CN110741105A - 蒸镀掩模 - Google Patents

蒸镀掩模 Download PDF

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Publication number
CN110741105A
CN110741105A CN201880039459.9A CN201880039459A CN110741105A CN 110741105 A CN110741105 A CN 110741105A CN 201880039459 A CN201880039459 A CN 201880039459A CN 110741105 A CN110741105 A CN 110741105A
Authority
CN
China
Prior art keywords
opening
openings
vapor deposition
deposition mask
metal film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201880039459.9A
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English (en)
Chinese (zh)
Inventor
观田康克
大河原健
为川贡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Display Central Inc
Original Assignee
Japan Display Central Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Display Central Inc filed Critical Japan Display Central Inc
Publication of CN110741105A publication Critical patent/CN110741105A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
CN201880039459.9A 2017-06-28 2018-03-29 蒸镀掩模 Pending CN110741105A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017-126165 2017-06-28
JP2017126165A JP6998139B2 (ja) 2017-06-28 2017-06-28 蒸着マスク
PCT/JP2018/013198 WO2019003534A1 (ja) 2017-06-28 2018-03-29 蒸着マスク

Publications (1)

Publication Number Publication Date
CN110741105A true CN110741105A (zh) 2020-01-31

Family

ID=64741357

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880039459.9A Pending CN110741105A (zh) 2017-06-28 2018-03-29 蒸镀掩模

Country Status (4)

Country Link
US (1) US11111572B2 (https=)
JP (1) JP6998139B2 (https=)
CN (1) CN110741105A (https=)
WO (1) WO2019003534A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114446190A (zh) * 2022-02-08 2022-05-06 武汉华星光电半导体显示技术有限公司 支撑板及显示装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112752860A (zh) * 2018-09-27 2021-05-04 日铁化学材料株式会社 金属掩膜材料及其制造方法、金属掩膜

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6720236B2 (en) * 2001-09-25 2004-04-13 Seiko Epson Corporation Mask and method of manufacturing the same, electro-luminescence device and method of manufacturing the same, and electronic instrument
CN1578563A (zh) * 2003-07-22 2005-02-09 精工爱普生株式会社 蒸镀掩模及制法、显示装置及制法以及具有其的电子机器
JP2009221535A (ja) * 2008-03-17 2009-10-01 Univ Of Tsukuba 微細構造素子製造装置及び微細構造素子生産方法
CN102023474A (zh) * 2009-09-22 2011-04-20 三星移动显示器株式会社 掩模组件、其制造方法及用于平板显示器的沉积装置
CN103238375A (zh) * 2010-12-20 2013-08-07 夏普株式会社 蒸镀方法、蒸镀装置和有机el显示装置
CN204125520U (zh) * 2014-08-14 2015-01-28 昆山萬豐電子有限公司 一种用于磁控溅射工艺的立式掩膜夹具

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JP2002060927A (ja) * 2000-08-10 2002-02-28 Toray Ind Inc 薄膜パターン成膜用マスク
JP2003017254A (ja) * 2001-06-29 2003-01-17 Sanyo Electric Co Ltd エレクトロルミネッセンス表示装置の製造方法
JP4608874B2 (ja) * 2003-12-02 2011-01-12 ソニー株式会社 蒸着マスクおよびその製造方法
JP2006152396A (ja) * 2004-11-30 2006-06-15 Sony Corp メタルマスク、電鋳用マスク原版及びマスター原版の製造方法
JP4624824B2 (ja) * 2005-03-04 2011-02-02 京セラ株式会社 メタルマスクの製造方法およびメタルマスク
JP2008293798A (ja) 2007-05-24 2008-12-04 Toyota Industries Corp 有機ｅｌ素子の製造方法
JP5297046B2 (ja) * 2008-01-16 2013-09-25 キヤノントッキ株式会社 成膜装置
JP2010106358A (ja) * 2008-09-30 2010-05-13 Canon Inc 成膜用マスク及びそれを用いた成膜方法
JP5642153B2 (ja) * 2009-04-03 2014-12-17 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ 材料堆積装置において基板を保持する装置
US8786054B2 (en) * 2009-11-16 2014-07-22 Taiwan Semiconductor Manufacturing Company, Ltd. Structure for integrated circuit alignment
JP5323041B2 (ja) * 2010-12-22 2013-10-23 日東電工株式会社 有機ｅｌ素子の製造方法及び製造装置
CN105144421B (zh) * 2013-04-22 2018-10-26 应用材料公司 主动对准的精细金属掩模
JP6404615B2 (ja) * 2014-06-26 2018-10-10 シャープ株式会社 有機エレクトロルミネッセンス素子製造用マスク、有機エレクトロルミネッセンス素子の製造装置、及び、有機エレクトロルミネッセンス素子の製造方法
JP6527408B2 (ja) * 2015-07-02 2019-06-05 株式会社ブイ・テクノロジー 成膜マスクの製造方法及びその製造装置
CN110117767A (zh) * 2015-07-17 2019-08-13 凸版印刷株式会社 金属掩模用基材及其制造方法、蒸镀用金属掩模及其制造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6720236B2 (en) * 2001-09-25 2004-04-13 Seiko Epson Corporation Mask and method of manufacturing the same, electro-luminescence device and method of manufacturing the same, and electronic instrument
CN1578563A (zh) * 2003-07-22 2005-02-09 精工爱普生株式会社 蒸镀掩模及制法、显示装置及制法以及具有其的电子机器
JP2009221535A (ja) * 2008-03-17 2009-10-01 Univ Of Tsukuba 微細構造素子製造装置及び微細構造素子生産方法
CN102023474A (zh) * 2009-09-22 2011-04-20 三星移动显示器株式会社 掩模组件、其制造方法及用于平板显示器的沉积装置
CN103238375A (zh) * 2010-12-20 2013-08-07 夏普株式会社 蒸镀方法、蒸镀装置和有机el显示装置
CN204125520U (zh) * 2014-08-14 2015-01-28 昆山萬豐電子有限公司 一种用于磁控溅射工艺的立式掩膜夹具

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114446190A (zh) * 2022-02-08 2022-05-06 武汉华星光电半导体显示技术有限公司 支撑板及显示装置
US12032414B2 (en) 2022-02-08 2024-07-09 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Support plate and display device

Also Published As

Publication number Publication date
JP6998139B2 (ja) 2022-01-18
US20200095668A1 (en) 2020-03-26
US11111572B2 (en) 2021-09-07
JP2019007069A (ja) 2019-01-17
WO2019003534A1 (ja) 2019-01-03

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Application publication date: 20200131