WO2018193935A1 - 導電性基板、導電性基板の製造方法 - Google Patents

導電性基板、導電性基板の製造方法 Download PDF

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Publication number
WO2018193935A1
WO2018193935A1 PCT/JP2018/015248 JP2018015248W WO2018193935A1 WO 2018193935 A1 WO2018193935 A1 WO 2018193935A1 JP 2018015248 W JP2018015248 W JP 2018015248W WO 2018193935 A1 WO2018193935 A1 WO 2018193935A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
metal layer
conductive substrate
plating
plating layer
Prior art date
Application number
PCT/JP2018/015248
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
下地　匠
Original Assignee
住友金属鉱山株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友金属鉱山株式会社 filed Critical 住友金属鉱山株式会社
Priority to CN201880025236.7A priority Critical patent/CN110537393B/zh
Priority to JP2019513577A priority patent/JP6954345B2/ja
Publication of WO2018193935A1 publication Critical patent/WO2018193935A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
PCT/JP2018/015248 2017-04-17 2018-04-11 導電性基板、導電性基板の製造方法 WO2018193935A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201880025236.7A CN110537393B (zh) 2017-04-17 2018-04-11 导电性基板、导电性基板的制造方法
JP2019513577A JP6954345B2 (ja) 2017-04-17 2018-04-11 導電性基板、導電性基板の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-081580 2017-04-17
JP2017081580 2017-04-17

Publications (1)

Publication Number Publication Date
WO2018193935A1 true WO2018193935A1 (ja) 2018-10-25

Family

ID=63855842

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/015248 WO2018193935A1 (ja) 2017-04-17 2018-04-11 導電性基板、導電性基板の製造方法

Country Status (4)

Country Link
JP (1) JP6954345B2 (zh)
CN (1) CN110537393B (zh)
TW (1) TWI765021B (zh)
WO (1) WO2018193935A1 (zh)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52145769A (en) * 1976-05-31 1977-12-05 Nippon Mining Co Method of surface treating printed circuit copper foil
JPH07243088A (ja) * 1994-01-21 1995-09-19 Olin Corp 銅ホイルのためのノジュラー銅・ニッケル合金処理方法
JPH1018075A (ja) * 1996-06-28 1998-01-20 Nikko Gould Foil Kk 電解銅箔
JP2001217516A (ja) * 2000-02-03 2001-08-10 Nikko Materials Co Ltd レーザー穴開け性に優れた銅箔及びその製造方法
JP2009149928A (ja) * 2007-12-19 2009-07-09 Hitachi Cable Ltd 印刷回路用銅箔
WO2017033740A1 (ja) * 2015-08-26 2017-03-02 住友金属鉱山株式会社 導電性基板

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3313277B2 (ja) * 1995-09-22 2002-08-12 古河サーキットフォイル株式会社 ファインパターン用電解銅箔とその製造方法
JP2006005149A (ja) * 2004-06-17 2006-01-05 Furukawa Circuit Foil Kk 抵抗層付き導電性基材及び抵抗層付き回路基板材料
JP2007046095A (ja) * 2005-08-09 2007-02-22 Mitsubishi Shindoh Co Ltd 銅箔およびその表面処理方法
JP2007103440A (ja) * 2005-09-30 2007-04-19 Mitsui Mining & Smelting Co Ltd 配線基板の製造方法および配線基板
WO2007145164A1 (ja) * 2006-06-12 2007-12-21 Nippon Mining & Metals Co., Ltd. 粗化処理面を備えた圧延銅又は銅合金箔及び圧延銅又は銅合金箔の粗化方法
JP4973231B2 (ja) * 2006-09-05 2012-07-11 日立化成工業株式会社 銅のエッチング処理方法およびこの方法を用いてなる配線基板と半導体パッケージ
US8642893B2 (en) * 2007-09-28 2014-02-04 Jx Nippon Mining & Metals Corporation Copper foil for printed circuit and copper-clad laminate
US8142905B2 (en) * 2008-06-17 2012-03-27 Jx Nippon Mining & Metals Corporation Copper foil for printed circuit board and copper clad laminate for printed circuit board
WO2012043182A1 (ja) * 2010-09-27 2012-04-05 Jx日鉱日石金属株式会社 プリント配線板用銅箔、その製造方法、プリント配線板用樹脂基板及びプリント配線板
JP5417538B1 (ja) * 2012-06-11 2014-02-19 Ｊｘ日鉱日石金属株式会社 表面処理銅箔及びそれを用いた積層板、プリント配線板、電子機器、並びに、プリント配線板の製造方法
JP2014152352A (ja) * 2013-02-06 2014-08-25 Sh Copper Products Corp 複合銅箔および複合銅箔の製造方法
TW201400643A (zh) * 2013-08-09 2014-01-01 Xin Hong Co Ltd 圖案導電線路的結構及形成方法
JP2015200025A (ja) * 2014-03-31 2015-11-12 Jx日鉱日石金属株式会社 キャリア付銅箔、プリント配線板、積層板、電子機器、積層体及びプリント配線板の製造方法
CN107533881B (zh) * 2015-04-28 2019-06-14 住友金属矿山股份有限公司 导电基板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52145769A (en) * 1976-05-31 1977-12-05 Nippon Mining Co Method of surface treating printed circuit copper foil
JPH07243088A (ja) * 1994-01-21 1995-09-19 Olin Corp 銅ホイルのためのノジュラー銅・ニッケル合金処理方法
JPH1018075A (ja) * 1996-06-28 1998-01-20 Nikko Gould Foil Kk 電解銅箔
JP2001217516A (ja) * 2000-02-03 2001-08-10 Nikko Materials Co Ltd レーザー穴開け性に優れた銅箔及びその製造方法
JP2009149928A (ja) * 2007-12-19 2009-07-09 Hitachi Cable Ltd 印刷回路用銅箔
WO2017033740A1 (ja) * 2015-08-26 2017-03-02 住友金属鉱山株式会社 導電性基板

Also Published As

Publication number Publication date
JPWO2018193935A1 (ja) 2020-03-05
TWI765021B (zh) 2022-05-21
CN110537393A (zh) 2019-12-03
CN110537393B (zh) 2022-09-20
TW201842625A (zh) 2018-12-01
JP6954345B2 (ja) 2021-10-27

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