WO2022032797A1 - 显示面板及显示装置 - Google Patents

显示面板及显示装置 Download PDF

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Publication number
WO2022032797A1
WO2022032797A1 PCT/CN2020/115727 CN2020115727W WO2022032797A1 WO 2022032797 A1 WO2022032797 A1 WO 2022032797A1 CN 2020115727 W CN2020115727 W CN 2020115727W WO 2022032797 A1 WO2022032797 A1 WO 2022032797A1
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WO
WIPO (PCT)
Prior art keywords
area
display panel
organic substrate
trench
cutting
Prior art date
Application number
PCT/CN2020/115727
Other languages
English (en)
French (fr)
Inventor
李雪
Original Assignee
武汉华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US17/058,166 priority Critical patent/US11961845B2/en
Publication of WO2022032797A1 publication Critical patent/WO2022032797A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • H01L27/1244—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement

Definitions

  • the present application relates to the field of display, and in particular, to a display panel and a display device.
  • the frame area of the display panel generally includes a wiring area 101 , an effective packaging area 102 , a crack prevention area 103 , and a cutting area 104 ; the display panel includes linings stacked in sequence from bottom to top.
  • the second inorganic layer 130 is arranged in a groove shape, and the organic layer 150 is filled in the groove to block the cracks generated by the inorganic film layer during the cutting process, and prevent the cracks from extending to the display area of the display panel. Display Error.
  • the encapsulation layer 160 will also generate cracks, and the cracks generated in the encapsulation layer 160 will also extend to the display area of the display panel. Therefore, a longer effective encapsulation area 102 is designed to extend the path of crack extension, and try to avoid it. The crack extends to the display area of the display panel.
  • the longer effective packaging area 102 increases the size of the frame area of the display panel, which affects the narrow frame design of the display panel.
  • the existing display panel has a problem that the frame is too wide, which needs to be solved.
  • the present application provides a display panel and a display device to improve the problem that the frame of the existing display panel is too wide.
  • the present application provides a display panel, the display panel includes a display area and a frame area, and in the frame area, the display panel includes:
  • a substrate including a first organic substrate, a second organic substrate, and an inorganic substrate between the first organic substrate and the second organic substrate;
  • the trench including a first trench portion extending through the first inorganic layer and extending to the second organic substrate the second trench portion, the orthographic projection of the first trench portion on the first organic substrate falls within the orthographic projection of the second trench portion on the first organic substrate, and is smaller than the orthographic projection area of the second trench portion on the first organic substrate.
  • the frame area includes a wiring area, an effective packaging area, and a cutting area, the effective packaging area is located between the wiring area and the cutting area, and the groove is provided in the cutting zone.
  • the encapsulation layer is disconnected at the groove.
  • the encapsulation layer is continuous at the groove.
  • the diameter of the part of the second groove part far from the first groove part is larger than the diameter of the part close to the first groove part.
  • the bottom surface of the second groove portion is located in the second organic substrate.
  • the second groove portion penetrates the second organic substrate, and the bottom surface of the second groove portion is in contact with the second organic substrate and the inorganic substrate face overlap.
  • the grooves include at least two.
  • the present application provides a display device, the display device includes a display panel, the display panel includes a display area and a frame area, and in the frame area, the display panel includes:
  • a substrate including a first organic substrate, a second organic substrate, and an inorganic substrate between the first organic substrate and the second organic substrate;
  • the trench including a first trench portion extending through the first inorganic layer and extending to the second organic substrate the second trench portion, the orthographic projection of the first trench portion on the first organic substrate falls within the orthographic projection of the second trench portion on the first organic substrate, and is smaller than the orthographic projection area of the second trench portion on the first organic substrate.
  • the frame area includes a wiring area, an effective packaging area, and a cutting area
  • the effective packaging area is located between the wiring area and the cutting area
  • the groove is provided in the cutting zone.
  • the encapsulation layer is disconnected at the groove.
  • the encapsulation layer is continuous at the groove.
  • the diameter of the part of the second groove part far from the first groove part is larger than the diameter of the part close to the first groove part.
  • the bottom surface of the second trench portion is located in the second organic substrate.
  • the second groove portion penetrates the second organic substrate, and a bottom surface of the second groove portion is in contact with the second organic substrate and the inorganic substrate face overlap.
  • the grooves include at least two.
  • Embodiments of the present application provide a display panel and a display device.
  • the display panel includes a display area and a frame area.
  • the display panel includes: a substrate, including a first organic substrate, a second organic substrate, and an inorganic substrate located between the first organic substrate and the second organic substrate; a first inorganic layer formed on the second organic substrate; an encapsulation layer formed on the first inorganic layer; and penetrating the first inorganic layer and extending to the trench of the second organic substrate, the trench includes a first trench portion penetrating the first inorganic layer and a second trench portion extending to the second organic substrate, and the first trench portion is in the first organic substrate.
  • the orthographic projection on the substrate falls within the orthographic projection of the second trench portion on the first organic substrate, and is smaller than the area of the orthographic projection of the second trench portion on the first organic substrate.
  • the first groove part and the second groove part form a convex incised structure.
  • the encapsulation layer when cutting, the encapsulation layer produces cutting cracks and extends outward. Due to the existence of the grooves of the convex indented structure, it is difficult for the cutting cracks to extend out of the groove area, preventing the cutting cracks of the encapsulation layer from reaching the display panel.
  • the display area is extended and the display panel is damaged, and at the same time, the effect of the anti-crack area and the longer effective packaging area in the prior art is achieved.
  • the display panel provided by the present application retains the width of the wiring area and the cutting area, removes the crack prevention area, reduces the size of the effective packaging area, and thus reduces the size of the entire frame area. size.
  • FIG. 1 is a schematic structural diagram of a display panel in the prior art.
  • FIG. 2 is a schematic diagram of a first structure of a display panel provided by an embodiment of the present application.
  • FIG. 3 is a schematic diagram of a second structure of a display panel according to an embodiment of the present application.
  • FIG. 4 is a schematic diagram of a third structure of a display panel according to an embodiment of the present application.
  • the present application provides a display panel that can alleviate the problem.
  • the display panel provided by the present application includes a display area (not shown) and a frame area, and the frame area includes a wiring area 201 , an effective packaging area 202 , and a cutting area 203, the effective packaging area 202 is located between the wiring area 201 and the cutting area 203; in the cutting area 202, the display panel includes:
  • the substrate 210 includes a first organic substrate 211, a second organic substrate 213, and an inorganic substrate 212 located between the first organic substrate 211 and the second organic substrate 213;
  • the first inorganic layer 220 is formed on the second organic substrate 213;
  • the encapsulation layer 260 is formed on the first inorganic layer 220;
  • the trench including a first trench portion 271 penetrating the first inorganic layer 220 and a trench portion 271 located in the second organic substrate
  • the projected area is small.
  • An embodiment of the present application provides a display panel.
  • the display panel In the cutting area, the display panel is provided with a first groove portion penetrating the first inorganic layer, and a second groove portion extending to the second organic substrate.
  • the orthographic projection of a trench on the first organic substrate falls within the orthographic projection of the second trench on the first organic substrate, and is larger than the orthographic projection of the second trench on the first organic substrate
  • the projected area is small, and the first groove portion and the second groove portion form a convex inscribed structure.
  • the cutting crack will not be able to bypass the groove and continue to extend, which avoids the problem that the cutting crack of the first inorganic layer extends to the display area of the display panel and destroys the display panel; at the same time, the encapsulation layer generates cutting cracks and extends outwards during cutting.
  • the existence of the groove of the convex indented structure makes it difficult for the cutting crack to extend out of the groove area, avoiding the problem that the cutting crack of the encapsulation layer extends to the display area of the display panel and destroys the display panel, and at the same time achieves the problem of the prior art.
  • the effect of crack prevention zone and longer effective encapsulation zone is not be able to bypass the groove and continue to extend, which avoids the problem that the cutting crack of the first inorganic layer extends to the display area of the display panel and destroys the display panel; at the same time, the encapsulation layer generates cutting cracks and extends outwards during cutting.
  • the display panel provided by the present application retains the width of the wiring area and the cutting area, and by improving the setting of the cutting area, the crack prevention area is removed, and the size of the effective packaging area is reduced, thereby Reduced the size of the entire border area.
  • the wiring area 201 is arranged adjacent to the display area of the display panel, that is, the effective packaging area 202 and the cutting area 203 are sequentially away from the display area of the display panel.
  • the width of the wiring area 201 is the same as that of the prior art
  • the widths of the middle wiring regions 101 are the same. As shown in FIGS.
  • the display panel includes: a substrate 210 , including a first organic substrate 211 , an inorganic substrate 212 , and a second inorganic substrate 213 ; a first inorganic layer 220 , disposed on the second organic substrate 213; the second inorganic layer 230, disposed on the first inorganic layer 220; the metal wiring layer 240, disposed on the second inorganic layer 230; the organic layer 250, disposed on the metal wiring layer 240 , and cover the edge of the metal wiring layer 240 ; the encapsulation layer 260 is disposed on the organic layer 250 and covers the metal wiring layer 240 , the organic layer 250 , and the second inorganic layer 230 .
  • the effective packaging area 202 is disposed adjacent to the wiring area 201 and away from the display area.
  • the display panel includes: a substrate 210, including a first organic substrate 211, an inorganic substrate 212, and a second inorganic substrate 213; a first inorganic layer 220, is disposed on the second organic substrate 213 ; the second inorganic layer 230 is disposed on the first inorganic layer 220 ; the encapsulation layer 260 is disposed on the second inorganic layer 230 .
  • the second inorganic layer 230 is in close contact with the encapsulation layer 260, thereby forming a good encapsulation effect of the display panel.
  • the materials of the first organic substrate 211 and the second organic substrate 213 are usually organic polymer materials such as polyacetamide and polyethylene terephthalate, which are used to realize the flexibility of the display panel;
  • the material is generally silicon oxide or silicon nitride, which is used to maintain the rigidity and support properties of the substrate.
  • the material of the first inorganic layer 220 is generally silicon oxide (SiNx), silicon nitride silicon oxide (SiOx) or silicon oxynitride (SiNO), and usually a stacked structure of silicon nitride and silicon oxide is used. Silicon nitride has strong ion blocking ability and good water and oxygen isolation ability, which can effectively prevent impurities from diffusing into the display panel during the thermal process, and silicon oxide has good interface performance.
  • the second inorganic layer 230 is similar to the first inorganic layer 220 .
  • the metal wiring layer 240 includes metal wiring, and the material of the metal wiring can be metal molybdenum, aluminum, copper, titanium, chromium, silver or a mixture thereof, and the metal wiring layer 240 can be a single-film layer structure, such as a single-layer metal Copper, single-layer metal aluminum, single-layer metal copper, etc.; it can be a double-layer film structure, such as aluminum/molybdenum laminated structure, aluminum/titanium laminated structure, copper/titanium laminated structure; it can also be a three-film structure , such as molybdenum/aluminum/molybdenum laminated structure, titanium/aluminum/titanium laminated structure, titanium/copper/titanium laminated structure, etc.
  • the organic layer 250 covers the edge of the metal wiring layer 240 and is used to protect the metal wiring.
  • the material of the organic layer 250 includes, but is not limited to, polyimide-based resin, epoxy-based resin, acrylic-based resin, or tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer.
  • the encapsulation layer 260 is used to encapsulate the entire display panel, preventing external impurity particles or water and oxygen from entering the display panel, and at the same time protecting the display panel from damage by external force.
  • the material of the encapsulation layer 260 is an inorganic material, which is similar to the first inorganic layer 220 and the second inorganic layer 230, and is generally silicon oxide, silicon nitride silicon oxide or silicon oxynitride.
  • the cutting area 203 is an area reserved for cutting by the display panel, including a standard line for alignment cutting—the cutting line 204.
  • the width is the same as the width of the cutting area 104 in the prior art. Different arrangements of the trenches 270 in the cutting area 203 have different effects on the display panel.
  • the first trench portion 271 penetrates the first inorganic layer 220 , the second trench portion 272 is located in the second organic substrate 213 , and the second trench portion 272 is The bottom is inside the second organic substrate 21 .
  • the first trench portion 271 penetrates the first inorganic layer 220 , so that the first inorganic layer 220 is disconnected at the position of the first trench portion 271 .
  • a cutting crack is generated in the first inorganic layer 220 at the cutting position, and the cutting crack will extend to the effective packaging area 202.
  • the cutting crack extends to the first groove portion 271, due to When the first inorganic layer 220 is disconnected, the dicing crack cannot continue to extend around the trench, and the dicing crack generated by the first inorganic layer 220 will stop at the first trench portion 271 .
  • the orthographic projection of the first trench portion 271 on the first organic substrate 211 it falls within the orthographic projection of the second trench portion 272 on the first organic substrate 211 , and is smaller than the second trench portion 272
  • the area of the orthographic projection on the first organic substrate 211 is small, so that the entire trench 270 forms a convex undercut structure.
  • the groove 270 is convex
  • the existence of the undercut structure makes it difficult for the cutting crack to extend out of the trench area, and the cutting crack generated by the encapsulation layer 260 will stop at the trench 270 . That is, with the trench 270 as the limit, there will be no cutting cracks in the packaging layer 260 in the area opposite to the cutting position, which avoids the problem that the cutting cracks in the packaging layer 260 extend to the display area of the display panel and damage the display panel.
  • the encapsulation layer 260 is continuous at the trenches 270, but due to the existence of the convex structure of the trenches 270, during the preparation of the encapsulation layer 260, more encapsulation layer material is deposited In the second groove portion 272, the material of the encapsulation layer located on the sidewall of the first trench portion 271 is reduced, that is, the lateral thickness of the encapsulation layer located on the sidewall of the first trench portion 271 is reduced.
  • the dicing crack extends to the sidewall of the first groove portion 271, the inertial force of the dicing crack will be greatly weakened.
  • the inertial force will not be enough to drive the encapsulation layer 260 to crack in the effective encapsulation area, which greatly reduces the risk of the encapsulation layer 260 cutting crack extending outside the groove area;
  • the inertial force extending along the side of the second groove portion 272 in the lateral direction and the inertial force along the side of the first groove portion 271 in the longitudinal direction will be dispersed at the same time.
  • the former will greatly disperse the inertial force of the cutting crack, so that It is difficult for the dicing cracks generated by the encapsulation layer 260 to extend out of the trench area, which avoids the problem that the dicing cracks of the packaging layer 260 extend to the display area of the display panel and damage the display panel.
  • the encapsulation layer 260 is disconnected at the trench 270 , that is, the encapsulation layer 260 inside the trench 270 is disconnected from the encapsulation layer 260 outside the trench 270 , when When the display panel is cut along the cutting line 204 , the encapsulation layer 260 in the groove 270 will be cut from the cutting position, and will stop when it extends to the wall of the groove 270 , that is, the encapsulation layer 260 outside the groove 270 will not be cut.
  • the existence of cracks avoids the problem that the cutting cracks of the encapsulation layer 260 extend to the display area of the display panel and damage the display panel, thereby further ensuring the quality of the display panel.
  • the diameter of the part of the second groove part 273 close to the first groove part 271 is the same as the diameter of the part far from the first groove part 271 , and both are larger than the first groove According to the diameter of the part 271 , the encapsulation layer 260 is disconnected at the connection between the first groove part 271 and the second groove part 273 .
  • the diameter of the part of the second groove part 274 away from the first groove part 271 is larger than the diameter of the part close to the first groove part 271
  • the diameter of the part of the second groove part 274 The diameter of the contact position with the first groove portion 271 may be the same as the diameter of the first groove portion 271 , or may be larger than the diameter of the first groove portion 271 .
  • the structure of the second groove portion 274 is designed so that under the condition of the same cross-sectional area, the diameter of the bottom of the second groove portion 274 is larger than that of the second groove portion.
  • the encapsulation layer 260 is disconnected at the second trench portion 274 ; on the other hand, the structure design of the second trench portion 274 with a narrow upper portion and a wider lower portion is more disadvantageous for the material of the encapsulation layer 260 on the sidewall of the second trench portion 274 .
  • the deposition also blocks the connection between the encapsulation layer located at the bottom of the second trench portion 274 and the encapsulation layer located on the first trench 271 , so that the encapsulation layer 260 is disconnected at the second trench portion 274 .
  • only one trench 270 is provided within the dicing region 203.
  • the grooves 270 may be provided at the non-cutting line 204 or may be provided at the cutting line 204 .
  • the groove 270 is disposed at the cutting line 204.
  • the grooves 270 may all be disposed at the non-cutting line 204 , or there may be one groove 270 disposed at the cutting line 204 .
  • the design of the plurality of grooves 270 further considers the influence of cutting errors. When one groove 270 of the display panel loses its blocking effect on the cutting crack, other grooves 270 near the display area of the display panel can also block the cutting crack. , which further ensures the quality of the display panel.
  • the trench 270 penetrates the first inorganic layer 220 and the second organic substrate 213 simultaneously, and the bottom surface of the second trench portion ( 273 , 274 ) and the second The contact surfaces of the organic substrate 213 and the inorganic substrate 212 overlap.
  • the first groove portion 271 also penetrates the first inorganic layer 220 , so that the first inorganic layer 220 is disconnected at the position of the first groove portion 271 .
  • a cutting crack is generated in the first inorganic layer 220 at the cutting position, and the cutting crack will extend to the effective packaging area 202.
  • the cutting crack extends to the first groove portion 271, due to When the first inorganic layer 220 is disconnected, the dicing crack cannot continue to extend around the trench, and the dicing crack generated by the first inorganic layer 220 will stop at the first trench portion 271 .
  • the second trench portions ( 273 , 274 ) penetrate through the second organic substrate 213 , and the bottom surfaces of the second trench portions ( 273 , 274 ) are connected to the second organic substrate 213 and the inorganic substrate 213 .
  • the contact surfaces of the substrates 212 coincide.
  • the step difference of the second groove portions ( 273 , 274 ) is further increased, which further ensures the disconnection effect of the encapsulation layer 260 at the second groove portions ( 273 , 274 ).
  • the encapsulation layer 260 will generate a cutting crack at the cutting position, and the cutting crack will extend to the effective encapsulation area 202 .
  • the cutting crack When the cutting crack extends to the groove 270 , the cutting crack will Stop at trench 270 . That is, with the trench 270 as the limit, there will be no cutting cracks in the packaging layer 260 in the area opposite to the cutting position, which avoids the problem that the cutting cracks in the packaging layer 260 extend to the display area of the display panel and damage the display panel.
  • the structural design of the first groove portion 271 penetrating the first inorganic layer 220 replaces the crack prevention area 103 of the display panel in the prior art, so that the size of the display panel frame area is Compared with the prior art, it is reduced by 30-50um (the width of the crack prevention area 103 of the display panel in the prior art is 30-50um); at the same time, compared with the prior art, in the crack prevention area 103, only the second Grooves are arranged on the inorganic layer 130 to fill the organic layer, which can only block the cracks generated by the second inorganic layer 130 during the cutting process, and cannot avoid the display abnormality caused by the cracks generated by the first inorganic layer 120 extending into the display area of the display panel.
  • the boundary of the second inorganic layer 230 is set in the effective encapsulation area 202 to avoid the possibility of cutting cracks in the second inorganic layer 230 .
  • the extension path of the cutting crack of the first inorganic layer 220 is interrupted, and the blocking effect of the cutting crack of the first inorganic layer 220 and the second inorganic layer 230 is more direct and effective.
  • the design of the second trench portion ( 272 , 273 , 274 ) extending to the second organic substrate 213 makes the cutting crack generated by the encapsulation layer 260 stop at the trench 270 , thereby achieving a longer effective encapsulation area in the prior art 102 effect, so that the effective packaging area 202 of the display panel provided by this embodiment does not need to be lengthened, and the size of the effective packaging area 202 is reduced by 100-200um compared with the prior art;
  • the encapsulation area 102 is lengthened to prevent the cutting crack of the encapsulation area 160 from extending to the display area of the display panel by extending the path of the crack extension.
  • the display panel provided by the embodiment of the present application directly blocks the cutting crack of the encapsulation area 260
  • the extension path has a more direct and effective blocking effect on the dicing crack of the packaging area 160 .
  • the size of the entire frame area of the display panel provided by the embodiment of the present application is reduced by 130-250um.
  • an embodiment of the present application provides a method for manufacturing a display panel, which is used for manufacturing the above-mentioned display panel.
  • the manufacturing method of the display panel includes:
  • Step S1 preparing an array substrate
  • Step S2 in the cutting area, etching the first inorganic layer at the predetermined position of the array substrate, exposing the second organic substrate, and forming the first groove portion;
  • Step S3 reacting oxygen with the exposed second organic substrate, etching the second organic substrate to form a second groove portion; the orthographic projection of the second groove portion on the array substrate covers the first The orthographic projection of the groove portion on the array substrate is larger than the area of the orthographic projection of the first groove portion on the array substrate;
  • Step S4 preparing an encapsulation layer, and the encapsulation layer is disconnected at the groove;
  • Step S5 cutting the display panel.
  • Embodiments of the present application provide a method for fabricating a display panel.
  • the fabrication method forms a first trench portion penetrating the first inorganic layer and a second trench extending to a second organic substrate by forming a first inorganic layer in a cutting area.
  • the groove portion makes the entire groove form a convex indented structure.
  • the first inorganic layer generates cutting cracks and extends outward.
  • the groove When it extends to the position of the groove, the groove penetrates the first
  • the inorganic layer causes the first inorganic layer to be disconnected at the groove, and the cutting crack generated by the first inorganic layer will not be able to bypass the groove and continue to extend, so as to prevent the cutting crack of the first inorganic layer from extending to the display area of the display panel and damaging it.
  • the problem of the display panel Similarly, when cutting, the encapsulation layer produces a cutting crack and extends outward, and stops when it extends to the groove position, avoiding the problem that the cutting crack of the encapsulation layer extends to the display area of the display panel and destroys the display panel.
  • the preparation of the first groove part achieves the effect of the anti-crack zone in the prior art, and the preparation of the second groove part achieves the effect of the longer effective encapsulation zone in the prior art, compared with the existing The technology of the display panel, by improving the cutting area, removes the crack prevention area, reduces the size of the effective packaging area, and thus reduces the size of the entire frame area.
  • the second trench portion does not penetrate the second organic substrate, and the bottom surface of the second trench portion is located in the second organic substrate.
  • the second trench portion penetrates the second organic substrate, and the bottom surface of the second trench portion coincides with the contact surface of the second organic substrate and the inorganic substrate.
  • the predetermined location is at the cut line; in another embodiment, the predetermined location is at the non-cut line.
  • the predetermined positions include at least two locations, that is, the prepared display panel includes at least two grooves. In one embodiment, one of the predetermined positions is at the cutting line; in another embodiment, the predetermined positions are all at the non-cutting line.
  • An embodiment of the present application further provides a display device, the display device includes the display panel provided by the embodiment of the present application, the display panel includes a display area and a frame area, and in the frame area, the display panel includes:
  • a substrate including a first organic substrate, a second organic substrate, and an inorganic substrate between the first organic substrate and the second organic substrate;
  • the trench includes a first trench portion penetrating the first inorganic layer and a second trench portion extending to the second organic substrate, the first trench
  • the orthographic projection of the groove portion on the first organic substrate falls within the orthographic projection of the second groove portion on the first organic substrate, and is larger than the orthographic projection of the second groove portion on the first organic substrate. Small area.
  • the frame area includes a wiring area, an effective packaging area, and a dicing area, the effective packaging area is located between the wiring area and the dicing area, and the groove is disposed in the dicing area.
  • the encapsulation layer is broken at the trench.
  • the encapsulation layer is continuous at the trench.
  • the diameter of the part of the second groove part far from the first groove part is larger than the diameter of the part close to the first groove part.
  • the bottom surface of the second trench portion is located in the second organic substrate.
  • the second trench portion penetrates the second organic substrate, and the bottom surface of the second trench portion coincides with the contact surface between the second organic substrate and the inorganic substrate.
  • the grooves include at least two within the bezel region.
  • Embodiments of the present application provide a display panel, a method for manufacturing the same, and a display device.
  • the display panel includes a display area and a frame area.
  • the display panel includes: a substrate, including a first organic substrate, a second organic substrate a substrate, and an inorganic substrate between the first organic substrate and the second organic substrate; a first inorganic layer formed on the second organic substrate; an encapsulation layer formed on the first inorganic layer; and through
  • the first inorganic layer extends to a trench of the second organic substrate, the trench includes a first trench portion penetrating the first inorganic layer and a second trench portion extending to the second organic substrate, the first trench portion
  • the orthographic projection on the first organic substrate falls within the orthographic projection of the second trench portion on the first organic substrate, and is smaller than the area of the orthographic projection of the second trench portion on the first organic substrate .
  • the first inorganic layer When the display panel is cut, the first inorganic layer generates cutting cracks and extends outward. When the cutting cracks extend to the groove position, the first inorganic layer is disconnected at the groove because the groove penetrates the first inorganic layer. The cutting crack will not be able to bypass the groove and continue to extend, which avoids the problem that the cutting crack of the first inorganic layer extends to the display area of the display panel and destroys the display panel; at the same time, the encapsulation layer generates cutting cracks and extends outwards during cutting.
  • the existence of the groove of the convex indented structure makes it difficult for the cutting crack to extend out of the groove area, avoiding the problem that the cutting crack of the encapsulation layer extends to the display area of the display panel and destroys the display panel, and at the same time achieves the problem of the prior art.
  • the effect of crack prevention zone and longer effective encapsulation zone Compared with the display panel of the prior art, the display panel provided by the present application retains the width of the wiring area and the cutting area, and by improving the setting of the cutting area, the crack prevention area is removed, and the size of the effective packaging area is reduced, thereby Reduced the size of the entire border area.

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Abstract

本申请实施例提供了一种显示面板及显示装置，在边框区内，显示面板包括依次层叠设置的第一有机衬底、无机衬底、第二有机衬底、第一无机层、封装层，以及贯穿第一无机层的第一沟槽部和延伸至第二有机衬底的第二沟槽部，第一沟槽部在第一有机衬底上的正投影，落入且小于第二沟槽部在第一有机衬底上的正投影。

Description

显示面板及显示装置 技术领域
本申请涉及显示领域，尤其涉及一种显示面板及显示装置。
 背景技术
随着技术的发展和人们生活品质的提高，窄边框、全面屏逐渐成为显示技术领域的发展趋势。
要实现全面屏显示就要提高显示面板的屏占比，缩小显示面板的边框尺寸。在现有技术中，如图1所示，显示面板的边框区域一般包括走线区101、有效封装区102、防裂区103、以及切割区104；显示面板由下向上包括依次层叠设置的衬底110、第一无机层120、第二无机层130、金属走线层140、有机层150、以及封装层160。在防裂区103内，第二无机层130设置为沟壑状，有机层150填充于沟壑内，用于阻断切割过程中无机膜层产生的裂纹，避免裂纹延伸至显示面板的显示区内造成显示异常。然而，切割过程中封装层160也会产生裂纹，封装层160产生的裂纹也会向显示面板的显示区内延伸，因此设计了较长的有效封装区102，来延长裂纹延伸的路径，尽量避免裂纹延伸至显示面板的显示区。较长的有效封装区102增大了显示面板边框区的尺寸，影响了显示面板的窄边框设计。
因此，现有显示面板存在边框过宽的问题，需要解决。
 技术问题
本申请提供一种显示面板及显示装置，以改进现有显示面板存在边框过宽的问题。
 技术解决方案
本申请提供一种显示面板，所述显示面板包括显示区域和边框区域，在所述边框区内，所述显示面板包括：
衬底，包括第一有机衬底、第二有机衬底、以及位于所述第一有机衬底和所述第二有机衬底之间的无机衬底；
第一无机层，形成于所述第二有机衬底上；
封装层，形成于所述第一无机层上；
以及贯穿所述第一无机层并延伸至所述第二有机衬底的沟槽，所述沟槽包括贯穿所述第一无机层的第一沟槽部和延伸至所述第二有机衬底的第二沟槽部，所述第一沟槽部在所述第一有机衬底上的正投影，落入所述第二沟槽部在所述第一有机衬底上的正投影内，且比所述第二沟槽部在所述第一有机衬底上的正投影的面积小。
在本申请提供的显示面板中，所述边框区包括走线区、有效封装区、以及切割区，所述有效封装区位于所述走线区和所述切割区之间，所述沟槽设置于所述切割区内。
在本申请提供的显示面板中，所述封装层在所述沟槽处断开。
在本申请提供的显示面板中，所述封装层在所述沟槽处连续。
在本申请提供的显示面板中，所述第二沟槽部远离所述第一沟槽部的部分的口径大于靠近所述第一沟槽部的部分的口径。
在本申请提供的显示面板中，所述第二沟槽部的底面位于所述第二有机衬底内。
在本申请提供的显示面板中，所述第二沟槽部贯穿所述第二有机衬底，所述第二沟槽部的底面与所述第二有机衬底和所述无机衬底的接触面重合。
在本申请提供的显示面板中，在所述边框区内，所述沟槽仅为一个。
在本申请提供的显示面板中，在所述边框区内，所述沟槽包括至少两个。
在本申请提供的显示面板中，存在一个所述沟槽位于切割线处。
同时，本申请提供一种显示装置，所述显示装置包括显示面板，所述显示面板包括显示区域和边框区域，在所述边框区内，所述显示面板包括：
衬底，包括第一有机衬底、第二有机衬底、以及位于所述第一有机衬底和所述第二有机衬底之间的无机衬底；
第一无机层，形成于所述第二有机衬底上；
封装层，形成于所述第一无机层上；
以及贯穿所述第一无机层并延伸至所述第二有机衬底的沟槽，所述沟槽包括贯穿所述第一无机层的第一沟槽部和延伸至所述第二有机衬底的第二沟槽部，所述第一沟槽部在所述第一有机衬底上的正投影，落入所述第二沟槽部在所述第一有机衬底上的正投影内，且比所述第二沟槽部在所述第一有机衬底上的正投影的面积小。
在本申请提供的显示装置中，所述边框区包括走线区、有效封装区、以及切割区，所述有效封装区位于所述走线区和所述切割区之间，所述沟槽设置于所述切割区内。
在本申请提供的显示装置中，所述封装层在所述沟槽处断开。
在本申请提供的显示装置中，所述封装层在所述沟槽处连续。
在本申请提供的显示装置中，所述第二沟槽部远离所述第一沟槽部的部分的口径大于靠近所述第一沟槽部的部分的口径。
在本申请提供的显示装置中，所述第二沟槽部的底面位于所述第二有机衬底内。
在本申请提供的显示装置中，所述第二沟槽部贯穿所述第二有机衬底，所述第二沟槽部的底面与所述第二有机衬底和所述无机衬底的接触面重合。
在本申请提供的显示装置中，在所述边框区内，所述沟槽仅为一个。
在本申请提供的显示装置中，在所述边框区内，所述沟槽包括至少两个。
在本申请提供的显示装置中，存在一个所述沟槽位于切割线处。
 有益效果
本申请实施例提供了一种显示面板及显示装置，该显示面板包括显示区域和边框区域，在边框区内，显示面板包括：衬底，包括第一有机衬底、第二有机衬底、以及位于第一有机衬底和第二有机衬底之间的无机衬底；第一无机层，形成于第二有机衬底上；封装层，形成于第一无机层上；以及贯穿第一无机层并延伸至第二有机衬底的沟槽，沟槽包括贯穿第一无机层的第一沟槽部和延伸至第二有机衬底的第二沟槽部，第一沟槽部在第一有机衬底上的正投影，落入第二沟槽部在第一有机衬底上的正投影内，且比第二沟槽部在第一有机衬底上的正投影的面积小。第一沟槽部和第二沟槽部形成凸形的内切结构，当对显示面板进行切割时，第一无机层产生切割裂纹并向外延伸，切割裂纹在延伸到沟槽位置时，由于沟槽贯穿第一无机层使第一无机层在沟槽处断开，切割裂纹将无法绕过沟槽继续延伸，避免了第一无机层的切割裂纹向显示面板的显示区延伸，而破坏显示面板的问题；同时，切割时封装层产生切割裂纹并向外延伸，由于凸形内切结构的沟槽的存在，使得切割裂纹难以延伸出沟槽区，避免了封装层的切割裂纹向显示面板的显示区延伸，而破坏显示面板的问题，同时达到了现有技术中防裂区和较长有效封装区的作用效果。相比于现有技术的显示面板，本申请提供的显示面板保留了走线区和切割区的宽度，去除了防裂区，减小了有效封装区的尺寸，从而减小了整个边框区的尺寸。
 附图说明
下面结合附图，通过对本申请的具体实施方式详细描述，将使本申请的技术方案及其它有益效果显而易见。
图1为现有技术的显示面板的结构示意图。
图2为本申请实施例提供的显示面板的第一种结构示意图。
图3为本申请实施例提供的显示面板的第二种结构示意图。
图4为本申请实施例提供的显示面板的第三种结构示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本申请可用以实施的特定实施例。本申请所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本申请，而非用以限制本申请。在图中，结构相似的单元是用以相同标号表示。
针对现有显示面板存在边框过宽的问题，本申请提供一种显示面板可以缓解这个问题。
在一种实施例中，如图2至图4所示，本申请提供的显示面板包括显示区域（未画出）和边框区域，边框区域包括走线区201、有效封装区202、以及切割区203，有效封装区202位于走线区201和切割区203之间；在切割区202内，显示面板包括：
衬底210，包括第一有机衬底211、第二有机衬底213、以及位于第一有机衬底211和第二有机衬底213之间的无机衬底212；
第一无机层220，形成于第二有机衬底213上；
封装层260，形成于第一无机层220上；
以及贯穿所述第一无机层220并延伸至所述第二有机衬底的沟槽270，所述沟槽包括贯穿所述第一无机层220的第一沟槽部271和位于所述第二有机衬底213内的第二沟槽部（272，273，274），所述第一沟槽部271在所述第一有机衬底211上的正投影，落入所述第二沟槽部（272，273，274）在所述第一有机衬底211上的正投影内，且比所述第二沟槽部（272，273，274）在所述第一有机衬底211上的正投影的面积小。
本申请实施例提供一种显示面板，在切割区内，该显示面板的设置有贯穿第一无机层的第一沟槽部，和延伸至第二有机衬底的第二沟槽部，且第一沟槽部在第一有机衬底上的正投影，落入第二沟槽部在第一有机衬底上的正投影内，且比第二沟槽部在第一有机衬底上的正投影的面积小，第一沟槽部和第二沟槽部形成凸形的内切结构。当对显示面板进行切割时，第一无机层产生切割裂纹并向外延伸，切割裂纹在延伸到沟槽位置时，由于沟槽贯穿第一无机层使第一无机层在沟槽处断开，切割裂纹将无法绕过沟槽继续延伸，避免了第一无机层的切割裂纹向显示面板的显示区延伸，而破坏显示面板的问题；同时，切割时封装层产生切割裂纹并向外延伸，由于凸形内切结构的沟槽的存在，使得切割裂纹难以延伸出沟槽区，避免了封装层的切割裂纹向显示面板的显示区延伸，而破坏显示面板的问题，同时达到了现有技术中防裂区和较长有效封装区的作用效果。相比于现有技术的显示面板，本申请提供的显示面板保留了走线区和切割区的宽度，通过改进切割区的设置，去除了防裂区，减小了有效封装区的尺寸，从而减小了整个边框区域的尺寸。
走线区201与显示面板的显示区域相邻设置，即有效封装区202和切割区203依次远离显示面板的显示区域，在本申请提供的实施例中，走线区201的宽度与现有技术中走线区101的宽度相同。如图2至4所示，在走线区域201内，显示面板包括：衬底210，包括第一有机衬底211、无机衬底212、以及第二无机衬底213；第一无机层220，设置于第二有机衬底213上；第二无机层230，设置于第一无机层220上；金属走线层240，设置于第二无机层230上；有机层250，设置于金属走线层240上，且覆盖金属走线层240的边缘；封装层260，设置于有机层250上，覆盖金属走线层240、有机层250、以及第二无机层230。
有效封装区202与走线区201相邻设置，且远离显示区域。如图2至4所示，在有效封装区202内，显示面板包括：衬底210，包括第一有机衬底211、无机衬底212、以及第二无机衬底213；第一无机层220，设置于第二有机衬底213上；第二无机层230，设置于第一无机层220上；封装层260，设置于第二无机层230上。在有效封装区202内，第二无机层230与封装层260紧密接触，从而形成显示面板良好的封装效果。
第一有机衬底211和第二有机衬底213的材料通常为聚乙酰胺、聚对苯二甲酸乙二醇酯等有机聚合物材料，用于实现显示面板的柔性性能；无机衬底212的材料一般为氧化硅或氮化硅，用于维持衬底的刚性和支撑性能。
第一无机层220的材料一般为氧化（SiNx）硅、氮化硅氧化硅（SiOx）或氮氧化硅（SiNO），通常采用氮化硅和氧化硅的叠层结构。氮化硅具有较强的离子阻隔能力和很好的水氧隔绝能力，能有效防止杂质在热制程中扩散到显示面板内，氧化硅具有很好的界面性能。第二无机层230与第一无机层220相类似。
金属走线层240，包括金属走线，金属走线的材料可以是金属钼、铝、铜、钛、铬、银或其混合物，240金属走线层可以是单膜层结构，如单层金属铜、单层金属铝、单层金属铜等；可以是双和膜层结构，如铝/钼叠层结构、铝/钛叠层结构、铜/钛叠层结构；也可以是三膜层结构，如钼/铝/钼叠层结构、钛/铝/钛叠层结构、钛/铜/钛叠层结构等。
有机层250，覆盖金属走线层240的边缘，用于保护金属走线。有机层250的材料包括但不限于聚酰亚胺系树脂、环氧系树脂、压克力系树脂或四氟乙烯—全氟烷氧基乙烯基醚共聚物。
封装层260，用于封装整个显示面板，防止外界杂质粒子或水氧进入显示面板，同时保护显示面板免遭外力的损伤。封装层260的材料为无机材料，同第一无机层220和第二无机层230相类似，一般为氧化硅、氮化硅氧化硅或氮氧化硅。
切割区203是显示面板预留出的用于切割的区域，包括用于对位切割的标准线—切割线204，为了保证切割精度和热影响区域等，本申请实施例中，切割区203的宽度与现有技术中切割区104的宽度相同。切割区203内沟槽270结构的设置方式不同，对显示面板的影响效果也会不同。
在第一种实施例中，如图2所示，第一沟槽部271贯穿第一无机层220，第二沟槽部272位于第二有机衬底213内，且第二沟槽部272的底部位于第二有机衬底21内。
在本实施例提供的显示面板中，第一沟槽部271贯穿第一无机层220，使得第一无机层220在第一沟槽部271位置处断开。当对显示面板沿切割线204进行切割时，第一无机层220由切割位置产生切割裂纹，该切割裂纹会向有效封装区202延伸，当切割裂纹延伸至第一沟槽部271处时，由于第一无机层220的断接，切割裂纹无法绕过沟槽继续延伸，第一无机层220产生的切割裂纹将停止在第一沟槽部271处。即以第一沟槽部271为界限，切割位置对侧区域内将不会有第一无机层220切割裂纹存在，避免了第一无机层220的切割裂纹延伸至显示面板的显示区，而破坏显示面板的问题。
另外，由于第一沟槽部271在第一有机衬底211上的正投影，落入第二沟槽部272在第一有机衬底211上的正投影内，且比第二沟槽部272在第一有机衬底211上的正投影的面积小，从而整个沟槽270形成凸形的内切结构。当对显示面板沿切割线204进行切割时，封装层260由切割位置产生切割裂纹，该切割裂纹会向有效封装区202延伸，当切割裂纹延伸至沟槽270处时，由于沟槽270凸形内切结构的存在，使得切割裂纹难以延伸出沟槽区，封装层260产生的切割裂纹将停止在沟槽270处。即以沟槽270为界限，切割位置对侧区域内将不会有封装层260切割裂纹存在，避免了封装层260的切割裂纹延伸至显示面板的显示区，而破坏显示面板的问题。
在一种实施方案中，如图2所示，封装层260在沟槽270处连续，但由于沟槽270凸形结构的存在，在封装层260的制备过程中，更多的封装层材料沉积在第二沟槽部272内，使得位于第一沟槽部271侧壁上的封装层材料减少，即使得位于第一沟槽部271侧壁上的封装层的横向厚度变薄，在封装层切割裂纹延伸到第一沟槽部271侧壁上时，切割裂纹所具有的惯性力将大大减弱，当切割裂纹通过第一沟槽部271侧壁延伸至有效封装区时，切割裂纹所具有的惯性力将不足以驱使有效封装区内封装层260产生裂纹，大大降低了封装层260切割裂纹向沟槽区域外延伸的风险；另一方面，封装层260产生的切割裂纹在沟槽270内延伸时，会同时分散成在横向上沿第二沟槽部272侧边延伸的惯性力，和纵向上沿第一沟槽部271侧边的惯性力，前者将大大分散切割裂纹的惯性力，使得封装层260产生的切割裂纹难以延伸出沟槽区，避免了封装层260的切割裂纹向显示面板的显示区延伸，而破坏显示面板的问题。
在另一种实施方案中，如图3和图4所示，封装层260在沟槽270处断开，即沟槽270内的封装层260和沟槽270外的封装层260断接，当对显示面板沿切割线204进行切割时，沟槽270内的封装层260由切割位置产生切割裂纹，延伸至沟槽270壁时就会停止，即沟槽270外的封装层260不会有切割裂纹存在，避免了封装层260的切割裂纹延伸至显示面板的显示区，而破坏显示面板的问题，进一步保证了显示面板的品质。
在一种实施方案中，如图3所示，第二沟槽部273靠近第一沟槽部271的部分的口径与远离第一沟槽部271的部分的口径相同，均大于第一沟槽部271的口径，封装层260在第一沟槽部271与第二沟槽部273的连接处断开。
在另一种实施方案中，如图4所示，第二沟槽部274远离第一沟槽部271的部分的口径大于靠近第一沟槽部271的部分的口径，第二沟槽部274与第一沟槽部271接触位置的口径可以与第一沟槽部271的口径相同，也可以比第一沟槽部271的口径大。相比于图3所示的实施方案，本实施方案中，第二沟槽部274的结构设计，使得在相同截面面积情况下，第二沟槽部274底部的口径尺寸大于第二沟槽部273底部的口径尺寸，在沟槽270内沉积封装层260材料的体积相同时，封装层260在第二沟槽部274内的厚度大于在第二沟槽部273内的厚度，这更有利于封装层260在第二沟槽部274断开；另一方面，第二沟槽部274上窄下宽的结构设计，更不利于封装层260的材料在第二沟槽部274的侧壁上沉积，也就阻断了位于第二沟槽部274底部的封装层与位于第一沟槽271上的封装层的连接，使得封装层260在第二沟槽部274断开。
在一种实施方案中，在切割区203内，沟槽270仅设置为一个。沟槽270可以设置于非切割线204处，也可以设置于切割线204处。沟槽270设置于切割线204处，当对显示面板沿切割线204进行切割时，由于切割位置处的沟槽270内没有第一无机层220，因此在第一无机层220不会产生切割裂纹，也就不存在第一无机层220的切割裂纹延伸至显示面板的显示区，而破坏显示面板的问题；切割时封装层260产生切割裂纹并向外延伸，由于凸形内切结构的沟槽的存在，使得切割裂纹难以延伸出沟槽区，避免了封装层260的切割裂纹延伸至显示面板的显示区，而破坏显示面板的问题，进一步保证了显示面板的品质。
在另一种实施方案中，在切割区203内，沟槽270设置为至少两个。沟槽270可以均设置于非切割线204处，也可以存在一个沟槽270设置于切割线204处。多个沟槽270的设计方式，进一步考虑了切割误差的影响，当显示面板的一个沟槽270对切割裂纹失去阻档效果时，靠近显示面板显示区的其他沟槽270同样能够阻挡住切割裂纹，进一步保证了显示面板的品质。
在第二种实施例中，如图3和图4所示，沟槽270同时贯穿第一无机层220和第二有机衬底213，第二沟槽部（273，274）的底面与第二有机衬底213和无机衬底212的接触面重合。
同第一种实施例相类似，在本实施例提供的显示面板中，第一沟槽部271同样贯穿第一无机层220，使得第一无机层220在第一沟槽部271位置处断开。当对显示面板沿切割线204进行切割时，第一无机层220由切割位置产生切割裂纹，该切割裂纹会向有效封装区202延伸，当切割裂纹延伸至第一沟槽部271处时，由于第一无机层220的断接，切割裂纹无法绕过沟槽继续延伸，第一无机层220产生的切割裂纹将停止在第一沟槽部271处。即以第一沟槽部271为界限，切割位置对侧区域内将不会有第一无机层220切割裂纹存在，避免了第一无机层220的切割裂纹延伸至显示面板的显示区，而破坏显示面板的问题。
不同于第一种实施例的是，第二沟槽部（273，274）贯穿第二有机衬底213，且第二沟槽部（273，274）的底面与第二有机衬底213和无机衬底212的接触面重合。第二沟槽部（273，274）的段差进一步增大，进一步保证了封装层260在第二沟槽部（273，274）处的断开效果。同样的，当对显示面板沿切割线204进行切割时，封装层260由切割位置产生切割裂纹，该切割裂纹会向有效封装区202延伸，当切割裂纹延伸至沟槽270处时，切割裂纹将停止在沟槽270处。即以沟槽270为界限，切割位置对侧区域内将不会有封装层260切割裂纹存在，避免了封装层260的切割裂纹延伸至显示面板的显示区，而破坏显示面板的问题。
以上实施例仅为示例性说明本申请提供的显示面板，本领域技术人员可以结构上述实施例综合得出其他的实施例，在此不做限定。
在本申请实施例提供的显示面板中，贯穿第一无机层220的第一沟槽部271的结构设计，代替了现有技术中显示面板的防裂区103，使显示面板边框区域的尺寸，相比于现有技术缩小了30-50um（现有技术中显示面板的防裂区103的宽度为30-50um）；同时，相比于现有技术，在防裂区103内，仅第二无机层130上设置沟壑进行有机层填充，仅能阻断切割过程中第二无机层130产生的裂纹，无法避免第一无机层120产生的裂纹延伸至显示面板的显示区内造成的显示异常，本申请实施例将第二无机层230的边界设置在有效封装区202内，避免了第二无机层230产生切割裂纹的可能，在切割区203内对第一无机层220设置沟槽结构，阻断了第一无机层220的切割裂纹的延伸路径，对第一无机层220、第二无机层230的切割裂纹的阻隔效果更加直接有效。
延伸至第二有机衬底213的第二沟槽部（272，273，274）的设计，使封装层260产生的切割裂纹停止在沟槽270处，达到了现有技术中较长有效封装区102的效果，使得本实施例提供的显示面板的有效封装区202无需做长，效封装区202的尺寸相比于现有技术缩小了100-200um；同时，相比于现有技术中将有效封装区102做长，以延长裂纹延伸的路径的方式，来避免封装区160的切割裂纹延伸至显示面板的显示区，本申请实施例提供的显示面板直接阻断了封装区260的切割裂纹的延伸路径，对封装区160的切割裂纹的阻隔效果更加直接有效。
相比于现有技术，本申请实施例提供的显示面板的整个边框区域的尺寸缩小了130-250um。
同时，本申请实施例提供了一种显示面板的制备方法，用于制备上述所示的显示面板。在一种实施例中，该显示面板的制备方法包括：
步骤S1、制备阵列基板；
步骤S2、在切割区内，刻蚀阵列基板预定位置处的第一无机层，露出第二有机衬底，形成第一沟槽部；
步骤S3、将氧气与裸露出来的第二有机衬底进行反应，对第二有机衬底进行刻蚀，形成第二沟槽部；第二沟槽部在阵列基板上的正投影，覆盖第一沟槽部在阵列基板上的正投影，且比第一沟槽部在阵列基板上的正投影的面积大；
步骤S4、制备封装层，封装层在沟槽处断开；
步骤S5、对显示面板进行切割。
本申请实施例提供一种显示面板的制备方法，该制备方法通过在切割区内的第一无机层形成贯穿第一无机层的第一沟槽部以及延伸至第二有机衬底的第二沟槽部，使得整个沟槽形成凸形的内切结构，当对显示面板进行切割时，第一无机层产生切割裂纹并向外延伸，当延伸到沟槽位置处时，由于沟槽贯穿第一无机层使第一无机层在沟槽处断开，第一无机层产生的切割裂纹将无法绕过沟槽继续延伸，避免了第一无机层的切割裂纹向显示面板的显示区延伸，而破坏显示面板的问题；同样的，切割时封装层产生切割裂纹并向外延伸，在延伸到沟槽位置时停止，避免了封装层的切割裂纹向显示面板的显示区延伸，而破坏显示面板的问题；第一沟槽部的制备，达到了现有技术中防裂区的作用效果，第二沟槽部的制备，达到了现有技术中较长有效封装区的作用效果，相比于现有技术的显示面板，通过改进切割区，去除了防裂区，减小了有效封装区的尺寸，从而减小了整个边框区域的尺寸。
在一种实施例中，第二沟槽部未贯穿第二有机衬底，第二沟槽部的底面位于第二有机衬底内。
在另一种实施例中，第二沟槽部贯穿第二有机衬底，且第二沟槽部的底面与第二有机衬底和无机衬底的接触面重合。
在一种实施例中，预定位置仅为一处，即制备得到的显示面板的沟槽仅为一个。在一种实施方案中，预定位置为切割线处；在另一种实施方案中，预定位置为非切割线处。
在另一种实施例中，预定位置包括至少两处，即制备得到的显示面板的沟槽包括至少两个。在一种实施方案中，其中一处的预定位置为切割线处；在另一种实施方案中，预定位置均为非切割线处。
本申请实施例还提供一种显示装置，该显示装置包括本申请实施例提供的显示面板，该显示面板包括显示区域和边框区域，在边框区内，显示面板包括：
衬底，包括第一有机衬底、第二有机衬底、以及位于第一有机衬底和第二有机衬底之间的无机衬底；
第一无机层，形成于第二有机衬底上；
封装层，形成于第一无机层上；
以及贯穿第一无机层并延伸至第二有机衬底的沟槽，沟槽包括贯穿第一无机层的第一沟槽部和延伸至第二有机衬底的第二沟槽部，第一沟槽部在第一有机衬底上的正投影，落入第二沟槽部在第一有机衬底上的正投影内，且比第二沟槽部在第一有机衬底上的正投影的面积小。
在一种实施例中，边框区包括走线区、有效封装区、以及切割区，有效封装区位于走线区和切割区之间，沟槽设置于所述切割区内。
在一种实施例中，封装层在沟槽处断开。
在一种实施例中，封装层在沟槽处连续。
在一种实施例中，第二沟槽部远离第一沟槽部的部分的口径大于靠近第一沟槽部的部分的口径。
在一种实施例中，第二沟槽部的底面位于第二有机衬底内。
在一种实施例中，第二沟槽部贯穿第二有机衬底，第二沟槽部的底面与第二有机衬底和无机衬底的接触面重合。
在一种实施例中，在边框区内，沟槽仅为一个。
在一种实施例中，在边框区内，沟槽包括至少两个。
在一种实施例中，存在一个沟槽位于切割线处。
根据上述实施例可知：
本申请实施例提供了一种显示面板及其制备方法、显示装置，该显示面板包括显示区域和边框区域，在边框区内，显示面板包括：衬底，包括第一有机衬底、第二有机衬底、以及位于第一有机衬底和第二有机衬底之间的无机衬底；第一无机层，形成于第二有机衬底上；封装层，形成于第一无机层上；以及贯穿第一无机层并延伸至第二有机衬底的沟槽，沟槽包括贯穿第一无机层的第一沟槽部和延伸至第二有机衬底的第二沟槽部，第一沟槽部在第一有机衬底上的正投影，落入第二沟槽部在第一有机衬底上的正投影内，且比第二沟槽部在第一有机衬底上的正投影的面积小。当对显示面板进行切割时，第一无机层产生切割裂纹并向外延伸，切割裂纹在延伸到沟槽位置时，由于沟槽贯穿第一无机层使第一无机层在沟槽处断开，切割裂纹将无法绕过沟槽继续延伸，避免了第一无机层的切割裂纹向显示面板的显示区延伸，而破坏显示面板的问题；同时，切割时封装层产生切割裂纹并向外延伸，由于凸形内切结构的沟槽的存在，使得切割裂纹难以延伸出沟槽区，避免了封装层的切割裂纹向显示面板的显示区延伸，而破坏显示面板的问题，同时达到了现有技术中防裂区和较长有效封装区的作用效果。相比于现有技术的显示面板，本申请提供的显示面板保留了走线区和切割区的宽度，通过改进切割区的设置，去除了防裂区，减小了有效封装区的尺寸，从而减小了整个边框区的尺寸。
综上所述，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (20)

  1. 一种显示面板，其中，所述显示面板包括显示区域和边框区域，在所述边框区内，所述显示面板包括：
    衬底，包括第一有机衬底、第二有机衬底、以及位于所述第一有机衬底和所述第二有机衬底之间的无机衬底；
    第一无机层，形成于所述第二有机衬底上；
    封装层，形成于所述第一无机层上；
    以及贯穿所述第一无机层并延伸至所述第二有机衬底的沟槽，所述沟槽包括贯穿所述第一无机层的第一沟槽部和延伸至所述第二有机衬底的第二沟槽部，所述第一沟槽部在所述第一有机衬底上的正投影，落入所述第二沟槽部在所述第一有机衬底上的正投影内，且比所述第二沟槽部在所述第一有机衬底上的正投影的面积小。
  2. 如权利要求1所述的显示面板，其中，所述边框区包括走线区、有效封装区、以及切割区，所述有效封装区位于所述走线区和所述切割区之间，所述沟槽设置于所述切割区内。
  3. 如权利要求1所述的显示面板，其中，所述封装层在所述沟槽处断开。
  4. 如权利要求1所述的显示面板，其中，所述封装层在所述沟槽处连续。
  5. 如权利要求1所述的显示面板，其中，所述第二沟槽部远离所述第一沟槽部的部分的口径大于靠近所述第一沟槽部的部分的口径。
  6. 如权利要求1所述的显示面板，其中，所述第二沟槽部的底面位于所述第二有机衬底内。
  7. 如权利要求1所述的显示面板，其中，所述第二沟槽部贯穿所述第二有机衬底，所述第二沟槽部的底面与所述第二有机衬底和所述无机衬底的接触面重合。
  8. 如权利要求1所述的显示面板，其中，在所述边框区内，所述沟槽仅为一个。
  9. 如权利要求1所述的显示面板，其中，在所述边框区内，所述沟槽包括至少两个。
  10. 如权利要求1所述的显示面板，其中，存在一个所述沟槽位于切割线处。
  11. 一种显示装置，其中，所述显示装置包括显示面板，所述显示面板包括显示区域和边框区域，在所述边框区内，所述显示面板包括：
    衬底，包括第一有机衬底、第二有机衬底、以及位于所述第一有机衬底和所述第二有机衬底之间的无机衬底；
    第一无机层，形成于所述第二有机衬底上；
    封装层，形成于所述第一无机层上；
    以及贯穿所述第一无机层并延伸至所述第二有机衬底的沟槽，所述沟槽包括贯穿所述第一无机层的第一沟槽部和延伸至所述第二有机衬底的第二沟槽部，所述第一沟槽部在所述第一有机衬底上的正投影，落入所述第二沟槽部在所述第一有机衬底上的正投影内，且比所述第二沟槽部在所述第一有机衬底上的正投影的面积小。
  12. 如权利要求11所述的显示装置，其中，所述边框区包括走线区、有效封装区、以及切割区，所述有效封装区位于所述走线区和所述切割区之间，所述沟槽设置于所述切割区内。
  13. 如权利要求11所述的显示装置，其中，所述封装层在所述沟槽处断开。
  14. 如权利要求11所述的显示装置，其中，所述封装层在所述沟槽处连续。
  15. 如权利要求11所述的显示装置，其中，所述第二沟槽部远离所述第一沟槽部的部分的口径大于靠近所述第一沟槽部的部分的口径。
  16. 如权利要求11所述的显示装置，其中，所述第二沟槽部的底面位于所述第二有机衬底内。
  17. 如权利要求11所述的显示装置，其中，所述第二沟槽部贯穿所述第二有机衬底，所述第二沟槽部的底面与所述第二有机衬底和所述无机衬底的接触面重合。
  18. 如权利要求11所述的显示装置，其中，在所述边框区内，所述沟槽仅为一个。
  19. 如权利要求11所述的显示装置，其中，在所述边框区内，所述沟槽包括至少两个。
  20. 如权利要求11所述的显示装置，其中，存在一个所述沟槽位于切割线处。
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