WO2019024591A1 - 一种丝网网版、封装方法、显示面板和显示装置 - Google Patents

一种丝网网版、封装方法、显示面板和显示装置 Download PDF

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Publication number
WO2019024591A1
WO2019024591A1 PCT/CN2018/089217 CN2018089217W WO2019024591A1 WO 2019024591 A1 WO2019024591 A1 WO 2019024591A1 CN 2018089217 W CN2018089217 W CN 2018089217W WO 2019024591 A1 WO2019024591 A1 WO 2019024591A1
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WO
WIPO (PCT)
Prior art keywords
screen
line
occlusion
substrate
display panel
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PCT/CN2018/089217
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English (en)
French (fr)
Inventor
白雪飞
Original Assignee
京东方科技集团股份有限公司
鄂尔多斯市源盛光电有限责任公司
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Application filed by 京东方科技集团股份有限公司, 鄂尔多斯市源盛光电有限责任公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/335,905 priority Critical patent/US10749145B2/en
Priority to EP18841622.6A priority patent/EP3664176B1/en
Publication of WO2019024591A1 publication Critical patent/WO2019024591A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/34—Screens, Frames; Holders therefor
    • B41F15/36—Screens, Frames; Holders therefor flat
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00

Definitions

  • the present disclosure relates to the field of display technologies, and in particular, to a screen screen, a packaging method, a display panel, and a display device.
  • a display device such as a TFT-LCD (Thin Film Transistor-Liquid Crystal Display) or an OLED (Organic Light Emitting Diode) display device, generally includes an upper substrate and a lower substrate, an upper substrate, and The lower substrate is bonded by the encapsulant in the package area.
  • the encapsulant is generally formed on the upper substrate or the lower substrate by screen screen printing, and the upper substrate and the lower substrate are correspondingly bonded to be bonded together.
  • the display device has high requirements on the packaging effect, especially the OLED display device.
  • the organic layer which is extremely sensitive to water vapor and oxygen exists in the OLED display device, and if the package effect is not required, the life of the OLED display device is lowered. However, after using the current screen screen printing, the desired effect cannot be achieved.
  • the present disclosure provides a screen screen, a packaging method, a display panel, and a display device.
  • the present disclosure provides a screen screen comprising a frame, a screen fixed to the frame, and a shielding film disposed on the screen, the screen being not obscured by the shielding film a portion forming a printing area, wherein the printing area is provided with at least one occlusion line, the at least one occlusion line being disposed along an edge of the occlusion film, the occlusion line having a width greater than a grid line of the screen width.
  • the printing area is an annular structure surrounding the shielding film
  • the shielding line is a closed annular structure surrounding the shielding film.
  • a shielding line of a closed annular structure is disposed in the printing area.
  • the number of the line segments of the occlusion line is two, and the two line segments are respectively located in corresponding printing areas on the left and right sides of the occlusion film; or the number of line segments of the occlusion line is four.
  • Each line segment is along a corresponding printed area of the edge of the mask film.
  • the distance between the occlusion line and the corresponding edge of the frame is the same as the distance between the edge corresponding to the occlusion film.
  • the present disclosure also provides a packaging method, including:
  • the screen screen is the above screen screen
  • a screen mesh coated with an encapsulant is brought into contact with a first substrate to be printed, and the encapsulant is printed onto the first substrate.
  • the packaging method further includes:
  • the encapsulant is cured to form an encapsulation layer.
  • the formed encapsulation layer comprises a plurality of spaced-apart retaining walls, and the adjacent retaining walls are strip-shaped grooves.
  • the strip grooves are formed by occlusion lines in the printed area.
  • the present disclosure further provides a display panel packaged by the above method, the display panel comprising:
  • the encapsulation layer being an annular structure disposed around a display area of the display substrate, the encapsulation layer including along At least two spaced-apart retaining walls are disposed at the edges of the display area, and adjacent retaining walls are formed as strip-shaped grooves.
  • the strip grooves are formed by occlusion lines in the printed area.
  • the encapsulation layer comprises two spaced-apart retaining walls, and the two spaced-apart retaining walls form two closed annular structures.
  • the inside of the strip groove is a vacuum.
  • the strip groove is filled with a water absorbing getter material.
  • the present disclosure also provides a display device including the above display panel.
  • FIG. 1 is a schematic structural view of a screen screen according to some embodiments of the present disclosure.
  • FIG. 2 is a schematic structural view of a screen screen according to other embodiments of the present disclosure.
  • FIG. 3 is a schematic flow chart of a packaging method according to some embodiments of the present disclosure.
  • FIG. 4 is a schematic structural view of a screen screen in the related art
  • FIG. 5 is a schematic view showing the appearance of an encapsulant formed by printing a package adhesive using the screen screen of FIG. 4;
  • FIG. 6 is a schematic diagram showing the appearance of an encapsulant formed by printing a package adhesive using a screen screen in the embodiment of the present disclosure.
  • some embodiments of the present disclosure provide a screen screen comprising a frame 10 , a screen 20 fixed on the frame 10 , and a shielding film 30 disposed on the screen 20 , A portion of the screen 20 that is not blocked by the shielding film 30 forms a printing area in which an occlusion line 40 is disposed, the occlusion line 40 being disposed along an edge of the occlusion film 30, the occlusion line 40 The width is greater than the width of the grid lines of the screen 20.
  • the printing area is an annular structure surrounding the shielding film 30, and the shielding line 40 is a closed annular structure surrounding the shielding film 30.
  • a cloaking line 40 having a closed annular structure is disposed in the printing area.
  • two or more rings may be closed in the printing area.
  • the occlusion line 40 may not be a closed annular structure.
  • the occlusion line 40 includes four line segments that are independently disposed, and each line segment is along a corresponding one. The edge of the shielding film 30 is disposed.
  • the number of line segments in the occlusion line 40 may also be less than four, for example, only one line segment is respectively disposed in the printing areas on the left and right sides of the occlusion film 30.
  • the number of turns of the occlusion line 40 is not limited to one turn.
  • the distance between the occlusion line 40 and the corresponding edge of the frame 10 is the same as the distance between the edge corresponding to the occlusion film 30, that is, the occlusion line 40 is located in the corresponding printing.
  • the middle of the area may be disposed in the middle of the corresponding printing area, for example, disposed closer to the edge of the shielding film 30, or disposed closer to the frame 10.
  • the screen 20 is a grid-like structure composed of grid lines, and has a plurality of meshes for printing a material to be printed (for example, a package adhesive) to be printed. On the substrate.
  • a material to be printed for example, a package adhesive
  • the occlusion line 40 and the grid lines of the screen 20 may be made of the same material, such as a metal material.
  • some embodiments of the present disclosure further provide a packaging method, including steps 301 to 305.
  • Step 301 Providing a screen screen, which is the screen screen in the above embodiment.
  • Step 302 Apply an encapsulant to the printing area of the screen screen.
  • the encapsulant may be a glass glue.
  • the encapsulant can be applied to the printed area of the screen screen by a scraping scraper.
  • Step 303 contacting a screen screen coated with an encapsulant with a first substrate to be printed, and printing the encapsulant onto the first substrate.
  • the screen screen can be fixed on the first substrate to be printed by a fixing structure of the packaging device, and when the printing is required, the sealing glue on the screen screen is performed by using a doctor blade. The scraping is performed such that the encapsulant contacts the first substrate through the mesh of the printing area, and after the scraping is completed, the screen screen is entirely moved downward, so that the encapsulant is printed onto the first substrate.
  • Step 304 Aligning the first substrate with the second substrate
  • Step 305 curing the encapsulant to form an encapsulation layer.
  • the encapsulant When the encapsulant is cured, it can be cured by laser irradiation.
  • the encapsulation glue corresponding to the printing area of the obstruction line is less than the encapsulation glue of the printing area on both sides, so that the area of the obstruction line is
  • the height of the encapsulant is lower than the height of the encapsulant on both sides, and the encapsulant formed has at least two retaining walls, that is, two sides of the encapsulant respectively located in the area where the shielding line is located.
  • At least two retaining walls can form a secondary protection or multiple protections on the display panel, that is, when one of the retaining walls is eroded or cracked, the other retaining walls can still protect the display substrate, thereby achieving better
  • the ground encapsulation effect improves the erosion resistance of the display panel.
  • FIG. 4 is a schematic structural view of a screen screen in the related art
  • FIG. 5 is a schematic diagram of a package formed by printing the package glue by using the screen screen of FIG.
  • FIG. 6 is a schematic diagram showing the appearance of an encapsulant formed by printing a package adhesive by using a screen screen in the embodiment of the present disclosure.
  • the appearance of the package adhesive is as follows: the height of the encapsulant 61 in the region where the occlusion line is located is lower than the package on both sides thereof.
  • the height of the glue 62, the formed encapsulant has two retaining walls, and the cross section is "hump-like", which can form a secondary protection on the display panel, achieve better packaging effect, and improve the corrosion resistance of the display panel.
  • Some embodiments of the present disclosure further provide a display panel, which is packaged by the packaging method in the above embodiment, the display panel includes: a first substrate, a second substrate, and a first substrate and a second substrate An encapsulation layer having an annular structure disposed around a display area of the display substrate, the encapsulation layer including at least two spaced apart barrier walls disposed along edges of the display area, adjacent barriers A strip groove is formed between the walls.
  • the encapsulation layer corresponds to the printing area in the above method embodiment, and the strip groove is formed by the occlusion line 40 in the above method embodiment.
  • the display panel can be formed with secondary protection or multiple protections to achieve better packaging effect and improved. Shows the erosion resistance of the panel.
  • the encapsulation layer includes two spaced-apart retaining walls, and the two spaced-apart retaining walls form two closed annular structures, and the closed annular structure can enhance the encapsulation effect.
  • the encapsulation layer may also include two or more spaced-apart retaining walls, the number of which is determined by the number of occlusion lines in the printing area in the method implementation.
  • the strip-shaped groove is vacuumed to prevent water, gas, and the like from remaining in the package structure, thereby further improving the erosion resistance of the display panel.
  • the laser curing of the encapsulant the laser curing is usually performed under atmospheric pressure, and a pressure difference is formed between the strip groove and the external atmospheric pressure, so that the encapsulant and the display substrate can be further pressed, so that the encapsulant and the display substrate are combined. Closer, improve the packaging effect.
  • the strip-shaped groove may also be filled with a water-absorbing getter material, and when water and gas enter through the external retaining wall, it may be absorbed by the water-absorbing getter material, thereby further improving the erosion resistance of the display panel. .
  • Embodiments of the present disclosure also provide a display device including the above display panel.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Packages (AREA)

Abstract

本公开提供一种丝网网版、封装方法、显示面板和显示装置，该丝网网版包括框架，固定在所述框架上的丝网，以及设置于所述丝网上的遮挡膜，所述丝网未被所述遮挡膜遮挡的部分形成印刷区域，所述印刷区域中设置有遮挡线，所述遮挡线沿着所述遮挡膜的边缘设置，所述遮挡线的宽度大于所述丝网的网格线的宽度。

Description

一种丝网网版、封装方法、显示面板和显示装置
相关申请的交叉引用
本申请主张在2017年8月1日在中国提交的中国专利申请No.201710646231.3的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及显示技术领域，尤其涉及一种丝网网版、封装方法、显示面板和显示装置。
背景技术
现有的显示装置，诸如TFT-LCD(薄膜晶体管液晶显示装置，Thin Film Transistor-Liquid Crystal Display)或OLED(有机发光二极管，Organic LightEmitting Diode)显示装置，一般包括上基板和下基板，上基板和下基板在封装区通过封装胶粘合。目前，封装胶一般通过丝网网版印刷形成在上基板或下基板上，再将上基板与下基板对应贴合以粘合在一起。显示装置对封装效果要求很高，尤其是OLED显示装置，OLED显示装置中存在对于水汽和氧气极为敏感的有机层，如果封装效果达不到要求，则会降低OLED显示装置的寿命。然而，采用目前的丝网网版印刷后，并不能达到预想的效果。
发明内容
有鉴于此，本公开提供一种丝网网版、封装方法、显示面板和显示装置。
在第一方面，本公开提供一种丝网网版，包括框架，固定在所述框架上的丝网，以及设置于所述丝网上的遮挡膜，所述丝网未被所述遮挡膜遮挡的部分形成印刷区域，所述印刷区域中设置有至少一条遮挡线，所述至少一条遮挡线沿着所述遮挡膜的边缘设置，所述遮挡线的宽度大于所述丝网的网格线的宽度。
可选地，所述印刷区域为环绕所述遮挡膜的环状结构，所述遮挡线为环绕所述遮挡膜的封闭环状结构。
可选地，所述印刷区域中设置有一圈封闭环状结构的遮挡线。
可选地，所述遮挡线的线段的个数为两条，所述两条线段分别位于所述遮挡膜左右两侧对应的印刷区域中；或所述遮挡线的线段的个数为四条，每条线段均沿着所述遮挡膜边缘对应的印刷区域中。
可选地，所述遮挡线和所述框架对应的边缘之间的距离，与遮挡膜对应的边缘之间的距离相同。
在第二方面，本公开还提供一种封装方法，包括：
提供一丝网网版，所述丝网网版为上述丝网网版；
在所述丝网网版的印刷区域涂覆封装胶；
将涂覆有封装胶的丝网网版与待印刷的第一基板接触，将所述封装胶印刷至所述第一基板上。
可选地，所述封装方法还包括：
将所述第一基板与第二基板对合；
对所述封装胶进行固化，形成封装层。
可选地，形成的封装层包括多道间隔排列的挡墙，所述相邻的挡墙之间为条状凹槽。
可选地，所述条状凹槽是由所述印刷区域中的遮挡线形成。
在第三方面，本公开还提供一种显示面板，采用上述方法封装，所述显示面板包括：
第一基板、第二基板以及位于所述第一基板和第二基板之间的封装层，所述封装层呈围绕所述显示基板的显示区域设置的环状结构，所述封装层包括沿着所述显示区域的边缘设置的至少两道间隔排列的挡墙，相邻的挡墙之间形成为条状凹槽。
可选地，所述条状凹槽是由所述印刷区域中的遮挡线形成。
可选地，所述封装层包括两道间隔排列的挡墙，所述两道间隔排列的挡墙形成两圈封闭环状结构。
可选地，所述条状凹槽内为真空。
可选地，所述条状凹槽填充有吸水吸气材料。
在第四方面，本公开还提供一种显示装置，包括上述显示面板。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对本公开实施例的描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为本公开的一些实施例的丝网网版的结构示意图；
图2为本公开的另一些实施例的丝网网版的结构示意图；
图3为本公开的一些实施例的封装方法的流程示意图；
图4为相关技术中的丝网网版的结构示意图；
图5是采用图4所述的丝网网版对封装胶进行印刷后形成的封装胶的样貌示意图；
图6是采用本公开实施例中的丝网网版对封装胶进行印刷后形成的封装胶的样貌示意图。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员所获得的所有其他实施例，都属于本公开保护的范围。
请参考图1，本公开的一些实施例提供了一种丝网网版，包括框架10，固定在所述框架10上的丝网20，以及设置于所述丝网20上的遮挡膜30，所述丝网20未被所述遮挡膜30遮挡的部分形成印刷区域，所述印刷区域中设置遮挡线40,所述遮挡线40沿着所述遮挡膜30的边缘设置，所述遮挡线40的宽度大于所述丝网20的网格线的宽度。
本公开实施例中，所述印刷区域为环绕所述遮挡膜30的环状结构，所述遮挡线40为环绕所述遮挡膜30的封闭环状结构。
本公开实施例中，所述印刷区域中设置有一圈封闭环状结构的遮挡线40， 当然，在本公开的其他一些实施例中，所述印刷区域中也可能设置两圈或更多圈封闭环状结构的遮挡线40。
在本公开的其他一些实施例中，所述遮挡线40也可以不是封闭的环状结构，例如，请参考图2，遮挡线40包括独立设置的四条线段，每条线段均沿着对应的所述遮挡膜30的边缘设置。在本公开的另外一些实施例中，所述遮挡线40中的线段的个数也可以少于四条，例如，仅在遮挡膜30左右两侧的印刷区域中分别设置一条线段。
当然，在遮挡线40不是封闭的环状结构的实施例中，遮挡线40的圈数也不限于一圈。
本公开实施例中，所述遮挡线40和所述框架10对应的边缘之间的距离，与遮挡膜30对应的边缘之间的距离相同，也就是说，所述遮挡线40位于对应的印刷区域的中部。当然，在本公开的其他一些实施例中，所述遮挡线40也可以不设置于对应的印刷区域的中部，例如，设置得更靠近遮挡膜30的边缘一些，或设置得更靠近框架10对应的边缘一些。
本公开实施例中，所述丝网20是由网格线构成的网格状结构，具有多个网孔，所述多个网孔用于将待印刷材料(例如封装胶)印刷至待印刷基板上。
本公开实施例中，可选地，所述遮挡线40和所述丝网20的网格线可以采用相同的材料制成，例如金属材料。
请参考图3，本公开的一些实施例还提供一种封装方法，包括步骤301至305。
步骤301：提供一丝网网版，所述丝网网版为上述实施例中的丝网网版。
步骤302：在所述丝网网版的印刷区域涂覆封装胶。所述封装胶可以为玻璃胶。
在一些可选的实施例中，可以通过回料刮将封装胶涂覆到丝网网版的印刷区域。
步骤303：将涂覆有封装胶的丝网网版与待印刷的第一基板接触，将所述封装胶印刷至所述第一基板上。
在一些可选的实施例中，可以通过封装设备的一固定结构将丝网网版固定在待印刷的第一基板上方，在需要进行印刷时，利用刮刀将丝网网版上的封 装胶进行刮覆，使得封装胶通过印刷区域的网孔与第一基板接触，刮刀刮完后，然后将丝网网版整体向下移动，使得封装胶印刷至第一基板上。
步骤304：将所述第一基板与第二基板对合；
步骤305：对所述封装胶进行固化，形成封装层。
对封装胶进行固化时，可以采用激光照射的方式进行固化。
本公开实施例中，通过该丝网网版将封装胶印刷至待印刷基板上时，遮挡线对应的印刷区域的封装胶要少于其两侧的印刷区域的封装胶，使得遮挡线所在区域的封装胶的高度低于其两侧的封装胶的高度，形成的封装胶具有至少两道挡墙，即分别位于遮挡线所在区域的封装胶的两侧。至少两道挡墙对显示面板能够形成二次防护或多次防护，即当其中一道挡墙被侵蚀或者出现裂纹等情况时，其他道挡墙仍可以对显示基板进行保护，从而可以达到更佳地封装效果，提高了显示面板的抗侵蚀能力。
请参考图4-图6，图4为相关技术中的丝网网版的结构示意图，图5是采用图4所述的丝网网版对封装胶进行印刷后形成的封装胶的样貌示意图，图6是采用本公开实施例中的丝网网版对封装胶进行印刷后形成的封装胶的样貌示意图。从图6可以看出，采用本公开实施例中的丝网网版对封装胶进行印刷后，形成的封装胶样貌为：遮挡线所在区域的封装胶61的高度低于其两侧的封装胶62的高度，形成的封装胶具有两道挡墙，截面呈“驼峰状”，对显示面板能够形成二次防护，达到更佳地封装效果，提高了显示面板的抗侵蚀能力。
本公开的一些实施例还提供一种显示面板，采用上述实施例中的封装方法封装，所述显示面板包括：第一基板、第二基板以及位于所述第一基板和第二基板之间的封装层，所述封装层呈围绕所述显示基板的显示区域设置的环状结构，所述封装层包括沿着所述显示区域的边缘设置的至少两道间隔设置的挡墙，相邻的挡墙之间形成为条状凹槽。
所述封装层对应上述方法实施例中的印刷区域，所述条状凹槽是由上述方法实施例中的遮挡线40形成。
本公开实施例中，由于封装层包括沿着显示面板的显示区域设置的至少两道间隔设置的挡墙，对显示面板能够形成二次防护或多次防护，达到更佳地 封装效果，提高了显示面板的抗侵蚀能力。
本公开实施例中，可选地，所述封装层包括两道间隔排列的挡墙，所述两道间隔排列的挡墙形成两圈封闭环状结构，封闭环状结构能够使得加强封装效果。
在一些可选的实施例中，所述封装层也可以包括两道以上的间隔排列的挡墙，挡墙的个数由方法实施中的所述印刷区域中的遮挡线的条数确定。
本公开实施例中，可选地，所述条状凹槽内为真空，避免水、气等残留在封装结构内，进一步提高了显示面板的抗侵蚀能力。此外，在对封装胶进行激光固化时，激光固化通常在大气压下进行，条状凹槽和外界大气压之间形成压差，从而可以更压紧封装胶和显示基板，使得封装胶和显示基板结合的更紧密，提高封装效果。
本公开实施例中，所述条状凹槽内还可以填充吸水吸气材料，当水、气通过外部的挡墙进入时，可以被吸水吸气材料吸收，进一步提高了显示面板的抗侵蚀能力。
本公开实施例还提供一种显示装置，包括上述显示面板。
除非另作定义，本公开中使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“一个”或者“一”等类似词语也不表示数量限制，而是表示存在至少一个。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也相应地改变。
以上所述是本公开的可选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本公开所述原理的前提下，还可以作出若干改进和润饰，这些改进和润饰也应视为本公开的保护范围。

Claims (15)

  1. 一种丝网网版，包括框架，固定在所述框架上的丝网，以及设置于所述丝网上的遮挡膜，其中，所述丝网未被所述遮挡膜遮挡的部分形成印刷区域，所述印刷区域中设置有至少一条遮挡线，所述至少一条遮挡线分别沿着所述遮挡膜的边缘设置，所述遮挡线的宽度大于所述丝网的网格线的宽度。
  2. 根据权利要求1所述的丝网网版，其中，所述印刷区域为环绕所述遮挡膜的环状结构，所述遮挡线为环绕所述遮挡膜的封闭环状结构。
  3. 根据权利要求2所述的丝网网版，其中，所述印刷区域中设置有一圈封闭环状结构的遮挡线。
  4. 根据权利要求1所述的丝网网版，其中所述遮挡线的线段的个数为两条，所述两条线段分别位于所述遮挡膜左右两侧对应的印刷区域中；或
    所述遮挡线的线段的个数为四条，每条线段均沿着所述遮挡膜边缘对应的印刷区域中。
  5. 根据权利要求1-4中任一项所述的丝网网版，其中，所述遮挡线和所述框架对应的边缘之间的距离，与遮挡膜对应的边缘之间的距离相同。
  6. 一种封装方法，包括：
    提供一丝网网版，所述丝网网版为如权利要求1-5中任一项所述的丝网网版；
    在所述丝网网版的印刷区域涂覆封装胶；
    将涂覆有封装胶的丝网网版与待印刷的第一基板接触，将所述封装胶印刷至所述第一基板上。
  7. 根据权利要求6所述的封装方法，还包括：
    将所述第一基板与第二基板对合；
    对所述封装胶进行固化，形成封装层。
  8. 根据权利要求7所述的封装方法，其中形成的封装层包括多道间隔排列的挡墙，所述相邻的挡墙之间为条状凹槽。
  9. 根据权利要求8所述的封装方法，其中所述条状凹槽是由所述印刷区域中的遮挡线形成。
  10. 一种显示面板，采用如权利要求6或7所述的方法封装，包括：
    第一基板、第二基板以及位于所述第一基板和第二基板之间的封装层，所述封装层呈围绕所述显示基板的显示区域设置的环状结构，所述封装层包括沿着所述显示区域的边缘设置的至少两道间隔排列的挡墙，相邻的挡墙之间形成为条状凹槽。
  11. 根据权利要求10所述的显示面板，其中，所述条状凹槽是由所述印刷区域中的遮挡线形成。
  12. 根据权利要求10所述的显示面板，其中，所述封装层包括两道间隔排列的挡墙，所述两道间隔排列的挡墙形成两圈封闭环状结构。
  13. 根据权利要求10所述的显示面板，其中，所述条状凹槽内为真空。
  14. 根据权利要求7所述的显示面板，其中，所述条状凹槽填充有吸水吸气材料。
  15. 一种显示装置，包括如权要求10-14中任一项所述的显示面板。
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