WO2018180920A1 - 圧延銅箔 - Google Patents

圧延銅箔 Download PDF

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Publication number
WO2018180920A1
WO2018180920A1 PCT/JP2018/011507 JP2018011507W WO2018180920A1 WO 2018180920 A1 WO2018180920 A1 WO 2018180920A1 JP 2018011507 W JP2018011507 W JP 2018011507W WO 2018180920 A1 WO2018180920 A1 WO 2018180920A1
Authority
WO
WIPO (PCT)
Prior art keywords
copper foil
rolled copper
less
annealing
flexible
Prior art date
Application number
PCT/JP2018/011507
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
一貴 青島
Original Assignee
Ｊｘ金属株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｊｘ金属株式会社 filed Critical Ｊｘ金属株式会社
Priority to KR1020197031827A priority Critical patent/KR20190133736A/ko
Priority to JP2019509677A priority patent/JPWO2018180920A1/ja
Priority to CN201880022645.1A priority patent/CN110475883A/zh
Publication of WO2018180920A1 publication Critical patent/WO2018180920A1/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Definitions

  • the present invention relates to a rolled copper foil and the like, and more particularly to a copper foil used for a flexible printed wiring board having excellent vibration resistance.
  • the flexible printed wiring board is obtained by bonding a metal which is a conductive layer and a flexible insulating substrate typified by a resin film.
  • a metal which is a conductive layer and a flexible insulating substrate typified by a resin film.
  • a copper foil is used for the conductive layer, and a rolled copper foil having excellent flexibility is used particularly for applications that require flexibility.
  • General FPC manufacturing process is as follows. First, the copper foil is bonded to the resin film. For joining, there are a method of imidizing by applying heat treatment to a varnish applied on a copper foil, and a method of laminating a resin film with an adhesive and a copper foil. The copper foil with a resin film joined by these steps is referred to as CCL (copper-clad laminate). Thereafter, wiring is formed by etching to complete the FPC.
  • CCL copper-clad laminate
  • Flexibility required for rolled copper foil for FPC has become strict as electronic devices become lighter, shorter, and more functional, and various improvements have been proposed for obtaining rolled copper foil with excellent flex resistance. Yes.
  • Patent Document 1 discloses a copper foil having a specific softening temperature and a thickness of 50 ⁇ m or less.
  • Patent Documents 2 to 3 disclose a rolled copper foil having a thickness of 50 ⁇ m to 300 ⁇ m that is excellent in vibration resistance in addition to bending resistance.
  • Patent Documents 2 to 3 may not be able to be tolerated by the resin of a flexible printed wiring board used in vehicles (eg, polyimide (PI) ), Polyethylene terephthalate (PET), polyethylene naphthalate (PEN)).
  • PI polyimide
  • PET Polyethylene terephthalate
  • PEN polyethylene naphthalate
  • an object of the present invention is to provide a copper foil with few non-recrystallized portions.
  • invention 1 A copper foil having a thickness of 50 ⁇ m or more and an unrecrystallized crystal grain of 10% or less.
  • invention 2 A copper foil having a thickness of 50 ⁇ m or more and a non-recrystallized crystal grain of 10% or less in a metal structure after heating at 180 ° C. for 1 hour.
  • invention 3 A rolled copper foil according to invention 1 or 2, wherein the semi-softening temperature is 150 ° C or lower.
  • invention 4 The rolled copper foil according to invention 1 or 2, wherein the semi-softening temperature is 110 to 150 ° C.
  • invention 5 A rolled copper foil according to any one of inventions 1 to 4, Cu concentration is 99.8% by mass or more, The oxygen concentration is 0.05% by weight or less, and The total concentration of Ag, Sn, B, Zr, Ti, In and P is 0 to 0.03 mass%, Copper foil.
  • invention 6 A flexible copper clad laminate (CCL) comprising the rolled copper foil of any one of inventions 1 to 5.
  • Invention 7) Invention 6 A flexible printed wiring board (FPC) comprising a flexible copper clad laminate.
  • invention 8) An electronic component comprising the flexible printed wiring board of the seventh invention.
  • (Invention 9) A method for producing rolled copper foil, A step of performing recrystallization annealing at 450 to 800 ° C .; The method comprising a step of performing aging precipitation annealing at a temperature lower by 150 to 300 ° C. than a temperature of the recrystallization annealing, and a step of performing cold rolling so that the thickness becomes 50 ⁇ m or more.
  • (Invention 10) It is a manufacturing method of a flexible laminated board, Comprising: This method including the process of laminating
  • (Invention 11) It is a manufacturing method of a flexible printed wiring board, Comprising: The method which includes the process of forming a circuit in the flexible copper clad laminated board obtained by the method of invention 10.
  • the copper foil of the present invention has an unrecrystallized portion of 10% or less. Thereby, the vibration resistance of a flexible printed wiring board can be improved.
  • the copper foil of the present invention has an unrecrystallized portion of 10% or less in the metal structure after heating at 180 ° C. for 1 hour. Thereby, the vibration resistance of the flexible printed wiring board manufactured by heat-processing and forming CCL can be improved.
  • the copper foil may be composed of pure Cu. In another embodiment, the copper foil may contain Cu and other additive elements.
  • the Cu concentration in the copper foil is not particularly specified, but is preferably 99.8% by mass or more, more preferably 99.85% by mass or more, and 99.9% by mass or more for reasons of ensuring high conductivity. Even more preferably. However, even if the Cu concentration is too high, it leads to an increase in cost, so 99.999 mass% or less is preferable, and 99.995 mass% or less is more preferable.
  • the additive element other than Cu may be at least one selected from Ag, Sn, B, Zr, Ti, In, and P. These are preferable from the viewpoint of the flexibility and vibration of the copper foil.
  • the total concentration of Ag, Sn, B, Zr, Ti, In, and P may be 0.03% by mass or less (more preferably 0.02% by mass or less). If it exceeds 0.03 mass%, the strength is further improved, but there are cases where the conductivity is lowered and the softening temperature is raised. Although it does not specifically limit about a lower limit, 0 mass% or more may be sufficient.
  • oxygen concentration in the copper foil leads to an increase in cuprous oxide and leads to the suppression of the development of the cube orientation, it is preferably 0.05% by mass or less, and 0.005% by mass or less. For example, it can be 0.0001 mass% or more and less than 0.01 mass%.
  • oxygen-free copper (OFC) or tough pitch copper specified in JIS-H3510 or JIS-H3100 can be used.
  • the copper foil base material used in the present invention is a rolled copper foil.
  • Rolled copper foil is superior to electrolytic copper foil in that it can cope with an environment in which vibration continuously occurs and has high bending resistance.
  • the thickness should preferably be 50 ⁇ m or more, and more preferably 70 ⁇ m or more. However, if the thickness is excessively large, it may be difficult to remove the conductor layer by etching. Therefore, the thickness is preferably 300 ⁇ m or less, and more preferably 150 ⁇ m or less.
  • the copper foil of the present invention may have a suitable range of softening temperatures.
  • the semi-softening temperature here is defined as follows.
  • the tensile strength (A) after annealing for 60 minutes at various temperatures is measured.
  • the tensile strength (B) after rolling and the tensile strength (C) after annealing at 300 ° C. for 60 minutes and completely softening are measured.
  • the annealing temperature when the tensile strength (A) after annealing becomes an intermediate value between (B) and (C) is defined as a semi-softening temperature.
  • the copper foil of the present invention may have a semi-softening temperature of 150 ° C. or lower, more preferably 110 to 150 ° C. When the temperature is less than 110 ° C., softening at room temperature is likely. If it exceeds 150 ° C., it becomes difficult to soften by heat treatment in the production process of the copper clad laminate.
  • the copper foil of the present invention may have an amount of non-recrystallized particles of 10% or less (more preferably 5% or less, 1% or less, or 0%). If it exceeds 10%, the vibration resistance deteriorates.
  • the lower limit value is not particularly defined, but is typically 0% or more.
  • the amount of unrecrystallized particles can be calculated by the following method. First, a microstructure photograph of a cross section in the rolling direction is taken with a scanning electron microscope (the size of the field of view is not particularly limited, but is typically 100 ⁇ m ⁇ 200 ⁇ m). Next, 100 or more lattice points are written on the photographed photograph, and it is confirmed whether the lattice point is a recrystallized grain or an unrecrystallized part. The two can be identified on the basis of a post-rolling structure (rolling structure) photograph before heating and a structure photograph (completely recrystallized structure) after heating at 300 ° C. ⁇ 1 h. And it calculates from the ratio of the number of all the lattice points, and the number of the lattice points of an unrecrystallized part.
  • the copper foil of the present invention has an amount of unrecrystallized particles of 10% or less in a state after being heated at 180 ° C. for 1 hour. (More preferably 5% or less, 1% or less, or 0%) may be used.
  • the copper foil may finally be 10% or less. As described above, if it exceeds 10%, the vibration resistance deteriorates.
  • the lower limit value is not particularly defined, but is typically 0% or more.
  • the copper foil which concerns on this invention can be manufactured as follows, for example. First, a copper raw material such as electrolytic copper, oxygen-free copper, tough pitch copper or the like is melted, and an alloy element is added as necessary, and then the molten metal is cast to produce an ingot having a thickness of about 100 to 300 mm. Adjustment of the oxygen concentration in the melting step can be performed by techniques known to those skilled in the art, such as carbon sealing of the molten metal and release to the atmosphere. Then, after performing hot rolling, annealing and cold rolling are repeated.
  • a copper raw material such as electrolytic copper, oxygen-free copper, tough pitch copper or the like is melted, and an alloy element is added as necessary, and then the molten metal is cast to produce an ingot having a thickness of about 100 to 300 mm. Adjustment of the oxygen concentration in the melting step can be performed by techniques known to those skilled in the art, such as carbon sealing of the molten metal and release to the atmosphere. Then, after performing hot rolling, annealing and cold rolling
  • Recrystallization annealing and aging precipitation annealing can be performed before final cold rolling (more preferably, immediately before final cold rolling). Recrystallization annealing is performed under conditions of a high temperature and a short time (for example, in a continuous annealing line).
  • the temperature may be 450 to 800 ° C. (more preferably 550 to 700 ° C.), and the time may be 5 seconds to 300 seconds (more preferably 10 seconds to 200 seconds).
  • Aging precipitation annealing can be performed at a temperature lower by 150 to 300 ° C. than the recrystallization annealing described above.
  • the aging precipitation annealing may be 350 ° C. to 500 ° C.
  • the aging precipitation annealing time may be 300 times or more of the residence time in the heating furnace in the recrystallization annealing (continuous annealing line) (for example, 5 to 50 h, more preferably 5 to 20 h).
  • final cold rolling is performed.
  • the degree of reduction in the final cold rolling is 90% or more, more preferably 95% or more, and still more preferably 98% or more. And it can finish to the copper foil of the thickness described in said "(2) Rolled copper foil".
  • the flexible copper-clad laminate of the present invention includes the copper foil described above.
  • the flexible copper clad laminated board of this invention is equipped with the resin layer other than the said copper foil.
  • Several techniques can be employed to provide the resin layer. For example, a method of performing heat treatment by bonding a copper foil and a polyimide resin film using an adhesive made of a thermosetting resin such as epoxy can be used. Or the varnish containing the polyamic acid which is a precursor of a polyimide resin is apply
  • the heat treatment is often performed for bonding the insulating substrate and the copper foil. Therefore, the annealing process after the final cold rolling described above is performed by the heat treatment. It can also be combined.
  • the copper foil having the characteristics according to the present invention can be formed by setting the heat treatment during bonding at 150 to 250 ° C. (preferably 180 ° C. or more) for 0.5 to 3 hours (preferably 1 hour or more). Can be simultaneously bonded to the insulating substrate.
  • a roughening process can be performed with respect to copper foil.
  • the adhesive strength of resin and copper foil can be improved.
  • the roughening process can be performed under the following conditions. Liquid composition: Cu 10-20 g / L, Co 1-10 g / L, Ni 1-15 g / L pH: 1 to 4 Temperature: 30-50 ° C Current density (Dk): 20 to 50 A / dm 2 Time: 1-5 seconds
  • the flexible printed wiring board of the present invention includes the above-described flexible copper-clad laminate. Moreover, it is possible to manufacture a flexible printed wiring board (FPC) by forming a wiring according to a known procedure using the FCCL according to the present invention as a material. For example, apply an etching resist to the copper foil surface of the FCCL only on the necessary part as the conductor pattern, spray the etching solution onto the copper foil surface to remove the unnecessary copper foil, form the conductor pattern, and then peel off the etching resist -The method of removing and exposing a conductor pattern is mentioned. After forming the conductor pattern, it is common to apply a protective coverlay film.
  • FPC flexible printed wiring board
  • the flexible printed wiring board of the present invention can have excellent vibration resistance.
  • the vibration resistance time specified in JIS-D1601 may be 10 hours or more, more preferably 100 hours or more.
  • FPCs are used in electronic and electrical equipment for movable parts in hard disks, mobile phone hinges and sliding parts, printer heads, optical pickups, notebook PCs, etc. This corresponds to FPC.
  • the FPC according to the present invention is suitable as a vehicle-mounted or automatic machine control FPC that uses a relatively large thickness of copper foil and also requires vibration resistance.
  • a polyimide film having a thickness of 50 ⁇ m was laminated on the roughened surface under the condition of hot pressing at a temperature of 180 ° C. for 1 hour to produce a single-sided FCCL. Then, eight circuit etches with a length of 120 mm and a line and space of 0.3 mm / 0.3 mm were formed, and finally, a polyimide coverlay film with a thickness of 50 ⁇ m was hot-pressed on both sides at a temperature of 180 ° C. for 1 hour. By laminating, each test piece of FPC having a length of 150 mm and a width of 15 mm was produced.
  • a loop dimension refers to the distance from the fixed location of a test piece to the front-end
  • the vibration resistance time of vibration resistance was evaluated according to the following criteria. ⁇ : Less than 10 to 100 ⁇ : Less than 10 hours ⁇ : More than 100 hours
  • ⁇ Measurement of the amount of unrecrystallized> First, a microstructure photograph of a cross section in the rolling direction was taken with a scanning electron microscope (the size of the field of view is not particularly limited, but is typically 100 ⁇ m ⁇ 200 ⁇ m). Next, 100 or more lattice points were written on the photograph taken, and it was confirmed whether the lattice points were crystal grains or non-recrystallized portions. And it computed from the ratio of the number of all the lattice points, and the number of the lattice points of a non-recrystallized part.
  • the temperature of aging precipitation annealing was 350 ° C. lower than the recrystallization annealing temperature (that is, not 150 to 300 ° C. lower), so that many unrecrystallized crystals remained. . Therefore, vibration resistance was inferior. Moreover, the semi-softening temperature became high.
  • the description “or” or “or” includes a case where only one of the options is satisfied or a case where all the options are satisfied.
  • the description “A or B” or “A or B” it includes both the case where A is satisfied and B is not satisfied, the case where B is satisfied and A is not satisfied, and the case where A is satisfied and B is satisfied I intend to.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
PCT/JP2018/011507 2017-03-30 2018-03-22 圧延銅箔 WO2018180920A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020197031827A KR20190133736A (ko) 2017-03-30 2018-03-22 압연 구리박
JP2019509677A JPWO2018180920A1 (ja) 2017-03-30 2018-03-22 圧延銅箔
CN201880022645.1A CN110475883A (zh) 2017-03-30 2018-03-22 轧制铜箔

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-068797 2017-03-30
JP2017068797 2017-03-30

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WO2018180920A1 true WO2018180920A1 (ja) 2018-10-04

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JP (1) JPWO2018180920A1 (ko)
KR (1) KR20190133736A (ko)
CN (1) CN110475883A (ko)
TW (1) TW201840869A (ko)
WO (1) WO2018180920A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220279279A1 (en) * 2019-08-19 2022-09-01 Goertek Inc. Conductive film for sound producing apparatus and sound producing apparatus
CN115537595A (zh) * 2022-09-30 2022-12-30 宁波金田铜业(集团)股份有限公司 一种铜箔及其制备方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112187975A (zh) * 2020-09-17 2021-01-05 淮安维嘉益集成科技有限公司 Wofc2材料制作摄像头模组fpc基板应用

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000192172A (ja) * 1998-12-28 2000-07-11 Nippon Mining & Metals Co Ltd フレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP2001144391A (ja) * 1999-11-16 2001-05-25 Nippon Mining & Metals Co Ltd プリント回路基板用圧延銅箔およびその製造方法
JP2008248274A (ja) * 2007-03-29 2008-10-16 Nikko Kinzoku Kk 圧延銅箔
WO2011115305A1 (ja) * 2010-03-17 2011-09-22 新日本製鐵株式会社 金属テープ材料、及び太陽電池集電用インターコネクター
JP2013235796A (ja) * 2012-05-11 2013-11-21 Jx Nippon Mining & Metals Corp 超電導膜形成用圧延銅箔
JP2014077182A (ja) * 2012-10-12 2014-05-01 Sh Copper Products Corp 圧延銅箔
JP2014162930A (ja) * 2013-02-21 2014-09-08 Jx Nippon Mining & Metals Corp 銅箔、銅張積層体、フレキシブル配線板及び立体成型体

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3856582B2 (ja) * 1998-11-17 2006-12-13 日鉱金属株式会社 フレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP3856581B2 (ja) * 1999-01-18 2006-12-13 日鉱金属株式会社 フレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP2001262296A (ja) * 2000-03-17 2001-09-26 Nippon Mining & Metals Co Ltd 圧延銅箔およびその製造方法
JP2003193211A (ja) * 2001-12-27 2003-07-09 Nippon Mining & Metals Co Ltd 銅張積層板用圧延銅箔
JP5426936B2 (ja) * 2009-06-18 2014-02-26 株式会社Ｓｈカッパープロダクツ 銅合金の製造方法及び銅合金
CN102573287B (zh) * 2010-10-28 2014-09-17 Jx日矿日石金属株式会社 轧制铜箔
JP6360654B2 (ja) 2012-01-17 2018-07-18 Ｊｘ金属株式会社 フレキシブルプリント配線板用圧延銅箔
JP2013167013A (ja) 2012-01-17 2013-08-29 Jx Nippon Mining & Metals Corp フレキシブルプリント配線板用圧延銅箔
EP3231880B1 (en) * 2014-12-12 2020-10-21 Nippon Steel Corporation Oriented copper plate, copper- clad laminate, flexible circuit board, and electronic device
JP6446007B2 (ja) * 2015-12-25 2018-12-26 株式会社神戸製鋼所 放熱部品用銅合金板

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000192172A (ja) * 1998-12-28 2000-07-11 Nippon Mining & Metals Co Ltd フレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP2001144391A (ja) * 1999-11-16 2001-05-25 Nippon Mining & Metals Co Ltd プリント回路基板用圧延銅箔およびその製造方法
JP2008248274A (ja) * 2007-03-29 2008-10-16 Nikko Kinzoku Kk 圧延銅箔
WO2011115305A1 (ja) * 2010-03-17 2011-09-22 新日本製鐵株式会社 金属テープ材料、及び太陽電池集電用インターコネクター
JP2013235796A (ja) * 2012-05-11 2013-11-21 Jx Nippon Mining & Metals Corp 超電導膜形成用圧延銅箔
JP2014077182A (ja) * 2012-10-12 2014-05-01 Sh Copper Products Corp 圧延銅箔
JP2014162930A (ja) * 2013-02-21 2014-09-08 Jx Nippon Mining & Metals Corp 銅箔、銅張積層体、フレキシブル配線板及び立体成型体

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220279279A1 (en) * 2019-08-19 2022-09-01 Goertek Inc. Conductive film for sound producing apparatus and sound producing apparatus
CN115537595A (zh) * 2022-09-30 2022-12-30 宁波金田铜业(集团)股份有限公司 一种铜箔及其制备方法

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KR20190133736A (ko) 2019-12-03
JPWO2018180920A1 (ja) 2019-12-12
CN110475883A (zh) 2019-11-19
TW201840869A (zh) 2018-11-16

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