40 on the plane of the light-emitting display layer 10, and the groove 40 is illuminated.
  • the distance d between the projection on the plane of the display layer 10 and the projection of the organic layer 302 on the plane of the luminescent display layer 10 is from 1 micrometer to 1000 micrometers.
  • the groove 40 penetrates the planarization layer 20 in the thickness direction of the planarization layer 20.
  • This structure of the recess 40 completely blocks the transmission path of water oxygen in the planarization layer 20.
  • the recess 40 may not completely penetrate the planarization layer 20, and an opening is formed on the planarization layer 20, and the opening faces the encapsulation layer 30, in actual production. If the planarization layer 20 is processed to completely penetrate the planarization layer 20, it is difficult to ensure the integrity of the film structure under the planarization layer 20, and the device performance is thus affected, and the groove 40 that is not completely penetrated is avoided. Due to the low precision of the process, the film layer under the planarization layer 20 is damaged during the formation of the groove 40, and the processing process of the planarization layer 20 is lower and easier to implement.
  • the depth of the recess 40 is 30% or more of the thickness of the planarization layer 20, and the depth of such recess 40 is most controllable during the actual process.
  • the width of the groove 40 is from 1 micrometer to 100 micrometers.
  • the larger the width of the groove 40 the larger the volume of the groove 40, that is, the diffusion and penetration of water vapor or oxygen into the device.
  • the larger the retention space in the process the better the water blocking and oxygen barrier properties of the device.
  • the wider the width of the groove 40 the more easily the encapsulation layer 30 covering the groove 40 is formed into a depression, which affects the flatness of the device, so the concave
  • This width setting of the trench not only ensures the water-blocking gas barrier properties of the device, but also does not affect the overall flatness of the display device.
  • the encapsulation layer 30 is stacked with the luminescent display layer 10 and the planarization layer 20, and the encapsulation layer 30 includes two inorganic layers 301 and one organic layer 302.
  • the organic layer 302 is stacked on two layers. Between the inorganic layers 301, and the edges of the organic layer 302 do not exceed the edges of the inorganic layer 301.
  • the encapsulation layer 20 includes three inorganic layers 301 and two organic layers 302 alternately stacked to further block diffusion and penetration of moisture or harmful gases in the encapsulation layer 20, thereby further The performance of the water-blocking and gas-blocking of the flexible device is improved, and the bending life of the flexible device is increased.

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Abstract

一种整体封装效果良好的显示器件，包括发光显示层（10）、平坦化层（20）和封装层（30）；平坦化层（20）开设有至少一圈闭合凹槽（40），凹槽（40）形成的闭合圈在发光显示层（10）所在平面上的投影完全处于发光显示层（10）之外并围绕发光显示层（10）。显示器件，通过在平坦化层（20）开设至少一圈闭合凹槽（40）围绕发光显示层（10），避免平坦化层（20）从封装层（30）的边界连续的延伸至发光显示层（10），从而避免水氧通过平坦化层（20）进入封装层（30）内部，提高显示器件的封装效果和使用寿命。

Description

显示器件 技术领域
本发明涉及光电器件，特别是涉及显示器件。
背景技术
在现有的显示器件中，柔性显示器件的发展前景尤为广阔，消费者对于显示器件的要求也越来越高。为保证器件的柔性，无法使用传统的玻璃封装，必须使用薄膜封装。
现有的薄膜封装采用无机层与有机层共同进行封装，以使得显示器件具有良好的阻气阻水的效果。
然而，在显示器件的封装中，平坦化层的材料多为有机材料，有机材料的水氧阻隔性差，在显示器件的发光显示层被封装在封装层中时，处于发光显示层下方的平坦化层容易影响整个显示器件的封装效果，进而影响显示器件的使用寿命，因此，寻求一种整体封装效果良好的显示器件具有非常重要的意义。
发明内容
基于此，有必要针对上述问题，提供一种整体封装效果良好的显示器件。
一种显示器件，包括顺次层叠设置的发光显示层、平坦化层和封装层。所述平坦化层开设有至少一圈闭合凹槽，所述凹槽形成的闭合圈在所述发光显示层所在平面上的投影完全处于所述发光显示层之外并围绕所述发光显示层。
在其中一个实施例中，所述封装层包括无机层，所述平坦化层的边界在所述发光显示层所在平面上的投影位于所述无机层的边界在所述发光显示层所在平面上的投影内，且与所述无机层的边界在所述发光显示层所在平面上的投影不重合。
在其中一个实施例中，所述凹槽在所述发光显示层所在平面上的投影与所述无机层的边界在所述发光显示层所在平面上的投影的距离为1微米至3000微米。
在其中一个实施例中，还包括绝缘层，所述无机层的边缘与所述绝缘层连接。
在其中一个实施例中，所述绝缘层将所述平坦化层与显示器件的驱动元件隔离。
在其中一个实施例中，所述封装层包括有机层，所述有机层在所述发光显示层所在平面上的投影能完全覆盖所述发光显示层且位于所述凹槽形成的闭合圈在所述发光显示层所在平面上的投影内。
在其中一个实施例中，所述凹槽在所述发光显示层所在平面上的投影与所述有机层边界在所述发光显示层所在平面上的投影的距离为1微米至1000微米。
在其中一个实施例中，所述封装层还包括与有机层交替层叠设置的若干无机层，所述有机层的边缘不超过所述无机层的边缘。
在其中一个实施例中，所述凹槽在所述平坦化层的厚度方向上贯穿所述平坦化层。
在其中一个实施例中，所述凹槽不完全贯穿所述平坦化层，并在所述平坦化层上形成开口，所述开口朝向所述封装层。
在其中一个实施例中，所述凹槽的深度为所述平坦化层厚度的30％及以上。
在其中一个实施例中，所述凹槽的宽度为1微米至100微米。
上述显示器件，在所述平坦化层开设至少一圈闭合凹槽围绕所述发光显示层，避免平坦化层从封装层的边界连续的延伸至发光显示层，从而避免水氧通过平坦化层进入封装层内部，提高显示器件的封装效果和使用寿命。
附图说明
图1为本发明第一实施例提供的显示器件的剖面图；
图2为本发明第一实施例提供的显示器件的俯视图；
图3为本发明第二实施例提供的显示器件的剖面图；
图4为本发明第三实施例提供的显示器件的剖面图；
图5为本发明第四实施例提供的显示器件的剖面图。
附图标记：
10-发光显示层
20-平坦化层
30-封装层
301-无机层
302-有机层
40-凹槽
50-绝缘层
具体实施方式
参考图1及图2，本发明的一个实施例提供了一种显示器件，包括发光显示层10、平坦化层20和封装层30。平坦化层20开设有至少一圈闭合凹槽40，凹槽40形成的闭合圈在发光显示层10所在平面上的投影完全处于发光显示层10之外并围绕发光显示层10。
上述显示器件，闭合凹槽40能有效地阻挡外界水汽或氧气从封装层30与平坦化层20的接触面渗入从而接触到发光显示层10，提升了器件的阻水阻氧性能，有效地改善了显示器件的封装效果，从而提高了显示器件的显示寿命。实验证明本技术方案的显示器件在高温高湿下能够点亮1230小时，远超无凹槽40的显示器件的480小时。
优选地，封装层30包括无机层301，平坦化层20的边界在发光显示层10所在平面上的投影位于无机层301的边界在发光显示层10所在平面上的投影内，且与无机层301的边界在发光显示层10所在平面上的投影不重合。无机层301具有良好的阻气阻水性能，用于阻挡外界水汽或氧气与发光显示层10接触，起到对发光显示层10的保护作用。通过无机层301完全覆盖平坦化层20，更好地防止了水氧通过平坦化层20进入封装层30内部。优选地，凹槽40在发光显示层10所在平面上的投影与无机层301的边界在发光显示层10所在平面上的 投影的距离D为1微米至3000微米，在保证无机层301完全覆盖平坦化层20的同时使显示器件的非显示区尽量减小，充分扩大显示器件的有效显示面积。
优选地，参考图3，还包括绝缘层50，无机层301的边缘与绝缘层50连接，绝缘层50用于将平坦化层20与显示器件的驱动元件进行隔离，实现对驱动元件的保护作用。通过使所述无机层301的边缘与所述绝缘层50连接，一方面可以将平坦化层20更为完整地封装，另一方面无机层301与绝缘层50结合性能更好，更容易实现更为可靠的封装效果。
优选地，封装层30还包括有机层302，有机层302与无机层301层叠相邻设置，有机层302具有良好的柔性，用于防止无机层301在弯折过程中开裂。更优地，有机层302在发光显示层10所在平面上的投影能完全覆盖发光显示层10且位于凹槽40形成的闭合圈在发光显示层10所在平面上的投影内，凹槽40在发光显示层10所在平面上的投影与有机层302边界在发光显示层10所在平面上的投影的距离d为1微米至1000微米。根据这种结构，有机层设置于凹槽内部时，有机层和无机层的形成不会因为凹槽的存在而下陷，从而进一步保障了有机层302与无机层301的厚度的均匀性。
优选地，凹槽40在平坦化层20的厚度方向上贯穿平坦化层20。凹槽40的这种结构完全隔断了水氧在平坦化层20中的传输路径。
请参阅图4，在另一实施例中，凹槽40也可以不完全贯穿所述平坦化层20，并在平坦化层20上形成开口，所述开口朝向所述封装层30，在实际生产中，若将平坦化层20加工至完全穿透平坦化层20，很难保证平坦化层20下方膜层结构的完整性，器件性能会因此受到影响，而不完全贯穿的凹槽40避免了由于工艺精度不高所导致的平坦化层20下方膜层在凹槽40的形成过程中遭到的破坏，对平坦化层20的加工工艺的要求更低，更容易实现。
优选地，凹槽40的深度为平坦化层20厚度的30％及以上，这种凹槽40深度的设置在实际工艺过程中最可控。
优选地，凹槽40的宽度为1微米至100微米，在深度不变的条件下，凹槽40的宽度越大，凹槽40的容积越大，即水汽或氧气往器件内扩散与渗透的过程中的滞留空间越大，器件的阻水阻氧性能更优，但是，凹槽40的宽度越宽，覆 盖于凹槽40上方的封装层30越容易形成凹陷，影响器件平整度，所以凹槽的这种宽度设置不仅保证了器件的阻水阻气性能，也不影响显示器件的整体平整度。
在图1至图3的实施例中，封装层30与发光显示层10及平坦化层20层叠设置，且封装层30包括两个无机层301和一个有机层302，有机层302层叠设置在两个无机层301之间，且有机层302的边缘不超过无机层301的边缘。
参考图5，在另一实施例中，封装层20包括交替层叠设置的三个无机层301和两个有机层302，进一步地阻挡水汽或有害气体在封装层20中的扩散与渗透，从而进一步提高了柔性设备的阻水阻气的性能，且增加了柔性设备的弯折寿命。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对本发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (12)

  1. 一种显示器件，包括顺次层叠设置的发光显示层、平坦化层和封装层；
    其中，所述平坦化层开设有至少一圈闭合凹槽，所述凹槽形成的闭合圈在所述发光显示层所在平面上的投影完全处于所述发光显示层之外并围绕所述发光显示层。
  2. 根据权利要求1所述的显示器件，其中，所述封装层包括无机层，所述平坦化层的边界在所述发光显示层所在平面上的投影位于所述无机层的边界在所述发光显示层所在平面上的投影内，且与所述无机层的边界在所述发光显示层所在平面上的投影不重合。
  3. 根据权利要求2所述的显示器件，其中，所述凹槽在所述发光显示层所在平面上的投影与所述无机层的边界在所述发光显示层所在平面上的投影的距离为1微米至3000微米。
  4. 根据权利要求2所述的显示器件，其中，还包括绝缘层，所述无机层的边缘与所述绝缘层连接。
  5. 根据权利要求2所述的显示器件，其中，所述绝缘层将所述平坦化层与显示器件的驱动元件隔离。
  6. 根据权利要求1所述的显示器件，其中，所述封装层包括有机层，所述有机层在所述发光显示层所在平面上的投影能完全覆盖所述发光显示层且位于所述凹槽形成的闭合圈在所述发光显示层所在平面上的投影内。
  7. 根据权利要求6所述的显示器件，其中，所述凹槽在所述发光显示层所在平面上的投影与所述有机层边界在所述发光显示层所在平面上的投影的距离为1微米至1000微米。
  8. 根据权利要求6所述的显示器件，其中，所述封装层还包括与有机层交替层叠设置的若干无机层，所述有机层的边缘不超过所述无机层的边缘。
  9. 根据权利要求1所述的显示器件，其中，所述凹槽在所述平坦化层的厚度方向上贯穿所述平坦化层。
  10. 根据权利要求1所述的显示器件，其中，所述凹槽不完全贯穿所述平坦化层，并在所述平坦化层上形成开口，所述开口朝向所述封装层。
  11. 根据权利要求10所述的显示器件，其中，所述凹槽的深度为所述平坦化层厚度的30％及以上。
  12. 根据权利要求1所述的显示器件，其中，所述凹槽的宽度为1微米至100微米。
PCT/CN2018/085177 2017-11-24 2018-04-28 显示器件 WO2019100661A1 (zh)

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