WO2019003534A1 - 蒸着マスク - Google Patents
蒸着マスク Download PDFInfo
- Publication number
- WO2019003534A1 WO2019003534A1 PCT/JP2018/013198 JP2018013198W WO2019003534A1 WO 2019003534 A1 WO2019003534 A1 WO 2019003534A1 JP 2018013198 W JP2018013198 W JP 2018013198W WO 2019003534 A1 WO2019003534 A1 WO 2019003534A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- opening
- openings
- deposition mask
- metal film
- mask according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
Definitions
- the present invention relates to a vapor deposition mask.
- the present invention relates to a deposition mask provided with a plurality of openings in a metal film formed by electroforming.
- organic EL display device In the manufacturing process of a display device (hereinafter referred to as "organic EL display device") using an organic EL (electroluminescence) material, a vapor deposition method is used as a technique for forming a thin film composed of the organic EL material. There is. In the case of forming a thin film made of an organic EL material using a vapor deposition method, a vapor deposition mask (also called a metal mask) made of a metal film having a plurality of minute openings is used.
- a vapor deposition mask also called a metal mask
- the organic EL material is selectively selected for a plurality of pixels. Can be deposited.
- the deposition mask can be manufactured by etching a metal plate or can be manufactured using electroforming.
- a deposition mask manufactured using electroforming is suitable for forming a thin film with high accuracy because it is excellent in dimensional accuracy. Therefore, for example, in Patent Document 1, a vapor deposition mask using electroforming is used for vapor deposition of the organic EL material constituting the light emitting layer and the like of the organic EL display device.
- alignment marks are formed on both the deposition mask and the array substrate. For example, in the deposition mask, an opening is formed as an alignment mark, and in the array substrate, an alignment mark having the same shape as the deposition mask is formed. Then, alignment between the deposition mask and the array substrate is performed by matching the contour of the opening of the deposition mask with the contour of the alignment mark of the array substrate.
- an opening is formed as an alignment mark in a deposition mask manufactured using electroforming, but since the deposition mask manufactured using electroforming is made of a metal film, it is extremely thin. Therefore, stress may concentrate in the vicinity of the opening formed as an alignment mark, and the metal film may be warped.
- Alignment between the alignment mark of the deposition mask and the alignment mark of the array substrate is performed using an autofocus mechanism of a camera. At this time, if the vicinity of the alignment mark is warped, focusing by the autofocus mechanism becomes difficult, and there is a problem that alignment using the alignment mark can not be performed.
- the present invention has been made in view of the above problems, and an object of the present invention is to relieve stress generated in the vicinity of an alignment mark disposed on a metal film constituting a deposition mask.
- the deposition mask according to an embodiment of the present invention includes a frame and a metal film held by the frame, and the metal film includes a first opening and a plurality of metal films disposed around the first opening.
- the diameter of the second opening is smaller than the diameter of the first opening.
- FIG. 1 is a plan view showing the configuration of the vapor deposition mask 100 according to the first embodiment.
- the vapor deposition mask 100 includes a frame 102 made of a metal member such as invar, and a plurality of metal films 104 held in a plurality of openings 102 a provided in the frame 102.
- the plurality of metal films 104 are disposed corresponding to the respective organic EL display devices, and function as masks that block the vapor deposition material.
- the metal film 104 is a metal film produced using electroforming, and can be produced, for example, by a plating technique using a metal material such as nickel, nickel-cobalt alloy, iron-nickel alloy, copper or the like.
- the thickness of the metal film may be, for example, in the range of 5 to 20 ⁇ m.
- the metal film 104 has a mask region 104a.
- the mask area 104 a is an area corresponding to the display area of the organic EL display device to be vapor-deposited.
- the mask area 104 a has a plurality of pixel openings at positions corresponding to the respective pixels arranged in the display area of the organic EL display device.
- the plurality of pixel openings are openings for depositing an organic EL material selectively for each pixel.
- FIG. 2 shows a state in which a part inside the mask area 104a (area surrounded by the frame line 106) is enlarged.
- FIG. 2 is a plan view enlarging a part of the inside of the mask region 104 a in the vapor deposition mask 100 according to the first embodiment.
- the metal film 104 is provided with a plurality of pixel openings 107 in a region surrounded by the frame line 106.
- the pixel openings 107 are provided corresponding to the positions of the individual pixels (pixels of the organic EL display device). Note that the metal film 104 shown in FIG. 2 has a pixel opening 107 corresponding to the position of the sub-pixel that emits red, green or blue light. When corresponding to a sub-pixel emitting light of another color, the position of the pixel opening 107 is shifted by one or two columns.
- an alignment mark is disposed in a region of the metal film 104 outside the mask region 104 a.
- the alignment mark is a mark for aligning the deposition mask 100 with a mother glass (not shown) on which a plurality of organic EL display devices are formed.
- FIG. 3 shows a state in which a part of the outside of the mask area 104a (the area surrounded by the frame line 108) is enlarged.
- FIG. 3 is an enlarged plan view of a part of the outside of the mask region 104 a in the vapor deposition mask 100 according to the first embodiment.
- the metal film 104 is provided with the first opening 110 in the region surrounded by the frame 108.
- the first opening 110 is an opening that functions as an alignment mark.
- the present invention is not limited to this, and may be a polygon, a rectangle, an ellipse, or the like. However, in order to minimize the stress generated at the edge of the first opening 110, it is desirable that the outline of the first opening 110 be circular.
- the plurality of second openings 112 and the third openings 114 are disposed around the first opening 110.
- the plurality of second openings 112 and the plurality of third openings 114 are annularly arranged along the contour of the first opening 110.
- the plurality of third openings 114 are disposed outside the second opening 112 with respect to the first opening 110. At this time, as shown in FIG. 3, the plurality of second openings 112 and the plurality of third openings 114 are alternately arranged clockwise or counterclockwise along the outline of the first opening 110. Ru.
- Each of the plurality of second openings 112 and the third openings 114 is an opening functioning as a stress relieving part that relieves stress generated around the first opening 110.
- the arrangement of the plurality of second openings 112 and the third openings 114 is annular, but for example, the outline of the first opening 110 is If it is rectangular, the plurality of second openings 112 and third openings 114 may be disposed along the rectangle. However, this is an example, and it is also possible to arrange the plurality of second openings 112 and the plurality of third openings 114 so as not to follow the contour of the first opening 110.
- FIG. 4 is an enlarged plan view of a part of the first opening 110, the plurality of second openings 112, and the plurality of third openings 114 in the vapor deposition mask 100 according to the first embodiment.
- the diameter of the first opening 110 is R1
- the diameter of the second opening 112 is R2
- the diameter of the third opening 114 is R3, R2 and R3 are smaller than R1.
- R 2 and R 3 preferably have a diameter equal to or less than half of R 1.
- R1 can be 0.5 mm or more and 1.5 mm or less (preferably 0.8 mm or more and 1.2 mm or less), and R2 and R3 can be 150 ⁇ m or more and 250 ⁇ m or less (preferably 180 ⁇ m or more and 220 ⁇ m or less).
- R1 is 1.0 mm, and R2 and R3 are 200 ⁇ m.
- R2 and R3 have the same length, the present invention is not limited to this. R2 and R3 may have different lengths.
- the expression “diameter” is used to indicate their size. It is only an example of an indicator indicating the size.
- the expression “maximum width” is used as an index indicating the size of each opening.
- the “maximum width” is the maximum width (maximum distance) when two points on the contour of the opening are connected by a straight line. That is, when the first opening 110, the second opening 112 and the third opening 114 are circular, the maximum width is equal to the diameter.
- first opening 110, the second opening 112, and the third opening 114 are figures such as a rectangle, a polygon, or an ellipse, in which the distance from the center to the outline changes.
- a relative comparison is possible if the maximum width is used as a measure of
- the plurality of second openings 112 are disposed apart from the edge of the first opening 110 by a predetermined distance L1.
- the autofocusing mechanism uses the plurality of second openings 112 and the plurality of third openings 114 arranged around the first opening 110 as the first opening 110. It is provided to prevent false recognition.
- the predetermined distance L1 is preferably a distance (in the present embodiment, 1.0 mm or more) or more of the diameter (ie, the maximum width) of the first opening 110, but it is particularly preferable if the above-mentioned erroneous recognition can be avoided. There is no limit.
- P1 is 300 ⁇ m or more It may be set in the range of 500 ⁇ m or less (preferably 350 ⁇ m or more and 450 ⁇ m or less). Further, the distance between adjacent ones of the plurality of third openings 114 may be set in the same range.
- the metal film 104 is provided with the first opening 110 as an alignment mark.
- a plurality of second openings 112 and a plurality of third openings 114 having a diameter smaller than that of the first opening 110 are provided so as to surround the periphery of the first opening 110, and the vicinity of the first opening 110 is provided. Relieve stress that occurs in
- the stress generated in the metal film 104 is accumulated as it approaches the first opening 110 from the vicinity of the boundary between the frame 102 and the metal film 104 in FIG.
- the diameter of the first opening 110 is 0.5 mm or more, the problem of warpage is significant.
- the present embodiment by providing the plurality of second openings 112 and the plurality of third openings 114 around the first opening 110 as shown in FIG.
- the stress gradually accumulated from the boundary is relieved in the region where the plurality of second openings 112 and the plurality of third openings 114 are disposed, and does not transmit to the edge of the first opening 110. That is, the bending in the direction perpendicular to the metal film 104 is eliminated, and the problem that the edge of the first opening 110 is warped does not occur. Therefore, according to the present embodiment, accurate alignment using the first opening 110 as an alignment mark is possible.
- the present embodiment is effective when the diameter of the first opening 110 is 0.5 mm or more.
- the plurality of second openings 112 and the plurality of third openings 114 surround the periphery of the first opening 110, and the plurality of second openings 112 and the plurality of third openings Preferably, the openings 114 are staggered, clockwise or counterclockwise, along the contour of the first opening 110.
- the path through which stress is transmitted toward the first opening 110 can be efficiently closed by the plurality of second openings 112 and the plurality of third openings 114, so that stress can be further relieved. It is because the effect is enhanced.
- Second Embodiment In the second embodiment, an example will be described in which the shape of the opening formed in the metal film 104 is different from that of the first embodiment.
- description will be made focusing on the difference in configuration from the vapor deposition mask 100 of the first embodiment, and the same configuration may be assigned the same reference numerals and descriptions thereof may be omitted.
- FIG. 5 is an enlarged plan view of the vicinity of the first opening 110 functioning as an alignment mark in the second embodiment.
- a plurality of second openings 112a and a plurality of third openings 114a having a shape along an arc are arranged around the first opening 110.
- the plurality of third openings 114 a are disposed at positions corresponding to the gaps between the adjacent second openings 112 a. That is, the third opening 114 a is disposed at a position overlapping the gap between the adjacent second openings 112 a when viewed from the first opening 110.
- the metal film 104 of the present embodiment has a configuration in which the stress transmission path toward the first opening 110 is closed by the second opening 112 a and the third opening 114 a.
- the stress gradually accumulated from the boundary between the frame 102 and the metal film 104 is reset in the region where the second opening 112 a and the third opening 114 a are disposed, and the first opening It does not transmit to the edge of the part 110. Therefore, since the problem that the edge of the first opening 110 is bent does not occur, accurate alignment using the first opening 110 as an alignment mark is possible.
- FIG. 6 is an enlarged plan view of the vicinity of the first opening 110 functioning as an alignment mark in the third embodiment.
- the outline of the first opening 110 a is rectangular, and a plurality of second openings 112 b and a plurality of third openings 114 b are disposed along each side around the first opening 110.
- the plurality of second openings 112 b include a plurality of rod-shaped openings.
- the second opening 112 b and the third opening 114 b are rectangular or L-shaped, but may be square.
- the third opening 114 b is disposed at a position corresponding to the gap between the adjacent second openings 112 b. That is, the third opening 114 b is disposed at a position overlapping the gap between the adjacent second openings 112 b when viewed from the first opening 110 a.
- the metal film 104 of the present embodiment has a configuration in which the stress transmission path toward the first opening 110 a is blocked by the second opening 112 b and the third opening 114 b.
- the stress gradually accumulated from the boundary between the frame 102 and the metal film 104 is reset in the region where the second opening 112 b and the third opening 114 b are disposed, and the first opening It does not transmit to the edge of the part 110a. Therefore, since the problem that the edge of the first opening 110a is bent does not occur, accurate alignment using the first opening 110a as an alignment mark is possible.
- vapor deposition mask 102 frame 102a: opening 104: metal film 104a: mask area 107: pixel opening 110, 110a: first opening 112, 112a, 112b: second opening , 114, 114a, 114b ... third opening
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201880039459.9A CN110741105A (zh) | 2017-06-28 | 2018-03-29 | 蒸镀掩模 |
| US16/693,454 US11111572B2 (en) | 2017-06-28 | 2019-11-25 | Vapor deposition mask |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-126165 | 2017-06-28 | ||
| JP2017126165A JP6998139B2 (ja) | 2017-06-28 | 2017-06-28 | 蒸着マスク |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US16/693,454 Continuation US11111572B2 (en) | 2017-06-28 | 2019-11-25 | Vapor deposition mask |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2019003534A1 true WO2019003534A1 (ja) | 2019-01-03 |
Family
ID=64741357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2018/013198 Ceased WO2019003534A1 (ja) | 2017-06-28 | 2018-03-29 | 蒸着マスク |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US11111572B2 (https=) |
| JP (1) | JP6998139B2 (https=) |
| CN (1) | CN110741105A (https=) |
| WO (1) | WO2019003534A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112752860A (zh) * | 2018-09-27 | 2021-05-04 | 日铁化学材料株式会社 | 金属掩膜材料及其制造方法、金属掩膜 |
| CN114446190B (zh) | 2022-02-08 | 2023-07-25 | 武汉华星光电半导体显示技术有限公司 | 支撑板及显示装置 |
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| JP2002060927A (ja) * | 2000-08-10 | 2002-02-28 | Toray Ind Inc | 薄膜パターン成膜用マスク |
| JP2009221535A (ja) * | 2008-03-17 | 2009-10-01 | Univ Of Tsukuba | 微細構造素子製造装置及び微細構造素子生産方法 |
| JP2012134043A (ja) * | 2010-12-22 | 2012-07-12 | Nitto Denko Corp | 有機el素子の製造方法及び製造装置 |
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| JP2016009673A (ja) * | 2014-06-26 | 2016-01-18 | シャープ株式会社 | 有機エレクトロルミネッセンス素子製造用マスク、有機エレクトロルミネッセンス素子の製造装置、及び、有機エレクトロルミネッセンス素子の製造方法 |
| JP2017014582A (ja) * | 2015-07-02 | 2017-01-19 | 株式会社ブイ・テクノロジー | 成膜マスクの製造方法及びその製造装置 |
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| JP3596502B2 (ja) * | 2001-09-25 | 2004-12-02 | セイコーエプソン株式会社 | マスク及びその製造方法、エレクトロルミネッセンス装置及びその製造方法並びに電子機器 |
| JP2005042133A (ja) * | 2003-07-22 | 2005-02-17 | Seiko Epson Corp | 蒸着マスク及びその製造方法、表示装置及びその製造方法、表示装置を備えた電子機器 |
| JP4608874B2 (ja) * | 2003-12-02 | 2011-01-12 | ソニー株式会社 | 蒸着マスクおよびその製造方法 |
| JP2006152396A (ja) * | 2004-11-30 | 2006-06-15 | Sony Corp | メタルマスク、電鋳用マスク原版及びマスター原版の製造方法 |
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| KR20130065730A (ko) * | 2010-12-20 | 2013-06-19 | 샤프 가부시키가이샤 | 증착 방법 및 증착 장치 |
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| CN110117767A (zh) * | 2015-07-17 | 2019-08-13 | 凸版印刷株式会社 | 金属掩模用基材及其制造方法、蒸镀用金属掩模及其制造方法 |
-
2017
- 2017-06-28 JP JP2017126165A patent/JP6998139B2/ja active Active
-
2018
- 2018-03-29 CN CN201880039459.9A patent/CN110741105A/zh active Pending
- 2018-03-29 WO PCT/JP2018/013198 patent/WO2019003534A1/ja not_active Ceased
-
2019
- 2019-11-25 US US16/693,454 patent/US11111572B2/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002060927A (ja) * | 2000-08-10 | 2002-02-28 | Toray Ind Inc | 薄膜パターン成膜用マスク |
| JP2009221535A (ja) * | 2008-03-17 | 2009-10-01 | Univ Of Tsukuba | 微細構造素子製造装置及び微細構造素子生産方法 |
| JP2012522891A (ja) * | 2009-04-03 | 2012-09-27 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 材料堆積装置において基板を保持する装置 |
| JP2012134043A (ja) * | 2010-12-22 | 2012-07-12 | Nitto Denko Corp | 有機el素子の製造方法及び製造装置 |
| JP2016009673A (ja) * | 2014-06-26 | 2016-01-18 | シャープ株式会社 | 有機エレクトロルミネッセンス素子製造用マスク、有機エレクトロルミネッセンス素子の製造装置、及び、有機エレクトロルミネッセンス素子の製造方法 |
| JP2017014582A (ja) * | 2015-07-02 | 2017-01-19 | 株式会社ブイ・テクノロジー | 成膜マスクの製造方法及びその製造装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6998139B2 (ja) | 2022-01-18 |
| US20200095668A1 (en) | 2020-03-26 |
| US11111572B2 (en) | 2021-09-07 |
| JP2019007069A (ja) | 2019-01-17 |
| CN110741105A (zh) | 2020-01-31 |
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