CN103579256A - 阻气基板 - Google Patents
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Abstract
本发明是有关于一种阻气基板,包括可挠性基材、至少第一无机阻气层以及至少第二无机阻气层。可挠性基材具有上表面。第一无机阻气层配置于可挠性基材上且覆盖上表面。第二无机阻气层配置于第一无机阻气层上且覆盖第一无机阻气层。第二无机阻气层的水氧穿透速率低于第一无机阻气层的水氧穿透速率。
Description
技术领域
本发明是有关于一种阻气基板,特别是有关于一种良好阻气能力的阻气基板。
背景技术
显示器是否具备可挠性,取决于其所使用的基板材质。当显示器所使用的基板为硬质基板(rigid substrate)时,例如玻璃基板,显示器不具有可挠性。反之,显示器所使用的基板为可挠性基板(flexible substrate)时,例如塑料基板,显示器即具有良好的可挠性。
可挠性基板相较于一般硬质基板的优点为便宜、透明、易加工、符合安全性、适合所有显示介质并适合Roll-to-Roll工艺,但其缺点为不耐高温、阻水阻氧气性差、耐化学药品性差及热膨胀系数大。典型的可挠性基板对水的穿透速率为100-10-1g/m2/day(25°C),其因无法完全阻隔水气及氧气的穿透,进而加速基板内的元件老化,导致所制成的元件寿命减短,无法符合商业上的需求。因此,为了阻隔水氧,在可挠性基板和无机导电层之间涂覆致密的特殊材料,以防止水氧的渗透及扩散,此致密阻隔材料的选取需使其在涂覆过程中能无缺陷地(defect-free)均匀成膜、不会产生针孔(pinholes)、高透光性及避免对可见光的吸收,并以单层或多层堆叠的方式来达成可挠性基板对于阻气的需求。
目前做在可挠性基板上的柔软阻气膜包括有机膜与无机膜,无机膜例如金属氧化物(metal oxide)、金属氮化物(metal nitride)、金属氮氧化物(metal oxynitride)等,其中无机膜的阻气性较有机膜佳,而有机膜可以保持整体阻气层的柔软度。然而,若为了增加阻隔水氧的特性而增加无机膜的厚度,过厚的无机膜容易于挠曲时出现裂缝(crack),因此如何避免因应力集中所造成阻气膜失效的问题就相形重要。
由此可见,上述现有的可挠性基板在结构与使用上,显然仍存在有不便与缺陷,而亟待加以进一步改进。因此如何能创设一种新型结构的阻气基板,亦成为当前业界极需改进的目标。
发明内容
本发明的目的在于,克服现有的可挠性基板存在的缺陷,而提供一种新型结构的阻气基板,所要解决的技术问题是使其具有良好的阻气能力,非常适于实用。
本发明的目的及解决其技术问题是采用以下技术方案来实现的。依据本发明提出的一种阻气基板,其中包括:可挠性基材,具有上表面;至少第一无机阻气层,配置于该可挠性基材上,且覆盖该上表面;以及至少第二无机阻气层,配置于该第一无机阻气层上,且覆盖该第一无机阻气层,其中该第二无机阻气层的水氧穿透速率低于该第一无机阻气层的水氧穿透速率。
本发明的目的及解决其技术问题还可采用以下技术措施进一步实现。
前述的阻气基板,其中所述的可挠性基材包括塑料基材或薄化玻璃基材。
前述的阻气基板,其中所述的第一无机阻气层的材质包括氮化硅或氧化硅。
前述的阻气基板,其中所述的第一无机阻气层的材质与该第二无机阻气层的材质相同。
前述的阻气基板,其中所述的第一无机阻气层的厚度大于该第二无机阻气层的厚度。
前述的阻气基板,其中所述的第二无机阻气层的致密度高于该第一无机阻气层的致密度。
前述的阻气基板,其中所述的第一无机阻气层的应力值小于该第二无机阻气层的应力值。
前述的阻气基板,其中所述的第一无机阻气层的应力值介于-100MPa至200MPa之间。
前述的阻气基板,其中所述的第二无机阻气层的应力值介于-300MPa至-700MPa之间。
前述的阻气基板,其中所述的第一无机阻气层的水氧穿透速率介于0.1g/m2/day至1g/m2/day之间。
前述的阻气基板,其中所述的第二无机阻气层的水氧穿透速率介于0.1g/m2/day至0.01g/m2/day之间。
前述的阻气基板,其特征在于更包括:黏着层,配置于该第二无机阻气层上,且覆盖该第二无机阻气层。
前述的阻气基板,其特征在于至少第一无机阻气层为多个第一无机阻气层,而所述第一无机阻气层与该第二无机阻气层交替堆叠于该可挠性基材上。
本发明与现有技术相比具有明显的优点和有益效果。由以上可知,为达到上述目的,本发明提供了一种可挠性基材、至少第一无机阻气层以及至少第二无机阻气层。可挠性基材具有上表面。第一无机阻气层配置于可挠性基材上且覆盖上表面。第二无机阻气层配置于第一无机阻气层上且覆盖第一无机阻气层,其中第二无机阻气层的水氧穿透速率低于第一无机阻气层的水氧穿透速率。
借由上述技术方案,本发明阻气基板至少具有下列优点及有益效果:由于在可挠性基材上配置有具有不同水氧穿透速率的第一无机阻气层及第二无机阻气层,因此本发明的实施例的阻气层结构除了可具有较佳的阻隔水气与氧气的能力外,亦可具有可挠曲性。此种第一无机阻气层与第二无机阻气层的搭配设计亦可以使阻气基板具有较佳地结构可靠度。此外,由于第二无机阻气层的水氧穿透速率低于第一无机阻气层的水氧穿透速率,因此当水气与氧气由膜层中渗入时,可以避免水气与氧气在第一无机阻气层与第二无机阻气层中大幅度地扩散,进而增加阻气基板的产品可靠度。另外,由于阻气基板亦可更包括黏着层,因此可有效增加阻气基板与后续形成于其上的元件两者之间结合力。
上述说明仅是本发明技术方案的概述,为了能够更清楚了解本发明的技术手段,而可依照说明书的内容予以实施,并且为了让本发明的上述和其它目的、特征和优点能够更明显易懂,以下特举较佳实施例,并配合附图,详细说明如下。
附图说明
图1绘示为本发明的一实施例的一种阻气基板的剖面示意图。
图2绘示为本发明的另一实施例的一种阻气基板的剖面示意图。
图3绘示为本发明的又一实施例的一种阻气基板的剖面示意图。
图4绘示为本发明的再一实施例的一种阻气基板的剖面示意图。
100a、100b、100c、100d:阻气基板
110:可挠性基材
112:上表面
120a、120b:第一无机阻气层
130:第二无机阻气层
140:黏着层
H1、H2:厚度
具体实施方式
为更进一步阐述本发明为达成预定发明目的所采取的技术手段及功效,以下结合附图及较佳实施例,对依据本发明提出的阻气基板其具体实施方式、结构、特征及其功效,详细说明如后。
图1绘示为本发明的一实施例的一种阻气基板的剖面示意图。请参阅图1,在本实施例中,阻气基板100a包括可挠性基材110、至少第一无机阻气层120a(图1A中仅示意地绘示一层)以及至少第二无机阻气层130(图1A中仅示意地绘示一层)。
详细来说,可挠性基材110具有上表面112,其中可挠性基材110例如是塑料基材或薄化玻璃基材。第一无机阻气层120a配置于可挠性基材110上且覆盖上表面112。第二无机阻气层130配置于第一无机阻气层120a上且覆盖第一无机阻气层120a,其中第二无机阻气层130的水氧穿透速率低于第一无机阻气层120a的水氧穿透速率。较佳地,本实施例的第一无机阻气层120a的水氧穿透速率(water vapor transmission rate,WVTR)介于0.1g/m2/day至1g/m2/day之间,而第二无机阻气层130的水氧穿透速率介于0.1g/m2/day至0.01g/m2/day之间。
更具体来说,在本实施例中,第一无机阻气层120a的材质例如是氮化硅或氧化硅,且第二无机阻气层130的材质与第一无机阻气层120a的材质实值上相同。也就是说,第二无机阻气层130的材质亦例如是氮化硅或氧化硅。特别是,本实施例的第一无机阻气层120a的厚度H1实质上大于第二无机阻气层130的厚度H2,较佳地,第一无机阻气层120a的厚度H1为100纳米(nm)至500纳米(nm),而第二无机阻气层130的厚度H2为第一无机阻气层120a的厚度H1的0.1倍至0.5倍。
再者,第二无机阻气层130的致密度高于第一无机阻气层120a的致密度,也就是说,相较于具有较大厚度的第一无机阻气层120a,具有较小厚度的第二无机阻气层130的膜质较为致密(即较硬)。换言之,厚度较厚的第一无机阻气层120a的膜质较为松散(即柔软)。此外,第一无机阻气层120a的应力值小于第二无机阻气层130的应力值,较佳地,第一无机阻气层120a的应力值例如是介于-100MPa至200MPa之间,而第二无机阻气层130的应力值例如是介于-300MPa至-700MPa之间。其中,负号-代表压缩应力,正号+代表拉伸应力,此后不再叙述。
由于本实施例是将具有不同水氧穿透速率的第一无机阻气层120a与第二无机阻气层130依序配置于可挠性基材110上,因此本实例的阻气基板100a除了可具有较佳的阻隔水气与氧气的能力外,亦可具有可挠曲性。再者,由于具有较小厚度的第二无机阻气层130的致密度高于具有较大厚度的第一无机阻气层120a的致密度,因此在挠曲阻气基板100a时,除了可以避免现有习知因过厚的无机层所产生的应力集中造成脆裂的问题外,当可挠性基材110的上表面112有损坏时,直接接触可挠性基材110的上表面112的第一无机阻气层120a也因其致密度低于第二无机阻气层130而不易产生结构性的破坏。也就是说,此种第一无机阻气层120a与第二无机阻气层130的搭配设计亦可以使阻气基板100a具有较佳的结构可靠度。此外,由于第二无机阻气层130的水氧穿透速率低于第一无机阻气层120a的水氧穿透速率,因此当水气与氧气由膜层中渗入时,可以避免水气与氧气在第一无机阻气层120a与第二无机阻气层130中大幅度地扩散,进而增加阻气基板100a的产品可靠度。
图2绘示为本发明的另一实施例的一种阻气基板的剖面示意图。本实施例沿用前述实施例的元件标号与部分内容,其中采用相同的标号来表示相同或近似的元件,并且省略了相同技术内容的说明。关于省略部分的说明可参照前述实施例,本实施例不再重复叙述。请参阅图2,本实施例的阻气基板100b与图1的阻气基板100a主要的差异是在于:本实施例的阻气基板100b更包括一黏着层140,其中黏着层140配置于第二无机阻气层130上且覆盖第二无机阻气层130。此处,黏着层140的目的在于增加后续形成于阻气基板100b上的主动元件或被动元件(未绘示)与阻气基板100b的第二无机阻气层130两者之间的结合力,其中,主动元件例如是薄膜晶体管。
图3绘示为本发明的又一实施例的一种阻气基板的剖面示意图。本实施例沿用前述实施例的元件标号与部分内容,其中采用相同的标号来表示相同或近似的元件,并且省略了相同技术内容的说明。关于省略部分的说明可参照前述实施例,本实施例不再重复叙述。请参阅图3,本实施例的阻气基板100c与图1的阻气基板100a主要的差异是在于:本实施例的阻气基板100c具有多个第一无机阻气层120a、120b(图3中仅示意地绘示两个),而这些第一无机阻气层120a、120b与第二无机阻气层130交替堆叠于可挠性基材110上。如图3所示,第二无机阻气层130是位于这两个第一无机阻气层120a、120b之间。
值得一提的是,本发明并不限定第一无机阻气层120a、120b与第二无机阻气层130的层数,虽然此处所提及的第一无机阻气层120a、120b具体化为两层,而第二无机阻气层130具体化为一层。但,其它未绘示的实施例中,第一无机阻气层120a、120b与第二无机阻气层130的层数及排列方式,端视所需的阻水气及氧气的程度而定,在此并不加以限制。
图4绘示为本发明的再一实施例的一种阻气基板的剖面示意图。本实施例沿用前述实施例的元件标号与部分内容,其中采用相同的标号来表示相同或近似的元件,并且省略了相同技术内容的说明。关于省略部分的说明可参照前述实施例,本实施例不再重复叙述。请参阅图4,本实施例的阻气基板100d与图3的阻气基板100c主要的差异是在于:本实施例的阻气基板100d可更包括一黏着层140,其中黏着层140配置于第一无机阻气层120b上且覆盖第一无机阻气层120b。此处,黏着层140的目的在于增加后续形成于阻气基板100d上的主动元件或被动元件(未绘示)与阻气基板100d的第一无机阻气层120b两者之间的结合力,其中,主动元件例如是薄膜晶体管。
综上所述,由于本发明的实施例是将具有不同水氧穿透速率的第一无机阻气层与第二无机阻气层依序配置于可挠性基材上,因此本发明的实施例的阻气基板除了可具有较佳的阻隔水气与氧气的能力外,亦可具有可挠曲性。再者,由于具有较小厚度的第二无机阻气层的致密度高于具有较大厚度的第一无机阻气层的致密度,因此于挠曲阻气基板时,除了可以避免现有习知因过厚的无机层所产生的应力集中造成脆裂的问题外,当可挠性基材的上表面有损坏时,直接接触可挠性基材的上表面的第一无机阻气层也因其致密度低于第二无机阻气而不易产生结构性的破坏。也就是说,此种第一无机阻气层与第二无机阻气层的搭配设计亦可以使阻气基板具有较佳地结构可靠度。此外,由于第二无机阻气层的水氧穿透速率低于第一无机阻气层的水氧穿透速率,因此当水气与氧气由膜层中渗入时,可以避免水气与氧气在第一无机阻气层与第二无机阻气层中大幅度地扩散,进而增加阻气基板的产品可靠度。另外,由于阻气基板亦可更包括黏着层,因此可有效增加阻气基板与后续形成于其上的元件两者之间结合力。
以上所述,仅是本发明的较佳实施例而已,并非对本发明作任何形式上的限制,虽然本发明已以较佳实施例揭露如上,然而并非用以限定本发明,任何熟悉本专业的技术人员,在不脱离本发明技术方案范围内,当可利用上述揭示的技术内容作出些许更动或修饰为等同变化的等效实施例,但凡是未脱离本发明技术方案内容,依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰,均仍属于本发明技术方案的范围内。
Claims (13)
1.一种阻气基板,其特征在于包括:
可挠性基材,具有上表面;
至少第一无机阻气层,配置于该可挠性基材上,且覆盖该上表面;以及
至少第二无机阻气层,配置于该第一无机阻气层上,且覆盖该第一无机阻气层,其中该第二无机阻气层的水氧穿透速率低于该第一无机阻气层的水氧穿透速率。
2.如权利要求1所述的阻气基板,其特征在于其中所述的可挠性基材包括塑料基材或薄化玻璃基材。
3.如权利要求1所述的阻气基板,其特征在于其中所述的第一无机阻气层的材质包括氮化硅或氧化硅。
4.如权利要求3所述的阻气基板,其特征在于其中所述的第一无机阻气层的材质与该第二无机阻气层的材质相同。
5.如权利要求1所述的阻气基板,其特征在于其中所述的第一无机阻气层的厚度大于该第二无机阻气层的厚度。
6.如权利要求1所述的阻气基板,其特征在于其中所述的第二无机阻气层的致密度高于该第一无机阻气层的致密度。
7.如权利要求1所述的阻气基板,其特征在于其中所述的第一无机阻气层的应力值小于该第二无机阻气层的应力值。
8.如权利要求7所述的阻气基板,其特征在于其中所述的第一无机阻气层的应力值介于-100MPa至200MPa之间。
9.如权利要求7所述的阻气基板,其特征在于其中所述的第二无机阻气层的应力值介于-300MPa至-700MPa之间。
10.如权利要求1所述的阻气基板,其特征在于其中所述的第一无机阻气层的水氧穿透速率介于0.1g/m2/day至1g/m2/day之间。
11.如权利要求1所述的阻气基板,其特征在于其中所述的第二无机阻气层的水氧穿透速率介于0.1g/m2/day至0.01g/m2/day之间。
12.如权利要求1所述的阻气基板,其特征在于更包括:
黏着层,配置于该第二无机阻气层上,且覆盖该第二无机阻气层。
13.如权利要求1所述的阻气基板,其特征在于至少第一无机阻气层为多个第一无机阻气层,而所述第一无机阻气层与该第二无机阻气层交替堆叠于该可挠性基材上。
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106299153A (zh) * | 2016-10-10 | 2017-01-04 | 昆山工研院新型平板显示技术中心有限公司 | 一种薄膜封装方法及其结构 |
US10275062B2 (en) | 2016-10-14 | 2019-04-30 | Industrial Technology Research Institute | Flexible electronic device having barrier planarization layer including nitrogen-rich region and oxygen-rich region |
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WO2020188313A2 (en) * | 2018-07-10 | 2020-09-24 | Next Biometrics Group Asa | Thermally conductive and protective coating for electronic device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009031612A (ja) * | 2007-07-27 | 2009-02-12 | Ulvac Japan Ltd | 樹脂基板 |
US20110217533A1 (en) * | 2010-03-04 | 2011-09-08 | Fujifilm Corporation | Gas barrier film, film deposition method, and film deposition device |
US20120034451A1 (en) * | 2010-08-03 | 2012-02-09 | Samsung Mobile Display Co., Ltd. | Substrate for flexible display and method of manufacturing the substrate |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2040682A1 (en) * | 1990-04-20 | 1991-10-21 | Bruce L. Booth | Moisture sealing of optical waveguide devices with doped silicon dioxide having a silicon monoxide undercoat |
US5085904A (en) * | 1990-04-20 | 1992-02-04 | E. I. Du Pont De Nemours And Company | Barrier materials useful for packaging |
US20010038894A1 (en) * | 2000-03-14 | 2001-11-08 | Minoru Komada | Gas barrier film |
US20040052975A1 (en) * | 2002-04-18 | 2004-03-18 | Minoru Komada | Barrier film and laminated material, container for wrapping and image display medium using the same, and manufacturing method for barrier film |
US20040121146A1 (en) * | 2002-12-20 | 2004-06-24 | Xiao-Ming He | Composite barrier films and method |
US7288311B2 (en) * | 2003-02-10 | 2007-10-30 | Dai Nippon Printing Co., Ltd. | Barrier film |
CN1977404B (zh) * | 2004-02-20 | 2010-05-12 | 欧瑞康太阳Ip股份公司(特吕巴赫) | 扩散阻挡层和扩散阻挡层的制造方法 |
JP4698310B2 (ja) * | 2005-07-11 | 2011-06-08 | 富士フイルム株式会社 | ガスバリア性フィルム、基材フィルムおよび有機エレクトロルミネッセンス素子 |
KR101171192B1 (ko) | 2005-10-21 | 2012-08-06 | 삼성전자주식회사 | 박막트랜지스터 기판와 그 제조방법 |
US20110291544A1 (en) * | 2010-05-31 | 2011-12-01 | Industrial Technology Research Institute | Gas barrier substrate, package of organic electro-luminenscent device and packaging method thereof |
JP2012096432A (ja) * | 2010-11-01 | 2012-05-24 | Sony Corp | バリアフィルム及びその製造方法 |
-
2012
- 2012-07-25 TW TW101126795A patent/TWI477642B/zh active
-
2013
- 2013-03-12 CN CN201310077893.5A patent/CN103579256B/zh active Active
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009031612A (ja) * | 2007-07-27 | 2009-02-12 | Ulvac Japan Ltd | 樹脂基板 |
US20110217533A1 (en) * | 2010-03-04 | 2011-09-08 | Fujifilm Corporation | Gas barrier film, film deposition method, and film deposition device |
US20120034451A1 (en) * | 2010-08-03 | 2012-02-09 | Samsung Mobile Display Co., Ltd. | Substrate for flexible display and method of manufacturing the substrate |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106299153A (zh) * | 2016-10-10 | 2017-01-04 | 昆山工研院新型平板显示技术中心有限公司 | 一种薄膜封装方法及其结构 |
US10275062B2 (en) | 2016-10-14 | 2019-04-30 | Industrial Technology Research Institute | Flexible electronic device having barrier planarization layer including nitrogen-rich region and oxygen-rich region |
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