JPWO2018180920A1 - 圧延銅箔 - Google Patents

圧延銅箔 Download PDF

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Publication number
JPWO2018180920A1
JPWO2018180920A1 JP2019509677A JP2019509677A JPWO2018180920A1 JP WO2018180920 A1 JPWO2018180920 A1 JP WO2018180920A1 JP 2019509677 A JP2019509677 A JP 2019509677A JP 2019509677 A JP2019509677 A JP 2019509677A JP WO2018180920 A1 JPWO2018180920 A1 JP WO2018180920A1
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JP
Japan
Prior art keywords
copper foil
less
rolled copper
temperature
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2019509677A
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English (en)
Japanese (ja)
Inventor
一貴 青島
一貴 青島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Publication of JPWO2018180920A1 publication Critical patent/JPWO2018180920A1/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2019509677A 2017-03-30 2018-03-22 圧延銅箔 Pending JPWO2018180920A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017068797 2017-03-30
JP2017068797 2017-03-30
PCT/JP2018/011507 WO2018180920A1 (ja) 2017-03-30 2018-03-22 圧延銅箔

Publications (1)

Publication Number Publication Date
JPWO2018180920A1 true JPWO2018180920A1 (ja) 2019-12-12

Family

ID=63675753

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019509677A Pending JPWO2018180920A1 (ja) 2017-03-30 2018-03-22 圧延銅箔

Country Status (5)

Country Link
JP (1) JPWO2018180920A1 (ko)
KR (1) KR20190133736A (ko)
CN (1) CN110475883A (ko)
TW (1) TW201840869A (ko)
WO (1) WO2018180920A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110545505A (zh) * 2019-08-19 2019-12-06 歌尔股份有限公司 一种用于发声装置的导电膜以及发声装置
CN112187975A (zh) * 2020-09-17 2021-01-05 淮安维嘉益集成科技有限公司 Wofc2材料制作摄像头模组fpc基板应用
CN115537595B (zh) * 2022-09-30 2023-08-01 宁波金田铜业(集团)股份有限公司 一种铜箔及其制备方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000192172A (ja) * 1998-12-28 2000-07-11 Nippon Mining & Metals Co Ltd フレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP2001262296A (ja) * 2000-03-17 2001-09-26 Nippon Mining & Metals Co Ltd 圧延銅箔およびその製造方法
JP2011001593A (ja) * 2009-06-18 2011-01-06 Hitachi Cable Ltd 銅合金の製造方法及び銅合金
WO2011115305A1 (ja) * 2010-03-17 2011-09-22 新日本製鐵株式会社 金属テープ材料、及び太陽電池集電用インターコネクター
JP2013235796A (ja) * 2012-05-11 2013-11-21 Jx Nippon Mining & Metals Corp 超電導膜形成用圧延銅箔
JP2014077182A (ja) * 2012-10-12 2014-05-01 Sh Copper Products Corp 圧延銅箔
WO2016093349A1 (ja) * 2014-12-12 2016-06-16 新日鐵住金株式会社 配向銅板、銅張積層板、可撓性回路基板、及び電子機器
JP2017119909A (ja) * 2015-12-25 2017-07-06 株式会社神戸製鋼所 放熱部品用銅合金板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3856582B2 (ja) * 1998-11-17 2006-12-13 日鉱金属株式会社 フレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP3856581B2 (ja) * 1999-01-18 2006-12-13 日鉱金属株式会社 フレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP3709109B2 (ja) * 1999-11-16 2005-10-19 日鉱金属加工株式会社 張出し加工性に優れたプリント回路基板用圧延銅箔およびその製造方法
JP2003193211A (ja) * 2001-12-27 2003-07-09 Nippon Mining & Metals Co Ltd 銅張積層板用圧延銅箔
JP2008248274A (ja) * 2007-03-29 2008-10-16 Nikko Kinzoku Kk 圧延銅箔
CN102573287B (zh) * 2010-10-28 2014-09-17 Jx日矿日石金属株式会社 轧制铜箔
JP6360654B2 (ja) 2012-01-17 2018-07-18 Ｊｘ金属株式会社 フレキシブルプリント配線板用圧延銅箔
JP2013167013A (ja) 2012-01-17 2013-08-29 Jx Nippon Mining & Metals Corp フレキシブルプリント配線板用圧延銅箔
JP6220132B2 (ja) * 2013-02-21 2017-10-25 Ｊｘ金属株式会社 銅箔、銅張積層体、フレキシブル配線板及び立体成型体

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000192172A (ja) * 1998-12-28 2000-07-11 Nippon Mining & Metals Co Ltd フレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP2001262296A (ja) * 2000-03-17 2001-09-26 Nippon Mining & Metals Co Ltd 圧延銅箔およびその製造方法
JP2011001593A (ja) * 2009-06-18 2011-01-06 Hitachi Cable Ltd 銅合金の製造方法及び銅合金
WO2011115305A1 (ja) * 2010-03-17 2011-09-22 新日本製鐵株式会社 金属テープ材料、及び太陽電池集電用インターコネクター
JP2013235796A (ja) * 2012-05-11 2013-11-21 Jx Nippon Mining & Metals Corp 超電導膜形成用圧延銅箔
JP2014077182A (ja) * 2012-10-12 2014-05-01 Sh Copper Products Corp 圧延銅箔
WO2016093349A1 (ja) * 2014-12-12 2016-06-16 新日鐵住金株式会社 配向銅板、銅張積層板、可撓性回路基板、及び電子機器
JP2017119909A (ja) * 2015-12-25 2017-07-06 株式会社神戸製鋼所 放熱部品用銅合金板

Also Published As

Publication number Publication date
WO2018180920A1 (ja) 2018-10-04
TW201840869A (zh) 2018-11-16
KR20190133736A (ko) 2019-12-03
CN110475883A (zh) 2019-11-19

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