WO2018176657A1 - 一种表面贴装式rgb-led封装模组及其制造方法 - Google Patents

一种表面贴装式rgb-led封装模组及其制造方法 Download PDF

Info

Publication number
WO2018176657A1
WO2018176657A1 PCT/CN2017/089336 CN2017089336W WO2018176657A1 WO 2018176657 A1 WO2018176657 A1 WO 2018176657A1 CN 2017089336 W CN2017089336 W CN 2017089336W WO 2018176657 A1 WO2018176657 A1 WO 2018176657A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
package module
surface mount
led package
light
Prior art date
Application number
PCT/CN2017/089336
Other languages
English (en)
French (fr)
Inventor
李邵立
孔一平
袁信成
Original Assignee
山东晶泰星光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 山东晶泰星光电科技有限公司 filed Critical 山东晶泰星光电科技有限公司
Priority to EP17904279.1A priority Critical patent/EP3582261B1/en
Priority to US16/346,118 priority patent/US20190259736A1/en
Priority to JP2019522319A priority patent/JP2020502780A/ja
Publication of WO2018176657A1 publication Critical patent/WO2018176657A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

Definitions

  • the present invention relates to SMD LED packaging technology, and more particularly to a surface mount RGB LED package module and a method of fabricating the same.
  • the display LEDs are transformed from the original DIP (dual inline-pin package) structure to the SMD (Surface Mounted Devices) structure.
  • the SMD structure LED has the advantages of light weight, smaller individual, automatic installation, large illumination angle, uniform color, and reduced attenuation.
  • the general SMD LED has the above advantages, there is still a large attenuation. Long heat conduction path, low current carrying capacity, complex production, low reliability, low moisture resistance, and poor weather resistance. If the reliability of the product is to be improved without changing the overall structure of the product, there is still no good solution in the industry.
  • the products In the existing SMD LED manufacturing, the products generally adopt the PLCC4 structure (for example, 3528, 2121, 1010, etc.), but the above structures are all unique, the customer uses ⁇ , the production efficiency is low, and only one one is occupied. Moreover, it is difficult to repair. When it is produced into a small-sized product, such as 1.0mm*1.0mm and the following specifications, the production difficulty of the product is doubled, and the mechanical strength of the product is also low, which is very strong under external force. It is easy to damage, production efficiency is low, and the requirements for placement equipment are high.
  • PLCC4 structure for example, 3528, 2121, 1010, etc.
  • the production efficiency of the COB (chip on board) integrated module has been improved, but the COB integrated module also has many problems, such as the difference in the center value of different batches of chips in the module or the difference in substrate ink.
  • the color difference is caused, and the consistency of the whole screen is poor.
  • the chip is directly mounted on the circuit board, lacks protection, cannot guarantee reliability, and the illumination unit fails to maintain high cost. Due to the difference in the center value of different batches of chips or the difference in substrate ink, the color difference is different, the consistency of the whole screen is poor, and the cost of repairing the failure of the light-emitting unit is high.
  • An object of the present invention is to provide a surface mount RGB LED package module and a manufacturing method thereof, which aim to solve the problems of low production efficiency, high production difficulty, low mechanical strength, and the like of the existing chip RGB LED products. problem.
  • a surface mount RGB LED package module includes a substrate and a light emitting unit disposed on the substrate, wherein the light emitting unit is provided with a protective layer, the number of the light emitting units being at least two, each of the light emitting
  • the unit includes four independent upper pads and a set of RGB LED chips, and the RGB LED chips are disposed on any one of the upper pads, and are connected to the other three upper pads by keys and lines, and the upper pad is disposed There is a metal hole that passes through the upper and lower sides of the substrate, and a lower pad is disposed at a position corresponding to the metal hole on the reverse side of the substrate, and the lower pads are independent from each other.
  • the surface mount RGB LED package module wherein an isolation frame is further disposed around the light emitting unit.
  • the surface mount RGB LED package module wherein the isolation frame is a black frame that is opaque.
  • the surface mount RGB LED package module wherein the surface of the protective layer is rough and non-reflective.
  • a method for manufacturing the above surface mount RGB LED package module comprises the following steps:
  • Step 1 coating copper and via holes on both sides of the substrate, and forming a plurality of sets of metal holes that are turned up and down to conduct the front and back sides of the substrate;
  • Step 2 etching a plurality of sets of upper pads on the front side of the substrate, etching the lower pads on the reverse side, and etching the plating circuit to electrically connect all the upper pads and the lower pads on the substrate;
  • Step 3 plating the substrate
  • Step 4 RGB LED chip is crystallized on the substrate, and wire bonding is performed to form a plurality of light emitting units
  • Step 5 Cutting the substrate according to the number of the light-emitting units as needed to form a package module having a plurality of light-emitting units, and cutting the germanium to cut the plating circuit so that all of the upper and lower pads are independent of each other
  • step 4 further comprises: after forming the light emitting unit, forming a protective layer on the light emitting unit.
  • step 4 further comprises: after forming the light emitting unit, fabricating an isolation frame around each of the light emitting units.
  • step 3 further comprises filling the metal hole with a seal.
  • the beneficial effects of the present invention include: The surface mount RGB LED package module provided by the invention and the manufacturing method thereof, the plurality of light emitting units are integrated in one package module, so that the production efficiency of the LED in subsequent application production The utility model is greatly improved, and the production cost is greatly reduced; meanwhile, a plurality of light-emitting units are integrated in one module, and the LED module provided by the invention has better sealing performance and is less easy than the conventional single-shaped LED. It is eroded by water vapor and has a longer life.
  • multiple light-emitting units are integrated on one module, which can effectively improve the overall resistance of the display to external mechanical strength. By setting the isolation frame in the light-emitting unit, the influence between the light-emitting units is reduced.
  • one template of the invention includes less light-emitting units, which can effectively avoid the difference of the central value of different batches of chips or the difference of substrate inks. Color difference, poor consistency of the whole screen, and now the integrated module has high maintenance cost if the lighting unit fails to be repaired, and the maintenance cost of the invention is low.
  • FIG. 1 is a schematic structural view of a conventional PPA stent.
  • FIG. 2 is a schematic structural view of a conventional CHIP type package bracket.
  • FIG 3 is a front view of a 1*2 surface mount RGB LED package module provided by the present invention.
  • 4 is a front view of a 1*2 surface mount RGB LED package module with an isolation frame according to the present invention
  • 5 is a reverse side view of a 1*2 surface mount RGB LED package module according to the present invention.
  • FIG. 6 is a cross-sectional view of a 1*2 surface mount RGB LED package module according to the present invention.
  • FIG. 7 is a cross-sectional view of a 1*2 surface mount RGB LED package module with an isolation frame according to the present invention.
  • 8a is a circuit diagram of a plating of a 1*2 surface mount RGB LED package module according to the present invention.
  • 8b is a cutting circuit diagram of a 1*2 surface mount RGB LED package module provided by the present invention.
  • FIG. 9 is a front view of a 1*3 surface mount RGB LED package module provided by the present invention.
  • FIG. 10 is a reverse side view of a 1*3 surface mount RGB LED package module provided by the present invention.
  • 11a is a circuit diagram of a plating process of a 1*3 surface mount RGB LED package module provided by the present invention.
  • FIG. 1 ib is a cutting circuit diagram of a 1*3 surface mount RGB LED package module provided by the present invention.
  • FIG. 12 is a front view of a 1*3 surface mount RGB LED package module according to the present invention.
  • FIG. 13 is a reverse side view of a 1*3 surface mount RGB LED package module provided by the present invention.
  • FIG. 14 is a cutting circuit diagram of a 1*3 surface mount RGB LED package module provided by the present invention.
  • 15 is a front view of a 1*4 surface mount RGB LED package module according to the present invention.
  • 16 is a reverse side view of a 1*4 surface mount RGB LED package module according to the present invention.
  • 17a is a circuit diagram of a reverse plating of a 1*4 surface mount RGB LED package module according to the present invention.
  • 17b is a reverse circuit diagram of a 1*4 surface mount RGB LED package module provided by the present invention.
  • 18a is a front plating circuit diagram of a 1*4 surface mount RGB LED package module provided by the present invention.
  • 18b is a front cut circuit diagram of a 1*4 surface mount RGB LED package module according to the present invention.
  • 19 is a circuit diagram of a reverse plating of a 1*4 surface mount RGB LED package module according to the present invention.
  • 20 is a circuit diagram of a reverse plating of a 1*4 surface mount RGB LED package module according to the present invention.
  • 21 is a flow chart of manufacturing a surface mount RGB LED package module according to the present invention.
  • FIG. 1 is a schematic structural view of a conventional PPA+ copper bow I-package bracket
  • FIG. 2 is a schematic structural view of a conventional CHIP type package bracket, which are both single package structures.
  • LED display With the reduction of the pixel pitch of the screen and the increasing number of packaged devices per unit area, the number of LED packaged devices used in the application is huge, and the production efficiency of the single-package production method is extremely low.
  • the light emitting unit is provided with a protective layer 8, the number of the light emitting units being at least two, each
  • the light emitting unit includes four independent upper pads 2 and a set of RGB LED chips 4, and the RGB LED chips 4 are disposed on any one of the upper pads 2, and are connected to the other three upper pads 2 through the keys and lines 401,
  • the pad 2 is provided with a metal hole 3 which is electrically connected through the upper and lower sides of the substrate 1.
  • the lower surface of the substrate 1 is provided with a lower pad 5 at a position corresponding to the metal hole 3, and the lower pads 5 are independent from each other.
  • the package module provided by the present invention is provided with a plurality of light-emitting units on the substrate 1, and is mounted in the form of a module after performing subsequent LED lamp bead mounting.
  • the mounting efficiency of the present invention is extremely high, and the mounting efficiency is improved as the number of light emitting units on the package module increases. If the number of the light-emitting units on the package module is 16, the mounting efficiency can be increased by 16 times.
  • the number of the light-emitting units of the present invention is 2-16.
  • the arrangement of the light emitting units may also be inverted "L" shaped.
  • the arrangement of the light-emitting units is not limited in the present invention, and may be a "one"-shaped arrangement, or a combination of rows and columns of MxN (M and N are integers), and may also be other irregular arrangement shapes.
  • MxN M and N are integers
  • the invention is not limited thereto. It should be noted that those skilled in the art can make modifications or changes in accordance with the above description, all of which are within the scope of the appended claims.
  • an isolation frame 9 is disposed around the illumination unit.
  • the isolation frame 9 is an opaque frame that further prevents light from penetrating the isolation frame 9. Further, the color of the isolation frame 9 is black.
  • the surface of the protective layer 8 is rough and non-reflective.
  • the protective layer 8 is a translucent epoxy resin layer with a diffusing agent.
  • the protective layer 8 is disposed to prevent the ingress of moisture and prevent the element. Device affected mechanical injury.
  • the use of a translucent epoxy resin adhesive with a diffusing agent as the protective layer 8 allows the light to pass through the protective layer 8 more uniformly, reducing the influence of the protective layer 8 on light.
  • the four independent upper pads are respectively an "L" shaped die pad 203 for placing the R GB LED chip 4 in the middle and respectively located at the upper left corner.
  • the first bonding wire region 201, the second bonding wire region 202, and the third bonding wire region 203 in the upper right corner and the lower left corner, preferably, the second bonding wire region 20 3 serves as a common pole region.
  • the invention adopts solid crystal glue to RGB
  • the LED chip 4 is attached to the centered chip pad 203 to make the light more concentrated.
  • both the upper pad 2 and the lower pad 5 must be plated before soldering, since the upper pad 2 and the lower pad 5 are independent of each other, before plating, It is necessary to electrically connect all of the upper pads 2 and the lower pads 5 to perform plating.
  • the present invention connects all the pads by providing a plating circuit, and finally cuts them into individual products, cutting the plating circuit to keep the individual pads independent.
  • the present invention provides a package that is not a single package and is a package module having a plurality of light-emitting units. Therefore, a plating circuit is provided.
  • Embodiment 1 is a diagrammatic representation of Embodiment 1 :
  • the present invention provides a 1*2 surface mount RGB LED package module.
  • the package module has two light emitting units.
  • an isolation frame 9 may be provided around the light-emitting unit to reduce the influence between the light-emitting units.
  • an identification area 101 may be disposed in the middle of each of the light-emitting units to facilitate subsequent testing and packaging of the device to identify the front and back sides of the package module.
  • a protective layer 8 may be further disposed on the light emitting unit, and the protective layer 8 is preferably a translucent epoxy resin layer with a diffusing agent, and the protective layer 8 is disposed to prevent moisture. Enter, and prevent components from being mechanically damaged.
  • the protective layer 8 can be formed by molding or injection molding. Referring to FIG. 8a and FIG. 8b, in actual production, a plurality of light-emitting units are first disposed on the substrate 1, and then a package module having a specified number of light-emitting units is cut by cutting. 8a is a plating circuit diagram of a package module having two light emitting units, and FIG. 8b is a corresponding cutting circuit diagram. After the cutting process, the cutting line 7 is cut.
  • the cutting line 7 does not need to be Actually, just set the program and let the cutting device cut according to the set cutting direction. Cut it.
  • the blade width of the cutting tool is larger than the width of the plating circuit 6, ensuring that the plating circuit 6 can be completely cut.
  • the plating circuit 6 may be disposed on the front surface of the substrate 1, or may be disposed on the reverse side of the substrate 1, and may even be disposed on the front and back sides of the substrate 1. Due to the presence of the metal hole 3, the upper pad 2 and the lower pad 5 of the corresponding position are electrically connected to each other, so that all the soldering can be realized as long as all the upper pads 2 are connected or all the lower pads 5 are connected. The discs are electrically connected. As shown in Figs.
  • a plating circuit 6 is disposed on the front surface of the substrate 1, a bus of the plating circuit 6 is disposed on the dicing line 7, and all of the upper pads 2 are connected to the nearest plating circuit 6 through the plating circuit 6. On the bus, to ensure that all the plating circuits 6 are cut off during the cutting process, all the upper pads 2 are independent of each other.
  • the electroplating circuit 6 of Fig. 8a is only one of the circuit connection modes, and those skilled in the art can easily associate other connection modes according to the present invention, which is not limited by the present invention. Connections that are modified or altered in light of the above description are intended to be within the scope of the appended claims.
  • the 1*3 surface mount RGB LED package module provided by the present invention has three light emitting units.
  • the structure of the light-emitting unit is the same as that of the light-emitting unit in Embodiment 1.
  • the substrate 1 is provided with 24 light-emitting units distributed in 4 rows and 6 columns.
  • the cutting line 7 divides the substrate 1 into eight package modules, and the cutting line 7 is also provided with a plating circuit 6, and all the plating circuits 6 of this embodiment are disposed on the front side of the substrate 1.
  • All of the upper pads 2 are connected to the nearest plating circuit 6 at the position of the cutting line 7 through the plating circuit 6, and at the cutting substrate 1, all the plating circuits 6 at the position of the cutting line 7 are cut, and then all the upper electrodes are soldered.
  • the discs 2 are thus independent of each other and are no longer connected by the plating circuit 6.
  • FIG. 14 show another 1*3 surface mount RGB LED package module according to the present invention. All package modules also have three light emitting units, but the arrangement of the light emitting units and the embodiment 2 different. In the present embodiment, the three light emitting units are arranged in an inverted "L" shape, and the present invention is not limited to the arrangement of the light emitting units.
  • the plating circuit of this embodiment is disposed on the front surface of the substrate 1, and the position of the cutting line 7 also has a plating circuit 6, and all the upper pads 2 are electrically connected to the plating circuit 6 at the position of the cutting line 7, for specific The connection mode is not limited in this embodiment.
  • Example 4 15 to FIG. 20 show a 1*4 surface mount RGB LED package module according to the present invention, wherein the package module has four light emitting units. As shown in Fig. 15, the light-emitting units are arranged in a square shape. In other embodiments of the present invention, they may be arranged in a line, and the plating circuit 6 is connected in the same manner as in the first and second embodiments.
  • the plating circuit 6 may be disposed on the reverse side of the substrate 1 (as shown in FIG. 17a), or on the front surface of the substrate 1 (as shown in FIG. 18a), or may be combined with the front side and the reverse side. mode.
  • connection mode of the electroplating circuit 6 is varied, and other modifications can be easily made by those skilled in the art based on the description of the present invention, and all such improvements and modifications are within the scope of the appended claims.
  • the present invention also provides a method for manufacturing the above surface mount RGB LED package module, comprising the following steps:
  • Step 1 On both sides of the substrate 1, copper and via holes are formed, and a plurality of sets of metal holes 3 that are vertically turned on are formed, and the front and back sides of the substrate 1 are electrically connected through the arrangement of the metal holes 3; in practical applications, the substrate 1 Can use BT CCL directly
  • Step 2 A plurality of sets of upper pads 2 are etched on the front side of the substrate 1, and the lower pads 5 are etched on the reverse side, and the plating circuit 6 is etched to electrically connect all the upper pads 2 and the lower pads 5 on the substrate 1.
  • the plating circuit 6 functions to electrically connect all of the upper pads 2 and the lower pads 5 for electroplating use in subsequent processes, and the connection manner of the plating circuit 6 is not limited.
  • Step 3 Electroplating the substrate 1; preferably, during the electroplating process, the metal hole 3 is filled and sealed to ensure that the glue does not penetrate into the lower pad through the metal hole 3 during the subsequent process of manufacturing the protective layer 8. 5 on.
  • Step 4 The RGB LED chip 4 is solid-crystallized on the substrate 1 by a die bonding glue, and a bonding wire is formed to form a plurality of light emitting units; preferably, the physical connection is made by a key and a wire by means of a key and a wire. .
  • Step 5 Cutting the substrate 1 according to the number of the light-emitting units as needed to form a package module having a plurality of light-emitting units, and cutting the germanium to cut the plating circuit 6 so that all the upper pads 2 and the lower pads 5 are Independent
  • the plating circuit 6 is disposed on the front side and/or the reverse side of the substrate 1.
  • the plating circuit 6 is disposed on the reverse side of the substrate 1 to facilitate cutting.
  • the step 4 further includes: after forming the light emitting unit, on the light emitting unit As a protective layer 8.
  • the step 4 further includes: after forming the light emitting unit, fabricating the isolation frame 9 around each of the light emitting units.
  • the insulation frame 9 is subjected to baking aging to further strengthen the mechanical strength of the insulation frame 9, and preferably, the baking temperature is 100 to 300 degrees Celsius.
  • the surface mount RGB LED package module and the manufacturing method thereof provide a plurality of light emitting units integrated in one package module, so that the production efficiency of the LED in subsequent application production is greatly improved, greatly The production cost is reduced; meanwhile, a plurality of light-emitting units are integrated in one module, and the LED module provided by the invention has better sealing performance, less vulnerability to water vapor erosion and longer life than conventional single-mode LEDs.
  • the isolation frame in the light-emitting unit By setting the isolation frame in the light-emitting unit, the influence between the light-emitting units is reduced, thereby improving the resolution and contrast of the L ED display.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

一种表面贴装式RGB-LED封装模组及其制造方法，该封装模组包括基板（1）以及设置在基板上的发光单元，发光单元上设置有保护层（8），发光单元的数量至少为两个，每个发光单元包括四个相互独立的上焊盘（2）和一组RGB-LED芯片（4），RGB-LED芯片设置在任意一个上焊盘上，通过键和线（401）与另外三个上焊盘连接，上焊盘设置有穿过基板的上下导通的金属孔（3），基板反面与金属孔对应位置设置有下焊盘（5），下焊盘之间相互独立。通过将多个发光单元集成在一个封装模组中，使LED在后续应用生产的生产效率得到提高，降低了生产成本。

Description

一种表面贴装式 RGB-LED封装模组及其制造方法 技术领域
[0001] 本发明涉及到 SMD LED封装技术， 特别是涉及一种表面贴装式 RGB LED封装 模组及其制造方法。
背景技术
[0002] 随着显示屏产业不断发展， 显示屏用 LED由原来的 DIP (dual inline-pin package ， 双列直插式封装技术） 结构高速向 SMD (Surface Mounted Devices, 表面贴装 器件） 结构转变， SMD结构的 LED具有重量轻、 个体更小、 自动化安装、 发光 角度大、 颜色均匀、 衰减少等优点越来越被人接受， 虽然一般 SMD LED具有以 上优点， 但还是存在有衰减较大、 导热路径长、 承载电流低、 生产复杂， 可靠 性低， 防潮性能低， 耐气候性差等问题。 如果在不改变产品的整体结构的情况 下， 要提高产品的可靠性， 至今在业界仍没有较好的解决办法。
[0003] 在现有的 SMD LED制造中， 产品一般采用 PLCC4结构 （例如 3528,2121, 1010等 规格） ， 但上述结构都是单个存在， 客户使用吋， 生产效率低， 只能一个一个 贝占， 而且维修难度大， 当生产成小尺寸的产品吋， 如 1.0mm*1.0mm的规格以及 以下规格吋， 产品的生产难度成倍增加， 产品的机械强度也会很低， 在外力作 用下很容易损坏， 生产效率也会很低， 并且对贴装设备的要求也会很高。 针对 单颗贴装的问题， 采用 COB (chip On board) 集成模组的生产效率有所提高， 但 是 COB集成模组同样存在诸多问题， 如模组中不同批次芯片中心值差异或基板 油墨差异导致显色差异， 整屏一致性差， 另一方面， 芯片直接安装在电路板上 ， 缺乏保护， 无法保证可靠性， 且发光单元失效维修成本高。 因不同批次芯片 中心值差异或基板油墨差异导致显色差异， 整屏一致性差问题， 还有发光单元 失效维修成本高等问题。
[0004] 因此， 现有技术还有待于改进和发展。
技术问题
问题的解决方案 技术解决方案
[0005] 本发明的目的在于提供一种表面贴装式 RGB LED封装模组及其制造方法， 旨在 解决现有的贴片式 RGB LED产品生产效率低、 生产难度大、 产品机械强度低等 问题。
[0006] 为解决上述问题， 本发明的技术方案如下：
[0007] 一种表面贴装式 RGB LED封装模组， 包括基板以及设置在基板上的发光单元， 所述发光单元上设置有保护层， 所述发光单元的数量至少为两个， 每个发光单 元包括四个相互独立的上焊盘和一组 RGB LED芯片， 所述 RGB LED芯片设置在 任意一个上焊盘上， 通过键和线与另外三个上焊盘连接， 所述上焊盘设置有穿 过所述基板的上下导通的金属孔， 所述基板反面与所述金属孔对应位置设置有 下焊盘， 所述下焊盘之间相互独立。
[0008] 所述的表面贴装式 RGB LED封装模组， 其中， 所述发光单元周围还设置有隔离 框架。
[0009] 所述的表面贴装式 RGB LED封装模组， 其中， 所述隔离框架为不透光的黑色框 架。
[0010] 所述的表面贴装式 RGB LED封装模组， 其中， 所述保护层表面粗糙不反光。
[0011] 一种上述表面贴装式 RGB LED封装模组的制造方法， 包括以下步骤：
[0012] 步骤 1 : 在基板两面覆铜， 过孔， 制作多组上下导通的金属孔， 将基板的正反 两面导通；
[0013] 步骤 2: 在所述基板正面蚀刻出多组上焊盘， 反面蚀刻出下焊盘， 并蚀刻电镀 电路使基板上所有上焊盘和下焊盘电性连接；
[0014] 步骤 3: 对所述基板进行电镀；
[0015] 步骤 4: 将 RGB LED芯片固晶在所述基板上， 并进行焊线， 形成多个发光单元
[0016] 步骤 5: 根据需要将基板按照发光单元的数量进行切割， 形成具有多个发光单 元的封装模组， 切割吋将所述电镀电路切断， 使所有上焊盘和下焊盘均相互独
[0017] 所述的表面贴装式 RGB LED封装模组的制造方法， 其中， 所述电镀电路设置在 基板正面和 /或反面。
[0018] 所述的表面贴装式 RGB LED封装模组的制造方法， 其中， 所述步骤 4还包括： 在形成发光单元后， 在所述发光单元上制作保护层。
[0019] 所述的表面贴装式 RGB LED封装模组的制造方法， 其中， 所述步骤 4还包括： 在形成发光单元后， 在每个所述发光单元周围制作隔离框架。
[0020] 所述的表面贴装式 RGB LED封装模组的制造方法， 其中， 对所述隔离框架进行 烘烤老化， 烘烤温度为 100-300摄氏度。
[0021] 所述的表面贴装式 RGB LED封装模组的制造方法， 其中， 所述步骤 3还包括将 所述金属孔填满密封。
[0022] 本发明的有益效果包括： 本发明提供的表面贴装式 RGB LED封装模组及其制造 方法， 将多个发光单元集成在一个封装模组中， 使 LED在后续应用生产的生产效 率得到极大提高， 极大地降低了生产成本； 同吋， 将多个发光单元集成在一个 模组中， 相比较传统的单个形态 LED, 本发明提供的 LED模组密封性更佳， 更不 容易受水汽侵蚀， 寿命更长； 另外， 多个发光单元集成在一个模组上， 能有效 提高显示屏整体抗外界机械强度能力； 通过在发光单元设置隔离框架， 减小了 发光单元之间的影响， 进而提高了 LED显示屏的分辨率和对比度。 通过多个发光 单元集成在一个模组上， 与现有集成式模组对比， 优势在于本发明一个模板包 含发光单元较少， 可有效避免因不同批次芯片中心值差异或基板油墨差异导致 显色差异， 整屏一致性差问题， 并且现在集成式模组若出现发光单元失效维修 成本高， 本发明维修成本低。
发明的有益效果
对附图的简要说明
附图说明
[0023] 图 1现有 PPA支架的结构示意图。
[0024] 图 2现有 CHIP类型封装支架的结构示意图。
[0025] 图 3为本发明提供的 1*2表面贴装式 RGB LED封装模组的正面图。
[0026] 图 4为本发明提供的带有隔离框架的 1*2表面贴装式 RGB LED封装模组的正面图 [0027] 图 5为本发明提供的 1*2表面贴装式 RGB LED封装模组的反面图。
[0028] 图 6为本发明提供的 1*2表面贴装式 RGB LED封装模组的剖视图。
[0029] 图 7为本发明提供的带有隔离框架的 1*2表面贴装式 RGB LED封装模组的剖视图
[0030] 图 8a为本发明提供的 1*2表面贴装式 RGB LED封装模组的电镀电路图。
[0031] 图 8b为本发明提供的 1*2表面贴装式 RGB LED封装模组的切割线路图。
[0032] 图 9为本发明提供的 1*3表面贴装式 RGB LED封装模组的正面图。
[0033] 图 10为本发明提供的 1*3表面贴装式 RGB LED封装模组的反面图。
[0034] 图 11a为本发明提供的 1*3表面贴装式 RGB LED封装模组的电镀电路图。
[0035] 图 l ib为本发明提供的 1*3表面贴装式 RGB LED封装模组的切割线路图。
[0036] 图 12为本发明提供的 1*3表面贴装式 RGB LED封装模组的正面图。
[0037] 图 13为本发明提供的 1*3表面贴装式 RGB LED封装模组的反面图。
[0038] 图 14为本发明提供的 1*3表面贴装式 RGB LED封装模组的切割线路图。
[0039] 图 15为本发明提供的 1*4表面贴装式 RGB LED封装模组的正面图。
[0040] 图 16为本发明提供的 1*4表面贴装式 RGB LED封装模组的反面图。
[0041] 图 17a为本发明提供的 1*4表面贴装式 RGB LED封装模组的反面电镀电路图。
[0042] 图 17b为本发明提供的 1*4表面贴装式 RGB LED封装模组的反面切割线路图。
[0043] 图 18a为本发明提供的 1*4表面贴装式 RGB LED封装模组的正面电镀电路图。
[0044] 图 18b为本发明提供的 1*4表面贴装式 RGB LED封装模组的正面切割线路图。
[0045] 图 19为本发明提供的 1*4表面贴装式 RGB LED封装模组的反面电镀电路图。
[0046] 图 20为本发明提供的 1*4表面贴装式 RGB LED封装模组的反面电镀电路图。
[0047] 图 21为本发明提供的一种表面贴装式 RGB LED封装模组的制造流程图。
[0048] 附图标记说明： 1、 基板； 101、 识别区； 2、 上焊盘； 201、 第一焊接区； 202 、 第二焊接区； 203、 芯片焊接区； 204、 第三焊接区； 3、 金属孔； 4、 RGB LED芯片； 401、 键和线； 5、 下焊盘； 6、 电镀电路； 7、 切割线； 8、 保护层； 9 、 隔离框架。
本发明的实施方式 [0049] 为使本发明的目的、 技术方案及优点更加清楚、 明确， 以下参照附图并举实施 例对本发明进一步详细说明。
[0050] 图 1为现有的 PPA+铜弓 I脚的封装支架的结构示意图， 图 2为现有 CHIP类型封装 支架的结构示意图， 均为单颗封装结构， 在实际生产中， 随着 LED显示屏像素间 距的缩小， 单位面积上的封装器件数量越来越多， 因此应用吋使用的 LED封装器 件数量巨大， 而仅靠单颗贴装的生产方式， 生产效率极低。
[0051] 参见图 3-图 20， 为本发明提供的表面贴装式 RGB LED封装模组实施例。 本发明 提供的表面贴装式 RGB LED封装模组包括基板 1以及设置在基板 1上的发光单元 ， 所述发光单元上设置有保护层 8， 所述发光单元的数量至少为两个， 每个发光 单元包括四个相互独立的上焊盘 2和一组 RGB LED芯片 4， RGB LED芯片 4设置 在任意一个上焊盘 2上， 通过键和线 401与另外三个上焊盘 2连接， 上焊盘 2设置 有穿过基板 1的上下导通的金属孔 3， 基板 1反面与金属孔 3对应位置设置有下焊 盘 5， 下焊盘 5之间相互独立。 相比传统的单颗形态的 LED封装体， 本发明提供的 封装模组在基板 1上设置有多个发光单元， 在进行后续 LED灯珠贴装吋， 由于是 以模组的形式进行贴装， 相比单颗贴装的方式， 本发明的贴装效率极高， 贴装 效率随着封装模组上的发光单元数量的增加而提高。 如果封装模组上发光单元 的数量为 16个， 则贴装效率可提高 16倍， 优选地， 本发明所述发光单元的数量 为 2-16个。 所述发光单元的排列形态还可以是倒" L"形的。 对于所述发光单元的 排列方式本发明并不做限制， 既可以是"一"字形排列， 也可以是 MxN (M和 N均 为整数） 的行列组合排列， 还可以是其他不规则的排列形状， 本发明对此并不 做限制。 应当注意的是， 对本领域普通技术人员来说， 可以根据上述说明加以 改进或变换， 所有这些改进和变换都应属于本发明所附权利要求的保护范围。
[0052] 在实际应用中， 所述发光单元周围还设置有隔离框架 9， 通过在发光单元设置 隔离框架， 减小了发光单元之间的影响， 进而提高了 LED显示屏的分辨率和对比 度。 优选地， 隔离框架 9为不透光的框架， 进一步防止光线穿透隔离框架 9， 进 一步地， 隔离框架 9的颜色为黑色。
[0053] 在实际应用中， 保护层 8表面粗糙不反光， 优选地， 保护层 8为带有扩散剂的半 透明环氧树脂胶层， 保护层 8的设置可以防止水汽的进入， 以及防止元器件受到 机械损伤。 本发明使用带有扩散剂的半透明环氧树脂胶作为保护层 8可以使光线 更加均匀地透过保护层 8， 减少保护层 8对光线的影响。
[0054] 在实际应用中， 如图 3所示， 所述四个独立的上焊盘分别为位于中间用于放置 R GB LED芯片 4的" L"形的芯片焊接区 203以及分别位于左上角、 右上角和左下角 的第一焊线区 201、 第二焊线区 202以及第三焊线区 203， 优选地， 第二焊线区 20 3作为公共极区。 本发明通过固晶胶将 RGB
LED芯片 4固定在居中的芯片焊接区 203上， 可以使光线更加集中。
[0055] 在实际生产中， 对上焊盘 2和下焊盘 5都必须电镀后才能进行焊接， 由于上焊盘 2之间、 下焊盘 5之间都是相互独立的， 在电镀前， 需要将所有上焊盘 2和下焊盘 5电连接才能进行电镀。 本发明通过设置电镀电路将所有焊盘连接起来， 再最后 切割成单个产品吋， 将电镀电路切断， 使各个焊盘保持独立。 而本发明提供的 并非单颗的封装体， 是具有多个发光单元的封装模组， 因此在设置电镀电路吋
， 并非简单地将所有焊盘连接起来， 在切割产品吋， 还需保证切割出具有多个 发光单元的封装模组的同吋， 将所有电镀电路都切断。
[0056] 下面结合本发明的几个实施例来具体说明：
[0057] 实施例 1 :
[0058] 参见图 3-图 8， 为本发明提供的 1*2表面贴装式 RGB LED封装模组。 所述封装模 组具有两个发光单元。 在实际生产中， 如图 4和图 7所示， 还可以在所述发光单 元周围设置隔离框架 9， 以减少发光单元之间的影响。 优选地， 如图 5所示， 在 基板 1的反面， 每个发光单元中间还可以设置识别区 101， 便于后续测试及包装 器械识别封装模组的正反面。 如图 6和图 7所示， 在所述发光单元上还可以设置 保护层 8， 保护层 8优选地为带有扩散剂的半透明环氧树脂胶层， 保护层 8的设置 可以防止水汽的进入， 以及防止元器件受到机械损伤。 优选地， 可以通过模压 或注胶的方式制作保护层 8。 参见图 8a和图 8b， 在实际生产中， 首先在基板 1上设 置数量众多的发光单元， 再通过切割的方式， 切割出具有指定数量发光单元的 封装模组。 图 8a为具有两个发光单元的封装模组的电镀电路图， 图 8b为对应的切 割线路图， 在进行切割工序吋， 将沿切割线 7进行切割， 在实际应用中， 切割线 7并不需要实际划出， 只需设定程序， 让切割器械按照设定好的切割方向进行切 割即可。 在实际生产中， 切割刀具的刀锋宽度大于电镀电路 6的宽度， 保证电镀 电路 6可以被完全切断。 电镀电路 6可以设置在基板 1的正面， 也可以设置在基板 1的反面， 甚至可以设置在基板 1的正面和反面。 由于金属孔 3的存在， 对应位置 的上焊盘 2和下焊盘 5本身是相互导通的， 因此只要连通所有的上焊盘 2或者连通 所有的下焊盘 5， 就可以实现将所有焊盘均电性连接。 如图 8a和 8b所示， 本实施 例在基板 1的正面设置电镀电路 6， 在切割线 7上设置电镀电路 6的总线， 将所有 上焊盘 2通过电镀电路 6连接到就近的电镀电路 6的总线上， 以保证在进行切割工 序吋， 可以将所有的电镀电路 6切断， 确保所有上焊盘 2均相互独立。 图 8a的电镀 电路 6仅为其中一种电路连接方式， 本领域技术人员根据本发明很容易联想到其 他的连接方式， 本发明对此并不限制。 根据上述说明加以改进或变换的连接方 式都应属于本发明所附权利要求的保护范围。
[0059] 实施例 2:
[0060] 参见图 9-图 11， 为本发明提供的 1*3表面贴装式 RGB LED封装模组， 所述封装 模组具有三个发光单元。 所述发光单元的结构同实施例 1中的发光单元的结构。 如图 11a和图 l ib所示， 基板 1上设置有 24个发光单元， 呈 4行 6列分布。 如图 l ib所 示， 切割线 7将基板 1分隔成 8个封装模组， 切割线 7的位置上同样设置有电镀电 路 6， 本实施例的所有电镀电路 6均设置在基板 1的正面。 所有上焊盘 2均通过电 镀电路 6连接到就近的处于切割线 7位置的电镀电路 6上， 在切割基板 1吋， 将所 有切割线 7位置上的电镀电路 6均切断， 此吋所有上焊盘 2因此相互独立， 不再由 电镀电路 6相连。
[0061] 实施例 3:
[0062] 图 12-图 14为本发明提供的另一种 1*3表面贴装式 RGB LED封装模组， 所有封装 模组上同样具有三个发光单元， 但发光单元的排列与实施例 2不同。 在本实施例 中， 三个发光单元呈倒" L"形排列， 对于发光单元的排列方式， 本发明并不做限 制。 如图 14所示， 本实施例的电镀电路设置在基板 1正面， 切割线 7的位置同样 有电镀电路 6， 所有上焊盘 2均与切割线 7位置的电镀电路 6电连接， 对于具体的 连接方式， 本实施例并不做限定。
[0063] 实施例 4: [0064] 图 15至图 20为本发明提供的 1*4表面贴装式 RGB LED封装模组， 所述封装模组 具有 4个发光单元。 如图 15所示， 所述发光单元呈方形排列， 在本发明的其他实 施例中， 也可以呈一字排列， 则其电镀电路 6的连接方式同实施例 1和 2。 针对电 镀电路 6的连接方式， 既可以将电镀电路 6设置在基板 1反面 （如图 17a所示） ， 也 可以设置在基板 1正面 （如图 18a所示） ， 或者采取正面与反面相结合的模式。 对 于具体的连接方式， 既可以如实施例 1-3， 将所有焊盘连到切割线 7所在的位置， 也可以如图 19或图 20。 由此可见， 电镀电路 6的连接方式多变， 本领域技术人员 在本发明说明的基础上， 很容易得到其他变换方式， 所有这些改进和变换都应 属于本发明所附权利要求的保护范围。
[0065] 参见图 21， 本发明还提供了一种上述表面贴装式 RGB LED封装模组的制造方 法， 包括以下步骤：
[0066] 步骤 1 : 在基板 1两面覆铜， 过孔， 制作多组上下导通的金属孔 3， 通过金属孔 3 的设置将基板 1的正反两面导通； 在实际应用中， 基板 1可以直接使用 BT覆铜板
、 FR4覆铜板或者其他类型的线路板。
[0067] 步骤 2: 在基板 1正面蚀刻出多组上焊盘 2， 反面蚀刻出下焊盘 5， 并蚀刻电镀电 路 6使基板 1上所有上焊盘 2和下焊盘 5电性连接。 如上文所述， 电镀电路 6的作用 为将所有上焊盘 2和下焊盘 5电性连接， 用于后续工序的电镀使用， 对于电镀电 路 6的连接方式并不限定。
[0068] 步骤 3: 对基板 1进行电镀； 优选地， 电镀过程中， 将金属孔 3填满密封， 以保 证后续制作保护层 8的过程中， 胶水不会通过金属孔 3渗透到下焊盘 5上。
[0069] 步骤 4: 将 RGB LED芯片 4通过固晶胶固晶在基板 1上， 并进行焊线， 形成多个 发光单元； 优选地， 使用键和线， 通过键和方式进行物理电性连接。
[0070] 步骤 5: 根据需要将基板 1按照发光单元的数量进行切割， 形成具有多个发光单 元的封装模组， 切割吋将电镀电路 6切断， 使所有上焊盘 2和下焊盘 5均相互独立
[0071] 在实际应用中， 电镀电路 6设置在基板 1正面和 /或反面。 优选地， 将电镀电路 6 设置在基板 1反面， 方便切割。
[0072] 在实际应用中， 所述步骤 4还包括： 在形成发光单元后， 在所述发光单元上制 作保护层 8。
[0073] 在实际应用中， 所述步骤 4还包括： 在形成发光单元后， 在每个所述发光单元 周围制作隔离框架 9。 优选地， 对隔离框架 9进行烘烤老化， 进一步加强隔离框 架 9的机械强度， 优选地， 烘烤温度为 100-300摄氏度。
[0074] 本发明提供的表面贴装式 RGB LED封装模组及其制造方法， 将多个发光单元集 成在一个封装模组中， 使 LED在后续应用生产的生产效率得到极大提高， 极大地 降低了生产成本； 同吋， 将多个发光单元集成在一个模组中， 相比较传统的单 个形态 LED, 本发明提供的 LED模组密封性更佳， 更不容易受水汽侵蚀， 寿命更 长； 通过在发光单元设置隔离框架， 减小了发光单元之间的影响， 进而提高了 L ED显示屏的分辨率和对比度。
[0075] 应当理解的是， 本发明的应用不限于上述的举例， 对本领域普通技术人员来说 ， 可以根据上述说明加以改进或变换， 所有这些改进和变换都应属于本发明所 附权利要求的保护范围。

Claims

权利要求书
[权利要求 1] 一种表面贴装式 RGB-LED封装模组， 包括基板以及设置在基板上的 发光单元， 所述发光单元上设置有保护层， 其特征在于， 所述发光单 元的数量至少为两个， 每个发光单元包括四个相互独立的上焊盘和一 组 RGB LED芯片， 所述 RGB LED芯片设置在任意一个上焊盘上， 通 过键和线与另外三个上焊盘连接， 所述上焊盘设置有穿过所述基板的 上下导通的金属孔， 所述基板反面与所述金属孔对应位置设置有下焊 盘， 所述下焊盘之间相互独立。
[权利要求 2] 根据权利要求 1所述的表面贴装式 RGB-LED封装模组， 其特征在于， 所述发光单元周围还设置有隔离框架。
[权利要求 3] 根据权利要求 2所述的表面贴装式 RGB-LED封装模组， 其特征在于， 所述隔离框架为不透光的框架。
[权利要求 4] 根据权利要求 1所述的表面贴装式 RGB-LED封装模组， 其特征在于， 所述保护层表面粗糙不反光。
[权利要求 5] —种如权利要求 1-4所述的表面贴装式 RGB-LED封装模组的制造方法
， 其特征在于， 包括以下步骤：
步骤 1 : 在基板两面覆铜， 过孔， 制作多组上下导通的金属孔， 将基 板的正反两面导通；
步骤 2: 在所述基板正面蚀刻出多组上焊盘， 反面蚀刻出下焊盘， 并 蚀刻电镀电路使基板上所有上焊盘和下焊盘电性连接；
步骤 3: 对所述基板进行电镀；
步骤 4: 将 RGB LED芯片固晶在所述基板上， 并进行焊线， 形成多个 发光单元；
步骤 5: 根据需要将基板按照发光单元的数量进行切割， 形成具有多 个发光单元的封装模组， 切割吋将所述电镀电路切断， 使所有上焊盘 和下焊盘均相互独立。
[权利要求 6] 根据权利要求 5所述的表面贴装式 RGB-LED封装模组的制造方法， 其 特征在于， 所述电镀电路设置在基板正面和 /或反面。
[权利要求 7] 根据权利要求 5所述的表面贴装式 RGB-LED封装模组的制造方法， 其 特征在于， 所述步骤 4还包括： 在形成发光单元后， 在所述发光单元 上制作保护层。
[权利要求 8] 根据权利要求 5所述的表面贴装式 RGB-LED封装模组的制造方法， 其 特征在于， 所述步骤 4还包括： 在形成发光单元前， 在每个所述发光 单元周围制作隔离框架。
[权利要求 9] 根据权利要求 8所述的表面贴装式 RGB-LED封装模组的制造方法， 其 特征在于， 对所述隔离框架进行烘烤老化， 烘烤温度为 100-300摄氏 度。
[权利要求 10] 根据权利要求 5所述的表面贴装式 RGB-LED封装模组的制造方法， 其 特征在于， 所述步骤 3还包括将所述金属孔填满密封。
PCT/CN2017/089336 2017-03-28 2017-06-21 一种表面贴装式rgb-led封装模组及其制造方法 WO2018176657A1 (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP17904279.1A EP3582261B1 (en) 2017-03-28 2017-06-21 Method for preparing a surface-mounted rgb-led packaging module
US16/346,118 US20190259736A1 (en) 2017-03-28 2017-06-21 Surface-Mounted RGB-LED Packaging Module and Preparing Method Thereof
JP2019522319A JP2020502780A (ja) 2017-03-28 2017-06-21 表面実装型ｒｇｂ−ｌｅｄパッケージモジュール及びその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710194308.8A CN106847801B (zh) 2017-03-28 2017-03-28 一种表面贴装式rgb-led封装模组及其制造方法
CN201710194308.8 2017-03-28

Publications (1)

Publication Number Publication Date
WO2018176657A1 true WO2018176657A1 (zh) 2018-10-04

Family

ID=59142529

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/089336 WO2018176657A1 (zh) 2017-03-28 2017-06-21 一种表面贴装式rgb-led封装模组及其制造方法

Country Status (5)

Country Link
US (1) US20190259736A1 (zh)
EP (1) EP3582261B1 (zh)
JP (1) JP2020502780A (zh)
CN (1) CN106847801B (zh)
WO (1) WO2018176657A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109754718A (zh) * 2019-02-18 2019-05-14 深圳市梓桥科技有限公司 水下显示屏
US11024609B2 (en) * 2018-06-14 2021-06-01 Shenzhen Zhixunda Optoelectronics Co., Ltd. Four-in-one mini-LED module, display screen and manufacturing method
CN117239042A (zh) * 2023-11-09 2023-12-15 广东安林电子科技股份有限公司 一种全彩贴片式led结构

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106847801B (zh) * 2017-03-28 2023-09-15 山东捷润弘光电科技有限公司 一种表面贴装式rgb-led封装模组及其制造方法
CN108091644A (zh) * 2017-12-15 2018-05-29 深圳市晶台股份有限公司 一种led高密显示光源器件的封装结构
JP6799627B2 (ja) 2018-02-26 2020-12-16 山東捷潤弘光電科技有限公司 Ｒｇｂ−ｌｅｄパッケージモジュール及びそのディスプレイ
CN108511431A (zh) * 2018-05-21 2018-09-07 佛山市国星光电股份有限公司 一种led显示单元组及显示面板
CN108807356B (zh) * 2018-06-05 2020-10-27 深圳市智讯达光电科技有限公司 一种四合一mini-LED模组、显示屏及制造方法
CN108598071A (zh) * 2018-06-28 2018-09-28 山西高科华兴电子科技有限公司 一种top结构的三基色led模组器件及其制作方法
CN109244102A (zh) * 2018-09-10 2019-01-18 佛山市国星光电股份有限公司 一种led显示单元组及显示面板
CN109411457A (zh) * 2018-10-26 2019-03-01 吉安市木林森光电有限公司 Rgb led集成封装模块
US11756947B2 (en) 2020-02-06 2023-09-12 Lumileds Llc Light-emitting diode lighting system with wirebonded hybridized device
US11575074B2 (en) 2020-07-21 2023-02-07 Lumileds Llc Light-emitting device with metal inlay and top contacts
CN112382713A (zh) * 2020-10-27 2021-02-19 浙江英特来光电科技有限公司 一种基于倒装工艺的smd全彩led封装结构
CN113394323A (zh) * 2021-05-25 2021-09-14 江西展耀微电子有限公司 显示模组及其制作方法
CN113506520B (zh) * 2021-06-22 2023-01-10 安徽精卓光显技术有限责任公司 一种无边缘布线的led透明显示屏及其生产方法
TWI822286B (zh) 2022-08-31 2023-11-11 晶呈科技股份有限公司 垂直型發光二極體晶粒的封裝方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103177662A (zh) * 2011-12-21 2013-06-26 四川柏狮光电技术有限公司 高密度全彩led显示点阵模块
CN103594464A (zh) * 2013-11-25 2014-02-19 广东威创视讯科技股份有限公司 一种发光二极管的cob封装结构
CN106531730A (zh) * 2016-10-31 2017-03-22 杭州美卡乐光电有限公司 Led封装组件及其制造方法
CN106847801A (zh) * 2017-03-28 2017-06-13 山东晶泰星光电科技有限公司 一种表面贴装式rgb‑led封装模组及其制造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003086735A (ja) * 2001-06-27 2003-03-20 Shinko Electric Ind Co Ltd 位置情報付配線基板及びその製造方法並びに半導体装置の製造方法
JP2005347401A (ja) * 2004-06-01 2005-12-15 Meiko:Kk 光素子チップ部品
JP2009038188A (ja) * 2007-08-01 2009-02-19 Toyoda Gosei Co Ltd 表示装置用ｌｅｄランプ及びｌｅｄ表示装置
JP5224802B2 (ja) * 2007-09-29 2013-07-03 京セラ株式会社 発光素子収納用パッケージ、発光装置ならびに発光素子収納用パッケージおよび発光装置の製造方法
JP2013026510A (ja) * 2011-07-22 2013-02-04 Rohm Co Ltd Ｌｅｄモジュールおよびｌｅｄモジュールの実装構造
CN102945845B (zh) * 2012-11-13 2015-01-21 佛山市国星光电股份有限公司 一种显示屏用的led器件及显示模组
CN203826384U (zh) * 2014-02-08 2014-09-10 惠州科锐半导体照明有限公司 固态发射器面板
JP6441636B2 (ja) * 2014-10-14 2018-12-19 大日本印刷株式会社 画像表示装置用モジュール及び画像表示装置
CN204289443U (zh) * 2014-12-25 2015-04-22 深圳市安普光光电科技有限公司 连体全彩发光二极管及led显示模组
CN205264271U (zh) * 2015-11-27 2016-05-25 叶勇 一种全彩rgb集成发光单元模块及led显示屏
CN105591013B (zh) * 2016-03-25 2018-11-13 深圳市九洲光电科技有限公司 一种smd外封装式led
CN206340544U (zh) * 2017-03-28 2017-07-18 山东晶泰星光电科技有限公司 一种表面贴装式rgb‑led封装模组

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103177662A (zh) * 2011-12-21 2013-06-26 四川柏狮光电技术有限公司 高密度全彩led显示点阵模块
CN103594464A (zh) * 2013-11-25 2014-02-19 广东威创视讯科技股份有限公司 一种发光二极管的cob封装结构
CN106531730A (zh) * 2016-10-31 2017-03-22 杭州美卡乐光电有限公司 Led封装组件及其制造方法
CN106847801A (zh) * 2017-03-28 2017-06-13 山东晶泰星光电科技有限公司 一种表面贴装式rgb‑led封装模组及其制造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11024609B2 (en) * 2018-06-14 2021-06-01 Shenzhen Zhixunda Optoelectronics Co., Ltd. Four-in-one mini-LED module, display screen and manufacturing method
CN109754718A (zh) * 2019-02-18 2019-05-14 深圳市梓桥科技有限公司 水下显示屏
CN109754718B (zh) * 2019-02-18 2024-01-26 深圳市梓桥科技有限公司 水下显示屏
CN117239042A (zh) * 2023-11-09 2023-12-15 广东安林电子科技股份有限公司 一种全彩贴片式led结构
CN117239042B (zh) * 2023-11-09 2024-01-19 广东安林电子科技股份有限公司 一种全彩贴片式led结构

Also Published As

Publication number Publication date
EP3582261A4 (en) 2020-03-25
EP3582261B1 (en) 2023-11-15
CN106847801B (zh) 2023-09-15
JP2020502780A (ja) 2020-01-23
US20190259736A1 (en) 2019-08-22
EP3582261A1 (en) 2019-12-18
CN106847801A (zh) 2017-06-13

Similar Documents

Publication Publication Date Title
WO2018176657A1 (zh) 一种表面贴装式rgb-led封装模组及其制造方法
JP6821801B2 (ja) Ｃｏｂ表示モジュール及びその製造方法、ｌｅｄデバイス及びその製造方法
WO2018176656A1 (zh) Qfn表面贴装式rgb-led封装模组及其制造方法
WO2018176655A1 (zh) 一种集成式rgb-led显示屏
WO2021027415A1 (zh) 一种led背光模块及显示装置
CN206340544U (zh) 一种表面贴装式rgb‑led封装模组
CN112242476A (zh) 一种led显示单元组及显示面板
KR20220001954U (ko) Led 라이트 스트링, 제조 방법 및 led 라이트 스트링에 사용되는 led 소자
CN206338768U (zh) 一种表面贴装式rgb‑led集成基板
JP2003008071A (ja) Ｌｅｄ基板アセンブリを使用したｌｅｄランプ
CN201149869Y (zh) 一种led封装结构
WO2017041280A1 (zh) 一种具有过渡基板的led器件及其封装方法
CN113054059A (zh) 显示装置、led封装体及其制作方法
CN106847803B (zh) 一种集成ic的表面贴装式rgb-led封装模组
US11316085B2 (en) Display device and manufacturing method thereof
CN101814574A (zh) 一种发光二极管基板散热结构及其制作方法
US20070221942A1 (en) LED backlight unit without printed circuit board and method of manufacturing the same
CN106871078A (zh) 一种表面贴装式rgb‑led集成基板及其制造方法
JP3238008B2 (ja) 発光表示装置
WO2008138182A1 (fr) Diode électroluminescente de type à puce
JP2004063973A (ja) 縦横マウント型電子部品
JP3617264B2 (ja) プラスチック回路基板の電解めっき方法
CN212209546U (zh) 器件线路板、发光器件、阵列线路板、器件阵列及显示屏
CN214505491U (zh) 带剪线缺口的三线点控led灯珠及点控led灯串
CN103107274B (zh) 一种采用过渡电极实现的led集成封装模块

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17904279

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2019522319

Country of ref document: JP

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 2017904279

Country of ref document: EP

Effective date: 20190911

NENP Non-entry into the national phase

Ref country code: DE