WO2019012829A1 - Tête à jet d'encre, dispositif d'enregistrement à jet d'encre et procédé de production de tête à jet d'encre - Google Patents

Tête à jet d'encre, dispositif d'enregistrement à jet d'encre et procédé de production de tête à jet d'encre Download PDF

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Publication number
WO2019012829A1
WO2019012829A1 PCT/JP2018/020648 JP2018020648W WO2019012829A1 WO 2019012829 A1 WO2019012829 A1 WO 2019012829A1 JP 2018020648 W JP2018020648 W JP 2018020648W WO 2019012829 A1 WO2019012829 A1 WO 2019012829A1
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WO
WIPO (PCT)
Prior art keywords
liquid repellent
repellent layer
nozzle
film
ink
Prior art date
Application number
PCT/JP2018/020648
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English (en)
Japanese (ja)
Inventor
下村　明久
綾子 鈴木
洋平 佐藤
陽介 中野
江口　秀幸
山田　晃久
Original Assignee
コニカミノルタ株式会社
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Publication date
Application filed by コニカミノルタ株式会社 filed Critical コニカミノルタ株式会社
Priority to JP2019528972A priority Critical patent/JPWO2019012829A1/ja
Priority to EP18831247.4A priority patent/EP3653386B1/fr
Priority to CN201880045420.8A priority patent/CN110869213B/zh
Publication of WO2019012829A1 publication Critical patent/WO2019012829A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1606—Coating the nozzle area or the ink chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/162—Manufacturing of the nozzle plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1625—Manufacturing processes electroforming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B41J2/1634—Manufacturing processes machining laser machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/165—Prevention or detection of nozzle clogging, e.g. cleaning, capping or moistening for nozzles

Definitions

  • the present invention relates to an inkjet head, an inkjet recording apparatus, and a method of manufacturing an inkjet head.
  • an inkjet recording apparatus which ejects (discharges) ink droplets from a nozzle of an inkjet head to form an image on a recording medium.
  • inkjet head when ink droplets are ejected, the ink adheres to the nozzle surface (around the ejection side opening of the nozzle) due to the influence of ink mist generated in the printer, ink bounce from the recording medium, etc.
  • ink adheres to the nozzle surface it is known that when the ink droplet is ejected from the nozzle, the ejection angle is bent under the influence of the ink adhered to the nozzle surface.
  • an ink repellent agent is coated on the nozzle surface to form an ink repellent layer as a means for suppressing the ink adhesion to the nozzle surface.
  • the ink-repellent layer a dehydration condensation reaction with a silane coupling - by ([-OH] + [HO-Si-R-F] ⁇ [H 2 O] + [O-Si-R-F]), fluorine It is known that a film is formed by bonding the contained organic functional group (see Patent Document 1).
  • the silane coupling agent forms a siloxane bond between the silanol group in the compound and the hydroxyl group on the surface of the base film, but the covalent bonding property of the base film is desirably high, and the ion bonding property of the base film is desirable. It is known that this bond does not occur if there is a strong (see Non-Patent Document 1).
  • a nozzle substrate in which an inner wall of a nozzle hole and a plurality of ink resistant protective films are formed has been proposed (see Patent Document 2).
  • a thermal oxide film having high filmability is formed, and then a metal oxide having ink resistance is formed on the inner wall, the front surface, and the back surface by a CVD (Chemical Vapor Deposition) method, and then an ejection surface A water repellent film is formed on the side.
  • CVD Chemical Vapor Deposition
  • ejection surface A water repellent film is formed on the side.
  • the ink-resistant protective film metal oxides are used, and besides tantalum pentoxide, any of hafnium oxide, niobium oxide, titanium oxide and zirconium oxide is mentioned. It is because these metal oxides have high resistance to alkaline ink (ejection liquid).
  • the water repellent film one having a fluorine-containing organic silicon compound as a main component is preferable, and the hydroxyl group on the surface of the ink protective film is strongly bonded to a hydrolyzable group such as methoxy group of the fluorine-containing organic silicon compound, This is because the adhesion between the ink-resistant protective film and the water-repellent film formed on the surface is improved.
  • a wiping means which wipes off the ink of the liquid repellent layer (water repellent film) of the nozzle substrate of the ink jet head.
  • the metal element contained in the metal oxide film such as tantalum pentoxide, hafnium oxide, niobium oxide, titanium oxide, or zirconium oxide used for the protective film is a transition metal element of Group 4 or 5 . It is known that these metal elements have a very stable oxidation state, and that the outermost shell orbit is filled with electrons and the internal orbit is empty. Therefore, as shown in the following Table I, the bonding of these metal oxide films is stronger than the oxide films of typical elements such as SiO 2 as shown in the following Table I, and the reaction of the silane coupling agent (liquid repellent agent, water repellent agent) Sex is low.
  • the silane coupling agent liquid repellent agent, water repellent agent
  • liquid repellence (water repellency, ink repellency) fell in wiping off.
  • An object of the present invention is to improve the reactivity of the ejection surface side of the nozzle substrate with the liquid repellent agent and the resistance to ink, and to prevent the reduction of the liquid repellency.
  • the ink jet head of the invention is A base portion in which a nozzle for ejecting ink is formed; A liquid repellent layer base film formed on the injection surface side of the base portion and having a silicon carbide oxide film; And a liquid repellent layer formed on the injection surface side of the liquid repellent layer base film.
  • the invention according to claim 2 is the inkjet head according to claim 1 in which
  • the liquid repellent layer base film is A first coordinate point having an atomic ratio of Si: C: O of 1: 1: 0,
  • An atomic ratio of Si: C: O is in a range surrounded by a fourth coordinate point having 1: 2: 0, and the first coordinate point and the fourth coordinate point are
  • the silicon carbide oxide film has a composition in a range excluding the connecting line.
  • the invention according to claim 3 is the inkjet head according to claim 1 or 2, wherein The liquid repellent layer base film is formed on the emission surface side of the base portion and the inner wall of the nozzle.
  • the invention according to claim 4 is the ink jet head according to any one of claims 1 to 3.
  • a flow path protection film is formed in the flow path of the nozzle.
  • the invention according to claim 5 is the ink jet head according to any one of claims 1 to 4 in which The liquid repellent underlayer has a thickness of 50 nm or less.
  • the invention according to claim 6 is the inkjet head according to any one of claims 1 to 5,
  • the base portion is made of silicon, a metal material or a resin material.
  • the inkjet recording device of the invention according to claim 7 is An inkjet head according to any one of claims 1 to 6, And a cleaning unit for wiping the ink on the side of the ejection surface of the liquid repellent layer.
  • a method of manufacturing an ink jet head is as follows.
  • the invention according to claim 9 is the method for manufacturing an ink jet head according to claim 8.
  • the liquid repellent layer base film is A first coordinate point having an atomic ratio of Si: C: O of 1: 1: 0, A second coordinate point having an atomic ratio of Si: C: O of 3: 2: 2, A third coordinate point having an atomic ratio of Si: C: O of 1: 2: 2, An atomic ratio of Si: C: O is in a range surrounded by a fourth coordinate point having 1: 2: 0, and the first coordinate point and the fourth coordinate point are
  • the silicon carbide oxide film has a composition ratio in a range excluding a connecting line.
  • the invention according to claim 10 is the method for manufacturing an ink jet head according to claim 9.
  • the outermost surface layer forms a liquid repellent layer base film having the composition ratio within the above range by adding oxygen to the silicon carbide film or the silicon carbide oxide film additionally.
  • the invention according to claim 11 is the method for manufacturing an ink jet head according to claim 10,
  • plasma treatment in an atmosphere containing oxygen gas is used.
  • the invention according to claim 12 is the method for manufacturing an ink jet head according to claim 9.
  • the outermost surface layer forms a liquid repellent layer base film having the composition ratio within the above range by adding carbon to the silicon oxide film or the silicon carbide oxide film.
  • the invention according to claim 13 is the method for manufacturing an ink jet head according to claim 12. Plasma treatment in an atmosphere containing a hydrocarbon gas is used for the addition of carbon.
  • the invention according to claim 14 is the method for manufacturing an ink jet head according to any one of claims 8 to 13, In the liquid repellent layer base film forming step, the liquid repellent layer base film is formed on the emission surface side of the base portion and the inner wall of the nozzle.
  • the invention according to claim 15 is the method for manufacturing an ink jet head according to any one of claims 8 to 14, The flow path protective film formation process of forming a flow path protective film in the flow path of the said nozzle is included.
  • the invention according to claim 16 is the method for manufacturing an ink jet head according to any one of claims 8 to 15, In the nozzle forming step, after the liquid repellent layer underlayer and the liquid repellent layer are formed on the substrate portion, the substrate portion, the liquid repellent layer underlayer, and the liquid repellent layer are ablated by excimer laser processing. Forming the nozzle.
  • the invention according to claim 17 is the method for manufacturing an ink jet head according to any one of claims 8 to 16, In the liquid repellent layer base film forming step, the liquid repellent layer base film having a thickness of 50 nm or less is formed.
  • the invention according to claim 18 is the method for manufacturing an ink jet head according to any one of claims 8 to 17,
  • the base portion is made of silicon, a metal material or a resin material.
  • the reactivity of the ejection surface side of the nozzle substrate with the liquid repellent agent and the resistance to ink can be improved, and a decrease in liquid repellency can be prevented.
  • FIG. 1 is a schematic front view of a configuration of an ink jet recording apparatus according to an embodiment of the present invention.
  • FIG. 6 is a schematic configuration diagram of the head unit as viewed from the upstream side of the conveyance direction of the recording medium above the conveyance surface of the image forming drum.
  • FIG. 6 is a bottom view of the head unit as viewed from the conveyance surface side of the image forming drum.
  • FIG. 2 is a perspective view of an image forming drum.
  • FIG. 6 is a view of the image forming drum as seen from the same front side as FIG. 1 as viewed from the rear side. It is a figure which shows typically the cross-sectional shape of an inkjet head. It is a typical sectional view of the 1st nozzle substrate of an embodiment.
  • FIG. It is a figure which shows the range of the composition ratio of the preferable silicon carbide oxide film in the triangular figure which shows atomic number ratio of Si, C, and O.
  • FIG. It is a figure which shows the arbitrary coordinate point in the triangular diagram which shows atomic ratio of Si, C, and O.
  • FIG. It is a flowchart which shows a 1st nozzle board
  • FIG. It is a figure which shows the coordinate point of the 1st, 2nd sample in the triangular diagram which shows atomic number ratio of Si, C, and O.
  • FIG. It is a figure which shows the coordinate point and contact angle of the 3rd-11th sample in the triangular figure which shows the atomic ratio of Si, C, and O.
  • FIG. 1 is a schematic view of the configuration of an inkjet recording apparatus 1 according to the present embodiment as viewed from the front.
  • the inkjet recording apparatus 1 includes a medium supply unit 10, an image forming unit 20, a medium discharge unit 30, a control unit (not shown), and the like.
  • the recording medium R stored in the medium supply unit 10 is conveyed to the image forming unit 20 based on the control operation of the control unit, and is discharged to the medium discharge unit 30 after an image is formed.
  • the medium supply unit 10 includes a medium supply tray 11, a transport unit 12, and the like.
  • the medium supply tray 11 is a plate-like member provided so as to be capable of mounting one or more recording media R.
  • the medium supply tray 11 moves up and down according to the amount of the recording medium R placed thereon, and the top one of the recording medium R is held at the conveyance start position by the conveyance unit 12.
  • various kinds of media which can be curved and carried on the outer peripheral surface of the image forming drum 21 such as printing paper of various thicknesses, cells, films and fabrics are used.
  • the transport unit 12 includes a plurality of (for example, two) rollers 121 and 122, an annular belt 123 supported by the rollers 121 and 122 on the inner side, and the recording medium R mounted on the medium supply tray 11. And a supply unit (not shown) for delivering the top one to the belt 123.
  • the conveyance unit 12 conveys the recording medium R delivered on the belt 123 by the supply unit in accordance with the circumferential movement of the belt 123 by the rotation of the rollers 121 and 122 and sends the recording medium R to the image forming unit 20.
  • the image forming unit 20 includes an image forming drum 21, a delivery unit 22, a temperature measuring unit 23, a head unit 24, a heating unit 25, a delivery unit 26, a cleaning unit 27 (see FIGS. 3A and 3B) and the like.
  • the image forming drum 21 has a cylindrical outer peripheral shape, carries the recording medium R on the outer peripheral surface (conveying surface), and conveys the recording medium R along a conveyance path according to the rotation operation.
  • a heater is provided on the inner surface side of the image forming drum 21 and can heat the conveyance surface so that the recording medium R placed on the conveyance surface has a predetermined set temperature.
  • the delivery unit 22 delivers the recording medium R delivered from the transport unit 12 to the image forming drum 21.
  • the delivery unit 22 is provided at a position between the conveyance unit 12 of the medium supply unit 10 and the image forming drum 21.
  • the delivery unit 22 has a claw portion 221 which holds one end of the recording medium R sent by the conveyance portion 12, a cylindrical delivery drum 222 which guides the recording medium R held by the claw portion 221, and the like.
  • the recording medium R acquired from the transport unit 12 by the claws 221 moves along the outer peripheral surface of the delivery drum 222 which rotates when sent to the delivery drum 222, and is guided to the outer peripheral surface of the image forming drum 21 as it is Passed
  • the temperature measuring unit 23 is positioned between the recording medium R being placed on the conveyance surface of the image forming drum 21 and the position at which the recording medium R faces the ink ejection surface (ejection surface) of the first head unit 24.
  • the surface temperature of the recording medium R to be conveyed (the temperature of the surface opposite to the surface in contact with the conveyance surface) is measured.
  • a radiation thermometer is used as the temperature sensor of the temperature measurement unit 23, and the surface temperature of the recording medium R not in contact with the temperature measurement unit 23 (radiation thermometer) is measured by measuring the intensity distribution of infrared rays. .
  • temperatures at a plurality of points along a width direction (direction perpendicular to the surface of FIG.
  • a plurality of sensors are arrayed so as to be able to measure, and measurement data is output to each control unit at an appropriate timing set in advance and controlled.
  • the head unit 24 is disposed at each position of the recording medium R from a plurality of nozzle openings (nozzle holes) provided on the ink ejection surface facing the recording medium R in accordance with the rotation of the image forming drum 21 carrying the recording medium R.
  • An image is formed by ejecting (discharging) ink droplets.
  • four head units 24 are spaced apart from the outer peripheral surface of the image forming drum 21 by a preset distance, and are arranged at predetermined intervals.
  • the four head units 24 respectively output C (cyan) M (magenta) Y (yellow) K (black) inks of four colors.
  • C, M, Y, and K color inks are respectively ejected in order from the upstream side in the transport direction of the recording medium R.
  • Any ink may be used as the ink, but a normal liquid ink is used here, and the ink is fixed to the recording medium R by the evaporation and drying of the water by the operation of the heating unit 25.
  • each of the head units 24 is a line head capable of forming an image over the image forming width on the recording medium R by combination with the rotation of the image forming drum 21.
  • the heating unit 25 heats the surface of the recording medium R to be conveyed.
  • the heating unit 25 has, for example, a heating wire or the like, generates heat in response to energization, heats air, and heats the recording medium R by irradiating infrared rays.
  • the heating unit 25 is in the vicinity of the outer peripheral surface of the image forming drum 21 and after the ink is ejected from the head unit 24 onto the recording medium R conveyed by the rotation of the image forming drum 21, the recording medium R is an image.
  • the recording medium R is disposed so as to be able to be heated before it passes from the forming drum 21 to the delivery unit 26.
  • the ink ejected from the nozzle of the head unit 24 is dried to fix the ink on the recording medium R.
  • the delivery unit 26 conveys the recording medium R having the ejected and fixed ink from the image forming drum 21 to the medium discharge unit 30.
  • the delivery unit 26 includes a plurality of (for example, two) rollers 261 and 262, an annular belt 263 supported by the rollers 261 and 262 on the inner side, a cylindrical delivery roller 264, and the like.
  • the delivery unit 26 guides the recording medium R on the image forming drum 21 onto the belt 263 by the delivery roller 264, and moves the delivered recording medium R together with the belt 263 that circulates along with the rotation of the rollers 261 and 262. And transport to the medium discharge unit 30.
  • the cleaning unit 27 cleans the ink ejection surface of the head unit 24.
  • the cleaning unit 27 is disposed adjacent to the image forming drum 21 in the width direction. By moving the head unit 24 in the width direction, the ink ejection surface of the head unit 24 is set at the cleaning position by the cleaning unit 27.
  • the medium discharge unit 30 stores the recording medium R after image formation sent from the image forming unit 20 until it is taken out by the user.
  • the medium discharge unit 30 has a plate-like medium discharge tray 31 or the like on which the recording medium R conveyed by the delivery unit 26 is placed.
  • FIG. 2A and 2B are diagrams showing the configuration of the head unit 24.
  • FIG. FIG. 2A is a schematic view of the head unit 24 as viewed from the upstream side of the conveyance direction of the recording medium R above the conveyance surface of the image forming drum 21.
  • FIG. 2B is a bottom view of the head unit 24 as viewed from the conveyance surface side of the image forming drum 21.
  • the head unit 24 has a plurality of inkjet heads 241.
  • 16 inkjet heads 241 are provided in one head unit 24, it is not limited to this.
  • the sixteen inkjet heads 241 are included in the eight inkjet modules 242 in sets of two each.
  • the ink jet module 242 is adjusted and fixed at an appropriate relative position by a fixing member 245 here in a zigzag form.
  • the fixing member 245 is supported and held by the carriage 246.
  • the carriage 246 holds the first sub tank 243 and the second sub tank 244 together, and the ink is supplied from the first sub tank 243 and the second sub tank 244 to the respective inkjet heads 241.
  • the carriage 246 is movable in the width direction on the image forming drum 21 separately for each of the four head units 24.
  • the inkjet heads 241 each have a plurality of nozzles 2411.
  • the inkjet head 241 ejects ink (droplets) from the openings (nozzle holes) of the plurality of nozzles 2411 provided on each bottom surface (nozzle opening surface 241 a), and is carried on the conveyance surface of the image forming drum 21.
  • the ink droplets are landed on the recording medium R.
  • the inkjet head 241 has a two-dimensional array pattern in which the openings are arranged in two lines in the transport direction, the inkjet head 241 is not limited thereto.
  • the openings may be arranged in any suitable one-dimensional or two-dimensional array pattern.
  • the arrangement range of these openings covers the recordable width of the recording medium R carried on the transport surface in the width direction with the entire 16 inkjet heads 241, and image formation in a one-pass method while the head unit 24 is fixed. Is made possible.
  • the nozzle opening surfaces 241 a of the sixteen inkjet heads 241 are covered with a liquid repellent layer (water repellent layer, ink repellent layer) 43 (see FIG. 5).
  • FIGS. 3A and 3B are diagrams for explaining the configuration of the cleaning unit 27.
  • FIG. FIG. 3A is a perspective view of the image forming drum 21.
  • FIG. FIG. 3B is a view when the image forming drum 21 is transmitted from the same front side as FIG. 1 and viewed from the rear side.
  • the cleaning unit 27 wipes and removes ink and other contaminants (collectively, foreign substances) adhering to the nozzle opening surface 241 a of the inkjet head 241 after ink ejection and maintenance relating to image formation.
  • the cleaning unit 27 is arranged in the width direction with respect to the image forming drum 21 and is arranged so that the ink ejection surface can be cleaned when the head unit 24 moves in the width direction. .
  • the cleaning unit 27 includes a wiping member 271, an elastic member 272, an unwinding roller 273, a winding roller 274, and the like. These configurations are separately provided for the plurality of head units 24, but may be provided commonly for the plurality of head units 24 so that the cleaning unit 27 can be moved in the transport direction.
  • the wiping member 271 is a long cloth-like sheet member, and the length (width) in the width direction of the wiping member 271 can cover the ink ejection surface (the whole of at least a plurality of nozzle opening surfaces 241 a).
  • a member which can easily absorb the moisture of the ink and has a hardness lower than at least the material of the ink ejection surface is preferable, and a member which does not easily damage the liquid repellent layer is preferable.
  • polyester, an acryl, a polyamide, a polyurethane etc. are mentioned, for example. These members may form a woven or non-woven fabric. In particular, it is more preferable to have a high water absorbability and to which the liquid is easily absorbed even when the pressing force at the time of contact is low.
  • the wiping member 271 may have a blade-like structure.
  • the elastic member 272 is opposed to the ink ejection surface with the wiping member 271 interposed therebetween, and the size of the surface (pressing surface) opposed to the ink ejection surface is formed so as to cover the entire ink ejection surface.
  • the elastic member 272 is movable substantially perpendicular to the ink ejection surface.
  • a material of the elastic member 272 for example, a material such as sponge (foamed resin) or rubber which does not damage the nozzle even when pressed against the nozzle opening surface 241a is used.
  • the wiping member 271 is brought into contact with the nozzle opening surface 241a as a whole in a substantially parallel state by moving the elastic member 272 in a direction approaching the nozzle opening surface 241a (ink ejection surface).
  • the relative position (distance) between the elastic member 272 and the ink ejection surface is fixed here, and accordingly, the pressing of the wiping member 271 against the ink ejection surface is performed.
  • the pressure is kept constant each time within the range of the influence of the separation of the liquid repellent layer on the surface of the nozzle opening surface 241a.
  • the relative position is determined so that the pressing force at this time has an appropriate size for wiping the ink on the ink ejection surface.
  • the pressing force may be variable, and in this case, the maximum value is determined according to the relationship between the surface shape of the nozzle opening surface 241 a and the wiping member 271 as described later.
  • the wiping member 271 is unwound from the unwinding roller 273 and taken up by the winding roller 274 as the winding operation is performed by the winding roller 274. During this time, the elastic member 272 presses the wiping member 271 substantially equally against the ink ejection surface, whereby the new (no ink attached) wiping member 271 in contact with the ink ejection surface is the nozzle opening surface 241a (ink Wipe off the ink etc. adhering to the ejection surface. When all the wiping members 271 are unwound from the unwinding roller 273, the wiping members 271 can be easily replaced.
  • FIG. 4 is a view schematically showing the cross-sectional shape of the inkjet head 241. As shown in FIG.
  • Each ink jet head 241 is a bend mode ink jet head formed by laminating a plurality of plates (substrates) as shown in FIG. 4, although not particularly limited. Specifically, in each inkjet head 241, the nozzle substrate 40A, the pressure chamber substrate 50, the diaphragm 60, the spacer substrate 70, and the wiring substrate 80 are stacked in order from the nozzle opening surface 241a (ink ejection surface, downward) side upwards It is done.
  • the ink supplied from the first sub tank 243 and the second sub tank 244 flows into the pressure chamber 51 of the pressure chamber substrate 50 through the ink flow path communicated with the wiring substrate 80, the spacer substrate 70, and the diaphragm 60.
  • the pressure chamber 51 is in contact with the piezoelectric element portion 71 of the spacer substrate 70 via the diaphragm 60 and is conducted to the nozzle 2411.
  • a control signal from the control unit of the inkjet recording apparatus 1 is input to the piezoelectric element unit 71 via the wiring of the wiring substrate 80, and the piezoelectric element unit 71 physically vibrates, whereby an ink flow path such as the wiring substrate 80 is obtained.
  • the inflow of the ink into the pressure chamber 51 and the outflow of the ink from the inside of the pressure chamber 51 to the nozzle 2411 of the nozzle substrate 40A are performed. Then, the ink in the nozzle 2411 is ejected as an ink droplet from the opening (nozzle hole) on the nozzle opening surface 241 a (emission surface) side, and the ink droplet is landed on the recording medium R.
  • an intermediate substrate (intermediate layer) having a flow path that leads from the pressure chamber 51 to the nozzle 2411 may be provided between the nozzle substrate 40A and the pressure chamber substrate 50.
  • FIG. 5 is a schematic cross-sectional view of the nozzle substrate 40A.
  • the lower side of the drawing is the (ink) ejection surface side (head outer side), and the upper side is similarly expressed as the flow path side (head inner side, pressure chamber side).
  • the nozzle substrate 40 ⁇ / b> A has a base portion 41, a liquid repellent layer base film 42 ⁇ / b> A, and a liquid repellent layer 43.
  • the material of the base portion 41 is silicon (silicon), metal such as SUS (Steel Use Stainless), nickel, metal containing nickel, resin such as polyimide, or the like.
  • the nozzle 2411 is a nozzle of the ink formed in the base material part 41, and contains the flow path of an ink, and the nozzle hole by the side of the injection
  • the liquid repellent layer foundation film 42A is provided on the ejection surface side where the cleaning of the ink is performed by the cleaning section 27 at the time of maintenance of the base material section 41, and is an underlayer on the flow path (base material section 41) side of the liquid repellent layer 43. is there.
  • the material of the liquid repellent layer base film 42A is silicon carbide oxide (silicon carbide oxide film) Si a C b O c (a, b, c: number of atoms).
  • the liquid repellent layer 43 is provided on the ejection surface side of the liquid repellent layer base film 42A, and has, for example, a structure having a perfluoro carbon chain, and has liquid repellency (water repellency, ink repellency).
  • the silicon carbide oxide film is selected as the liquid repellent underlayer film 42A because of the alkali resistance, the durability against chemical mechanical polishing (CMP), and the fixability of the liquid repellent (siloxane It is in the point which can make compatible and (bond can be formed).
  • the durability against chemical mechanical polishing refers to the durability against film loss of the liquid repellent underlayer film by the ink wiping of the cleaning unit 27.
  • the conventional liquid repellent layer base film of the nozzle substrate is repelled by wiping the ink on the ejection surface of the nozzle substrate with a cloth of the cleaning unit and performing maintenance under alkaline ink usage.
  • Silicon carbide is known to have the highest hardness next to DLC (diamond-like carbon) as a material, and is a material that is very difficult to etch by alkali. Therefore, by using a silicon carbide oxide film in which carbon is introduced into silicon oxide as the liquid repellent layer base film 42A, the alkali resistance can be improved while maintaining the reactivity with the silane coupling agent on the nozzle surface. it can.
  • polyester or synthetic fiber is used as the recording medium R, an aqueous ink such as a disperse dye ink or a sublimation ink is used, but an additive such as a dispersant exhibits alkalinity.
  • the dispersion of the pigment molecules is controlled by the pH of the ink.
  • the hydrolysis of the liquid repellent layer is promoted, or the etching of the liquid repellent layer base film is promoted to promote the removal of the liquid repellent material. Therefore, the liquid repellent formed by the conventional silane coupling The stratum was unreliable.
  • a cloth coated with an alkaline pretreatment agent for improving color development may be used.
  • the surface of the fabric is made alkaline by raising the surface. The treatment agent may affect the reliability of the liquid repellency of the subsequent inkjet head surface.
  • the silicon carbide oxide film has high chemical stability and can improve the alkali resistance.
  • the composition ratio of the silicon carbide oxide film Si a C b O c ) excellent in alkali resistance will be described.
  • FIG. 6A is a diagram showing the range of the composition ratio of a preferred silicon carbide oxide film in a triangular diagram showing the atomic ratio of Si, C, and O.
  • FIG. 6B is a diagram showing an arbitrary coordinate point P0 in a triangular diagram showing atomic ratio of Si, C and O.
  • an equilateral triangle having three vertexes whose composition ratio (atomic number ratio) of silicon (silicon) Si, carbon C, and oxygen O in the silicon carbide oxide film is the composition of only Si, C, and O On the triangle of.
  • vertices corresponding to only Si, C and O are respectively VSi, VC and VO.
  • the coordinates of the coordinate point P0 are: vertex VO ⁇ length ⁇ on the side of vertex VSi, vertex VSi ⁇ length ⁇ on the side of vertex VC, and vertex VSi This is represented by the length ⁇ on the side of the vertex VO.
  • a preferable composition ratio a: b: c of the silicon carbide oxide film Si a C b O c of the liquid repellent layer base film 42A will be described with reference to FIG. 6A.
  • the lines L1 to L6 on the triangle diagram showing the composition of Si, C and O will be described.
  • the coordinate point corresponding to silicon dioxide SiO 2 is PSiO 2
  • the coordinate point corresponding to silicon carbide SiC is PSiC (P 1)
  • the coordinate point corresponding to silicon carbide 2 SiC is PSiC 2 (P 4) Do.
  • the line L1 is a line connecting the coordinate point PSiO 2 and the coordinate point P1, and the composition thereof is SiC 1-t O 2 t (0 ⁇ t ⁇ 1).
  • the line L2 is a line connecting the coordinate point PSiO 2 and the coordinate point P4, and the composition thereof is SiC 2 (1-s) O 2 s (0 ⁇ s ⁇ 1).
  • the line L3 is a line connecting the coordinate point PSiO 2 and the vertex VC.
  • the ratio of carbon is higher than that of oxygen (c ⁇ b).
  • oxygen c ⁇ b
  • the ratio of carbon: oxygen (c / b) is preferably 0 ⁇ c / b ⁇ 1.
  • the intermediate composition that is, the state of x ⁇ 2 in SiO x stoichiometrically exists metastablely.
  • the range of x> 2 is a so-called peroxide, which is unstable and does not exist as a film.
  • the ratio of silicon to oxygen (c / a) is preferably 0 ⁇ c / a ⁇ 2.
  • the silicon: carbon ratio is more carbon rich than line L1 and more preferably silicon rich than line L2. Since silicon and carbon are the same Group 14 element and have the same valence, substitution in the compound is possible. From the viewpoint of alkali resistance and chemical mechanical polishing resistance, silicon and carbon are preferably equivalent or carbon rich (b / a ⁇ 1).
  • sp hybrid orbitals forming a covalent bond consist of 3s orbitals and 3p orbitals in the case of silicon atoms
  • sp hybrid orbitals consist of 2s orbitals and 2p orbitals in the case of carbon atoms. Bonding distance is short. Therefore, when the ratio of carbon is excessively increased, the film stress of the liquid repellent layer base film 42A becomes large, and the adhesion between the base portion 41 and the liquid repellent layer base film 42A is lowered.
  • the hydroxyl group that reacts with the silane coupling agent at the time of formation of liquid repellent layer 43 is a silicon atom rather than a hydroxyl group bonded to a carbon atom () C—OH)
  • the proportion of the localized charge is larger in the hydroxyl group ( ⁇ Si-OH) bonded to the group, and the reactivity with the silane coupling agent is dominant. Therefore, the proportion of carbon needs to be limited (b / a ⁇ 2). From these findings, the inventors believe that it is preferable that the carbon is richer than the line L1 and silicon richer than the line L2.
  • the composition ratio of the area surrounded by the coordinate point P4 having the composition ratio a: b: c 1: 2: 0 and excluding the line segment connecting the coordinate point P1 and the coordinate point P4 .
  • FIG. 7 is a flowchart showing the first nozzle substrate manufacturing process.
  • FIG. 8A is a cross-sectional view schematically showing the base portion 41 before nozzle processing.
  • FIG. 8B is a cross-sectional view schematically showing the base portion 41 on which the liquid repellent layer base film 42A is formed.
  • FIG. 8C is a cross-sectional view schematically showing the base portion 41 on which the liquid repellent layer 43 is formed.
  • FIG. 8D is a cross-sectional view schematically showing the base portion 41 to which the protective sheet 45 is attached.
  • FIG. 8E is a cross-sectional view schematically showing the base portion 41 in which the nozzle 2411 is formed.
  • FIG. 8F is a cross-sectional view schematically showing the nozzle substrate 40A from which the protective sheet 45 has been peeled.
  • the manufacturer prepares the base portion 41 to be the base member (step ST11).
  • the substrate portion 41 is a polyimide (PI) film.
  • PI polyimide
  • a resin such as PET (PolyEthylene Terephthalate: polyethylene terephthalate), PPS (Poly Phenylene Sulfide: polyphenylene sulfide) can be used, and more specifically, a Kapton film made by Dupon Ube Industries, Inc.'s Upilex 75S, TORAY's Tolerina, etc. may be used.
  • Polyimide is excellent in heat resistance, and can be subjected to an annealing process at a high temperature after formation of the liquid repellent layer base film 42A, or after formation of the liquid repellent layer 43, and the like.
  • PPS is excellent in dimensional stability, and can reduce variation in nozzle array length of the inkjet head 241.
  • the manufacturer forms a silicon carbide oxide film having the composition ratio of the preferable range shown in FIG. 6A on the injection surface side of the base material portion 41 prepared in step ST11 A liquid underlayer film 42A is formed (step ST12).
  • the silicon carbide oxide film By using the silicon carbide oxide film, the liquid repellent layer base film 42A can be made excellent in alkali resistance and durability against chemical mechanical polishing. Further, a siloxane bond can be formed, and the liquid repellent layer base film 42A can be made excellent in the fixability of the liquid repellent agent.
  • step ST12 As a method for forming a silicon carbide oxide film in step ST12, (1) High frequency discharge plasma CVD (Chemical Vapor Deposition) using tetraethyl orthosilicate (TEOS), trimethylsilane (TMS), silane, hydrocarbon gas such as methane, ethane, or acetylene, argon, oxygen gas, etc. Growth) Deposition or PIG (Penning Ionization Gauge) plasma CDV, (2) Sputter deposition in an atmosphere of argon gas, oxygen gas, methane, etc. using Si, SiC, SiO 2 targets, (3) Coating method using a solution material containing silica (polysilazane type), The film can be formed using
  • the plasma processing may be performed on the base portion 41 as the film forming pretreatment of the liquid repellent layer base film 42A in step ST12.
  • plasma treatment plasma treatment with oxygen gas or argon gas or a mixed gas thereof can be performed.
  • oxygen gas or argon gas or a mixed gas thereof can be performed.
  • the contamination removal effect or the surface activation effect on the surface of the base portion 41 can be obtained, and the adhesion between the liquid repellent layer base film 42A and the base portion 41 can be increased.
  • reverse sputtering may be performed on the base portion 41.
  • the base material portion 41 is sputtered using oxygen gas or argon gas or a mixed gas thereof.
  • step ST12 hydrogenation may be performed on the material gas.
  • stress and film hardness may be improved, and scratch resistance may be improved.
  • step ST12 after a silicon oxide film or a silicon carbide oxide film is formed as the liquid repellent layer base film 42A, carbon may be introduced to the surface of the film.
  • carbon introduction plasma processing containing hydrocarbon gas such as methane and ethane can be used.
  • an ion implantation method, an ion shower doping method or the like can be used.
  • the profile of the carbon composition ratio in the depth direction of the underlayer pulls the tail from the surface of the liquid repellent underlayer, but the liquid repellent underlayer surface (uppermost surface layer) is It can be carbonized and controlled so as to obtain a desired composition ratio (preferred range shown in FIG. 6A).
  • step ST12 the number of siloxane bond sites on the surface (-OH group) is subjected to oxidation treatment or the like during or after film formation for the purpose of further improving the fixability between the silicon carbide oxide film and the liquid repellent agent. It may be configured to perform additional processing to increase the Specifically, oxygen is added during the formation of the silicon carbide oxide film as the liquid repellent underlayer film 42A, or the surface is oxidized by oxygen plasma treatment after the silicon carbide film or silicon carbide oxide film is formed. It can be mentioned.
  • the film forming method and the pretreatment method of the liquid repellent layer base film 42A described above may be appropriately combined and used, and are not limited to the method described above.
  • the silicon carbide oxide film in step ST12 is preferably amorphous or single crystal.
  • the crystal grain boundary becomes an etching site at the time of alkali immersion and etching progresses selectively to form pinholes, and etching may progress to the base material of the base.
  • amorphous or single crystal there is no grain boundary to be an etching site, so that etching does not progress selectively even in alkali immersion, and a liquid repellent layer base film having higher alkali resistance (nozzles)
  • a flow path protective film can be formed on the inner wall.
  • the manufacturer forms the liquid repellent layer 43 on the ejection surface side (surface) of the liquid repellent layer base film 42A formed in step ST12 (step ST13).
  • the liquid repellent layer 43 may be formed by coating or depositing a silane coupling agent as a liquid repellent agent having a perfluoro carbon chain.
  • a silane coupling agent OPTOOL manufactured by Daikin Industries, WR4 manufactured by Merck, FG-5080 manufactured by Fluoro Technology, FG-5010, or the like can be used.
  • Plasma treatment may be performed as pretreatment for forming the liquid repellent layer 43 in step ST13.
  • plasma treatment plasma treatment with oxygen gas or argon gas or a mixed gas thereof can be performed.
  • the contamination removal effect or the surface activation effect of the surface of the liquid repellent layer base film 42A is obtained, and the reactivity and adhesion between the liquid repellent layer base film 42A and the liquid repellent layer 43 are improved. Alkali resistance and durability against chemical mechanical polishing can be increased.
  • the protective sheet 45 has a base sheet 45a and an adhesive layer 45b on the base sheet 45a.
  • the base sheet 45a can be made of polyimide, PET, PPS or the like.
  • the adhesive layer 45 b is adhered to the ejection surface side of the liquid repellent layer 43.
  • the manufacturer processes the nozzle on the flow path side (back surface) of the base portion 41 to which the protective sheet 45 is attached in step ST14, the liquid repelling layer base film 42A, and the liquid repelling layer 43.
  • the nozzle 2411 is formed (step ST15).
  • step ST15 laser irradiation is performed from the back surface of the base portion 41, and the nozzle 2411 is formed.
  • a silicon carbide oxide film as the liquid repellent layer base film 42A, laser processing of the liquid repellent layer base film 42A can be performed with high accuracy.
  • step ST15 when nozzle processing is performed using a KrF excimer laser as the laser light source, the wavelength is 248 nm, that is, the photon energy is 5.0 eV.
  • the band gap of the silicon carbide silicon oxide film is narrower than that of SiO 2 due to the effect of carbon introduction (the band gap of SiO 2 is 8 to 9 [eV], SiC Band gap is about 3 [eV]. Therefore, the absorption efficiency of the KrF excimer laser is improved, the liquid repellent layer base film 42A is also ablated at the time of nozzle processing, generation of burrs is suppressed, and the processing accuracy of the end of the nozzle 2411 is improved.
  • the film thickness of the liquid repellent layer base film 42A is preferably 100 nm or less, more preferably 50 nm or less, and further preferably 20 nm or less.
  • the film thickness of the liquid repellent layer foundation film 42A is thin, laser ablation is easy to occur, and burrs hardly remain.
  • the adhesion between the protective sheet 45 and the surface of the liquid repellent layer 43 of the adhesive layer 45 b of the protective sheet 45 is 0.1 to 0. 0 when the protective sheet 45 and the base portion 41 are stretched in the opposite direction by 180 degrees. It may be 7 [N / 10 mm], more preferably 0.15 to 0.64 [N / 10 mm].
  • the base material part 41 consists of metal materials, such as SUS
  • a picosecond pulse laser for a laser light source.
  • generation of burrs and dross can be suppressed with respect to metal, and a nozzle 2411 having a good shape can be formed.
  • the manufacturer peels off the protective sheet 45 from the base portion 41 on which the nozzle 2411 is formed in step ST15, the liquid repellent layer base film 42A, the liquid repellent layer 43, and the protective sheet 45.
  • the nozzle substrate 40A is formed (step ST16), and the first nozzle substrate manufacturing method is completed.
  • the adhesion between the protective sheet 45 and the surface of the liquid repellent layer 43 is 0.1 to 0.7 N / N when the protective sheet 45 and the base portion 41 are stretched in the opposite direction by 180 degrees. 10 mm], more preferably 0.15 to 0.64 [N / 10 mm].
  • the nozzle substrate 40A formed by the first nozzle substrate manufacturing process is bonded to the pressure chamber substrate 50 (or the intermediate substrate) by the manufacturer, and the nozzle substrate 40A, the pressure chamber substrate 50, the diaphragm 60, the spacer A substrate on which the substrate 70 and the wiring substrate 80 are stacked is generated, and a drive circuit and an ink supply path are connected to the substrate to generate the inkjet head 241, which is used as a part of the inkjet recording apparatus 1.
  • Ru is used as a part of the inkjet recording apparatus 1.
  • the ink jet head 241 is a liquid repellent that includes the base portion 41 on which the nozzle 2411 that ejects the ink is formed, and the silicon carbide oxide film formed on the ejection surface side of the base portion 41 A nozzle substrate 40A having a layer base film 42A and a liquid repellent layer 43 formed on the exit surface side of the liquid repellent layer base film 42A is provided.
  • the reactivity with the liquid repellent agent for forming the liquid repellent layer 43 on the ejection surface side of the nozzle substrate 40A can be improved by the liquid repellent layer base film 42A of the silicon carbide oxide film, and the ink, particularly to the alkaline ink The resistance can be improved, and the decrease in liquid repellency can be prevented.
  • the liquid repellent layer base film 42A is a triangular figure showing the atomic ratio of silicon Si, carbon C and oxygen O, and the coordinate point P1 is such that the atomic ratio of Si: C: O is 1: 1: 0. And a coordinate point P2 in which the atomic ratio of Si: C: O is 3: 2: 2, and a coordinate point P3 in which the atomic ratio of Si: C: O is 1: 2: 2, Si: Carbonization within the range surrounded by coordinate point P4 where the atomic ratio of C: O is 1: 2: 0 and excluding the line connecting coordinate point P1 and coordinate point P4 It has a silicon oxide film. Therefore, as shown in the first and second embodiments to be described later, a high etching rate can be obtained, the alkali resistance can be greatly improved, and a large contact angle can be obtained, and the liquid repellent property can be obtained. It can improve.
  • the film thickness of the liquid repellent layer base film 42A is 50 nm or less. For this reason, at the time of forming the nozzle 2411, laser ablation can be facilitated, and burrs can be prevented from remaining in the base portion 41 or the like.
  • the base 41 is made of silicon, a metal material or a resin material. For this reason, by making the base portion 41 silicon (silicon), it is possible to use a photolithography process or the like for nozzle processing, and by using this processing process, it is possible to process the nozzle 2411 with high precision, and the injection angle It is possible to manufacture an inkjet head 241 with very small variation and good drawing quality.
  • the heat resistance can be enhanced by forming the base portion 41 of polyimide as a resin material, and the annealing treatment can be performed at a high temperature after formation of the liquid repellent layer base film 42A or after formation of the liquid repellent layer 43.
  • the nozzle 2411 can be easily formed by punching on a SUS film, laser processing, or electroforming.
  • the inkjet recording apparatus 1 further includes an inkjet head 241 having a nozzle substrate 40A, and a cleaning unit 27 that wipes off the ink on the ejection surface side of the liquid repellent layer 43. Therefore, the effect of chemical mechanical polishing by the ink wiping of the cleaning unit 27 can be suppressed, and the ink jet recording apparatus 1 can be realized which prevents the decrease in the liquid repellency of the ejection surface side of the nozzle substrate 40A.
  • the reactivity with the liquid repellent agent for forming the liquid repellent layer 43 on the ejection surface side of the nozzle substrate 40A can be improved by the liquid repellent layer base film 42A of the silicon carbide oxide film, and the ink, particularly to the alkaline ink The resistance can be improved, and the decrease in liquid repellency can be prevented.
  • the outermost surface layer is a liquid repellency of the silicon carbide oxide film having the composition ratio in the range shown in FIG. 6A.
  • a liquid underlayer 26A is formed.
  • plasma treatment in an atmosphere containing oxygen gas is used. Therefore, the liquid repellent layer base film 42A of the silicon carbide oxide film having the composition ratio in the range shown in FIG. 6A can be easily formed, and the number of siloxane bonding sites (-OH group) on the silicon carbide oxide film surface is increased. Fixability of the silicon carbide oxide film of the liquid layer base film 42A and the liquid repellent agent of the liquid repellent layer 43 can be further improved.
  • liquid repellent layer base film forming step by adding carbon to the silicon oxide film or the silicon carbide oxide film additionally, the liquid repellent layer base film 42A having the composition ratio of the outermost surface layer in the range shown in FIG. 6A.
  • the liquid repellent layer base film 42A of the silicon carbide oxide film having the composition ratio in the range shown in FIG. 6A can be easily formed.
  • the nozzle forming step after the liquid repellent layer base film 42A and the liquid repellent layer 43 are formed on the base material portion 41, the substrate portion 41, the liquid repellent layer base film 42A and the liquid repellent layer 43 are ablated by excimer laser processing.
  • the nozzle 2411 is formed. At the time of forming the nozzle 2411, laser ablation can be facilitated, and burrs can be prevented from remaining on the base portion 41 or the like.
  • FIG. 9 is a schematic cross-sectional view of the nozzle substrate 40B.
  • the nozzle substrate 40 ⁇ / b> B has a base portion 41, a liquid repellent layer base film 42 ⁇ / b> B, and a liquid repellent layer 43.
  • the liquid repellent layer base film 42 B is a layer provided on the injection surface side of the base portion 41 and in the flow path of the nozzle 24 11 and a part thereof becomes the base layer on the side of the liquid repellent layer 43 on the base portion 41.
  • the liquid repellent layer base film 42B is a silicon oxide film having a composition ratio in a preferable range shown in FIG. 6A.
  • FIG. 10 is a flowchart showing the second nozzle substrate manufacturing process.
  • FIG. 11A is a cross-sectional view schematically showing the base portion 41 in which the nozzle 2411 is formed.
  • FIG. 11B is a cross-sectional view schematically showing the base portion 41 on which the liquid repellent layer base film 42B is formed.
  • FIG. 11C is a cross-sectional view schematically showing the nozzle substrate 40B on which the liquid repellent layer 43 is formed.
  • a second nozzle substrate manufacturing process for manufacturing the nozzle substrate 40B will be described with reference to FIG.
  • the manufacturer processes the nozzle on the flow path side (back side) to form the base portion 41 serving as a base member on which the nozzle 2411 is formed (step ST21).
  • the base 41 is made of, for example, a metal material (SUS).
  • the base portion 41 in which the nozzle 2411 is formed is formed by, for example, forming a recess having a depth greater than the thickness of the SUS film by punching in a SUS film, and smoothing the projections formed on the back surface. Can.
  • the base material part 41 in which the nozzle 2411 was formed can be formed by carrying out the laser processing to SUS film, and forming the nozzle 2411. Furthermore, the base portion 41 of the metal material in which the nozzle 2411 is formed can be formed by electroforming.
  • a manufacturer carbonizes the composition ratio of the preferable range shown to FIG. 6A in the injection
  • a silicon oxide film is formed to form a liquid repellent layer base film 42B (step ST22).
  • the liquid repellent layer base film on the surface excellent in alkali resistance and durability against chemical mechanical polishing and the flow path protective film in the flow path As a result, a siloxane bond can be formed, and a liquid repellent layer base film excellent in the fixability of the liquid repellent agent can be obtained.
  • film formation can be performed using film formation methods (1) to (3) or the like as in step ST12 of FIG.
  • film formation pretreatment of the liquid repellent layer base film 42B in step ST22 plasma treatment may be performed on the base portion 41 as in step ST12 of FIG. 7.
  • the reverse sputtering process may be performed on the base material portion 41 as a film forming pretreatment of the liquid repellent layer base film 42B.
  • the base material is sputtered using oxygen gas, argon gas, or a mixed gas thereof.
  • step ST22 hydrogen may be added to the source gas.
  • the stress and film hardness of the liquid repellent layer base film 42B may be improved, and the abrasion resistance may be improved.
  • step ST22 as in the case of step ST12 in FIG. 7, a silicon oxide film or a silicon carbide oxide film may be formed as the liquid repellent layer base film 42B, and then carbon may be introduced onto the film surface.
  • step ST22 as in step ST12 in FIG. 7, after addition of oxygen during formation of the silicon carbide oxide film, or after formation of a silicon carbide film or silicon carbide oxide film, as the liquid repellent layer base film 42B, the film surface May be oxidized.
  • step ST22 by forming the liquid repellent layer base film 42B as a protective film on the inner wall and the flow path of the nozzle 2411, a flow path protective film having excellent alkali resistance and excellent lyophilic property is provided.
  • the silicon carbide oxide film Since the silicon carbide oxide film has high covalent bondability, it has a hydroxyl group on the surface, and is excellent in lyophilicity (philicity, hydrophilicity). Therefore, when the ink is introduced into the ink jet head 241, air bubbles in the flow path easily come off, and the air bubbles in the flow path hardly adhere even during the operation of the ink jet head 241. Is less likely to occur.
  • the manufacturer forms the lyophobic layer 43 on the ejection surface side (surface) of the base portion 41 on which the lyophobic layer base film 42B is formed in step ST22, thereby forming the nozzle substrate 40B.
  • the formation (step ST23) ends the second nozzle substrate manufacturing method.
  • the liquid repellent layer 43 is formed by the same method as step ST13 of FIG.
  • a liquid repellent layer is formed on the emission surface side (front surface), the inner wall of the nozzle 2411 and the flow path side (back side), and the liquid repellant layer of all or part of the inner wall and flow path side (back side) of the nozzle 2411 May be removed to form a liquid repellent layer 43.
  • the removal method plasma treatment, chemical solution treatment, or the like can be used.
  • a liquid repellent layer may be formed on the emission surface side (front surface), the inner wall of the nozzle 2411 and the flow path side (back surface).
  • the surface of the nozzle 2411 is in contact with air, but the inner wall of the nozzle 2411 and the inner wall of the flow path are filled with ink, so no air is present and the wettability of the ink may be lower than the surface of the nozzle 2411 .
  • the nozzle substrate 40B of the ink jet head 241 has the liquid repellent layer base film 42B formed on the emission surface side of the base portion 41 and the inner wall of the nozzle 2411. For this reason, the flow path of the ink can be protected by the liquid repellent layer base film 42B which is excellent in alkali resistance and excellent in lyophilic property.
  • the ink is introduced to the ink jet head 241 by the liquid repellent layer base film 42B, the air bubbles in the flow path can be easily removed, and the air bubbles in the flow path can not be easily attached during the operation of the ink jet head 241. It is possible to reduce the occurrence of injection failure of the nozzle 2411 and the like.
  • FIG. 12 is a schematic cross-sectional view of the nozzle substrate 40Ba.
  • the nozzle substrate 40Ba has a base portion 41, a liquid repellent layer base film 42A, a liquid repellent layer 43, and a flow path protective film 44B.
  • the flow path protective film 44B is provided in the injection surface side of the base portion 41 and in the flow path of the nozzle 2411, and a layer (film) which becomes a base layer on the base portion 41 side of the liquid repellent layer base film 42A. It is.
  • the flow path protective film 44B is a protective film having ink resistance.
  • the nozzle substrate 40Ba is manufactured by the same manufacturing method as the second nozzle substrate manufacturing process of FIG. However, in the second nozzle substrate manufacturing process, after the step ST21 and before the step ST22, the manufacturer flows the flow toward the injection surface side and the flow path side of the base portion 41 on which the nozzle 2411 is formed in the step ST21.
  • the path protective film 44B is formed.
  • the flow path protective film 44B it is preferable to use a metal oxide film containing one or more kinds of metal elements such as tantalum, hafnium, niobium, titanium, zirconium, and the like, which are chemically stable in a high oxidation state. Such a metal oxide film is excellent in alkali resistance. Further, as the flow path protective film 44, a metal silicate film containing silicon in a metal oxide film containing one or more kinds of metal elements chemically stable in a high oxidation state such as tantalum, hafnium, niobium, titanium, or zirconium is used.
  • a metal silicate film tantalum silicate, hafnium silicate, niobium silicate, titanium silicate, zirconium silicate and the like can be mentioned.
  • a metal silicate film has alkali resistance and contains silicon to lower the ionic bondability and improve the covalent bondability, thereby increasing the hydroxyl groups of the flow path protective film 44B, thereby preventing the flow path protection.
  • the lyophilic property of the surface of the film 44B is improved. When the ink is introduced into the inkjet head 241 by improving the lyophilic property, the air bubbles in the flow path are easily removed, and the air bubbles in the flow path are less likely to be attached during the operation of the ink jet head 241. It becomes difficult for the occurrence of injection failure and the like to occur.
  • step ST22 in place of the liquid repellent layer base film 42B, the liquid repellent layer base film 42A is formed on the ejection surface side of the base portion 41 on which the flow path protective film 44B is formed.
  • the liquid repellent layer base film is formed on the injection surface side and the flow path side of the base material portion 41 on which the flow path protective film 44B is formed, and on the injection surface side of the base portion 41 on which the liquid repellent layer base film is formed.
  • the protective sheet is attached, the liquid repellent layer underlayer on the flow path side is removed by etching treatment, plasma treatment, or the like, the protective sheet is peeled off, and the liquid repellent layer underlayer 42A is formed.
  • step ST23 is executed to manufacture the nozzle substrate 40Ba.
  • FIG. 13 is a schematic cross-sectional view of the nozzle substrate 40C.
  • the nozzle substrate 40 ⁇ / b> C includes a base portion 41, a liquid repellent layer base film 42 ⁇ / b> A, a liquid repellent layer 43, and a flow path protective film 44.
  • the flow path protective film 44 is provided in the injection surface side of the base portion 41 and in the flow path of the nozzle 2411, and a layer (film) which becomes a base layer on the base portion 41 side of the liquid repellent layer base film 42A. It is.
  • the flow path protective film 44 is a protective film having ink resistance.
  • FIG. 14 is a flowchart showing the third nozzle substrate manufacturing process.
  • FIG. 15A is a cross-sectional view schematically showing the base portion 41C.
  • FIG. 15B is a cross-sectional view schematically showing the base portion 41C on which the liquid repellent layer base film 42A is formed.
  • FIG. 15C is a cross-sectional view schematically showing the base portion 41C in which the nozzle holes 2411a are formed.
  • FIG. 15D is a cross-sectional view schematically showing the base portion 41C in which the ink channel 2411b is formed.
  • FIG. 15E is a cross-sectional view schematically showing the base portion 41C in which the flow path protective film 44 is formed.
  • FIG. 15F is a cross-sectional view schematically showing the nozzle substrate 40C on which the liquid repellent layer 43 is formed.
  • a third nozzle substrate manufacturing process for manufacturing the nozzle substrate 40C will be described with reference to FIG.
  • a process for manufacturing a nozzle substrate 40C in which the substrate portion 41 is a substrate portion 41C as an SOI (Silicon On Insulator) substrate and the nozzles 2411 are nozzles 2411C including a nozzle hole and an ink channel explain.
  • the manufacturer prepares a base portion 41C as an SOI substrate (step ST31).
  • the base portion 41C has a support substrate 41a, a BOX (Buried Oxide: buried oxide film) layer 41b, and an SOI layer 41c, and has a structure in which each layer is stacked in this order.
  • the base portion 41C as the SOI substrate can be formed by a substrate bonding method, a SIMOX (Separation by Implantation of OXygen) method, an ELTRAN (Epitaxial Layer TRANsfer), or the like.
  • the thickness of the SOI layer 41c may be 10 to 100 ⁇ m
  • the thickness of the BOX layer 41b may be 50 to 200 nm.
  • a silicon oxide film or the like may be formed on the surface of the base portion 41C on the side of the SOI layer 41c.
  • the thickness of the supporting substrate 41 a may be 50 ⁇ m to 1000 ⁇ m.
  • the material of the support substrate 41a may be silicon, but it is not limited thereto, and quartz, glass, sapphire, SiC, GaN, YSZ or the like may be used.
  • the ink jet head 241 having excellent ink resistance of the inner wall of the nozzle 2411 C and the ink flow path can be formed by using the base portion 41 C in which the material having the ink resistance is the support substrate 41 a.
  • the manufacturer uses silicon carbide oxide having the composition ratio of the preferable range shown in FIG. 6A on the injection surface side (surface) of the SOI layer 41c of the base portion 41C prepared in step ST31.
  • a film is formed to form a liquid repellent underlayer film 42A (step ST32).
  • film formation method of the silicon carbide oxide film in step ST32 film formation can be performed using film formation methods (1) to (3) or the like as in step ST12 of FIG.
  • step ST32 As the film formation pretreatment of the liquid repellent layer base film 42B in step ST32, plasma treatment may be performed on the base portion 41 as in step ST12 of FIG. 7. In addition, the reverse sputtering process may be performed on the base material portion 41 as a film forming pretreatment of the liquid repellent layer base film 42B. In addition, at the time of silicon carbide oxide film formation in step ST32, hydrogen may be added to the source gas. Further, in step ST32, as in the step ST12 of FIG. 7, a silicon oxide film or a silicon carbide oxide film may be formed as the liquid repellent layer base film 42A, and then carbon may be introduced onto the film surface. In step ST32, as in step ST12 in FIG.
  • the film surface May be oxidized.
  • these film formation methods and pretreatment methods may be appropriately combined and used, and are not limited to the above description.
  • the manufacturer processes the nozzle hole on the injection surface side (surface) of the liquid repellent layer base film 42A formed in step ST32 and the SOI layer 41c of the base portion 41C.
  • the holes 2411a are formed (step ST33).
  • step ST33 for example, after applying a resist on the surface of the liquid repellent layer base film 42A, a resist pattern is formed by exposure, and a nozzle hole 2411a is formed by dry etching. A Bosch process etc. can be used for dry etching.
  • the nozzle holes 2411a are preferably processed to be reverse tapered as viewed from the surface side of the SOI layer.
  • step ST34 the manufacturer processes the ink channel on the flow path side (back surface) of the support substrate 41a and the BOX layer 41b of the base portion 41C in which the nozzle hole 2411a is formed in step ST33 2411b are formed (step ST34).
  • step ST34 for example, after applying a resist on the back surface of the support substrate 41a, a resist pattern is formed by exposure, and an ink channel 2411b is formed by dry etching.
  • the support substrate 41a may be polished and thinned to have a desired ink channel 2411b size.
  • the manufacturer forms the flow path protective film 44 on the flow path side (rear surface) of the base portion 41C in which the ink channel 2411b (nozzle 2411C) is formed in step ST34 (step ST35).
  • the flow path protective film 44 it is preferable to use a metal oxide film containing one or more kinds of metal elements such as tantalum, hafnium, niobium, titanium, zirconium, etc. which are chemically stable in a high oxidation state. Such a metal oxide film is excellent in alkali resistance.
  • a metal silicate film containing silicon in a metal oxide film containing one or more kinds of metal elements chemically stable in a high oxidation state such as tantalum, hafnium, niobium, titanium, or zirconium is used. May be As such a metal silicate film, tantalum silicate, hafnium silicate, niobium silicate, titanium silicate, zirconium silicate and the like can be mentioned.
  • Such a metal silicate film has alkali resistance and contains silicon to lower the ionic bondability and improve the covalent bondability, so that the hydroxyl group of the flow path protective film 44 is increased, thereby preventing the flow path protection.
  • the lyophilic property of the surface of the membrane 44 is improved.
  • the air bubbles in the flow path are easily removed, and the air bubbles in the flow path are less likely to be attached during the operation of the ink jet head 241. It becomes difficult for the occurrence of injection failure and the like to occur.
  • a silicon carbide oxide film may be used as the flow path protective film 44.
  • the flow path protective film can be made excellent in alkali resistance and excellent in lyophilicity.
  • the silicon carbide oxide film has a hydroxyl group on the surface and is excellent in lyophilicity because of high covalent bonding. Therefore, when ink is introduced into the ink jet head 241, air bubbles in the flow path are easily removed, and air bubbles in the flow path are less likely to be attached even while the ink jet head 241 is in operation. It becomes difficult to get up.
  • a silicon carbide oxide film may be additionally stacked on all or part of the upper layer of the flow path protective film 44 of metal oxide or metal silicate film. Further, the flow path protective film 44 may not be formed on the nozzle substrate 40C.
  • the manufacturer forms a liquid repellent layer on the ejection surface side (surface) of the base portion 41C on which the flow path protective film 44 is formed in step ST35 and the liquid repellent layer base film 42A.
  • the nozzle substrate 40C is formed (step ST36), and the third nozzle substrate manufacturing method is finished.
  • the liquid repellent layer 43 is formed by the same method as step ST13 of FIG.
  • a liquid repellent layer is formed on the emission surface side (front surface), the inner wall of the nozzle 2411C and the flow path side (back side), and the liquid repellant layer of all or part of the inner wall and the flow path side (back side) of the nozzle 2411C. May be removed to form a liquid repellent layer 43.
  • the removal method plasma treatment, chemical solution treatment, or the like can be used.
  • a liquid repellent layer may be formed on the emission surface side (front surface), the inner wall of the nozzle 2411C, and the flow path side (back surface).
  • the surface of the nozzle 2411C is in contact with air, but the inner wall of the nozzle 2411C and the inner wall of the flow channel are filled with ink, so no air is present and the wettability of the ink may be lower than the surface of the nozzle 2411C .
  • the nozzle substrate 40C of the ink jet head 241 includes the flow path protective film 44 formed in the flow path of the nozzle 2411. Therefore, the flow path protective film 44 can protect the flow path of the ink.
  • the flow path protective film 44 is a silicon carbide oxide film, air bubbles in the flow path can be easily removed, for example, when ink is introduced to the ink jet head 241, and the flow path can be removed during the operation of the ink jet head 241. It is possible to make it difficult for the air bubbles to adhere, and to reduce the occurrence of an injection failure of the nozzle 2411 or the like.
  • FIG. 16 is a diagram showing coordinate points PSA and PSB of the samples SA and SB in a triangular diagram showing the atomic ratio of Si, C, and O.
  • sample SA as an example of the silicon carbide oxide film Si a C b O c was generated.
  • O 2 plasma processing was performed on a base material (Si wafer) by RIE-10 NR manufactured by SAMCO.
  • a silicon carbide oxide film was formed as a sample SA on the base material (Si wafer) using TEOS (TEtraeth OxySilane) with a film forming apparatus (plasma CVD apparatus PD-200ST manufactured by SAMCO).
  • a silicon oxide film as an example of the carbide silicon oxide film Si a C b O c.
  • the pretreatment for film formation was performed on the base material (Si wafer) in the same manner as the sample SA.
  • a silicon carbide oxide film was formed as a sample SB on a base material (Si wafer) by using a film forming apparatus (plasma CVD apparatus PD-200ST manufactured by SAMCO) using TEOS.
  • composition ratio of Si, C, and O of the samples SA and SB was evaluated using an X-ray photoelectron spectrometer (Quantera SXM manufactured by ULVAC-PHI, Inc.).
  • coordinate points PSA and PSB corresponding to the samples SA and SB are plotted in a triangular diagram showing the atomic ratio of Si, C, and O.
  • coordinate point PSA is included in the preferable range of the composition ratio of Si, C, O shown in FIG. 6A
  • sample SB is a silicon oxide film
  • coordinate point PSB is also in the range of the preferred composition ratio. Not included
  • the etching rate was about 1/300 of the silicon carbide oxide film of sample SA with respect to the silicon oxide film of sample SB. Therefore, it can be seen that the alkali resistance of the liquid repellent layer underlayers 42A and 42B is greatly improved by using a silicon carbide oxide film such as the sample SA for the liquid repellent layer underlayers 42A and 42B.
  • FIG. 17 is a diagram showing coordinate points and contact angles of samples S1 to S9 in a triangular diagram showing the atomic ratio of Si, C and O.
  • samples S1, S2, S3, S4, S5, S6, S7, S8, and S9 having the composition ratios of silicon carbide oxide films Si a C b O c shown in the following Table III were generated. .
  • the sample S1 is silicon
  • the samples S2 and S3 are silicon oxide films
  • the sample S4 is a silicon carbide film.
  • FIG. 17 in a triangular diagram showing atomic ratio of Si, C and O, coordinate points PS1 and PS2 corresponding to samples S1, S2, S3, S4, S5, S6, S7, S8 and S9. , PS3, PS4, PS5, PS6, PS7, PS8, PS9 are plotted.
  • the liquid repellent layer as the liquid repellent layer 43 was formed on the samples S1 to S9 as the liquid repellent layer underlying films 42A and 42B by coating.
  • coating conditions dip the samples S1 to S9 in OPTOOL 0.1% diluted solution for 3 minutes, pull up at low speed (10 [mm / sec]) and then ultrasonic cleaning (ultrasonic frequency 950 [kHz], time: I did 20 minutes.
  • the samples S1 to S9 on which the liquid repellent layer is formed are immersed in aqueous alkaline dummy ink of pH 11, and the contact angle (static contact angle, receding contact angle) of the dummy ink is measured to change the contact angle. evaluated.
  • the aqueous alkaline dummy ink at pH 11 contained polypropylene glycol alkyl ether, dipolypropylene glycol alkyl ether, tripolypropylene glycol alkyl ether, etc. which were adjusted to pH 10 to pH 11 by mixing buffer solutions such as sodium carbonate and potassium carbonate. It is an aqueous solution.
  • the dummy ink for measuring the contact angle may be selected from diethylene glycol alkyl ether, triethylene glycol alkyl ether, tetraethylene glycol alkyl ether, polypropylene glycol alkyl ether, dipolypropylene glycol alkyl ether, tripolypropylene glycol alkyl ether, or a plurality of them. A mixture of seed solvents was used.
  • the static contact angles and receding contact angles of the dummy ink in the samples S1 to S9 on which the liquid repellent layer was formed were as shown in Table III.
  • the contact angles corresponding to the samples S1 to S9 are represented by the size (diameter) of a circle centered on each of the coordinate points PS1 to PS9.
  • the samples S5, S7, and S9 having the composition ratio of the preferable range shown in FIG. 6A can obtain a preferable contact angle even in a state after being dipped in an alkaline ink and obtain preferable liquid repellency. It is obtained.
  • the increase in hydroxyl groups on the surface of the liquid repellent underlayer increases the density of Si—O bonds formed between the compound forming the liquid repellent layer and the liquid repellent underlayer. It is considered that the liquid repellent material is prevented from being detached from the liquid repellent layer base film by the hydrolysis reaction by the alkali.
  • the alkali resistance of the liquid repellent layer underlayer is improved, so that the liquid repellent layer underlayer is etched during immersion in the alkaline ink and the liquid repellent material is separated from the liquid repellent layer underlayer. It is considered to be suppressed.
  • substrate was demonstrated, it is not limited to this.
  • the nozzle substrate of the above embodiment and modification is applied to a nozzle substrate of a shear mode ink jet head which imparts bending deformation by applying an electric field in a direction perpendicular to the polarization direction of the piezoelectric element to pressurize ink in the channel. It may be configured to
  • the inkjet head, the inkjet recording apparatus, and the method of manufacturing the inkjet head of the present invention can be applied to image recording using an ink.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Ink Jet (AREA)

Abstract

La présente invention aborde le problème de l'amélioration de la réactivité avec des agents repoussant les liquides et de la résistance aux encres du côté surface d'éjection d'un substrat de buse, ce qui empêche une diminution de la répulsion des liquides du côté surface d'éjection du substrat de buse. À cet effet, la présente invention concerne une tête à jet d'encre d'un dispositif d'enregistrement à jet d'encre, pourvue d'un substrat de buse (40A). Le substrat de buse (40A) comprend : une partie de matériau de base (41) qui est pourvue d'une buse (2411) de laquelle une encre est éjectée ; un film de base de couche repoussant les liquides (42A) qui est formé sur le côté surface d'éjection de la partie de matériau de base (41) et qui comporte un film de carboxyde de silicium ; et une couche repoussant les liquides (43) qui est formée sur le côté surface d'éjection du film de base de couche repoussant les liquides (42A).
PCT/JP2018/020648 2017-07-10 2018-05-30 Tête à jet d'encre, dispositif d'enregistrement à jet d'encre et procédé de production de tête à jet d'encre WO2019012829A1 (fr)

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JP2019528972A JPWO2019012829A1 (ja) 2017-07-10 2018-05-30 インクジェットヘッド、インクジェット記録装置及びインクジェットヘッドの製造方法
EP18831247.4A EP3653386B1 (fr) 2017-07-10 2018-05-30 Tête à jet d'encre, dispositif d'enregistrement à jet d'encre et procédé de production de tête à jet d'encre
CN201880045420.8A CN110869213B (zh) 2017-07-10 2018-05-30 喷墨头、喷墨记录装置及喷墨头的制造方法

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EP3653386A1 (fr) 2020-05-20
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JPWO2019012829A1 (ja) 2020-05-21
EP3653386B1 (fr) 2022-06-29
EP3653386A4 (fr) 2020-07-08

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