WO2019037502A1 - 显示器件 - Google Patents

显示器件 Download PDF

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Publication number
WO2019037502A1
WO2019037502A1 PCT/CN2018/089145 CN2018089145W WO2019037502A1 WO 2019037502 A1 WO2019037502 A1 WO 2019037502A1 CN 2018089145 W CN2018089145 W CN 2018089145W WO 2019037502 A1 WO2019037502 A1 WO 2019037502A1
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WO
WIPO (PCT)
Prior art keywords
substrate
groove
crack
display device
encapsulant
Prior art date
Application number
PCT/CN2018/089145
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English (en)
French (fr)
Inventor
李发顺
白雪飞
尚跃东
Original Assignee
京东方科技集团股份有限公司
鄂尔多斯市源盛光电有限责任公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 鄂尔多斯市源盛光电有限责任公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/334,244 priority Critical patent/US10985342B2/en
Publication of WO2019037502A1 publication Critical patent/WO2019037502A1/zh

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10Substrates, e.g. flexible substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/562Protection against mechanical damage
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0217Mechanical details of casings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30Devices specially adapted for multicolour light emission
    • H10K59/38Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8722Peripheral sealing arrangements, e.g. adhesives, sealants
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells

Definitions

  • the present disclosure relates to the field of display device technologies, and in particular to a display device.
  • the crack when the edge is damaged by the bump, the crack will extend to the inside of the display device, and when it extends to the package, the package is easily damaged, thereby affecting the packaging effect of the display device and affecting the use of the display device. .
  • a display device includes: a first substrate, the first substrate is provided with a first relief groove; and the second substrate is provided with a second crack preventing groove; An encapsulant, wherein the encapsulant is sandwiched between the first substrate and the second substrate to seal the first substrate and the second substrate.
  • the encapsulant is disposed at an outer edge of the first substrate and the second substrate.
  • the first crack preventing groove is located between the encapsulant and an outer edge of the first substrate.
  • the second crack preventing groove is located between the encapsulant and an outer edge of the second substrate.
  • the first crack preventing groove includes a first inner crack stop groove disposed on an inner surface of the first substrate facing the second substrate, and a first outer crack stop groove disposed on an outer surface of the first substrate away from the second substrate.
  • the second crack preventing groove includes a second inner crack preventing groove disposed on an inner surface of the second substrate facing the first substrate and disposed on the second substrate away from the first a second outer crack stop on the outer surface of the substrate.
  • a size of a cross section of the first inner crack stop groove is determined by an inner surface of the first substrate
  • the outer surface toward the first substrate is gradually reduced, and the size of the cross section of the first outer crack stop is gradually increased from the outer surface of the first substrate toward the inner surface of the first substrate.
  • a size of a cross section of the second inner crack stop is gradually reduced from an inner surface of the second substrate toward an outer surface of the second substrate
  • a size of a cross section of the second outer crack stop is gradually increased from an outer surface of the second substrate toward an inner surface of the second substrate.
  • the first inner crack stop groove and the first outer crack stop groove have a plane perpendicular to an extended surface of the first substrate Trapezoidal cross section. Further, in a plane perpendicular to an extended surface of the second substrate, the second inner crack stop groove and the first outer crack stop groove have a trapezoidal cross section.
  • the first inner crack stop groove and the first outer crack stop groove are spaced apart in a thickness direction of the first substrate.
  • the second inner crack stop groove and the second outer crack stop groove are spaced apart in the thickness direction of the second substrate.
  • the first inner crack stop groove is disposed closer to an outer edge of the first substrate than the first outer crack stop groove
  • the second inner relief groove is disposed closer to the outer edge of the second substrate than the second outer relief groove.
  • the encapsulant extends along a perimeter of the second substrate and the first substrate, the first crack stop along the The periphery of the first substrate extends, and the second crack preventing groove extends along the circumference of the second substrate.
  • the first crack preventing groove is disposed adjacent to a center position between the encapsulant and an outer edge of the first substrate. Further, similarly, the second crack preventing groove is disposed adjacent to a center position between the encapsulant and an outer edge of the second substrate.
  • the first substrate includes a color filter substrate
  • the second substrate includes a thin film transistor substrate.
  • the display device includes an Active Matrix Organic Light Emitting Diode (AMOLED) panel.
  • AMOLED Active Matrix Organic Light Emitting Diode
  • FIG. 1 shows a schematic structural view of a display device according to an embodiment of the present disclosure.
  • FIG. 2 shows a partial structural schematic view of a display device in accordance with an embodiment of the present disclosure.
  • FIG. 3 illustrates a partial structural schematic view of a display device in accordance with another embodiment of the present disclosure.
  • FIG. 4 shows a partial structural schematic view of a display device in accordance with still another embodiment of the present disclosure.
  • the display device 1 the first substrate 100, the first crack stop groove 110, the first inner portion.
  • the display device 1 includes a first substrate 100, a second substrate 200, and an encapsulant 300.
  • the first substrate 100 is provided with a first crack preventing groove 110.
  • the second substrate 200 is provided with a second crack preventing groove 210.
  • the encapsulant 300 is sandwiched between the first substrate 100 and the second substrate 200 to seal the first substrate 100 and the second substrate 200.
  • the encapsulant 300 is disposed at an interval from the outer edges of the first substrate 100 and the second substrate 200, wherein the first crack preventing groove 110 is located between the outer edge of the encapsulant 300 and the first substrate 200, and the second crack preventing groove 210 Located between the encapsulant 300 and the outer edge of the second substrate 200.
  • the display device 1 when the outer edge of the first substrate 100 and/or the second substrate 200 is bumped by an external force at a certain position, for example, as shown in FIG. 2, the display device 1 will be subjected to The role of this external force F.
  • the display device 1 can be subjected to an external force from other directions in addition to the external force F shown in FIG. 2, and the present disclosure is not limited in this respect.
  • the display device 1 Under the action of the external force F, the display device 1 will generate cracks, and such cracks may extend inward along the outer edges of the first substrate 100 and/or the second substrate 200.
  • the crack preventing groove 110 and the second crack preventing groove 210 when the crack extends to the first crack preventing groove 110 and/or the second When the groove 210 is stopped, the crack will stop continuing to extend inward due to the blockage.
  • the crack can be blocked by the first crack preventing groove 110 and the second crack preventing groove 210, thereby minimizing the influence of the rubbing on the sealing effect of the display device 1.
  • the encapsulation and/or sealing performance of the display device 1 is ensured, and damage of the sealing performance of the display device 1 by cracks due to bumping is avoided, thereby improving the sealing reliability of the display device 1.
  • the encapsulant 300 has a glass fragile property, cracks generated at the outer edges of the first substrate 100 and/or the second substrate 200 will easily cause damage to the encapsulant 300.
  • the package sandwiched between the first substrate 100 and the second substrate 200 can also be disposed by providing the first crack preventing groove 110 and the second crack preventing groove 210 and thereby blocking the crack inwardly extending.
  • the glue 300 provides protection. Thereby, problems such as cracking of the encapsulant 300 due to the crack extending to the encapsulant 300 are avoided, thereby ensuring the sealing reliability of the encapsulant 300 and improving the reliability and stability of the use of the encapsulant 300.
  • the first crack preventing groove 110 and the second crack preventing groove 210 to reduce the damage of the display device 1 by the rubbing, it is also possible to reduce the defective rate of the display device 1. Thereby, the production quality of the display device 1 can be improved, and the production cost of the display device 1 can be lowered, thereby improving the production efficiency of the display device 1.
  • first crack preventing groove 110 and the second crack preventing groove 210 to reduce the damage of the display device 1 by the bump, it is also possible to avoid damage to the display device 1 due to the bump during transportation. In such a case, the transportation of the display device 1 and the reduction in transportation cost are facilitated, so that the transportation efficiency of the display device 1 can be improved.
  • the display device 1 contributes to reduction of damage due to bumping, and has advantages such as high reliability.
  • the display device 1 according to a specific embodiment of the present disclosure will be continuously described below with reference to the drawings.
  • the display device 1 includes a first substrate 100, a second substrate 200, and an encapsulant 300.
  • the first crack preventing groove 110 includes a first inner crack preventing groove 111 provided on an inner surface of the first substrate 100 and a first surface provided on an outer surface of the first substrate 100 The outer crack stop 112.
  • the second crack preventing groove 210 includes a second inner crack preventing groove 211 provided on the inner surface of the second substrate 200 and a second outer crack preventing groove 212 provided on the outer surface of the second substrate 200.
  • the first crack preventing groove 110 that is, the first inner crack preventing groove 111 and the first outer crack preventing groove 112 can respectively block cracks generated on the inner surface and the outer surface of the first substrate 100. .
  • the second crack preventing groove 210 that is, the second inner crack preventing groove 211 and the second outer crack preventing groove 212, can respectively block cracks generated on the inner and outer surfaces of the second substrate 200. Thereby, cracks from various directions can be blocked at any position on the outer edge of the entire display device 1, so that the display device 1 does not suffer from cracking of the package due to an external force in any direction.
  • the size of the cross section of the first inner crack stop groove 111 (for example, the width)
  • the inner surface of the first substrate 100 is gradually reduced toward the outer surface, and the size (width) of the cross section of the first outer crack stop groove 112 is gradually increased from the outer surface toward the inner surface of the first substrate 100.
  • the size (e.g., width) of the cross section of the second inner crack preventing groove 211 is The inner surface of the second substrate 200 is gradually reduced toward the outer surface, and the size (for example, the width) of the cross section of the second outer crack preventing groove 212 is gradually increased from the outer surface toward the inner surface of the second substrate 200.
  • the first inner crack preventing groove 111 and the first outer crack preventing groove 112 have a trapezoidal shape Cross section.
  • the second inner crack stop groove 211 and the first outer crack stop groove 212 also have a trapezoidal cross section.
  • the first inner crack stop groove 111 and the first outer crack stop groove 112 are spaced apart in the thickness direction of the first substrate 100, and the second inner crack stop groove 211 and the first The two outer crack preventing grooves 212 are spaced apart in the thickness direction of the second substrate 200.
  • the first inner crack stop groove 111 and the first outer crack stop groove 112 can be prevented from overlapping in the thickness direction of the first substrate 100, thereby preventing the local strength of the first substrate 100 from being too small, and the first substrate 100 is advantageously improved.
  • Strength and stiffness are spaced apart in the thickness direction of the second substrate 200, that is, do not overlap. In this manner, the local strength of the second substrate 200 is likewise prevented from being too small, and it is advantageous to increase the strength and rigidity of the second substrate 200.
  • the first inner crack stop groove 111 is disposed closer to the outer edge of the first substrate 100 than the first outer crack stop groove 112, and the second inner crack stop groove 211 is set to be larger than The second outer crack stop groove 212 is closer to the outer edge of the second substrate 200. Since the outer surfaces of the first substrate 100 and the second substrate 200 are more likely to be bumped to generate cracks, the first outer cracking groove 112 and the second outer crack preventing groove 212 can be more effectively blocked by the above manner. Cracks on the outer surfaces of the substrate 100 and the second substrate 200.
  • the first outer crack stop groove 112 is disposed closer to the outer edge of the first substrate 100 than the first inner crack stop groove 111, and the second outer crack stop groove 212 is disposed to be more than the second inner crack stop groove 211 Near the outer edge of the second substrate 200.
  • the strength and rigidity of the first substrate 100 and the second substrate 200 can be ensured.
  • the encapsulant 300 extends along the circumference of the second substrate 200 and the first substrate 100
  • the first crack preventing groove 110 extends along the circumference of the first substrate 100
  • the second crack preventing groove 210 is along the first
  • the two substrates 200 extend in the circumferential direction. In this way, cracks can be blocked in all directions around the first substrate 100 and the second substrate 200, thereby providing better protection for the encapsulant 300.
  • the second crack-removing groove 210 is disposed adjacent to a center position between the outer edge of the encapsulant 300 and the second substrate 200
  • the first crack-removing groove 110 is disposed adjacent to the encapsulant 300 and The center position between the outer edges of the first substrate 100.
  • the crack stop groove not only can be too close to the edge, but also the crack stop groove can be prevented from being too close to the sealant 300.
  • the phenomenon that the crack passes over the crack stop groove and directly protrudes into the inside of the substrate due to the large external force is avoided.
  • it also helps to ensure the sealing effect of the encapsulant 300.
  • the blocking effect of the second crack preventing groove 210 and the first crack preventing groove 110 is improved, and the blocking reliability of the second crack preventing groove 210 and the first crack preventing groove 110 is ensured.
  • the first substrate 100 includes a color filter substrate
  • the second substrate 200 includes a thin film transistor substrate.
  • the structure of the crack arresting groove can be applied to a structure requiring a double-layer glass package such as an LED, thereby contributing to improvement in production quality and reliability of use.
  • display device 1 comprises an active matrix organic light emitting diode panel.
  • display device 1 comprises an active matrix organic light emitting diode panel.
  • first crack preventing groove 110 and the second crack preventing groove 210 may be formed by etching.
  • the display device 1 may also include any other suitable composition structure according to an embodiment of the present disclosure, which should be easily conceived by those skilled in the art, and the present disclosure will not be described in detail herein.
  • the terms “mounted,” “connected,” and “connected” are to be interpreted broadly unless otherwise specifically defined and defined. For example, it can be a fixed connection, a detachable connection, or an integral connection. Alternatively, it may be a mechanical connection or an electrical connection. Further alternatively, it may be directly connected, or may be indirectly connected through an intermediate medium, or may be internal to the two elements.
  • the specific meanings of the above terms in the present disclosure can be understood by those skilled in the art on a case-by-case basis.

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Abstract

一种显示器件(1),包括:第一基板(100),第一基板(100)上设有第一止裂槽(110);第二基板(200),第二基板(200)上设有第二止裂槽(210);以及封装胶(300),其中,封装胶(300)夹在第一基板(100)和第二基板(200)之间以对第一基板(100)和第二基板(200)进行密封。进一步地,封装胶(300)与第一基板(100)和第二基板(200)的外边沿间隔设置。第一止裂槽(110)位于封装胶(300)和第一基板(100)的外边沿之间,并且第二止裂槽(210)位于封装胶(300)和第二基板(200)的外边沿之间。

Description

显示器件
对相关申请的交叉引用
本申请要求2017年8月25日提交的中国专利申请号201710744739.7的优先权,该中国专利申请以其整体通过引用并入本文。
技术领域
本公开涉及显示器件技术领域,具体而言,涉及一种显示器件。
背景技术
相关技术中的显示器件,其边缘受到磕碰损伤时损伤裂纹会向显示器件的内部延伸,当其延伸到封装胶时,封装胶容易受到损伤,从而影响显示器件的封装效果,影响显示器件的使用。
发明内容
根据本公开的实施例,提供了一种显示器件。具体地,所述显示器件包括:第一基板,所述第一基板上设有第一止裂槽(relief groove);第二基板,所述第二基板上设有第二止裂槽;以及封装胶,其中,所述封装胶夹在所述第一基板和所述第二基板之间以对所述第一基板和所述第二基板进行密封。所述封装胶与所述第一基板和所述第二基板的外边沿(outer edge)间隔设置。所述第一止裂槽位于所述封装胶和所述第一基板的外边沿之间。所述第二止裂槽位于所述封装胶和所述第二基板的外边沿之间。
根据具体实现方案,在本公开的实施例提供的显示器件中,所述第一止裂槽包括设置在所述第一基板面向所述第二基板的内表面上的第一内止裂槽和设置在所述第一基板远离所述第二基板的外表面上的第一外止裂槽。此外,类似地,所述第二止裂槽包括设置在所述第二基板面向所述第一基板的内表面上的第二内止裂槽和设置在所述第二基板远离所述第一基板的外表面上的第二外止裂槽。
根据具体实现方案,在本公开的实施例提供的显示器件中,在所述第一基板的延伸面中,所述第一内止裂槽的横截面的尺寸由所述第 一基板的内表面朝向所述第一基板的外表面逐渐减小,并且所述第一外止裂槽的横截面的尺寸由所述第一基板的外表面朝向所述第一基板的内表面逐渐增大。此外,类似地,在所述第二基板的延伸面中,所述第二内止裂槽的横截面的尺寸由所述第二基板的内表面朝向所述第二基板的外表面逐渐减小,并且所述第二外止裂槽的横截面的尺寸由所述第二基板的外表面朝向所述第二基板的内表面逐渐增大。
根据具体实现方案,在本公开的实施例提供的显示器件中,在垂直于所述第一基板的延伸面的平面中,所述第一内止裂槽和所述第一外止裂槽具有梯形横截面。进一步地,在垂直于所述第二基板的延伸面的平面中,所述第二内止裂槽和所述第一外止裂槽具有梯形横截面。
根据具体实现方案,在本公开的实施例提供的显示器件中,所述第一内止裂槽和所述第一外止裂槽在所述第一基板的厚度方向上间隔开。与此类似,所述第二内止裂槽和所述第二外止裂槽在所述第二基板的厚度方向上间隔开。
根据具体实现方案,在本公开的实施例提供的显示器件中,所述第一内止裂槽设置为比所述第一外止裂槽更靠近所述第一基板的外边沿,并且所述第二内止裂槽设置为比所述第二外止裂槽更靠近所述第二基板的外边沿。
根据具体实现方案,在本公开的实施例提供的显示器件中,所述封装胶沿所述第二基板和所述第一基板的四周(perimeter)延伸,所述第一止裂槽沿所述第一基板的四周延伸,并且所述第二止裂槽沿所述第二基板的四周延伸。
根据具体实现方案,在本公开的实施例提供的显示器件中,所述第一止裂槽设置为邻近所述封装胶与所述第一基板的外边沿之间的中心位置。进一步地,与此类似,所述第二止裂槽设置为邻近所述封装胶与所述第二基板的外边沿之间的中心位置。
根据具体实现方案,在本公开的实施例提供的显示器件中,所述第一基板包括彩膜基板,并且所述第二基板包括薄膜晶体管基板。
根据具体实现方案,在本公开的实施例提供的显示器件中,所述显示器件包括有源矩阵有机发光二极体(Active Matrix Organic Light Emitting Diode,AMOLED)面板。
附图说明
本公开的各种方面和/或优点将从结合以下附图对实施例的详细描述中变得更加明显和容易理解,其中:
图1示出了根据本公开的一个实施例的显示器件的结构示意图。
图2示出了根据本公开的一个实施例的显示器件的局部结构示意图。
图3示出了根据本公开的另一个实施例的显示器件的局部结构示意图。
图4示出了根据本公开的又一个实施例的显示器件的局部结构示意图。
具体实施方式
下面详细地描述本公开的实施例。所述实施例的示例在附图中示出,其中,自始至终利用相同或类似的标号表示相同或类似的元件或者具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的,并且仅用于解释本公开,而不能理解为对本公开的限制。
在接下来的详细描述中,分别使用以下附图标记来指代在本公开的实施例中提及的各种组件:显示器件1,第一基板100,第一止裂槽110,第一内止裂槽111,第一外止裂槽112,第二基板200,第二止裂槽210,第二内止裂槽211,第二外止裂槽212,封装胶300,以及外力F。
下面将参考附图详细地描述根据本公开的实施例的显示器件。
如图1-图4所示,根据本公开的实施例的显示器件1包括第一基板100、第二基板200和封装胶300。
具体地,第一基板100上设有第一止裂槽110。第二基板200上设有第二止裂槽210。封装胶300夹在第一基板100和第二基板200之间以对第一基板100和第二基板200进行密封。封装胶300与第一基板100和第二基板200的外边沿间隔地设置,其中,第一止裂槽110位于封装胶300和第一基板200的外边沿之间,并且第二止裂槽210位于封装胶300和第二基板200的外边沿之间。
根据本公开的实施例,在显示器件1中,当第一基板100和/或第二基板200的外边沿在某一处受到外力磕碰时,例如,如图2所示, 显示器件1将受到该外力F的作用。当然,需要指出的是,除了在图2中示出的外力F之外,显示器件1也可以受到来自其他方向的外力作用,并且本公开在这一方面不受限制。在外力F的作用下,显示器件1将产生裂纹,并且这样的裂纹会沿着第一基板100和/或第二基板200的外边沿向内延伸。与相关技术中的显示器件相比,在本公开的实施例中,通过设置第一止裂槽110和第二止裂槽210,使得当裂纹延伸到第一止裂槽110和/或第二止裂槽210时,裂纹将会因为受到阻挡而停止继续向内延伸。这样,能够利用第一止裂槽110和第二止裂槽210对裂纹进行阻挡,从而最大限度地减小磕碰对显示器件1的封装效果的影响。由此,保证了显示器件1的封装和/或密封性能,并且避免了由于磕碰而产生的裂纹对显示器件1的密封性能的损坏,从而提高显示器件1的密封可靠性。
进一步地,由于封装胶300具有玻璃易碎特质,所以在第一基板100和/或第二基板200的外边沿产生的裂纹将容易使封装胶300发生损伤。在本公开的实施例中,通过设置第一止裂槽110和第二止裂槽210并且由此阻挡裂纹向内延伸,还能够对夹在第一基板100和第二基板200之间的封装胶300提供保护。由此,避免了由于裂纹延伸至封装胶300而导致的封装胶300产生裂纹等问题,从而保证了封装胶300的密封可靠性,并且提高了封装胶300的使用可靠性和稳定性。
进一步地,通过设置第一止裂槽110和第二止裂槽210以减小磕碰对显示器件1的损坏,还能够降低显示器件1的次品率。由此,可以提高显示器件1的生产质量,并且降低显示器件1的生产成本,从而提高显示器件1的生产效率。
此外,通过设置第一止裂槽110和第二止裂槽210以减小磕碰对显示器件1的损坏,还能够避免在运输过程中由于磕碰对显示器件1造成的损坏。在这样的情况下,有利于显示器件1的运输以及运输成本的降低,从而可以提高显示器件1的运输效率。
因此,根据本公开的实施例,显示器件1有助于减少由于磕碰所致的损伤,并且具有可靠性高等优点。
下面将参考附图继续描述根据本公开的具体实施例的显示器件1。
在本公开的一些具体实施例中,例如,如图1-图4所示,显示器件1包括第一基板100、第二基板200和封装胶300。
具体地,如图3和图4所示,第一止裂槽110包括设在第一基板100的内表面上的第一内止裂槽111和设在第一基板100的外表面的第一外止裂槽112。与此类似,第二止裂槽210包括设在第二基板200的内表面上的第二内止裂槽211和设在第二基板200的外表面的第二外止裂槽212。在这样的情况下,第一止裂槽110,即,第一内止裂槽111和第一外止裂槽112,能够分别对第一基板100的内表面和外表面上产生的裂纹进行阻挡。同样地,第二止裂槽210,即,第二内止裂槽211和第二外止裂槽212,能够分别对第二基板200的内表面和外表面上产生的裂纹进行阻挡。由此,可以在整个显示器件1的外边沿上的任何位置处对来自各个方向的裂纹进行阻挡,使得显示器件1不会由于承受任何方向上的外力而发生封装开裂的现象。
更为具体地,如图4所示,在第一基板100的延伸面中,即,在图中与纸面垂直的平面中,第一内止裂槽111的横截面的大小(例如,宽度)由第一基板100的内表面向外表面逐渐减小,并且第一外止裂槽112的横截面的大小(宽度)由第一基板100的外表面向内表面逐渐增大。与此类似,如图4所示,在第二基板200的延伸面(即,图中与纸面垂直的平面)中,第二内止裂槽211的横截面的大小(例如,宽度)由第二基板200的内表面向外表面逐渐减小,并且第二外止裂槽212的横截面的大小(例如,宽度)由第二基板200的外表面向内表面逐渐增大。这样,不仅能够保证第一止裂槽110和第二止裂槽210对裂纹的阻挡效果,而且还能够避免由于止断槽而造成第一基板100和第二基板200的外表面的凹凸不平。由此,在有效地防止裂纹延伸的同时,还可以尽可能地保证显示器件1的表面平坦性,从而提高了第一基板100和第二基板200的外观美观性。
进一步地,如图4所示,在垂直于第一基板100的延伸面的平面中,即,在图中的纸面中,第一内止裂槽111和第一外止裂槽112具有梯形横截面。与此类似,在垂直于第二基板200的延伸面的平面中,即,在图中的纸面中,第二内止裂槽211和第一外止裂槽212也具有梯形横截面。这样,在保证阻挡效果的同时,还可以使第一外止裂槽112和第二外止裂槽212的外露侧具有较小的开口,从而进一步降低了对外形美观性的影响。
可选地,如图3和图4所示,第一内止裂槽111和第一外止裂槽 112在第一基板100的厚度方向上间隔开,并且第二内止裂槽211和第二外止裂槽212在第二基板200的厚度方向上间隔开。这样,可以避免第一内止裂槽111和第一外止裂槽112在第一基板100的厚度方向上重合,从而防止第一基板100的局部强度过小,并且有利于提高第一基板100的强度和刚度。同时,第二内止裂槽211和第二外止裂槽212在第二基板200的厚度方向上间隔开,即,不重合。以这样的方式,同样地防止了第二基板200的局部强度过小,并且有利于提高第二基板200的强度和刚度。
进一步地,如图3和图4所示,第一内止裂槽111设置为比第一外止裂槽112更靠近第一基板100的外边沿,并且第二内止裂槽211设置为比第二外止裂槽212更靠近第二基板200的外边沿。由于第一基板100和第二基板200的外表面更容易发生磕碰从而产生裂纹,所以通过以上方式,可以借助于第一外止裂槽112和第二外止裂槽212更加有效地阻挡第一基板100和第二基板200的外表面上的裂纹。
可选地,第一外止裂槽112设置为比第一内止裂槽111更靠近第一基板100的外边沿,并且第二外止裂槽212设置为比第二内止裂槽211更靠近第二基板200的外边沿。这样,在保证第一基板100和第二基板200的止裂效果的同时,还能够保证第一基板100和第二基板200的强度和刚度。
具体地,如图1所示,封装胶300沿第二基板200和第一基板100的四周延伸,第一止裂槽110沿第一基板100的四周延伸,并且第二止裂槽210沿第二基板200的周向延伸。这样,能够在第一基板100和第二基板200的四周全方位地阻挡裂纹,从而更好地为封装胶300提供保护。
可选地,如图1所示,第二止裂槽210设置为邻近封装胶300与第二基板200的外边沿之间的中心位置,并且第一止裂槽110设置为邻近封装胶300与第一基板100的外边沿之间的中心位置。这样,不仅可以避免止裂槽距离边沿过近,而且还可以避免止裂槽距离封装胶300过近。由此,避免了由于承受较大外力而导致的裂纹越过止裂槽并且直接伸入基板内部的现象。同时,还有助于保证封装胶300的密封效果。进一步地,提高了第二止裂槽210和第一止裂槽110的阻挡效果,并且保证了第二止裂槽210和第一止裂槽110的阻挡可靠性。
具体地,第一基板100包括彩膜基板(color filter substrate),并且第二基板200包括薄膜晶体管基板(thin film transistor substrate)。这样,可以将止裂槽的结构应用于LED等需要双层玻璃封装的结构中,从而有助于提高其生产质量和使用可靠性。
可选地,显示器件1包括有源矩阵有机发光二极体面板。这样,能够提高AMOLED面板抗磕碰损伤的能力,从而有助于降低AMOLED面板的生产成本。
具体而言,第一止裂槽110和第二止裂槽210可以通过刻蚀的方法形成。
根据本公开的实施例,显示器件1还可以包括任何其它合适的组成结构,这应当是本领域普通技术人员容易设想到的,并且本公开在此不再详细描述。
需要理解的是,在本公开的描述中,由术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”、“顺时针”、“逆时针”、“轴向”、“径向”等指示的方位或位置关系均为基于附图所示的方位或位置关系。这样的目的仅是为了便于描述本公开并且使描述简化,而不是指示或暗示所指的装置或元件必须具有特定的方位或者以特定的方位构造和操作。因此,这样的表述不能理解为对本公开的限制。此外,由“第一”、“第二”等限定的特征可以明示或者隐含地包括一个或者更多个这样的特征。在本公开的描述中,除非另有说明,否则“多个”的含义是两个或两个以上。
还需要说明的是,在本公开的描述中,除非另有明确的规定和限定,否则术语“安装”、“相连”、“连接”应做广义理解。例如,它可以是固定连接,也可以是可拆卸连接,或一体式连接。可替换地,它可以是机械连接,也可以是电连接。进一步可替换地,它可以是直接相连,也可以是通过中间媒介的间接相连,或者是两个元件内部的连通。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本公开中的具体含义。
在本说明书的描述中,参考术语“一个实施例”、“一些实施例”、“示意性实施例”、“示例”、“具体示例”、或“一些示例”等意 指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本公开的至少一个实施例或示例中。在本说明书中,对上述术语的示意性表述不一定指的是相同的实施例或示例。而且,描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
尽管已经示出和描述了本公开的实施例,但是本领域的普通技术人员可以理解到,在不脱离本公开的原理和宗旨的情况下,可以对这些实施例进行多种变化、修改、替换和变型,并且本公开的范围仅由权利要求及其等同物限定。

Claims (10)

  1. 一种显示器件,包括:
    第一基板,所述第一基板上设有第一止裂槽(relief groove);
    第二基板,所述第二基板上设有第二止裂槽;以及
    封装胶,所述封装胶夹在所述第一基板和所述第二基板之间以对所述第一基板和所述第二基板进行密封,其中
    所述封装胶与所述第一基板和所述第二基板的外边沿(outer edge)间隔设置,
    所述第一止裂槽位于所述封装胶和所述第一基板的外边沿之间,并且
    所述第二止裂槽位于所述封装胶和所述第二基板的外边沿之间。
  2. 根据权利要求1所述的显示器件,其中
    所述第一止裂槽包括设置在所述第一基板面向所述第二基板的内表面上的第一内止裂槽和设置在所述第一基板远离所述第二基板的外表面上的第一外止裂槽,以及
    所述第二止裂槽包括设置在所述第二基板面向所述第一基板的内表面上的第二内止裂槽和设置在所述第二基板远离所述第一基板的外表面上的第二外止裂槽。
  3. 根据权利要求2所述的显示器件,其中
    在所述第一基板的延伸面中,所述第一内止裂槽的横截面的尺寸由所述第一基板的内表面朝向所述第一基板的外表面逐渐减小,并且所述第一外止裂槽的横截面的尺寸由所述第一基板的外表面朝向所述第一基板的内表面逐渐增大,以及
    在所述第二基板的延伸面中,所述第二内止裂槽的横截面的尺寸由所述第二基板的内表面朝向所述第二基板的外表面逐渐减小,并且所述第二外止裂槽的横截面的尺寸由所述第二基板的外表面朝向所述第二基板的内表面逐渐增大。
  4. 根据权利要求3所述的显示器件,其中
    在垂直于所述第一基板的延伸面的平面中,所述第一内止裂槽和所述第一外止裂槽具有梯形横截面,并且
    在垂直于所述第二基板的延伸面的平面中,所述第二内止裂槽和 所述第一外止裂槽具有梯形横截面。
  5. 根据权利要求2所述的显示器件,其中
    所述第一内止裂槽和所述第一外止裂槽在所述第一基板的厚度方向上间隔开,并且
    所述第二内止裂槽和所述第二外止裂槽在所述第二基板的厚度方向上间隔开。
  6. 根据权利要求5所述的显示器件,其中
    所述第一内止裂槽设置为比所述第一外止裂槽更靠近所述第一基板的外边沿,并且
    所述第二内止裂槽设置为比所述第二外止裂槽更靠近所述第二基板的外边沿。
  7. 根据权利要求1所述的显示器件,其中
    所述封装胶沿所述第二基板和所述第一基板的四周(perimeter)延伸,
    所述第一止裂槽沿所述第一基板的四周延伸,并且
    所述第二止裂槽沿所述第二基板的四周延伸。
  8. 根据权利要求1所述的显示器件,其中
    所述第一止裂槽设置为邻近所述封装胶与所述第一基板的外边沿之间的中心位置,并且
    所述第二止裂槽设置为邻近所述封装胶与所述第二基板的外边沿之间的中心位置。
  9. 根据权利要求1所述的显示器件,其中
    所述第一基板包括彩膜基板,并且
    所述第二基板包括薄膜晶体管基板。
  10. 根据权利要求1所述的显示器件,其中
    所述显示器件包括有源矩阵有机发光二极体(Active Matrix Organic Light Emitting Diode,AMOLED)面板。
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